JP2008286672A - スズまたはスズ合金めっき層の定量分析方法 - Google Patents
スズまたはスズ合金めっき層の定量分析方法 Download PDFInfo
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- JP2008286672A JP2008286672A JP2007132681A JP2007132681A JP2008286672A JP 2008286672 A JP2008286672 A JP 2008286672A JP 2007132681 A JP2007132681 A JP 2007132681A JP 2007132681 A JP2007132681 A JP 2007132681A JP 2008286672 A JP2008286672 A JP 2008286672A
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- Prior art keywords
- tin
- plated layer
- copper
- brass
- plating
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 38
- 238000004445 quantitative analysis Methods 0.000 title claims abstract description 15
- 229910001128 Sn alloy Inorganic materials 0.000 title claims abstract description 12
- 238000007747 plating Methods 0.000 claims abstract description 77
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052802 copper Inorganic materials 0.000 claims abstract description 31
- 239000010949 copper Substances 0.000 claims abstract description 31
- 229910001369 Brass Inorganic materials 0.000 claims abstract description 28
- 239000010951 brass Substances 0.000 claims abstract description 28
- 239000000243 solution Substances 0.000 claims abstract description 15
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052796 boron Inorganic materials 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 11
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000002253 acid Substances 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims abstract description 5
- 150000001639 boron compounds Chemical class 0.000 claims abstract description 5
- 239000007864 aqueous solution Substances 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 abstract description 19
- 239000007788 liquid Substances 0.000 abstract description 2
- 239000011133 lead Substances 0.000 description 14
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 12
- 229910052804 chromium Inorganic materials 0.000 description 12
- 239000011651 chromium Substances 0.000 description 12
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 11
- 229910052793 cadmium Inorganic materials 0.000 description 11
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 11
- 229910052725 zinc Inorganic materials 0.000 description 11
- 239000011701 zinc Substances 0.000 description 11
- 238000004090 dissolution Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000011002 quantification Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- -1 iron ions Chemical class 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000000383 hazardous chemical Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- GCYHRYNSUGLLMA-UHFFFAOYSA-N 2-prop-2-enoxyethanol Chemical compound OCCOCC=C GCYHRYNSUGLLMA-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000001479 atomic absorption spectroscopy Methods 0.000 description 1
- WVMHLYQJPRXKLC-UHFFFAOYSA-N borane;n,n-dimethylmethanamine Chemical compound B.CN(C)C WVMHLYQJPRXKLC-UHFFFAOYSA-N 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- VEWFZHAHZPVQES-UHFFFAOYSA-N boron;n,n-diethylethanamine Chemical compound [B].CCN(CC)CC VEWFZHAHZPVQES-UHFFFAOYSA-N 0.000 description 1
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910001430 chromium ion Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000004993 emission spectroscopy Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/20—Metals
- G01N33/202—Constituents thereof
- G01N33/2028—Metallic constituents
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/20—Metals
- G01N33/208—Coatings, e.g. platings
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Pathology (AREA)
- Immunology (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Analytical Chemistry (AREA)
- Food Science & Technology (AREA)
- Medicinal Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Investigating And Analyzing Materials By Characteristic Methods (AREA)
- Sampling And Sample Adjustment (AREA)
- ing And Chemical Polishing (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
Abstract
