JP2002254481A - Resin mold die and method for manufacturing resin mold package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the generation of wrinkles in the periphery of a semiconductor chip of a release film when a chip exposing type resin mold package is to be manufactured by utilizing the release film. SOLUTION: The loseness of the release film 7 is absorbed by increasing a mold resin surface area by the projections 8 arranged to the undersurface of a floating block 5a in a lattice form so as to partition respective semiconductor chips 1 molded collectively from a resin to extend the looseness of the release film 7 and the generation of wrinkles in the peripheries of the semiconductor chips 1 at the time of mold clamping is prevented. Further, grooves are formed in the collective resin mold package by the projections 8 and the defectiveness of an outer shape due to the abrasion of a dicing blade is eliminated by forming a part of the package by the grooves at the time of dicing of the individual resin mold package and the cost reduction can be achieved by the reduction of a dicing sheet or the common use of a dicing fixture.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin mold used for manufacturing a resin mold package and a method for manufacturing a resin mold package using the mold. A resin mold and a method of manufacturing a resin mold package used for manufacturing a resin mold package (chip exposure type package) having an exposed surface in which a part of a semiconductor chip after molding and resin molding is not molded with resin. About.

[0002]

2. Description of the Related Art In recent years, a release film has been interposed between resin molds to improve the releasability between the mold and the product, eliminate the need for mold cleaning for mold contamination with resin, and furthermore, use a chip exposure method and a heat sink. An enclosure method for the purpose of exposure is being adopted. For example, as disclosed in JP-A-11-34066, this release film is used to separate the upper and lower mold halves including the inner surface of a cavity forming a resin mold package and the inner surface of a runner which serves as a path for a resin to carry the mold resin into the cavity. It is provided so as to cover. In particular, a batch resin mold package in which a plurality of semiconductor chips are mounted on a substrate, and these semiconductor chips are integrally resin-molded together with the substrate as a single package, and the upper surfaces of all the semiconductor chips are not resin-molded. In a resin mold package (chip-exposure type package), which is an encapsulation method that is exposed from the package surface, the release film must be molded using a resin so that the upper surface of the semiconductor chip becomes an exposed surface after the resin molding. In addition to covering the inner surface of the semiconductor chip, it also has a function of covering the exposed surface of the semiconductor chip to prevent intrusion of the mold resin.

A method of manufacturing a resin mold package of this chip exposure type will be described with reference to the drawings. 9A and 9B are schematic cross-sectional views showing a state in which resin molding is performed using a conventional chip-exposed resin molding die. FIG. 9A shows a state before mold clamping, and FIG. The state at the time is shown. Next, an example of a method of manufacturing a chip exposure type package will be described.

First, as shown in FIG. 9 (a), a release film 7 is supplied between an upper mold 3 and a lower mold 4, and is released by a suction hole (not shown) opened in the upper mold 3. Mold 3
The release film 7 is attached to the entire lower surface of the device by suction. At this time, depending on the direction of the product in which the resin mold package product is to be sealed in the upper mold or the lower mold, the direction in which the release film 7 is stuck may be the lower mold 4. In the following, a case will be described in which only the upper mold 3 is provided. The upper mold 3 is provided with a countermeasure against chip cracks when the semiconductor chip 1 is pressed against the release film 7.
A floating block 5 that moves up and down by a spring 6 is provided (cavity floating system), and a release film 7 is adsorbed and attached to the entire lower surface of the upper mold 3 including the lower surface of the floating block 5 and the inner surface of the runner 13. Next, the substrate 2 on which the semiconductor chip 1 is mounted in advance is placed on the lower mold 4. The mounting of the semiconductor chip 1 is performed by connecting the electrode pads provided on the main surface side of the semiconductor chip 1 and the connection terminals provided on the circuit pattern of the substrate 2 in a face-down manner.

Next, as shown in FIG. 9B, the upper die 3 and the lower die 4 cover the portion of the semiconductor chip 1 which will become the exposed surface 14 (the surface opposite to the main surface) with the release film 7. Perform clamping in the state. At the time of clamping, the floating block 5 is released from the semiconductor chip 1 by the release film 7.
And a space (cavity) 23 is formed around the semiconductor chip 1. Next, the resin 10 is injected into the space 23. The resin 10 softened by the heated mold is pressurized by the injection cylinder 11,
The semiconductor chip 1 flows into the space 23 via the cull 9 and the runner 13 and is filled so as to surround the side surface of the semiconductor chip 1. At this time, the exposed surface 14 of the semiconductor chip 1 is
The release film 7 is covered with a spring 6
, The resin 10 is prevented from entering the exposed surface 14 of the semiconductor chip 1 and no resin burrs occur.

