JP2008237914A - Imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an imaging apparatus which can be made compact and suppress a rise in temperature of a solid-state imaging device thereby causing no deterioration in electrical characteristics relating to temperature dependency of the solid-state imaging device. <P>SOLUTION: The imaging apparatus 24 includes a circuit board 42 mounted with the solid-state imaging device 41, electronic parts 43, 43a and a signal line 39, wherein the solid-state imaging device 41 and an integrated circuit 44 among the electronic parts are placed on both ends of the circuit board and mounted electronic parts and the signal line are placed between the solid-state imaging device 41 and the integrated circuit 44 and the signal line 30 is placed near the solid-state imaging device 41 and the integrated circuit 44, the solid-state imaging device 41 is placed so that the imaging face is almost in parallel with the axial direction, the electronic parts are placed so that the outline height thereof is lower than the outline height of the solid-state imaging device and the signal line is placed near the integrated circuit among the electronic parts. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an imaging apparatus that is provided at the tip of an electronic endoscope and performs imaging with a solid-state imaging device.

  As a prior art, there is JP-A-8-106055. In the solid-state imaging device disclosed in Japanese Patent Laid-Open No. 8-106055, a circuit element of a drive circuit is disposed at the same position as the solid-state imaging element via a substrate, and a cable is disposed at the rear of the substrate. In the solid-state imaging device having the configuration of JP-A-8-106055, the heat generated by the drive circuit is directly transmitted to the solid-state imaging device, and there is a risk that the electrical characteristics related to the temperature dependence of the solid-state imaging device are deteriorated.

  As electronic endoscopes become smaller in diameter, it is necessary to reduce the size of solid-state imaging devices. As the solid-state imaging device is downsized, the solid-state imaging device is downsized and the light-receiving unit is reduced. To maintain the conventional sensitivity, the gain tends to increase in the solid-state imaging device. It is in.

  As a result, when the solid-state imaging device generates heat and there is a tendency to arrange an integrated circuit (abbreviated as IC) for amplifying the output signal of the solid-state imaging device closer to the solid-state imaging device, There was concern about temperature rise. As a result, how to improve the temperature-dependent characteristics such as noise has become a problem.

  The present invention has been made in view of the above-described points, and can be miniaturized, can suppress the temperature rise of the solid-state imaging device, and can prevent deterioration of the electrical characteristics related to the temperature dependence of the solid-state imaging device. An object is to provide an imaging device.

An imaging apparatus of the present invention is an imaging apparatus having a circuit board on which a solid-state imaging device, an electronic component, and a signal line are mounted.
An integrated circuit of the solid-state imaging device and the electronic component is disposed at both ends of the circuit board, the mounting electronic component and a signal line are disposed between the solid-state imaging device and the integrated circuit, and the solid-state imaging device Is arranged such that the imaging surface is substantially parallel to the axial direction, and the electronic component is arranged such that the height of the outer shape is lower than the height of the outer shape of the solid-state imaging device, and among the electronic components, A signal line is arranged in the vicinity of the integrated circuit.

  ADVANTAGE OF THE INVENTION According to this invention, the imaging device which can be reduced in size, suppresses the temperature rise of a solid-state image sensor, and does not degrade the electrical special property relevant to the temperature dependence of a solid-state image sensor can be provided.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
1 to 4 relate to a first embodiment of the present invention, and FIG. 1 shows an overall configuration of an endoscope system including an electronic endoscope incorporating the first embodiment of the present invention. 2 shows a longitudinal section and the like of the imaging device according to the first embodiment, FIG. 3 shows the configuration of the solid-state imaging device, and FIG. 4 shows the configuration of the solid-state imaging device before cutting the substrate.

  The endoscope system 1 shown in FIG. 1 has an electronic endoscope 2 incorporating the first embodiment provided with electromagnetic interference countermeasure means, and the electronic endoscope 2 is connected to the illumination light. A video processor 5 that is connected to a light source device 3 to be supplied and a solid-state imaging device 25 (described later in FIG. 2) that is connected to the electronic endoscope 2 via a scope cable 4 and built in the electronic endoscope 2. And a color monitor 6 for displaying a video signal input via a monitor cable connected to the video processor 5.

  The electronic endoscope 2 is an elongated and flexible insertion portion 7 to be inserted into a body cavity or the like, an operation portion 8 formed on the proximal end side of the insertion portion 7, and an extension from the operation portion 8. The extended universal cord portion 9 and a scope connector portion 10 provided at the end of the universal cord portion 9 and detachably connected to the light source device 3 are provided.

