JP2008270422A - Stationary solder bath device - Google Patents

Stationary solder bath device Download PDF

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JP2008270422A
JP2008270422A JP2007109349A JP2007109349A JP2008270422A JP 2008270422 A JP2008270422 A JP 2008270422A JP 2007109349 A JP2007109349 A JP 2007109349A JP 2007109349 A JP2007109349 A JP 2007109349A JP 2008270422 A JP2008270422 A JP 2008270422A
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solder
circuit board
printed circuit
solder bath
pallet
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JP4823130B2 (en
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Atsushi Hiraiwa
淳 平岩
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Kojima Industries Corp
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Kojima Press Industry Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To well solder a pin of an electronic component inserted through a through hole of a printed board irrespective of a change in liquid level of molten solder in a stationary solder bath. <P>SOLUTION: A stationary solder bath device includes the stationary solder bath 10, a frame-like substrate pallet 30 holding the printed board 1 with its mounting face upward and with its lower surface exposed, and a conveyer 20 for carrying the substrate pallet 30 onto a liquid level 13 of the molten solder 12 in the bath 10 and floating it, and then lifting and carrying it to a predetermined position after a predetermined time elapses. The substrate pallet 30 is equipped with a pressing force applying means 41 for applying pressing force for pressing the lower surface of the printed board 1 against the liquid level 13 of the molten solder 12. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

この発明は、プリント基板のスルーホールに挿通された電子部品のピンを半田付けするための静止型半田槽装置に関する。   The present invention relates to a static solder bath apparatus for soldering pins of an electronic component inserted into a through hole of a printed board.

従来、静止型半田槽装置においては、図１０に示すように、プリント基板１０１の実装面側からスルーホール１０３に挿入された電子部品１０４のピン１０５を半田付けする際、対をなす搬送アーム１２３の下端部に対向状に形成されたスライド溝１２３ａにプリント基板１０１の両端縁が嵌込まれて保持される。
その後、静止型半田槽１１０内の溶融半田１１２の液面１１３の上方から、搬送アーム（制御装置によって移動制御される）１２３と共に、プリント基板１０１が下降され、プリント基板１０１の実装面と反対側面が溶融半田１１２の液面１１３に浸漬されることによって、プリント基板１０１に対し電子部品１０４のピン１０５が半田付けされ、その後、元の位置まで上昇されるになっている。
このような静止型半田槽装置においては、静止型半田槽１１０内の溶融半田１１２の液面１１３のレベルが変動しやすい。この液面レベルの変動によって、静止型半田槽１１０内の溶融半田１１２の液面１１３に対しプリント基板１０１の電子部品１０４のピン１０５の浸漬が不十分となったり、あるいは過剰となって半田不良（未半田部分や過大な半田付け部分）が発生しやすい。
また、静止型半田槽装置において、静止型半田槽内の溶融半田の液面レベルを安定化するために、例えば、特許文献１に開示たものが知られている。
これにおいては、静止型半田槽内の溶融半田の液面上に配置された浮き子と、この浮き子に一端部が連結されかつ支点において上下動する伝達支と、伝達支の他端の上下動を測定するセンサと、センサの測定値で静止型半田槽に溶融半田を注入して半田量を制御する制御器とを備えている。
特開平８−１０９４２号公報 Conventionally, in the static solder bath apparatus, as shown in FIG. 10, when soldering the pins 105 of the electronic components 104 inserted into the through holes 103 from the mounting surface side of the printed circuit board 101, a pair of transfer arms 123 are formed. Both end edges of the printed circuit board 101 are fitted and held in a slide groove 123a formed opposite to the lower end of the substrate.
Thereafter, the printed circuit board 101 is lowered from above the liquid surface 113 of the molten solder 112 in the static solder bath 110 together with the transfer arm (moved and controlled by the control device) 123, and the side surface opposite to the mounting surface of the printed circuit board 101. Is immersed in the liquid surface 113 of the molten solder 112, the pins 105 of the electronic component 104 are soldered to the printed circuit board 101, and then raised to the original position.
In such a static solder bath apparatus, the level of the liquid surface 113 of the molten solder 112 in the static solder bath 110 is likely to fluctuate. Due to the fluctuation of the liquid level, the immersion of the pin 105 of the electronic component 104 of the printed circuit board 101 becomes insufficient or excessive due to the liquid level 113 of the molten solder 112 in the static solder bath 110. (Unsoldered parts and excessive soldered parts) are likely to occur.
Further, in the static solder bath apparatus, for example, the one disclosed in Patent Document 1 is known in order to stabilize the liquid level of the molten solder in the static solder bath.
In this, a float placed on the surface of the molten solder in the static solder bath, a transmission support having one end connected to the float and moving up and down at a fulcrum, and upper and lower ends of the other end of the transmission support A sensor for measuring the movement and a controller for controlling the amount of solder by injecting molten solder into the static solder bath based on the measured value of the sensor.
Japanese Patent Application Laid-Open No. 8-10942