Next, the mold is opened, and as shown in a sectional view of FIG. 10, a package resin mold package 18 in which a plurality of semiconductor chips 1 having an exposed surface 14 are collectively molded on the substrate 2 with the resin 10 is placed. Take out. Next, as shown in the cross-sectional view of FIG. 11, the solder balls 22 serving as electrode terminals are mounted on the back surface (the opposite surface on which the semiconductor chip 1 is mounted) of the substrate 2 of the packaged resin mold package 18 taken out. Various methods for mounting the solder balls 22 have been proposed, and a description thereof will be omitted.

Next, as shown in the cross-sectional view of FIG. 12, the package resin mold package 18 is mounted on the dicing sheet 20 with the substrate surface on which the solder balls 22 are formed facing upward.
The resin 10 filled around the semiconductor chip 1 is diced together with the substrate 2 by using a blade called a blade 21, and as shown in the sectional view of FIG. The individual resin mold package 19 of the exposure system is completed. In the divided individual resin mold package 19, only the periphery of the side surface of the semiconductor chip 1 is molded with the resin 10, and the semiconductor chip 1
Is a small and thin package having almost the same size as that of the first embodiment, which contributes to the weight reduction of electronic devices and has excellent heat dissipation because a part of the semiconductor chip 1 is an exposed surface 14. .

However, some problems have been pointed out also in the process of manufacturing the chip-exposed resin mold package. First, when the mold is clamped after the release film is sucked, the release film compressed by the semiconductor chip and the floating block mechanism causes film wrinkles around the semiconductor chip. for that reason,
As shown in the enlarged cross-sectional view of FIG. 14, the inflowing resin 10 is blocked by the wrinkles 15 and an unfilled portion of the resin 10 is formed along the periphery of the semiconductor chip 1 in a groove shape, resulting in poor appearance.

In the dicing step of dividing the collective resin mold package into individual resin mold packages, the width of the dicing blade is increased so that the package for which the cutting margin of the resin mold package is wide is not required to be cut twice. Although the index reduction is prevented, the blade tip is easily worn when the blade width is increased, and as a result, the R shape of the blade tip is increased, and as shown in the sectional view of FIG. The cross-sectional shape of the resin 10 of the mold package 19 protrudes in the opposite direction as an inverted R portion 16, and an external defect occurs. In order to prevent this shape defect, it is necessary to increase the thickness of the dicing sheet that fixes the package and increase the blade depth during dicing, resulting in a significant increase in cost due to the thicker dicing sheet. Would.

[0010]

As described above, in a resin mold used for manufacturing a conventional chip exposure type package, a release film provided to suppress the generation of resin burrs on an exposed surface of a semiconductor chip. When the release film is clamped with a mold, the release film becomes wrinkled and pushes up around the semiconductor chip. In the package manufacturing process, when dicing an individual resin mold package from a collective resin mold package, if the blade width is large, an abrasion of the blade causes an inverted R-shaped uncut portion to be formed on the cut surface of the individual resin mold package. And
There is a problem that the external dimensions are defective.

SUMMARY OF THE INVENTION The present invention has been made to solve these problems, and it is an object of the present invention to prevent the release film from wrinkling when the resin molding is performed by covering the inner surface of a resin mold with a release film. Accordingly, an object of the present invention is to improve the manufacturing yield while maintaining the package outer shape.

[0012]

According to the present invention, there is provided a resin mold having a plurality of semiconductor chips arranged at equal intervals in the vertical and horizontal directions, a board mounted thereon, and a floating block movable up and down by a spring. A release film disposed between the upper mold having the lower mold and the substrate set thereon is pressed against the upper surface of the semiconductor chip with a floating block, clamped, and resin is injected around the semiconductor chip to form a plurality of semiconductor chips on the substrate. This is a resin mold used to manufacture a chip-exposed resin mold package that prevents the resin from flowing into the upper surface of the semiconductor chip when performing resin molding of the package, and presses down and extends the release film when clamping the mold Each semiconductor chip to be collectively resin-molded on the lower surface of the floating block The convex projections arranged in a lattice form is provided to cut. The height of the projection is lower than the thickness of the semiconductor chip, the width is formed to be narrower than the cutting allowance when the package is cut by dicing, and the shape of the projection is V-shaped or mountain-shaped in cross section. Is formed.