  A contact connector portion 10a is provided on the side of the scope connector portion 10, and the other end of the scope cable 4 provided with the detachable electrical connector 4a on the contact connector portion 10a is detachably attached to the video processor 5 by the electrical connector 4b. Connected with.

  The insertion portion 7 includes a distal end portion 11 provided with an imaging device 24 (described later in FIG. 2), a bendable bending portion 12 formed on the proximal end side of the distal end portion 11, and a proximal end of the bending portion 12. The long flexible tube portion 13 extends from the side to the distal end side of the operation portion 8.

  A switch portion 14 provided with a plurality of switches 14 a is provided on the top of the operation portion 8. Further, an air supply / water supply control unit 15 that performs air supply / water supply control and a suction control unit 16 that performs suction control are provided on the side surface of the operation unit 8. Further, the operation section 8 is provided with a bending operation knob 17, and the bending section 12 can be bent by gripping the grip section 18 and operating the bending operation knob 17.

  Further, an air / water supply conduit (not shown) is inserted into the insertion portion 7, and this air / water supply conduit is connected to the air / water supply control portion 15 by the operation portion 8, and further inside the universal cord portion 9. The end of the inserted air / water supply pipe reaches the scope connector 10 and is connected to the air / water supply mechanism in the light source device 3.

  Further, a suction conduit (not shown) inserted into the insertion portion 7 is branched into two near the distal end side of the operation portion 8, one communicating with the forceps port 19 b, and the other via the suction control portion 16 to the universal cord portion. 9 communicates with the suction line in 9 and reaches a suction base (not shown) of the scope connector 10.

  Further, the suction opening 19a opened at the distal end portion 12 is aspirated during a suction operation, and when a forceps is inserted from the forceps port 19b, a forceps outlet from which the forceps are projected.

  A light guide (not shown) that transmits illumination light is inserted into the insertion portion 7, the operation portion 8, and the universal cord portion 9. The proximal end side of the light guide reaches the scope connector portion 10, and the lamp inside the light source device 3 The illumination light supplied from is transmitted and emitted forward from the distal end surface of the illumination window 20 fixed to the distal end portion 11 to illuminate a subject such as an affected area.

  An imaging object 24 including an objective lens unit 22 (shown in FIG. 2) and a solid-state imaging unit 25 is incorporated in an observation window 21 provided adjacent to the illumination window 20 for the illuminated subject. An image is formed on a solid-state image pickup device 41 (which forms the solid-state image pickup device 23) disposed in the image forming position of the objective lens unit 22, and photoelectric conversion is performed by the solid-state image pickup device 41.

A cable 39 is connected to the solid-state image pickup device 23 provided with the solid-state image pickup element 41 on the distal end side (as shown in FIG. 2). The cable 39 is a noise reducer (not shown) housed in the scope connector 10 shown in FIG. And the scope cable 4 is connected to the video processor 5.
Inside the observation window 21, as shown in FIG. 2A, an imaging device 24 of the present embodiment is provided.

  As shown in FIG. 2A, the imaging device 24 of the present embodiment includes an objective optical system attached to an objective lens frame 26, that is, an objective lens unit 22 having a plurality of lenses 27 arranged at predetermined positions, and the objective. The solid-state imaging unit 25 is configured to photoelectrically convert an optical image formed by the lens unit 22. The solid-state imaging unit 25 includes a solid-state imaging device 23 including a solid-state imaging element 41.

  The imaging device 24 of the present embodiment is a side view type as can be seen from FIG. 1 or FIG. 2A represents the side surface of the tip portion 11.

As shown in FIG. 9, the conventional side-view type image pickup device 92 is based on the direct-view type image pickup device 93, and an optical system 94 such as a prism 94a is used at the front end of the direct-view type image pickup device 93. The side-view type imaging device 92 is formed by bending the imaging direction at a right angle.
For this reason, in addition to the focus adjustment of the image pickup apparatus 92, adjustment such as declination adjustment is necessary.

  On the other hand, in the imaging device 24 of the present embodiment shown in FIG. 2A, the imaging direction 28 by the solid-state imaging device 41 of the solid-state imaging device 23 is directed to the side surface, and an optical system similar to the direct-view type is used. Further, by eliminating the deviation angle adjustment at the time of assembling the imaging device 24, the structure can be simplified.