ところで、特許文献１に開示された静止型半田槽の液面制御装置においては、浮き子、伝達支、センサ及び制御器が必要となる。このため、部品点数が多くなりかつ構造が複雑化しコスト高となる。   By the way, in the liquid level control apparatus of the stationary solder tank disclosed in Patent Document 1, a float, a transmission support, a sensor, and a controller are required. For this reason, the number of parts increases, the structure becomes complicated, and the cost increases.

この発明の目的は、前記問題点に鑑み、静止型半田槽内の溶融半田の液面レベルの変化にかかわることなく、プリント基板のスルーホールに挿通された電子部品のピンを良好に半田付けすることができる静止型半田槽装置を提供することである。   In view of the above problems, an object of the present invention is to satisfactorily solder pins of electronic components inserted into through-holes in a printed circuit board without involving changes in the liquid level of molten solder in a static solder bath. It is an object of the present invention to provide a static solder bath apparatus that can be used.

前記目的を達成するために、この発明の請求項１に係る静止型半田槽装置は、プリント基板のスルーホールに挿通された電子部品のピンを半田付けする静止型半田槽装置であって、
静止型半田槽と、プリント基板の実装面を上向きにし、かつ同プリント基板の下面を露出させて保持する枠状の基板パレットと、前記基板パレットを前記静止型半田槽内の溶融半田の液面上まで搬送して浮かばせ、かつ所定時間経過後、持ち上げて所定位置まで搬送する搬送装置と、を備え、
前記基板パレットには、前記プリント基板の下面を前記溶融半田の液面に押し付ける押圧力を付与するための押圧力付与手段が設けられていることを特徴とする。 In order to achieve the above object, a static solder bath apparatus according to claim 1 of the present invention is a static solder bath apparatus for soldering pins of an electronic component inserted into a through hole of a printed board,
A stationary solder bath, a frame-shaped substrate pallet that holds the printed circuit board with its mounting surface facing upward and the lower surface of the printed circuit board exposed, and a liquid level of molten solder in the stationary solder bath A transport device that transports it up and floats, and lifts and transports it to a predetermined position after a predetermined time,
The board pallet is provided with a pressing force applying means for applying a pressing force for pressing the lower surface of the printed board against the liquid surface of the molten solder.

前記構成において、枠状の基板パレットに、プリント基板がその実装面を上向きにし、かつ下面が露出されてセットされた後、搬送装置によって基板パレットが静止型半田槽内の溶融半田の液面上まで搬送されて所定時間放置され、所定時間経過後、持ち上げられて所定位置まで搬送される。
前記したように、静止型半田槽内の溶融半田の液面上に基板パレットが放置されると、基板パレットが溶融半田の液面上に浮かぶ。
この際、押圧力付与手段による押圧力によって基板パレットのプリント基板の下面が溶融半田の液面に押し付けられる。
これによって、静止型半田槽内の溶融半田の液面レベルの変化にかかわることなく、プリント基板のスルーホールに対する溶融半田の半田上がりが良好となる。この結果、プリント基板の電子部品のピンを良好に半田付けすることができる。 In the above configuration, after the printed circuit board is set on the frame-shaped substrate pallet with its mounting surface facing upward and the lower surface is exposed, the substrate pallet is placed on the liquid surface of the molten solder in the static solder bath by the transfer device. And is allowed to stand for a predetermined time, and after a predetermined time has elapsed, it is lifted and transported to a predetermined position.
As described above, when the substrate pallet is left on the surface of the molten solder in the static solder bath, the substrate pallet floats on the surface of the molten solder.
At this time, the lower surface of the printed circuit board of the substrate pallet is pressed against the liquid surface of the molten solder by the pressing force by the pressing force applying means.
As a result, the molten solder rises with respect to the through-holes of the printed circuit board without affecting the change in the liquid level of the molten solder in the static solder bath. As a result, the pins of the electronic components of the printed board can be soldered satisfactorily.

