JP2008235916A5

JP2008235916A5 -

Info

Publication number: JP2008235916A5
Application number: JP2008098000A
Authority: JP
Filing date: 2008-04-04
Publication date: 2010-10-21
Anticipated expiration: 2022-07-22

Claims

A method for manufacturing a semiconductor device comprising the following steps:
(A) a substrate having a plurality of device regions and a dicing region located between the plurality of device regions, a plurality of semiconductor chips respectively mounted on the plurality of device regions, and the plurality of semiconductor chips together Preparing an assembly including a batch sealing portion to be sealed;
(B) After the step (a), a substrate provided with a product support portion having a plurality of through holes respectively corresponding to a groove corresponding to the dicing region of the substrate and the plurality of device regions of the substrate. Arranging the assembly on a dicer cut stage via a holding jig;
(C) After the step (b), the collective sealing portion via the suction holes provided in the dicer cut stage and the plurality of through holes provided in the product support portion of the base material holding jig A step of dividing the batch sealing portion and the base material by running a blade along the dicing area in a state where the surface of the substrate is adsorbed and held;
here,
In the step (b), the surface of the batch sealing portion is opposed to the product support portion of the base material holding jig, and the grooves and the plurality of through holes provided in the product support portion are The assembly is disposed on the substrate holding jig so as to correspond to the dicing area and the plurality of device areas, respectively.
The product support portion is made of rubber.

In the manufacturing method of the semiconductor device according to claim 1,
The method of manufacturing a semiconductor device, wherein the product support portion is fixed on a plate-shaped jig body.

The method of manufacturing a semiconductor device according to claim 2.
After the step (a) and before the step (b),
(D) In a state where the plurality of external terminals of the base material are in contact with the sponge of the jig transfer hand, the assembly is held using the jig transfer hand,
(E) After the step (d), the surface of the collective sealing portion faces the product support portion, and the groove and the plurality of through holes correspond to the dicing region and the plurality of device regions, respectively. To hold the base material holding jig using the jig transfer hand holding the assembly,
A method for manufacturing a semiconductor device.

In the manufacturing method of the semiconductor device according to claim 3,
In the step (e), by guiding the jig transfer hand with a positioning pin, the dicing region and the plurality of device regions correspond to the groove and the plurality of through holes, respectively. A method for manufacturing a semiconductor device.

In the manufacturing method of the semiconductor device according to claim 1,
The semiconductor device manufacturing method, wherein the plurality of semiconductor chips are electrically connected to the plurality of device regions through a plurality of wires, respectively.

A method for manufacturing a semiconductor device comprising the following steps:
(A) preparing a wiring board having a main surface on which a plurality of device regions are formed, a back surface opposite to the main surface, and a dicing region located between the plurality of device regions;
(B) After the step (a), a step of fixing a plurality of semiconductor chips to the plurality of device regions of the wiring board, respectively.
(C) After the step (b), a step of forming a collective sealing portion that collectively covers the plurality of semiconductor chips on the main surface of the wiring board;
(D) After the step (c), attaching a plurality of external terminals to the back surface of the wiring board so as to correspond to each of the plurality of device regions;
(E) Substrate provided with a product support portion having a plurality of through holes respectively corresponding to the grooves corresponding to the dicing region of the wiring board and the plurality of device regions of the wiring board after the step (d). Disposing the wiring board on a dicer cut stage via a holding jig;
(F) After the step (e), the collective sealing portion is inserted through the suction holes provided in the dicer cut stage and the plurality of through holes provided in the product support portion of the substrate holding jig. With the front surface held by suction, a dicing blade is run along the dicing area from the back side of the wiring board to divide the batch sealing portion and the wiring board to obtain a plurality of assemblies. The step of:
here,
In the step (e), the surface of the collective sealing portion of the wiring board faces the product support portion of the substrate holding jig, and the groove and the plurality of through holes provided in the product support portion The wiring board is disposed on the substrate holding jig so that holes correspond to the dicing area and the plurality of device areas of the wiring board, respectively.
The product support portion is made of rubber.

The method of manufacturing a semiconductor device according to claim 6 , wherein the product support portion is fixed on a plate-shaped jig body.
After the step (f), the substrate holding jig on which the plurality of assemblies are arranged is transported to the next step using a jig transfer hand.

8. The method of manufacturing a semiconductor device according to claim 7 , wherein the plurality of assemblies are cleaned after the step (f).

