TW201119854A - Release film - Google Patents
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- TW201119854A TW201119854A TW99135393A TW99135393A TW201119854A TW 201119854 A TW201119854 A TW 201119854A TW 99135393 A TW99135393 A TW 99135393A TW 99135393 A TW99135393 A TW 99135393A TW 201119854 A TW201119854 A TW 201119854A
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201119854 六、發明說明: 【發明所屬之技術領域】 ' 本發明係關於一種離型膜,特別係關於一種印刷基板 製造時所使用之離型膜。尤其有關一種於具有精密的圖型 之印刷基板上藉熱硬化性黏著劑而高溫熱壓黏著覆蓋膜時 有用的離型膜。 【先前技術】 離型膜在工業上被廣泛使用。尤其,在印刷電路基 板、軟性印刷電路基板、多層印刷電路基板等之製造步驟 中,經由預浸體或耐熱膜而熱壓銅箔層合板或銅箔時,可 使用於用以防止預浸體或耐熱膜與壓熱板黏著。進一步, 在軟性印刷基板的製造步驟中,於形成電性電路之軟性印 刷基板本體藉熱硬化型黏著劑而熱壓黏著覆蓋膜時,可使 用於用以防止覆蓋膜與壓熱板黏著。 前述用途之離型膜係可舉例如氟系膜、聚矽氧塗佈聚 對苯二甲酸乙二酯膜、聚甲基戊烯膜、聚丙烯膜等。 但,自以往可使用來作為離型膜之氟系膜雖於耐熱 性、離型性、非污染性優異,但除昂貴外,在使用後之廢. 棄燒燼處理中很難燃燒,且產生有毒氣體之問題點仍存 在。又,聚矽氧塗佈聚對苯二甲酸乙二酯膜、聚曱基戊烯 膜係於膜組成中含有聚矽氧或低份子量體,因此等之移 動,於印刷電路基板尤其基板上之銅電路上引起污染,恐 損及品質。又,聚丙烯膜係耐熱性差,離型性不充分。 因此,就改善柔軟性、耐熱性、離型性、非污染性, 3 322464 201119854 可廢棄燒燼之離型祺,已知於含有例如聚丙烯系樹脂、與 乙烯系芳香族系彈性體之緩衝(cushion)層的兩面層合由結 晶性芳香族聚酯所構成的離型層之膜(專利文獻1)。又, 已揭示聚對苯二甲酸丁二酯、聚對苯二甲酸丙二酯、聚對 苯二甲酸丁二酯與聚_之嵌般共聚物作為離变層之膜(專 利文獻2)、或以此等作為緩衝層之膜(專利文獻3)。 又,耐熱性、成形加工性優異之層合化粧薄片已揭示 使非晶性聚酯系樹脂與結晶性聚酯樹脂掺混、或層合之膜 (專利文獻4、專利文獻5)。 [專利文獻1]曰本特開2008_049504號公報 [專利文獻2]國際公開第〇5/〇〇285〇號手冊 [專利文獻3]日本特許第4099355號公報 [專利文獻4]日本特開2003-231761號公報 [專利文獻5]曰本特開2008-162058號公報 【發明内容】 [發明欲解決之課題] 但,在如此之技術中,未充分兼具離型性及耐熱性、 與柔軟性,重視離型性與耐熱性時,變成犧牲柔軟性,對 於/、有精岔圖型之印刷基板的埋入性差。另外,重視柔軟 陡時,除離型性的降低或膜表面的滑性惡化外,因彈性率 低’故膜之捲取時或裁切時延伸或產生皺折等,綜合性之 處理作業性差。 例如,專利文獻1記載之膜中係離型性、埋入性優異, 但,緩衝層樹脂之烙點低’故耐熱性不充分。因此,有熱 4 322464 201119854 壓時缓衝層從膜端部滲出,或因低分子量體之移動而污染 印刷電路基板之問題。 '在專利文獻2、專利文獻3之技術中,以埋入性提昇 作為目的,使用柔軟共聚合之聚對苯二甲酸丁二酯,因此, 離型性、非污染性優異。但,於内層、或外層使用聚對苯 二曱酸丁二酯,其硬度之故,熱壓時之埋入性較以往所使 用之聚曱基戊烯系膜差。 在專利文獻4、專利文獻5之技術中,以化粧薄片之 成形加工性提昇作為目的,於結晶性聚酯樹脂掺混非晶聚 酯系樹脂。因此,埋入性優異。但,表層樹脂係藉由重視 成形性未積極地結晶化,因此,如本發明之用途的高溫熱 壓時,有耐熱性或離型性差之問題。 本發明係解決習知技術之前述問題點,目的在於提供 一種柔軟性、離型性、财熱性、非污染性優異,尤其,對 於具有精密圖型之印刷基板的埋入性良好,且薄片之捲取 或裁切時之處理作業性優異之離型薄膜。 [用以解決課題之手段] 本發明人等係為解決上述課題,專心研究之結果,藉 由層合具有特定結晶性的聚酯系彈性體、與玻璃轉移溫度 高於其之聚酯,使表層之聚酯系彈性體結晶化而賦予離型 性,藉由使内層之結晶性樹脂的聚酯之結晶性調控於特定 的範圍,發現可兼具在高溫之熱壓時的埋入性與非滲出性 之相反的特性,完成本發明。又,在本發明中,所謂高溫 熱壓,謂使用加熱至100°C以上之熱板的壓加工。亦即, 5 322464 201119854 本發明之要旨係如^。 (1) .一種離型膜’其特徵係具有配置於表層之聚酯系彈 性體(A)層’與聚酯(B)層, 聚醋系彈性體(A)係玻璃轉移溫度為〇至抓且結 晶化速度指標為20至50。(:, 聚醋(B)係含有結晶性芳香族聚酯(B1)及1,4-環 己烧二曱醇共聚合聚對笨二甲酸乙二醋⑻),質量比(叫 /( B2 )為5/95至50/50的範圍, 聚醋⑻係玻璃轉移溫度為4〇ι8〇0(:且結晶炼解熱 量為5至40J/g。 (2) .如(1)之離型膜聚酯系彈性體(A)係玻璃轉移溫度 為3至12°C且結晶化速度指標為25至48<3(:, 聚酯(B)中之結晶性芳香族聚酯(B1)與丨,4-環己 烧-甲醇共聚合聚對苯二甲酸乙二酯(B2)之質量比(Βι ) /( B2 )為 10/90 至 50/50 的範圍, 聚酯(B)係玻璃轉移溫度為5〇至73<t且結晶熔解熱 量為8至35J/g。 ' (3) .如(1)或(2)項之離型膜,其中聚酯系彈性體(a) 為聚對苯二甲酸丁二酯與聚醚之嵌段共聚物。 (4) .如(1)或(3)項中任一項之離型膜,其中結晶性芳香 族聚酿(B1)為聚對苯二甲酸丁二酯、聚對苯二甲酸丙二 S曰、聚對苯二甲酸乙二酯、間苯二甲酸共聚合聚對苯二甲 酸乙二酯之任一者或2種以上的混合物。 (5) .如(1)或(4)項中任一項之離型膜,其中層合膜之構 322464 6 201119854 、或(A) / (B)之 2 成為(A) /(B) /(A)之2種3層 種2層。 a 【實施方式】 [用以實施發明之形態] 以下’詳細說明本發明。 本毛月之綠型膜,其係具有配置於表層之聚醋系彈性 體(A)層,與聚醋⑻層之層合膜。 〈聚酯系彈性體(A)> 聚酯系彈性體(A)層係配置於離型膜之表層而發揮 離型層功能。若無聚I系彈性體⑷層,熱壓時之離型 性降低,例如在使用覆蓋膜之層合板的熱壓步驟中,膜容 易被剝離,而於層合板或壓熱板上黏著膜,將其等污染。 象5曰系彈性體(A )係可舉例如由高溶點結晶性節段 與低熔點節段之嵌段共聚物所構成者。高熔點結晶性節段 主要由、纟。Ba性务香族聚醋單元所構成,低溶點節段係由脂 肪族聚醚單元及/或脂肪族聚酯單元所構成。 聚醋系彈性體(A)中之高熔點結晶性節段與低熔點 郎¥又的共聚合比率除了選擇構成各節段之單體外,以滿足 後述之熔點、玻璃轉移溫度、結晶化速度指標、結晶熔解 熱量之範圍而決定,無特別限定。但,於聚酯系彈性體(A) 中含有低熔點節段5至50質量%為適宜。 在聚酯系彈性體(A)中’構成高熔點結晶性節段之 結晶性芳香族聚酯係宜由芳香族二敌酸成分與脂肪族二醇 成分所形成之聚醋。詳細而§ ’從耐熱性或高結晶性之觀 322464 7 201119854 點’宜為聚對苯二甲酸乙二酯(PET)、聚對苯二曱酸丁二酯 (PBT)、聚對笨二曱酸丙二酯(ΡΓΓ)。 上述之PET、PBT、PTT之外亦可使用由如以下之芳 香族二羧酸成分、二醇成分所得到之聚酯作為結晶性芳香 族聚酯。又如此之結晶性芳香族聚酯亦可為與PET、ΡΒτ、 PTT之任一者共聚合者。 芳香族二羧酸成分係可舉例如間笨二曱酸、苯二甲 酸、萘-2,6-二羧酸、萘-2,7-二羧酸、二笨基_4,4,-二羧酸、 一本氧基乙烧二竣酸、5 -續間苯二甲酸、或此等之g旨形成 性衍生物。 一醇成分宜為分子量300以下之二醇。可舉例如乙二 醇、丙二醇、戊二醇、己二醇、新戊二醇、癸二醇等脂肪 族二醇;1,4_環己烷二甲醇、三環癸烷二羥甲基等脂環式 二醇;二甲笨二醇、雙(對-羥基)二苯基、雙(對_羥基 苯基)丙烷、2,2-雙[4- (2-羥基乙氧基)苯基]丙烷、雙[4_ (2-羥基)苯基]砜、丨,卜雙[4_ (2_羥基乙氧基)苯基]環己 烷、4,4’-二羥基_對聯三苯基、4,4’·二羥基_對聯四苯基等 芳香族二醇等。此等之二羧酸成分及二醇成分亦可併用2 種以上。 結晶性芳香族聚酯係可為使3官能以上之多官能羧酸 成分、多官能羥基酸成分、多官能羥基成分等在5莫耳% 以下之範圍共聚合者。 、° 在聚酯系彈性體(A)中,構成低熔點節段之脂肪族 聚趟可舉例如聚(環氧乙烧)二醇、聚(環氧丙烧)二醇、、 322464 8 201119854 聚(環氧丁幻二醇、聚(環氧己院)二醇、環氧乙烧與 • %氧丙院之共聚合物、聚(環氧丙燒)二醇之環氧乙烧加 成聚合物、環氧乙烷與四氫呋喃之共聚合物等。構成低熔 點節段之脂肪族聚酯可舉例如聚(ε •己内酯)、聚壬内酯、 聚戊内酯、聚己二酸丁二酯、聚己二酸乙二酯等。此等脂 肪族聚醚及/或脂肪族聚酯之中,從所得到之聚酯嵌段共聚 物的彈性特性,宜為聚(環氧丁燒)二醇、聚(環氧丙幻 二醇之環氧乙烷加成物、聚(ε_己内酯)、聚己二酸丁二 酯、聚己二酸乙二酯等,尤宜為聚(環氧丁烷)二醇。又, 此等之低熔點節段的數目平均分子量在共聚合之狀態中宜 為300至6000左右。 “ 聚酯系彈性體(Α)的玻璃轉移溫度係必須為〇至2〇 C。若玻璃轉移溫度低於0〇c,熱壓時之離型性與耐熱性 差,進一步,製膜作業性亦降低。若超過20。(:,埋入性差。 聚酯系彈性體(A)的玻璃轉移溫度宜為〇至15。〇。 聚酯系彈性體(A)之熔點宜為2〇〇〇c以上。若熔點低 於200°C,有時熱壓時之耐熱性差。 聚酯系彈性體(A)於製膜時必須以澆鑄輥充分結晶 化。因此,聚S旨系彈性體(A)之結晶化速度指標必須為 20至50C。結晶化速度指標係表示聚酯系彈性體(A)的 熔融後冷卻時的結晶化速度之指標。若結晶化速度指標超 過50°C,亦即,若熔融後冷卻時的結晶化速度慢,形成層 s膜之耐熱性賦予很難,以輥直接加熱層合膜而實施結 a曰化處理日守產生自輥之剝離不良。若結晶化速度指標為上 322464 9 201119854 述範圍内,可使樹脂於熔融押出後以冷卻輥結晶化,而且, 可以澆鑄輥之溫度或速度調控薄片的結晶狀態。結晶化速 度指標宜為25至5(TC。 聚酯系彈性體(A)宜為結晶熔解熱量為25至45 J/g。 不足25 J/g時耐熱性或離型性易不充分,另外,若超過μ J/g,埋入性易降低。 具有上述結晶化特性之聚酯系彈性體(A)較佳的構 成,係可舉例如聚對苯二曱酸丁二酯與聚醚之嵌段兑聚 物。=醚之共聚合量宜為1〇至4〇質量%,更宜為b、至 30質里%。若聚醚之共聚合量少,柔軟化效果小,另外, :¾太夕对熱性或結晶性過於降低。若為如此之範圍,易 於聚酉日系彈性體⑷之溶點、玻璃轉移溫度、結晶化速度 指標、結晶熔解熱量等。 聚酯系彈性體(A)可以公知之方法製造。例如,使二羧 酸^低級醇二酿、過剩量的低分子量二醇、及低溶點節段 成刀在觸媒的存在下進行醋交換反應,使所得到之反應生 成物聚縮合之方法。或者,使二羧酸與過剩量的二醇及低 溶點希段成分在觸媒的存在下進行酯化反應,使所得到之 反應生成物聚縮合之方法。又,可舉例如預先製作高熔點 結晶性節段’再添加低熔點節段成分而藉酯交換反應使之 無規化的方法。可列舉使高熔點結晶性節段與低熔點節段 以鏈連結劑連結之方法。進—步,於低熔點節段使用聚(£ -己内醋)時’可列舉於高熔點結晶性節段使ε -己内酯單體 加成反應的方法等。亦可為任一者之方法。 10 322464 201119854 〈聚酯(B)> 在本發明之離型膜中必須為層合發揮離型層功能之 前述聚酯系彈性體(A)層的支樓層、及作為在高溫之熱 壓的埋入層之聚酯(B)層。若非(B)層,膜製造時輥捲 取此膜時,由於膜之本體脆弱,故產生皺折,製膜作業性 明顯降低,工業上很難生產。又,在高溫之熱壓時的埋入 性不充分。 構成聚酯(B)層的成分,必須為結晶性芳香族聚酯 (B1)、與l,4-環己烷二甲醇共聚合聚對苯二甲酸乙二酯 (B2)。 構成聚酯(B)層之結晶性芳香族聚酯(B1)與i,4_ 環己烷二甲醇共聚合聚對苯二甲酸乙二酯(B2)的質量比 (Bl) / (B2)必須為 5/95 i 5G/5G 的範圍,宜為 3〇/7〇 至50/50之範圍。若結晶性芳香族聚酯(B1)未達$質量 ’(B)層的結晶性太低,高溫熱時之耐熱性有降低= 傾向’因(B )層之滲出而有時污染各部分。若()超 過50質s % ’⑻層之結晶性太高’有高溫熱沖壓時的埋 入性差的傾向。 聚酯(B)之玻璃轉移溫度必須為4〇至8〇ΐ。若玻璃 轉移溫度低於25t,由於膜在常溫軟化,故薄片捲取時有 皺折’裁切時之切割性等的處理作業性變成不充分。另外, 若玻璃轉移溫度超過8Gt:,在鐘時膜之軟化變成不充 分’故埋入性差。聚醋⑻之玻璃轉移溫度宜為Μ至乃 °C,尤宜為50至70。〇 322464201119854 VI. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a release film, and more particularly to a release film used in the manufacture of a printed substrate. In particular, it relates to a release film which is useful when a cover film is formed by a thermosetting adhesive on a printed circuit board having a precise pattern and a high temperature heat-pressure adhesive film. [Prior Art] The release film is widely used industrially. In particular, in a manufacturing step of a printed circuit board, a flexible printed circuit board, or a multilayer printed circuit board, when a copper foil laminate or a copper foil is hot-pressed via a prepreg or a heat-resistant film, it can be used to prevent a prepreg. Or the heat resistant film is adhered to the hot plate. Further, in the manufacturing step of the flexible printed circuit board, when the flexible printed circuit board body forming the electrical circuit is thermally pressure-bonded to the cover film by the heat-curing adhesive, it can be used to prevent the cover film from adhering to the hot plate. The release film of the above-mentioned use may, for example, be a fluorine-based film, a polyoxymethylene-coated polyethylene terephthalate film, a polymethylpentene film or a polypropylene film. However, the fluorine-based film which has been used as a release film in the past is excellent in heat resistance, release property, and non-contamination property, but it is expensive in use, and it is difficult to burn after disposal. The problem of producing toxic gases still exists. Further, the polyoxymethylene-coated polyethylene terephthalate film or the polydecylpentene film contains polyfluorene or a low molecular weight in the film composition, and thus moves on a printed circuit board, particularly a substrate. The copper circuit causes pollution, damage and quality. Further, the polypropylene film is inferior in heat resistance and insufficient in release property. Therefore, the softness, the heat resistance, the release property, and the non-contamination property are improved. 