The method of manufacturing a resin mold package according to the present invention is characterized in that a substrate on which a plurality of semiconductor chips are arranged at equal intervals in the vertical and horizontal directions is set in a lower die, and an upper die having a floating block movable up and down by a spring. The release film placed between the mold and the lower mold on which the board is set is pressed against the upper surface of the semiconductor chip with a floating block, clamped, resin is injected around the semiconductor chip, and multiple semiconductor chips are collectively resin-molded on the board A method of manufacturing a resin mold package of a chip exposure type, wherein a resin is prevented from flowing into the upper surface of a semiconductor chip when performing
Using a resin mold having a convex protrusion on the floating block, forming grooves arranged in a grid pattern on the resin surface on the same plane as the semiconductor chip exposed surface of the collective resin mold package so as to partition each semiconductor chip. Is the way.

Further, according to the method of manufacturing a resin mold package of the present invention, the batch resin mold package is placed on a dicing sheet with the groove facing downward, the blade is aligned with the groove, dicing is performed with the substrate, and divided into individual resin mold packages. In the case of dicing, dicing is performed using a blade having a thickness smaller than the groove width, so that the slope of the groove remains in a chamfered shape in the resin portion of the divided individual resin mold package. It is.

In the method of manufacturing a resin mold package according to the present invention, when dicing is performed using a blade having a thickness smaller than the groove width, the cutting depth of the blade is adjusted to a position where the tip of the blade is slightly in contact with the dicing sheet. Alternatively, the cutting depth of the blade is set at a position where the blade tip is slightly separated from the dicing sheet.

Further, according to the method for manufacturing a resin mold package of the present invention, the batch resin mold package is placed on a suction table with the groove facing downward, the blade is aligned with the groove, and the substrate is diced, without using a dicing sheet. This is a method of dividing into individual resin mold packages, and in dicing, the cutting depth of the blade is set to a position where the tip of the blade is slightly separated from the suction table.

[0017]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing a resin mold according to the present embodiment and a method for manufacturing a resin mold package using the same. FIG. 1A shows a state before the mold is clamped, and FIG. The state at the time of mold clamping is shown. FIG. 2 is a partially enlarged view of FIG. The resin mold package targeted in the present embodiment is a small and thin package having a size substantially equal to the size of a semiconductor chip, and furthermore, a chip-exposed resin having an exposed surface on which one surface of the semiconductor chip is not resin-molded. It is a mold package. Next, an example of a method of manufacturing the chip exposure type package will be described. Note that the same parts as those in the related art will be described using the same reference numerals.

First, as shown in FIG.
The configuration of the substrate 2 on which the semiconductor chips 1 are mounted will be described. A plurality of semiconductor chips 1 are arranged and mounted in advance on a sheet-like substrate 2 on which a circuit pattern is formed. This mounting is performed by connecting the electrode pads provided on the front surface side of the semiconductor chip 1 and the connection terminals provided on the circuit pattern of the substrate 2 in a face-down manner. Also, the arrangement of the semiconductor chips 1 on the substrate 2 is such that nine semiconductor chips 1 arranged in nine rows are provided in two rows, and a total of 18 semiconductor chips 1 are arranged on a single substrate 2 at equal vertical and horizontal intervals. .

The upper mold 3 employs a cavity floating method, and has a floating block 5a which can be moved up and down by a spring 6 to release the pressure applied to the semiconductor chip 1 at the time of clamping the mold. On the lower surface, a convex protrusion 8 which is a feature of the present invention is formed. The cross section of this convex projection 8 is V
It is formed in the shape of a letter or a mountain, and the tip of the projection is slightly rounded so that the release film 7 in contact with the projection is not damaged. Further, as shown in the bottom view of the floating block 5a in FIG. 3, three convex protrusions 8 are provided in the column direction and the row direction so as to partition each of the 18 semiconductor chips 1 arranged on the substrate 2 described above. Ten are arranged in a grid. The width of the projection 8 is smaller than the cutting margin when the resin mold package is cut by dicing, and the height is smaller than the thickness of the semiconductor chip 1. The release film 7 is supplied between the upper mold 3 and the lower mold 4 having such a structure, and then the substrate 2 on which the semiconductor chip 1 is mounted is placed on the lower mold 4. At this time, the release film 7 may be attached to the lower mold 4 depending on the package direction, but the case where only the upper mold is used will be described here.

