JP2008274260A5 - - Google Patents
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- Publication number
- JP2008274260A5 JP2008274260A5 JP2008095069A JP2008095069A JP2008274260A5 JP 2008274260 A5 JP2008274260 A5 JP 2008274260A5 JP 2008095069 A JP2008095069 A JP 2008095069A JP 2008095069 A JP2008095069 A JP 2008095069A JP 2008274260 A5 JP2008274260 A5 JP 2008274260A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- molecular weight
- organic resin
- composition according
- optical member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920005989 resin Polymers 0.000 claims description 39
- 239000011347 resin Substances 0.000 claims description 39
- 239000011342 resin composition Substances 0.000 claims description 34
- 230000003287 optical Effects 0.000 claims description 13
- 229920000647 polyepoxide Polymers 0.000 claims description 13
- 125000003700 epoxy group Chemical group 0.000 claims description 8
- 125000004432 carbon atoms Chemical group C* 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 125000002723 alicyclic group Chemical group 0.000 claims description 4
- 125000003118 aryl group Chemical group 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 150000001491 aromatic compounds Chemical class 0.000 claims description 2
- 238000009835 boiling Methods 0.000 claims 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 3
- 238000005452 bending Methods 0.000 claims 1
- 150000001768 cations Chemical class 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000002522 swelling Effects 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008095069A JP4398500B2 (ja) | 2007-04-06 | 2008-04-01 | 樹脂組成物及び光学部材 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007100963 | 2007-04-06 | ||
JP2008095069A JP4398500B2 (ja) | 2007-04-06 | 2008-04-01 | 樹脂組成物及び光学部材 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009243570A Division JP5037584B2 (ja) | 2007-04-06 | 2009-10-22 | 樹脂組成物及び光学部材 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008274260A JP2008274260A (ja) | 2008-11-13 |
JP2008274260A5 true JP2008274260A5 (fr) | 2009-07-02 |
JP4398500B2 JP4398500B2 (ja) | 2010-01-13 |
Family
ID=40052635
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008095069A Active JP4398500B2 (ja) | 2007-04-06 | 2008-04-01 | 樹脂組成物及び光学部材 |
JP2009243570A Expired - Fee Related JP5037584B2 (ja) | 2007-04-06 | 2009-10-22 | 樹脂組成物及び光学部材 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009243570A Expired - Fee Related JP5037584B2 (ja) | 2007-04-06 | 2009-10-22 | 樹脂組成物及び光学部材 |
Country Status (1)
Country | Link |
---|---|
JP (2) | JP4398500B2 (fr) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4398500B2 (ja) * | 2007-04-06 | 2010-01-13 | 株式会社日本触媒 | 樹脂組成物及び光学部材 |
US8674038B2 (en) | 2007-09-27 | 2014-03-18 | Nippon Skokubai Co., Ltd. | Curable resin composition for molded bodies, molded body, and production method thereof |
JP4406465B2 (ja) * | 2008-03-27 | 2010-01-27 | 株式会社日本触媒 | 成型体用硬化性樹脂組成物、成型体及びその製造方法 |
CN102388078B (zh) * | 2009-04-17 | 2013-09-25 | 三井化学株式会社 | 密封用组合物以及密封用片 |
WO2011102288A1 (fr) * | 2010-02-16 | 2011-08-25 | ダイセル化学工業株式会社 | Composition durcissable, et produit durci |
JP2012077257A (ja) * | 2010-10-06 | 2012-04-19 | Daicel Corp | 硬化物の製造方法及び硬化物 |
JP2013234231A (ja) * | 2012-05-07 | 2013-11-21 | Nippon Shokubai Co Ltd | カチオン硬化性樹脂組成物 |
JP6022302B2 (ja) * | 2012-10-30 | 2016-11-09 | 株式会社トクヤマ | 乾式シリカ微粒子 |
JP6382180B2 (ja) | 2013-02-19 | 2018-08-29 | 株式会社ダイセル | ウェハレベルレンズ用硬化性組成物、ウェハレベルレンズの製造方法及びウェハレベルレンズ、並びに光学装置 |
WO2018003844A1 (fr) * | 2016-07-01 | 2018-01-04 | 日産化学工業株式会社 | Procédé destiné à empêcher la survenue d'une décharge électrique rampante |
WO2018151080A1 (fr) * | 2017-02-14 | 2018-08-23 | 荒川化学工業株式会社 | Composition, agent de revêtement isolant, produit durci et carte de circuit électronique |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4450151B2 (ja) * | 2003-02-19 | 2010-04-14 | Toto株式会社 | エポキシ樹脂成形体からなる人工大理石 |
JP2005263869A (ja) * | 2004-03-16 | 2005-09-29 | Nagase Chemtex Corp | 光半導体封止用樹脂組成物 |
JP2005272672A (ja) * | 2004-03-25 | 2005-10-06 | Toray Ind Inc | 難燃剤マスターバッチ、熱硬化性樹脂組成物、プリプレグおよび繊維強化複合材料 |
JP4452683B2 (ja) * | 2005-01-26 | 2010-04-21 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス素子用封止剤、有機エレクトロルミネッセンス表示装置の製造方法、及び、有機エレクトロルミネッセンス表示装置 |
JP5176290B2 (ja) * | 2005-06-15 | 2013-04-03 | 東レ株式会社 | ペースト組成物、誘電体組成物、誘電体シート、およびこれらを用いたキャパシタ内蔵回路基板 |
JP4810911B2 (ja) * | 2005-07-26 | 2011-11-09 | パナソニック電工株式会社 | エポキシ樹脂組成物、エポキシ樹脂フィルム、光導波路、光・電気混載配線基板並びに電子デバイス |
JP4812364B2 (ja) * | 2005-08-18 | 2011-11-09 | ダイセル化学工業株式会社 | 硬化性樹脂組成物及び光導波路 |
JP4788457B2 (ja) * | 2006-04-18 | 2011-10-05 | 三菱瓦斯化学株式会社 | プリプレグ並びに銅張積層板 |
JP5072309B2 (ja) * | 2006-09-29 | 2012-11-14 | 株式会社日本触媒 | 樹脂組成物及びその製造方法 |
JP5000261B2 (ja) * | 2006-10-20 | 2012-08-15 | 株式会社ダイセル | エポキシ樹脂組成物及びエポキシ樹脂硬化物 |
JP5480469B2 (ja) * | 2006-10-31 | 2014-04-23 | 株式会社日本触媒 | 樹脂組成物、光学材料、及び、該光学材料の制御方法 |
JP4390826B2 (ja) * | 2006-10-31 | 2009-12-24 | 株式会社日本触媒 | 有機無機複合樹脂組成物及び光学部材 |
JP5305707B2 (ja) * | 2007-03-29 | 2013-10-02 | 株式会社日本触媒 | 樹脂組成物及び光学部材 |
JP4398500B2 (ja) * | 2007-04-06 | 2010-01-13 | 株式会社日本触媒 | 樹脂組成物及び光学部材 |
-
2008
- 2008-04-01 JP JP2008095069A patent/JP4398500B2/ja active Active
-
2009
- 2009-10-22 JP JP2009243570A patent/JP5037584B2/ja not_active Expired - Fee Related
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