3 322 464 201119854 The 离 烬 can be discarded, and is known to contain, for example, a polypropylene resin and a buffer of a vinyl aromatic elastomer. A film of a release layer composed of a crystalline aromatic polyester is laminated on both surfaces of the (cushion) layer (Patent Document 1). Further, a film of polybutylene terephthalate, polytrimethylene terephthalate, polybutylene terephthalate, and poly-ply-like copolymer has been disclosed as a film of a release layer (Patent Document 2). Or such a film as a buffer layer (Patent Document 3). In addition, a laminated cosmetic sheet having excellent heat resistance and moldability has been disclosed as a film in which an amorphous polyester resin and a crystalline polyester resin are blended or laminated (Patent Document 4, Patent Document 5). [Patent Document 1] Japanese Laid-Open Patent Publication No. 2008-049504 [Patent Document 2] International Publication No. 5/〇〇285 No. [Patent Document 3] Japanese Patent No. 4099355 [Patent Document 4] Japanese Patent Laid-Open No. 2003- [Patent Document 5] JP-A-2008-162058 SUMMARY OF THE INVENTION [Problems to be Solved by the Invention] However, in such a technique, the release property, heat resistance, and flexibility are not sufficiently obtained. When the release property and the heat resistance are emphasized, the softness is sacrificed, and the embedding property of the printed substrate having the fine pattern is poor. In addition, when the softness and steepness are emphasized, the release property is lowered or the slipperiness of the film surface is deteriorated, and the elastic modulus is low, so that the film is stretched or wrinkled during the winding or the cutting, and the comprehensive processing workability is poor. . For example, in the film described in Patent Document 1, the release property and the embedding property are excellent, but the hardness of the buffer layer resin is low, so that heat resistance is insufficient. Therefore, there is a problem that the buffer layer bleeds from the end of the film when the pressure is 4 322464 201119854, or the printed circuit board is contaminated by the movement of the low molecular weight body. In the techniques of Patent Document 2 and Patent Document 3, the soft copolymerized polybutylene terephthalate is used for the purpose of improving the embedding property, and therefore, it is excellent in release property and non-contamination property. However, the use of polybutylene terephthalate in the inner layer or the outer layer has a hardness which is inferior to the polydecylpentene film used in the prior art. In the techniques of Patent Document 4 and Patent Document 5, the amorphous polyester resin is blended in the crystalline polyester resin for the purpose of improving the moldability of the cosmetic sheet. Therefore, the embedding property is excellent. However, since the surface layer resin is not actively crystallized by paying attention to moldability, there is a problem of poor heat resistance or release property at the time of high-temperature hot pressing of the use of the present invention. The present invention solves the aforementioned problems of the prior art, and an object of the invention is to provide a softness, a release property, a heat recovery property, and a non-pollution property, and in particular, a good embedding property for a printed circuit board having a precise pattern, and a sheet A release film that is excellent in workability when being taken up or cut. [Means for Solving the Problem] The present inventors have solved the above problems and, as a result of intensive research, laminated a polyester elastomer having a specific crystallinity and a polyester having a glass transition temperature higher than that. The polyester elastomer of the surface layer is crystallized to impart release property, and the crystallinity of the polyester of the inner layer of the crystalline resin is adjusted to a specific range, and it is found that the embedding property at the time of hot pressing at a high temperature can be achieved. The opposite characteristics of non-exudative properties complete the present invention. Further, in the present invention, the high-temperature hot pressing is a press working using a hot plate heated to 100 ° C or higher. That is, 5 322464 201119854 The gist of the present invention is as follows. (1) A release film having the characteristics of a polyester-based elastomer (A) layer and a polyester (B) layer disposed on the surface layer, and the glass transition temperature of the polyester-based elastomer (A) is 〇 to The catching and crystallization speed index is 20 to 50. (:, Polyacetate (B) contains crystalline aromatic polyester (B1) and 1,4-cyclohexanol dimethanol copolymerized poly(p-dibenzoic acid ethylene diacetate (8)), mass ratio (called / ( B2 In the range of 5/95 to 50/50, the transfer temperature of the poly (8) glass is 4 〇 ι 8 〇 0 (: and the heat of crystallization heat is 5 to 40 J/g. (2). Release as in (1) The film polyester elastomer (A) has a glass transition temperature of 3 to 12 ° C and a crystallization rate of 25 to 48 < 3 (:, a crystalline aromatic polyester (B1) in the polyester (B) and丨, 4-cyclohexane-methanol copolymerized polyethylene terephthalate (B2) mass ratio (Βι ) / ( B2 ) is in the range of 10/90 to 50/50, polyester (B) glass The transfer temperature is 5 〇 to 73 < t and the heat of crystal fusion is 8 to 35 J/g. (3) The release film of (1) or (2), wherein the polyester elastomer (a) is a poly A release film of a polybutylene terephthalate and a polyether. The release film of any one of (1) or (3), wherein the crystalline aromatic poly (B1) is a poly Butylene terephthalate, poly(trimethylene terephthalate), polyethylene terephthalate, isophthalic acid copolymerization Any one or a mixture of two or more of polyethylene terephthalate. The release film of any one of (1) or (4), wherein the structure of the laminated film is 322464 6 201119854 2 or (A) / (B) 2 is a two-layer, two-layer, two-layer (A) / (B) / (A) a. [Embodiment] [Formation for carrying out the invention] The following is a detailed description of the present invention. In the present invention, the green film of the month of the month has a layer of a polyester-based elastomer (A) disposed on the surface layer and a laminated film of the layer of the polyester (8). <Polyester-based elastomer (A)> Polyester The elastomer (A) layer is disposed on the surface layer of the release film to function as a release layer. If the layer of the poly-I-based elastomer (4) is not provided, the release property during hot pressing is lowered, for example, in a laminate using a cover film. In the hot pressing step, the film is easily peeled off, and the film is adhered to the laminate or the hot plate to contaminate it. For example, the 5-lanthanide elastomer (A) may be, for example, a high melting point crystalline segment and low. The block copolymer of the melting point segment is composed of a high-melting-point crystalline segment mainly composed of 纟. Ba savory scented vinegar unit, and the low-melting point segment is composed of aliphatic polyether unit and/or fat. It is composed of a fatty polyester unit. The copolymerization ratio of the high melting point crystalline segment and the low melting point in the polyacetal elastomer (A) is selected in addition to the monomers constituting each segment to satisfy the melting point described later. The glass transition temperature, the crystallization rate index, and the range of the heat of crystal melting are not particularly limited. However, it is preferable that the polyester