JP2008253069A - Laminated piezoelectric element and oscillatory wave drive device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminated piezoelectric element and an oscillatory wave drive device, capable of enhancing the performance of the oscillatory wave drive unit, without having to install a new manufacturing facility or increase the cost of manufacturing, while maintaining the reliability. <P>SOLUTION: This laminated piezoelectric element 1 is constituted of a plurality of piezoelectric layers 4-1, 4-2, 4-3, 4-4, 4-3, ..., 4-3, 4-4, which are layers formed from a piezoelectric material, and internal electrodes 5 mounted on the surfaces of the piezoelectric layers 4-3, 4-4, which are layers of an electrode material. Furthermore, the piezoelectric layer 4-2 has eight through holes 6 for conducting the internal electrodes 5 installed, and eight wiring conductive films 2 installed for respectively conducting the eight through holes 6. The ends 3 of the wiring conductive films 2 are gathered and exposed on the circumferential surface of the piezoelectric layer 4-2. Power is supplied with respective internal electrodes 5, from an external power supply through the wiring substrate 11, the wiring conductive films 2 and the through holes 6, and the laminated piezoelectric element 1 is used as the exciting source of the vibrator 21 of a vibration wave motor 20. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a laminated piezoelectric element and a vibration wave driving device in which piezoelectric material layers and electrode material layers are alternately laminated.

  In recent years, development of a small and high-performance multilayer piezoelectric element in which a plurality of piezoelectric elements are laminated has progressed. As a multilayer piezoelectric element according to a first conventional example, a multilayer piezoelectric element having a configuration shown in FIG. 5 that is an excitation source of a vibration body of a vibration wave motor (particularly a vibration wave motor having a rod-like structure) has been proposed (for example, , See Patent Document 1).

  FIG. 5 is an exploded perspective view showing the configuration of the laminated piezoelectric element according to the first conventional example.

  In FIG. 5, a laminated piezoelectric element 40 includes a plurality of piezoelectric layers 41 that are layers of piezoelectric material (piezoelectric ceramics), and an electrode layer that is a layer of electrode material provided on the surface of each piezoelectric layer 41 (hereinafter referred to as an internal electrode). 42. Further, as an interlayer wiring for connecting the internal electrodes 42 between the piezoelectric layers, a so-called through hole (via hole) 43 in which a conductive material is filled in a through hole provided in the layer of the piezoelectric layer 41 along the axial direction is used. ing.

  Each internal electrode 42 is formed by being divided into four in the circumferential direction of the piezoelectric layer 41 and is configured to be non-conductive with each other. Each internal electrode 42 is connected by a through hole 43. The end of the through hole 43 is exposed on the surface of the uppermost piezoelectric layer 41 of the laminated piezoelectric element 40. Thereby, the surface electrode 44 is formed.

  FIG. 6 is a cross-sectional view showing a configuration of a vibration wave motor in which the multilayered piezoelectric element of FIG. 5 is incorporated in a vibrating body.

  In FIG. 6, the vibration wave motor 50 is formed in a rod shape and has a configuration in which the laminated piezoelectric element 40 is incorporated in a vibrating body 51. The laminated piezoelectric element 40 is disposed between the hollow member 53 and the member 54 while the wiring substrate 52 made of a soft resin having flexibility is brought into contact with the surface electrode 44. By inserting the bolt 55 from the member 54 side and screwing it into the member 53, the laminated piezoelectric element 40 and the wiring board 52 are fixed between the member 53 and the member 54. Thereby, the vibrating body 51 is configured.

  Further, the wiring board 52 is connected to a drive circuit (not shown) of an external power source. Accordingly, a driving AC voltage is applied to the laminated piezoelectric element 40, and the rotor 56 is rotationally driven by the vibration of the vibrating body 51.

  As a multilayer piezoelectric element according to a second conventional example, a multilayer piezoelectric element having a configuration shown in FIG. 7 has been proposed (see, for example, Patent Document 2).

  FIG. 7 is a view showing a laminated piezoelectric element and a wiring board according to a second conventional example.

  In FIG. 7, a laminated piezoelectric element 60 is incorporated in a vibrating body of a rod-shaped vibration wave motor. An outer electrode 65 is formed on the outer peripheral portion, and a flexible wiring board 61 is provided. The wiring board 61 has wiring 66 and external terminals 67.

  FIG. 8 is an exploded perspective view showing the configuration of the multilayer piezoelectric element of FIG.

