TWI478811B - Release film - Google Patents

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TWI478811B
TWI478811B TW099135393A TW99135393A TWI478811B TW I478811 B TWI478811 B TW I478811B TW 099135393 A TW099135393 A TW 099135393A TW 99135393 A TW99135393 A TW 99135393A TW I478811 B TWI478811 B TW I478811B
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polyester
film
layer
release
release film
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TW099135393A
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TW201119854A (en
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Kenji Shibuya
Kazunari Nanjo
Hiroshi Nishimura
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Unitika Ltd
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Description

離型膜Release film

本發明係關於一種離型膜,特別係關於一種印刷基板製造時所使用之離型膜。尤其有關一種於具有精密的圖型之印刷基板上藉熱硬化性黏著劑而高溫熱壓黏著覆蓋膜時有用的離型膜。The present invention relates to a release film, and more particularly to a release film used in the manufacture of a printed substrate. In particular, it relates to a release film which is useful when a cover film is bonded to a printed circuit board having a precise pattern by a thermosetting adhesive at a high temperature.

離型膜在工業上被廣泛使用。尤其,在印刷電路基板、軟性印刷電路基板、多層印刷電路基板等之製造步驟中,經由預浸體或耐熱膜而熱壓銅箔層合板或銅箔時,可使用於用以防止預浸體或耐熱膜與壓熱板黏著。進一步,在軟性印刷基板的製造步驟中,於形成電性電路之軟性印刷基板本體藉熱硬化型黏著劑而熱壓黏著覆蓋膜時,可使用於用以防止覆蓋膜與壓熱板黏著。Release films are widely used in the industry. In particular, in a manufacturing step of a printed circuit board, a flexible printed circuit board, or a multilayer printed circuit board, when a copper foil laminate or a copper foil is hot-pressed via a prepreg or a heat-resistant film, it can be used to prevent a prepreg. Or the heat resistant film is adhered to the hot plate. Further, in the manufacturing step of the flexible printed circuit board, when the flexible printed circuit board body forming the electrical circuit is thermally pressure-bonded to the cover film by the thermosetting adhesive, it can be used to prevent the cover film from adhering to the hot plate.

前述用途之離型膜係可舉例如氟系膜、聚矽氧塗佈聚對苯二甲酸乙二酯膜、聚甲基戊烯膜、聚丙烯膜等。The release film of the above-mentioned application may, for example, be a fluorine-based film, a polyoxymethylene-coated polyethylene terephthalate film, a polymethylpentene film or a polypropylene film.

但,自以往可使用來作為離型膜之氟系膜雖於耐熱性、離型性、非污染性優異,但除昂貴外,在使用後之廢棄燒燼處理中很難燃燒,且產生有毒氣體之問題點仍存在。又,聚矽氧塗佈聚對苯二甲酸乙二酯膜、聚甲基戊烯膜係於膜組成中含有聚矽氧或低份子量體,因此等之移動,於印刷電路基板尤其基板上之銅電路上引起污染,恐損及品質。又,聚丙烯膜係耐熱性差,離型性不充分。However, the fluorine-based film which has been used as a release film in the past is excellent in heat resistance, release property, and non-contamination property, but it is difficult to burn and is toxic in waste burnt treatment after use except expensive. The problem of gas still exists. Further, the polyoxymethylene-coated polyethylene terephthalate film or the polymethylpentene film contains polyfluorene or a low molecular weight in the film composition, and thus moves on a printed circuit board, particularly a substrate. The copper circuit causes pollution, damage and quality. Further, the polypropylene film is inferior in heat resistance and insufficient in release property.

因此,就改善柔軟性、耐熱性、離型性、非污染性,可廢棄燒燼之離型膜,已知於含有例如聚丙烯系樹脂、與乙烯系芳香族系彈性體之緩衝(cushion)層的兩面層合由結晶性芳香族聚酯所構成的離型層之膜(專利文獻1)。又,已揭示聚對苯二甲酸丁二酯、聚對苯二甲酸丙二酯、聚對苯二甲酸丁二酯與聚醚之嵌般共聚物作為離型層之膜(專利文獻2)、或以此等作為緩衝層之膜(專利文獻3)。Therefore, it is possible to remove the burnt release film by improving the flexibility, heat resistance, release property, and non-contamination property, and it is known to contain, for example, a polypropylene resin and a buffer of a vinyl aromatic elastomer. A film of a release layer composed of a crystalline aromatic polyester is laminated on both sides of the layer (Patent Document 1). Further, a film of a polybutylene terephthalate, a polytrimethylene terephthalate, a polybutylene terephthalate, and a polyether as a release layer has been disclosed (Patent Document 2). Or such a film as a buffer layer (Patent Document 3).

又,耐熱性、成形加工性優異之層合化粧薄片已揭示使非晶性聚酯系樹脂與結晶性聚酯樹脂掺混、或層合之膜(專利文獻4、專利文獻5)。In the laminated cosmetic sheet which is excellent in heat resistance and moldability, a film in which an amorphous polyester resin and a crystalline polyester resin are blended or laminated is disclosed (Patent Document 4, Patent Document 5).

[專利文獻1] 日本特開2008-049504號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2008-049504

[專利文獻2] 國際公開第05/002850號手冊[Patent Document 2] International Publication No. 05/002850

[專利文獻3] 日本特許第4099355號公報[Patent Document 3] Japanese Patent No. 4099355

[專利文獻4] 日本特開2003-231761號公報[Patent Document 4] Japanese Patent Laid-Open Publication No. 2003-231761

[專利文獻5] 日本特開2008-162058號公報[Patent Document 5] Japanese Patent Laid-Open Publication No. 2008-162058

但,在如此之技術中,未充分兼具離型性及耐熱性、與柔軟性,重視離型性與耐熱性時,變成犧牲柔軟性,對於具有精密圖型之印刷基板的埋入性差。另外,重視柔軟性時,除離型性的降低或膜表面的滑性惡化外,因彈性率低,故膜之捲取時或裁切時延伸或產生皺折等,綜合性之處理作業性差。However, in such a technique, when the release property, the heat resistance, and the flexibility are not sufficiently obtained, the release property and the heat resistance are emphasized, the sacrificial flexibility is obtained, and the embedding property of the printed circuit board having a precise pattern is inferior. In addition, when the flexibility is emphasized, in addition to the deterioration of the release property or the deterioration of the slipperiness of the film surface, the elastic modulus is low, so that the film is stretched or wrinkled during the winding or cutting, and the comprehensive handling property is poor. .

例如,專利文獻1記載之膜中係離型性、埋入性優異,但,緩衝層樹脂之熔點低,故耐熱性不充分。因此,有熱壓時緩衝層從膜端部滲出,或因低分子量體之移動而污染印刷電路基板之問題。For example, the film described in Patent Document 1 is excellent in release property and embedding property. However, since the melting point of the buffer layer resin is low, heat resistance is insufficient. Therefore, there is a problem that the buffer layer oozes from the end portion of the film during hot pressing or contaminates the printed circuit board due to the movement of the low molecular weight body.

在專利文獻2、專利文獻3之技術中,以埋入性提昇作為目的,使用柔軟共聚合之聚對苯二甲酸丁二酯,因此,離型性、非污染性優異。但,於內層、或外層使用聚對苯二甲酸丁二酯,其硬度之故,熱壓時之埋入性較以往所使用之聚甲基戊烯系膜差。In the technique of Patent Document 2 and Patent Document 3, since the soft copolymerized polybutylene terephthalate is used for the purpose of improving the embedding property, it is excellent in release property and non-contamination property. However, polybutylene terephthalate is used for the inner layer or the outer layer, and the hardness thereof is inferior to the polymethylpentene film used in the prior art.

在專利文獻4、專利文獻5之技術中,以化粧薄片之成形加工性提昇作為目的,於結晶性聚酯樹脂掺混非晶聚酯系樹脂。因此,埋入性優異。但,表層樹脂係藉由重視成形性未積極地結晶化,因此,如本發明之用途的高溫熱壓時,有耐熱性或離型性差之問題。In the techniques of Patent Document 4 and Patent Document 5, the amorphous polyester resin is blended in the crystalline polyester resin for the purpose of improving the moldability of the cosmetic sheet. Therefore, the embedding property is excellent. However, since the surface layer resin is not actively crystallized by paying attention to moldability, there is a problem of poor heat resistance or release property at the time of high-temperature hot pressing of the use of the present invention.

本發明係解決習知技術之前述問題點,目的在於提供一種柔軟性、離型性、耐熱性、非污染性優異,尤其,對於具有精密圖型之印刷基板的埋入性良好,且薄片之捲取或裁切時之處理作業性優異之離型薄膜。The present invention solves the aforementioned problems of the prior art, and an object thereof is to provide an excellent property of flexibility, release property, heat resistance, and non-contamination property, and in particular, good embedding property for a printed circuit board having a precise pattern, and a sheet A release film that is excellent in workability when being taken up or cut.