elastomer (A) contains a low melting point of 5 to 50% by mass. In the elastomer (A), the crystalline aromatic polyester constituting the high-melting crystalline segment is preferably a polyester formed from an aromatic dicarboxylic acid component and an aliphatic diol component. In detail, § 'From the viewpoint of heat resistance or high crystallinity, 322464 7 201119854 points' should be polyethylene terephthalate (PET), polybutylene terephthalate (PBT), poly-p-butadiene Acid propylene diester (ΡΓΓ). A polyester obtained from an aromatic dicarboxylic acid component or a diol component such as the following may be used as the crystalline aromatic polyester in addition to the above-mentioned PET, PBT, and PTT. Further, such a crystalline aromatic polyester may be copolymerized with any of PET, ΡΒτ, and PTT. The aromatic dicarboxylic acid component may, for example, be adipic acid, phthalic acid, naphthalene-2,6-dicarboxylic acid, naphthalene-2,7-dicarboxylic acid, dipyridyl-4,4,-di A carboxylic acid, a oxyethylidene dicarboxylic acid, a 5-an isophthalic acid, or the like. The monool component is preferably a diol having a molecular weight of 300 or less. Examples thereof include aliphatic diols such as ethylene glycol, propylene glycol, pentanediol, hexanediol, neopentyl glycol, and decanediol; 1,4-cyclohexanedimethanol, tricyclodecane dimethylol, and the like. Alicyclic diol; dimethyl diol, bis(p-hydroxy)diphenyl, bis(p-hydroxyphenyl)propane, 2,2-bis[4-(2-hydroxyethoxy)phenyl Propane, bis[4_(2-hydroxy)phenyl]sulfone, anthracene, bis[4_(2-hydroxyethoxy)phenyl]cyclohexane, 4,4'-dihydroxy-p-terphenyl, An aromatic diol such as 4,4'-dihydroxy-p-tetraphenyl or the like. These dicarboxylic acid components and diol components may be used in combination of two or more kinds. The crystalline aromatic polyester may be a copolymer of a trifunctional or higher polyfunctional carboxylic acid component, a polyfunctional hydroxy acid component, a polyfunctional hydroxy component, or the like in a range of 5 mol% or less. In the polyester elastomer (A), the aliphatic polyfluorene constituting the low melting point segment may, for example, be a poly(ethylene oxide) diol or a poly(ethylene propylene oxide) diol, 322464 8 201119854 Poly(ethylene epoxide diol, poly(epoxy hexanyl) diol, epoxy ethene and ethoxylates, co-polymer of polyoxypropylene propylene glycol a polymer, a copolymer of ethylene oxide and tetrahydrofuran, etc. The aliphatic polyester constituting the low melting point segment may, for example, be poly(ε•caprolactone), polydecanolactone, polyvalerolactone, polyhexamethylene. Butic acid diester, polyethylene adipate, etc. Among these aliphatic polyethers and/or aliphatic polyesters, the elastic properties of the obtained polyester block copolymer are preferably poly(epoxy). Butadiene) diol, poly(ethylene oxide adduct of propylene propylene glycol, poly(ε_caprolactone), polybutylene adipate, polyethylene adipate, etc. It is preferably a poly(butylene oxide) diol. Further, the number average molecular weight of these low melting point segments is preferably about 300 to 6000 in the state of copolymerization. "Polyester elastomer (Α) glass The transfer temperature must be 〇 to 2〇C. If the glass transition temperature is lower than 0〇c, the release property and heat resistance during hot pressing are inferior, and further, the film forming workability is also lowered. If it exceeds 20. (:, buried The glass transition temperature of the polyester elastomer (A) is preferably from 〇 to 15. 〇. The melting point of the polyester elastomer (A) is preferably 2 〇〇〇 c or more. If the melting point is lower than 200 ° C, there is The heat resistance at the time of hot pressing is inferior. The polyester elastomer (A) must be sufficiently crystallized by a casting roll at the time of film formation. Therefore, the crystallization rate index of the poly(S) elastomer (A) must be 20 to 50C. The crystallization rate index is an index indicating the crystallization rate at the time of cooling after melting of the polyester elastomer (A). When the crystallization rate index exceeds 50 ° C, that is, the crystallization rate at the time of cooling after melting is slow. It is difficult to form the heat resistance of the layer s film, and the laminated film is directly heated by the roll to perform the ablation treatment, and the peeling failure from the roll occurs. If the crystallization rate is in the range of 32246 94 201119854, The resin is crystallized by a cooling roll after being melted, and the casting roll can be Temperature or speed regulates the crystallization state of the sheet. The crystallization rate index is preferably 25 to 5 (TC. The polyester elastomer (A) preferably has a heat of crystal fusion of 25 to 45 J/g. Heat resistance at less than 25 J/g. The release property is not sufficient, and if it exceeds μ J/g, the embedding property is liable to lower. The polyester elastomer (A) having the above crystallization characteristics is preferably a composition, for example, polyparaphenylene. The block copolymer of butylene phthalate and polyether == the copolymerization amount of the ether is preferably from 1 to 4% by mass, more preferably from b to 30% by mass. If the polyether is less copolymerized The softening effect is small, and the :3⁄4 Taixi is too low in heat or crystallinity. If it is such a range, it is easy to polymerize the melting point of the Japanese elastomer (4), the glass transition temperature, the crystallization rate index, the heat of crystal melting, and the like. . The polyester elastomer (A) can be produced by a known method. For example, a method in which a dicarboxylic acid, a lower alcohol, a low molecular weight diol, a low-molecular weight diol, and a low-melting point segment are subjected to a vinegar exchange reaction in the presence of a catalyst to obtain a condensation reaction of the obtained reaction product. . Alternatively, a method in which a dicarboxylic acid, an excess amount of a diol, and a low melting point component are subjected to an esterification reaction in the presence of a catalyst to obtain a condensation reaction of the obtained reaction product. Further, for example, a method in which a high-melting-point crystalline segment is prepared in advance and a low-melting-point segment component is added to be randomized by a transesterification reaction can be mentioned. A method of connecting a high-melting-point crystalline segment and a low-melting-point segment to a chain linking agent can be mentioned. Further, when poly(£-hexane vinegar) is used in the low melting point section, a method of adding an ε-caprolactone monomer to a high-melting crystalline segment may be mentioned. It can also be a method of either. 