KR101435432B1 - The loading rack of printed circuit board - Google Patents

The loading rack of printed circuit board Download PDF

Info

Publication number
KR101435432B1
KR101435432B1 KR1020130166594A KR20130166594A KR101435432B1 KR 101435432 B1 KR101435432 B1 KR 101435432B1 KR 1020130166594 A KR1020130166594 A KR 1020130166594A KR 20130166594 A KR20130166594 A KR 20130166594A KR 101435432 B1 KR101435432 B1 KR 101435432B1
Authority
KR
South Korea
Prior art keywords
printed circuit
circuit board
fixing part
rack
mounting
Prior art date
Application number
KR1020130166594A
Other languages
Korean (ko)
Inventor
이성기
서정식
이대원
조승훈
김원준
Original Assignee
주식회사 에스아이 플렉스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 에스아이 플렉스 filed Critical 주식회사 에스아이 플렉스
Priority to KR1020130166594A priority Critical patent/KR101435432B1/en
Application granted granted Critical
Publication of KR101435432B1 publication Critical patent/KR101435432B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/18—Construction of rack or frame
    • H05K7/183—Construction of rack or frame support rails therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Abstract

The present invention relates to a printed circuit board mounting rack comprising a body, a side support body having both side ends of a printed circuit board sandwiched and supported thereon, and a bottom support body on which a lower portion of the printed circuit board is seated, A plurality of vertical fixing parts fixed to the upper frame, a plurality of vertical fixing parts positioned on both lower sides of the vertical fixing part and substantially seating the product, and a fixing part for fixing the mounting part to the vertical fixing part By including the horizontal fixing part for fixing,
The PSR ink can be removed from the support so that the foreign matter can be improved by periodically replacing the PSR ink, so that a convenient maintenance effect can be achieved.

Description

[0001] The present invention relates to a rack for loading printed circuit boards

The present invention relates to a rack for mounting a printed circuit board, and it is possible to prevent tearing or breakage of the printed circuit board when the PSR process is performed by making Teflon as a material of the plug portion to which the printed circuit board can be inserted, The present invention relates to a rack for loading a printed circuit board which is easy to replace and clean.

In general, when a printed circuit board (PCB) is manufactured, a circuit is formed on a substrate made of an electrically insulating resin, a hole is formed after plating so as to allow electrical connection between the circuit and the circuit, (Photo Solder Resist) is applied to the substrate to prevent the substrate from being oxidized and the substrate is protected from the external environment, the printed circuit board on which the ink is applied is cut into several sheets, .

In this series of processes, the printed circuit board is stored in a state of being inserted or fixed in a rack, or transferred to a next process. Most of the racks used in the past are formed in a rectangular plate-like shape with a wide width and a flat upper surface, A plurality of slots are formed in the width direction so that a plurality of substrates can be inserted into the slots, and the slots are spaced apart from each other at predetermined intervals so that the substrates do not contact each other in a state in which ink is not solidified after ink application .

However, since conventionally used racks are simply supported with a printed circuit board inserted into slots corresponding to each other, a plate-shaped printed circuit board wobbles during movement and storage, and as the printed circuit board wobbles like this, The printed circuit board is bent, bent or twisted.

That is, since a thin plate-shaped printed circuit board is simply inserted into slots corresponding to each other, when a rack having a large number of printed circuit boards inserted therein is conveyed, wobbling and flow naturally occur, As the circuit board is transferred as it is and the central side of the printed circuit board is placed in an unprotected state, the printed circuit board is largely shaken and the printed circuit board is bent or bent.

This is because the position for supporting the printed circuit board made of a thin plate is located only on both sides of the printed circuit board where the printed circuit board is inserted into the slot of the rack, so that the center side of the printed circuit board is left unprotected .

As a conventional technique, a blackening processing rack of a printed circuit board is disclosed in Japanese Patent Laid-Open No. 10-982267, which comprises a base body composed of a plurality of frames, a plurality of fixed guides arranged at equal intervals in a lower portion of the base body, A plurality of fixing bars penetratingly coupled to the fixing guides, and a film supporting frame rotatably coupled to both end portions of the fixing bars and having a plurality of supports arranged at equal intervals on an outer circumferential surface thereof, It is possible to prevent breakage of the copper-clad laminated film by preventing the copper-clad laminated film from being easily detached from the rack, and to minimize the damage of the copper-clad laminated film, thereby minimizing product defects and product losses.

However, since the support of the copper-clad laminated film constituting the printed circuit board is concentrated only on both sides of the film as described above, there is a problem that the printed circuit board can not be wobbled during the movement.

Korea Intellectual Property Office Registered Utility Model No. 20-0457378

The present invention has been devised to solve the problem of a conventional rack having a printed circuit board mounted thereon. The pre-drying process is performed at 80 degrees in the PSR process and the preliminary drying process is performed at 150 degrees And it is an object of the present invention to provide a rack for loading a printed circuit board which can withstand heat in the course of a complete drying process in the course of a complete drying process and which is not broken or torn by force when the printed circuit board is dropped.

