JP2008243879A - Electronic device and its manufacturing method - Google Patents

Electronic device and its manufacturing method Download PDF

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Publication number
JP2008243879A
JP2008243879A JP2007078280A JP2007078280A JP2008243879A JP 2008243879 A JP2008243879 A JP 2008243879A JP 2007078280 A JP2007078280 A JP 2007078280A JP 2007078280 A JP2007078280 A JP 2007078280A JP 2008243879 A JP2008243879 A JP 2008243879A
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electronic component
groove
resin
circuit board
outer periphery
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JP2007078280A
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Japanese (ja)
Inventor
Masato Kinoshita
眞人 木下
Yukinori Fukunaga
幸範 福永
Hatsuo Takada
初夫 高田
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Kyocera Corp
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Kyocera Corp
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Priority to JP2007078280A priority Critical patent/JP2008243879A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

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  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic device wherein an overflow of resin injected between an electronic part and a circuit substrate is suppressed. <P>SOLUTION: In an electronic part 2 wherein a plurality of terminal electrodes 2a are formed on its lower surface, the terminal electrodes 2a are mounted to a circuit substrate 1 wherein a plurality of electrode pads 1a are formed on its upper surface, being opposite to the electrode pads 1a. A groove 4 having a discontinuous part 4a is formed on the upper surface of the circuit substrate 1 to surround the electrode pads 1a so that the surrounded area 8 may be located inside the outer circumference 2b of the electronic part 2, and a resin 3 is injected into the area 8 surrounded by the groove 4 between the electronic part 2 and the circuit substrate 1, thus forming the electronic device 10. The resin 3 is injected into the discontinuous part 4a of the groove 4, so that the inside of the area 8 surrounded by the groove 4 is first filled with the resin 3. An overflow of the resin 3 is suppressed by the surface tension thereof at an opening of the groove 4, reducing the overflow of the injected resin 3. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、プリント回路基板等の回路基板に半導体回路素子等の電子部品を搭載した電子装置およびその製造方法に関するものである。   The present invention relates to an electronic device in which an electronic component such as a semiconductor circuit element is mounted on a circuit board such as a printed circuit board, and a manufacturing method thereof.

従来から、プリント回路基板等の回路基板に半導体回路素子等の電子部品を搭載した電子装置が様々な電子機器に組み込まれている。   2. Description of the Related Art Conventionally, electronic devices in which electronic components such as semiconductor circuit elements are mounted on a circuit board such as a printed circuit board have been incorporated into various electronic devices.

電子装置の一例として、例えば、下面に複数の端子電極が形成されている電子部品が、上面に複数の電極パッドが形成されている回路基板上に、複数の端子電極と複数の電極パッドとを対向させて搭載されており、電子部品と回路基板との間に樹脂が注入されている構成の電子装置が知られている（例えば、特許文献１を参照。）。   As an example of an electronic device, for example, an electronic component having a plurality of terminal electrodes formed on a lower surface is provided with a plurality of terminal electrodes and a plurality of electrode pads on a circuit board having a plurality of electrode pads formed on an upper surface. 2. Description of the Related Art There is known an electronic device that is mounted so as to be opposed and in which a resin is injected between an electronic component and a circuit board (see, for example, Patent Document 1).

以上の電子装置は、電子部品の下面に形成されている複数の端子電極と複数の電極パッドとを対向させて搭載された、いわゆるフェイスダウンボンディングの構造となっており、周囲に搭載されたチップ部品との間隔を短くしているので、搭載された電子部品の密度を高くすることができるという長所を持っている。   The above electronic device has a so-called face-down bonding structure in which a plurality of terminal electrodes and a plurality of electrode pads formed on the lower surface of an electronic component are opposed to each other, and a chip mounted around Since the distance between the components is shortened, the density of the mounted electronic components can be increased.

また、電子部品と回路基板との間に注入されている樹脂は、電子部品と回路基板との接合力を高める役割を持っており、さらに、電子部品がベアチップである場合には、電子部品の下面に形成されている微細な回路配線を封止する役割も持っている。   In addition, the resin injected between the electronic component and the circuit board has a role of increasing the bonding force between the electronic component and the circuit board. Furthermore, when the electronic component is a bare chip, It also serves to seal fine circuit wiring formed on the lower surface.

前述の電子装置の製造方法の一例として、例えば、以下の工程１〜４を含むものが知られている。下面に複数の端子電極が形成されている電子部品を準備し、回路基板の上面に、複数の端子電極に対応した複数の電極パッドを形成する（工程１）。端子電極と電極パッドとを対向させながら接続して、回路基板上に電子部品を搭載する（工程２）。電子部品および回路基板の間に未硬化の樹脂を注入する（工程３）。未硬化の樹脂を硬化させる（工程４）。
特開2005−129818号公報 As an example of the method for manufacturing the electronic device described above, for example, one including the following steps 1 to 4 is known. An electronic component having a plurality of terminal electrodes formed on the lower surface is prepared, and a plurality of electrode pads corresponding to the plurality of terminal electrodes are formed on the upper surface of the circuit board (step 1). The terminal electrode and the electrode pad are connected to face each other, and an electronic component is mounted on the circuit board (step 2). An uncured resin is injected between the electronic component and the circuit board (step 3). Uncured resin is cured (step 4).
JP-A-2005-129818

しかしながら、前述の従来の電子装置は、電子部品と回路基板との間に注入されている樹脂が、電子部品および回路基板の間から溢れて隣の電子部品にまで到達し、隣の電子部品に悪影響を及ぼすことがあった。例えば、隣の電子部品がチップコンデンサの場合には、樹脂の熱膨張および熱収縮がチップコンデンサに応力を加えることになり、最悪の場合にはチップコンデンサにクラックを発生させるという問題点がある。隣の電子部品が他の種類の電子部品の場合にも同様の問題点がある。   However, in the above-described conventional electronic device, the resin injected between the electronic component and the circuit board overflows from between the electronic component and the circuit board and reaches the adjacent electronic component. There was an adverse effect. For example, when the adjacent electronic component is a chip capacitor, the thermal expansion and contraction of the resin adds stress to the chip capacitor, and in the worst case, there is a problem that a crack occurs in the chip capacitor. A similar problem occurs when the adjacent electronic component is another type of electronic component.

電子部品および回路基板の間からはみ出す量が少なくなるように樹脂を注入する方法としては、未硬化の樹脂の粘度を高くする方法があるが、一方で、粘度が高くなりすぎるときには、未硬化の樹脂は電子部品および回路基板の間における流動性が悪くなるので、電子部品および回路基板の間に樹脂の未注入部分が多く発生してしまい、電子部品と回路基板との接合力が低下するという問題点がある。すなわち、従来の電子装置の製造方法においては、電子部品および回路基板の間からはみ出す量を少なくすることと、電子部品および回路基板の間の未注入部分を少なくすることとはトレードオフに近い関係にあり、両方を満足させることは困難であった。   As a method of injecting the resin so that the amount protruding from between the electronic component and the circuit board is small, there is a method of increasing the viscosity of the uncured resin. On the other hand, when the viscosity is too high, the resin is uncured. Since resin has poor fluidity between the electronic component and the circuit board, many uninjected portions of the resin are generated between the electronic component and the circuit board, and the bonding force between the electronic component and the circuit board is reduced. There is a problem. That is, in the conventional method of manufacturing an electronic device, there is a close trade-off between reducing the amount of protrusion between the electronic component and the circuit board and reducing the uninjected portion between the electronic component and the circuit board. It was difficult to satisfy both.

本発明は前述のような従来の電子装置およびその製造方法における問題点に鑑み案出されたものであり、その目的は、電子部品および回路基板の間に注入された樹脂がはみ出す量を少なくした電子装置およびその製造方法を提供することにある。   The present invention has been devised in view of the problems in the conventional electronic device and the manufacturing method thereof as described above, and its purpose is to reduce the amount of resin injected between the electronic component and the circuit board. An object of the present invention is to provide an electronic device and a manufacturing method thereof.

本発明の電子装置は、下面に複数の端子電極が形成されている電子部品が、上面に複数の電極パッドが形成されている回路基板上に、前記複数の端子電極と前記複数の電極パッドとを対向させて搭載されており、前記回路基板の上面に、前記複数の電極パッドを囲むとともに囲まれる領域が前記電子部品の外周の内側に位置するような、不連続部を有する溝が形成されており、前記電子部品および前記回路基板の間の前記溝で囲まれた領域に樹脂が注入されていることを特徴とするものである。   In the electronic device according to the present invention, an electronic component having a plurality of terminal electrodes formed on a lower surface thereof has a plurality of terminal electrodes and a plurality of electrode pads formed on a circuit board having a plurality of electrode pads formed on an upper surface. And a groove having a discontinuous portion is formed on the upper surface of the circuit board so that a region surrounding and surrounded by the plurality of electrode pads is located inside the outer periphery of the electronic component. The resin is injected into a region surrounded by the groove between the electronic component and the circuit board.

