JP2008244054A - Apparatus and method of conveying electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for sucking and conveying an electronic component 20 for keeping a stable takeoff attitude from a first suction nozzle 18, when the component 20 jetted up from the first nozzle 18 is sucked to a second suction nozzle 19 and reduces the damage to the component 20. <P>SOLUTION: The first suction nozzle 18 has a surface worked part 25 such as a counter bore, and a gas circulating path 21 is equipped with a contraction 27 so that effects of a static pressure thrust bearing is applied to the first suction nozzle 18. The surface worked part 25 is, preferably, defined as a similar shape smaller than the electronic component 20 to be conveyed. In addition, the surface worked part 25 and the contraction 27 can be replaced with a porous material. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an apparatus and a method for conveying an electronic component using a suction nozzle.

  Some conventional electronic component transport apparatuses include a suction nozzle on the delivery side. By sucking the ambient atmosphere with this suction nozzle and bringing it close to the electronic component during transport between processes, the electronic component is sucked to the suction nozzle, and the electronic component is transported while being sucked by the suction nozzle. .

  As a conventional transport device, for example, a transport device having a function of reducing the probability of collision with a suction nozzle that occurs during electronic component suction (see, for example, Patent Document 1), or transport having a function of reducing the impact with the suction nozzle Apparatus (for example, refer to Patent Document 2). Hereinafter, a conventional conveying apparatus will be described. In the description of the background art, the same components are denoted by the same reference numerals and description thereof is omitted.

  FIG. 12 is a perspective view showing a part of the electronic component conveying apparatus described in Patent Document 1. In FIG. FIG. 12 refers to FIG. 1 of Patent Document 1. A method for reducing the collision probability between the suction nozzle and the electronic component will be described with reference to FIG.

  In FIG. 12, in order to suck the chip-shaped electronic component 2 with the suction nozzle 1, the electronic component 2 arranged in the cavity (not shown) of the carrier tape is transported to the opening 3 which is a supply port. When the suction nozzle 1 sucks the electronic component 2, the suction nozzle 1 collides with the peripheral edge 4 of the opening 3, so that the suction nozzle 1 is worn or damaged, the suction reliability of the suction nozzle 1 is lowered, or the opening 3. May occur. In order to prevent them, in Patent Document 1, a chamfer 5 or a counterbore for making the tip of the suction nozzle 1 difficult to collide is formed on the peripheral edge 4 of the opening 3.

  FIG. 13 is a perspective view showing a part of an electronic component transport device described in Patent Document 2. As shown in FIG. FIG. 13 refers to FIG. 1 of Patent Document 2, and a method for mitigating the impact with the suction nozzle will be described with reference to FIG.

  In FIG. 13, in order to stably adsorb the circuit component 7 having a curved surface to the tip surface of the adsorption nozzle 6 without adjusting the angle each time, the first opening 8 and the periphery of the first opening 8 are arranged. A plurality of annular second openings 9 and an air circulation groove 10 from each of the second openings 9 to the outer periphery of the tip surface of the suction nozzle 6 are formed. In addition, by making the shape of the first opening 8 and the second opening 9 circular and setting the diameter of the first opening 8 to be larger than the diameter of the second opening 9, the circuit component 7 can be made more stable. Can be adsorbed.

  Further, as a method of performing posture control without contact, there is a fluid bearing structure (see, for example, Patent Document 3).

  FIG. 14 is a cross-sectional view showing a part of the hydrodynamic bearing described in Patent Document 3. FIG. 14 refers to FIG. 1 of Patent Document 3, and this figure will be used to explain posture stabilization without contact.

In FIG. 14, by adopting a hydrostatic bearing structure for the purpose of smoothly moving the hydrostatic slide device 11 without contact, the load applied to the slider 12 can be increased, and smooth movement and positioning accuracy can be achieved. Can be improved. Here, in the static pressure slide device 11, a groove 14 and a plurality of branch grooves 15 extending from the groove 14 are provided on the surface of the slider 12 that faces the guide 13 for position regulation. In addition, an orifice 17 having a nozzle for restricting compressed air is provided on a surface of the lower surface of the slider 12 facing the surface plate 16.
JP 09-064591 A JP 09-036591 A Japanese Patent Laid-Open No. 01-126425

  However, even in the above-described conventional transportation of electronic components, damage to the electronic components is a problem. A piece generated from an electronic component due to damage during conveyance becomes a foreign substance depending on other electronic components, and this defective piece may double the defect rate during conveyance.