  In FIG. 8, the laminated piezoelectric element 60 is composed of a plurality of piezoelectric layers 62 and internal electrodes 63 provided on the surface of each piezoelectric layer 62 by being divided into four. The outer peripheral end of the internal electrode 63 is located inside the outer peripheral end of the piezoelectric layer 62. Further, on the surface of the piezoelectric layer 62, connection electrodes 64 connected to the internal electrodes 63 and extending to the outer peripheral end of the piezoelectric layer 62 are formed. For example, the connection electrodes 64 are formed in every other layer and at the same phase position with respect to the internal electrode 63 at the same phase position.

  Further, the connection electrodes 64 at the same phase position are connected by an external electrode 65 which is an interlayer electrode provided on the outer peripheral portion of the multilayer piezoelectric element 60. The external electrodes 65 are formed at a total of eight locations in the circumferential direction for each connection electrode 64 positioned at the same phase position in the axial direction of the laminated piezoelectric element 60. Note that the upper and lower end faces of the laminated piezoelectric element 60 are formed of a piezoelectric layer 62 and insulate the internal electrode 63 from the outside.

  Furthermore, as shown in FIG. 7, the laminated piezoelectric element 60 has a flexible wiring substrate 61 wound around a predetermined position on the outer periphery thereof and fixed by adhesion. Each wiring 66 on the front surface side of the wiring substrate 61 is electrically connected to each external electrode 65 of the laminated piezoelectric element 60 on the back surface side of the wiring substrate 61 and is collected at an external terminal 67 on the outer peripheral surface of the wiring substrate 61.

  FIG. 9 is a cross-sectional view showing a configuration of a vibration wave motor in which the laminated piezoelectric element of FIG. 7 is incorporated in a vibrating body.

  In FIG. 9, the vibration wave motor 70 is formed in a rod shape and has a configuration in which the laminated piezoelectric element 60 is incorporated in a vibration body 71. The laminated piezoelectric element 60 is disposed between the hollow member 53 and the member 54. By inserting the bolt 55 from the member 54 side and screwing it into the member 53, the laminated piezoelectric element 60 is directly sandwiched and fixed between the member 53 and the member 54. Thereby, the vibrating body 71 is configured.

Further, a flexible wiring board 72 (or a flat cable) is soldered to the external terminal 67 of the wiring board 61 fixed to the outer peripheral portion of the laminated piezoelectric element 60. Further, the wiring board 72 is connected to a drive circuit (not shown) of an external power source. Thereby, a driving AC voltage is applied to the laminated piezoelectric element 60, and the rotor 56 is rotationally driven by the vibration of the vibrating body 71.
JP-A-8-213664 JP 2003-9555 A

  In the first conventional example, a vibrating body of a vibration wave motor is configured by sandwiching a laminated piezoelectric element and a wiring board made of flexible soft resin between two members. For this reason, there is a problem that the vibration attenuation (energy loss) of the vibrating body is increased, the efficiency of the vibration wave motor is deteriorated, and the performance of the vibration wave motor is deteriorated.

  In the second conventional example, the vibrating body of the vibration wave motor is configured by winding a flexible wiring board around the outer peripheral surface of the laminated piezoelectric element provided with the external electrode around the laminated piezoelectric element. Therefore, a new process for providing external electrodes to the laminated piezoelectric element increases. Further, since the wiring board is wound around substantially the entire circumference of the outer peripheral surface of the multilayer piezoelectric element, the vibration of the vibrator is attenuated, and the performance of the vibration wave motor is reduced as in the first conventional example. was there.

  An object of the present invention is to provide a laminated piezoelectric element and a vibration wave driving device capable of improving the performance of the vibration wave driving device while maintaining reliability, without installing new manufacturing equipment and without increasing the manufacturing cost. Is to provide.

  In order to achieve the above-described object, the laminated piezoelectric element of the present invention includes a plurality of piezoelectric layers made of a piezoelectric material and electrode layers made of an electrode material which are alternately stacked and stacked. A plurality of through holes that are electrically connected to the electrode layer are provided, and at least one piezoelectric layer of the plurality of piezoelectric layers is provided with a conductive film for wiring that is electrically connected to the plurality of through holes, respectively. An end portion of the wiring conductive film is exposed on an outer peripheral surface of the piezoelectric layer provided with the conductive film.