  Further, as will be described below, in the imaging device 24, an integrated circuit 44 in which electronic components are integrated at a high density is mounted on the substrate 42 to reduce the size and facilitate incorporation into the distal end portion 11. Further, the solid-state imaging device 41 is not affected by the heat generated by the integrated circuit 44.

  An optical component 29 is bonded to the front surface of the solid-state imaging device 23 with, for example, an ultraviolet curable adhesive. The optical component 29 may be a parallel plate or a lens having power. This optical component 29 is fitted with a lens frame 30 to which the objective lens frame 26 is fitted and attached, and the entire circumference of the fitting portion is fixed by an adhesive 38.

  The rear part of the lens frame 30 is protected by a frame member 31, and the frame member 31 and the lens frame 30 are fixed by an adhesive. The frame member 31 in the present embodiment is made of metal.

  The lens frame 30 is inclined toward the rear side 32 in order to widen the field of view toward the rear side 32. Further, the first lens 27a closest to the image pickup object side of the lens 27 disposed in the objective lens frame 26 has an angled surface on the front and back surfaces of the lens, and its thickness is shown in the cross section shown in FIG. The thickness of the rear side 32 is made thicker.

  The field of view is widened to the rear side 32 by inclining the imaging direction 28 to the rear side 32 by providing an angle to the surface of the first lens 27a as described above.

The frame member 31 has a cross-section having an opening 33 in the direction of the objective lens frame 26 and the lens frame 30 as shown in FIG. 2B showing the AA cross section of FIG. The solid-state imaging device 23 can be put into the frame member 31 through the opening 33.
Further, the periphery of the solid-state imaging device 23 is reinforced with, for example, an epoxy-based adhesive 34 and is prevented from entering moisture, and the periphery of the adhesive 34 is filled with the adhesive 34 or a high watertight function. It is filled with an agent, and the periphery thereof is further covered with a heat shrinkable tube 35 for further reinforcement.

  The lens frame 30 has a shape as shown in FIG. The lens frame 30 has a substantially cylindrical shape, and a chamfered portion 30a is provided on the outer peripheral surface thereof. The heat-shrinkable tube 35 can cover the chamfered portion 30a, and the airtightness of the imaging device 24 is improved by reducing the gap between the lens frame 30 and the frame member 31.

In addition, a notch 30b is provided on the lens frame 30 on the side where the solid-state imaging unit 25 is mounted, so as to avoid interference with a substrate 42 to be described later, a fitting portion 37 between the lens frame 30 and the frame member 31. The airtightness of the periphery of the solid-state imaging device 23 was improved.
The objective lens unit 22 and the solid-state imaging unit 25 are fixed with an adhesive 38 after the objective lens frame 26 and the lens frame 30 are fitted and brought out of focus.

  The solid-state imaging device 23 includes a signal line 39a (hereinafter referred to as a driving signal line) for driving the solid-state imaging device 23, a signal line 39b (hereinafter referred to as a power supply signal line) for supplying power, and a signal connected to the ground. A line 39c (hereinafter referred to as a ground signal line) and a solid-state imaging device output signal line 39d (hereinafter referred to as an output signal line) are connected, and all the signal lines are connected to a processor 5 (not shown) by a bundled cable 39.

  Next, the solid-state imaging device 23 according to the present embodiment will be described with reference to FIGS. 3A is a plan view of the solid-state imaging device 23 (the solid-state imaging element portion is shown in cross section), FIG. 3B is a side view, FIG. 3C is a front (cross-sectional) view, and FIG. D) is a rear view. 4 is a view before cutting the substrate 42 as shown in FIG. 3, FIG. 4 (A) is a rear view, FIG. 4 (B) is a side view, and FIG. 4 (C) is a plan view.

  As shown in FIG. 3, the solid-state imaging device 23 includes a solid-state imaging device 41 that photoelectrically converts an optical image formed by the objective optical system, a substrate 42 that is connected to the solid-state imaging device 41 at the front end side, and the substrate. 42, and an integrated circuit (hereinafter abbreviated as IC) 44 having a high degree of integration or high power consumption of an electronic component that amplifies the output signal of the solid-state imaging device 41. The

The signal line 39a of the cable 39 is connected to the substrate 42 of the solid-state image pickup device 23, and the solid-state image pickup unit 25 is formed by being housed in the frame member 31.
The solid-state imaging device 41 has an image area 41a for photoelectric conversion in a predetermined area on the surface. A cover glass 41b is bonded to the light-receiving side surface of the image area 41a with a transparent resin to protect the image area 41a.