  In order to investigate the cause of the damage of the electronic component, the applicant repeatedly observed the transport process of the electronic component with a high-sensitivity video camera. As a result of the observation, it was found that the attitude of the electronic component at the moment of take-off of the electronic component when the electronic component is removed (floated) from the suction nozzle greatly affects the damage to the electronic component. That is, when the suction nozzle is switched from the vacuum holding state to the ejection (vacuum break), the posture of the electronic component to be removed from the suction nozzle becomes unstable, and thus the electronic component may be damaged. .

  In the above-described conventional transportation of electronic parts, it is not considered to stabilize the posture of the electronic parts, and the structure of the fluid bearing is also applied to non-contact transportation of machine elements and objects. Since it is not the purpose of stabilizing the posture of the contact component, it is considered that the effect for solving the problem in the present invention is not exhibited.

  The present invention solves the above-described conventional problems, and an object of the present invention is to provide an apparatus and method for stabilizing the posture of an electronic component during the conveyance of the electronic component.

  In order to achieve the above object, an electronic component transport apparatus according to the present invention includes an adsorption nozzle having an opening communicating with a gas flow passage formed at a tip thereof, and a supply / exhaust device that discharges or supplies gas to the gas flow passage. The cross-sectional area of the said opening part is larger than the cross-sectional area of the said gas flow path, It is characterized by the above-mentioned.

In order to achieve the above object, the electronic component conveying method of the present invention includes a first adsorption step in which an electronic component is adsorbed by a first adsorption nozzle in which an opening communicating with a gas flow path is formed at a tip, and an adsorption A transporting step of transporting the electronic component, a floating step of levitating the electronic component from the tip of the first suction nozzle by a gas ejected from the gas flow path, and the electronic component floating up by the second suction nozzle A second adsorbing step for adsorbing, wherein the gas passage resistance in the gas flow passage is C _s, and the gas passage resistance in the gap between the electronic component and the adsorption nozzle is C _x , the conditions in the levitation step It is characterized by satisfying the formula.

  As described above, by using the present invention, it is possible to stabilize the posture of the electronic component that floats from the suction nozzle, and avoids the end of the electronic component from colliding with the suction nozzle to reduce damage to the electronic component. can do.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Here, the same components are denoted by the same reference numerals, and description thereof is omitted.

(Embodiment 1)
FIG. 1A is a perspective view showing a part of the transport apparatus according to Embodiment 1 of the present invention, and FIG. 1B is a cross-sectional view showing a part of the transport apparatus according to Embodiment 1. .

  In FIG. 1, the transport device in the present embodiment includes a first suction nozzle 18 and a second suction nozzle 19 at a position opposite to the first suction nozzle 18, and transfers and conveys the electronic component 20 between the suction nozzles. is there. The first suction nozzle 18 and the second suction nozzle 19 have gas flow passages 21 and 22 in the center. The gas flow passages 21 and 22 are connected to pumps (not shown) serving as a suction source and a jet source, respectively, so that gas can be sucked and jetted through the jet holes 23 and 24. In the present embodiment, the front end surfaces of the first suction nozzle 18 and the second suction nozzle 19 will be described as flat surfaces. 28 can also be applied. The surface processing 25 and 26 and the configurations of the diaphragms 27 and 28 for forming the portions having different cross-sectional areas in the plane perpendicular to the passage are formed by the gas existing in the gap between the suction nozzle and the electronic component 20 to be conveyed This affects the posture of the electronic component 20. These effects will be described later.

  FIG. 2 is a diagram showing a flow of the adsorption process in the first embodiment of the present invention.

  In FIG. 2, in step S <b> 1, the electronic component 20 that has been carried by the first suction nozzle 18 while being sucked (or stopped or held in a vacuum) is instantaneously spouted with air from the pump by the first suction nozzle. Break the vacuum.

  Subsequently, in step S2, the static pressure thrust function is developed by continuing the gas supply from the first suction nozzle 18. Thereby, the floating posture of the electronic component 20 is stabilized.