本發明人等係為解決上述課題,專心研究之結果,藉由層合具有特定結晶性的聚酯系彈性體、與玻璃轉移溫度高於其之聚酯,使表層之聚酯系彈性體結晶化而賦予離型性,藉由使內層之結晶性樹脂的聚酯之結晶性調控於特定的範圍,發現可兼具在高溫之熱壓時的埋入性與非滲出性之相反的特性,完成本發明。又,在本發明中,所謂高溫熱壓,謂使用加熱至100℃以上之熱板的壓加工。亦即,本發明之要旨係如下。In order to solve the above-mentioned problems, the inventors of the present invention have concentrated on the polyester elastomer of the surface layer by laminating a polyester elastomer having a specific crystallinity and a polyester having a glass transition temperature higher than that. By imparting the release property, the crystallinity of the polyester of the inner layer of the crystalline resin is adjusted to a specific range, and it is found that the burying property and the non-bleeding property at the time of hot pressing at a high temperature can be reversed. The present invention has been completed. Further, in the present invention, the high-temperature hot pressing is a press working using a hot plate heated to 100 ° C or higher. That is, the gist of the present invention is as follows.

(1).一種離型膜,其特徵係具有配置於表層之聚酯系彈性體(A)層,與聚酯(B)層,聚酯系彈性體(A)係玻璃轉移溫度為0至20℃且結晶化速度指標為20至50℃,聚酯(B)係含有結晶性芳香族聚酯(B1)及1,4-環己烷二甲醇共聚合聚對苯二甲酸乙二酯(B2),質量比(B1)/(B2)為5/95至50/50的範圍,聚酯(B)係玻璃轉移溫度為40至80℃且結晶熔解熱量為5至40J/g。(1) A release film characterized by having a polyester-based elastomer (A) layer disposed on a surface layer, and a polyester (B) layer, and a polyester-based elastomer (A)-based glass transition temperature of 0 to 20 ° C and the crystallization rate index is 20 to 50 ° C, polyester (B) contains crystalline aromatic polyester (B1) and 1,4-cyclohexane dimethanol copolymerized polyethylene terephthalate ( B2), the mass ratio (B1) / (B2) is in the range of 5/95 to 50/50, and the polyester (B) system has a glass transition temperature of 40 to 80 ° C and a heat of crystal fusion of 5 to 40 J/g.

(2).如(1)之離型膜聚酯系彈性體(A)係玻璃轉移溫度為3至12℃且結晶化速度指標為25至48℃,聚酯(B)中之結晶性芳香族聚酯(B1)與1,4-環己烷二甲醇共聚合聚對苯二甲酸乙二酯(B2)之質量比(B1)/(B2)為10/90至50/50的範圍,聚酯(B)係玻璃轉移溫度為50至73℃且結晶熔解熱量為8至35J/g。(2) The release film polyester elastomer (A) according to (1) has a glass transition temperature of 3 to 12 ° C and a crystallization rate of 25 to 48 ° C, and a crystalline aromatic in the polyester (B) The mass ratio (B1)/(B2) of the copolymerized polyester (B1) to 1,4-cyclohexanedimethanol copolymerized polyethylene terephthalate (B2) is in the range of 10/90 to 50/50. The polyester (B)-based glass has a glass transition temperature of 50 to 73 ° C and a heat of crystal fusion of 8 to 35 J/g.

(3).如(1)或(2)項之離型膜,其中聚酯系彈性體(A)為聚對苯二甲酸丁二酯與聚醚之嵌段共聚物。(3) The release film of (1) or (2), wherein the polyester elastomer (A) is a block copolymer of polybutylene terephthalate and polyether.

(4).如(1)或(3)項中任一項之離型膜,其中結晶性芳香族聚酯(B1)為聚對苯二甲酸丁二酯、聚對苯二甲酸丙二酯、聚對苯二甲酸乙二酯、間苯二甲酸共聚合聚對苯二甲酸乙二酯之任一者或2種以上的混合物。(4) The release film of any one of (1) or (3), wherein the crystalline aromatic polyester (B1) is polybutylene terephthalate or polytrimethylene terephthalate Any of polyethylene terephthalate or isophthalic acid copolymerized polyethylene terephthalate or a mixture of two or more thereof.

(5).如(1)或(4)項中任一項之離型膜,其中層合膜之構成為(A)/(B)/(A)之2種3層、或(A)/(B)之2種2層。The release film of any one of (1) or (4), wherein the laminated film is composed of two types of (A)/(B)/(A), or (A) / (B) 2 kinds of 2 layers.

[用以實施發明之形態][Formation for implementing the invention]

以下,詳細說明本發明。Hereinafter, the present invention will be described in detail.

本發明之離型膜,其係具有配置於表層之聚酯系彈性體(A)層,與聚酯(B)層之層合膜。The release film of the present invention has a polyester-based elastomer (A) layer disposed on the surface layer and a laminated film with the polyester (B) layer.

〈聚酯系彈性體(A)〉<Polyester Elastomer (A)>

聚酯系彈性體(A)層係配置於離型膜之表層而發揮離型層功能。若無聚酯系彈性體(A)層,熱壓時之離型性降低,例如在使用覆蓋膜之層合板的熱壓步驟中,膜容易被剝離,而於層合板或壓熱板上黏著膜,將其等污染。The polyester elastomer (A) layer is disposed on the surface layer of the release film to exhibit a release layer function. If there is no polyester elastomer (A) layer, the release property during hot pressing is lowered. For example, in the hot pressing step of the laminate using the cover film, the film is easily peeled off and adhered to the laminate or the hot plate. The membrane, which is contaminated.

聚酯系彈性體(A)係可舉例如由高熔點結晶性節段與低熔點節段之嵌段共聚物所構成者。高熔點結晶性節段主要由結晶性芳香族聚酯單元所構成,低熔點節段係由脂肪族聚醚單元及/或脂肪族聚酯單元所構成。The polyester elastomer (A) is exemplified by a block copolymer of a high melting point crystalline segment and a low melting point segment. The high melting point crystalline segment is mainly composed of a crystalline aromatic polyester unit, and the low melting point segment is composed of an aliphatic polyether unit and/or an aliphatic polyester unit.

聚酯系彈性體(A)中之高熔點結晶性節段與低熔點節段的共聚合比率除了選擇構成各節段之單體外,以滿足後述之熔點、玻璃轉移溫度、結晶化速度指標、結晶熔解熱量之範圍而決定,無特別限定。但,於聚酯系彈性體(A)中含有低熔點節段5至50質量%為適宜。The copolymerization ratio of the high-melting-point crystalline segment and the low-melting-point segment in the polyester-based elastomer (A) is selected in addition to the monomers constituting each segment to satisfy the melting point, glass transition temperature, and crystallization rate which will be described later. The range of heat of crystal melting is determined, and is not particularly limited. However, it is preferable that the polyester elastomer (A) contains 5 to 50% by mass of the low melting point segment.

在聚酯系彈性體(A)中,構成高熔點結晶性節段之結晶性芳香族聚酯係宜由芳香族二羧酸成分與脂肪族二醇成分所形成之聚酯。詳細而言,從耐熱性或高結晶性之觀點,宜為聚對苯二甲酸乙二酯(PET)、聚對苯二甲酸丁二酯(PBT)、聚對苯二甲酸丙二酯(PTT)。In the polyester elastomer (A), the crystalline aromatic polyester constituting the high melting point crystalline segment is preferably a polyester formed of an aromatic dicarboxylic acid component and an aliphatic diol component. Specifically, from the viewpoint of heat resistance or high crystallinity, polyethylene terephthalate (PET), polybutylene terephthalate (PBT), and polytrimethylene terephthalate (PTT) are preferable. ).

上述之PET、PBT、PTT之外亦可使用由如以下之芳香族二羧酸成分、二醇成分所得到之聚酯作為結晶性芳香族聚酯。又如此之結晶性芳香族聚酯亦可為與PET、PBT、PTT之任一者共聚合者。A polyester obtained from an aromatic dicarboxylic acid component or a diol component as described below may be used as the crystalline aromatic polyester in addition to the above-mentioned PET, PBT, and PTT. Further, such a crystalline aromatic polyester may be copolymerized with any of PET, PBT, and PTT.

芳香族二羧酸成分係可舉例如間苯二甲酸、苯二甲酸、萘-2,6-二羧酸、萘-2,7-二羧酸、二苯基-4,4’-二羧酸、二苯氧基乙烷二羧酸、5-磺間苯二甲酸、或此等之酯形成性衍生物。Examples of the aromatic dicarboxylic acid component include isophthalic acid, phthalic acid, naphthalene-2,6-dicarboxylic acid, naphthalene-2,7-dicarboxylic acid, and diphenyl-4,4'-dicarboxylate. An acid, a diphenoxyethane dicarboxylic acid, a 5-sulfoisophthalic acid, or an ester-forming derivative thereof.

二醇成分宜為分子量300以下之二醇。可舉例如乙二醇、丙二醇、戊二醇、己二醇、新戊二醇、癸二醇等脂肪族二醇;1,4-環己烷二甲醇、三環癸烷二羥甲基等脂環式二醇;二甲苯二醇、雙(對-羥基)二苯基、雙(對-羥基苯基)丙烷、2,2-雙[4-(2-羥基乙氧基)苯基]丙烷、雙[4-(2-羥基)苯基]碸、1,1-雙[4-(2-羥基乙氧基)苯基]環己烷、4,4’-二羥基-對聯三苯基、4,4’-二羥基-對聯四苯基等芳香族二醇等。此等之二羧酸成分及二醇成分亦可併用2種以上。The diol component is preferably a diol having a molecular weight of 300 or less. Examples thereof include aliphatic diols such as ethylene glycol, propylene glycol, pentanediol, hexanediol, neopentyl glycol, and decanediol; 1,4-cyclohexanedimethanol, tricyclodecane dimethylol, and the like. Alicyclic diol; xylene diol, bis(p-hydroxy)diphenyl, bis(p-hydroxyphenyl)propane, 2,2-bis[4-(2-hydroxyethoxy)phenyl] Propane, bis[4-(2-hydroxy)phenyl]anthracene, 1,1-bis[4-(2-hydroxyethoxy)phenyl]cyclohexane, 4,4'-dihydroxy-para-triphenyl An aromatic diol such as a 4,4'-dihydroxy-p-tetraphenyl group or the like. These dicarboxylic acid components and diol components may be used in combination of two or more kinds.