Next, the release film 7 is attracted and adhered along the entire lower surface of the upper mold 3 including the lower surface of the floating block 5a including the convex protrusion 8 and the inner surface of the runner 13. Next, as shown in FIG. 1B, the exposed surface 14 (the surface opposite to the substrate side) of the semiconductor chip 1 is covered with a release film 7 disposed between the upper mold 3 and the lower mold 4. Perform mold clamping with. As shown in the partially enlarged view of FIG.
As a result, the entire surface of the semiconductor chip 1 is stretched due to an increase in the surface area of the resin mold, and the semiconductor chip 1 is removed in a state where the slack generated on the semiconductor chip 1 and the wrinkles generated around the semiconductor chip 1 in the related art are eliminated. Can be coated.

After completion of the mold clamping, the resin 10 is injected into the space 23. The resin 10 is softened by a mold heated to around 180 ° C., pressurized by an injection cylinder 11 as shown in FIG. 1 (b), passes through a cull 9, a runner 13 and surrounds the semiconductor chip 1 on the substrate 2. Although filled, the exposed surface 14 of the semiconductor chip 1 is covered with the release film 7, so that the intrusion of the resin 10 is prevented, and no resin burr occurs. Further, since the wrinkles of the release film 7 generated around the semiconductor chip 1 are eliminated, the unfilled portion of the resin is eliminated and the appearance defect is also eliminated.

In the resin injected into the space 23 shown in FIG. 2, a V-shaped or mountain-shaped groove is formed as a replica of the projection 8. This groove exhibits an effect at the time of dicing as described later. Next, the mold is opened, and as shown in the sectional view of FIG. 4, a plurality of semiconductor chips 1 each having an exposed surface 14 are collectively molded on
Take out a. This batch resin mold package 18a
The surface of the resin 10 on the same plane as the semiconductor chip exposed surface 14 is formed in three rows and ten rows in the mold resin portion so that each semiconductor chip 1 is partitioned by the convex protrusions 8 shown in FIG. The grooves 12 are formed in a lattice shape. Next, as shown in the cross-sectional view of FIG. 5, a solder ball 22 serving as an electrode terminal is mounted on the back surface (the opposite surface on which the semiconductor chip 1 is mounted) of the substrate 2 of the taken-out package resin mold package 18a. Various methods for mounting the solder balls 22 have been proposed, and a description thereof will be omitted.

Next, as shown in the sectional view of FIG. 6, the package resin mold package 18a is placed on the dicing sheet 20 with the surface on which the solder balls 22 are mounted facing upward.
And the cutting direction of the blade 21 is aligned with the groove 12,
The tip of the blade 21 is fed at least to a depth reaching the groove 12, the resin 10 molding the periphery of the semiconductor chip 1 is diced along with the substrate 2 along the groove 12, and as shown in the sectional view of FIG. The individual resin mold package 19a by the chip exposure method is completed.

At the time of dicing, dicing can be performed under various optimum conditions in consideration of the width and depth of the groove, the width and feed amount of the blade, and the like. For example, as shown in the cross-sectional view of FIG. 8, if the width of the groove 12 is made wider than the width of the blade 21, the groove 12 serves as a relief part for stress generated at the time of cutting, so that cracks in the resin 10 are reduced. Generation can be reduced. At the same time, as shown in FIG. 7, the inclined surface 17 of the groove 12 remains as a chamfered portion, so that even if the blade 21 is worn, the reverse R chamfered portion which is conventionally generated does not occur, and individual blades which are not affected by blade wear are eliminated. The cross section of the resin 10 of the resin mold package 19a can be obtained. Also,
If it is not desired to leave traces of the groove 12 on the resin 10, the width of the groove 12 is made narrower than the width of the blade 21, and dicing is performed in consideration of positional accuracy. A resin mold package can be made. In addition, by controlling the size and depth of the grooves, even if the package warps during resin molding of the package, the grooves are formed when the package is pressed horizontally in the subsequent process This makes it easier to correct the warpage.