  Subsequently, in step S3, the second suction nozzle 19 is not vacuumed until the electronic component 20 achieves a stable posture. At this time, the posture of the electronic component 20 is stabilized in the air by continuing the gas supply from the first suction nozzle 18.

  Subsequently, in step S4, after confirming that the electronic component 20 is in a stable floating state, the second suction nozzle 19 is brought close to the electronic component 20 and vacuum suction of the second suction nozzle 19 is started.

  Subsequently, in step S <b> 5, the electronic component 20 is sucked and held on the tip surface of the second suction nozzle 19. After that, the second suction nozzle 19 moves the electronic component 20 while keeping the vacuum, and transfers it to the subsequent process.

  Here, the case where the pressure balance received on the back surface of the electronic component 20 is broken and the posture of the electronic component 20 is inclined when some disturbance is applied during conveyance will be considered with reference to FIG.

  FIG. 3A is a cross-sectional view showing the periphery of the electronic component in the first embodiment of the present invention, and FIG. 3B is a cross-sectional view showing the case where the electronic component 20 in the first embodiment is tilted. FIG. 3C is a cross-sectional view showing the moment when the electronic component 20 in the first embodiment is tilted.

  In FIG. 3A, gaps 29 and 30 are formed between the first suction nozzle 18 and the electronic component 20 at both ends of the electronic component, respectively.

  Here, when the relative posture between the first suction nozzle 18 and the electronic component 20 changes, the electronic component 20 is inclined as shown in FIG. By tilting the electronic component 20, one of the gaps 29 and 30 between the first suction nozzle 18 and the electronic component 20 (the gap 29 in FIG. 3) is narrowed. Therefore, the gas flow path on the gap 29 side is temporarily narrowed, the gas flow rate 31 passing through the unit cross-sectional area on the gap 29 side is increased, and the pressure on the gap 29 side is increased. As a result, the force for supporting the electronic component 20 is increased on the gap 29 side, and the electronic component 20 is pushed up.

  On the other hand, on the side where the gap widens (gap 30 in FIG. 3), the gas flow passage temporarily widens, so the gas flow rate 32 passing through the unit cross-sectional area decreases, and the pressure on the gap 30 side decreases. As a result, the force for supporting the electronic component 20 is weakened.

  As a result, as shown in FIG. 3C, moments 33 and 34 are generated in the direction opposite to the inclination of the electronic component 20. It is considered that the electronic component 20 can maintain a stable posture by the action of the moments 33 and 34.

  FIG. 4A is a diagram illustrating an example of the pressure distribution when there is no restriction in the first embodiment, and FIG. 4B is an example of the pressure distribution when there is a restriction in the first embodiment. FIG.

  As shown in FIG. 4A, when there is no surface machining portion such as a spot facing, the pressure distribution 35 of the pressure applied to the electronic component 20 from the first suction nozzle 18 is directed from the center of the electronic component 20 toward the outer periphery. The distribution is descending.

  On the other hand, as shown in FIG. 4B, when the surface machining portion 25 such as a spot facing is provided on the tip surface of the first suction nozzle 18, the surface machining portion 25 functions as a recess of the hydrostatic thrust bearing. To do. A load generated by the static pressure of the gas existing in the gap between the first suction nozzle 18 and the electronic component 20 acts on the first suction nozzle 18 at this time. In this case, the pressure distribution 36 is constant in a region corresponding to the projected area from the surface processing portion 25 to the back surface of the electronic component 20, and a large load capacity can be obtained even with the same hole size. Here, the shape of the surface processing portion 25 such as a spot facing is smaller than the electronic component 20 to be transported, and a similar shape of the electronic component 20 is desirable. This is because an uneven pressure distribution is not generated on the back surface of the electronic component 20.

  FIG. 5 is a cross-sectional view of a nozzle having an orifice according to Embodiment 1 of the present invention.

  As shown in FIG. 5, by providing the orifice restrictors 37 in the gas flow passages 21, the first suction nozzle 18 has a gap amount between the first suction nozzle 18 and the electronic component 20 like a static pressure thrust bearing. It has the effect of increasing or decreasing the pressure in response to the change of. Thereby, the effect which suppresses the change of the load which acts on the gas in a gap | interval can be anticipated.