  According to the present invention, since the end of the conductive film for wiring is exposed on the outer peripheral surface of the multilayer piezoelectric element, the multilayer piezoelectric element can be directly sandwiched between members of the vibration body of the vibration wave driving device. As a result, the vibration attenuation of the vibrating body can be reduced as compared with the case where the wiring board is sandwiched between the laminated piezoelectric elements and the members of the vibrating body. Accordingly, a laminated piezoelectric element capable of improving the performance of the vibration wave driving device with less vibration attenuation of the vibrating body without increasing new manufacturing equipment and without increasing the manufacturing cost while maintaining reliability. It becomes possible to provide.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is an exploded perspective view showing a configuration of a laminated piezoelectric element according to an embodiment of the present invention.

  In FIG. 1, the laminated piezoelectric element 1 includes a plurality of piezoelectric layers 4-1, 4-2, 4-3, 4-4, 4-3,. 4 and an internal electrode 5 which is a layer of electrode material provided on the surface of the piezoelectric layers 4-3 and 4-4. That is, the laminated piezoelectric element 1 is formed by laminating a plurality of layers of piezoelectric material and electrode material alternately, and both end surfaces are composed of the piezoelectric layer 4-1 and the piezoelectric layer 4-4. Yes. Further, piezoelectric layers 4-3 and 4-4 are alternately stacked below the piezoelectric layer 4-2. In the figure, reference numeral 11 denotes a wiring board, which will be described in detail in the explanation of FIG.

  The outer peripheral end of the internal electrode 5 is provided closer to the inner peripheral side than the outer peripheral ends of the piezoelectric layers 4-3 and 4-4. The piezoelectric layer 4-3 has internal surfaces A +, A−, B +, and B− formed by dividing the surface into four in the circumferential direction. The internal electrodes A +, A−, B +, and B− are configured to be non-conductive with each other. The piezoelectric layer 4-4 has a surface divided into four in the circumferential direction, thereby forming internal electrodes AG +, AG−, BG +, and BG−. The internal electrodes AG +, AG−, BG +, BG− are configured to be non-conductive with each other. The piezoelectric layers 4-3 and the piezoelectric layers 4-4 are alternately stacked.

  Internal electrodes A +, A−, B +, B− formed on the piezoelectric layer 4-3 and AG +, AG−, BG +, BG− formed on the piezoelectric layer 4-4 are connected by eight through holes 6. ing. That is, the internal electrodes A +, A−, B +, B−, AG +, AG−, BG +, BG− and the eight through holes 6 are electrically connected. The eight through holes 6 reach the surface of the piezoelectric layer 4-2.

  In the piezoelectric layer 4-2, eight conductive films 2 for wiring that are electrically connected to the eight through holes 6 are provided. The end portions 3 of the eight conductive films 2 for wiring are exposed in a state of being gathered in a line on the outer peripheral surface of the piezoelectric layer 4-2. The end portions 3 of the eight conductive films 2 for wiring are fixed to the wiring substrate 11 in contact, and can be used as electrical terminals.

  FIG. 2 is a diagram showing a method for manufacturing the multilayer piezoelectric element of FIG.

  In FIG. 2, first, a small hole to be a through hole 6 is formed in a green sheet 10 cut into a square shape having a certain size made of a piezoelectric ceramic powder to be the piezoelectric layer 4 and an organic binder. Further, a paste made of a conductive powder material (silver / palladium powder) is filled into the holes formed in the green sheet 10 by a screen printing method. Further, a paste made of a conductive powder material (silver / palladium powder) for forming the internal electrode 5 and the wiring conductive film 2 is printed on the surface of the green sheet 10 by a screen printing method.

  The broken lines in the figure indicate the inner diameter portion and the outer diameter portion of the final laminated piezoelectric element 1. In the piezoelectric layer 4-2 on the lower side of the uppermost layer, the wiring conductive film 2 is formed from the electrically conductive through hole 6 to the outside of the outer diameter portion indicated by the broken line of the laminated piezoelectric element 1. In the uppermost piezoelectric layer 4-1, the exposed through-hole 7 and the surrounding surface electrode film 8 for polarization are formed outside the outer diameter portion of the laminated piezoelectric element 1. The through hole 7 of the piezoelectric layer 4-1 and the surface electrode film 8 for polarization are electrically connected to the end of the conductive film 2 for wiring of the piezoelectric layer 4-2 below.

  In the production of the laminated piezoelectric element 1, a plurality of green sheets 10 are stacked in order from the bottom as shown in the figure, and are pressed and laminated while being heated by a heating / pressurizing device (not shown). Further, the inside of the portion that becomes the inner diameter portion of the laminated piezoelectric element is drilled by a drill (not shown) in a rectangular parallelepiped in which a plurality of green sheets 10 are laminated. Then, the laminated rectangular parallelepiped is fired in a lead atmosphere at 1100 ° C. to 1200 ° C. After firing, polarization treatment is performed using the wiring electric film 2.