It is another object of the present invention to provide a rack for mounting a printed circuit board which is formed to have a width of about 10 mm so that the impact can be minimized by distributing force when the printed circuit board directly touches.

According to an aspect of the present invention, there is provided a printed circuit board mounting rack including a body, a side support body having both side ends of a printed circuit board inserted therein, and a bottom support body on which a lower portion of the printed circuit board is mounted,

The bottom support comprises a plurality of vertical fixing parts fixed to the upper frame and positioned on both sides of a lower part of the vertical fixing part so that the bottom supporting part can be seated on the bottom surface of the product, And a horizontal fixing part for fixing the mounting part to the vertical fixing part.

In this case, the mounting portion is formed of Teflon material and has a width of 10 mm so that the area directly touching the product is widened to disperse the force, and a plurality of seating grooves can be formed inside.

The horizontal fixing part is located on both sides of the fixing part so that the horizontal fixing part and the fixing part can be fixed by the bolts so that both sides of the fixing part can be pressed and fixed to the horizontal fixing part, And is formed of the same stainless steel material so as to be fixed by welding.

As described above, according to the printed circuit board loading rack of the present invention, since the material of the plug portion where the printed circuit board is inserted is made of Teflon, the preliminary drying process at 80 degrees in the PSR process and the completely dry So as to withstand the heat during the process, and to prevent the breakage or breakage of the printed circuit board due to the force when the printed circuit board is dropped.

Further, when the printed circuit board is directly contacted, the width of the mounting portion is approximately 10 mm, and the force is dispersed so that the impact can be minimized.

In addition, by making it possible to separate the holder from the support, it is possible to improve the foreign matter by replacing the PSR inks periodically, thereby achieving a convenient maintenance effect.

1 is a perspective view of a rack for mounting a printed circuit board according to an embodiment of the present invention,
2 is an exploded perspective view of a rack for mounting a printed circuit board according to an embodiment of the present invention,
3 to 4 are partial perspective views of a bottom support of a rack for loading printed circuit boards according to an embodiment of the present invention.

Hereinafter, a rack for mounting a printed circuit board according to the present invention will be described in detail with reference to the accompanying drawings. It is to be noted that like elements in the drawings are represented by the same reference numerals as possible. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

FIG. 1 is a perspective view of a rack for mounting a printed circuit board according to an embodiment of the present invention, FIG. 2 is an exploded perspective view of a rack for mounting a printed circuit board according to an embodiment of the present invention, Is a partial perspective view of a bottom support of a rack for loading printed circuit boards according to an embodiment of the present invention.

As shown in these drawings, a rack 100 for loading a printed circuit board according to the present invention comprises a body 10, a side support 20 on which both side ends of a printed circuit board are inserted and supported, And a bottom supporting body 30 on which the bottom supporting body 30 is seated.

The body 10 includes a pair of upper frames 11 spaced apart from each other by a predetermined distance, vertical frames 12 fixed to the upper frame 11 and extending vertically downward, The upper frame 11 and the vertical frame 12 and the reinforcing frame 13 are welded to each other so that the upper frame 11 and the upper frame 11 are welded to each other. Lt; / RTI >

The upper frame 11 is formed into an annular rod shape and is cut into a predetermined length when necessary, so that the upper frame 11 can be installed through the vertical frame 12.

The vertical frame 12 is formed in a plate shape so that the PCB 100 can be formed to have a square shape so that the upper frame 11 can be inserted and fixed in a direction orthogonal to the upper frame 11. [ do.

The reinforcing frame 13 is positioned at the upper and lower portions of the vertical frame 12 so that the pair of vertical frames 12 can be connected to each other so that the side support 20 is fixed to the reinforcing frame 13 . At this time, the side surface of the reinforcing frame 13 is formed to be bent so as to improve the folding force with the side support 20, which will be described later. In addition, a knob 131 is formed on one side of the reinforcing frame 13 so that the rack 100 can be easily moved.

The side support 20 is formed into a plate by laser processing a SUS (stainless steel) original plate, and then bent to process a side of the product inserted into the rack 100. In addition, the support 20 can be fixed to the reinforcing frame 13, so that the pair of side supports 20 can be positioned in a direction corresponding to each other and fixed by welding.

The bottom support 30 is positioned on the bottom surface of the product and includes a plurality of vertical fixing parts 31 fixed to the upper frame 11, And a horizontal fixing part 33 for fixing the mounting part 32 to the vertical fixing part 31. The vertical fixing part 31 is provided with a fixing part 33 for fixing the product.

The vertical fixing part 31 is fixed to the upper frame 11 and extends vertically downward so that the vertical fixing part 31 can have a sufficient width so as to be spaced apart from the mounting part 32 by a predetermined distance.