10 322464 201119854 <Polyester (B)> In the release film of the present invention, it is necessary to laminate the above-mentioned polyester-based elastomer (A) layer which functions as a release layer, and as a hot press at a high temperature. The layer of polyester (B) embedded in the layer. In the case of the non-layer (B), when the film is taken up by the roll during the production of the film, wrinkles are generated due to the fragile body of the film, and the film forming workability is remarkably lowered, which is industrially difficult to produce. Further, the embedding property at the time of hot pressing at a high temperature is insufficient. The component constituting the polyester (B) layer must be a crystalline aromatic polyester (B1) and a polyethylene terephthalate (B2) copolymerized with 1,4-cyclohexanedimethanol. The mass ratio (Bl) / (B2) of the crystalline aromatic polyester (B1) constituting the polyester (B) layer to the i, 4 - cyclohexane dimethanol copolymerized polyethylene terephthalate (B2) must be For the range of 5/95 i 5G/5G, it is preferably in the range of 3〇/7〇 to 50/50. If the crystalline aromatic polyester (B1) does not reach the mass of 'B', the crystallinity of the layer (B) is too low, and the heat resistance at high temperature is lowered. = The tendency is to contaminate the parts due to the bleeding of the (B) layer. . If () is more than 50 s%, the crystallinity of the (8) layer is too high, and the embedding property at the time of high-temperature hot stamping tends to be poor. The glass transition temperature of the polyester (B) must be 4 Torr to 8 Torr. When the glass transition temperature is lower than 25 t, the film is softened at room temperature, so that the sheet is wrinkled during winding, and the workability such as cutting property at the time of cutting becomes insufficient. Further, if the glass transition temperature exceeds 8 Gt: the softening of the film becomes insufficient at the time of the clock, so the embedding property is poor. The glass transition temperature of the polyacetic acid (8) is preferably from Μ to °C, particularly preferably from 50 to 70. 〇 322464
II 201119854 聚醋(B)之結晶轉熱量必須為5至4〇 j/g。若為如 此之範圍内,⑻層可充分發揮⑷層之支撐層的功能, f可兼具高溫熱時之耐熱性、埋人性等。若結晶熔解熱 里低於5 J/g ’由於結晶性太低’故高溫熱慶時的耐熱性 差,=時從膜端部發生⑻層的渗出。另外,若結晶炫 解熱量超過40 J/g時,高溫熱屋時的膜之軟化變成不充 刀’故埋人性差。聚g旨⑻之結晶轉熱量係宜為⑺至 35J/g ’ 尤宜為 15至3〇;/§。 〈結晶性芳香族聚酯(Bl)> 結晶性芳香族«⑶)從耐熱性或高結晶性之觀 點,可舉例如PET、PBT、PTT、及此等與間苯二甲酸等 之共聚物、或此等之2種以上的混合物。 結晶性芳香族聚醋(B1 )之炫點宜為200°C以上。若 熔點低於200。(:,有時熱壓時之耐熱性差。 使用間苯三甲酸絲合聚對苯H二g旨作為社 晶性芳香族聚自旨⑶)時,例如只要選擇炫點成為上述^ 圍内之共聚合的比率即可。詳細而言,相對於全二緩酸成 分’間苯二甲酸之比率宜為20莫耳%以T,尤宜為10莫 耳%以下。若超過20莫耳%,_⑻層之熔點及結晶 性降低,故高溫熱壓時之耐熱性有差的傾向。 結晶性芳香族聚醋(B1)係可為在無損及⑻層的 熔點及結晶性之範圍共聚合者。 共聚合成分係無特別限定,但酸成分可舉例如間苯二 甲酸、苯二甲酸、2,6_萘二㈣、5•鈉續間苯二甲酸、草酸、 322464 12 201119854 破拍酸、己二酸、癸二酸、壬二酸、十二碳二酸、二聚酸' 馬來酸酐、馬來酸、富馬酸、衣康酸、擰康酸、中康酸、 環己烧二緩酸等二緩酸、4-經基安息香酸、£ -己内醋或乳 酸等。 又’醇成分可舉例如乙二醇、二乙二醇、1,3 -丙二醇、 新戊二醇、1,6-己二醇、環己烷二甲醇、三乙二醇、聚乙 二醇、聚丙二醇、聚丁二醇、雙酚A或雙酚S之環氧乙烷 加成物等。 進一步,可少量使用偏苯三曱酸、均苯三曱酸、均苯 四甲酸、三羥曱基丙烷、甘油、季戊四醇等3官能化合物 專。此等之共聚合成分可併用2種以上。 又’使此等結晶性芳香族聚酯混合2種以上而使用 時,其混合比係考量(B1 )樹脂的結晶性,只要適當選擇 即可。 結晶性芳香族聚酯(B1)係可以公知之方法製造。可 舉例如使一羧酸之低級醇二酯、過剩量之低分子量二醇在 觸媒的存在下進行g旨交換反應,使所得到之反應生成物聚 縮合之方法。或可舉例如使二羧酸與過剩量之二醇在觸媒 的存在下進行酯交換反應,使所得到之反應生成物聚縮合 之方法。 ^聚合後之聚酯由於含有單體或寡聚物、副生成物之乙 路或四氫$喃等’故若直接使用於熱壓時,產生此等之低 ^ =移動至基板之問題。因此,宜使用在減壓或情性 體机通下、2〇〇°c以上之溫度固相聚合的原料。 322464 13 201119854 〈1,4-環己烷二甲醇共聚合聚對苯二甲酸乙二酯(B2)> 1,4-環己烷二甲醇共聚合聚對苯二甲酸乙二酯(以 下,簡稱為「CHDM-PET」)係使乙二醇之一部分以 環己烷二甲醇取代之PET共聚物。為提高聚酯(B)層之 非晶化度,滿足熱壓時之埋入性,相對於全二醇成分含有 1,4-環己烷二甲醇成分1〇莫耳%以上、宜為12莫耳%以 上、更宜為15莫耳%以上。另外,若14環己烷二p醇成 分太多,有薄膜缺乏耐熱性之傾向,上限宜為5〇莫耳%, 更宜為45莫耳%以下,最宜為4〇莫耳%以下。 如此之CHDM-PET的具體例可舉例如EastmanII 201119854 The crystallization of calcined vinegar (B) must be 5 to 4 〇 j/g. If it is within this range, the (8) layer can fully exert the function of the support layer of the (4) layer, and f can have both heat resistance and burying property at high temperature and heat. If the heat of crystal fusion is less than 5 J/g ', the crystallinity is too low, so the heat resistance at the time of high temperature heat is poor, and when it is =, the (8) layer is oozing out from the end of the film. In addition, when the heat of the crystal is more than 40 J/g, the softening of the film at the time of the hot house is not filled, so the burial property is poor. The crystallization heat transfer amount of the poly (g) is preferably from (7) to 35 J/g ', particularly preferably from 15 to 3 Å; /§. <Crystalline Aromatic Polyester (Bl)> Crystalline Aromatic «(3)) From the viewpoint of heat resistance or high crystallinity, for example, PET, PBT, PTT, and copolymers thereof with isophthalic acid and the like are mentioned. Or a mixture of two or more of these. The bright point of the crystalline aromatic polyester (B1) is preferably 200 ° C or higher. If the melting point is below 200. (: There may be a case where the heat resistance at the time of hot pressing is inferior. When the isophthalic acid is used to form a poly(p-phenylene) group, it is preferable to select a bright point as the above-mentioned range. The ratio of copolymerization is sufficient. Specifically, the ratio of the isophthalic acid component 'isophthalic acid' is preferably 20 mol% to T, particularly preferably 10 mol% or less. If it exceeds 20 mol%, the melting point and crystallinity of the _(8) layer are lowered, so that heat resistance at high temperature and hot pressing tends to be inferior. The crystalline aromatic polyester (B1) may be copolymerized in a range which does not impair the melting point and crystallinity of the (8) layer. The copolymerization component is not particularly limited, and examples of the acid component include isophthalic acid, phthalic acid, 2,6-naphthalene di(tetra), 5·sodium phthalate, oxalic acid, 322464 12 201119854 Diacid, azelaic acid, sebacic acid, dodecanedioic acid, dimer acid 'maleic anhydride, maleic acid, fumaric acid, itaconic acid, tumconic acid, mesaconic acid, cyclohexane Acidic acid such as dibasic acid, 4-pyruvic acid, hexanyl vinegar or lactic acid. Further, the 'alcohol component' may, for example, be ethylene glycol, diethylene glycol, 1,3-propanediol, neopentyl glycol, 1,6-hexanediol, cyclohexanedimethanol, triethylene glycol or polyethylene glycol. , an ethylene oxide adduct of polypropylene glycol, polytetramethylene glycol, bisphenol A or bisphenol S, and the like. Further, a trifunctional compound such as trimellitic acid, trimesic acid, pyromellitic acid, trihydroxydecylpropane, glycerin or pentaerythritol can be used in a small amount. These copolymerizable components may be used in combination of two or more kinds. When two or more kinds of these crystalline aromatic polyesters are used in combination, the mixing ratio is considered to be the crystallinity of the (B1) resin, and may be appropriately selected. The crystalline aromatic polyester (B1) can be produced by a known method. For example, a method in which a lower alcohol diester of a monocarboxylic acid and an excessive amount of a low molecular weight diol are subjected to an exchange reaction in the presence of a catalyst to obtain a condensation reaction of the obtained reaction product. Alternatively, for example, a method in which a dicarboxylic acid and an excess amount of a diol are subjected to a transesterification reaction in the presence of a catalyst to obtain a condensation reaction of the obtained reaction product. ^Polymerized polyester contains a monomer or oligomer, a by-product B or tetrahydrogen, etc., so if it is directly used for hot pressing, it causes such a problem that it moves to the substrate. Therefore, it is preferred to use a raw material which is solid-phase polymerized at a temperature of 2 〇〇 ° C or more under reduced pressure or emotional body. 322464 13 201119854 <1,4-cyclohexanedimethanol copolymerized polyethylene terephthalate (B2)> 1,4-cyclohexanedimethanol copolymerized polyethylene terephthalate (hereinafter, The abbreviation "CHDM-PET" is a PET copolymer in which one part of ethylene glycol is substituted with cyclohexane dimethanol. In order to increase the degree of amorphization of the polyester (B) layer and to satisfy the embedding property at the time of hot pressing, the 1,4-cyclohexanedimethanol component is contained in an amount of 1% by mole or more, preferably 12%, based on the total diol component. Mole% or more, more preferably 15 mol% or more. Further, if the 14-cyclohexanedi-p-ol component is too much, the film tends to have a lack of heat resistance, and the upper limit is preferably 5 〇 mol%, more preferably 45 mol% or less, and most preferably 4 〇 mol% or less. Specific examples of such CHDM-PET include, for example, Eastman.