この発明の請求項２に係る静止型半田槽装置は、請求項１に記載の静止型半田槽装置であって、
押圧力付与手段は、基板パレット上の四隅部にそれぞれ配置される重錘体によって構成されていることを特徴とする。
前記構成において、基板パレット上の四隅部に重錘体を配置するという簡単な構造によって押圧力付与手段を構成することができ、安価に提供することができる。 A static solder bath apparatus according to claim 2 of the present invention is the static solder bath apparatus according to claim 1,
The pressing force applying means is configured by weight bodies respectively disposed at four corners on the substrate pallet.
In the above configuration, the pressing force applying means can be configured with a simple structure in which the weights are arranged at the four corners on the substrate pallet, and can be provided at low cost.

この発明の請求項３に係る静止型半田槽装置は、請求項２に記載の静止型半田槽装置であって、
重錘体は、薄板状の重錘板が積層されることで構成されていることを特徴とする。
前記構成において、薄板状の重錘板の積層枚数を適宜に変更することで基板パレットに対する押圧力を所望とする押圧力に容易に調整することができると共に、基板パレットを水平状にバランスさせて静止型半田槽内の溶融半田の液面上に浮かばせることができる。この結果、プリント基板のスルーホールに対する溶融半田の半田上がりがより一槽良好となる。 A static solder bath apparatus according to claim 3 of the present invention is the static solder bath apparatus according to claim 2,
The weight body is formed by stacking thin plate weight plates.
In the above configuration, the pressing force on the substrate pallet can be easily adjusted to a desired pressing force by appropriately changing the number of laminated thin plate weight plates, and the substrate pallet is balanced horizontally. It can be floated on the liquid surface of the molten solder in the static solder bath. As a result, the molten solder with respect to the through hole of the printed circuit board is better in one tank.

次に、この発明を実施するための最良の形態を実施例にしたがって説明する。   Next, the best mode for carrying out the present invention will be described with reference to examples.

（実施例１）
この発明の実施例１を図１〜図９にしたがって説明する。
図１はこの発明の実施例１に係る静止型半田槽装置を示す斜視図である。図２は静止型半田槽装置の側面図である。図３は基板パレットを示す平面図である。図４は基板パレットにプリント基板が基板押え体によって保持された状態を示す図３のＩＶ−ＩＶ線に基づく断面図である。図５は搬送装置のパレットアームによって基板パレットが下降される状態を示す説明図である。図６は静止型半田槽内の溶融半田の液面に基板パレットが放置される状態を示す説明図である。図７は搬送装置のパレットアームによって基板パレットが持ち上げられる状態を示す説明図である。図８は静止型半田槽内の溶融半田がプリント基板のスルーホールに沿って上げられる状態を示す説明図である。図９はプリント基板の電子部品のピンが半田付けされた状態を示す説明図である。 Example 1
A first embodiment of the present invention will be described with reference to FIGS.
1 is a perspective view showing a stationary solder bath apparatus according to Embodiment 1 of the present invention. FIG. 2 is a side view of the static solder bath apparatus. FIG. 3 is a plan view showing the substrate pallet. FIG. 4 is a cross-sectional view based on the line IV-IV in FIG. 3 showing a state in which the printed board is held by the board pressing body on the board pallet. FIG. 5 is an explanatory view showing a state in which the substrate pallet is lowered by the pallet arm of the transfer device. FIG. 6 is an explanatory view showing a state in which the substrate pallet is left on the surface of the molten solder in the static solder bath. FIG. 7 is an explanatory view showing a state in which the substrate pallet is lifted by the pallet arm of the transfer apparatus. FIG. 8 is an explanatory view showing a state where the molten solder in the static solder bath is raised along the through hole of the printed circuit board. FIG. 9 is an explanatory view showing a state in which the pins of the electronic components of the printed circuit board are soldered.

図１と図２に示すように、この実施例１に係る静止型半田槽装置は、主として、プリント基板１の実装面上に配設される各種の電子部品４のピン５をプリント基板１のランド（導電配線）２に半田付けするものであり、静止型半田槽１０、搬送装置２０、及び基板パレット３０を備えている。
静止型半田槽１０は、上方に開口する方形箱形状に形成され、静止型半田槽１０内には溶融半田１２が貯留され、底部にはヒータ１１が内設されている。なお、プリント基板１には、各種の電子部品４のピン５が貫通状に挿通される多数のスルーホール３が貫設され、各種の電子部品４のピン５は、プリント基板１の実装面側から各スルーホール３に挿通される（図４参照）。 As shown in FIGS. 1 and 2, the static solder bath apparatus according to the first embodiment mainly has pins 5 of various electronic components 4 arranged on the mounting surface of the printed board 1. It is to be soldered to a land (conductive wiring) 2 and includes a stationary solder tank 10, a transfer device 20, and a substrate pallet 30.
The stationary solder bath 10 is formed in a rectangular box shape that opens upward, the molten solder 12 is stored in the stationary solder bath 10, and the heater 11 is installed in the bottom. The printed circuit board 1 has many through holes 3 through which the pins 5 of various electronic components 4 are inserted in a penetrating manner. The pins 5 of the various electronic components 4 are on the mounting surface side of the printed circuit board 1. Are inserted through the through holes 3 (see FIG. 4).