また、本発明の電子装置は、上記構成において、前記溝は、前記電子部品の外周に対向するように形成されていることを特徴とするものである。   Moreover, the electronic device of the present invention is characterized in that, in the above configuration, the groove is formed so as to face the outer periphery of the electronic component.

また、本発明の電子装置は、上記構成において、前記電子部品の外周が長方形状であり、前記溝がひとつながりであるとともに不連続部が前記電子部品の外周の１つの隅部と対向していることを特徴とするものである。   In the electronic device according to the present invention, in the configuration described above, the outer periphery of the electronic component is rectangular, the groove is connected, and the discontinuous portion faces one corner of the outer periphery of the electronic component. It is characterized by being.

また、本発明の電子装置の製造方法は、下面に複数の端子電極が形成されている電子部品を準備し、回路基板の上面に、前記複数の端子電極に対応した複数の電極パッドを形成するとともに、該複数の電極パッドを囲み、かつ囲まれる領域が前記電子部品の外周の内側に位置するような、不連続部を有する溝を形成する工程１と、前記端子電極と前記電極パッドとを対向させながら接続して、前記回路基板上に前記電子部品を搭載する工程２と、前記電子部品および前記回路基板の間の前記溝で囲まれた領域に、前記溝の不連続部から未硬化の樹脂を注入する工程３と、前記未硬化の樹脂を硬化させる工程４とを含むものである。   According to another aspect of the invention, there is provided a method for manufacturing an electronic device, comprising preparing an electronic component having a plurality of terminal electrodes formed on a lower surface and forming a plurality of electrode pads corresponding to the plurality of terminal electrodes on an upper surface of a circuit board. And a step 1 of forming a groove having a discontinuous portion so as to surround the plurality of electrode pads and the surrounded region is located inside the outer periphery of the electronic component, and the terminal electrode and the electrode pad, Step 2 of mounting the electronic component on the circuit board while facing each other and uncured from the discontinuous portion of the groove in the region surrounded by the groove between the electronic component and the circuit board The process 3 which inject | pours this resin, and the process 4 which hardens the said uncured resin are included.

また、本発明の電子装置の製造方法は、上記構成の前記工程１において、前記溝を、開口が前記電子部品の外周に位置するように形成することを特徴とするものである。   In addition, the electronic device manufacturing method of the present invention is characterized in that, in the step 1 configured as described above, the groove is formed so that an opening is located on an outer periphery of the electronic component.

また、本発明の電子装置の製造方法は、上記構成において、前記外周が長方形状の前記電子部品を用いて、前記工程１において、前記溝を、ひとつながりに、かつ前記不連続部が前記電子部品の外周の１つの隅部と対向するように形成することを特徴とするものである。   In the electronic device manufacturing method of the present invention, the electronic device having the above-described configuration having a rectangular outer periphery is used, and in the step 1, the groove is connected in a single line and the discontinuous portion is the electron. It is formed so as to face one corner of the outer periphery of the part.

本発明の電子装置によれば、下面に複数の端子電極が形成されている電子部品が、上面に複数の電極パッドが形成されている回路基板上に、複数の端子電極と複数の電極パッドとを対向させて搭載されており、回路基板の上面に、複数の電極パッドを囲むとともに囲まれる領域が電子部品の外周の内側に位置するような、不連続部を有する溝が形成されていることから、電子部品および回路基板の間の溝で囲まれた領域に注入される樹脂は、溝の不連続部から注入することによって、電子部品および回路基板の間の溝で囲まれた領域の内側から満たされていき、電子部品および回路基板の間からはみ出そうとすると溝の開口部で樹脂に表面張力が働くので、回路基板と接触している部分において溝で囲まれた領域から外側へは流れにくくなり、電子部品および回路基板の間に注入された樹脂のはみ出す量が少ないものとなる。   According to the electronic device of the present invention, an electronic component having a plurality of terminal electrodes formed on the lower surface thereof has a plurality of terminal electrodes, a plurality of electrode pads, and a circuit board having a plurality of electrode pads formed on the upper surface. And a groove having a discontinuous portion is formed on the upper surface of the circuit board so that a region surrounding and surrounded by the plurality of electrode pads is located inside the outer periphery of the electronic component. From the inside of the region surrounded by the groove between the electronic component and the circuit board, the resin injected into the region surrounded by the groove between the electronic component and the circuit board is injected from the discontinuous portion of the groove As the surface tension acts on the resin at the opening of the groove when it tries to protrude from between the electronic component and the circuit board, the area that is in contact with the circuit board is not outside the area surrounded by the groove. It becomes difficult to flow The amount of protruding the injected resin between the electronic component and the circuit board becomes small.

また、本発明の電子装置によれば、溝が電子部品の外周に対向するように形成されているときには、溝の開口部で働く表面張力に加えて電子部品の外周で未硬化の樹脂に表面張力が働くので、電子部品および回路基板の間に注入された樹脂のはみ出す量がさらに少ないものとなる。   According to the electronic device of the present invention, when the groove is formed so as to face the outer periphery of the electronic component, in addition to the surface tension acting at the opening of the groove, the surface of the uncured resin on the outer periphery of the electronic component Since the tension works, the amount of the resin injected between the electronic component and the circuit board is further reduced.

また、本発明の電子装置によれば、電子部品の外周が長方形状であり、溝がひとつながりであるとともに不連続部が電子部品の外周の１つの隅部と対向しているときには、電子部品および回路基板の間の溝で囲まれた領域に、中心から最も離れた位置から樹脂が注入されるので、樹脂が溝で囲まれた領域からはみ出そうとする力が弱まり、樹脂がはみ出す量が少ないものとなる。これに加えて、溝が電子部品の外周に対向するように形成されているときに、電子部品の外周の３つの隅部と対向する部分と、樹脂を注入する溝の不連続部との距離が離れることになるので、はみ出そうとする力が集中する隅部に対してもはみ出そうとする力が弱まり、樹脂がはみ出す量を少なくする効果が特に高いものとなる。   According to the electronic device of the present invention, when the outer periphery of the electronic component is rectangular, the grooves are connected and the discontinuous portion faces one corner of the outer periphery of the electronic component, the electronic component Since the resin is injected into the region surrounded by the groove between the circuit boards from the position farthest from the center, the force that the resin tries to protrude from the region surrounded by the groove is weakened, and the amount of the resin protruding It will be less. In addition, when the groove is formed so as to face the outer periphery of the electronic component, the distance between the portion facing the three corners of the outer periphery of the electronic component and the discontinuous portion of the groove into which the resin is injected As a result, the force to protrude from the corner portion where the force to protrude is concentrated is weakened, and the effect of reducing the amount of the resin protruding is particularly high.

また、本発明の電子装置の製造方法によれば、工程１において、回路基板の上面に、複数の端子電極に対応した複数の電極パッドを形成するとともに、この複数の電極パッドを囲み、かつ囲まれる領域が電子部品の外周の内側に位置するような、不連続部を有する溝を形成しておいて、工程３において、溝の不連続部から未硬化の樹脂を注入するようにしており、未硬化の樹脂が、電子部品および回路基板の間の溝で囲まれた領域の内側から満たされるようにしているので、溝の開口部で未硬化の樹脂に表面張力を働かせることができ、未硬化の樹脂が溝で囲まれた領域から外側へは流れにくくなり、電子部品および回路基板の間に注入された未硬化の樹脂のはみ出す量が少ないものとなる。仮に、溝に不連続部を形成せずに溝を越えるようにして未硬化の樹脂を注入した場合には、電子部品および回路基板の間の溝で囲まれた領域に比べて流れやすい溝へと先に未硬化の樹脂が満たされていき、満たされた未硬化の樹脂が溢れて電子部品の外周から樹脂がはみ出しやすい。   According to the method for manufacturing an electronic device of the present invention, in Step 1, a plurality of electrode pads corresponding to the plurality of terminal electrodes are formed on the upper surface of the circuit board, and the plurality of electrode pads are surrounded and surrounded. Forming a groove having a discontinuous portion such that the region to be located is located inside the outer periphery of the electronic component, and in Step 3, uncured resin is injected from the discontinuous portion of the groove, Since the uncured resin is filled from the inside of the region surrounded by the groove between the electronic component and the circuit board, the surface tension can be applied to the uncured resin at the opening of the groove. It is difficult for the cured resin to flow outward from the region surrounded by the grooves, and the amount of the uncured resin injected between the electronic component and the circuit board is small. If uncured resin is injected over the groove without forming a discontinuity in the groove, the groove will be easier to flow than the region surrounded by the groove between the electronic component and the circuit board. The uncured resin is filled first, and the filled uncured resin overflows and the resin tends to protrude from the outer periphery of the electronic component.