Further, the formation of the groove 12 eliminates the need to cut the blade 21 deep into the dicing sheet 20, so that the dicing sheet 20 can be thinned and reused.
If the depth of cut is set to a point in the groove that does not reach the dicing sheet 20, the dicing sheet 20 does not need to be used, so that the cost of the dicing sheet can be reduced. In addition, when a dicing sheet is not used, dicing can be performed only by fixing the collective resin mold package to the suction table irrespective of the type, so that it is not necessary to provide a fixing jig for each type.

[0026]

The present invention relates to a resin mold and a method for manufacturing a resin-molded package of a chip-exposed type using a release film. On the lower surface of the floating block of the mold, convex protrusions are arranged in a grid so as to partition each semiconductor chip to be collectively resin-molded. On the resin surface on the same plane as the above, grooves arranged in a lattice pattern are formed so as to partition each semiconductor chip, and this package resin mold package is fixed to a dicing sheet with the grooves facing down, or Dicing with the substrate by aligning the blade with the groove position without using Because be divided into a Kkeji, the following effects can be obtained.

Since the release film is no longer slack, wrinkles generated around the chip due to the collapse of the release film are eliminated, and this portion is not filled with the resin, so that appearance defects can be eliminated.

By making the groove width smaller than the blade width at the time of dicing, no groove mark remains on the divided individual resin mold packages. Further, by setting the groove width larger than the blade width, it is possible to obtain a package cut surface which is not affected by wear of the blade, and at the same time, it is possible to reduce resin cracks at the time of cutting by forming a slope of the groove in the cut surface. .

Even if the blade width is large, the dicing sheet can be made thinner because the groove is provided in the cut portion, so that the blade does not need to be set deeply, and the cost can be reduced. Also, by making the groove larger (deeper), the package can be cut without cutting the blade to the dicing sheet, so that the dicing sheet can be reused.

Further, by making the groove large (deep), it is not necessary to cut the blade more than the thickness of the semiconductor chip, so that dicing can be performed without using a dicing sheet. It is no longer necessary and cost can be reduced.

Further, by controlling the size and depth of the groove, it becomes easy to straighten the package warpage generated during the resin molding in a later step.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view showing an embodiment of a resin mold according to the present invention and a method of manufacturing a package using the mold, wherein FIG. 1 (a) is before a mold clamp, and FIG. The state at the time of mold clamping is shown.

FIG. 2 is an enlarged sectional view of FIG. 1 (b).

FIG. 3 is a bottom view of a floating block showing an embodiment of a resin mold according to the present invention.

FIG. 4 is a cross-sectional view of a batch resin mold package molded using the resin mold of the present invention.

FIG. 5 is a cross-sectional view in which solder balls are mounted on the collective resin mold package shown in FIG.

FIG. 6 is a cross-sectional view showing a state in which a batch resin mold package formed using the resin mold of the present invention is diced.

FIG. 7 is a cross-sectional view of an individual resin mold package obtained by dividing the collective resin mold package shown in FIG. 7 by dicing.

FIG. 8 is a cross-sectional view illustrating an embodiment of a package manufacturing method according to the present invention.

FIGS. 9A and 9B are cross-sectional views illustrating a conventional chip-exposed resin mold and a method of manufacturing a package using the mold, wherein FIG. 9A is a view before a mold is clamped, and FIG. The state at the time of clamping is shown.

FIG. 10 is a cross-sectional view of a batch resin mold package formed using a conventional resin mold.

FIG. 11 is a cross-sectional view of a package resin mold package shown in FIG. 10 on which solder balls are mounted.

FIG. 12 is a cross-sectional view showing a state of dicing a batch resin mold package formed using a conventional resin mold.

13 is a cross-sectional view showing a general shape of an individual resin mold package obtained by dividing the collective resin mold package shown in FIG. 12 by dicing.

FIG. 14 is a partially enlarged cross-sectional view illustrating a conventional problem during mold clamping.