  The substrate 42 in the present embodiment is an elastic substrate. The substrate 42 is composed of a front surface copper foil pattern 42a, a polyimide 42b, and a back surface copper foil pattern 42c. A plurality of (conductive) surface copper foil patterns 42a are formed on both sides using the polyimide 42b as an insulating base material. A back surface copper foil pattern 42c is formed.

  The substrate 42 is joined to a connecting portion 41c provided in the vicinity of the image area 41a of the solid-state imaging device 41 with an inner lead 45a with the back surface copper foil pattern 42c exposed through a bump 45b. In the case of the present embodiment, the connecting portion 41c is a bonding pad.

  The substrate 42 extended from the vicinity of the image area 41a of the solid-state image sensor 41 is arranged along the side surface on the front end side of the solid-state image sensor 41 and further along the back surface, and then extended rearward. In this case, the light receiving surface 41d of the image area 41a extends substantially in parallel.

  In the portion along the side surface and the back surface of the solid-state image sensor 41, the substrate 42 has the polyimide 42b surface facing the back surface side of the solid-state image sensor 41, and the circuit pattern by the solid-state image sensor 41 and the back surface copper foil pattern 42c. ) To prevent short circuit.

  The cover glass 41 b is fixed to the solid-state image sensor 41. In this case, portions of the solid-state image sensor 41, the cover glass 41b, and the substrate 42 along the side surface to the back surface of the solid-state image sensor 41 are fitted into a mold, solidified with a sealing resin 46, and solid-state image sensor 41 at the tip of the substrate 42. A solid-state image sensor portion 47 is formed by sealing and fixing.

For example, a black epoxy resin is used as the sealing resin 46 in order to prevent optical defects such as flare. In order to sufficiently seal and to reduce the size of the periphery of the solid-state imaging device 41, all corners of the sealing resin 46 are chamfered.
Further, in order to prevent peeling of the cover glass 41b and the solid-state imaging device 41 and to prevent the moment applied to the substrate 42 from being transmitted, only the polyimide 42b and the back surface copper foil pattern 42c are provided at the boundary portion 48 between the sealing resin 46 and the substrate 42. It is arranged.

  Thus, by adopting a structure in which the mounting electronic component 43 is not disposed on the surface of the boundary portion 48 of the substrate 42 in this way, the boundary portion 48 is more easily bent while maintaining reliability. The moment applied to the stop resin 46 is relaxed so that the cover glass 41b and the solid-state image sensor 41 can be prevented from being peeled off.

Further, due to the structure of the imaging device 24, the boundary 48 may be bent to avoid interference between the frame member 31 and the substrate 42 as shown in FIG. This can be achieved by taking the structure of the boundary 48. Lands 49a and 49b connected to the surface copper foil pattern 42a and the like are formed on the surface side of the substrate 42 behind the boundary portion 48, and the mounting electronic component 43 and the IC 44 are disposed.
In the present embodiment, the solid-state image pickup device 41 and the IC 44 are spaced apart at both ends of the substrate 42.

  Further, the IC 44 is a bare chip, and is connected to a connection portion 51 provided on the surface copper foil pattern 42a via a bump 50 as shown in an enlarged view showing a part on the mounting portion side in FIG. Has been. In this case, an underfill material 52 is filled between the substrate 42 and the IC 44 in order to improve the fixing strength.

  The IC 44 generates heat when the solid-state image sensor 41 is driven. As shown in FIG. 2, a land 49a (hereinafter referred to as a driving land) for connecting the driving signal line 39a of the solid-state imaging device 41 and an output from the IC 44 are taken out between the IC 44 and the solid-state imaging device 41. Land 49b (hereinafter referred to as an output land) and an electronic component 43 are installed.

In this case, a drive signal line 39a is connected to the drive land 49a, and an output signal line 39d is connected to the output land 49b. The power signal line 39b and the ground signal line 39c are the electrodes 43c of the electronic component 43, respectively. It is connected to the. A land connecting the power signal line 39b and the ground signal line 39c may be provided separately.
In that case, by disposing the driving land 49a close to the solid-state imaging device 41, the heat of the solid-state imaging device 41 is efficiently radiated from the driving signal line 39a connected to the driving land 49a.

  Further, by arranging the output land 49b close to the IC 44, the heat of the IC 44 can be efficiently radiated by the output signal line 39d, and the heat of the IC 44 can be prevented from being transmitted to the solid-state imaging device 41. .