搬送装置２０は、次に詳述する基板パレット３０を静止型半田槽１０内の溶融半田１２の液面１３上まで搬送して浮かばせ、かつ所定時間経過後、持ち上げて所定位置まで搬送するものであり、この実施例１において、搬送装置２０は、昇降駆動機構２１、昇降部材２７及びパレットアーム２８を備えて構成されている。
すなわち、図１と図２に示すように、静止型半田槽１０の側方には、昇降駆動機構２１が配設されている。この昇降駆動機構２１は、縦長の固定ケース２２内に回転可能に支持されかつモータ２３を駆動源とする上下方向の送りねじ（ボールネジ）２４と、この送りねじ２４の回転によって上下方向に移動されるナット２５とを備えている。そして、ナット２５には上下方向の板状の連動部材２６が固定され、この連動部材２６の上端部には、静止型半田槽１０の上方に位置するように昇降部材２７が水平方向に突出され、かつピン２９を支点として所定角度だけ傾動可能に取り付けられている。
昇降部材２７は、平面形状において四角枠状に形成され、この昇降部材２７の相対する枠体には、複数（図１では４つ）のパレットアーム２８が垂下状に取り付けられている。
そして、各パレットアーム２８の下端には、基板パレット３０の下面の四隅部近傍をそれぞれ支承して持ち上げる支承片２８ａが略水平状に折り曲げられて形成されている。 The transport device 20 transports a substrate pallet 30 described in detail below to the liquid level 13 of the molten solder 12 in the static solder bath 10 and floats it, and lifts it to a predetermined position after a predetermined time. In the first embodiment, the transport device 20 includes a lift drive mechanism 21, a lift member 27, and a pallet arm 28.
That is, as shown in FIGS. 1 and 2, an elevating drive mechanism 21 is disposed on the side of the stationary solder tank 10. The elevating drive mechanism 21 is rotatably supported in a vertically long fixed case 22 and moved up and down by a feed screw (ball screw) 24 having a motor 23 as a drive source and a rotation of the feed screw 24. Nut 25 is provided. A vertical plate-like interlocking member 26 is fixed to the nut 25, and an elevating member 27 protrudes in the horizontal direction at the upper end of the interlocking member 26 so as to be positioned above the stationary solder bath 10. And it is attached so that it can tilt by a predetermined angle with the pin 29 as a fulcrum.
The elevating member 27 is formed in a square frame shape in plan view, and a plurality (four in FIG. 1) of pallet arms 28 are attached to the opposing frame body of the elevating member 27 in a hanging shape.
At the lower end of each pallet arm 28, a support piece 28 a that supports and lifts the vicinity of the four corners of the lower surface of the substrate pallet 30 is formed by being bent substantially horizontally.

図２〜図４に示すように、基板パレット３０は、溶融半田１２の熱に耐え得る耐熱性合成樹脂材よって方形枠状に形成され、その開口孔３１は上半部が広く下半部が狭い段差状に形成されている。そして、基板パレット３０の開口孔３１には、その上方からプリント基板１が、実装面を上向きにして嵌込まれ、プリント基板１の下面周縁部が開口孔３１の段差面３２に支承されてセットされる。この状態において、プリント基板１の周縁部を除く下面の略全域が開口孔３１の下端開口部から露出するようになっている。   As shown in FIGS. 2 to 4, the substrate pallet 30 is formed in a rectangular frame shape by a heat-resistant synthetic resin material that can withstand the heat of the molten solder 12, and the opening hole 31 has a wide upper half and a lower half. It is formed in a narrow step shape. Then, the printed board 1 is fitted into the opening hole 31 of the board pallet 30 with the mounting surface facing upward from above, and the lower peripheral edge of the printed board 1 is supported by the step surface 32 of the opening hole 31 and set. Is done. In this state, substantially the entire lower surface excluding the peripheral edge of the printed circuit board 1 is exposed from the lower end opening of the opening hole 31.