FIG. 15 is a sectional view of an individual resin mold package for explaining a conventional problem.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor chip 2 Substrate 3 Upper mold 4 Lower mold 5, 5a Floating block 6 Spring 7 Release film 8 Convex projection 9 Cal 10 Resin 11 Injection cylinder 12 Groove 13 Runner 14 Exposed surface 15 Wrinkle 16 Reverse R part 17 Slope 18 , 18a Bulk resin mold package 19, 19a Individual resin mold package 20 Dicing sheet 21 Blade 22 Solder ball 23 Space

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) B29K 105: 22 B29K 105: 22 B29L 9:00 B29L 9:00 31:34 31:34 F term (reference) 4F202 AD03 AD05 AD08 AD35 AG03 AH37 AR12 CA11 CB01 CB12 CB13 CB17 CB20 CK52 CK75 CL02 CQ01 CQ03 CQ07 4F206 AD03 AD05 AD08 AD35 AG03 AH37 AR12 JA01 JA07 JB12 JB13 JB17 JB20 JF23 J01 JN02 JM03 J01

Claims (11)

[Claims] 1. A substrate on which a plurality of semiconductor chips are arranged at equal intervals in the vertical and horizontal directions is set in a lower die, and an upper die having a floating block movable up and down by a spring and a lower die on which the substrate is set. The release film placed between them is pressed against the upper surface of the semiconductor chip with a floating block and clamped, and resin is injected around the semiconductor chip and resin is applied to the upper surface of the semiconductor chip when multiple semiconductor chips are collectively resin-molded on the board. In a resin mold used for manufacturing a chip-exposed resin mold package that prevents inflow of semiconductor chips, a plurality of semiconductor chips to be collectively resin-molded are arranged in a grid on the lower surface of the floating block. Provide convex protrusions,
A resin mold, characterized in that the release film is pushed down and stretched during mold clamping. 2. The semiconductor device according to claim 1, wherein a height of the projection is smaller than a thickness of the semiconductor chip, and a width of the projection is smaller than a cutting margin when the package is cut by dicing. Resin mold. 3. The resin mold according to claim 1, wherein the convex protrusion has a V-shaped or mountain-shaped cross section. 4. A substrate on which a plurality of semiconductor chips are arranged at equal intervals vertically and horizontally is set in a lower die, and an upper die having a floating block movable up and down by a spring and a lower die on which the substrate is set. The release film placed between them is pressed against the upper surface of the semiconductor chip with a floating block and clamped, and resin is injected around the semiconductor chip and resin is applied to the upper surface of the semiconductor chip when multiple semiconductor chips are collectively resin-molded on the board. In the method of manufacturing a chip-exposed type resin mold package in which the inflow of a semiconductor chip is prevented, a resin mold having a convex protrusion on the floating block is used, and is flush with a semiconductor chip exposed surface of the package resin mold package. A special feature is to form grooves arranged in a grid on a certain resin surface to partition each semiconductor chip. A method of manufacturing a resin mold package. 5. When separating the package resin mold package into individual pieces, the package resin mold package is fixed to a sheet called a dicing sheet with the groove of the package resin mold package facing downward,
A method for manufacturing a resin mold package, comprising: performing dicing and cutting along with a substrate in accordance with a groove with a blade called a blade for separating the collective resin mold package into individual pieces; and dividing the package into individual resin mold packages. 6. The method according to claim 5, wherein the dicing is performed using a blade having a thickness smaller than a groove width. 7. The method for manufacturing a resin mold package according to claim 5, wherein a slope of the groove is left in a chamfered shape in a resin portion of the individual resin mold package divided by the dicing. 8. The method for manufacturing a resin mold package according to claim 5, wherein, during the dicing, the cutting depth of the blade is set at a position where the tip of the blade slightly contacts the dicing sheet. 9. The method for manufacturing a resin mold package according to claim 5, wherein, at the time of dicing, the cutting depth of the blade is set at a position where the tip of the blade is slightly separated from the dicing sheet. 10. The package resin mold package is mounted on a suction table with a groove facing down, a blade is aligned with the groove, dicing is performed with the substrate, and the package is divided into individual resin mold packages without using a dicing sheet. Manufacturing method of a resin mold package. 11. The method for manufacturing a resin mold package according to claim 10, wherein, during the dicing, the cutting depth of the blade is set at a position where the tip of the blade is slightly separated from the suction table.