The mounting portion 32 is made of Teflon and has a width of about 10 mm so that an area directly touching the product is widened to disperse the force and a plurality of seating grooves 321 can be formed inside do.

The horizontal fixing part 33 is located on both sides of the mounting part 32 and allows the horizontal fixing part 33 and the fixing part 32 to be fixed by the bolts 34. The horizontal fixing part 33 Are formed to be the same as the length of the plug portion 32 so that both side faces of the plug portion 32 can be pressed and fixed by the horizontal fixing portion 33.

The horizontal fixing part 33 is made of the same material as the vertical fixing part 31 and can be fixed by welding so that the horizontal fixing part 33 is made of a material different from that of the fixing part 32 so that it can be fixed by bolts do.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, Should be interpreted as falling within the scope of.

10: Body 20: Side support
30: bottom support

Claims (3)

A printed circuit board mounting rack (100) comprising a body (10), a side support body (20) in which both side ends of a printed circuit board are fitted and supported, and a bottom support body (30) ,
The bottom support 30 is positioned on the bottom surface of the product and includes a plurality of vertical fixing parts 31 fixed to the upper frame 11 and a pair of vertical fixing parts 31, And a horizontal fixing part (33) for fixing the mounting part (32) to the vertical fixing part (31), wherein the fixing part (32)
The horizontal fixing part 33 is positioned on both sides of the mounting part 32 and can fix the horizontal fixing part 33 and the mounting part 32 by the bolts 34 so that both sides of the mounting part 32 And the horizontal fixing part 33 and the vertical fixing part 31 are made of the same stainless steel material so that they can be fixed by welding. Rack for loading printed circuit boards. The method according to claim 1,
The mounting portion 32 is formed of Teflon and has a width of 10 mm so that an area directly touching the product is widened to disperse the force and a plurality of seating grooves 321 can be formed in the inside And a plurality of printed circuit boards. delete
KR1020130166594A 2013-12-30 2013-12-30 The loading rack of printed circuit board KR101435432B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020130166594A KR101435432B1 (en) 2013-12-30 2013-12-30 The loading rack of printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130166594A KR101435432B1 (en) 2013-12-30 2013-12-30 The loading rack of printed circuit board

Publications (1)

Publication Number Publication Date
KR101435432B1 true KR101435432B1 (en) 2014-08-29

Family

ID=51751547

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130166594A KR101435432B1 (en) 2013-12-30 2013-12-30 The loading rack of printed circuit board

Country Status (1)

Country Link
KR (1) KR101435432B1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09226882A (en) * 1996-02-23 1997-09-02 Dainichi Shoji Kk Cassette for substrates
JPH10303159A (en) * 1997-04-17 1998-11-13 Lsi Logic Corp Carrier for cleaning substrate
JP3586876B2 (en) 1994-02-04 2004-11-10 松下電器産業株式会社 Electronic equipment
JP3855589B2 (en) 2000-03-30 2006-12-13 三菱電機株式会社 Board mounting equipment

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3586876B2 (en) 1994-02-04 2004-11-10 松下電器産業株式会社 Electronic equipment
JPH09226882A (en) * 1996-02-23 1997-09-02 Dainichi Shoji Kk Cassette for substrates
JPH10303159A (en) * 1997-04-17 1998-11-13 Lsi Logic Corp Carrier for cleaning substrate
JP3855589B2 (en) 2000-03-30 2006-12-13 三菱電機株式会社 Board mounting equipment

Similar Documents

Publication Publication Date Title
JP2011108237A (en) Fixed rack
KR101435432B1 (en) The loading rack of printed circuit board
JP4386089B2 (en) Mounting structure of connector receptacle on wiring board
JP2006237022A (en) Conduction terminal
KR200457378Y1 (en) loading rack of printed circuit board with supporting tool
CN107128061B (en) PCB printing device
CN215682799U (en) Double-sided DIP wave soldering jig for double-sided SMT patch element
KR20110133191A (en) Plating apparatus
JP2009218358A5 (en)
KR100711884B1 (en) Suppport Frame for flexible substrate of Display device
CN213485256U (en) Jig for improving ink development
JP2010215287A (en) Wire cassette for substrate
JP5507658B2 (en) Electrical connection device
JP4947408B2 (en) Array mask support device
CN109041449B (en) Reflow soldering carrier
KR101209671B1 (en) A Basket Device for Electrless of thin Printed Circuit Board
KR102504222B1 (en) IMT and SMT Combination Type Connector
CN202524656U (en) Deformation-preventing wave soldering jig
JP6378265B2 (en) PCB connection structure
CN204721780U (en) A kind of riveting pin, heat spreader structures and pcb board
KR101830915B1 (en) Non-contact alignment device for PCB board
JP3174834U (en) Pallet for soldering
US7798835B1 (en) Electronic connector with press-fitted terminals in a body floating on a support member
JP3109582U6 (en) Card reader
JP3109582U (en) Card reader

Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20170602

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20180704

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20190611

Year of fee payment: 6