また、本発明の電子装置の製造方法によれば、工程１において、溝を、開口が電子部品の外周に位置するように形成するときには、溝の開口部で働く表面張力に加えて電子部品の外周で未硬化の樹脂に表面張力が働くので、電子部品および回路基板の間に注入された未硬化の樹脂が溝で囲まれた領域からはみ出そうとする力を抑える力が強くなり、未硬化の樹脂のはみ出す量がさらに少ないものとなる。   According to the method for manufacturing an electronic device of the present invention, when the groove is formed in step 1 so that the opening is located on the outer periphery of the electronic component, in addition to the surface tension acting at the opening of the groove, the electronic component Since the surface tension acts on the uncured resin on the outer periphery, the force that suppresses the force that the uncured resin injected between the electronic component and the circuit board tries to protrude from the region surrounded by the groove becomes stronger, and the uncured resin The amount of the protruding resin is further reduced.

また、本発明の電子装置の製造方法によれば、外周が長方形状の電子部品を用いて、工程１において、溝を、ひとつながりに、かつ不連続部が電子部品の外周の１つの隅部と対向するように形成するときには、溝をひとつながりにすることによって、未硬化の樹脂が溝で囲まれた領域からはみ出そうとすると、未硬化の樹脂は溝に沿った方向に流れていき、さらに、電子部品および回路基板の間の溝で囲まれた領域に、中心から最も離れた位置から未硬化の樹脂が注入されるので、未硬化の樹脂が溝で囲まれた領域からはみ出そうとする力が弱まり、未硬化の樹脂がはみ出す量が少ないものとなる。これに加えて、溝が電子部品の外周に対向するように形成されているときに、電子部品の外周の３つの隅部と対向する部分と、未硬化の樹脂を注入する溝の不連続部との距離が離れることになるので、はみ出そうとする力が集中する隅部に対してもはみ出そうとする力が弱まり、未硬化の樹脂がはみ出す量を少なくする効果が特に高いものとなる。   In addition, according to the method for manufacturing an electronic device of the present invention, using an electronic component having a rectangular outer periphery, in Step 1, grooves are connected together and a discontinuous portion is one corner of the outer periphery of the electronic component. When the uncured resin tries to protrude from the region surrounded by the grooves by connecting the grooves together, the uncured resin flows in the direction along the grooves, Furthermore, since the uncured resin is injected from the position farthest from the center into the area surrounded by the groove between the electronic component and the circuit board, the uncured resin tries to protrude from the area surrounded by the groove. Accordingly, the amount of uncured resin that protrudes is reduced. In addition to this, when the groove is formed to face the outer periphery of the electronic component, the portion facing the three corners of the outer periphery of the electronic component and the discontinuous portion of the groove for injecting uncured resin Therefore, the force to protrude from the corner where the force to be protruded is concentrated is weakened, and the effect of reducing the amount of uncured resin to be protruded is particularly high.

以下に、本発明の電子装置について添付図面を参照しつつ詳細に説明する。   Hereinafter, an electronic device of the present invention will be described in detail with reference to the accompanying drawings.

図１は本発明の電子装置の一例の要部を示す外観斜視図であり、図２は図１のＡ−Ａ’線断面図であり、図３は図２のＺ部を拡大して示す拡大断面図である。また、図４は、電子部品が搭載されている部分を電子部品を透視して上方から回路基板を見た平面図である。これらの図に示す電子装置10は、基本的な構成として、下面に複数の端子電極２ａが形成されている電子部品２が、上面に複数の電極パッド１ａが形成されている回路基板１上に、複数の端子電極２ａと複数の電極パッド１ａとを対向させて搭載されており、電子部品２および回路基板１の間の溝４で囲まれた領域８に樹脂３が注入されている。   1 is an external perspective view showing an essential part of an example of an electronic apparatus according to the present invention, FIG. 2 is a cross-sectional view taken along the line AA ′ of FIG. 1, and FIG. 3 is an enlarged view of a Z part of FIG. It is an expanded sectional view. FIG. 4 is a plan view of the circuit board viewed from above with the electronic component seen through the portion where the electronic component is mounted. The electronic device 10 shown in these drawings has, as a basic structure, an electronic component 2 having a plurality of terminal electrodes 2a formed on the lower surface and a circuit board 1 having a plurality of electrode pads 1a formed on the upper surface. The plurality of terminal electrodes 2 a and the plurality of electrode pads 1 a are mounted facing each other, and the resin 3 is injected into a region 8 surrounded by the groove 4 between the electronic component 2 and the circuit board 1.

電子部品２は、例えば、集積回路が形成されている電子部品素子がＣＳＰ基板上にフェイスダウンボンディングされた構成の部品である。電子部品素子は、例えば、シリコン半導体基板の下面に論理回路や増幅回路等の半導体回路配線、およびこの半導体回路配線に接続する金バンプ電極が形成された半導体回路素子である。ＣＳＰ基板は、例えば、表面および内部に銅の配線導体を有したポリイミド樹脂の多層回路基板であり、上面に半導体回路素子のバンプ電極と接続する複数のバンプ接続導体が形成され、下面の全体に複数の端子電極２ａが等間隔に配置して形成されている。なお、半導体回路素子はＣＳＰ基板の上面で保護樹脂に覆われている。   The electronic component 2 is, for example, a component having a configuration in which an electronic component element in which an integrated circuit is formed is face-down bonded on a CSP substrate. The electronic component element is, for example, a semiconductor circuit element in which a semiconductor circuit wiring such as a logic circuit or an amplifier circuit and a gold bump electrode connected to the semiconductor circuit wiring are formed on the lower surface of a silicon semiconductor substrate. The CSP substrate is, for example, a polyimide resin multilayer circuit board having copper wiring conductors on the surface and inside, and a plurality of bump connection conductors connected to bump electrodes of the semiconductor circuit element are formed on the upper surface, and the entire lower surface is formed. A plurality of terminal electrodes 2a are formed at equal intervals. The semiconductor circuit element is covered with a protective resin on the upper surface of the CSP substrate.

電子部品２の下面に形成されている複数の端子電極２ａは、電子部品２に形成されている回路配線と接続されており、回路基板１に搭載されたときに、電極パッド１ａを介して回路基板１の配線導体と電気的に接続する役割を有している。なお、本例の端子電極２ａはハンダバンプで形成されている。   A plurality of terminal electrodes 2a formed on the lower surface of the electronic component 2 are connected to circuit wiring formed on the electronic component 2, and when mounted on the circuit board 1, a circuit is provided via the electrode pad 1a. It has a role of being electrically connected to the wiring conductor of the substrate 1. Note that the terminal electrode 2a of this example is formed of solder bumps.

回路基板１は、表面に配線導体を有した単層回路基板、または、表面および内部に配線導体を有した多層回路基板である。回路基板１を形成する材料としては、エポキシ樹脂，ポリイミド樹脂，アクリル樹脂，フェノール樹脂，ポリエステル樹脂等の熱硬化型または紫外線硬化型の樹脂材料や、酸化アルミニウム質焼結体，窒化アルミニウム質焼結体，炭化珪素質焼結体，窒化珪素質焼結体，ガラスセラミック焼結体，ムライト質焼結体等のセラミック材料、またはセラミック材料と樹脂材料との複合材料等の電気絶縁性の材料が挙げられる。   The circuit board 1 is a single-layer circuit board having wiring conductors on the surface or a multilayer circuit board having wiring conductors on the surface and inside. As a material for forming the circuit board 1, thermosetting or ultraviolet curable resin materials such as epoxy resin, polyimide resin, acrylic resin, phenol resin, and polyester resin, aluminum oxide sintered body, aluminum nitride sintered Body, silicon carbide sintered body, silicon nitride sintered body, glass ceramic sintered body, mullite sintered body and other ceramic materials, or composite materials of ceramic materials and resin materials, etc. Can be mentioned.

回路基板１の上面に形成されている複数の電極パッド１ａは、回路基板１の表面または内部の配線導体と接続されており、搭載された電子部品２の端子電極２ａと接続して電子部品２の回路配線と回路基板１の配線導体とを電気的に接続する役割を有している。なお、本例の電極パッド１ａは銅導体で形成されている。   The plurality of electrode pads 1a formed on the upper surface of the circuit board 1 are connected to the surface or internal wiring conductor of the circuit board 1, and connected to the terminal electrode 2a of the mounted electronic component 2 to form the electronic component 2. The circuit wiring and the wiring conductor of the circuit board 1 are electrically connected. The electrode pad 1a of this example is formed of a copper conductor.