  According to the electronic component transport apparatus of the present embodiment having the above-described configuration, the posture can be controlled independently even when the posture of the electronic component 20 being transported is tilted. Therefore, since the possibility that the end of the electronic component 20 collides with the second suction nozzle 19 can be reduced, the generation of foreign matters due to the damage of the electronic component 20 can be suppressed. As a result, it is possible to improve the yield in the electronic component transport apparatus and maintain a clean environment in the process.

  It should be noted that, in addition to the surface-drawing-shaped surface machining portion 25 by counterbore described in the present embodiment, even a nozzle having an orifice restriction 37 in the gas flow passage 21 has a function of a static pressure thrust bearing. If it is, the effect of this Embodiment can be show | played.

  Here, the first suction nozzle 18 considers the design of the surface processing portion 25 and the size of the aperture for causing the function of the hydrostatic thrust bearing to appear.

  6A is a top sectional view of the bearing in the first embodiment of the present invention, and FIG. 6B is a plan view of the bearing in the first embodiment. Here, as shown in FIG. 6, the nozzle has a counterbore (pocket) 40 and an orifice restriction 41.

In FIG. 6A, R _o represents the bearing radius, R _i represents the counterbore radius, and in FIG. 6B, the diameter of the orifice restrictor 41 is d, and the distance of the bearing gap 42 is h. Furthermore, the atmospheric pressure and P _a, the pressure of the counterbore 40 outlets and P _o, a supply air pressure to the first suction nozzle 18 and P _s.

Here, the range in which the first suction nozzle 18 functions as a static pressure thrust bearing will be considered. When the gas passage resistance in the orifice throttle 41 is C _s and the gas passage resistance in the bearing gap 42 is C _x , the following equation (1) is established.

In Equation (1), in order to reduce pressure loss and increase efficiency, it is necessary to set the ratio of C _{s to} C _x . C _s is preferably equal to or larger than C _x . When C _s is smaller than C _x , the main pressure loss occurs in the bearing gap 42. In this case, the change in the boost pressure P _s is generated directly appear as pressure fluctuation in the bearing gap 42, adversely affect the posture stabilization of the electronic component 20. It is desirable that the ratio of C _s / C _x is large, but it is desirable that the ratio is at least equal, that is, 1 <C _s / C _x .

On the other hand, if C _s becomes too large with respect to C _x , the pressure loss generated in the orifice restrictor 41 becomes large, so that a high supply pressure P _s is required. In order to stably supply high-pressure air, the supply pressure P _s is preferably 10 atm or less.

Further, the supply air pressure P _s is obtained from the equation (1) as P _s = (1 + C _s / C _x ) P _o . In order to supply high-pressure air more stably, it is desirable to set the ratio of C _s / C _x to 5 or less and to set P _{s to} 6 at most with respect to P _o . The practical value is empirically a value in a range represented by the following formula (2).

In the present embodiment, the gas passage resistance value satisfying the above formula (2) is a range necessary for the nozzle to exhibit the function of the hydrostatic thrust bearing. The values of C _x and C _s are determined by the throttle shape and the counterbore shape. For example, for C _s of a nozzle having a capillary stop, Equation (3) is obtained from Poiseille's formula, and the counterbore shape C _x Is obtained as shown in the following formula (4).

Furthermore, in this condition, since the counterbore 40 outlet pressure P _o is required to become the atmospheric pressure P _a higher supply air pressure P _s is a value in the range represented by the following formula (5) Become.

  Next, a specific procedure for setting the nozzle shape will be described. In the hydrostatic thrust bearing, the following Reynolds equation, equation (6), holds for the gas passing through the bearing gap 42.

  Here, m is the viscosity of the gas passing through the bearing gap 42, and r is the gas density.

From equation of Navier-Stokes represented by a cylindrical coordinate system, the gas weight flow rate w _o which passes through the bearing gap 42 is represented by the following formula (7).

On the other hand, the gas weight flow w _i flowing into the bearing is expressed by the following formula (8). Here, gamma _a is the specific weight of the gas at atmospheric pressure, room ^{temperature, S (= πd 2/4} ) shows the air supply area. S varies depending on the shape of the diaphragm, but in the following, formula expansion is performed by taking the orifice diaphragm as an example.