Chemical 公司製「PETG 6763」等。 聚酯系彈性體(A)、結晶性芳香族聚酯㈤)及 CHDM-PET(B2)係可在無損及實用性的範圍,添加熱安 定劑、抗靜電劑、結晶造核劑等。其中,宜含有熱安定劑。 熱安定劑宜為5價或/及3價的鱗化合物、或阻紛系化合 等。 本發明之離型膜係宜聚酯系彈性體(A)層的厚度為5 至5—。聚I系彈性體⑷層之厚度未達5二膜製 造時的樹脂押出時,(A)層肖⑻層之間的流動均衡亞 化,易產生流痕,易成為製膜困難。若超過 性易不足。 聚醋系彈性體U)層的厚度更宜為1〇至3〇鋒。此 處所謂之(A)層的厚度如2種3層構成時,含有⑷展 2層以上時為其1層分的厚度。 a 322464 14 201119854 本發明之離型膜係宜聚酯(B)層的厚度為15至160 // m。若聚酯(B)層之厚度未達15/zm,在常溫之軟質的 (A)層相對地變厚,由於膜之本體變弱,捲取膜時易有 皺折,或熱壓時之柔軟性不充分,故招致埋入性的降低。 若超過160# m,膜製造時的樹脂押出時,(A)層與(B) 層之間的流動均衡惡化,易產生流痕,有製膜困難之傾向。 聚酯(B)層之厚度更宜為20至100/im。 本發明之離型膜宜全體之厚度為30/zm至200//m。 全體之厚度低於30//m,薄片之強度、剛性易降低,處理 易變困難。另外,若超過200# m,於熱壓時之印刷基板的 表面圖型之追蹤性易降低,有時不適於具有微細的圖型之 印刷基板製造。全體之厚度更宜為30/zm至150#m,最 宜為 40 # m 至 100 /z m。 本發明之離型膜較佳的構成,可舉例如使用聚酯系彈 性體(A)與聚酯(B)之(A)/(B)/(A)的2種3層構成,或(A)/(B) 的2種2層構成。但,不限定於此,而(A)層若配置於表層, 進一步亦可具有其他之層。 (A) / (B) / (A)之2種3層構成的較佳厚度構成 比率為1/2/1至1/5/1。若為此範圍,(B)層可充分發揮作 為(A)層之支撐層的功能,且可兼具在高溫之熱壓時的 耐熱性與埋入性等。 其次,說明有關本發明之離型膜的製造方法。 有關本發明之離型膜的製造中係宜採取以共押出T模 頭法製膜之方法。若依此方法,易調控各層之厚度、或使 15 322464 201119854 (A)層為所希望的結晶化狀態。 在本發明之離型膜的製造中,就賦予膜特定的熱特 性,提昇耐熱性、離型性 '尺寸安定性之目的,必須設有 結晶化步驟。結晶化方法可舉例如加熱結晶化、配向結晶 化。但,由於在熱壓之用途中在高溫的尺寸安定性為必要 的:故無實質上配向,宜藉加熱結晶化。加熱結晶化之方 法係從T模頭押出後與冷卻同時地結晶化之方法,在調控 步驟之簡便性或膜品質之點為佳。與冷卻同時地結晶化 時,考量結晶化速度而必須適切設定澆鑄輥之溫度。其溫 度若為本發明之樹脂構成,宜為50至i0(rc,更宜為5〇 至8〇°C。又,為了調控離型性與埋入性,必須使成為離型 層之聚酯系彈性體(A)配置於澆鑄輥侧。 。本發明之離型膜係18〇t之熱收縮率在MD方向中宜 為2%以下,更宜為丨5%以下。在TD方向中宜為以下, 更宜為〇.5%以了。若為如此之熱收縮率,即使熱壓時與熱 板接觸,胃録變成皺折,製造印刷基板時之耐熱性與尺 寸安定性良好。 μ '、 在本發明的離型膜中,配置於表層之聚酯系彈性體 (Α)層的表面狀態係依用途,可為平滑,為了作業性, 亦可賦予滑性、抗壓黏性。χ,以熱壓成料之去空氣作 為=的,可於膜之至少單面設有適度的壓花花紋。為此之 壓花加工係可使用被表面加工之澆鑄輥。 本發明之離型臈係高溫熱壓時之埋入性、耐熱性、離 型性、非污染性優異,又,可安全且容易地廢棄處理。因 322464 16 201119854 此’本發明之離型膜係在印刷電路基板、可撓性印刷電路 基板、或多層印刷電路板等之製造步驟中,經由預浸體或 耐熱膜而熱壓銅箔層合板或銅箔時,可適宜使用來作為防 止與壓熱板、印刷電路基板、可撓性印刷電路基板、多層 印刷電路板等之黏著的離型膜。又,在可撓性印刷電路基 板之製造步驟中,藉熱壓成形使覆蓋膜以熱硬化性黏著劑 黏著時’亦可適宜使用來作為防止覆蓋膜與熱壓板之黏 著、或覆蓋膜間之黏著的離型膜。 [實施例] 以下,依據實施例而說明本發明。但,本發明係不限 定於以下之實施例。 (Α)聚酯系彈性體Chemical company "PETG 6763" and so on. The polyester elastomer (A), the crystalline aromatic polyester (5), and the CHDM-PET (B2) can be added with a heat stabilizer, an antistatic agent, a crystal nucleating agent, and the like in a non-destructive and practical range. Among them, it is preferred to contain a heat stabilizer. The heat stabilizer is preferably a 5-valent or/and trivalent scaly compound or a chelating compound. The release film of the present invention is preferably a polyester elastomer (A) layer having a thickness of 5 to 5 Å. When the thickness of the poly-I-based elastomer (4) layer is less than 5 when the resin is extruded, the flow between the layers (A) of the layer (A) is balanced and the flow marks are easily generated, which makes it difficult to form a film. If the excess is not enough. The thickness of the layer of the vinegar-based elastomer U) is more preferably from 1 〇 to 3 〇. Here, the thickness of the layer (A) is two layers of three layers, and the thickness of the layer (1) is two layers or more. a 322464 14 201119854 The release film of the present invention is preferably a polyester (B) layer having a thickness of 15 to 160 // m. If the thickness of the polyester (B) layer is less than 15/zm, the soft (A) layer at room temperature is relatively thicker, and since the body of the film becomes weak, the film is easily wrinkled when being wound up, or when hot pressed The softness is insufficient, resulting in a decrease in embedding. When it exceeds 160 #m, when the resin at the time of film production is extruded, the flow balance between the (A) layer and the (B) layer is deteriorated, flow marks are likely to occur, and film formation tends to be difficult. The thickness of the polyester (B) layer is more preferably from 20 to 100 / im. The release film of the present invention preferably has a thickness of from 30/zm to 200/m. When the thickness of the whole is less than 30/m, the strength and rigidity of the sheet are liable to be lowered, and the handling is difficult to change. Further, when it exceeds 200 # m, the traceability of the surface pattern of the printed substrate at the time of hot pressing is liable to be lowered, and it is not suitable for the production of a printed circuit board having a fine pattern. The thickness of the whole is preferably from 30/zm to 150#m, and most preferably from 40 #m to 100/z m. The preferred structure of the release film of the present invention may be, for example, two or three layers of (A)/(B)/(A) of the polyester elastomer (A) and the polyester (B), or Two types of two layers of A)/(B). However, the layer (A) is not limited to this, and the layer (A) may have other layers if it is disposed on the surface layer. The preferred thickness composition of the two types of three layers of (A) / (B) / (A) is 1/2/1 to 1/5/1. In this range, the layer (B) can sufficiently function as a support layer of the layer (A), and can have heat resistance and embedding property at the time of hot pressing at a high temperature. Next, a method of producing the release film of the present invention will be described. In the production of the release film of the present invention, a method of forming a film by a co-extrusion T-die method is preferred. According to this method, it is easy to adjust the thickness of each layer, or to make 15 322464 201119854 (A) layer the desired crystallization state. In the production of the release film of the present invention, it is necessary to provide a crystallization step for the purpose of imparting specific heat characteristics to the film and improving heat resistance and release property. The crystallization method may, for example, be a heating crystallization or an alignment crystallization. However, since dimensional stability at high temperatures is necessary in the application of hot pressing, there is no substantial alignment, and it is preferable to heat crystallization. The method of heating and crystallization is preferably a method of crystallization from the T die and cooling at the same time as cooling, and is preferable in terms of the simplicity of the control step or the film quality. When crystallizing at the same time as cooling, the crystallization rate is considered and the temperature of the casting rolls must be appropriately set. The temperature is preferably 50 to i0 (rc, more preferably 5 to 8 ° C.) in order to adjust the release property and embedding property, and the polyester which becomes the release layer must be used. The elastic body (A) is disposed on the side of the casting roll. The heat shrinkage rate of the release film of the present invention is preferably 2% or less in the MD direction, more preferably 丨 5% or less. For the following, it is more preferably 5%. If it is such a heat shrinkage rate, even if it is in contact with the hot plate during hot pressing, the stomach record becomes wrinkled, and the heat resistance and dimensional stability when manufacturing the printed substrate are good. In the release film of the present invention, the surface state of the polyester-based elastomer layer disposed on the surface layer can be smooth depending on the application, and the slip property and the pressure-resistant property can be imparted for workability. χ, the air is removed by hot pressing as the =, and a moderate embossing pattern can be provided on at least one side of the film. For this embossing process, a surface-processed casting roll can be used. It is excellent in embedding property, heat resistance, release property, and non-contamination property when it is hot pressed at high temperature, and can be disposed of safely and easily. 322464 16 201119854 The release film of the present invention is a hot-pressed copper foil laminate via a prepreg or a heat-resistant film in a manufacturing process such as a printed circuit board, a flexible printed circuit board, or a multilayer printed circuit board. In the case of a copper foil, it can be suitably used as a release film which is adhered to a hot plate, a printed circuit board, a flexible printed circuit board, a multilayer printed circuit board, etc. Further, in the manufacture of a flexible printed circuit board. In the step, when the cover film is adhered by a thermosetting adhesive by hot press forming, it may be suitably used as a release film for preventing adhesion between the cover film and the hot press plate or adhesion between the cover films. Hereinafter, the present invention will be described based on examples. However, the present invention is not limited to the following examples. (Α) Polyester elastomer