また、本発明の回路基板１の上面には、複数の電極パッド１ａを囲む溝４が形成されている。また、溝４は、この溝４によって囲まれる領域８が電子部品２の外周２ｂの内側に位置するように形成されている。さらに、溝４は、不連続部４ａを有する溝として形成されており、全体として１つにつながっていないものとして形成されている。そして、この溝４で囲まれる領域８の電子部品２と回路基板１との間の空間を、不連続部４ａから注入された樹脂３がほぼ満たしている。   Further, a groove 4 surrounding the plurality of electrode pads 1a is formed on the upper surface of the circuit board 1 of the present invention. Further, the groove 4 is formed such that a region 8 surrounded by the groove 4 is located inside the outer periphery 2 b of the electronic component 2. Furthermore, the groove | channel 4 is formed as a groove | channel which has the discontinuous part 4a, and is formed as what is not connected to one as a whole. The space between the electronic component 2 and the circuit board 1 in the region 8 surrounded by the groove 4 is almost filled with the resin 3 injected from the discontinuous portion 4a.

電子部品２および回路基板１の間の溝４で囲まれた領域８に注入されている樹脂３は、電子部品２と回路基板１との接合力を高める役割を持つものであり、材料としては、例えば、エポキシ樹脂，ポリイミド樹脂，アクリル樹脂等の絶縁性・強度の高い樹脂材料が用いられる。   The resin 3 injected into the region 8 surrounded by the groove 4 between the electronic component 2 and the circuit board 1 has a role of increasing the bonding force between the electronic component 2 and the circuit board 1. For example, a resin material having high insulation and strength such as an epoxy resin, a polyimide resin, and an acrylic resin is used.

また、本例の回路基板１の上面には、電子部品２とは異なるチップ部品９が電子部品２に隣接して搭載されている。本例のチップ部品９はチップコンデンサであり、他の電極パッド１ｂとハンダで接合され、電子部品２の電源回路に接続されて、電子部品２に供給される電源電圧を安定化させる役割を有している。   A chip component 9 different from the electronic component 2 is mounted adjacent to the electronic component 2 on the upper surface of the circuit board 1 of this example. The chip component 9 in this example is a chip capacitor, which is joined to the other electrode pads 1b by soldering and connected to the power supply circuit of the electronic component 2 to stabilize the power supply voltage supplied to the electronic component 2. is doing.

本発明の電子装置10は、下面に複数の端子電極２ａが形成されている電子部品２が、上面に複数の電極パッド１ａが形成されている回路基板１上に、複数の端子電極２ａと複数の電極パッド１ａとを対向させて搭載されており、回路基板１の上面に、複数の電極パッド１ａを囲むとともに囲まれる領域８が電子部品２の外周２ｂの内側に位置するような、不連続部４ａを有する溝４が形成されていることから、電子部品２および回路基板１の間の溝４で囲まれた領域８に注入される樹脂３は、溝４の不連続部４ａから注入することによって、電子部品２および回路基板１の間の溝４で囲まれた領域８の内側から満たされていき、電子部品２および回路基板１の間からはみ出そうとすると溝４の開口部で樹脂３に表面張力が働くので、溝４で囲まれた領域８から外側へは流れにくくなり、電子部品２および回路基板１の間に注入された樹脂３のはみ出す量が少ないものとなる。   In the electronic device 10 of the present invention, an electronic component 2 having a plurality of terminal electrodes 2a formed on the lower surface thereof has a plurality of terminal electrodes 2a and a plurality of terminals disposed on the circuit board 1 having a plurality of electrode pads 1a formed on the upper surface. The electrode pad 1a is mounted so as to be opposed to each other, and on the upper surface of the circuit board 1, a region 8 surrounding and surrounded by the plurality of electrode pads 1a is located inside the outer periphery 2b of the electronic component 2 so as to be discontinuous. Since the groove 4 having the portion 4 a is formed, the resin 3 injected into the region 8 surrounded by the groove 4 between the electronic component 2 and the circuit board 1 is injected from the discontinuous portion 4 a of the groove 4. As a result, the resin fills from the inside of the region 8 surrounded by the groove 4 between the electronic component 2 and the circuit board 1, and attempts to protrude from between the electronic component 2 and the circuit board 1 at the opening of the groove 4. Since the surface tension works on 3, Hardly flow from region 8 to the outside, becomes the amount protruding with the resin 3 which is injected between the electronic component 2 and the circuit board 1 is small.

本発明の電子装置10におけるこのような溝４は、幅が回路基板１の上面と電子部品２の下面との間隔よりも大きく設定することが好ましく、また深さは幅の１／４〜１／３に設定することが好ましい。このような幅および深さの溝４とすることにより、注入された樹脂３が溝４の開口部に到達した後、表面張力が働きながら膨らんで溝４の開口部上に張り出した樹脂３が溝４へと入り込みにくくなる。また、溝４で囲まれた領域８は、面積が広いほど回路基板１と電子部品２との接合力を高めることができるので、溝４は、複数の電極パッド１ａが形成されている領域から電子部品２の外周の外側までの間で、電子部品２の外周２ｂに近い位置に形成されていることが好ましい。   Such a groove 4 in the electronic device 10 of the present invention is preferably set to have a width larger than the distance between the upper surface of the circuit board 1 and the lower surface of the electronic component 2, and the depth is 1/4 to 1 of the width. It is preferable to set to / 3. By forming the groove 4 having such a width and depth, after the injected resin 3 reaches the opening of the groove 4, the resin 3 that swells and projects over the opening of the groove 4 while the surface tension works. It becomes difficult to enter the groove 4. Moreover, since the area | region 8 enclosed by the groove | channel 4 can raise the joining force of the circuit board 1 and the electronic component 2 so that an area is large, the groove | channel 4 is from the area | region in which the several electrode pad 1a is formed. It is preferable to be formed at a position close to the outer periphery 2b of the electronic component 2 between the outer periphery of the electronic component 2 and the outside.

また、溝４の不連続部４ａは、樹脂３を注入するところであることから、この付近での樹脂３のはみ出し量が多くなるため、電子部品２とは異なるチップ部品９が付近に形成されていない位置に形成されていることが好ましい。また、溝４の不連続部４ａは、広く形成するほど樹脂３の注入を短時間で行なうことができるようになるが、他方では、広く形成するほどこの付近からのはみ出し量が多くなるので、不連続部４ａの両端をむすぶ長さは１〜５ｍｍに設定されていることが好ましい。   Further, since the discontinuous portion 4a of the groove 4 is where the resin 3 is injected, the amount of the resin 3 protruding in this vicinity increases, so that a chip component 9 different from the electronic component 2 is formed in the vicinity. It is preferable that it is formed at a position that is not present. In addition, as the discontinuous portion 4a of the groove 4 is formed wider, the resin 3 can be injected in a shorter time. On the other hand, the wider the discontinuous portion 4a, the larger the amount of protrusion from the vicinity. It is preferable that the length extending between both ends of the discontinuous portion 4a is set to 1 to 5 mm.

また、本発明の電子装置10によれば、図４に示すように、溝４が電子部品２の長方形状の外周２ｂに対向するように形成されているときには、図３に示すように、溝４の開口部で働く表面張力に加えて電子部品２の外周２ｂでも樹脂３に表面張力が働くので、電子部品２および回路基板１の間に注入された樹脂３のはみ出す量がさらに少ないものとなる。   Further, according to the electronic device 10 of the present invention, as shown in FIG. 4, when the groove 4 is formed so as to face the rectangular outer periphery 2b of the electronic component 2, as shown in FIG. In addition to the surface tension acting at the opening 4, the surface tension acts on the resin 3 also on the outer periphery 2 b of the electronic component 2, so that the amount of the resin 3 injected between the electronic component 2 and the circuit board 1 is further reduced. Become.