また、図３と図４に示すように、基板パレット３０の上面の複数箇所には、プリント基板１の実装面（上面）を押さえて浮き上がりを防止するための基板押え体３３が配設されている。
この実施例１において、基板押え体３３は、図４に示すように、基板パレット３０の上面に支持ピン３６を中心として回動可能に取り付けられる取付部３４と、この取付部３４の一端からプリント基板１の実装面に向けて略Ｓ字状に屈曲されて延出され、かつ先端部にプリント基板１の実装面を押圧する押圧部３５とを有している。そして、基板押え体３３は、支持ピン３６を中心として略９０度の範囲において回動操作されることで、基板パレット３０の上面から退避する退避位置と、基板パレット３０の上面を押圧する押圧位置とに配置切り換えされるようになっている。 Further, as shown in FIGS. 3 and 4, at a plurality of positions on the upper surface of the substrate pallet 30, substrate pressing bodies 33 are disposed for pressing the mounting surface (upper surface) of the printed circuit board 1 and preventing the substrate pallet 30 from rising. Yes.
In the first embodiment, as shown in FIG. 4, the substrate pressing body 33 is attached to the upper surface of the substrate pallet 30 so as to be rotatable about the support pins 36, and printed from one end of the attachment portion 34. It has a pressing portion 35 that is bent and extended in a substantially S shape toward the mounting surface of the substrate 1 and that presses the mounting surface of the printed circuit board 1 at the tip. The substrate pressing body 33 is rotated within a range of about 90 degrees around the support pin 36, so that the retreat position for retreating from the upper surface of the substrate pallet 30 and the pressing position for pressing the upper surface of the substrate pallet 30 are obtained. It is possible to switch the layout.

また、図１と図３に示すように、基板パレット３０の上面の四隅部には、同基板パレット３０と共に、プリント基板１の下面（実装面と反対側の面）を静止型半田槽１０の溶融半田１２の液面１３に押し付ける押圧力を付与するための押圧力付与手段としての重錘体４１がそれぞれ配設されている。
この実施例１において、重錘体４１は、基板パレット３０の上面の四隅部に突出された保持突起３８に着脱可能に嵌合されて積層状に保持される多数枚の薄板状の重錘板４２によって構成されている。 As shown in FIGS. 1 and 3, the lower surface of the printed circuit board 1 (the surface opposite to the mounting surface) is attached to the four corners of the upper surface of the substrate pallet 30 together with the substrate pallet 30. A weight body 41 is provided as a pressing force application means for applying a pressing force to press the liquid surface 13 of the molten solder 12.
In the first embodiment, the weight body 41 includes a plurality of thin plate-like weight plates that are detachably fitted to the holding protrusions 38 that protrude from the four corners of the upper surface of the substrate pallet 30 and are held in a stacked manner. 42.

この実施例１に係る静止型半田槽装置は上述したように構成される。
したがって、プリント基板１の実装面上に配設される各種の電子部品４のピン５をプリント基板１のランド（導電配線）２に半田付けする場合、先ず、基板パレット３０の開口孔３１の上方からプリント基板１が、その実装面を上向きにして嵌込まれる。
ここで、基板押え体３３が、支持ピン３６を中心として略９０度回動操作され、基板パレット３０の上面を押圧する押圧位置に配置切り換えされることで、基板パレット３０にプリント基板１がセットされる（図４参照）。 The static solder bath apparatus according to the first embodiment is configured as described above.
Therefore, when soldering the pins 5 of the various electronic components 4 arranged on the mounting surface of the printed circuit board 1 to the lands (conductive wiring) 2 of the printed circuit board 1, first, above the opening hole 31 of the circuit board pallet 30. The printed circuit board 1 is fitted with its mounting surface facing upward.
Here, the printed circuit board 1 is set on the substrate pallet 30 by the substrate pressing body 33 being rotated about 90 degrees around the support pin 36 and being switched to a pressing position for pressing the upper surface of the substrate pallet 30. (See FIG. 4).