結晶性芳香族聚酯係可為使3官能以上之多官能羧酸成分、多官能羥基酸成分、多官能羥基成分等在5莫耳%以下之範圍共聚合者。The crystalline aromatic polyester may be a copolymer of a trifunctional or higher polyfunctional carboxylic acid component, a polyfunctional hydroxy acid component, a polyfunctional hydroxy component, or the like in a range of 5 mol% or less.

在聚酯系彈性體(A)中,構成低熔點節段之脂肪族聚醚可舉例如聚(環氧乙烷)二醇、聚(環氧丙烷)二醇、聚(環氧丁烷)二醇、聚(環氧己烷)二醇、環氧乙烷與環氧丙烷之共聚合物、聚(環氧丙烷)二醇之環氧乙烷加成聚合物、環氧乙烷與四氫呋喃之共聚合物等。構成低熔點節段之脂肪族聚酯可舉例如聚(ε-己內酯)、聚壬內酯、聚戊內酯、聚己二酸丁二酯、聚己二酸乙二酯等。此等脂肪族聚醚及/或脂肪族聚酯之中,從所得到之聚酯嵌段共聚物的彈性特性,宜為聚(環氧丁烷)二醇、聚(環氧丙烷)二醇之環氧乙烷加成物、聚(ε-己內酯)、聚己二酸丁二酯、聚己二酸乙二酯等,尤宜為聚(環氧丁烷)二醇。又,此等之低熔點節段的數目平均分子量在共聚合之狀態中宜為300至6000左右。In the polyester elastomer (A), the aliphatic polyether constituting the low melting point segment may, for example, be a poly(ethylene oxide) glycol, a poly(propylene oxide) glycol, or a poly(butylene oxide). Glycol, poly(ethylene oxide) diol, copolymer of ethylene oxide and propylene oxide, ethylene oxide addition polymer of poly(propylene oxide) diol, ethylene oxide and tetrahydrofuran Copolymers, etc. Examples of the aliphatic polyester constituting the low melting point segment include poly(ε-caprolactone), polydecalactone, polyvalerolactone, polybutylene adipate, and polyethylene adipate. Among these aliphatic polyethers and/or aliphatic polyesters, the elastic properties of the obtained polyester block copolymer are preferably poly(butylene oxide) glycol or poly(propylene oxide) glycol. The ethylene oxide adduct, poly(ε-caprolactone), polybutylene adipate, polyethylene adipate or the like is particularly preferably poly(butylene oxide) glycol. Further, the number average molecular weight of the low melting point segments is preferably from about 300 to about 6,000 in the state of copolymerization.

聚酯系彈性體(A)的玻璃轉移溫度係必須為0至20℃。若玻璃轉移溫度低於0℃,熱壓時之離型性與耐熱性差,進一步,製膜作業性亦降低。若超過20℃,埋入性差。聚酯系彈性體(A)的玻璃轉移溫度宜為0至15℃。The glass transition temperature of the polyester elastomer (A) must be 0 to 20 °C. When the glass transition temperature is lower than 0 ° C, the release property and the heat resistance at the time of hot pressing are inferior, and further, the film forming workability is also lowered. If it exceeds 20 ° C, the embedding property is poor. The glass transition temperature of the polyester elastomer (A) is preferably from 0 to 15 °C.

聚酯系彈性體(A)之熔點宜為200℃以上。若熔點低於200℃,有時熱壓時之耐熱性差。The melting point of the polyester elastomer (A) is preferably 200 ° C or higher. If the melting point is lower than 200 ° C, the heat resistance at the time of hot pressing may be poor.

聚酯系彈性體(A)於製膜時必須以澆鑄輥充分結晶化。因此,聚酯系彈性體(A)之結晶化速度指標必須為20至50℃。結晶化速度指標係表示聚酯系彈性體(A)的熔融後冷卻時的結晶化速度之指標。若結晶化速度指標超過50℃,亦即,若熔融後冷卻時的結晶化速度慢,形成層合膜時之耐熱性賦予很難,以輥直接加熱層合膜而實施結晶化處理時產生自輥之剝離不良。若結晶化速度指標為上述範圍內,可使樹脂於熔融押出後以冷卻輥結晶化,而且,可以澆鑄輥之溫度或速度調控薄片的結晶狀態。結晶化速度指標宜為25至50℃。The polyester elastomer (A) must be sufficiently crystallized by a casting roll at the time of film formation. Therefore, the crystallization rate index of the polyester elastomer (A) must be 20 to 50 °C. The crystallization rate index is an index indicating the crystallization rate at the time of cooling of the polyester elastomer (A) after melting. When the crystallization rate index exceeds 50 ° C, that is, the crystallization rate at the time of cooling after melting is slow, the heat resistance at the time of forming a laminated film is difficult, and the crystallization process is directly performed by heating the laminated film by a roll. Poor peeling of the roll. When the crystallization rate index is within the above range, the resin can be crystallized by a cooling roll after being melted, and the crystal state of the sheet can be controlled by the temperature or speed of the casting roll. The crystallization rate index is preferably from 25 to 50 °C.

聚酯系彈性體(A)宜為結晶熔解熱量為25至45 J/g。不足25 J/g時耐熱性或離型性易不充分,另外,若超過45 J/g,埋入性易降低。The polyester elastomer (A) preferably has a heat of crystal fusion of 25 to 45 J/g. When the thickness is less than 25 J/g, the heat resistance and the release property are insufficient, and if it exceeds 45 J/g, the embedding property is liable to lower.

具有上述結晶化特性之聚酯系彈性體(A)較佳的構成,係可舉例如聚對苯二甲酸丁二酯與聚醚之嵌段共聚物。聚醚之共聚合量宜為10至40質量%,更宜為15至30質量%。若聚醚之共聚合量少,柔軟化效果小,另外,若太多,耐熱性或結晶性過於降低。若為如此之範圍,易調整聚酯系彈性體(A)之熔點、玻璃轉移溫度、結晶化速度指標、結晶熔解熱量等。A preferred configuration of the polyester-based elastomer (A) having the above crystallization characteristics is, for example, a block copolymer of polybutylene terephthalate and a polyether. The copolymerization amount of the polyether is preferably from 10 to 40% by mass, more preferably from 15 to 30% by mass. When the amount of copolymerization of the polyether is small, the softening effect is small, and if too much, the heat resistance or crystallinity is excessively lowered. In such a range, the melting point of the polyester elastomer (A), the glass transition temperature, the crystallization rate index, the heat of crystal melting, and the like can be easily adjusted.

聚酯系彈性體(A)可以公知之方法製造。例如,使二羧酸之低級醇二酯、過剩量的低分子量二醇、及低熔點節段成分在觸媒的存在下進行酯交換反應,使所得到之反應生成物聚縮合之方法。或者,使二羧酸與過剩量的二醇及低熔點節段成分在觸媒的存在下進行酯化反應,使所得到之反應生成物聚縮合之方法。又,可舉例如預先製作高熔點結晶性節段,再添加低熔點節段成分而藉酯交換反應使之無規化的方法。可列舉使高熔點結晶性節段與低熔點節段以鏈連結劑連結之方法。進一步,於低熔點節段使用聚(ε-己內酯)時,可列舉於高熔點結晶性節段使ε-己內酯單體加成反應的方法等。亦可為任一者之方法。The polyester elastomer (A) can be produced by a known method. For example, a method in which a lower alcohol diester of a dicarboxylic acid, an excessive amount of a low molecular weight diol, and a low melting point component are subjected to a transesterification reaction in the presence of a catalyst to obtain a condensation reaction of the obtained reaction product. Alternatively, a method in which a dicarboxylic acid, an excess amount of a diol, and a low-melting-point segment component are subjected to an esterification reaction in the presence of a catalyst to obtain a condensation reaction of the obtained reaction product. Further, for example, a method of preparing a high-melting-point crystalline segment in advance, adding a low-melting-point segment component, and randomizing it by a transesterification reaction may be mentioned. A method of connecting a high-melting-point crystalline segment and a low-melting-point segment to a chain linking agent is exemplified. Further, when poly(ε-caprolactone) is used in the low-melting-point segment, a method of adding an ε-caprolactone monomer to a high-melting-point crystalline segment may be mentioned. It can also be a method of either.

〈聚酯(B)〉<Polyester (B)>

在本發明之離型膜中必須為層合發揮離型層功能之前述聚酯系彈性體(A)層的支撐層、及作為在高溫之熱壓的埋入層之聚酯(B)層。若非(B)層,膜製造時輥捲取此膜時,由於膜之本體脆弱,故產生皺折,製膜作業性明顯降低,工業上很難生產。又,在高溫之熱壓時的埋入性不充分。In the release film of the present invention, it is necessary to laminate a support layer of the polyester elastomer (A) layer which functions as a release layer, and a polyester (B) layer which is a buried layer which is hot pressed at a high temperature. . In the case of the non-layer (B), when the film is taken up by the roll during the production of the film, wrinkles are generated due to the fragile body of the film, and the film forming workability is remarkably lowered, which is industrially difficult to produce. Moreover, the embedding property at the time of hot pressing of high temperature is inadequate.