Here, is a gas constant, and T is a supply air temperature. Y is an orifice outflow rate coefficient, and the orifice outflow rate coefficient Ψ varies depending on conditions. Specifically, when P _o / P _s ≧ {2 / (k + 1)} ^{k / (k−1)} , it is expressed by the following equation (9), and P _o / P _s <{2 / (k + 1)} ^{When k / (k-1)} , it is expressed by the following formula (10).

  Here, g in the equation is gravitational acceleration, and k is the adiabatic index of gas.

Since the gas weight flow rate entering and exiting is constant, the equation (7) and can be simultaneous with the formula and (8), as in the following equation (11), determining the pressure P _o of the pocket 40 outlet be able to. The pressure distribution is given by the following formula (12).

  By integrating the pressure distribution obtained by the above equation (12) over the entire area of the bearing, the load capacity W of the bearing is obtained. In the case of orifice restriction, the following approximate expression, Expression (13), is given.

Since the electronic component 20 is only required to float from the first suction nozzle 18, the load capacity W is the weight of the electronic component 20. Therefore, the dimensions of the diaphragm and the like can be obtained using a series of the above formulas (6) to (13). As an example, consider that a circular electronic component 20 having a weight of 2.0 mg, a thickness of 0.20 mm, and a diameter of 2.0 mm is levitated. Since the bearing dimensions are equal to the electronic component dimensions, it is assumed that the bearing radius R _o = 1.0 mm, the counterbore radius R _i = 0.90 mm, and the environmental temperature T = 20 ° C. Here, the bearing gap h may be considered to be a height at which the electronic component 20 is lifted into the air. In general, electronic components are provided with components such as bumps for electrode formation. The object to be handled here is about 0.10 mm in height of components such as bumps. As shown in FIG. 2, the second suction nozzle 19 sucks the electronic component 20 that has floated, and the role of the first suction nozzle 18 is to stably take off the electronic component 20. For this reason, it is sufficient for the bearing gap h to have the height of the components on the surface of the electronic component 20. Therefore, the maximum value of the bearing gap h is set to a value slightly larger than 0.10 mm which is the height of the component.

FIG. 7 is a relationship diagram between the throttle and the supply air pressure in the first embodiment. FIG. 7 shows the relationship between the throttle diameter d for taking off the electronic component 20 and the supply air pressure P _s required at that time under the above-described conditions. By carrying out formula development based on the dimensions of the nozzles thus given, it is possible to obtain the relationship between variables such as a desired throttle and supply air pressure. Furthermore, the remaining dimension can be calculated | required by applying the conditions shown to the said Formula (2) and the said Formula (5).

(Embodiment 2)
In the electronic component transport apparatus having the above-described configuration, attention is paid to the fact that the flow rate of the gas ejected from the first suction nozzle 18 and the pressure distribution caused thereby are stabilized on the back surface of the electronic component 20. Here, the calculation of the load capacity is also shown using the above formulas (1) to (7).

  In order to further stabilize the posture of the electronic component 20, it is conceivable to provide a plurality of independent gas ejection holes 23, surface processing 25, and gas flow passages 21. With this configuration, the main purpose is to cancel the moment generated from each hole and to make the pressure distribution uniform. In order to verify this, the case where a plurality of ejection holes 23 are provided will be considered based on the simulation results.

  FIG. 8A is a pressure distribution diagram in the case where there is one ejection hole in the second embodiment, and FIG. 8B is a pressure distribution diagram in the case where there are four ejection holes in the second embodiment. FIG. 8C is a pressure distribution diagram when the number of ejection holes in the second embodiment is nine.

Here, FIG. 8A to FIG. 8C are obtained by numerical analysis of the influence of the number of holes on the pressure distribution when the plurality of ejection holes 23 are provided in the surface processing portion 25. It is assumed that the size of the surface processed portion 25 is a square with a side of 50 mm, the size of the ejection holes 23 is 0.5 mm in diameter, and the ejection pressure of each ejection hole is 30.0 kgf / mm ² .

  More specifically, FIG. 8A shows one in which one ejection hole 23 is arranged at the center of the surface processed portion 25, and FIG. 8B shows one in which four ejection holes 23 are arranged equally. (C) is one in which nine ejection holes 23 are arranged uniformly. From the respective comparisons, it can be seen that the pressure gradient decreases as the number of the ejection holes 23 increases, and at the same time, the constant pressure region also increases. Therefore, it is clear that a larger number of holes is more advantageous in order to maintain a stable posture of the electronic component 20.