また、本発明の電子装置10によれば、特に本例のように外周２ｂが長方形状の電子部品２を用いており、溝４がひとつながりであるとともに不連続部４ｂが電子部品２の外周２ｂの１つの隅部と対向しているときには、電子部品２および回路基板１の間の溝４で囲まれた領域８に、中心から最も離れた位置となる不連続部４ａから樹脂３が注入されるので、樹脂３が溝４で囲まれた領域８からはみ出そうとする力が弱まり、樹脂８がはみ出す量がより少ないものとなる。これに加えて、溝４が電子部品２の外周２ｂに対向するように形成されているときには、電子部品２の外周２ｂの３つの隅部と対向する部分と、樹脂３を注入する溝４の不連続部４ａとの距離が離れることになるので、樹脂３がはみ出そうとする力が集中する隅部に対してもはみ出そうとする力が弱まり、樹脂３がはみ出す量を少なくする効果が特に高いものとなる。   In addition, according to the electronic device 10 of the present invention, the electronic component 2 having a rectangular outer periphery 2b is used as in this example, the groove 4 is connected and the discontinuous portion 4b is the outer periphery of the electronic component 2. When facing one corner of 2b, the resin 3 is injected into the region 8 surrounded by the groove 4 between the electronic component 2 and the circuit board 1 from the discontinuous portion 4a which is the farthest from the center. Therefore, the force that the resin 3 tries to protrude from the region 8 surrounded by the groove 4 is weakened, and the amount of the resin 8 that protrudes becomes smaller. In addition to this, when the groove 4 is formed so as to face the outer periphery 2b of the electronic component 2, a portion facing the three corners of the outer periphery 2b of the electronic component 2 and the groove 4 into which the resin 3 is injected are formed. Since the distance from the discontinuous portion 4a is increased, the force of the resin 3 to protrude from the corner where the force of the resin 3 is concentrated is weakened, and the effect of reducing the amount of the resin 3 protruding is particularly reduced. It will be expensive.

本発明の電子装置10は、以下に示す方法によって作製することができる。   The electronic device 10 of the present invention can be manufactured by the following method.

（工程１）
先ず、下面に複数の端子電極２ａが形成されている電子部品２を準備する。このような電子部品２は、例えば、集合基板を用いて作製することができる。集合基板としては、複数の前述のＣＳＰ基板が縦横の並びに一体となって配置しているものを用意する。この集合基板の各ＣＳＰ基板上のそれぞれに電子部品素子をフェイスダウンボンディングし、トランスファモールド等によってそれぞれの電子部品素子を覆うように集合基板の上面に未硬化の保護樹脂を塗布して硬化させ、ダイシング等によって集合基板を各ＣＳＰ基板へ分割するように保護樹脂とともに切断する。このように集合基板を用いることによって、効率的に大量の電子部品２を作製することができる。端子電極２ａは、予め集合基板の状態でＣＳＰ基板の下面のハンダバンプの下地となる複数の導体上にハンダペーストを同量ずつ塗布しておいて、加熱して溶融させ、冷却して固化させることにより形成することができる。 (Process 1)
First, an electronic component 2 having a plurality of terminal electrodes 2a formed on the lower surface is prepared. Such an electronic component 2 can be produced using, for example, a collective substrate. As the collective substrate, a substrate in which a plurality of the above-mentioned CSP substrates are integrally arranged in the vertical and horizontal directions is prepared. Electronic component elements are face-down bonded to each of the CSP substrates of the collective substrate, and an uncured protective resin is applied and cured on the upper surface of the collective substrate so as to cover each electronic component element with a transfer mold or the like, The collective substrate is cut together with the protective resin so as to be divided into each CSP substrate by dicing or the like. By using the collective substrate in this way, a large amount of electronic components 2 can be efficiently manufactured. The terminal electrode 2a is preliminarily coated with a same amount of solder paste on a plurality of conductors which are the bases of solder bumps on the lower surface of the CSP substrate in the state of a collective substrate, heated and melted, and cooled and solidified. Can be formed.

また、上面に、複数の端子電極２ａに対応した複数の電極パッド１ａを形成した回路基板１を準備する。さらに、本発明の電子部品10の製造方法においては、回路基板１の上面には、この複数の電極パッド１ａを囲み、かつ囲まれる領域８が電子部品２の外周２ｂの内側に位置するような、不連続部４ａを有する溝４を形成する。このような回路基板１を作製する方法について、回路基板１の材料としてガラス布基材エポキシ樹脂を用い、表面または内部の配線導体および複数の電極パッド１ａの材料として銅を用いた具体例を以下に示す。   In addition, a circuit board 1 having a plurality of electrode pads 1a corresponding to the plurality of terminal electrodes 2a formed on the upper surface is prepared. Furthermore, in the method for manufacturing the electronic component 10 according to the present invention, the upper surface of the circuit board 1 surrounds the plurality of electrode pads 1a, and the surrounded region 8 is located inside the outer periphery 2b of the electronic component 2. Then, the groove 4 having the discontinuous portion 4a is formed. About the method of producing such a circuit board 1, the specific example using a glass cloth base material epoxy resin as a material of the circuit board 1 and using copper as a material of the surface or internal wiring conductor and the plurality of electrode pads 1a is as follows. Shown in

先ず、銅箔を用意し、その表面に未硬化のフォトレジストをコーティングして、この上にパターンフィルムを重ねて露光して現像することによりフォトレジストを形成する。次に、フォトレジストが形成された銅箔をエッチングしてからフォトレジストを除去し、洗浄・乾燥することにより銅導体パターンを形成する。次に、ガラス布基材にエポキシ樹脂を含浸させた半硬化状態のプリプレグを用意し、このプリプレグと前述した銅導体パターンとを交互に積み重ね、加熱・加圧してプリプレグを硬化させ、所定の形状に安定させる。そして、得られた積層体の所定位置にドリルを用いてスルーホールを形成し、スルーホールの内壁にめっき層を形成して配線導体および複数の電極パッド１ａとの接続を行なった後、この積層体を所定の寸法に分割することにより回路基板１が完成する。なお、溝４は、積層体の最上層を構成するプリプレグに、予めレーザー等を用いて溝４と同じ形状の貫通部を設けておくことにより形成することができる。   First, a copper foil is prepared, an uncured photoresist is coated on the surface thereof, a pattern film is overlaid thereon, and the photoresist is formed by exposure and development. Next, after etching the copper foil on which the photoresist is formed, the photoresist is removed, and the copper conductor pattern is formed by washing and drying. Next, prepare a semi-cured prepreg in which a glass cloth base material is impregnated with epoxy resin, stack this prepreg and the copper conductor pattern alternately, heat and press to cure the prepreg, To stabilize. Then, a through hole is formed at a predetermined position of the obtained laminated body using a drill, a plating layer is formed on the inner wall of the through hole, and the wiring conductor and the plurality of electrode pads 1a are connected. The circuit board 1 is completed by dividing the body into predetermined dimensions. In addition, the groove | channel 4 can be formed by providing the penetration part of the same shape as the groove | channel 4 previously using the laser etc. in the prepreg which comprises the uppermost layer of a laminated body.

また、図には示していないが、回路基板１の上面の溝４の不連続部４ａ、電極パッド１ａおよび他の電極パッド１ｂ以外の部分には、ハンダレジストが形成されている。ハンダレジストは、例えば、回路基板１の上面に、未硬化のエポキシ樹脂に感光性の硬化剤を加えたインクをメッシュのスクリーンを用いて塗布して一定時間放置し、塗布したインクの形状が安定した後に一定時間加熱して乾燥させ、乾燥したインクを、不連続部４ａおよび電極パッド１ａ，１ｂに対応する部分が遮光されるようにしたパターンフィルムを重ねてから回路基板１の上方より露光し、現像することにより、不連続部４ａ、電極パッド１ａおよび他の電極パッド１ｂが露出するように形成することができる。このハンダレジストを形成することによって、溝４の深さをさらに深いものにすることができる。   Although not shown in the drawing, solder resist is formed on portions other than the discontinuous portion 4a of the groove 4 on the upper surface of the circuit board 1, the electrode pad 1a, and the other electrode pads 1b. For example, the solder resist is coated on the upper surface of the circuit board 1 with an uncured epoxy resin plus a photosensitive curing agent using a mesh screen and allowed to stand for a certain period of time, so that the shape of the applied ink is stable. After that, the film is heated and dried for a certain period of time, and the dried ink is exposed from above the circuit board 1 after overlaying a pattern film in which the discontinuous portions 4a and portions corresponding to the electrode pads 1a and 1b are shielded from light. By developing, the discontinuous portion 4a, the electrode pad 1a, and the other electrode pad 1b can be formed to be exposed. By forming this solder resist, the depth of the groove 4 can be further increased.

