JP2008232958A - Inspection tool and semiconductor device inspection method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection tool that makes it less apt to have the heat from a semiconductor device escape to the outside through contacting an inspection tool from the external electrode of a semiconductor device, when conducting accurate inspection of temperature control. <P>SOLUTION: The periphery of the contact 105 in the inspection tool is surrounded by a substance 201 having thermal conductivity higher than that of the contact 105, and the periphery of the substance 201 having high thermal conductivity is surrounded by a heat-insulating substance (substance having low thermal conductivity) 202, thus preserving the temperature of the contact 105, preventing heat from the semiconductor device 101 from escaping to an inspection board 109 easily through the contact 105, and controlling the temperature accurately. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a semiconductor device inspection jig and a semiconductor device inspection method, and relates to a technique for performing temperature control of an inspection jig used for performing various measurements of a semiconductor device and a semiconductor device to be mounted.

  Conventionally, when inspecting by applying temperature to a semiconductor device, for example, as shown in FIG. 3, a heat source device (heater device) 104 disposed on the upper surface side of the semiconductor device 101 and a lower surface side of the semiconductor device 101 are disposed. An inspection jig (socket) 100 to be used and a semiconductor device inspection apparatus (inspection board 109) to measure the semiconductor device 101 are used.

  The inspection jig 100 has a plurality of contacts 105 in a socket housing 108, and the contacts 105 contact the semiconductor device 101 and the inspection board 109 of the semiconductor device inspection apparatus. The contact 105 is in contact with the external electrode 103 of the semiconductor device 101 at the contact end portion 106 on the upper surface side of the socket, and is in contact with the inspection board 109 at the contact end portion 107 on the lower surface side of the socket.

In this configuration, the heat source device (heater device) 104 performs temperature control while heating the semiconductor device 101 from the upper surface side. The heat of the upper surface of the semiconductor device 101 heated by the heat source device 104 is conducted from the upper surface portion of the semiconductor device 101 to the resin portion 102 of the semiconductor device 101. In this state, a temperature assurance inspection of the chip 110 of the semiconductor device 101 is performed by the inspection board 109.
JP 2006-17738 A

  By the way, in order to guarantee the operation characteristics of the semiconductor device 101 in the above-described temperature assurance inspection, the temperature control of the semiconductor device 101 when the semiconductor device 101 is heated by the heat source device (heater device) 104, particularly the temperature control of the chip 110. is important. However, since the chip 110 is generally sealed and protected by the resin portion 102 as a package, the thermal conductivity is not so good.

  For this reason, when heated by the heat source device (heater device) 104, the semiconductor device 101 actually has a certain temperature difference between the surface portion of the resin portion 102 and the chip 110 inside the resin portion 102. Therefore, even if the surface temperature of the resin portion 102 is measured, it is difficult to accurately measure the temperature of the chip 110.

  In recent years, the external electrodes 103 of the semiconductor device 101 have become multi-pin (500 pins or more) as the function of the semiconductor device 101 increases. For this reason, the heat applied to the resin portion 102 is conducted to the contact 105 of the socket 100 through the multi-pin external electrode 103, and the heat escapes to the inspection board 109 of the semiconductor device inspection apparatus. ) 104, even if the temperature of the resin portion 102 is adjusted, it is difficult to accurately adjust the temperature of the chip 110 inside the semiconductor device.

  With respect to such a problem, in the socket for semiconductor device inspection apparatus described in Patent Document 1, a passage through which gas or liquid passes is provided in the contact portion of the inspection jig, and the heated gas or liquid is supplied to the passage. The contactor is heated by feeding, and the temperature control is performed so that the heat of the semiconductor device is difficult to escape.

However, in this method, it is necessary to apply heat from the outside of the inspection jig to the apparatus for sending heat to the contact end portion of the inspection jig (socket), and the apparatus configuration becomes complicated.
The present invention solves the above-mentioned problems, and without keeping heat from the outside of the inspection jig, the contact end of the inspection jig is kept warm so as not to release the heat applied to the semiconductor device. An object of the present invention is to provide an inspection jig and an inspection method capable of accurately controlling the temperature of a semiconductor device.

  In order to solve the above-described problems, the inspection jig of the present invention includes a plurality of contacts that connect a plurality of electrodes provided in a semiconductor device and a plurality of electrodes provided in an apparatus for measuring the semiconductor device. In the inspection jig, the periphery of the contact is filled with at least one of a gas, a liquid, or a solid having higher thermal conductivity than the contact, and the periphery of the material is surrounded by a material having a higher thermal insulation than the material. It is characterized by that.