  FIG. 3 is a perspective view showing a rectangular parallelepiped in which a plurality of green sheets constituting the laminated piezoelectric element of FIG. 1 are laminated.

  In FIG. 3, the stacked rectangular parallelepiped is subjected to polarization processing under the conditions described later. Finally, the both ends of the rectangular parallelepiped are slightly cut and flattened by a processing device (not shown), and machining is performed to remove the outside of the outer diameter portion of the laminated piezoelectric element, thereby forming a ring shape having an inner diameter portion. The laminated piezoelectric element 1 is finished. Through the machining, the through hole 7 and the polarization surface electrode film 8 are removed, and the end portion 3 of the wiring conductive film 2 appears on the outer peripheral surface of the multilayer piezoelectric element 1 as shown in FIG.

  In the polarization treatment, a probe (not shown) is pressed against each of the eight surface electrode films 8 for polarization, and a DC voltage is applied as follows. For each of the internal electrodes A +, A−, B +, B−, AG +, AG−, BG +, and BG− connected to the through hole 7, the conductive film 2 for wiring, and the through hole 6, +300 V is applied to A + and B +. . -300V is applied to A- and B-. AG +, AG−, BG +, and BG− are grounds. Further, a polarization treatment is performed for 30 to 60 minutes in a 120 to 130 ° C. silicone oil. That is, of the four divided internal electrodes, two internal electrodes having a positional relationship of 180 degrees are polarized so that their polarization directions are different from each other.

  Specific numerical values of each part of the manufactured laminated piezoelectric element 1 are as follows. The laminated piezoelectric element 1 has an outer diameter of 10 mm, an inner diameter of 2.8 mm, and a thickness of about 2.2 mm. The piezoelectric layer has a thickness of 85 μm. The internal electrode has an outer diameter of 9.5 mm and a thickness of 2 to 3 μm. The number of piezoelectric layers is 25, and the number of internal electrodes is 24. The diameter of the through hole is φ0.1 mm. The wiring electrode film has a width of 0.4 mm and a thickness of 20 μm.

  FIG. 4 is a cross-sectional view illustrating a configuration of a vibration wave motor as a vibration wave driving device in which the multilayer piezoelectric element of FIG. 1 is incorporated in a vibration body.

  In FIG. 4, the vibration wave motor 20 includes a vibrating body 21 having a member 22, a member 23, and a bolt 24 and incorporating the laminated piezoelectric element 1, a rotor 25, and an output member 26. When assembling the vibration wave motor 20, the ring-shaped laminated piezoelectric element 1 having an inner diameter portion is disposed between the hollow cylindrical member 22 and the member 23. Further, a bolt 24 having a pin tip formed in a pin shape is inserted from the member 23 side and screwed into the member 22, thereby fixing the laminated piezoelectric element 1 between the member 22 and the member 23. .

  Both end surfaces of the laminated piezoelectric element 1 are composed of the piezoelectric layer 4-1 and the piezoelectric layer 4-4 as described above. The piezoelectric layer 4-1 and the piezoelectric layer 4-4 on both end surfaces are electrically insulated from the internal electrode 5 and have a flat surface. On the other hand, the member 22 and the member 23 of the vibration wave motor 20 are also formed with a flat surface on the side sandwiching the laminated piezoelectric element 1. Thereby, the laminated piezoelectric element 1 can be securely sandwiched and fixed between the member 22 and the member 23 of the vibration wave motor 20.

  After the laminated piezoelectric element 1 is sandwiched and fixed between the member 22 and the member 23 of the vibration wave motor 20, the end of the wiring conductive film 2 that is gathered and exposed in a line on a part of the outer peripheral surface of the laminated piezoelectric element 1. The wiring board 11 is fixed in contact with the part 3 (FIG. 1). By using the end portion 3 of the wiring conductive film 2 as an electrical terminal, the wiring conductive film 2 is connected to a drive circuit (not shown) of an external power source via the wiring substrate 11. Along with this, driving AC voltage is applied to the laminated piezoelectric element 1 from the external power source to the internal electrodes 5 through the wiring conductive film 2 and the through holes 6, and power is supplied. Thereby, the laminated piezoelectric element 1 becomes a vibration source of the vibrating body 21 of the vibration wave motor 20.