(A-l) HYTREL 5557 : Toray Dupont 公司製、Tm 208 °C、Tg _20°C(A-l) HYTREL 5557 : Toray Dupont, Tm 208 °C, Tg _20°C
(A-2) HYTREL 6347 : Toray Dupont 公司製、Tm 221 °C > Tg 3°C(A-2) HYTREL 6347 : Toray Dupont, Tm 221 °C > Tg 3°C
(A-3) HYTREL 7247 : Toray Dupont 公司製、Tm 221 °C ' Tg 12°C(A-3) HYTREL 7247 : manufactured by Toray Dupont, Tm 221 °C ' Tg 12 ° C
(A-4) HYTREL 6347M : Toray Dupont 公司製、Tm 215 °C > Tg 3°C(A-4) HYTREL 6347M : Toray Dupont, Tm 215 °C > Tg 3 °C
Tm意指熔點,Tg意指玻璃轉移溫度。以下,相同。 上述4種之聚酯系彈性體係任一者均為聚對苯二曱酸 丁二酯與聚醚之嵌段共聚物。 (B1)結晶性芳香族聚酯 322464 17 201119854Tm means melting point and Tg means glass transition temperature. The following is the same. Any of the above four polyester-based elastic systems is a block copolymer of polybutylene terephthalate and polyether. (B1) crystalline aromatic polyester 322464 17 201119854
(B1-1)聚對苯二曱酸丁二酯:三菱Engineering Plastic 公司製「Novaduran 50IOCS」、Tm 223°C、Tg 34°C (B1-2 )聚對苯二甲酸丙二酉旨;Shell Chemical Japan 公司製「Corterra 9200」、Tm 223°C、Tg 52〇C(B1-1) Polybutylene terephthalate: "Novaduran 50IOCS" manufactured by Mitsubishi Engineering Plastics Co., Ltd., Tm 223 ° C, Tg 34 ° C (B1-2 ) Polybutylene terephthalate; Shell "Corterra 9200" manufactured by Chemical Japan, Tm 223°C, Tg 52〇C
(Bl-3)聚對苯二甲酸乙二酯;日本Ester公司製 「NEH-2050」、Tm 255°C、Tg : 80°C(Bl-3) Polyethylene terephthalate; "NEH-2050" manufactured by Ester Co., Ltd., Tm 255 ° C, Tg: 80 ° C
(Bl-4 )間笨二曱酸4 mol%共聚合聚對苯二曱酸乙二 酯、Tm 246°C、Tg : 75°C (B2) CHDM-PET • Eastman Chemical 公司製「PETG 6763」、Tg 80〇C (C)其他(Bl-4) stearic acid 4 mol% copolymerized polyethylene terephthalate, Tm 246 ° C, Tg: 75 ° C (B2) CHDM-PET • "PETG 6763" manufactured by Eastman Chemical Co., Ltd. , Tg 80〇C (C) other
•聚曱基戊烯:三井化學公司製「DX 845」、Tm 233 °C ' Tg 20°C 將各種測定法及評估表示於以下。 使用微分掃描型熱量計(Perkin Elmer公司製「Pyrisl DSC」),使試樣l〇mg以速度20。(:/分昇溫至260°C,測定 玻璃轉移溫度(Tg)、熔點(Tm)、結晶熔解熱量。 進一步,以260°C維持3分鐘後,以速度20。(:/分冷卻,測 定結晶化譜峰溫度(Tc)。以熔點與降溫時結晶化譜峰溫度 之差為結晶化速度指標。 熔點(Tm)、玻璃轉移溫度(Tg)、結晶化速度指標之 測定中的試樣係使原料樹脂一次熔融後,急冷而得到之非 晶化的試樣。(A)層之結晶熔解熱量係使用聚酯系彈性體 (A)單獨樹脂’使厚度、押出速度、澆鑄輥溫度與層合 18 322464 201119854 膜同條件之做法而製作單層膜試樣,使用此而測定。即使 在(B)層之結晶熔解熱量中,同樣地,使結晶性芳香族 聚酯(B1)與CHDM-PET (B2)摻混之樹脂以與層合膜 相同之製造條件製作單層膜試樣,使用此而測定。 <製膜作業性> 依據以下之基準而評估切割所得到之膜端部後之輥 捲取性、〇為合格(良好)。 〇:於輥捲取性無問題。 △:輥捲取時少許皺折 X :輥捲取時無皺折,很難捲取 <耐熱性、中間層非滲出性、埋入性、離型性> 於雙面塗佈有20#m之環氧系黏著劑(東亞合成公司 製「AS-60」)之厚25 # m聚酿亞胺膜(Dupont公司製「Kapton 100V」)的兩側,層合厚35#m的銅箔,製作3層型式的 銅箔層合板。於其單面搭載以塗布有20/z m環氧系黏著劑 (東亞合成公司製「AS-60」)之厚25/zm聚醯亞胺薄膜 (Dupont公司製「Kapton 100V」)作為覆蓋膜,進一步, 以供測試用之離型膜挾住其兩側。此時,以離型膜之聚酯 系彈性體(A)面成為内側之方式配置。其後,以溫度180 °C、壓力3MPa熱壓5分鐘。熱壓後,從熱壓裝置迅速地 取出而放冷後,剝離離型膜。有關其時之狀況,依據以下 之基準,進行财熱性、中間層非滲出性、埋入性、離型性 之評估。〇以上判定為合格(良好)。此時,覆蓋膜係開啟 直徑5mm之真圓狀的孔,使用於黏著劑之滲出的評估。 19 322464 201119854 (耐熱性) 〇:於熱壓後之膜看不出皺折。 △:於熱壓後之膜可看出稍微皺折。 X :於熱壓後之膜可看出顯著皺折。 (中間層非滲出性) 〇:從熱壓後之膜端部看不出中間層聚合物之滲出 △:從熱壓後之膜端部可看出中間層聚合物之滲出 X :從熱壓後之膜端部可明顯看出中間層聚合物之滲 出,可看到於層合板或壓熱板的聚合物附著。 (埋入性) 以顯微鏡觀察覆蓋膜孔部之黏著劑的滲出長度,依據 以下之基準而評估。 ◎:黏著劑之滲出長度為50 # m以下 〇:黏著劑之滲出長度為超過50#m、70/zm以下 △:黏著劑之滲出長度為超過70 # m、100 # m以下 X:黏著劑之滲出長度為超過100 # m (離型性) ◎:無阻抗地剝離 〇:略有阻抗,但於層合板無影響地剝離 △:有阻抗,但層合板無變形地剝離 X:阻抗強,剝離時伴隨層合板之變形 <财污染性> 使用熱脫黏GC-MS,以180°C、10分鐘之加熱從膜產 生的氣體使用無極性毛細管而分離,使所檢測出之譜峰總 20 322464 201119854 面積的己烷換算量以膜重量規格化,以此作為釋氣產生 量。釋氣產生量宜為很少的程度,400ppm以下判斷為合格 ‘ (良好)。 <熱收縮率> 依如下之順序測定膜MD方向及TD方向的熱收縮率。 將試樣膜切割成10mmxl50mm,再以成為間隔100mm 之方式製作已置入2條標線的試驗片5個。 所得到之試驗片在無荷重下於170°C的烘箱中熱處理 30分鐘後,取出試驗片而返回室溫而測定標線間距離。依 下式求出熱收縮率,以5條平均值作為各試樣膜的熱收縮 率0 熱收縮率(%) = (L-L,)/Ax 1000 L:熱處理前之標線間距離(mm)、L’:熱處理後之標線 間距離(mm)。 [實施例1] 對2台的獨立押出機,分別供給A-2作為(A)層樹 脂,供給B1-1與B2以成為40/60的質量比作為(B)層 樹脂,任一層之樹脂皆以260°C熔融混練。使各別之熔融 體在抵達T模頭的出口之前合流層合成A/B/A之3層狀之 後★從T模頭出口押出,密著於已調整至80°C之澆鑄輥而 冷卻,得到層厚為A/B/A=20/60/20 (#m)的層合膜。於 澆鑄報之密著時間為4秒。 [實施例2至12、比較例1至5] 相較於實施例1,使(A)層及(B)層之各層所使用 21 322464 201119854• Polydecylpentene: "DX 845" manufactured by Mitsui Chemicals Co., Ltd., Tm 233 °C 'Tg 20 °C Various measurement methods and evaluations are shown below. The sample was centrifuged at a speed of 20 using a differential scanning calorimeter ("Pyrisl DSC" manufactured by Perkin Elmer Co., Ltd.). (: / / The temperature was raised to 260 ° C, and the glass transition temperature (Tg), the melting point (Tm), and the heat of crystal melting were measured. Further, after maintaining at 260 ° C for 3 minutes, the temperature was 20. (: / minute cooling, measurement of crystals The peak temperature (Tc) of the peak is the crystallization rate index when the melting point and the temperature of the crystallization peak are lowered. The sample in the measurement of the melting point (Tm), the glass transition temperature (Tg), and the crystallization rate index is The raw material resin is once melted and then quenched to obtain an amorphized sample. The heat of crystal melting of the layer (A) is a polyester elastomer (A) alone resin 'thickness, extrusion speed, casting roll temperature and lamination 18 322464 201119854 A single-layer film sample was prepared by the same method as the condition, and was measured using this. Even in the heat of crystal melting of the (B) layer, the crystalline aromatic polyester (B1) and CHDM-PET were similarly obtained. (B2) The resin to be blended was produced by the same production conditions as those of the laminated film, and was measured using the same. <Film forming workability> After the film end portion obtained by cutting was evaluated based on the following criteria The roll take-up and 〇 are qualified (good). There is no problem with the take-up of the roll. △: A little wrinkle when the roll is taken up. X: There is no wrinkle when the roll is taken up, it is difficult to take up < heat resistance, non-exudation of the intermediate layer, embedding property, release property> Both sides of the thick 25 # m polyimine film ("Kapton 100V" manufactured by Dupont Co., Ltd.) of 20#m epoxy-based adhesive ("AS-60" manufactured by Toagosei Co., Ltd.) were coated on both sides. A copper foil having a thickness of 35 #m was used to produce a three-layer copper foil laminate, and a thickness of 25/zm epoxy-based adhesive ("AS-60" manufactured by Toagosei Co., Ltd.) was applied to one surface thereof. A zm polyimide film ("Kapton 100V" manufactured by Dupont Co., Ltd.) was used as a cover film, and further, a release film for testing was stuck on both sides thereof. At this time, a polyester elastomer (A) which is a release film was used. The surface was placed on the inner side. Thereafter, the surface was heat-pressed at a temperature of 180 ° C and a pressure of 3 MPa for 5 minutes. After hot pressing, the film was quickly taken out from the hot press device and allowed to cool, and then the release film was peeled off. According to the following criteria, the evaluation of the heat, the non-exudation, the embedding, and the release property of the intermediate layer is carried out. The above is judged as qualified (good). The cover film is a true round hole with a diameter of 5 mm, which is used for the evaluation of the exudation of the adhesive. 19 322464 201119854 (Heat resistance) 〇: The film does not show wrinkles after hot pressing. △: After hot pressing The film can be slightly wrinkled. X: Significant wrinkles can be seen in the film after hot pressing. (Intermediate layer non-exudative) 〇: No seepage of the intermediate layer polymer is observed from the end of the film after hot pressing. : The exudation of the interlayer polymer can be seen from the end of the film after hot pressing. X: The exudation of the interlayer polymer can be clearly seen from the end of the film after hot pressing, which can be seen in the laminate or the hot plate. The polymer is attached. (Embedded property) The exudation length of the adhesive in the pore portion of the coating film was observed under a microscope, and evaluated based on the following criteria. ◎: The exudation length of the adhesive is 50 #m or less. 