In addition, a material having higher thermal conductivity than the contact is in contact with the contact through an insulator, or a material having higher thermal conductivity than the contact is itself an insulator.
In addition, the contact portion has an insulating treatment on a surface portion in contact with the material having high thermal conductivity except for an electrode surface portion in contact with the semiconductor device and an electrode surface portion in contact with an apparatus for measuring the semiconductor device. It is characterized by being.

In addition, an internal heat source device that heats the material having high heat conductivity is provided inside the material surrounded by the material having high heat insulation.
The semiconductor device inspection method of the present invention is to inspect the semiconductor device by connecting the electrode of the semiconductor device and the electrode of the apparatus for measuring the semiconductor device with a contact, and heating the semiconductor device with a heat source device The semiconductor device is controlled by controlling the temperature of the semiconductor device while keeping the heat conducted from the semiconductor device to the contact with a substance having higher heat conductivity than the contact disposed around the contact. The device is inspected.

  As described above, according to the present invention, the heat applied from the heat source device (heater device) to the upper surface of the semiconductor device is prevented from escaping from the plurality of electrodes of the semiconductor device to the measuring device of the semiconductor device through the contact of the inspection jig. Since the amount of heat that escapes can be reduced, the temperature of the semiconductor device can be accurately controlled by adjusting the heat source device (heater device), and the chip of the semiconductor device can be obtained without applying heat to the inspection jig from the outside. It is possible to accurately adjust the temperature of the.

Hereinafter, an inspection jig and a semiconductor device inspection method showing embodiments of the present invention will be specifically described with reference to the drawings.
First, the configuration of the inspection jig according to the first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a cross-sectional view of the inspection jig of the first embodiment.
(Embodiment 1)
As shown in FIG. 1, an inspection jig (hereinafter referred to as a socket) 200 includes a plurality of contacts 105 that contact a semiconductor device 101 and an inspection board 109 of a semiconductor device inspection apparatus that measures the semiconductor device 101 in a socket housing. 108.

  In the contact 105, the contact end portion 106 on the upper surface side of the socket contacts the external electrode 103 of the semiconductor device 101, and the contact end portion 107 on the lower surface side of the socket contacts the inspection board 109.

  The socket 200 is provided with a material 201 having high heat conductivity in the socket casing 108, and the material 201 having high heat conductivity surrounds the contact 105 disposed on the socket 200 and contacts the surface of the contact 105. Therefore, heat is conducted from the material 201 having high thermal conductivity to the contact 105.

  The material 201 having a high thermal conductivity has a higher thermal conductivity than the material of the contact 105 and the inspection board 109, and the portion in contact with the contact 105 is insulated, so that an electrical short between the contacts 105 can be prevented. It is preventing. In addition, the material 201 having high heat conductivity may be any of gas, liquid, and solid as its material state, but a solid is desirable in order to securely fix the contact 105 and the socket housing 108. Further, the material 201 having high thermal conductivity can be an insulator.

As an example, copper (Cu) or the like that has been subjected to insulation plating (insulation plating of 10 × 10 ¹⁶ Ω or more) on the surface of the portion that contacts the contact 105 is preferable. In the case where the surface of the material 201 having high thermal conductivity is not insulated, the contact 105 is subjected to insulation plating (insulation plating of 10 × 10 ¹⁶ Ω or more). This insulation plating is performed except for the electrode surface that contacts the external electrode 103 of the semiconductor device 101 and the inspection board 109 of the semiconductor device inspection apparatus, that is, the upper surface portion of the contact end portion 106 and the lower surface portion of the contact end portion 107.

  The outer side of the material 201 having high heat conductivity is covered with a heat insulating material 202, and the heat is transferred from the contact 105 to the material 201 having high heat conductivity so as not to escape to the outside of the socket 200. The heat insulating material 202 is characterized by a material having a thermal conductivity lower than that of the material 201 having high thermal conductivity provided around the contact 105.

  A semiconductor device inspection method using the socket 200 according to the first embodiment will be described below. As shown in FIG. 1, first, the upper surface of the semiconductor device 101 is heated by a heat source device (heater device) 104. The heat applied from the heat source device (heater device) 104 to the upper surface of the semiconductor device 101 is thermally conducted to the external electrode 103 through the resin portion 102, and is conducted from the external electrode 103 to the contact 105 through the contact end portion 106, and further contacted. Heat conduction from the child 105 to the material 201 having high heat conduction. Since the material 201 with high heat conductivity is thermally insulated from the outside by the heat insulating material 202, the heat conducted from the contact 105 to the material 201 with high heat conductivity is kept in the material 201 with high heat conductivity.