その後、図５に示すように、基板パレット３０の下面の四隅部近傍が各パレットアーム２８の下端の支承片２８ａ上に支承された状態で、昇降駆動機構２１によって昇降部材２７が図６に示すように下降端位置まで下降される。
昇降部材２７の下降に伴って各パレットアーム２８と共に基板パレット３０が下降される。そして、昇降部材２７と共に、各パレットアーム２８が下降端位置に達する前に、基板パレット３０と共に、プリント基板１が静止型半田槽１０の溶融半田１２の液面１３上に達し、各パレットアーム２８から開放されて溶融半田１２の液面１３上に放置される。これによって、溶融半田１２の液面１３上に基板パレット３０と共にプリント基板１が浮かぶ。
この際、押圧力付与手段としての重錘体４１による押圧力によって基板パレット３０と共に、プリント基板１の下面が溶融半田１２の液面１３に押し付けられ、プリント基板１のスルーホール３に溶融半田１２の一部が上げられる（図８参照）。 Thereafter, as shown in FIG. 5, the elevating member 27 is shown in FIG. 6 by the elevating drive mechanism 21 in a state where the vicinity of the four corners of the lower surface of the substrate pallet 30 is supported on the supporting piece 28 a at the lower end of each pallet arm 28. Thus, it is lowered to the lower end position.
As the elevating member 27 is lowered, the substrate pallet 30 is lowered together with each pallet arm 28. Before each pallet arm 28 reaches the lower end position together with the elevating member 27, the printed circuit board 1 reaches the liquid level 13 of the molten solder 12 in the stationary solder tank 10 together with the substrate pallet 30, and each pallet arm 28. And left on the liquid surface 13 of the molten solder 12. As a result, the printed circuit board 1 floats together with the substrate pallet 30 on the liquid surface 13 of the molten solder 12.
At this time, the lower surface of the printed circuit board 1 is pressed against the liquid surface 13 of the molten solder 12 together with the substrate pallet 30 by the pressing force by the weight body 41 as the pressing force applying means, and the molten solder 12 is pressed into the through hole 3 of the printed circuit board 1. Is raised (see FIG. 8).

その後、図７に示すように、昇降駆動機構２１によって昇降部材２７が元の上昇端位置まで上昇される。そして、昇降部材２７の各パレットアーム２８によって基板パレット３０と共にプリント基板１が元に上昇端位置まで持ち上げ（吊り上げ）られる。
基板パレット３０と共にプリント基板１が元に上昇端位置まで持ち上げられる間において、プリント基板１のスルーホール３に挿通された電子部品４のピン５回りに付着した溶融半田が固化されて半田付け部１５が形成され、この半田付け部１５によってプリント基板１の電子部品４のピン５がランド２に良好に半田付けされる（図９参照）。 Thereafter, as shown in FIG. 7, the elevating member 27 is raised to the original ascending end position by the elevating drive mechanism 21. Then, the printed circuit board 1 is lifted (lifted) together with the substrate pallet 30 to the raised end position by the pallet arms 28 of the elevating member 27.
While the printed circuit board 1 is lifted to the rising end position together with the circuit board pallet 30, the molten solder attached around the pins 5 of the electronic component 4 inserted into the through hole 3 of the printed circuit board 1 is solidified and is soldered. Is formed, and the pins 5 of the electronic component 4 of the printed board 1 are soldered to the land 2 satisfactorily by the soldering portion 15 (see FIG. 9).

前記したようにして、基板パレット３０と共に、プリント基板１が溶融半田１２の液面１３上に放置されて浮かんだ状態において、押圧力付与手段としての重錘体４１による押圧力によって基板パレット３０と共にプリント基板１の下面が溶融半田１２の液面１３に押し付けられるため、静止型半田槽１０内の溶融半田１２の液面１３の変化にかかわることなく、プリント基板１のスルーホール３に対する溶融半田１２の半田上がりが良好となる。この結果、プリント基板１の電子部品４のピン５回りにおいて、プリント基板１のランド２に溶着する半田付け部１５を良好に形成することができる。言い換えると、プリント基板１の電子部品４のピン５を良好に半田付けすることができる。   As described above, together with the substrate pallet 30, the printed board 1 is left on the liquid surface 13 of the molten solder 12 and floated together with the substrate pallet 30 by the pressing force by the weight body 41 as the pressing force applying means. Since the lower surface of the printed circuit board 1 is pressed against the liquid level 13 of the molten solder 12, the molten solder 12 with respect to the through hole 3 of the printed circuit board 1 is not affected by the change in the liquid level 13 of the molten solder 12 in the static solder bath 10. The solder finish is good. As a result, the soldering portion 15 that is welded to the land 2 of the printed circuit board 1 can be satisfactorily formed around the pins 5 of the electronic component 4 of the printed circuit board 1. In other words, the pins 5 of the electronic component 4 of the printed board 1 can be soldered well.