構成聚酯(B)層的成分,必須為結晶性芳香族聚酯(B1)、與1,4-環己烷二甲醇共聚合聚對苯二甲酸乙二酯(B2)。The component constituting the polyester (B) layer must be a crystalline aromatic polyester (B1) and a polyethylene terephthalate (B2) copolymerized with 1,4-cyclohexanedimethanol.

構成聚酯(B)層之結晶性芳香族聚酯(B1)與1,4-環己烷二甲醇共聚合聚對苯二甲酸乙二酯(B2)的質量比(B1)/(B2)必須為5/95至50/50的範圍,宜為30/70至50/50之範圍。若結晶性芳香族聚酯(B1)未達5質量%,(B)層的結晶性太低,高溫熱壓時之耐熱性有降低的傾向,因(B)層之滲出而有時污染各部分。若(B1)超過50質量%,(B)層之結晶性太高,有高溫熱沖壓時的埋入性差的傾向。Mass ratio (B1)/(B2) of the crystalline aromatic polyester (B1) constituting the polyester (B) layer and 1,4-cyclohexanedimethanol copolymerized polyethylene terephthalate (B2) Must be in the range of 5/95 to 50/50, preferably in the range of 30/70 to 50/50. When the crystalline aromatic polyester (B1) is less than 5% by mass, the crystallinity of the layer (B) is too low, and the heat resistance at the time of high-temperature hot pressing tends to be lowered, and the (B) layer may be contaminated by oozing. section. When (B1) exceeds 50% by mass, the crystallinity of the layer (B) is too high, and the embedding property at the time of high-temperature hot stamping tends to be inferior.

聚酯(B)之玻璃轉移溫度必須為40至80℃。若玻璃轉移溫度低於25℃,由於膜在常溫軟化,故薄片捲取時有皺折,裁切時之切割性等的處理作業性變成不充分。另外,若玻璃轉移溫度超過80℃,在熱壓時膜之軟化變成不充分,故埋入性差。聚酯(B)之玻璃轉移溫度宜為45至75℃,尤宜為50至70℃The glass transition temperature of the polyester (B) must be 40 to 80 °C. When the glass transition temperature is lower than 25 ° C, the film is softened at room temperature, so that the sheet wrinkles during winding, and the handling property such as cutting property at the time of cutting becomes insufficient. Further, when the glass transition temperature exceeds 80 ° C, the softening of the film at the time of hot pressing becomes insufficient, so that the embedding property is poor. The glass (M) has a glass transition temperature of preferably 45 to 75 ° C, particularly preferably 50 to 70 ° C.

聚酯(B)之結晶熔解熱量必須為5至40 J/g。若為如此之範圍內,(B)層可充分發揮(A)層之支撐層的功能,且可兼具高溫熱壓時之耐熱性、埋入性等。若結晶熔解熱量低於5 J/g,由於結晶性太低,故高溫熱壓時的耐熱性差,有時從膜端部發生(B)層的滲出。另外,若結晶熔解熱量超過40 J/g時,高溫熱壓時的膜之軟化變成不充分,故埋入性差。聚酯(B)之結晶熔解熱量係宜為10至35 J/g,尤宜為15至30 J/g。The heat of crystal melting of the polyester (B) must be 5 to 40 J/g. In such a range, the layer (B) can sufficiently exhibit the function of the support layer of the layer (A), and can have heat resistance and embedding property at the time of high-temperature hot pressing. When the heat of crystal melting is less than 5 J/g, since the crystallinity is too low, the heat resistance at the time of high-temperature hot pressing is poor, and the bleeding of the layer (B) may occur from the end portion of the film. Further, when the heat of crystal melting exceeds 40 J/g, the softening of the film at the time of high-temperature hot pressing becomes insufficient, so that the embedding property is poor. The heat of crystal melting of the polyester (B) is preferably from 10 to 35 J/g, particularly preferably from 15 to 30 J/g.

〈結晶性芳香族聚酯(B1)〉<Crystalline aromatic polyester (B1)>

結晶性芳香族聚酯(B1)從耐熱性或高結晶性之觀點,可舉例如PET、PBT、PTT、及此等與間苯二甲酸等之共聚物、或此等之2種以上的混合物。The crystalline aromatic polyester (B1) may, for example, be PET, PBT, PTT, or a copolymer thereof with isophthalic acid or the like, or a mixture of two or more thereof, from the viewpoint of heat resistance or high crystallinity. .

結晶性芳香族聚酯(B1)之熔點宜為200℃以上。若熔點低於200℃,有時熱壓時之耐熱性差。The melting point of the crystalline aromatic polyester (B1) is preferably 200 ° C or higher. If the melting point is lower than 200 ° C, the heat resistance at the time of hot pressing may be poor.

使用間苯二甲酸共聚合聚對苯二甲酸乙二酯作為結晶性芳香族聚酯(B1)時,例如只要選擇熔點成為上述範圍內之共聚合的比率即可。詳細而言,相對於全二羧酸成分,間苯二甲酸之比率宜為20莫耳%以下,尤宜為10莫耳%以下。若超過20莫耳%,由於(B)層之熔點及結晶性降低,故高溫熱壓時之耐熱性有差的傾向。When the isophthalic acid copolymerized polyethylene terephthalate is used as the crystalline aromatic polyester (B1), for example, the ratio of the melting point to the copolymerization within the above range may be selected. Specifically, the ratio of isophthalic acid is preferably 20 mol% or less, and particularly preferably 10 mol% or less, based on the total dicarboxylic acid component. When it exceeds 20 mol%, since the melting point and crystallinity of the (B) layer are lowered, the heat resistance at the time of high-temperature hot pressing tends to be inferior.

結晶性芳香族聚酯(B1)係可為在無損及(B)層的熔點及結晶性之範圍共聚合者。The crystalline aromatic polyester (B1) may be copolymerized in a range which does not impair the melting point and crystallinity of the layer (B).

共聚合成分係無特別限定,但酸成分可舉例如間苯二甲酸、苯二甲酸、2,6-萘二羧酸、5-鈉磺間苯二甲酸、草酸、琥珀酸、己二酸、癸二酸、壬二酸、十二碳二酸、二聚酸、馬來酸酐、馬來酸、富馬酸、衣康酸、檸康酸、中康酸、環己烷二羧酸等二羧酸、4-羥基安息香酸、ε-己內酯或乳酸等。The copolymerization component is not particularly limited, and examples of the acid component include isophthalic acid, phthalic acid, 2,6-naphthalenedicarboxylic acid, 5-sodium sulfisophthalic acid, oxalic acid, succinic acid, and adipic acid. Azelaic acid, azelaic acid, dodecanedioic acid, dimer acid, maleic anhydride, maleic acid, fumaric acid, itaconic acid, citraconic acid, mesaconic acid, cyclohexanedicarboxylic acid, etc. Carboxylic acid, 4-hydroxybenzoic acid, ε-caprolactone or lactic acid.

又,醇成分可舉例如乙二醇、二乙二醇、1,3-丙二醇、新戊二醇、1,6-己二醇、環己烷二甲醇、三乙二醇、聚乙二醇、聚丙二醇、聚丁二醇、雙酚A或雙酚S之環氧乙烷加成物等。Further, examples of the alcohol component include ethylene glycol, diethylene glycol, 1,3-propanediol, neopentyl glycol, 1,6-hexanediol, cyclohexanedimethanol, triethylene glycol, and polyethylene glycol. , an ethylene oxide adduct of polypropylene glycol, polytetramethylene glycol, bisphenol A or bisphenol S, and the like.

進一步,可少量使用偏苯三甲酸、均苯三甲酸、均苯四甲酸、三羥甲基丙烷、甘油、季戊四醇等3官能化合物等。此等之共聚合成分可併用2種以上。Further, a trifunctional compound such as trimellitic acid, trimesic acid, pyromellitic acid, trimethylolpropane, glycerin or pentaerythritol can be used in a small amount. These copolymerizable components may be used in combination of two or more kinds.

又,使此等結晶性芳香族聚酯混合2種以上而使用時,其混合比係考量(B1)樹脂的結晶性,只要適當選擇即可。When two or more kinds of these crystalline aromatic polyesters are used in combination, the mixing ratio is considered to be the crystallinity of the (B1) resin, and may be appropriately selected.

結晶性芳香族聚酯(B1)係可以公知之方法製造。可舉例如使二羧酸之低級醇二酯、過剩量之低分子量二醇在觸媒的存在下進行酯交換反應,使所得到之反應生成物聚縮合之方法。或可舉例如使二羧酸與過剩量之二醇在觸媒的存在下進行酯交換反應,使所得到之反應生成物聚縮合之方法。The crystalline aromatic polyester (B1) can be produced by a known method. For example, a method in which a lower alcohol diester of a dicarboxylic acid and an excessive amount of a low molecular weight diol are subjected to a transesterification reaction in the presence of a catalyst to obtain a condensation reaction of the obtained reaction product. Alternatively, for example, a method in which a dicarboxylic acid and an excess amount of a diol are subjected to a transesterification reaction in the presence of a catalyst to obtain a condensation reaction of the obtained reaction product.