  Further, as shown in FIG. 3A, the driving land 49a, the output land 49b, the electronic component 43, and the IC 44 are arranged on the same plane, thereby eliminating the irregularities on the back surface of the substrate 42. Since the back surface can be subjected to insulation treatment such as overcoat, the solid-state imaging device 23 can be efficiently dissipated by being brought closer to a metal member such as the frame member 31.

  In this way, the heat of the IC 44 is prevented from being transmitted to the solid-state image sensor 41, and heat can be radiated to the signal lines independently from the lands provided in the vicinity of the solid-state image sensor 41 and the IC 44. As a result, It is possible to prevent the temperature of the solid-state imaging device 41 from being increased due to the heat generated by the solid-state imaging device 41 itself and the influence of heat conduction from the IC 44. Further, as a result, it has temperature dependence, and prevents the deterioration of the electrical characteristics due to the temperature rise of the solid-state imaging device 41 in which the electrical characteristics deteriorate, such as an increase in dark current or an increase in noise. be able to.

  By adopting such a structure of the imaging device 24, the electronic component 43 mounted on the substrate 42 is disposed between the cable connection lands 49a and 49b. Height 53 from the bottom surface of the substrate 42 to the farthest signal line generated when the signal lines 39a and 39d connected to the lands 49a and 49b get over the electronic component 43 (the height with respect to the signal line 39d is shown in FIG. 2). )) Can be reduced in the height direction around the signal line connecting portion.

  For this purpose, the lowest electronic component 43a among the electronic components 43 is installed between the signal line connection lands 49a and 49b as shown in FIG. 2, so that the signal line 39a connected to the land 49a is electronically connected. The height 53 from the bottom surface of the substrate 42 to the highest portion of the signal line 39a generated when getting over the component 43a is suppressed, and the solid-state imaging unit 25 (imaging device 24) can be downsized.

  Next, the form 54 before cutting the substrate 42 will be described with reference to FIG. In order to confirm the operation of the solid-state imaging device 23, the form 54 before cutting has an inspection land 54a as shown in FIG. 4A, and is connected to a waveform confirmation device (not shown) and output.

  Each signal is transmitted from the solid-state imaging device 41 and the input / output unit to the IC 44 to the inspection land by the front surface inspection pattern 54c and the back surface inspection pattern 54d.

  And in order to make it the shape of the solid-state imaging device 23, this form 44 is cut | disconnected by the type | mold which is not shown in figure by the cutting part 54b. Since the cutting position varies, a minimum margin is necessary to avoid pattern cutting at the time of cutting and damage to the mounted electronic component 43 in the vicinity thereof.

  If the space between the cutting line and the pattern and the electronic component 43 is simply widened, miniaturization is prevented. Therefore, as shown in FIG. 3A, the electronic component 43, the front copper foil pattern 42a, and the back copper foil pattern 42c are solid after cutting. The imaging device 23 is moved toward the center line O in the longitudinal direction.

Further, a step 42d is provided on the substrate 42, a difference in width is provided on the substrate 42, a narrow substrate portion 42e is disposed on the solid-state imaging device 41 side, and a wide substrate portion 42f is disposed on the IC 44 side. 43, the electronic component 43b having the longest longitudinal direction is arranged on the wide substrate 42f, and the long axis direction of the electronic component 43b having the longest longitudinal direction among the mounted electronic components 43 is the width of the wide substrate. Pointed in the direction.
By doing so, the cutting width 54b can be reduced and the size can be reduced while keeping the mounting electronic component 43 from being damaged by the cutting portion 54b shown in FIG.

  In addition, sagging and burrs are generated in the cut portion 54b after cutting, so that the inspection patterns 54c and 54d are short-circuited on the front and back of the substrate 42, and the imaging device 24 is configured with the circuit board after cutting. However, the inspection patterns 54c and 54d are not overlapped with each other in the vicinity of the cut portion 54b. By doing so, it was made possible to prevent a short circuit due to the occurrence of sagging or burrs at the cutting part 54b after cutting.

The present embodiment has the following effects.
By disposing the solid-state imaging device 41 and the IC 44 that amplifies the output signal of the solid-state imaging device 41 at both ends on the substrate 42, the IC 44 serving as a heating element is separated from the solid-state imaging device 41, and the heat Conductivity is suppressed, and by connecting the signal lines 39a to 39d in the vicinity of the solid-state imaging device 41 and the IC 44, heat can be dissipated through the connected signal lines 39a to 39d, so that the temperature of the solid-state imaging device 41 increases. Is suppressed.

