JP2008265247A5 - - Google Patents

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Publication number
JP2008265247A5
JP2008265247A5 JP2007114869A JP2007114869A JP2008265247A5 JP 2008265247 A5 JP2008265247 A5 JP 2008265247A5 JP 2007114869 A JP2007114869 A JP 2007114869A JP 2007114869 A JP2007114869 A JP 2007114869A JP 2008265247 A5 JP2008265247 A5 JP 2008265247A5
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JP
Japan
Prior art keywords
base material
material layer
layer
flexible film
outer layer
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Application number
JP2007114869A
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Japanese (ja)
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JP5307352B2 (en
JP2008265247A (en
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Priority to JP2007114869A priority Critical patent/JP5307352B2/en
Priority claimed from JP2007114869A external-priority patent/JP5307352B2/en
Publication of JP2008265247A publication Critical patent/JP2008265247A/en
Publication of JP2008265247A5 publication Critical patent/JP2008265247A5/ja
Application granted granted Critical
Publication of JP5307352B2 publication Critical patent/JP5307352B2/en
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Claims (5)

基材層（Ｂ）の両面に外層（Ａ）を積層させた３層からなる軟質フィルムであって、
基材層（Ｂ）が、ポリエチレン系樹脂からなり、
外層（Ａ）が、テレフタル酸と１，４−ブタンジオールとポリテトラメチレングリコールからなり、ポリテトラメチレングリコールの含有量が５〜２０重量％である変性ポリブチレンテレフタレート系樹脂からなることを特徴とする軟質フィルム。 A soft film composed of three layers in which an outer layer (A) is laminated on both sides of a base material layer (B),
The base material layer (B) is made of a polyethylene resin,
The outer layer (A) is Ri Do from terephthalic acid and 1,4-butanediol and polytetramethylene glycol, the content of the polytetramethylene glycol by comprising 5 to 20 wt% der Ru modified polybutylene terephthalate resin Characteristic soft film. 外層（Ａ）と基材層（Ｂ）との層比が、（Ａ）：（Ｂ）：（Ａ）＝１：４：１〜１：１６：１であることを特徴とする請求項１に記載の軟質フィルム。   The layer ratio of the outer layer (A) to the base material layer (B) is (A) :( B) :( A) = 1: 4: 1 to 1: 16: 1. The soft film as described in 2. 基材層（Ｂ）が、ポリエチレン系樹脂にポリオレフィンの無水マレイン酸グラフト系接着性樹脂の少なくとも１種を０〜１００重量％含むものであることを特徴とする請求項１または２に記載の軟質フィルム。   3. The flexible film according to claim 1, wherein the base material layer (B) contains 0 to 100% by weight of at least one maleic anhydride graft adhesive resin of polyolefin in a polyethylene resin. 4. 基材層（Ｂ）が、ポリオレフィンエーテル系永久帯電防止剤を１０〜３０重量％含有することを特徴とする請求項１〜３のいずれか一項に記載の軟質フィルム。   The flexible film according to any one of claims 1 to 3, wherein the base material layer (B) contains 10 to 30% by weight of a polyolefin ether permanent antistatic agent. 電子線照射が施されることを特徴とする請求項１〜４のいずれか一項に記載の軟質フィルム。
Electron beam irradiation is given, The flexible film as described in any one of Claims 1-4 characterized by the above-mentioned.
JP2007114869A 2007-04-24 2007-04-24 Soft film Active JP5307352B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007114869A JP5307352B2 (en) 2007-04-24 2007-04-24 Soft film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007114869A JP5307352B2 (en) 2007-04-24 2007-04-24 Soft film

Publications (3)

Publication Number Publication Date
JP2008265247A JP2008265247A (en) 2008-11-06
JP2008265247A5 true JP2008265247A5 (en) 2010-06-03
JP5307352B2 JP5307352B2 (en) 2013-10-02

Family

ID=40045441

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007114869A Active JP5307352B2 (en) 2007-04-24 2007-04-24 Soft film

Country Status (1)

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JP (1) JP5307352B2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5489501B2 (en) * 2009-03-19 2014-05-14 グンゼ株式会社 Back grind film and manufacturing method thereof
JP2013182981A (en) * 2012-03-01 2013-09-12 Gunze Ltd Substrate film for back grinding sheet
JP6391441B2 (en) * 2014-11-26 2018-09-19 三井化学東セロ株式会社 Semiconductor wafer protection sheet
JP6507785B2 (en) * 2015-03-27 2019-05-08 東レ株式会社 Film for surface protection
JP6767763B2 (en) * 2016-03-29 2020-10-14 三井化学東セロ株式会社 A mold release film for a process that has an excellent appearance of a molded product, its application, and a method for manufacturing a resin-sealed semiconductor using the same.

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3503035B2 (en) * 1994-12-19 2004-03-02 タキロン株式会社 Antistatic sheet and method for producing the same
JP2006148081A (en) * 2004-10-19 2006-06-08 Sumitomo Bakelite Co Ltd Mold release film and method of manufacturing circuit board
JP4526937B2 (en) * 2004-12-02 2010-08-18 アキレス株式会社 Antistatic base film for semiconductor manufacturing tape

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