  The wiring substrate 11 is a flexible substrate in which a plurality of wiring patterns made of copper foil with a thickness of 25 μm are formed on the surface of a base material made of polyimide resin with a thickness of 30 μm, for example. The wiring board 11 is bonded and fixed to a part of the outer peripheral surface of the laminated piezoelectric element 1 (FIG. 1). The plurality of wiring patterns on the wiring substrate 11 are electrically connected to the plurality of ends 3 of the wiring conductive film 2 exposed on the outer peripheral surface of the multilayer piezoelectric element 1, respectively.

  When the vibration wave motor 20 is driven, a high frequency voltage is applied to each internal electrode of the laminated piezoelectric element 1 as follows. In contrast to the internal electrodes AG +, AG−, BG +, and BG− corresponding to the electrical ground, the internal electrodes A + and A− have a high-frequency voltage substantially matching the natural frequency of the vibrating body. A high frequency voltage having a phase difference of 90 ° is applied to the electrodes A + and A−. By the previous polarization process and the application of the high frequency voltage, it is possible to generate two bending vibrations perpendicular to the axial direction in the vibrating body 21.

  That is, the driving principle of the rod-shaped vibration wave motor 20 is as follows. Two bending vibrations perpendicular to the axial direction are generated in the vibrating body 21 incorporating the laminated piezoelectric element 1 with a temporal phase difference. Along with this, the member 22 moves like a swing using the tip of the member 22 constituting the vibrating body 21 as a drive unit, and the rotor 25 is a contact body that is brought into contact with the member 22 in a pressurized state by a spring force. Rotate (moves relatively) by frictional contact. The rotation of the rotor 25 is transmitted to an output member 26 composed of gears disposed above the rotor, and is output to the outside of the vibration wave motor via the output member 26.

  The positions of the plurality of ends 3 of the conductive film for wiring 2 exposed on the outer peripheral surface of the multilayer piezoelectric element 1 are arbitrarily selected by screen printing regardless of the positions of the through holes 6 widely dispersed inside the multilayer piezoelectric element. be able to.

  In the present embodiment, the plurality of end portions 3 of the conductive film 2 for wiring are configured to be gathered in about a quarter of the outer peripheral surface of the laminated piezoelectric element 1 (FIG. 1), but the present invention is limited to this. It is not a thing. A plurality of end portions 3 of the wiring conductive film 2 may be gathered in a narrower range of the outer peripheral surface of the laminated piezoelectric element 1.

  In the present embodiment, the plurality of end portions 3 of the wiring conductive film 2 are provided in the piezoelectric layer 4-2 under the piezoelectric layer 4-1 that is the uppermost layer of the laminated piezoelectric element 1. It is not limited to. The plurality of end portions 3 of the wiring conductive film 2 may be provided in an arbitrary piezoelectric layer of the piezoelectric layers of the laminated piezoelectric element 1 or may be provided in a plurality of piezoelectric layers instead of a single piezoelectric layer. Good.

  Thus, in the present embodiment, the connection between the laminated piezoelectric element 1 and the drive circuit of the external power source is performed via the end 3 of the conductive film 2 for wiring exposed on the outer peripheral surface of the laminated piezoelectric element 1. It is said. With this configuration, unlike the first conventional example, the laminated piezoelectric element 1 can be directly sandwiched between the two members 22 and 23 constituting the vibrating body 21 of the vibration wave motor 20. Thereby, it is possible to reduce the vibration attenuation of the vibration body 21 of the vibration wave motor 20 by the wiring board 11.

  In the second conventional example, the wiring board is wound around substantially the entire circumference of the multilayer piezoelectric element. On the other hand, in the present embodiment, the plurality of end portions 3 of the conductive film 2 for wiring are gathered at about a quarter of the outer peripheral surface of the laminated piezoelectric element 1, and the wiring substrate 11 is fixed to the end portion 3. is doing. With this configuration, the area of the wiring substrate 11 can be reduced, and the length of the laminated piezoelectric element 1 in the thickness direction can also be reduced. As a result, the vibration attenuation of the vibration body 21 of the vibration wave motor 20 can be further reduced.

  As described above, according to the present embodiment, since the end of the conductive film for wiring is exposed on the outer peripheral surface of the multilayer piezoelectric element, the multilayer piezoelectric element is disposed between both members of the vibration body of the vibration wave motor. Can be pinched directly. Therefore, the vibration attenuation of the vibrating body can be reduced as compared with the case where the wiring board is sandwiched between the laminated piezoelectric elements and the members of the vibrating body. Moreover, since the through-hole connecting the internal electrodes of the piezoelectric layer is manufactured by a screen printing method, it is not necessary to install a dedicated manufacturing facility. This makes it possible to improve the performance of the vibration wave motor with less vibration damping of the vibrating body without specially installing new manufacturing equipment and without specially increasing the manufacturing cost while maintaining reliability. A piezoelectric element can be provided.