  Therefore, it is possible to prevent deterioration of electrical characteristics due to the temperature rise by the solid-state imaging device 41 and to generate an imaging signal with a good S / N. Therefore, when the image captured by the imaging device 24 is displayed on the color monitor 6, the quality is improved. A good endoscopic image can be displayed.

  Further, by arranging the electronic component 43a having the lowest height among the electronic components 43 mounted on the rear portion of the frontmost land 49a for signal line connection, the signal line 39a connected to the land 49a is connected to the electronic component 43a. The height from the bottom surface of the substrate 42 to the outermost contour of the signal line that occurs when riding on the signal line can be suppressed, and the size in the height direction around the signal line connecting portion can be reduced.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIG. 5A shows the entire structure of the imaging device according to the second embodiment, FIG. 5B shows an enlarged view of a portion B in FIG. 5A, and FIG. 5C shows an elastic substrate. The structure of is shown.
As shown in FIG. 5A, the imaging device 55 of the present embodiment includes an objective lens unit 56 and a solid-state imaging unit 57, as in the first embodiment.

  In the objective lens unit 56, a plurality of lenses 59a are arranged at predetermined positions in the lens frame 58 to form an objective lens. The lens frame 58 of the objective lens unit 56 is fitted with a fixed frame 61 to which an optical member 60 constituting the solid-state imaging unit 57 is attached. A cover glass 62 a of the solid-state image sensor 62 is bonded and fixed to the optical member 60 attached to the fixed frame 61.

The solid-state imaging device 62 is provided with an image sensor 62b on the front surface, and a cover glass 62a is fixed to the surface with an ultraviolet curable adhesive.
The lens frame 58 to which the plurality of lenses 59a are attached and the fixed frame 61 to which the solid-state image sensor 62 is fixed via the optical member 60 are fixed with an adhesive after focus adjustment.

The solid-state imaging unit 57 includes a solid-state imaging device 63 including a solid-state imaging element 62.
The solid-state imaging device 63 used in this embodiment will be described more specifically with reference to FIGS. 5 (A), 5 (B), and 5 (C).

  The solid-state imaging device 63 includes a solid-state imaging device 62, a substrate 64, an electronic component 65 mounted on the substrate 64, and an IC 66 that amplifies the output signal of the solid-state imaging device 62. The substrate 64 includes an elastic substrate 67 and a laminated substrate 68 provided on the upper side of the elastic substrate 67 on which the electronic component 65 is mounted.

  The solid-state image sensor 62 and the elastic substrate 67 are connected to the bonding pads 62c of the solid-state image sensor 62 by bumps 70 with the inner leads 67a exposed from the elastic substrate 67 at the connection portions 69 shown in FIG. Yes.

  As shown in FIG. 5C, a plurality of copper patterns 67 c are arranged on the back surface 70 of the elastic substrate 67, and an inner lead portion 67 b exposed in the opening 71 is provided. Soldered to a land portion (not shown).

  An electronic component 65 for removing pulse signal noise is mounted on the multilayer substrate 68. A solid-state image sensor 62 is fixed to the front end of the multilayer substrate 68 with a sealing resin 72, and the other end. The IC 66 is mounted on the rear end portion so that even if the IC 66 generates heat, the heat does not reach the solid-state image sensor 62.

  Further, between the solid-state image pickup device 62 and the IC 66, a driving signal line connecting portion 73a, an output signal line connecting portion 73b, and a base signal end portion of the laminated substrate 68 as a power signal line connecting portion 73c Lead pins are provided, and a plurality of drive signal lines 74a, output signal lines 74b, and power supply signal lines 74c are connected to the lead pins.

  The drive signal line 74a is disposed in the vicinity of the solid-state imaging device 62, the output signal line 74b and the power supply signal line 73c are disposed in the vicinity of the IC 66. The signal line connecting portion 73b may be a metal plate having high thermal conductivity.

  By placing the lowest mounted electronic component 65a among the mounted electronic components 65 at the rear of the drive signal line connecting portion 73a and the output signal line connecting portion 73b, the signal line connected to the land is mounted on the mounted electronic component. The height 76 from the bottom surface of the substrate 68 to the outermost contour of the signal line that occurs when getting over 65a can be suppressed, and the solid-state imaging device can be downsized.