  By keeping the heat around the contact 105 with the highly heat-conductive material 201 that maintains this heat, the heat applied from the heat source device (heater device) 104 to the semiconductor device 101 does not easily escape to the inspection board 109 through the contact 105. The temperature of the semiconductor device 101 can be accurately controlled by adjusting the heat source device (heater device) 104.

Next, the configuration of the inspection jig according to the second embodiment of the present invention will be described with reference to FIG. FIG. 2 is a cross-sectional view of the inspection jig of the second embodiment.
(Embodiment 2)
In FIG. 2, the same components as those described in FIG.

  The feature of the second embodiment is that the socket 300 has an internal heat source device (heater device) 301. The internal heat source device (heater device) 301 is disposed inside the socket housing 108 and is attached to a position where heat can be easily conducted to the surface portion of the material 201 having high heat conduction. Arranged outside the high substance 201.

  The periphery of the material 201 with high heat conductivity and the internal heat source device (heater device) 301 is covered with a heat insulating material 202, and heat that conducts heat from the contact 105 to the material 201 with high heat conductivity and the internal heat source device (heater device) 301. The heat insulating material 202 is used to keep the heat conducted from the heat conducting material 201 to the highly heat conducting material 201 from escaping to the outside of the socket 300. Other configurations are the same as those in FIG.

  A semiconductor device inspection method using the socket 300 according to the second embodiment will be described below. As shown in FIG. 2, first, the upper surface of the semiconductor device 101 is heated by a heat source device (heater device) 104. The heat applied from the heat source device (heater device) 104 to the upper surface of the semiconductor device 101 is thermally conducted to the external electrode 103 through the resin portion 102, and is conducted from the external electrode 103 to the contact 105 through the contact end portion 106, and further contacted. Heat conduction from the child 105 to the material 201 having high heat conduction.

  In addition, simultaneously with the heating of the semiconductor device 101 by the heat source device (heater device) 104, the material 201 having high heat conductivity is heated by the internal heat source device (heater device) 301 attached to the surface portion of the material 201 having high heat conductivity.

  Since the material 201 with high heat conductivity is thermally insulated from the outside by the heat insulating material 202, the heat conducted from the contact 105 to the material 201 with high heat conductivity and the heat applied from the internal heat source device (heater device) 301 are heat. The highly conductive material 201 is maintained.

  By keeping the heat around the contact 105 with the highly heat-conductive material 201 that maintains this heat, the heat applied from the heat source device (heater device) 104 to the semiconductor device 101 does not easily escape to the inspection board 109 through the contact 105. The temperature of the semiconductor device 101 can be accurately controlled by adjusting the heat source device (heater device) 104 and the internal heat source device (heater device) 301.

Sectional drawing which shows the inspection jig in Embodiment 1 of this invention Sectional drawing which shows the inspection jig in other Embodiment 2 of this invention Sectional view showing a conventional inspection jig

Explanation of symbols

100 Inspection jig (socket)
DESCRIPTION OF SYMBOLS 101 Semiconductor device 102 Resin part of semiconductor device 103 External electrode of semiconductor device 104 Heat source apparatus (heater apparatus)
105 Contact 106 Contact end (contact part with semiconductor device)
107 Contact end (contact part with inspection board)
108 Socket housing 109 Inspection board 110 Chip 201 Material with high thermal conductivity (gas, liquid or solid)
202 Thermal insulation material 301 Internal heat source device (heater device)

Claims (5)

In an inspection jig in which a plurality of contacts connecting a plurality of electrodes provided in a semiconductor device and a plurality of electrodes provided in an apparatus for measuring the semiconductor device are arranged, the periphery of the contact is heated by the contact An inspection jig characterized by being filled with at least one of a highly conductive gas, liquid, or solid substance, and surrounding the substance with a substance having higher heat insulation than the substance. The material having higher thermal conductivity than the contact is in contact with the contact through an insulator, or the material having higher thermal conductivity than the contact is itself an insulator. Inspection jig. In the contact, the surface portion in contact with the material having high thermal conductivity is insulated except for the electrode surface portion in contact with the semiconductor device and the electrode surface portion in contact with the apparatus for measuring the semiconductor device. The inspection jig according to claim 1, wherein: The inspection jig according to claim 1, wherein an internal heat source device for heating the material having high thermal conductivity is provided inside the material surrounded by the material having high heat insulation. Inspecting the semiconductor device by connecting an electrode of a semiconductor device and an electrode of an apparatus for measuring the semiconductor device with a contact, the semiconductor device being heated with a heat source device, and the contact from the semiconductor device to the contact The semiconductor device is inspected by controlling the temperature of the semiconductor device while keeping the heat conducting heat to a temperature higher than that of the contact arranged around the contact with a substance having higher heat conductivity. Semiconductor device inspection method.

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