聚合後之聚酯由於含有單體或寡聚物、副生成物之乙醛或四氫呋喃等,故若直接使用於熱壓時,產生此等之低分子量物移動至基板之問題。因此,宜使用在減壓或惰性氣體流通下、200℃以上之溫度固相聚合的原料。Since the polyester after polymerization contains a monomer, an oligomer, or a by-product of acetaldehyde or tetrahydrofuran, when it is used directly for hot pressing, there arises a problem that such a low molecular weight substance moves to a substrate. Therefore, it is preferred to use a raw material which is solid-phase polymerized at a temperature of 200 ° C or higher under a reduced pressure or an inert gas flow.

〈1,4-環己烷二甲醇共聚合聚對苯二甲酸乙二酯(B2)〉<1,4-cyclohexanedimethanol copolymerized polyethylene terephthalate (B2)>

1,4-環己烷二甲醇共聚合聚對苯二甲酸乙二酯(以下,簡稱為「CHDM-PET」)係使乙二醇之一部分以1,4-環己烷二甲醇取代之PET共聚物。為提高聚酯(B)層之非晶化度,滿足熱壓時之埋入性,相對於全二醇成分含有1,4-環己烷二甲醇成分10莫耳%以上、宜為12莫耳%以上、更宜為15莫耳%以上。另外,若1,4-環己烷二甲醇成分太多,有薄膜缺乏耐熱性之傾向,上限宜為50莫耳%,更宜為45莫耳%以下,最宜為40莫耳%以下。1,4-cyclohexanedimethanol copolymerized polyethylene terephthalate (hereinafter, abbreviated as "CHDM-PET") is a PET in which one part of ethylene glycol is substituted with 1,4-cyclohexanedimethanol. Copolymer. In order to increase the degree of amorphization of the polyester (B) layer and to satisfy the embedding property at the time of hot pressing, the 1,4-cyclohexane dimethanol component is contained in an amount of 10 mol% or more, preferably 12 mol, based on the total diol component. More than or equal to the ear, more preferably 15% by mole or more. Further, when the 1,4-cyclohexanedimethanol component is too much, the film tends to have no heat resistance, and the upper limit is preferably 50 mol%, more preferably 45 mol% or less, and most preferably 40 mol% or less.

如此之CHDM-PET的具體例可舉例如Eastman Chemical公司製「PETG 6763」等。Specific examples of such CHDM-PET include, for example, "PETG 6763" manufactured by Eastman Chemical Co., Ltd., and the like.

聚酯系彈性體(A)、結晶性芳香族聚酯(B1)及CHDM-PET(B2)係可在無損及實用性的範圍,添加熱安定劑、抗靜電劑、結晶造核劑等。其中,宜含有熱安定劑。熱安定劑宜為5價或/及3價的磷化合物、或阻酚系化合物等。The polyester elastomer (A), the crystalline aromatic polyester (B1), and the CHDM-PET (B2) may be added with a heat stabilizer, an antistatic agent, a crystal nucleating agent, or the like in a non-destructive and practical range. Among them, it is preferred to contain a heat stabilizer. The heat stabilizer is preferably a pentavalent or/and trivalent phosphorus compound or a hindered phenol compound.

本發明之離型膜係宜聚酯系彈性體(A)層的厚度為5至50μm。聚酯系彈性體(A)層之厚度未達5μm,膜製造時的樹脂押出時,(A)層與(B)層之間的流動均衡惡化,易產生流痕,易成為製膜困難。若超過50μm,埋入性易不足。The release film of the present invention is preferably a polyester elastomer (A) layer having a thickness of 5 to 50 μm. When the thickness of the polyester elastomer (A) layer is less than 5 μm, the flow balance between the (A) layer and the (B) layer is deteriorated when the resin is extruded during the film production, and flow marks are likely to occur, which is likely to be difficult to form a film. If it exceeds 50 μm, the embedding property is liable to be insufficient.

聚酯系彈性體(A)層的厚度更宜為10至30μm。此處所謂之(A)層的厚度如2種3層構成時,含有(A)層2層以上時為其1層分的厚度。The thickness of the polyester-based elastomer (A) layer is more preferably from 10 to 30 μm. Here, when the thickness of the layer (A) is two or three layers, the thickness of the layer (A) is two layers or more.

本發明之離型膜係宜聚酯(B)層的厚度為15至160μm。若聚酯(B)層之厚度未達15μm,在常溫之軟質的(A)層相對地變厚,由於膜之本體變弱,捲取膜時易有皺折,或熱壓時之柔軟性不充分,故招致埋入性的降低。若超過160μm,膜製造時的樹脂押出時,(A)層與(B)層之間的流動均衡惡化,易產生流痕,有製膜困難之傾向。聚酯(B)層之厚度更宜為20至100μm。The release film of the present invention is preferably a polyester (B) layer having a thickness of 15 to 160 μm. If the thickness of the polyester (B) layer is less than 15 μm, the soft (A) layer at room temperature is relatively thick, and since the body of the film is weak, wrinkles are easily obtained when the film is taken up, or softness at the time of hot pressing. Insufficient, resulting in a decrease in embedding. When the resin is extruded at a temperature of more than 160 μm, the flow balance between the (A) layer and the (B) layer is deteriorated, flow marks are likely to occur, and film formation tends to be difficult. The thickness of the polyester (B) layer is more preferably from 20 to 100 μm.

本發明之離型膜宜全體之厚度為30μm至200μm。全體之厚度低於30μm,薄片之強度、剛性易降低,處理易變困難。另外,若超過200μm,於熱壓時之印刷基板的表面圖型之追蹤性易降低,有時不適於具有微細的圖型之印刷基板製造。全體之厚度更宜為30μm至150μm,最宜為40μm至100μm。The release film of the present invention preferably has a thickness of from 30 μm to 200 μm. When the thickness of the whole is less than 30 μm, the strength and rigidity of the sheet are liable to be lowered, and the handling is difficult to change. In addition, when it exceeds 200 μm, the traceability of the surface pattern of the printed substrate during hot pressing is liable to be lowered, and it may not be suitable for the production of a printed substrate having a fine pattern. The thickness of the whole is more preferably from 30 μm to 150 μm, most preferably from 40 μm to 100 μm.

本發明之離型膜較佳的構成,可舉例如使用聚酯系彈性體(A)與聚酯(B)之(A)/(B)/(A)的2種3層構成,或(A)/(B)的2種2層構成。但,不限定於此,而(A)層若配置於表層,進一步亦可具有其他之層。The preferred structure of the release film of the present invention may be, for example, two or three layers of (A)/(B)/(A) of the polyester elastomer (A) and the polyester (B), or Two types of two layers of A)/(B). However, the layer (A) is not limited to this, and the layer (A) may have other layers if it is disposed on the surface layer.

(A)/(B)/(A)之2種3層構成的較佳厚度構成比率為1/2/1至1/5/1。若為此範圍,(B)層可充分發揮作為(A)層之支撐層的功能,且可兼具在高溫之熱壓時的耐熱性與埋入性等。The preferred thickness composition ratio of the two 3-layer structures of (A)/(B)/(A) is 1/2/1 to 1/5/1. In this range, the (B) layer can sufficiently exhibit the function as the support layer of the (A) layer, and can have both heat resistance and embedding property at the time of hot pressing at a high temperature.

其次,說明有關本發明之離型膜的製造方法。Next, a method of producing the release film of the present invention will be described.

有關本發明之離型膜的製造中係宜採取以共押出T模頭法製膜之方法。若依此方法,易調控各層之厚度、或使(A)層為所希望的結晶化狀態。In the production of the release film of the present invention, a method of forming a film by a co-extrusion T-die method is preferred. According to this method, it is easy to adjust the thickness of each layer or to make the layer (A) a desired crystallization state.

在本發明之離型膜的製造中,就賦予膜特定的熱特性,提昇耐熱性、離型性、尺寸安定性之目的,必須設有結晶化步驟。結晶化方法可舉例如加熱結晶化、配向結晶化。但,由於在熱壓之用途中在高溫的尺寸安定性為必要的,故無實質上配向,宜藉加熱結晶化。加熱結晶化之方法係從T模頭押出後與冷卻同時地結晶化之方法,在調控步驟之簡便性或膜品質之點為佳。與冷卻同時地結晶化時,考量結晶化速度而必須適切設定澆鑄輥之溫度。其溫度若為本發明之樹脂構成,宜為50至100℃,更宜為50至80℃。又,為了調控離型性與埋入性,必須使成為離型層之聚酯系彈性體(A)配置於澆鑄輥側。In the production of the release film of the present invention, it is necessary to provide a crystallization step for the purpose of imparting specific thermal characteristics to the film and improving heat resistance, release property, and dimensional stability. The crystallization method may, for example, be heat crystallization or alignment crystallization. However, since dimensional stability at a high temperature is necessary for use in hot pressing, there is no substantial alignment, and it is preferable to heat crystallization. The method of heating and crystallization is a method of crystallization from the T die and simultaneously cooling with cooling, and is preferable in terms of the simplicity of the conditioning step or the film quality. When crystallizing at the same time as cooling, the crystallization rate is considered and the temperature of the casting rolls must be appropriately set. The temperature is preferably from 50 to 100 ° C, more preferably from 50 to 80 ° C, if it is a resin of the present invention. Further, in order to adjust the release property and the embedding property, it is necessary to arrange the polyester elastomer (A) which is a release layer on the casting roll side.