The solid-state imaging device 62 and the IC 66 are disposed at both ends of the multilayer substrate 68, the distance between them is separated, the driving signal line 74 a is disposed in the vicinity of the solid-state imaging device 62, and the IC 66 is disposed near the IC 66. Since the output signal line 74b and the power supply signal line 74c are arranged, heat is transmitted from the IC 66 to the output signal line 74b and the power supply signal line 74c to be dissipated. The heat of the IC 66 becomes difficult to be transmitted, and the temperature rise of the solid-state image sensor 62 can be prevented.
Note that the lower end side of the base end portion of the multilayer substrate 68 is notched in a stepped shape to form a notch portion 75, and the power signal line 74c is connected to the back surface where the elastic substrate 67 is not provided.

  Further, since heat is radiated by the drive signal line 74a in the vicinity of the solid-state image sensor 62, the temperature of the solid-state image sensor 62 can be prevented from rising. The rear end of the fixed frame 61 is connected to the front end of the shield frame 77 so that the solid-state imaging unit 57 is covered with the shield frame 77. The outer periphery of the shield frame 77 is covered with a heat shrinkable tube 78, and the rear end of the heat shrinkable tube 78 is fixed to the outer peripheral surface of the cable 74 bundled with signal wires 74a and the like.

The operation of this embodiment is almost the same as that of the first embodiment.
The effect of the present embodiment is the same as that of the first embodiment.

(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIGS. 6 (A) and 6 (B). FIG. 6A shows a cross-sectional structure in the longitudinal direction of the imaging apparatus of the third embodiment, and FIG. 6B shows the solid-state imaging apparatus portion in a plan view.

  Since the basic configuration of the imaging device 24 of the present embodiment is the same as that of the first embodiment, differences from the first embodiment will be described. As in the first embodiment, a solid-state image sensor unit 47 having a solid-state image sensor 41 is attached to the front end of the substrate 42, and an IC 44 is mounted on the rear end of the substrate 42. A component 43 is mounted.

  In such a structure, in the present embodiment, the number of signal lines 39c provided in the vicinity of the IC 44 side is more connected in the vicinity of the IC 44 than in the signal line 39a provided in the vicinity of the solid-state imaging device 41. Other configurations are substantially the same as those of the first embodiment.

  With such a configuration, it is possible to make it difficult for the heat of the IC 44 to be transferred to the solid-state imaging device 41 by actively releasing the heat of the IC 44 to the signal line 39c side.

The operation of the present embodiment is the same as that of the first embodiment.
The effect of this embodiment is almost the same as that of the first embodiment.

(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described with reference to FIGS. FIG. 7A shows the imaging device 24 of the present embodiment.
Since the basic structure of the imaging device 24 is the same as that of the first embodiment, differences from the first embodiment will be described.

  In the objective lens unit 22, an objective lens frame 126 to which a plurality of lenses 27 are attached is fitted and fixed to the lens frame 30.

  A convex portion 26a is provided at the rear end portion of the objective lens frame 26 on the solid-state imaging device 41 side, and the lens 27b and the lens frame 30 at the rear end portion are optically fixed when the objective lens unit 22 is fixed at a desired position. The convex portions 26 a are provided in such a positional relationship that the convex portions 26 a first abut against the abutting surface 30 a of the lens frame 30 so as not to contact the component 29.

  As a result, the lens 27b is prevented from being damaged, and as shown in the comparison with the conventional example shown in FIG. 7B, this figure is more preferable than the fitting portion between the objective lens frame 26B and the lens frame 30B in the conventional example. As shown by 7 (B), the length of this embodiment can be increased by the amount of X.

  As described above, since the backlash between the objective lens frame 26 and the lens frame 30 can be reduced by making the fitting length longer than that of the conventional example, the deflection angle of the optical system of the objective lens unit 22 can be suppressed.

  The frame member 31 is covered with an outer frame 81 as shown in FIG. The frame member 31 is inserted into the outer frame 81 from the end on the cable 39 side, and the outer frame 81 is positioned by being applied substantially perpendicular to the longitudinal direction of the fitting portion with the lens frame 30. Has been done.

  As in the first embodiment, the frame member 31 is as shown in FIG. 2B, and the solid-state imaging device 23 joined to the lens frame 30 is fitted into the lens frame 30 into which the objective lens frame 26 is fitted. By combining, it can be inserted into the frame member 31 from the opening 33 in FIG.

  As shown in FIGS. 7D and 7E, the lens frame 30 is fitted into the frame member 31, and the flat portion 31a of the frame member 31 is abutted against the flange 30b provided on the lens frame 30. In addition, the lens frame 30 can be positioned and fixed. FIG. 7D shows a side view, and FIG. 7E shows a perspective view of the front end portion of the frame member 31.