  Further, a conductive film for wiring is provided inside the laminated piezoelectric element. As a result, even in a configuration in which a multilayered piezoelectric element is provided with an internal electrode that is expected to be complicatedly divided (multiple divisions of 4 or more) and an internal electrode for a sensor, in other words, in a configuration in which the number of through holes increases, It becomes possible to easily manufacture the conductive film and the end portion. Furthermore, the realization of the multilayer piezoelectric element of this configuration will be useful when developing a high-performance vibration wave motor expected in the future.

[Other embodiments]
In the above embodiment, the case where eight through-holes and eight conductive films for wiring are formed in the laminated piezoelectric element has been described as an example. However, the present invention is not limited to this. The number of through holes and conductive films for wiring formed in the laminated piezoelectric element can be arbitrarily set without departing from the gist of the present invention.

  In the above embodiment, the case where the piezoelectric layer of the multilayer piezoelectric element is divided into four and the internal electrode is formed is taken as an example, but the present invention is not limited to this. The present invention is also applicable to the case where an internal electrode is formed by dividing a piezoelectric layer of a laminated piezoelectric element into four or more parts.

It is a disassembled perspective view which shows the structure of the laminated piezoelectric element which concerns on embodiment of this invention. It is a figure which shows the manufacturing method of the laminated piezoelectric element of FIG. It is a perspective view which shows the rectangular parallelepiped which laminated | stacked the several green sheet which comprises the laminated piezoelectric element of FIG. It is sectional drawing which shows the structure of the vibration wave motor as a vibration wave drive device which integrated the laminated piezoelectric element of FIG. 1 in the vibrating body. It is a disassembled perspective view which shows the structure of the laminated piezoelectric element which concerns on a 1st prior art example. It is sectional drawing which shows the structure of the vibration wave motor which integrated the laminated piezoelectric element of FIG. 5 in the vibrating body. It is a figure which shows the laminated piezoelectric element and wiring board which concern on a 2nd prior art example. It is a disassembled perspective view which shows the structure of the laminated piezoelectric element of FIG. It is sectional drawing which shows the structure of the vibration wave motor which integrated the laminated piezoelectric element of FIG. 7 in the vibrating body.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Laminated piezoelectric element 2 Conductive film for wiring 3 End part of conductive film for wiring 4 Piezoelectric layer 5 Internal electrode (electrode layer)
6, 7 Through-hole 8 Surface electrode film for polarization 11 Wiring board 20 Vibration wave motor (vibration wave driving device)
21 vibrating body 22 member (driving unit)
23 member 25 rotor (contact body)
26 Output member

Claims (6)

A plurality of piezoelectric layers composed of piezoelectric materials and electrode layers composed of electrode materials are alternately stacked and laminated,
Providing a plurality of through holes that are electrically connected to the plurality of electrode layers,
A conductive film for wiring that is electrically connected to each of the plurality of through holes is provided in at least one of the plurality of piezoelectric layers,
A laminated piezoelectric element, wherein an end of the wiring conductive film is exposed on an outer peripheral surface of the piezoelectric layer provided with the wiring conductive film.   2. The laminated piezoelectric element according to claim 1, wherein both end faces of the laminated piezoelectric element are constituted by the piezoelectric layers, and the piezoelectric layers on the both end faces are electrically insulated from the electrode layers. element.   2. The laminated piezoelectric element according to claim 1, wherein an end portion of the wiring conductive film is exposed in a part of an outer peripheral surface of the piezoelectric layer provided with the wiring conductive film. .   The multilayer piezoelectric element according to claim 1, wherein power is supplied from the outside of the multilayer piezoelectric element through an end portion of the conductive film for wiring.   The multilayer piezoelectric element according to claim 1, wherein polarization treatment is performed using the conductive film for wiring. A vibration wave driving apparatus using the multilayered piezoelectric element according to any one of claims 1 to 5 as an excitation source,
A vibration body that incorporates the multilayer piezoelectric element and has a drive unit to form vibrations in the drive unit; and a contact body that is in contact with the drive unit of the vibration body in a pressurized state; and A vibration wave driving device characterized by relatively moving the contact body.

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