（工程２）
次に、電極パッド１ａ上にフラックスを塗布しておいて、端子電極２ａと電極パッド１ａとを対向させながら回路基板１上に電子部品２を載置しておいて、これらを加熱してハンダバンプとしての端子電極２ａを溶融させ、しかる後に冷却して固化させることにより、端子電極２ａと電極パッド１ａとを対向させながら接続して、回路基板１上に電子部品２を搭載する。なお、加熱する際に、回路基板１上の他の電極パッド１ｂ上にはハンダペーストを塗布しておき、この上にチップコンデンサとしてのチップ部品９を載置しておくことにより、回路基板１の上面にハンダにより接続してチップ部品９を搭載することができる。 (Process 2)
Next, a flux is applied on the electrode pad 1a, the electronic component 2 is placed on the circuit board 1 with the terminal electrode 2a and the electrode pad 1a facing each other, and these are heated to form solder bumps. Then, the terminal electrode 2a is melted and then cooled and solidified, whereby the terminal electrode 2a and the electrode pad 1a are connected to face each other, and the electronic component 2 is mounted on the circuit board 1. In addition, when heating, a solder paste is applied on the other electrode pad 1b on the circuit board 1, and a chip component 9 as a chip capacitor is placed thereon, whereby the circuit board 1 The chip component 9 can be mounted on the upper surface of the chip by connecting it with solder.

（工程３）
次に、溶剤，エポキシ樹脂，熱硬化剤等を混合し、さらに界面活性剤を添加して粘度を調整した未硬化の樹脂を作製しておき、この未硬化の樹脂を、電子部品２および回路基板１の間の溝４で囲まれた領域８に、溝４の不連続部４ａから注入する。 (Process 3)
Next, an uncured resin is prepared by mixing a solvent, an epoxy resin, a thermosetting agent, and the like, and further adding a surfactant to adjust the viscosity. The uncured resin is used as the electronic component 2 and the circuit. A region 8 surrounded by the groove 4 between the substrates 1 is injected from the discontinuous portion 4 a of the groove 4.

このとき、工程１において、回路基板１の上面に、複数の端子電極２ａに対応した複数の電極パッド１ａを形成するとともに、この複数の電極パッド１ａを囲み、かつ囲まれる領域８が電子部品２の外周２ｂの内側に位置するような、不連続部４ａを有する溝４を形成しているので、この工程３において、溝４の不連続部４ａから未硬化の樹脂を注入することにより、未硬化の樹脂が電子部品２および回路基板１の間の溝４で囲まれた領域８の内側から満たされるようにして、溝４の開口部で未硬化の樹脂に表面張力を働かせることができる。これにより、未硬化の樹脂が溝４で囲まれた領域８から外側へは流れにくくなり、電子部品２および回路基板１の間に注入された未硬化の樹脂のはみ出す量が少ないものとなる。仮に、溝４に不連続部４ａを形成せずに溝４を越えるようにして未硬化の樹脂を注入した場合には、電子部品２および回路基板１の間の溝４で囲まれた領域に比べて流れやすい溝４へと先に未硬化の樹脂が満たされていき、溝４に満たされた未硬化の樹脂が、領域８に流れるよりも先に溝４から溢れて電子部品２の外周２ｂから未硬化の樹脂がはみ出す、という現象が発生しやすいものとなる。   At this time, in step 1, a plurality of electrode pads 1 a corresponding to the plurality of terminal electrodes 2 a are formed on the upper surface of the circuit board 1, and the region 8 surrounding and surrounding the plurality of electrode pads 1 a is an electronic component 2. In this step 3, the uncured resin is injected from the discontinuous portion 4a of the groove 4 so that the uncured resin is injected. The cured resin is filled from the inside of the region 8 surrounded by the groove 4 between the electronic component 2 and the circuit board 1, and surface tension can be applied to the uncured resin at the opening of the groove 4. This makes it difficult for uncured resin to flow outward from the region 8 surrounded by the grooves 4, and the amount of uncured resin injected between the electronic component 2 and the circuit board 1 is small. If the uncured resin is injected so as to cross the groove 4 without forming the discontinuous portion 4a in the groove 4, the region surrounded by the groove 4 between the electronic component 2 and the circuit board 1 is used. The uncured resin is filled first into the grooves 4 that are easier to flow, and the uncured resin filled in the grooves 4 overflows from the grooves 4 before flowing into the region 8 and the outer periphery of the electronic component 2. The phenomenon that uncured resin protrudes from 2b is likely to occur.

また、電子部品２および回路基板１の間のこのような溝４で囲まれる領域８に注入される樹脂３としては、粘度を低くしておいたほうが電子部品２および回路基板１の間に入り込んでいきやすいが、前述したように、溝４の開口部で、樹脂３がはみ出そうとする力を弱めるだけの表面張力が必要であるため、4.0〜20Ｐａ・ｓの粘度に調整しておくことが好ましい。   Further, as the resin 3 to be injected into the region 8 surrounded by the groove 4 between the electronic component 2 and the circuit board 1, the resin 3 having a lower viscosity enters between the electronic component 2 and the circuit board 1. However, as described above, since the surface tension necessary to weaken the force of the resin 3 to protrude from the opening of the groove 4 is necessary, the viscosity should be adjusted to 4.0 to 20 Pa · s. Is preferred.

また、溝４の内側の側面と領域８とがなす角度が小さいほど前述の表面張力が大きくなるので、本例の電子装置10の製造方法によれば、回路基板１の上面に露光・現像により形成したハンダレジストが溝４の開口を形成していることから、ハンダレジストの開口部は断面を見ると切り立った形状となるので、溝４の内側の側面と領域８の面とがなす角度を略90°とすることができ、未硬化の樹脂のはみ出す量が特に少ないものとなる。   In addition, since the surface tension increases as the angle formed between the inner side surface of the groove 4 and the region 8 decreases, according to the method of manufacturing the electronic device 10 of this example, the upper surface of the circuit board 1 is exposed and developed. Since the formed solder resist forms the opening of the groove 4, the opening of the solder resist has a sharp shape when the cross section is viewed. Therefore, the angle formed between the inner side surface of the groove 4 and the surface of the region 8 is set. The angle can be approximately 90 °, and the amount of uncured resin that protrudes is particularly small.

（工程４）
そして、未硬化の樹脂が溝４で囲まれた領域８の全体を満たした後、これらを加熱することにより、未硬化の樹脂を熱硬化させ、電子部品２および回路基板１の間の溝４で囲まれた領域８に樹脂３が注入されている本発明の電子装置10を作製することができる。 (Process 4)
Then, after the uncured resin fills the entire region 8 surrounded by the grooves 4, the uncured resin is thermally cured by heating them, and the grooves 4 between the electronic component 2 and the circuit board 1 are heated. Thus, the electronic device 10 of the present invention in which the resin 3 is injected into the region 8 surrounded by the above can be manufactured.

また、工程１において、図４に示すように、溝４を、開口部が電子部品２の外周２ｂに対向するように形成するときには、図３に示すように、溝４の開口部で働く表面張力に加えて電子部品２の外周２ｂでも未硬化の樹脂に表面張力が働くので、電子部品２および回路基板１の間に注入された未硬化の樹脂が溝４で囲まれた領域８からはみ出そうとする力を抑える力が強くなり、未硬化の樹脂のはみ出す量がさらに少ないものとなる。   Further, in step 1, when the groove 4 is formed so that the opening faces the outer periphery 2b of the electronic component 2 as shown in FIG. 4, the surface working at the opening of the groove 4 as shown in FIG. In addition to the tension, surface tension acts on the uncured resin on the outer periphery 2 b of the electronic component 2, so that the uncured resin injected between the electronic component 2 and the circuit board 1 protrudes from the region 8 surrounded by the groove 4. The force which suppresses the force to do so becomes strong, and the amount of uncured resin that protrudes is further reduced.

また、本発明の電子装置10の製造方法によれば、外周２ｂが長方形状の電子部品２を用いて、工程１において、溝４を、ひとつながりに、かつ不連続部４ａが電子部品２の外周２ｂの１つの隅部と対向するように形成するときには、溝４をひとつながりにすることによって、未硬化の樹脂が溝４で囲まれた領域８からはみ出そうとすると、未硬化の樹脂は溝４に沿った方向に流れていき、さらに、電子部品２および回路基板１の間の溝４で囲まれた領域８には中心から最も離れた位置から未硬化の樹脂が注入されるので、未硬化の樹脂が溝４で囲まれた領域８からはみ出そうとする力が弱まり、未硬化の樹脂がはみ出す量がより少ないものとなる。これに加えて、溝４が電子部品２の外周２ｂに対向するように形成されているときには、電子部品２の外周２ｂの３つの隅部と対向する部分と、未硬化の樹脂を注入する溝４の不連続部４ａとの距離が離れることになるので、未硬化の樹脂のはみ出そうとする力が集中する隅部に対してもはみ出そうとする力が弱まり、未硬化の樹脂がはみ出す量を少なくする効果が特に高いものとなる。   Further, according to the method for manufacturing the electronic device 10 of the present invention, the outer periphery 2b of the electronic component 2 having the rectangular shape is used, and in step 1, the grooves 4 are connected together and the discontinuous portion 4a is the electronic component 2. When it is formed so as to face one corner of the outer periphery 2b, if the uncured resin tries to protrude from the region 8 surrounded by the grooves 4 by connecting the grooves 4, the uncured resin is Since the resin flows in the direction along the groove 4 and uncured resin is injected into the region 8 surrounded by the groove 4 between the electronic component 2 and the circuit board 1 from the position farthest from the center, The force of the uncured resin that protrudes from the region 8 surrounded by the groove 4 is weakened, and the amount of the uncured resin that protrudes is smaller. In addition, when the groove 4 is formed so as to face the outer periphery 2b of the electronic component 2, a portion facing the three corners of the outer periphery 2b of the electronic component 2 and a groove for injecting uncured resin Since the distance from the discontinuous part 4a of 4 is increased, the force to protrude from the corner where the force of the uncured resin is concentrated is weakened, and the amount of the uncured resin is projected. The effect of reducing the amount is particularly high.