  Thus, the flange 30b as shown in FIGS. 8A to 8C is provided on the outer peripheral surface of the lens frame 30, and the lens frame 30 is positioned by abutting against the frame member 31. . 8A is a perspective view of the lens frame 30, FIG. 8B is a side view, and FIG. 8C is a front view.

  As shown in FIGS. 8B and 8C, the flange 30b is provided with a straight portion 30c. By applying the outer frame 81 to the straight portion 30c as shown in FIG. The structure is such that the inside of the unit 25 can be sealed. Further, as shown in FIGS. 7D and 7E, the abutting portion of the flange 30b is provided with a flat surface 31a on the frame member 31 in a direction perpendicular to the fitting direction of the lens frame 30 and the frame member 31. It is.

  As shown in FIG. 7A, the substrate 42 is provided with a signal line 39c and a GND land 82a between the solid-state image sensor 41 and the IC 44 and close to the solid-state image sensor 41. A driving land 82b is provided at the rear end of the substrate 42, and a driving signal line 39a is connected thereto.

  As a result, the solid-state image pickup device 41 is separated from the driving land 82b, and the signal line 39c is provided between the solid-state image pickup device 41 and the IC 44. Therefore, noise due to the high frequency component of the drive signal rides on the image signal. It becomes difficult.

  Further, as shown in FIG. 8D when the substrate 42 is viewed from the upper side of FIG. 7A, the signal line 39c passes through the side surface 83a and the back surface of the substrate 42 from the surface on which the land 82a is arranged, and passes through the side surface 83. It is wired through the side surface 83b on the opposite side. In addition, a signal line 39 is disposed as a signal line in a portion near the frame member 31 on the substrate 42. An insulating material 84 is inserted between the substrate 42 and the frame member 31.

  For example, the insulating material 84 may be an adhesive. Further, by wiring the signal line 39c as described above, it is possible to avoid the substrate 42 from coming into contact with the frame member 31 due to the assembly variation of the substrate 42 and the variation of the frame member 31, and from the static electricity from the outside. Can protect 25.

  The operation of this embodiment is the same as that of the first embodiment. The effect is also the same as that of the first embodiment.

1 is an overall configuration diagram of an endoscope system including an electronic endoscope in which a first embodiment of the present invention is incorporated. FIG. FIG. 3 is a diagram illustrating a longitudinal section and the like of the imaging apparatus according to the first embodiment. The figure which shows the structure of a solid-state imaging device. The figure which shows the structure of the solid-state imaging device before cutting | disconnection of a board | substrate. The figure which shows structures, such as an imaging device of the 2nd Embodiment of this invention. The figure which shows the structure of the imaging device and solid-state imaging device of the 3rd Embodiment of this invention. The figure which shows structures, such as an imaging device of the 4th Embodiment of this invention. The figure which shows the structure of the lens frame of FIG. Sectional drawing which shows the structure of the imaging device of a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Endoscope system 2 ... Electronic endoscope 3 ... Light source device 5 ... Video processor 6 ... Color monitor 7 ... Insertion part 11 ... Tip part 22 ... Objective lens unit 23 ... Solid-state imaging device 24 ... Imaging device 25 ... Solid-state imaging Unit 26 ... Objective lens frame 27 ... Lens 30 ... Lens frame 31 ... Frame member 39 ... Cable 39a ... Drive signal line 39b ... Power supply signal line 39c ... Ground signal line 39d ... Output signal line 41 ... Solid-state image sensor 42 ... Substrate 43, 43a ... Electronic component 44 ... IC (integrated circuit)

Claims (2)

In an imaging apparatus having a circuit board on which a solid-state imaging device, electronic components and signal lines are mounted,
An integrated circuit of the solid-state imaging device and the electronic component is disposed at both ends of the circuit board, and the mounting electronic component and the signal line are disposed between the solid-state imaging device and the integrated circuit,
The solid-state imaging device is arranged so that the imaging surface is substantially parallel to the axial direction,
The electronic component is arranged such that the height of the outer shape is lower than the height of the outer shape of the solid-state imaging device, and a signal line is arranged in the vicinity of the integrated circuit of the electronic component. apparatus.   The imaging apparatus according to claim 1, wherein the signal line is disposed in the vicinity of the solid-state imaging device and the integrated circuit.

Images