本發明之離型膜係180℃之熱收縮率在MD方向中宜為2%以下,更宜為1.5%以下。在TD方向中宜為1%以下,更宜為0.5%以下。若為如此之熱收縮率,即使熱壓時與熱板接觸,易很難變成皺折,製造印刷基板時之耐熱性與尺寸安定性良好。The heat shrinkage rate of the release film of the present invention at 180 ° C is preferably 2% or less in the MD direction, more preferably 1.5% or less. In the TD direction, it is preferably 1% or less, more preferably 0.5% or less. If the heat shrinkage rate is such that it is in contact with the hot plate during hot pressing, it is difficult to become wrinkles, and the heat resistance and dimensional stability when producing a printed board are good.

在本發明的離型膜中,配置於表層之聚酯系彈性體(A)層的表面狀態係依用途,可為平滑,為了作業性,亦可賦予滑性、抗壓黏性。又,以熱壓成形時之去空氣作為目的,可於膜之至少單面設有適度的壓花花紋。為此之壓花加工係可使用被表面加工之澆鑄輥。In the release film of the present invention, the surface state of the polyester-based elastomer (A) layer disposed on the surface layer can be smooth depending on the application, and the slip property and the pressure-resistant property can be imparted for workability. Further, for the purpose of removing air during hot press forming, a moderate embossing pattern may be provided on at least one side of the film. For this embossing process, a surface-casting casting roll can be used.

本發明之離型膜係高溫熱壓時之埋入性、耐熱性、離型性、非污染性優異,又,可安全且容易地廢棄處理。因此,本發明之離型膜係在印刷電路基板、可撓性印刷電路基板、或多層印刷電路板等之製造步驟中,經由預浸體或耐熱膜而熱壓銅箔層合板或銅箔時,可適宜使用來作為防止與壓熱板、印刷電路基板、可撓性印刷電路基板、多層印刷電路板等之黏著的離型膜。又,在可撓性印刷電路基板之製造步驟中,藉熱壓成形使覆蓋膜以熱硬化性黏著劑黏著時,亦可適宜使用來作為防止覆蓋膜與熱壓板之黏著、或覆蓋膜間之黏著的離型膜。The release film of the present invention is excellent in embedding property, heat resistance, release property, and non-contamination property at the time of high-temperature hot pressing, and can be disposed of safely and easily. Therefore, in the production process of a printed circuit board, a flexible printed circuit board, or a multilayer printed wiring board, the release film of the present invention is obtained by hot-pressing a copper foil laminate or a copper foil via a prepreg or a heat resistant film. It can be suitably used as a release film which is adhered to a hot plate, a printed circuit board, a flexible printed circuit board, a multilayer printed wiring board, or the like. Further, in the manufacturing step of the flexible printed circuit board, when the cover film is adhered by a thermosetting adhesive by hot press forming, it can be suitably used as a film to prevent adhesion between the cover film and the heat press plate, or between the cover films. Adhesive release film.

[實施例][Examples]

以下,依據實施例而說明本發明。但,本發明係不限定於以下之實施例。Hereinafter, the present invention will be described based on examples. However, the present invention is not limited to the following examples.

(A)聚酯系彈性體(A) Polyester elastomer

(A-1) HYTREL 5557:Toray Dupont公司製、Tm 208℃、Tg-20℃(A-1) HYTREL 5557: manufactured by Toray Dupont, Tm 208 ° C, Tg -20 ° C

(A-2) HYTREL 6347:Toray Dupont公司製、Tm 221℃、Tg 3℃(A-2) HYTREL 6347: manufactured by Toray Dupont, Tm 221 ° C, Tg 3 ° C

(A-3) HYTREL 7247:Toray Dupont公司製、Tm 221℃、Tg 12℃(A-3) HYTREL 7247: manufactured by Toray Dupont, Tm 221 ° C, Tg 12 ° C

(A-4) HYTREL 6347M:Toray Dupont公司製、Tm 215℃、Tg 3℃(A-4) HYTREL 6347M: manufactured by Toray Dupont, Tm 215 ° C, Tg 3 ° C

Tm意指熔點,Tg意指玻璃轉移溫度。以下,相同。Tm means melting point and Tg means glass transition temperature. The following is the same.

上述4種之聚酯系彈性體係任一者均為聚對苯二甲酸丁二酯與聚醚之嵌段共聚物。Any of the above four polyester-based elastic systems is a block copolymer of polybutylene terephthalate and a polyether.

(B1)結晶性芳香族聚酯(B1) crystalline aromatic polyester

(B1-1)聚對苯二甲酸丁二酯:三菱Engineering Plastic公司製「Novaduran 5010CS」、Tm 223℃、Tg 34℃(B1-1) Polybutylene terephthalate: "Novaduran 5010CS" manufactured by Mitsubishi Engineering Plastic Co., Ltd., Tm 223 ° C, Tg 34 ° C

(B1-2)聚對苯二甲酸丙二酯;Shell Chemical Japan公司製「Corterra 9200」、Tm 223℃、Tg 52℃(B1-2) Polytrimethylene terephthalate; "Corterra 9200" manufactured by Shell Chemical Japan Co., Ltd., Tm 223 ° C, Tg 52 ° C

(B1-3)聚對苯二甲酸乙二酯;日本Ester公司製「NEH-2050」、Tm 255℃、Tg:80℃(B1-3) Polyethylene terephthalate; "NEH-2050" manufactured by Ester Co., Ltd., Tm 255 ° C, Tg: 80 ° C

(B1-4)間苯二甲酸4 mol%共聚合聚對苯二甲酸乙二酯、Tm 246℃、Tg:75℃(B1-4) 4 mol% isophthalic acid copolymerized polyethylene terephthalate, Tm 246 ° C, Tg: 75 ° C

(B2)CHDM-PET(B2) CHDM-PET

‧Eastman Chemical公司製「PETG 6763」、Tg 80℃‧Eastman Chemical Company "PETG 6763", Tg 80 ° C

(C)其他(C) Other

‧聚甲基戊烯:三井化學公司製「DX 845」、Tm 233℃、Tg 20℃‧ Polymethylpentene: "DX 845" manufactured by Mitsui Chemicals Co., Ltd., Tm 233 ° C, Tg 20 ° C

將各種測定法及評估表示於以下。Various assays and evaluations are shown below.

使用微分掃描型熱量計(Perkin Elmer公司製「Pyrisl DSC」),使試樣10mg以速度20℃/分昇溫至260℃,測定玻璃轉移溫度(Tg)、熔點(Tm)、結晶熔解熱量(△Hm)。進一步,以260℃維持3分鐘後,以速度20℃/分冷卻,測定結晶化譜峰溫度(Tc)。以熔點與降溫時結晶化譜峰溫度之差為結晶化速度指標。Using a differential scanning calorimeter ("Pyrisl DSC" manufactured by Perkin Elmer Co., Ltd.), 10 mg of the sample was heated to 260 ° C at a rate of 20 ° C / min, and the glass transition temperature (Tg), melting point (Tm), and crystal melting heat (Δ) were measured. Hm). Further, after maintaining at 260 ° C for 3 minutes, the film was cooled at a rate of 20 ° C / minute, and the crystallization peak temperature (Tc) was measured. The difference between the melting point and the temperature at which the crystallization peak is lowered is the index of crystallization rate.

熔點(Tm)、玻璃轉移溫度(Tg)、結晶化速度指標之測定中的試樣係使原料樹脂一次熔融後,急冷而得到之非晶化的試樣。(A)層之結晶熔解熱量係使用聚酯系彈性體(A)單獨樹脂,使厚度、押出速度、澆鑄輥溫度與層合膜同條件之做法而製作單層膜試樣,使用此而測定。即使在(B)層之結晶熔解熱量中,同樣地,使結晶性芳香族聚酯(B1)與CHDM-PET(B2)摻混之樹脂以與層合膜相同之製造條件製作單層膜試樣,使用此而測定。The sample in the measurement of the melting point (Tm), the glass transition temperature (Tg), and the crystallization rate index is a sample obtained by rapidly melting the raw material resin and then quenching it. The heat of crystal melting of the layer (A) is determined by using a polyester-based elastomer (A) alone resin, and the thickness, the extrusion speed, the temperature of the casting roll, and the temperature of the laminated film are the same, and a single-layer film sample is produced. . Even in the heat of crystal melting of the layer (B), the resin in which the crystalline aromatic polyester (B1) and the CHDM-PET (B2) are blended is similarly produced under the same manufacturing conditions as the laminated film. As such, it is measured using this.

<製膜作業性><film forming workability>

依據以下之基準而評估切割所得到之膜端部後之輥捲取性、○為合格(良好)。The roll take-up property after the end of the film obtained by the cutting was evaluated based on the following criteria, and ○ was acceptable (good).

○:於輥捲取性無問題。○: There is no problem in the rollability of the roll.