かくして、本発明の電子装置10は、電子部品２および回路基板１の間に注入された樹脂３がはみ出す量を少なくすることができるので、電子部品２の近くに搭載されたチップ部品９にはみ出した樹脂３が到達することが極めて少なくなり、電子部品２およびチップ部品９の搭載密度を高くすることができるとともに、信頼性を高くすることもできる。その結果、車載用の電子機器のように、高い信頼性が要求される電子機器に組み込む電子装置10として利用することができる。   Thus, the electronic device 10 of the present invention can reduce the amount of the resin 3 injected between the electronic component 2 and the circuit board 1, so that it protrudes into the chip component 9 mounted near the electronic component 2. In addition, it is possible to increase the mounting density of the electronic components 2 and the chip components 9 and to increase the reliability. As a result, the electronic device 10 can be used in an electronic device that requires high reliability, such as a vehicle-mounted electronic device.

なお、本発明は以上に説明した実施の形態の例に限定されるものではなく、本発明の要旨を逸脱しない範囲において種々の変更や改良等が可能である。   It should be noted that the present invention is not limited to the embodiments described above, and various modifications and improvements can be made without departing from the scope of the present invention.

例えば、本例においては、用いた電子部品２が小型の部品であるため、図４に示すように溝４は１本のみ形成されているが、電子部品２が大型の部品であって、回路基板１と電子部品２と間における樹脂３で接合する面積の比率を少なくしても充分な接合力が得られる場合には、溝４が、複数の電極パッド１ａが形成されている領域から電子部品２の外周の外側までの間に複数本形成されていてもよく、これにより樹脂３がはみ出す量をより少なくすることができる。   For example, in this example, since the electronic component 2 used is a small component, only one groove 4 is formed as shown in FIG. 4, but the electronic component 2 is a large component, In the case where a sufficient bonding force can be obtained even if the ratio of the area bonded by the resin 3 between the substrate 1 and the electronic component 2 is reduced, the grooves 4 are formed from the region where the plurality of electrode pads 1a are formed. A plurality of parts may be formed between the outer periphery of the component 2 and the amount of the resin 3 protruding can be further reduced.

また、電子部品２として半導体回路素子がＣＳＰ基板上に搭載されたものを用いているが、この他にも、電子部品２としてはＣＳＰ基板を用いないベアチップの半導体回路素子を用いることもできる。この場合には、電子部品２と回路基板１との間に注入されている樹脂３は、ベアチップの下面に形成されている微細な回路配線を封止する役割も持つことになる。   In addition, a semiconductor circuit element mounted on a CSP substrate is used as the electronic component 2, but a bare-chip semiconductor circuit element that does not use a CSP substrate can also be used as the electronic component 2. In this case, the resin 3 injected between the electronic component 2 and the circuit board 1 also serves to seal fine circuit wiring formed on the bottom surface of the bare chip.

また、本例においては端子電極２ａはハンダバンプで形成されているが、これ以外に、電子部品２としてベアチップを用いる場合であれば端子電極２ａに金バンプを用いてもよい。この場合、ベアチップを回路基板１上に搭載する方法としては、電極パッド１ａ上にはフラックスを塗布させない状態で金バンプ（端子電極２ａ）と電極パッド１ａとを対向させながら回路基板１上にベアチップを載置しておいて、ベアチップ上から加圧しつつ振動させながら加熱することにより、金バンプ（端子電極２ａ）を電極パッド１ａに接合させる方法を採用すればよい。   Further, in this example, the terminal electrode 2a is formed by solder bumps. However, in addition to this, if a bare chip is used as the electronic component 2, gold bumps may be used for the terminal electrode 2a. In this case, as a method of mounting the bare chip on the circuit board 1, the bare chip is placed on the circuit board 1 while the gold bump (terminal electrode 2a) and the electrode pad 1a are opposed to each other with no flux applied on the electrode pad 1a. And a method of joining the gold bump (terminal electrode 2a) to the electrode pad 1a by heating while vibrating while applying pressure from above the bare chip.

以下のようにして、本発明の電子装置10のサンプルを作製し、樹脂３のはみ出し量を評価した。   A sample of the electronic device 10 of the present invention was prepared as follows, and the amount of protrusion of the resin 3 was evaluated.

電子部品２には、縦が11ｍｍで横が８ｍｍのＣＳＰ基板上にベアチップのＤＳＰ（Digital Signal Processor）がフェイスダウンボンディングされ、さらにこのベアチップを覆うように保護樹脂としてのエポキシ樹脂が形成されたものを用いた。なお、下面に形成された複数の端子電極２ａはハンダバンプで形成した。   In the electronic component 2, a bare chip DSP (Digital Signal Processor) is face-down bonded on a CSP substrate having a length of 11 mm and a width of 8 mm, and an epoxy resin as a protective resin is formed so as to cover the bare chip. Was used. The plurality of terminal electrodes 2a formed on the lower surface were formed by solder bumps.

回路基板１は、ガラス布基材エポキシ樹脂からなる厚み0.55ｍｍの多層回路基板を用いた。なお、回路基板１上に形成された複数の電極パッド１ａの材料としては銅を用いた。また、複数の電極パッド１ａを囲み、かつ囲まれる領域８が電子部品２の外周２ｂの内側に位置するような、不連続部４ａを有する溝４は、多層回路基板を構成する積層体のプリプレグの１層分を貫通するものとし、幅が0.4ｍｍで深さが0.11ｍｍとなるように形成した。   As the circuit board 1, a 0.55 mm thick multilayer circuit board made of glass cloth base epoxy resin was used. Note that copper was used as the material of the plurality of electrode pads 1 a formed on the circuit board 1. Further, the groove 4 having the discontinuous portion 4a surrounding the plurality of electrode pads 1a and having the surrounded region 8 located inside the outer periphery 2b of the electronic component 2 is a prepreg of a laminate constituting the multilayer circuit board. It was formed so as to penetrate through one layer of the film, having a width of 0.4 mm and a depth of 0.11 mm.

このような回路基板１上に、複数の端子電極２ａと複数の電極パッド１ａとを対向させて、回路基板１の上面と電子部品２の下面との間隔が0.22ｍｍとなるように前述の電子部品２を搭載した。また、電子部品２との間隔が0.3ｍｍとなる近傍の位置に、チップ部品９としてのチップコンデンサを搭載した。   A plurality of terminal electrodes 2a and a plurality of electrode pads 1a are opposed to each other on such a circuit board 1 so that the distance between the upper surface of the circuit board 1 and the lower surface of the electronic component 2 is 0.22 mm. Part 2 was mounted. Further, a chip capacitor as the chip component 9 was mounted at a position in the vicinity where the distance from the electronic component 2 was 0.3 mm.

そして、溶剤，エポキシ樹脂，熱硬化剤等を混合し、さらに界面活性剤を添加して粘度を６〜12Ｐａ・ｓに調整した未硬化の樹脂を作製しておき、この未硬化の樹脂を、電子部品２および回路基板１の間の溝４で囲まれた領域８に、溝４の不連続部４ａから注入した。その後、これらを150℃のオーブンで１時間加熱することにより、未硬化の樹脂を熱硬化させ、電子部品２および回路基板１の間の溝４で囲まれた領域８に樹脂３が注入された本発明の電子装置10のサンプルを作製した。   Then, a solvent, an epoxy resin, a thermosetting agent, etc. are mixed, and a surfactant is added to prepare an uncured resin having a viscosity adjusted to 6 to 12 Pa · s. A region 8 surrounded by the groove 4 between the electronic component 2 and the circuit board 1 was injected from the discontinuous portion 4 a of the groove 4. Thereafter, these were heated in an oven at 150 ° C. for 1 hour to thermally cure the uncured resin, and the resin 3 was injected into the region 8 surrounded by the groove 4 between the electronic component 2 and the circuit board 1. A sample of the electronic device 10 of the present invention was produced.