【解決手段】銅または黄銅からなる基材に、スズまたはスズ合金からなるめっき層を形成してなる試料、もしくは金属製の基材に、銅または黄銅からなる下地層を介して、スズまたはスズ合金からなるめっき層を形成してなる試料における前記めっき層の定量分析方法であって、 ホウフッ化水素酸をホウ素元素換算で1.6質量%、ホウ素化合物をホウ素元素換算で0.2質量%以下、チオ尿素を1質量%以下の割合で含む水溶液からなるめっき剥離液を前記試料に接触させて前記めっき層を溶解し、溶解分を含有する前記めっき剥離液について定量することを特徴とするスズまたはスズ合金めっき層の定量分析方法。
【選択図】なし
Description
黄銅製基材に銅下地めっき、スズめっき層を形成した試料を、メルテックス株式会社製めっき剥離液「エンストリップTL−105」(ホウフッ化水素酸をホウ素元素換算で1.6質量%、ホウ素化合物をホウ素元素換算で0.2質量%以下、チオ尿素を1質量%以下、安定化剤含有、残部水)に浸漬した。黄銅製基材が露出した時点で試料を取り出し、浸漬前との重量差を求めたところ、試料量は0.01315gであった。
鉛 :3.3/0.01211=276.3ppm
カドミウム:0.05918/0.01211=4.9ppm
クロム :0.29062/0.01211=24.0ppm
黄銅製基材に、銅下地めっき、組成の異なるスズめっき層を形成した試料A〜Fを用意し、実施例1で用いたメルテックス株式会社製めっき剥離液「エンストリップTL−105」に浸漬した。黄銅製平板が露出した時点で試料を取り出し、めっき剥離液についてICP−AESにて定量分析を行ない、銅、亜鉛、鉛、カドミウム及びクロムの含有量を求めた。尚、ここでは実施例1のような銅及び亜鉛量を差し引く補正は行なっていない。結果を表2に示すが、銅及び亜鉛の含有量が少なく、黄銅製基材の溶解が少ないことがわかる。
めっき剥離液として、何れも硝酸と塩酸との混合液からなり、混合比の異なる混酸A〜Dを用い、それぞれに黄銅製基材にスズめっき層を形成した同一の試料を浸漬した。黄銅製平板が露出した時点で試料を取り出し、めっき剥離液についてICP−AESにて定量分析を行ない、銅、亜鉛、鉛、カドミウム及びクロムの含有量を求めた。また、黄銅製基材について、蛍光X線により銅及び亜鉛の含有量を測定し、ICP−AESにより銅、亜鉛、鉛、カドミウム及びクロムの含有量を測定した。そして、黄銅製基材中の各成分の含有割合を基に、めっき剥離液中の各成分の含有量を補正した。鉛、カドミウム及びクロムについて表3に示すが、鉛、カドミウム及びクロムの含有量がマイナスとなる場合が多く、混酸系のめっき剥離液は黄銅製基材を溶解し、スズめっき層の定量には使用できないことがわかる。
Claims (1)
- 銅または黄銅からなる基材に、スズまたはスズ合金からなるめっき層を形成してなる試料、もしくは金属製の基材に、銅または黄銅からなる下地層を介して、スズまたはスズ合金からなるめっき層を形成してなる試料における前記めっき層の定量分析方法であって、
ホウフッ化水素酸をホウ素元素換算で1.6質量%、ホウ素化合物をホウ素元素換算で0.2質量%以下、チオ尿素を1質量%以下の割合で含む水溶液からなるめっき剥離液を前記試料に接触させて前記めっき層を溶解し、溶解分を含有する前記めっき剥離液について定量することを特徴とするスズまたはスズ合金めっき層の定量分析方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007132681A JP4773399B2 (ja) | 2007-05-18 | 2007-05-18 | スズまたはスズ合金めっき層の定量分析方法 |
PCT/JP2008/059026 WO2008143170A1 (ja) | 2007-05-18 | 2008-05-16 | スズまたはスズ合金めっき層の定量分析方法 |
CN2008800163980A CN101680826B (zh) | 2007-05-18 | 2008-05-16 | 定量分析锡或锡合金镀层的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007132681A JP4773399B2 (ja) | 2007-05-18 | 2007-05-18 | スズまたはスズ合金めっき層の定量分析方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008286672A true JP2008286672A (ja) | 2008-11-27 |
JP4773399B2 JP4773399B2 (ja) | 2011-09-14 |
Family
ID=40031872
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007132681A Active JP4773399B2 (ja) | 2007-05-18 | 2007-05-18 | スズまたはスズ合金めっき層の定量分析方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4773399B2 (ja) |
CN (1) | CN101680826B (ja) |
WO (1) | WO2008143170A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009014525A (ja) * | 2007-07-05 | 2009-01-22 | Yazaki Corp | スズまたはスズ合金めっき層中の水銀定量分析方法 |
JP2009162727A (ja) * | 2008-01-10 | 2009-07-23 | Yazaki Corp | 銀めっき層の有害金属分析方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8616077B2 (en) * | 2009-08-05 | 2013-12-31 | United Technologies Corporation | Non-destructive inspection method for metallic alloys |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5051154A (en) * | 1988-08-23 | 1991-09-24 | Shipley Company Inc. | Additive for acid-copper electroplating baths to increase throwing power |
WO2000002426A1 (en) * | 1998-07-01 | 2000-01-13 | Fry's Metals, Inc. D/B/A Alpha Metals, Inc. | Post-treatment for copper on printed circuit boards |
JP3055554B2 (ja) * | 1999-08-02 | 2000-06-26 | ヤマハ株式会社 | 操作指示装置 |
JP2002194574A (ja) * | 2000-12-25 | 2002-07-10 | Mitsubishi Gas Chem Co Inc | 錫又は錫合金皮膜剥離液 |
JP3909035B2 (ja) * | 2003-04-09 | 2007-04-25 | 三井金属鉱業株式会社 | メッキ前処理液およびメッキ前処理方法 |
JP4273266B2 (ja) * | 2005-03-23 | 2009-06-03 | 石原薬品株式会社 | 溶解電流抑制式のスズ合金電気メッキ方法 |
-
2007
- 2007-05-18 JP JP2007132681A patent/JP4773399B2/ja active Active
-
2008
- 2008-05-16 CN CN2008800163980A patent/CN101680826B/zh not_active Expired - Fee Related
- 2008-05-16 WO PCT/JP2008/059026 patent/WO2008143170A1/ja active Application Filing
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009014525A (ja) * | 2007-07-05 | 2009-01-22 | Yazaki Corp | スズまたはスズ合金めっき層中の水銀定量分析方法 |
JP2009162727A (ja) * | 2008-01-10 | 2009-07-23 | Yazaki Corp | 銀めっき層の有害金属分析方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101680826A (zh) | 2010-03-24 |
CN101680826B (zh) | 2012-07-04 |
JP4773399B2 (ja) | 2011-09-14 |
WO2008143170A1 (ja) | 2008-11-27 |
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