△:輥捲取時少許皺折△: a little wrinkle when the roll is taken up

×:輥捲取時無皺折,很難捲取×: There is no wrinkle when the roll is taken, it is difficult to take up

<耐熱性、中間層非滲出性、埋入性、離型性><heat resistance, interlayer non-bleeding property, embedding property, release property>

於雙面塗佈有20μm之環氧系黏著劑(東亞合成公司製「AS-60」)之厚25μm聚醯亞胺膜(Dupont公司製「Kapton 100V」)的兩側,層合厚35μm的銅箔,製作3層型式的銅箔層合板。於其單面搭載以塗布有20μm環氧系黏著劑(東亞合成公司製「AS-60」)之厚25μm聚醯亞胺薄膜(Dupont公司製「Kapton 100V」)作為覆蓋膜,進一步,以供測試用之離型膜挾住其兩側。此時,以離型膜之聚酯系彈性體(A)面成為內側之方式配置。其後,以溫度180℃、壓力3MPa熱壓5分鐘。熱壓後,從熱壓裝置迅速地取出而放冷後,剝離離型膜。有關其時之狀況,依據以下之基準,進行耐熱性、中間層非滲出性、埋入性、離型性之評估。○以上判定為合格(良好)。此時,覆蓋膜係開啟直徑5mm之真圓狀的孔,使用於黏著劑之滲出的評估。Both sides of the 25 μm thick polyimide film ("Kapton 100V" manufactured by Dupont Co., Ltd.) having a 20 μm epoxy adhesive ("AS-60" manufactured by Toagosei Co., Ltd.) were coated on both sides, and laminated to a thickness of 35 μm. Copper foil, a three-layer copper foil laminate was produced. A 25 μm thick polyimide film ("Kapton 100V" manufactured by Dupont Co., Ltd.) coated with a 20 μm epoxy-based adhesive ("AS-60" manufactured by Toagosei Co., Ltd.) was used as a cover film on one surface thereof, and further provided for use. The release film used for the test was placed on both sides. At this time, the surface of the polyester elastomer (A) of the release film is disposed inside. Thereafter, the pressure was hot pressed at a temperature of 180 ° C and a pressure of 3 MPa for 5 minutes. After the hot pressing, the film was quickly taken out from the hot press device and allowed to cool, and then the release film was peeled off. Regarding the current situation, evaluation of heat resistance, interlayer non-bleeding property, embedding property, and release property was performed based on the following criteria. ○ The above is judged to be acceptable (good). At this time, the cover film was opened with a true round hole having a diameter of 5 mm, and was used for evaluation of the bleeding of the adhesive.

(耐熱性)(heat resistance)

○:於熱壓後之膜看不出皺折。○: No wrinkles were observed in the film after hot pressing.

△:於熱壓後之膜可看出稍微皺折。△: The film after hot pressing showed a slight wrinkle.

×:於熱壓後之膜可看出顯著皺折。×: Significant wrinkles were observed in the film after hot pressing.

(中間層非滲出性)(intermediate layer non-exudative)

○:從熱壓後之膜端部看不出中間層聚合物之滲出○: no seepage of the intermediate layer polymer was observed from the end of the film after hot pressing

△:從熱壓後之膜端部可看出中間層聚合物之滲出△: Exudation of the intermediate layer polymer can be seen from the end of the film after hot pressing

×:從熱壓後之膜端部可明顯看出中間層聚合物之滲出,可看到於層合板或壓熱板的聚合物附著。X: The exudation of the intermediate layer polymer was apparent from the end of the film after hot pressing, and the polymer adhesion to the laminate or the hot plate was observed.

(埋入性)(buried)

以顯微鏡觀察覆蓋膜孔部之黏著劑的滲出長度,依據以下之基準而評估。The exudation length of the adhesive covering the pores of the film was observed under a microscope, and evaluated based on the following criteria.

◎:黏著劑之滲出長度為50μm以下◎: The exudation length of the adhesive is 50 μm or less

○:黏著劑之滲出長度為超過50μm、70μm以下○: The exudation length of the adhesive is more than 50 μm and 70 μm or less.

△:黏著劑之滲出長度為超過70μm、100μm以下△: The bleed length of the adhesive is more than 70 μm and 100 μm or less.

╳:黏著劑之滲出長度為超過100μm╳: The exudation length of the adhesive is more than 100μm

(離型性)(release)

◎:無阻抗地剝離◎: peeling without impedance

○:略有阻抗,但於層合板無影響地剝離○: Slightly resistive, but peeled off without affecting the laminate

△:有阻抗,但層合板無變形地剝離△: There is impedance, but the laminate is peeled off without deformation.

╳:阻抗強,剝離時伴隨層合板之變形╳: Strong impedance, accompanied by deformation of the laminate

<耐污染性><Weather resistance>

使用熱脫黏GC-MS,以180℃、10分鐘之加熱從膜產生的氣體使用無極性毛細管而分離,使所檢測出之譜峰總面積的己烷換算量以膜重量規格化,以此作為釋氣產生量。釋氣產生量宜為很少的程度,400ppm以下判斷為合格(良好)。Using a thermal debonding GC-MS, the gas generated from the film by heating at 180 ° C for 10 minutes was separated using a non-polar capillary, and the amount of hexane in terms of the total area of the detected peak was normalized by the film weight. As the amount of outgassing. The amount of outgassing is preferably small, and 400 ppm or less is judged to be acceptable (good).

<熱收縮率><heat shrinkage rate>

依如下之順序測定膜MD方向及TD方向的熱收縮率。The heat shrinkage ratio in the MD direction and the TD direction of the film was measured in the following order.

將試樣膜切割成10mm×150mm,再以成為間隔100mm之方式製作已置入2條標線的試驗片5個。The sample film was cut into 10 mm × 150 mm, and five test pieces on which two lines were placed were prepared at intervals of 100 mm.

所得到之試驗片在無荷重下於170℃的烘箱中熱處理30分鐘後,取出試驗片而返回室溫而測定標線間距離。依下式求出熱收縮率,以5條平均值作為各試樣膜的熱收縮率。The obtained test piece was heat-treated in an oven at 170 ° C for 30 minutes under no load, and the test piece was taken out and returned to room temperature to measure the distance between the lines. The heat shrinkage ratio was determined according to the following formula, and the five average values were used as the heat shrinkage ratio of each sample film.

熱收縮率(%)=(L-L’)/A×1000Heat shrinkage rate (%) = (L-L') / A × 1000

L:熱處理前之標線間距離(mm)、L’:熱處理後之標線間距離(mm)。L: distance between the lines before the heat treatment (mm), L': distance between the lines after the heat treatment (mm).

[實施例1][Example 1]

對2台的獨立押出機,分別供給A-2作為(A)層樹脂,供給B1-1與B2以成為40/60的質量比作為(B)層樹脂,任一層之樹脂皆以260℃熔融混練。使各別之熔融體在抵達T模頭的出口之前合流層合成A/B/A之3層狀之後,從T模頭出口押出,密著於已調整至80℃之澆鑄輥而冷卻,得到層厚為A/B/A=20/60/20(μm)的層合膜。於澆鑄輥之密著時間為4秒。For each of the two independent extruders, A-2 was supplied as the (A) layer resin, and B1-1 and B2 were supplied to have a mass ratio of 40/60 as the (B) layer resin, and the resin of either layer was melted at 260 ° C. Mixed. The respective melts were combined into a layered A/B/A layer before reaching the exit of the T-die, and then extruded from the T-die outlet, and sealed with a casting roll adjusted to 80 ° C to be cooled. A laminate film having a layer thickness of A/B/A = 20/60/20 (μm). The adhesion time of the casting rolls was 4 seconds.

[實施例2至12、比較例1至5][Examples 2 to 12, Comparative Examples 1 to 5]

相較於實施例1,使(A)層及(B)層之各層所使用的樹脂之種類、B層之(B1)(B2)的調配比率、層厚度構成變更成如表1至3記載。實施例2至7、實施例10、比較例1至5係以260℃熔融,實施例8至9係以280℃熔融而從T模頭出口押出。所押出之樹脂係密著於已調整至表1、3所示之溫度的澆鑄輥。其他之條件係與實施例1同樣做法,得到具有A/B/A之構成的2種3層之層合膜。於澆鑄輥之密著時間為4秒。The composition of the resin used in each of the layers (A) and (B), the blending ratio of the layer B (B1) (B2), and the layer thickness were changed as shown in Tables 1 to 3 as compared with Example 1. . Examples 2 to 7, Example 10, and Comparative Examples 1 to 5 were melted at 260 ° C, and Examples 8 to 9 were melted at 280 ° C and extruded from the T die exit. The resin to be extruded was adhered to a casting roll adjusted to the temperatures shown in Tables 1 and 3. In the same manner as in Example 1, two types of three-layered laminated films having a structure of A/B/A were obtained. The adhesion time of the casting rolls was 4 seconds.

[實施例13][Example 13]

對2台的獨立押出機,分別供給A-2作為(A)層樹脂,供給B1-1與B2以成為40/60的質量比作為(B)層樹脂,任一層之樹脂皆以260℃熔融混練。使各別之熔融體在抵達T模頭的出口之前合流層合成A/B之2層狀之後,從T模頭出口押出,密著於已調整至80℃之澆鑄輥而冷卻,得到層厚為A/B=30/60(μm)的層合膜。於澆鑄輥之密著時間為4秒。For each of the two independent extruders, A-2 was supplied as the (A) layer resin, and B1-1 and B2 were supplied to have a mass ratio of 40/60 as the (B) layer resin, and the resin of either layer was melted at 260 ° C. Mixed. After the respective melts are joined to the outlet of the T die, the two layers of the A/B are combined, and then extruded from the exit of the T die, and sealed with a casting roll adjusted to 80 ° C to be cooled to obtain a layer thickness. It is a laminated film of A/B = 30/60 (μm). The adhesion time of the casting rolls was 4 seconds.