また、この実施例１においては、基板パレット３０上の四隅部に、所要数の薄板状の重錘板４２を積層する簡単な構造によって押圧力付与手段としての重錘体４１を容易に構成することができる。
さらに、薄板状の重錘体４１の積層枚数を適宜に変更することで、基板パレット３０に対する押圧力を所望とする押圧力に容易に調整することができると共に、基板パレット３０を水平状にバランスさせて静止型半田槽１０内の溶融半田１２の液面１３上に浮かばせることができる。この結果、プリント基板１のスルーホール３に対する溶融半田の半田上がりがより一槽良好となる。 In the first embodiment, the weight body 41 as the pressing force applying means is easily configured with a simple structure in which a required number of thin weight plates 42 are stacked at the four corners on the substrate pallet 30. be able to.
Furthermore, by appropriately changing the number of stacked thin plate-like weight bodies 41, the pressing force against the substrate pallet 30 can be easily adjusted to a desired pressing force, and the substrate pallet 30 is balanced horizontally. It can be made to float on the liquid level 13 of the molten solder 12 in the stationary solder tank 10. As a result, the soldering up of the molten solder with respect to the through hole 3 of the printed circuit board 1 becomes better.

なお、この発明は前記実施例１に限定されるものではなく、この発明の要旨を逸脱しない範囲内において、種々なる形態で実施し得ることは勿論である。
例えば、前記実施例１においては、押圧力付与手段としての重錘体４１を所要数の薄板状の重錘板４２を積層することで構成したが、重錘体４１は単体であってもよい。
また、重錘体４１を用いることなく、基板パレット３０の高さやプリント基板１をセットする高さを適宜に低くすることで、基板パレット３０自体の重量によって押圧力付与手段を構成することも可能である。
すなわち、押圧力付与手段は、半田上がりが良好となる押圧力を基板パレット３０にセットされたプリント基板１に付与し得るものであればどのように構成してもこの発明を実施することができる。
また、昇降駆動機構２１は、静止型半田槽１０の両側に配設することもできる。 In addition, this invention is not limited to the said Example 1, Of course, it can implement with a various form in the range which does not deviate from the summary of this invention.
For example, in the first embodiment, the weight body 41 as the pressing force application unit is configured by stacking the required number of thin weight plates 42, but the weight body 41 may be a single body. .
Further, without using the weight body 41, the height of the substrate pallet 30 and the height at which the printed circuit board 1 is set can be appropriately reduced so that the pressing force applying means can be configured by the weight of the substrate pallet 30 itself. It is.
In other words, the present invention can be implemented by any configuration as long as the pressing force applying means can apply a pressing force with good solder finish to the printed circuit board 1 set on the substrate pallet 30. .
Further, the elevating drive mechanism 21 can be disposed on both sides of the stationary solder bath 10.

この発明の実施例１に係る静止型半田槽装置を示す斜視図である。1 is a perspective view showing a stationary solder bath apparatus according to Embodiment 1 of the present invention. 同じく静止型半田槽装置の側面図である。It is a side view of a stationary solder bath apparatus similarly. 同じく基板パレットを示す平面図である。It is a top view which similarly shows a board | substrate pallet. 同じく基板パレットにプリント基板が基板押え体によって保持された状態を示す図３のＩＶ−ＩＶ線に基づく断面図である。It is sectional drawing based on the IV-IV line | wire of FIG. 3 which shows the state by which the printed circuit board was similarly hold | maintained by the board | substrate pressing body on the board | substrate pallet. 同じく搬送装置のパレットアームによって基板パレットが下降される状態を示す説明図である。It is explanatory drawing which shows the state by which a board | substrate pallet is similarly lowered | hung by the pallet arm of a conveying apparatus. 同じく静止型半田槽内の溶融半田の液面に基板パレットが放置される状態を示す説明図である。It is explanatory drawing which shows the state by which a board | substrate pallet is left on the liquid level of the molten solder in a static solder tank similarly. 同じく搬送装置のパレットアームによって基板パレットが持ち上げられる状態を示す説明図である。It is explanatory drawing which shows the state in which a board | substrate pallet is similarly lifted with the pallet arm of a conveying apparatus. 同じく静止型半田槽内の溶融半田がプリント基板のスルーホールに沿って上げられる状態を示す説明図である。It is explanatory drawing which shows the state from which the molten solder in a static solder tank is similarly raised along the through hole of a printed circuit board. 同じくプリント基板の電子部品のピンが半田付けされた状態を示す説明図である。It is explanatory drawing which shows the state by which the pin of the electronic component of the printed circuit board was soldered similarly. 従来の静止型半田槽装置を示す説明図である。It is explanatory drawing which shows the conventional static type solder tank apparatus.