9. The method of manufacturing a semiconductor device according to claim 8 , wherein after cleaning the plurality of assemblies, each of the plurality of assemblies is disposed on a spin stage via the substrate holding jig, and the spin stage is rotated. And a method of manufacturing a semiconductor device, wherein air is sprayed onto each of the plurality of assemblies to dry each of the plurality of assemblies.

10. The method of manufacturing a semiconductor device according to claim 9 , further comprising the following steps (g) to (i) after the drying step:
(G) Each of the plurality of assemblies is set on the draining hand so that the surface of each sealing portion of the plurality of assemblies contacts the water absorbing sponge of the draining hand, and the water absorbing sponge of the draining hand a step of adsorbing the surface of each of the sealing portions of the plurality of assembly through a plurality of through holes provided et the to;
(H) After the step (g), the step of pressing the surface of the sealing portion of each of the plurality of assemblies against the water-absorbing sponge of the draining hand;
(I) After the step (h), a step of taking out each of the plurality of assemblies from the draining hand and rubbing the surface of the sealing portion of each of the plurality of assemblies using a brush.

11. The method of manufacturing a semiconductor device according to claim 10 , wherein in the step (e), the surface of the batch sealing portion of the wiring board faces the product support portion of the substrate holding jig, and the product. The wiring board is arranged on the substrate holding jig so that the groove and the plurality of through holes provided in the support portion respectively correspond to the dicing line of the wiring board and the plurality of device regions. A method of manufacturing a semiconductor device.

12. The method of manufacturing a semiconductor device according to claim 11 , further comprising the following step (j) after the step (b) and before the step (c). Method:
(J) electrically connecting the plurality of semiconductor chips and the plurality of device regions through a plurality of wires, respectively.

12. The method of manufacturing a semiconductor device according to claim 11 , wherein each of the plurality of external terminals attached in the step (d) is a ball electrode.

12. The method of manufacturing a semiconductor device according to claim 11 , wherein in the step (c), a molding die including an upper die having a cavity and a lower die facing the upper die is prepared, The wiring board is disposed on the lower mold so that all of the plurality of semiconductor chips are located in the cavity, the upper mold and the lower mold are clamped, and a sealing resin is disposed in the cavity. And forming the collective sealing portion that collectively covers the plurality of semiconductor chips on the main surface of the wiring board.

8. The method of manufacturing a semiconductor device according to claim 7 , wherein a wiring pattern is formed on the back surface of the wiring board.
In the step (f), after the dicing area is determined by recognizing the wiring pattern with a recognition camera, the dicing blade is caused to travel along the dicing area from the back side of the wiring board. A method of manufacturing a semiconductor device.

16. The method of manufacturing a semiconductor device according to claim 15 , further comprising the following steps (k) to (l) after the step (d) and before the step (e): Semiconductor device manufacturing method:
(K) After the step (d), holding the wiring board with the jig transfer hand in a state where the plurality of external terminals of the wiring board are in contact with the sponge of the jig transfer hand;
(L) After the step (k), the surface of the collective sealing portion of the wiring board faces the product support portion of the substrate holding jig, and the grooves and the plurality of grooves provided in the product support portion A step of holding the substrate holding jig with the jig transfer hand holding the wiring substrate so that the through-holes correspond to the dicing region and the plurality of device regions of the wiring substrate, respectively.

17. The method of manufacturing a semiconductor device according to claim 16 , wherein in the step (h), the plurality of through holes provided in the product support portion correspond to the plurality of device regions, respectively, by guiding with positioning pins. A method for manufacturing a semiconductor device.

18. The method of manufacturing a semiconductor device according to claim 17 , further comprising the following step (m) after the step (b) and before the step (c). Method:
(M) A step of electrically connecting the plurality of semiconductor chips and the plurality of device regions via a plurality of wires, respectively.

18. The method of manufacturing a semiconductor device according to claim 17 , wherein each of the plurality of external terminals attached in the step (d) is a ball electrode.

18. The method of manufacturing a semiconductor device according to claim 17 , wherein in the step (c), a molding die having an upper die having a cavity and a lower die facing the upper die is prepared, The wiring board is disposed on the lower mold so that all of the plurality of semiconductor chips are located in the cavity, the upper mold and the lower mold are clamped, and a sealing resin is disposed in the cavity. And forming the collective sealing portion that collectively covers the plurality of semiconductor chips on the main surface of the wiring board.