[實施例14至15、比較例6][Examples 14 to 15, Comparative Example 6]

相較於實施例13,使(A)層及(B)層之各層所使用的樹脂之種類、B層之調配比率、層厚度構成變更成如表2至3記載。繼而使之以260℃熔融而從T模頭出口押出。密著於已調整至表2至3所示之溫度的澆鑄輥。其他之條件係與實施例1同樣做法,得到具有A/B之構成的2種2層之層合薄膜。於澆鑄輥之密著時間為4秒。The type of the resin used in each of the layers (A) and (B), the blending ratio of the layer B, and the layer thickness were changed as shown in Tables 2 to 3 as compared with Example 13. It is then melted at 260 ° C and extruded from the T die exit. The casting rolls were adhered to the temperatures adjusted to the temperatures shown in Tables 2 to 3. In the same manner as in Example 1, two types of two-layered laminated films having a structure of A/B were obtained. The adhesion time of the casting rolls was 4 seconds.

[比較例7至10][Comparative Examples 7 to 10]

於押出機供給表3所示之樹脂,以260℃熔融混練而押出,密著於已調整至表3所示之溫度的澆鑄輥而冷卻,得到具有表3所示之厚度的單層膜。於澆鑄輥之密著時間為4秒。又,在比較例7至10中所製作的膜係為單層膜,故無法進行中間層之非滲出的評估。The resin shown in Table 3 was supplied to the extruder, melt-kneaded at 260 ° C, and baked, and baked with a casting roll adjusted to the temperature shown in Table 3, and cooled to obtain a single-layer film having the thickness shown in Table 3. The adhesion time of the casting rolls was 4 seconds. Further, since the films produced in Comparative Examples 7 to 10 were single-layer films, evaluation of non-bleeding of the intermediate layers could not be performed.

將實施例1至15、比較例1至10之層構成、調配比率、各種特性、性能評估結果表示於表1至3。在各表中,B層調配比率表示質量比率。The layer constitutions, blending ratios, various characteristics, and performance evaluation results of Examples 1 to 15 and Comparative Examples 1 to 10 are shown in Tables 1 to 3. In each table, the B layer blending ratio represents the mass ratio.

實施例1至15之薄片係各種特性在本發明所規定之範圍內,故完全滿足作為離型膜之要求性能。尤其,高溫熱壓時之離型性及埋入性優異,故亦可應付具有精密的圖型之印刷基板,且,釋氣亦少,耐污染性亦優異者。The sheets of Examples 1 to 15 have various characteristics within the range specified by the present invention, and thus fully satisfy the required properties as a release film. In particular, since it is excellent in release property and embedding property at the time of high-temperature hot pressing, it can cope with a printed circuit board having a precise pattern, and has a small amount of outgassing and excellent stain resistance.

比較例1係離型層為聚對苯二甲酸丁二酯、中間層為聚酯系彈性體。因此,離型性雖良好,但玻璃轉移溫度與結晶熔解熱量高,故埋入性差。In Comparative Example 1, the release layer was polybutylene terephthalate, and the intermediate layer was a polyester elastomer. Therefore, although the release property is good, the glass transition temperature and the crystal melting heat are high, so the embedding property is poor.

比較例2係離型層為聚酯系彈性體、中間層為聚對苯二甲酸丁二酯。因此,結晶熔解熱量高而埋入性差。In Comparative Example 2, the release layer was a polyester elastomer, and the intermediate layer was polybutylene terephthalate. Therefore, the crystal melting heat is high and the embedding property is poor.

比較例3係於中間層不含有結晶性芳香族聚酯,故中間層為非晶狀態。因此,埋入性雖良好,但耐熱性差,尤其源自中間層之聚合物的滲出很明顯。In Comparative Example 3, since the intermediate layer did not contain the crystalline aromatic polyester, the intermediate layer was in an amorphous state. Therefore, although the embedding property is good, the heat resistance is poor, and in particular, the bleeding of the polymer derived from the intermediate layer is remarkable.

比較例4係中間層之結晶性芳香族聚酯之含量過大,由於中間層之結晶性太高,故埋入性差。In Comparative Example 4, the content of the crystalline aromatic polyester in the intermediate layer was too large, and since the crystallinity of the intermediate layer was too high, the embedding property was poor.

比較例5、6係離型層之玻璃轉移溫度太低,故埋入性雖良好,但耐熱性或離型性差,在製膜時之捲取中於膜有皺折。In Comparative Examples 5 and 6, the glass transition temperature of the release layer was too low, so that the embedding property was good, but the heat resistance and the release property were poor, and the film was wrinkled during winding during film formation.

比較例7係聚酯系彈性體單層,不具有中間層之聚酯層,故膜之本體弱,製膜作業性差,又,熱壓時之柔軟性不足,故埋入性亦不充分。In Comparative Example 7, the polyester-based elastomer single layer did not have the polyester layer of the intermediate layer. Therefore, the film body was weak, the film forming workability was poor, and the flexibility at the time of hot pressing was insufficient, so that the embedding property was also insufficient.

比較例8係聚對苯二甲酸丁二酯單層,由於結晶性太高,故離型性或耐熱性雖良好,但埋入性差。Comparative Example 8 is a single layer of polybutylene terephthalate, and since the crystallinity is too high, the release property or heat resistance is good, but the embedding property is poor.

比較例9係由廣泛使用來作為離型膜之聚甲基戊烯所構成的膜,但,釋氣產生量明顯多達本發明之膜的約10倍,為耐汙染性差者。Comparative Example 9 is a film composed of polymethylpentene which is widely used as a release film. However, the outgas generation amount is remarkably as large as about 10 times that of the film of the present invention, and is poor in stain resistance.

比較例10係不具有由聚酯系彈性體所構成之離型層。因此,熱壓時之埋入性雖優異,但膜之結晶性低,故耐熱性或離型性差。Comparative Example 10 does not have a release layer composed of a polyester elastomer. Therefore, although the embedding property at the time of hot press is excellent, since the film has low crystallinity, heat resistance and release property are inferior.

Claims (5)

一種離型膜,其特徵係具有配置於表層之聚酯系彈性體(A)層,與聚酯(B)層,而聚酯系彈性體(A)係玻璃轉移溫度為0至20℃且結晶化速度指標為20至50℃,聚酯(B)係含有結晶性芳香族聚酯(B1)及1,4-環己烷二甲醇共聚合聚對苯二甲酸乙二酯(B2),質量比(B1)/(B2)為5/95至50/50的範圍,而聚酯(B)係玻璃轉移溫度為40至80℃且結晶熔解熱量為5至40J/g。A release film characterized by having a polyester-based elastomer (A) layer disposed on a surface layer and a polyester (B) layer, and the polyester-based elastomer (A)-based glass has a glass transition temperature of 0 to 20 ° C and The crystallization rate is 20 to 50 ° C, and the polyester (B) contains a crystalline aromatic polyester (B1) and 1,4-cyclohexane dimethanol copolymerized polyethylene terephthalate (B2). The mass ratio (B1) / (B2) is in the range of 5/95 to 50/50, and the polyester (B) is glass transition temperature of 40 to 80 ° C and the heat of crystal fusion is 5 to 40 J/g. 如申請專利範圍第1項所述之離型膜,其中,聚酯系彈性體(A)係玻璃轉移溫度為3至12℃且結晶化速度指標為25至48℃,聚酯(B)中之結晶性芳香族聚酯(B1)與1,4-環己烷二甲醇共聚合聚對苯二甲酸乙二酯(B2)之質量比(B1)/(B2)為10/90至50/50的範圍,聚酯(B)係玻璃轉移溫度為50至73℃且結晶熔解熱量為8至35J/g。The release film according to claim 1, wherein the polyester elastomer (A) has a glass transition temperature of 3 to 12 ° C and a crystallization rate of 25 to 48 ° C, in the polyester (B) The mass ratio (B1)/(B2) of the crystalline aromatic polyester (B1) to 1,4-cyclohexanedimethanol copolymerized polyethylene terephthalate (B2) is 10/90 to 50/ In the range of 50, the polyester (B) glass has a glass transition temperature of 50 to 73 ° C and a heat of crystal fusion of 8 to 35 J/g. 如申請專利範圍第1或2項所述之離型膜,其中,聚酯系彈性體(A)為聚對苯二甲酸丁二酯與聚醚之嵌段共聚物。The release film according to claim 1 or 2, wherein the polyester elastomer (A) is a block copolymer of polybutylene terephthalate and polyether. 如申請專利範圍第1或2項所述之離型膜,其中,結晶性芳香族聚酯(B1)為聚對苯二甲酸丁二酯、聚對苯二甲酸丙二酯、聚對苯二甲酸乙二酯、間苯二甲酸共聚合聚對苯二甲酸乙二酯之任一者或2種以上的混合物。The release film according to claim 1 or 2, wherein the crystalline aromatic polyester (B1) is polybutylene terephthalate, polytrimethylene terephthalate or polyparaphenylene Ethylene formate or isophthalic acid copolymerized polyethylene terephthalate or a mixture of two or more thereof. 如申請專利範圍第1或2項所述之離型膜,其中,層合膜之構成為(A)/(B)/(A)之2種3層、或(A)/(B)之2種2層。The release film according to claim 1 or 2, wherein the laminate film is composed of two types of (A)/(B)/(A), or (A)/(B) 2 kinds of 2 layers.
TW099135393A 2009-10-22 2010-10-18 Release film TWI478811B (en)

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CN103434231B (en) * 2013-07-19 2016-04-13 胡宇翔 A kind of printed circuit board forming mould release membrance and manufacture method thereof
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