符号の説明Explanation of symbols

１ プリント基板
３ スルーホール
４ 電子部品
５ ピン
１０ 静止型半田槽
１２ 溶融半田
１３ 液面
２０ 搬送装置
２１ 昇降駆動機構
２８ パレットアーム
３３ 基板押え体
４１ 重錘体（押圧力付与手段）
４２ 重錘板 DESCRIPTION OF SYMBOLS 1 Printed circuit board 3 Through hole 4 Electronic component 5 Pin 10 Static solder tank 12 Molten solder 13 Liquid level 20 Conveyance apparatus 21 Lifting drive mechanism 28 Pallet arm 33 Substrate pressing body 41 Weight body (pressing force giving means)
42 Weight plate

Claims (3)

プリント基板のスルーホールに挿通された電子部品のピンを半田付けする静止型半田槽装置であって、
静止型半田槽と、プリント基板の実装面を上向きにし、かつ同プリント基板の下面を露出させて保持する枠状の基板パレットと、前記基板パレットを前記静止型半田槽内の溶融半田の液面上まで搬送して浮かばせ、かつ所定時間経過後、持ち上げて所定位置まで搬送する搬送装置と、を備え、
前記基板パレットには、前記プリント基板の下面を前記溶融半田の液面に押し付ける押圧力を付与するための押圧力付与手段が設けられていることを特徴とする静止型半田槽装置。 A static solder bath apparatus for soldering pins of electronic components inserted through through holes of a printed circuit board,
A stationary solder bath, a frame-shaped substrate pallet that holds the printed circuit board with its mounting surface facing upward, and the lower surface of the printed circuit board exposed, and the molten solder liquid level in the stationary solder bath A transporting device that transports to the top and floats, and after a predetermined time has passed, lifts and transports it to a predetermined position;
A stationary solder bath apparatus, wherein the substrate pallet is provided with a pressing force applying means for applying a pressing force for pressing the lower surface of the printed circuit board against the liquid surface of the molten solder. 請求項１に記載の静止型半田槽装置であって、
押圧力付与手段は、基板パレット上の四隅部にそれぞれ配置される重錘体によって構成されていることを特徴とする静止型半田槽装置。 The static solder bath apparatus according to claim 1,
The static soldering bath apparatus characterized in that the pressing force applying means is composed of weight bodies respectively arranged at four corners on the substrate pallet. 請求項２に記載の静止型半田槽装置であって、
重錘体は、薄板状の重錘板が積層されることで構成されていることを特徴とする静止型半田槽装置。 The static solder bath apparatus according to claim 2,
The weight body is configured by laminating thin plate-shaped weight plates.
JP2007109349A 2007-04-18 2007-04-18 Static solder bath equipment Expired - Fee Related JP4823130B2 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011082328A (en) * 2009-10-07 2011-04-21 Fa Shinka Technology Co Ltd Solder cutting method of soldering device, and pallet device used therefor
JP4999215B1 (en) * 2012-01-31 2012-08-15 Ｆａシンカテクノロジー株式会社 Method for leveling printed circuit board to be soldered, and solder liquid immersion mechanism of soldering apparatus using the same

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JPS60157294A (en) * 1984-01-09 1985-08-17 ソニー・テクトロニクス株式会社 Soldering method and circuit board carrier
JPH0317669Y2 (en) * 1986-03-17 1991-04-15
JPH04287957A (en) * 1991-01-08 1992-10-13 Nec Corp Gold plating removal jig and removal method for lead of lsi package
JP2003028243A (en) * 2001-07-18 2003-01-29 Walbro Japan Inc Balance weight for flywheel

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60157294A (en) * 1984-01-09 1985-08-17 ソニー・テクトロニクス株式会社 Soldering method and circuit board carrier
JPH0317669Y2 (en) * 1986-03-17 1991-04-15
JPH04287957A (en) * 1991-01-08 1992-10-13 Nec Corp Gold plating removal jig and removal method for lead of lsi package
JP2003028243A (en) * 2001-07-18 2003-01-29 Walbro Japan Inc Balance weight for flywheel

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011082328A (en) * 2009-10-07 2011-04-21 Fa Shinka Technology Co Ltd Solder cutting method of soldering device, and pallet device used therefor
JP4999215B1 (en) * 2012-01-31 2012-08-15 Ｆａシンカテクノロジー株式会社 Method for leveling printed circuit board to be soldered, and solder liquid immersion mechanism of soldering apparatus using the same

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