  Further, regarding the arrangement of the ejection holes 23 and the balance thereof, for example, considering the arrangement of the four holes in FIG. 8B, it is preferable to set the arrangements equally.

  FIG. 9A is a hole arrangement diagram when there are four ejection holes in the second embodiment, and FIG. 9B is a hole arrangement diagram when there are nine ejection holes in the second embodiment.

  The arrangement in the case of four ejection holes 23 is desirably set evenly as shown in FIG. This is intended for the pressure generated from each hole to act evenly on the back surface of the electronic component 20 and to handle the load evenly. Based on this concept, a 9-hole arrangement is considered as shown in FIG. In addition, what is necessary is just to arrange | position by the same view, when the number of holes increases. In other words, the number of holes and the arrangement thereof may be a number that balances the moment and an arrangement that satisfies the number corresponding to the shape of the electronic component 20. In general, the shape of the electronic component 20 is often rectangular, and in order to balance the moment that causes the inclination of the electronic component, the ejection holes are arranged in line-symmetrical or point-symmetrical positions, and the number corresponding thereto It is desirable that

  Moreover, the structure which has a some surface process part exhibits the same effect as the above-mentioned.

  FIG. 10A is a layout diagram in the case where there are a plurality of surface processed portions in the second embodiment, and FIG. 10B is a layout diagram in the case where there are a plurality of gas flow passages in the second embodiment.

  10 (a) and 10 (b) has a plurality of surface processing portions 25 and gas flow passages 21 themselves, and the effect of the hydrostatic thrust bearing is obtained in the region of the surface processing portion 25. is there. These positions and numbers are preferably line-symmetrical or point-symmetrical positions as in the case of the above-described ejection holes 23.

  Here, the adsorption process of the electronic component 20 is substantially the same as steps S1 to S5 of FIG. 2 shown in the first embodiment.

  In the example of the multiple arrangements shown in FIGS. 10A and 10B, an orifice diaphragm and a self-contained diaphragm are mentioned. However, as other diaphragm forms, various diaphragms described in the first embodiment are used. Includes shape.

(Embodiment 3)
Further, a configuration to be selected when the back surface shape of the electronic component 20 is not symmetrical will be considered.

  FIG. 11A is a perspective view of the transfer apparatus in the third embodiment, FIG. 11B is a cross-sectional view of the transfer apparatus in the third embodiment, and FIG. 11C is the embodiment. 3 is a cross-sectional view when a plurality of gas flow passages in FIG.

  FIG. 11A shows a configuration in which the surface processing portion 25 and the portion corresponding to the throttle 27 shown in FIG. 1 are replaced with the porous body 43, and the gas flow passage 21 is connected to the porous body 43. Yes.

  The gas that has passed through the gas flow passage 21 is taken into the porous body 43 and is ejected from the surface through the continuous pores. It is expected that the gas is randomly and uniformly ejected on the surface of the porous body 43 and the entire back surface of the electronic component 20 is ejected. As a material of the porous body 43, porous ceramics and the like are conceivable from the viewpoint of maintaining the strength as a nozzle, but it is speculated that a porous metal is also possible.

If it is difficult to calculate the gas passage resistance C _s of the porous body 43, the gas flow rate Q and the pressure change DP after passing through the porous body can be measured and obtained as the following equation (14).

  Further, the following equation (15) is calculated from the above equation (2) and (14).

  According to the present embodiment, even when the electronic component 20 has a shape other than a rectangle, the continuous pores present in the porous body 43 have a function equivalent to that of the throttle, A uniform pressure distribution can be generated. As a result, even when the posture of the electronic component 20 being conveyed is inclined, the posture can be controlled independently. Therefore, the danger that the end of the electronic component 20 collides with the second suction nozzle 19 can be avoided, and the generation of foreign matters due to the damage of the electronic component 20 can be suppressed. Therefore, the yield in the electronic component transport process is improved. At the same time, it is possible to maintain a clean environment in the process.

  Here, the adsorption process is not greatly changed from FIG. 2 shown in the first embodiment.