渗: The exudation length of the adhesive is more than 50#m, 70/zm or less. △: The exudation length of the adhesive is more than 70 # m, 100 # m or less X: Adhesive The bleed length is more than 100 # m (release property) ◎: detachment without resistance 〇: slightly impedance, but peeling off without affecting the laminate △: impedance, but the laminate is peeled without deformation X: strong impedance, Deformation accompanying the laminate at the time of peeling <Contamination"> Using a thermal debonding GC-MS, the gas generated from the film was heated at 180 ° C for 10 minutes using a non-polar capillary to separate the detected peaks Total 20 322464 201119854 The amount of hexane in the area is normalized by the film weight as the amount of outgassing. The amount of outgassing should be a small amount, and it is judged to be qualified below 400 ppm ‘(good). <Heat Shrinkage Ratio> The heat shrinkage ratio in the film MD direction and the TD direction was measured in the following order. The sample film was cut into 10 mm x 150 mm, and five test pieces on which two lines were placed were prepared at intervals of 100 mm. The obtained test piece was heat-treated in an oven at 170 ° C for 30 minutes under no load, and the test piece was taken out and returned to room temperature to measure the distance between the lines. The heat shrinkage rate was determined according to the following formula, and the five average values were used as the heat shrinkage ratio of each sample film. 0 Heat shrinkage ratio (%) = (LL,) / Ax 1000 L: Distance between the lines before heat treatment (mm) , L': distance between the marked lines after heat treatment (mm). [Example 1] A pair of independent extruders were supplied with A-2 as the (A) layer resin, and B1-1 and B2 were supplied to have a mass ratio of 40/60 as the (B) layer resin, and the resin of either layer. They are all melt-kneaded at 260 °C. After the respective melts are combined into the three layers of A/B/A before reaching the exit of the T-die, ★ are extruded from the exit of the T-die, and are cooled by a casting roll adjusted to 80 ° C, and cooled. A laminated film having a layer thickness of A/B/A = 20/60/20 (#m) was obtained. The sealing time of the casting is 4 seconds. [Examples 2 to 12, Comparative Examples 1 to 5] Compared with Example 1, the layers of the layers (A) and (B) were used. 21 322464 201119854
的樹脂之種類、B層之㈤)(叫的調配比率、層厚度 構成變更成如表… XThe type of the resin, the B layer (5)) (the ratio of the blending ratio, the thickness of the layer is changed to a table... X
比較例1至5係以2:二"至7、實施例10、 _ '、 C炫融’貫施例8至9係以280°C 溶融而從T模頭出口細山 ^ j 出押出。所押出之樹脂係密著於已調整 至表卜3所示之溫度的洗鑄輥。其他之條件係與實施们 同樣做法,得到具有A/B/A之構成的2種3層之層合膜。 於澆鑄輥之密著時間為4秒。 .、 [實施例13] t對2台的獨立押出機,分別供給A-2作為⑷層樹 曰供、.。B1-1與B2以成為4〇/6〇的質量比作為(b)層 任-狀難Μ 26叱熔融鱗。使各別之㈣ 在抵達T模頭的出口之前合流層合成A/B之2層狀之 =’從^頭出口押出,密著於已調整至8〇〇c之洗_而 =二到層厚為趟销Q(#m)的層合膜。於 輥之密著時間為4秒。 巧 [實施例14至15、比較例6] 相較於實施例13’使⑷層及(B)層之各層所使 的树月曰之種類、B層之調配比率、層厚度構成變更成如 '3記載。繼而使之以26(TC熔融而從τ模頭出口押 出也者於已調整至表2至3所示之溫度的洗轉親。盆他 之條件係與實施例i同樣做法,得到具有趟之構成的2 種2層之層合薄膜。於洗鑄輥之密著時間為4秒。 [比較例7至10] 於押出機供給表3所示之樹脂,以26〇t炫融混練而 322464 22 201119854 =出’密著於已4整至表3所示之溫度的洗鎊輥而冷卻, 得到具有表3所示之厚度的單層膜。於麟報之 ^秒、。又,在比較例7至1()中所製作的膜係為單層二間 文無法進仃中間層之非滲出的評估。 、 將實1至15 '比較例i至1〇之層 率、各種特性、性能評估結果表示於表i至3 B層調配比率表示質量比率。 在各表中, 322464 23 201119854 實施例12 A/B/A 10/50/10 A-2 40/60 S a CO § CO 00 CM 00 in 〇 〇 〇 〇 〇 S I__I -0.3 實施例11 A/B/A 50/100/50 A-2 B1-1 40/60 g a CO 3 K CNJ CM CO CNJ oo ιο 〇 〇 〇 0 ◎ 〇 C) 5 實施例10 A/B/A 5/20/5 A-2 B1-1 40/60 s a CO ? R CNJ CO CM c〇 m 〇 〇 〇 0 0 I Ο 實施例9 A/B/A 20/60/20 A-2 B1-4 40/60 § δ CO 5 240 s σ> in 〇 0 〇 ◎ 〇 § I is -0.7 實施例8 A/B/A 20/60/20 A-2 B1-3 40/60 § § CO 9 s 250 CO CO P 〇 〇 〇 〇 ◎ S 1.8 ! -0.7 實施例7 A/B/A 20/60/20 A-2 B1-2 40/60 g a CO o S csi in CSi 00 CO 〇 〇 〇 〇 〇 160 m -0.5 實施例6 A/B/A 20/60/20 A-2 B1-1 10/90 g a CO s CO 00 〇 〇 〇 ◎ 〇 〇 q -0.4 實施例5 A/B/A 20/60/20 A-2 B1-1 50/50 g a CO K a s s 〇 〇 〇 〇 ◎ 2 σ 實施例4 A/B/A 20/60/20 A-4 B1-1 40/60 g 刁 o s s a CO CSi CO in 〇 〇 〇 〇 ◎ 〇 α7 CNJ 實施例3 A/B/A 20/60/20 A-3 B1-1 40/60 g n SJ CM 穿 3 a a CO in 〇 〇 〇 〇 ◎ 〇 0) g 實施例2 A/B/A 20/60/20 A-2 B1-1 40/60 8 a CO K S CO CM 00 to 0 〇 〇 ◎ ◎ 0.8 Ο 實施例1 A/B/A 20/60/20 A-2 B1-1 40/60 § a CO OT K a CO CM CO LO 0 〇 〇 〇 〇 S ί 15 CO 層構成 層厚度(/im) A層樹脂 結晶性芳香族聚酯(Bl) B層&合質量比率(B1)/(B2) j 澆鑄輥溫度(°c) Tm(°C) Tg(°c) 結晶化速度指標(°c) Tm(°C) Tg(°C) 製膜作業性 耐熱性 中間層非滲出性 埋入性 離型性 污染性(釋氣ppm) f MD方向熱收縮率00 1 TD方向熱收缩率(X) QQ 樹脂 B oa 性能 評估 24 322464 201119854 【表2】 實施例13 實施例14 實施例15 層構成 A/B A/B A/B 層厚度(//m) 30/70 10/40 20/60 A層樹脂 A-2 A-3 A-4 B層 結晶性芳香族聚酯(B1) BH B1-1 B1-1 樹脂 B層配合質量比率(B1)/(B2) 40/60 40/60 40/60 澆鑄輥溫度(°C) 80 80 60 Tm(°C) 221 223 215 A層 Tg(°C) 3 12 3 結晶化速度指標rc) 48 46 25 ZlHm(J/g) 37 43 38 Tm(°C) 221 221 221 B層 ZlHm(«J/g) 28 28 28 Tg(°C) 58 58 58 製膜作業性 〇 〇 〇 财熱性 〇 〇 〇 中間層非滲出性 〇 〇 〇 性能 埋入性 ◎ 〇 ◎ 評估 離型性 〇 ◎ ◎ 财污染性(釋氣ppm) 160 110 140 MD方向熱收縮率(%) 1.7 1.4 1.2 TD方向熱收缩率(9〇 0.2 0.4 0.1 25 322464 201119854 【e<】 比較例10 < g B1-l/B2=40/60 I g CM S in CO csj I 〇 X ◎ X 180 T— C'i Ό.5 比較例9 < 8 T— Ο I g 233 in CO I I 〇 〇 〇 ◎ — 1400 ! 0.8 5 比較例8 < S Β1-1 I I § n Si § !〇 I I i 〇 〇 1 X ◎ S *— 0.6 5 比較例7 8 Α-2 I I § δ CO I I I X l <\ < I < 〇 § 0.8 比較例6 A/B 30/70 Α-1 B1-1 40/60 § 200 翁 CO CNi GO CM s < X ϊ < 〇 ◎ X 〇 T— 2_3 -0.7 比較例5 A/B/A 20/60/20 5 B1-1 40/60 § 200 o 00 csi a 00 CM S < X l < 〇 ◎ X 〇 1.8 -0.3 比較例4 A/B/A 20/60/20 Α-2 B1-1 60/40 s δ CO S 〇 s 〇 〇 〇 X 1 < 〇 0.9 5 比較例3 A/B/A 20/60/20 Α-2 i 0/100 § 222 CO !? 3 I 〇 g 〇 <1 X ◎ 〇 S Ί— 2.4 〇. 比較例2 A/B/A 20/60/20 Α-2 B1-1 100/0 § τ— CM OJ CO 吞 CO s OJ ΙΛ 荛 〇 〇 〇 X 〇 § 0.8 〇 比較例1 A/B/A ! 20/60/20 Β1-1 I 5 100/0 § 223 Ο g CM CO CM I 〇 〇 〇 X 1 <1 ◎ 〇 T— 5 層構成 | 層厚度(jum) | Α層樹脂 結晶性芳香族聚酯(Bl) B層配合質量比率(B1)/(B2) I 澆鑄輥溫度(°c) Tm(°C) Tg(°C) I 結晶化速度指標rc) ZlHm (J/g) Tm(°C) Tg(°C) 製膜作業性 耐熱性 中間層非滲出性 埋入性 離型性 耐污染性(釋氣ppm) MD方向熱收缩率(¾) , TD方向熱收缩率(9〇 CQ 樹脂 CO 性能 評估 26 322464 201119854 ^實鈀例1至15之薄片係各種特性在本發明所規定之 _内’故完全滿^作為離型臈之要求性能。尤其,高溫 熱壓時之離型性及埋入性優異,故亦可應付具有精密的圖 3L之印刷基板,且,釋氣亦少,耐污染性亦優異者。 比較例1係離型層為聚對苯二甲酸丁二醋、中間層為 聚醋系彈性體。因此,離型性雖良好,但玻璃轉移溫度與 結晶炫解熱量高’故埋入性差。 —比較例2係離型層為聚醋系彈性體、中間層為聚對苯 一甲酸丁二酯。因此,結晶熔解熱量高而埋入性差。 比較例3係於中間層不含有結晶性芳香族聚醋,故中 間層為非晶狀態。因此,埋入性雖良好,但耐熱性差,尤 其源自中間層之聚合物的渗出很明顯。 比較例4係中間層之結晶性芳香族聚酯之含量過大, 由於中間層之結晶性太高,故埋入性差。 比較例5、6係離型層之玻璃轉移溫度太低,故埋入 性雖良好,但耐熱性或離型性差,在製膜時之捲取中於膜 有敵折。 比較例7係聚酯系彈性體單層,不具有中間層之聚酯 層,故膜之本體弱,製膜作業性差,又,熱壓時之柔軟性 不足,故埋入性亦不充分。 比較例8係聚對苯二甲酸丁二酯單層,由於結晶性太 高,故離型性或耐熱性雖良好,但埋入性差。 比較例9係由廣泛使用來作為離型膜之聚甲基戍烯所 構成的膜,但’釋氣產生置明顯多達本發明之膜的約1〇 322464 27 201119854 倍,為耐汙染性差者。 比較例ίο係不具有由聚酯系彈性體所構成之離型 層。因此,熱壓時之埋入性雖優異,但膜之結晶性低,故 耐熱性或離型性差。 【圖式簡單說明】 無。 【主要元件符號說明】 無。 322464 28Comparative Examples 1 to 5 were carried out at 2:2 < to 7, Example 10, _ ', C, and the examples 8 to 9 were melted at 280 ° C and exited from the T die exit. The resin to be extruded is adhered to a washing roll which has been adjusted to the temperature shown in Table 3. The other conditions were the same as those of the implementers, and two types of three-layer laminated films having a structure of A/B/A were obtained. The adhesion time of the casting rolls was 4 seconds. [Embodiment 13] t pairs of two independent extruders, respectively, are supplied with A-2 as a (4) layer tree. B1-1 and B2 have a mass ratio of 4 〇 / 6 作为 as (b) layer - 状 状 Μ 叱 26 叱 叱 。 。 Make each of the (4) stratified A/B layer 2 before the exit to the T die = 'Exit from the ^ head exit, close to the wash that has been adjusted to 8〇〇c~==2 to the layer A laminate film with a thickness of 趟Q (#m). The adhesion time of the roller was 4 seconds. [Examples 14 to 15 and Comparative Example 6] The type of the tree scorpion, the blending ratio of the layer B, and the layer thickness of each layer of the (4) layer and the (B) layer were changed to, for example, the same as in the embodiment 13'. '3 records. Then, it was made 26 (the TC melted and was ejected from the τ die outlet, and was also adjusted to the temperature shown in Tables 2 to 3. The conditions of the pot were the same as in Example i, and it was obtained. Two kinds of two-layer laminated films were formed. The adhesion time of the washing rolls was 4 seconds. [Comparative Examples 7 to 10] The resin shown in Table 3 was supplied to the extruder, and the mixture was condensed at 26 〇t and 322464. 