また、比較例として、上面に溝が形成されていない回路基板と、上面に不連続部４ａを有しないで長方形の外周状に連続したひとつながりの溝が形成されている回路基板とを用いて同様の条件で、電子装置のサンプルをそれぞれ作製した。   In addition, as a comparative example, a circuit board in which no groove is formed on the upper surface and a circuit board in which continuous grooves are formed in a rectangular outer periphery without the discontinuous portion 4a on the upper surface are used. Under the same conditions, samples of electronic devices were produced.

本発明の電子装置10のサンプルおよび比較例のサンプルについて、チップ部品９への樹脂３の接触状態を観察したところ、比較例のサンプルについてはいずれも樹脂３が電子部品２および回路基板の間からはみ出してチップ部品９と接触していたが、本発明の電子装置10のサンプルについては、樹脂３は電子部品２および回路基板１の間の溝４で囲まれた領域８からはみ出さず、チップ部品９に接触していなかった。   When the contact state of the resin 3 to the chip component 9 was observed for the sample of the electronic device 10 and the sample of the comparative example of the present invention, the resin 3 was found between the electronic component 2 and the circuit board for the sample of the comparative example. Although it protruded and was in contact with the chip component 9, for the sample of the electronic device 10 of the present invention, the resin 3 did not protrude from the region 8 surrounded by the groove 4 between the electronic component 2 and the circuit board 1. The component 9 was not touched.

すなわち、本発明の電子装置10によれば、回路基板１の上面に、複数の端子電極２ａに対応した複数の電極パッド１ａを形成するとともに、この複数の電極パッド１ａを囲み、かつ囲まれる領域８が電子部品２の外周２ｂの内側に位置するような、不連続部４ａを有する溝４を形成しておいて、電子部品２を搭載した後に、この溝４の不連続部４ａから未硬化の樹脂を注入することにより、未硬化の樹脂が電子部品２および回路基板１の間の溝４で囲まれた領域８の内側から満たされるようにしているので、溝４の開口部で未硬化の樹脂に表面張力を働かせることができ、未硬化の樹脂が溝４で囲まれた領域８から外側へ流れにくくして、電子部品２および回路基板１の間に注入された樹脂３のはみ出す量を少なくすることができることが確認できた。   That is, according to the electronic device 10 of the present invention, a plurality of electrode pads 1a corresponding to the plurality of terminal electrodes 2a are formed on the upper surface of the circuit board 1, and the plurality of electrode pads 1a are surrounded and surrounded by the regions. A groove 4 having a discontinuous portion 4a is formed such that 8 is positioned inside the outer periphery 2b of the electronic component 2, and after the electronic component 2 is mounted, the discontinuous portion 4a of the groove 4 is uncured. Since the uncured resin is filled from the inside of the region 8 surrounded by the groove 4 between the electronic component 2 and the circuit board 1, the uncured resin is uncured at the opening of the groove 4. The amount of the resin 3 that is injected between the electronic component 2 and the circuit board 1 can be exerted by exerting a surface tension on the resin, making it difficult for the uncured resin to flow outward from the region 8 surrounded by the grooves 4. It is certain that It could be.

本発明の電子装置の一例の要部を示す外観斜視図である。It is an external appearance perspective view which shows the principal part of an example of the electronic device of this invention. 図１のＡ−Ａ’線断面図である。FIG. 2 is a cross-sectional view taken along line A-A ′ of FIG. 1. 図２のＺ部を拡大して示す拡大断面図である。It is an expanded sectional view which expands and shows the Z section of FIG. 電子部品が搭載されている部分を電子部品を透視して上方から回路基板を見た平面図である。It is the top view which looked at the circuit board from the upper part, seeing through the electronic component the part in which the electronic component is mounted.

符号の説明Explanation of symbols

１・・・回路基板
１ａ・・・電極パッド
２・・・電子部品
２ａ・・・端子電極
３・・・樹脂
４・・・溝
４ａ・・・（溝の）不連続部
８・・・（溝で）囲まれる領域（囲まれた領域）
10・・・電子装置 DESCRIPTION OF SYMBOLS 1 ... Circuit board 1a ... Electrode pad 2 ... Electronic component 2a ... Terminal electrode 3 ... Resin 4 ... Groove 4a ... (groove) discontinuous part 8 ... ( Enclosed area (enclosed area)
10 ... Electronic device

Claims (6)

下面に複数の端子電極が形成されている電子部品が、上面に複数の電極パッドが形成されている回路基板上に、前記複数の端子電極と前記複数の電極パッドとを対向させて搭載されており、前記回路基板の上面に、前記複数の電極パッドを囲むとともに囲まれる領域が前記電子部品の外周の内側に位置するような、不連続部を有する溝が形成されており、前記電子部品および前記回路基板の間の前記溝で囲まれた領域に樹脂が注入されていることを特徴とする電子装置。   An electronic component having a plurality of terminal electrodes formed on a lower surface is mounted on a circuit board having a plurality of electrode pads formed on an upper surface with the plurality of terminal electrodes and the plurality of electrode pads facing each other. A groove having a discontinuous portion is formed on the upper surface of the circuit board so that a region surrounding and surrounded by the plurality of electrode pads is located inside the outer periphery of the electronic component; An electronic device, wherein a resin is injected into a region surrounded by the groove between the circuit boards. 前記溝は、前記電子部品の外周に対向するように形成されていることを特徴とする請求項１に記載の電子装置。   The electronic device according to claim 1, wherein the groove is formed to face an outer periphery of the electronic component. 前記電子部品の外周が長方形状であり、前記溝がひとつながりであるとともに不連続部が前記電子部品の外周の１つの隅部と対向していることを特徴とする請求項１または請求項２に記載の電子装置。   The outer periphery of the electronic component is rectangular, the groove is connected, and the discontinuous portion faces one corner of the outer periphery of the electronic component. An electronic device according to 1. 下面に複数の端子電極が形成されている電子部品を準備し、回路基板の上面に、前記複数の端子電極に対応した複数の電極パッドを形成するとともに、該複数の電極パッドを囲み、かつ囲まれる領域が前記電子部品の外周の内側に位置するような、不連続部を有する溝を形成する工程１と、
前記端子電極と前記電極パッドとを対向させながら接続して、前記回路基板上に前記電子部品を搭載する工程２と、
前記電子部品および前記回路基板の間の前記溝で囲まれた領域に、前記溝の不連続部から未硬化の樹脂を注入する工程３と、
前記未硬化の樹脂を硬化させる工程４と
を含む電子装置の製造方法。 An electronic component having a plurality of terminal electrodes formed on the lower surface is prepared, and a plurality of electrode pads corresponding to the plurality of terminal electrodes are formed on the upper surface of the circuit board, and the plurality of electrode pads are surrounded and surrounded. Forming a groove having a discontinuous portion such that a region to be formed is located inside the outer periphery of the electronic component; and
Connecting the terminal electrode and the electrode pad facing each other and mounting the electronic component on the circuit board; and
Injecting uncured resin from a discontinuous portion of the groove into a region surrounded by the groove between the electronic component and the circuit board; and
A method of manufacturing an electronic device, comprising: a step 4 of curing the uncured resin. 前記工程１において、前記溝を、開口が前記電子部品の外周に位置するように形成することを特徴とする請求項４に記載の電子装置の製造方法。   5. The method of manufacturing an electronic device according to claim 4, wherein in the step 1, the groove is formed so that an opening is positioned on an outer periphery of the electronic component. 前記外周が長方形状の前記電子部品を用いて、前記工程１において、前記溝を、ひとつながりに、かつ前記不連続部が前記電子部品の外周の１つの隅部と対向するように形成することを特徴とする請求項４または請求項５に記載の電子装置の製造方法。   Using the electronic component having a rectangular outer periphery, in the step 1, the grooves are formed so as to be connected to each other so that the discontinuous portion faces one corner of the outer periphery of the electronic component. The method for manufacturing an electronic device according to claim 4, wherein:
JP2007078280A 2007-03-26 2007-03-26 Electronic device and its manufacturing method Pending JP2008243879A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014146687A (en) * 2013-01-29 2014-08-14 Stanley Electric Co Ltd Flip chip type semiconductor element, semiconductor device and method for manufacturing the same
WO2023035101A1 (en) * 2021-09-07 2023-03-16 华为技术有限公司 Chip packaging structure and method for preparing chip packaging structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014146687A (en) * 2013-01-29 2014-08-14 Stanley Electric Co Ltd Flip chip type semiconductor element, semiconductor device and method for manufacturing the same
WO2023035101A1 (en) * 2021-09-07 2023-03-16 华为技术有限公司 Chip packaging structure and method for preparing chip packaging structure

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