  In order to prevent the gas ejection from being hindered by the discontinuous pores present in the porous body 43, a plurality of gas flow passages 21 connected to the porous body 43 are arranged as shown in FIG. You may do it.

  According to the present invention, an unstable collision between the electronic component to be transported and the suction nozzle can be avoided, the electronic component can be prevented from being damaged, and a clean environment can be maintained by preventing the occurrence of a fragment of the electronic component. It is useful for an apparatus for conveying electronic parts.

  In addition, since it includes a function of stably holding an object in space, it is useful for application to a stage of a measuring instrument.

(A) The perspective view which shows a part of conveying apparatus in Embodiment 1, (b) Sectional drawing which shows a part of conveying apparatus in Embodiment 1 The figure which shows the flow of the adsorption | suction process in Embodiment 1. (A) Cross-sectional view showing the periphery of the electronic component in the first embodiment, (b) Cross-sectional view showing the case where the electronic component 20 in the first embodiment is inclined, (c) Electronic component 20 in the first embodiment is inclined. Sectional view showing moment (A) The figure which shows an example of the pressure distribution when there is no throttle in Embodiment 1, (b) The figure which shows an example of the pressure distribution when there is a throttle in Embodiment 1 Sectional drawing of the nozzle which has an orifice in Embodiment 1 (A) Top sectional view of bearing in embodiment 1, (b) Plan view of bearing in embodiment 1. Relationship diagram between throttle and supply air pressure in the first embodiment (A) Pressure distribution diagram with one ejection hole in the second embodiment, (b) Pressure distribution diagram with four ejection holes in the second embodiment, (c) 9 ejection holes in the second embodiment. Pressure distribution diagram (A) Hole arrangement diagram with four ejection holes in the second embodiment, (b) Hole arrangement diagram with nine ejection holes in the second embodiment (A) Arrangement in the case where there are a plurality of surface processed parts in the second embodiment, (b) Arrangement in the case of having a plurality of gas flow passages in the second embodiment. (A) The perspective view of the conveying apparatus in Embodiment 3, (b) Sectional drawing of the conveying apparatus in Embodiment 3, (c) Sectional drawing in the case of having a plurality of gas flow passages in Embodiment 3. The perspective view which shows a part of conveying apparatus of the electronic component of patent document 1 The perspective view which shows a part of conveying apparatus of the electronic component of patent document 2 Sectional drawing which shows a part of fluid bearing of patent document 3

Explanation of symbols

18 1st adsorption nozzle 19 2nd adsorption nozzle 20 Electronic component 21, 22 Gas flow path 23, 24 Ejection hole 25, 26 Surface processing part 27, 28 Restriction

Claims (6)

An adsorption nozzle having an opening communicating with the gas flow passage formed at the tip;
An air supply / exhaust device for discharging or supplying gas to the gas flow passage,
The electronic component transport apparatus according to claim 1, wherein a cross-sectional area of the opening is larger than a cross-sectional area of the gas flow passage. The electronic component transport apparatus according to claim 1, wherein a porous body is provided at a tip of the suction nozzle. The electronic component transport apparatus according to claim 1, further comprising a control unit that includes a plurality of suction nozzles and performs control to transfer and transport the electronic component between the plurality of suction nozzles. A first adsorption step of adsorbing an electronic component with a first adsorption nozzle having an opening communicating with the gas flow path formed at the tip;
A transporting process for transporting the adsorbed electronic component;
A levitation step of levitating the electronic component from the tip of the first suction nozzle by a gas ejected from the gas flow path;
A second adsorption step of adsorbing the levitated electronic component with a second adsorption nozzle,
When the gas passage resistance in the gas flow path is C _s and the gas passage resistance in the gap between the electronic component and the suction nozzle is C _x , the following equation (1) is satisfied in the levitation step: Parts transport method.

5. The electronic component conveying method according to claim 4, wherein the electronic component is levitated to a height of 0.1 mm from the tip surface of the first suction nozzle in the ascent step. A porous body is provided at the tip of the suction nozzle,
When the gas flow rate passing through the inside of the porous body is Q, the pressure change before and after passing through the porous body is ΔP, and the gas passage resistance in the gap between the electronic component and the porous body is C _x , The electronic component conveying method according to claim 4, wherein the following expression (2) is satisfied.

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