22 201119854 = Cooling was carried out with a pound-washing roller adhered to the temperature shown in Table 4 to obtain a single-layer film having the thickness shown in Table 3. In the case of Lin, it was measured in seconds. The films produced in Examples 7 to 1 () are evaluated as non-bleeding of the single layer and the second layer. The layer ratio, various characteristics, and properties of the samples 1 to 15 'Comparative Examples i to 1' will be obtained. The results of the evaluation are shown in Tables i to 3. The B blend ratio shows the mass ratio. In each table, 322464 23 201119854 Example 12 A/B/A 10/50/10 A-2 40/60 S a CO § CO 00 CM 00 in 〇〇〇〇〇S I__I -0.3 Example 11 A/B/A 50/100/50 A-2 B1-1 40/60 ga CO 3 K CNJ CM CO CNJ oo ιο 〇〇〇0 ◎ 〇C 5 Example 10 A/B/A 5/20 /5 A-2 B1-1 40/60 sa CO ? R CNJ CO CM c〇m 〇〇〇0 0 I 实施 Example 9 A/B/A 20/60/20 A-2 B1-4 40/60 § δ CO 5 240 s σ> in 〇0 〇◎ 〇§ I is -0.7 Example 8 A/B/A 20/60/20 A-2 B1-3 40/60 § § CO 9 s 250 CO CO P 〇〇〇〇◎ S 1.8 ! -0.7 Example 7 A/B/A 20/60/20 A-2 B1-2 40/60 ga CO o S csi in CSi 00 CO 〇〇〇〇〇160 m -0.5 Example 6 A/B/A 20/60/20 A-2 B1-1 10/90 ga CO s CO 00 〇〇〇 ◎ 〇〇q -0.4 Example 5 A/B/A 20/60/20 A -2 B1-1 50/50 ga CO K ass 〇〇〇〇◎ 2 σ Example 4 A/B/A 20/60/20 A-4 B1-1 40/60 g 刁ossa CO CSi CO in 〇〇 〇〇◎ 〇α7 CNJ Example 3 A/B/A 20/60/20 A-3 B1-1 40/60 gn SJ CM wear 3 aa CO in 〇〇〇〇 ◎ 〇 0) g Example 2 A/ B/A 20/60/20 A-2 B1-1 40/60 8 a CO KS CO CM 00 to 0 〇〇 ◎ ◎ 0.8 实施 Example 1 A/B/A 20/60/20 A-2 B1- 1 40/60 § a CO OT K a CO CM CO LO 0 〇〇〇〇S ί 15 CO layer layer thickness (/im) A layer resin crystalline aromatic polyester ( Bl) B layer & mass ratio (B1) / (B2) j casting roll temperature (°c) Tm (°C) Tg (°c) crystallization rate index (°c) Tm (°C) Tg (° C) Film-forming workability Heat-resistant intermediate layer Non-exudative Buried release pollution (released ppm) f MD direction heat shrinkage rate 00 1 TD direction heat shrinkage rate (X) QQ resin B oa Performance evaluation 24 322464 201119854 [Table 2] Example 13 Example 14 Example 15 Layer Composition A/BA/BA/B Layer Thickness (//m) 30/70 10/40 20/60 A layer resin A-2 A-3 A- 4 B layer crystalline aromatic polyester (B1) BH B1-1 B1-1 Resin B layer blending mass ratio (B1) / (B2) 40 / 60 40 / 60 40 / 60 casting roll temperature (°C) 80 80 60 Tm(°C) 221 223 215 A layer Tg(°C) 3 12 3 Crystallization speed index rc) 48 46 25 ZlHm(J/g) 37 43 38 Tm(°C) 221 221 221 B layer ZlHm(« J/g) 28 28 28 Tg(°C) 58 58 58 Film-making workability, heat-treating, intermediate layer, non-exudation, 〇〇〇 performance, embedding ◎ 〇 ◎ Evaluation of release 〇 ◎ ◎ Contaminant (released gas ppm) 160 110 140 MD direction heat shrinkage rate (%) 1.7 1.4 1.2 TD Thermal contraction rate (9〇0.2 0.4 0.1 25 322464 201119854 [e<>] Comparative Example 10 < g B1-l/B2=40/60 I g CM S in CO csj I 〇X ◎ X 180 T- C'i Ό.5 Comparative Example 9 < 8 T - Ο I g 233 in CO II 〇〇〇 ◎ - 1400 ! 0.8 5 Comparative Example 8 < S Β1-1 II § n Si § !〇II i 〇〇1 X ◎ S * - 0.6 5 Comparative Example 7 8 Α-2 II § δ CO IIIX l <\ < I < 〇§ 0.8 Comparative Example 6 A/B 30/70 Α-1 B1-1 40/60 § 200 CO CNi GO CM s < X ϊ < 〇◎ X 〇T-2_3 -0.7 Comparative Example 5 A/B/A 20/60/20 5 B1-1 40/60 § 200 o 00 csi a 00 CM S < X l < 〇 ◎ X 〇 1.8 -0.3 Comparative Example 4 A/B/A 20/60/20 Α-2 B1-1 60/40 s δ CO S 〇s 〇〇〇X 1 < 〇0.9 5 Comparative Example 3 A/B/A 20/60/20 Α-2 i 0/100 § 222 CO !? 3 I 〇g 〇<1 X ◎ 〇S Ί— 2.4 〇. Comparative Example 2 A/B/A 20/60/20 Α-2 B1-1 100/0 § τ— CM OJ CO CO s OJ ΙΛ 荛〇〇〇X 〇§ 0.8 〇Comparative example 1 A/B/A ! 20/60/20 Β1- 1 I 5 100/0 § 223 Ο g CM CO CM I 〇〇〇X 1 &l t;1 ◎ 〇T— 5 layer composition|layer thickness (jum) | Α layer resin crystalline aromatic polyester (Bl) B layer compounding mass ratio (B1)/(B2) I casting roll temperature (°c) Tm (°C) Tg(°C) I Crystallization speed index rc) ZlHm (J/g) Tm(°C) Tg(°C) Film-forming work-resistant heat-resistant intermediate layer non-exudative embedding release resistance Contaminant (exhaust gas ppm) MD direction heat shrinkage rate (3⁄4), TD direction heat shrinkage rate (9〇CQ resin CO performance evaluation 26 322464 201119854 ^ Real palladium examples 1 to 15 of the sheet system various characteristics are specified in the present invention _Inner's is completely full ^ as the required performance of the release type. In particular, since it is excellent in release property and embedding property at the time of high-temperature hot pressing, it is possible to cope with a printed circuit board having the precision of Fig. 3L, and has a small amount of outgassing and excellent stain resistance. In Comparative Example 1, the release layer was polybutylene terephthalate and the intermediate layer was a polyester elastomer. Therefore, although the release property is good, the glass transition temperature and the crystal heat dissipation are high, so the embedding property is poor. - Comparative Example 2 is a release layer of a polyester elastomer and an intermediate layer of polybutylene terephthalate. Therefore, the crystal melting heat is high and the embedding property is poor. In Comparative Example 3, since the intermediate layer did not contain the crystalline aromatic polyester, the intermediate layer was in an amorphous state. Therefore, although the embedding property is good, the heat resistance is poor, and the bleed out of the polymer derived from the intermediate layer is remarkable. In Comparative Example 4, the content of the crystalline aromatic polyester in the intermediate layer was too large, and the crystallinity of the intermediate layer was too high, so that the embedding property was poor. In Comparative Examples 5 and 6, the glass transition temperature of the release layer was too low, so that the embedding property was good, but the heat resistance or the release property was poor, and the film was broken during the filming. In Comparative Example 7, the polyester-based elastomer single layer did not have the polyester layer of the intermediate layer. Therefore, the film body was weak, the film forming workability was poor, and the flexibility at the time of hot pressing was insufficient, so that the embedding property was also insufficient. Comparative Example 8 is a single layer of polybutylene terephthalate, and since the crystallinity is too high, the release property or heat resistance is good, but the embedding property is poor. Comparative Example 9 is a film composed of polymethyl decene which is widely used as a release film, but 'the outgassing generation is as large as about 1 〇 322 464 27 201119854 times of the film of the present invention, which is poor in pollution resistance. . The comparative example ίο does not have a release layer composed of a polyester elastomer. Therefore, although the embedding property at the time of hot pressing is excellent, the crystallinity of the film is low, so heat resistance or release property is inferior. [Simple description of the diagram] None. [Main component symbol description] None. 322464 28
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JP2009243491A JP2011088351A (en) | 2009-10-22 | 2009-10-22 | Release film |
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CN103434231B (en) * | 2013-07-19 | 2016-04-13 | 胡宇翔 | A kind of printed circuit board forming mould release membrance and manufacture method thereof |
JP5804137B1 (en) * | 2014-05-20 | 2015-11-04 | 住友ベークライト株式会社 | Release film |
JP5804141B1 (en) * | 2014-06-18 | 2015-11-04 | 住友ベークライト株式会社 | Release film |
JP5862740B1 (en) * | 2014-09-30 | 2016-02-16 | 住友ベークライト株式会社 | Release film and method of using release film |
JP7461281B2 (en) * | 2015-12-03 | 2024-04-03 | 三井化学東セロ株式会社 | Process release film, its uses, and method for manufacturing resin-encapsulated semiconductors using the same |
JP6391554B2 (en) * | 2015-12-14 | 2018-09-19 | 住友ベークライト株式会社 | Release film |
JP2019209490A (en) * | 2018-05-31 | 2019-12-12 | 東レ株式会社 | Biaxially oriented polyester film for mold release |
CN114633534A (en) * | 2022-04-12 | 2022-06-17 | 广东鸿翔瑞材料科技有限公司 | High-temperature-resistant release film and preparation method thereof |
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EP1464995A4 (en) * | 2001-12-14 | 2005-09-14 | Toyo Kohan Co Ltd | Preventive film for polarizing film and preventive film for releasable polarizing film, and polarizing plate using them |
JP5517573B2 (en) * | 2008-12-02 | 2014-06-11 | ユニチカ株式会社 | Release film |
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CN102049893A (en) | 2011-05-11 |
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