JP2008219395A - Piezoelectric vibrating device and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric vibrating device improving an impact resistive performance, enhancing a conductive performance and reducing a cost. <P>SOLUTION: The piezoelectric vibrating device is composed of a metal base 1 with metal lead terminals, a piezoelectric diaphragm 2 loaded on the metal lead terminals and electrically connected through conductive-resin adhesives S and a metal cover 3. In the piezoelectric vibrating device, corrosion preventive films are formed to the metal lead terminals and the external surface of the metal base and oxide films for the corrosion preventive films on the uppermost surfaces of the corrosion preventive films. In the piezoelectric vibrating device, the piezoelectric diaphragm is joined directly in an electromechanical manner by using the conductive-resin adhesive softer than a pencil hardness 4B on the top faces of oxide layers for the corrosion preventive films under the state, in which the oxide layers in sections coated with at least the conductive-resin adhesives are thinner than those of other regions or the oxide films are scattered, on the inner sides of the metal lead terminals at the same time. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a piezoelectric vibration device such as a crystal resonator and a manufacturing method thereof. The present invention relates to a holding structure for a piezoelectric vibration device having an airtight terminal structure in which metal lead terminals are integrally formed with an insulating material interposed in a metal base, and a manufacturing method for obtaining the holding structure.

  Examples of the piezoelectric vibration device include a crystal resonator, a crystal filter, a crystal oscillator, and the like. For example, a crystal resonator is widely used as a reference source for frequency and time because it has excellent resonance characteristics. In these piezoelectric vibration devices, a metal thin film electrode is formed on the surface of a crystal vibration plate (piezoelectric vibration plate), and the metal thin film electrode is hermetically sealed by a package body in order to protect the metal thin film electrode from the outside air.

  Conventionally, in a piezoelectric vibration device having an airtight terminal structure, a pair of metal lead terminals are implanted in the metal base via an insulating material such as glass, and a pair of metal flat plates are provided on the inner side of the metal lead terminal. The support members are attached to face each other. The piezoelectric diaphragm is, for example, an AT-cut quartz diaphragm that undergoes thickness shear vibration, and an excitation electrode and an extraction electrode from each excitation electrode are formed on the front and back surfaces. A piezoelectric diaphragm is mounted on the support, and is electrically and mechanically connected by a conductive bonding material. The metal base is covered with a metal lid, and these are air-bonded to each other by a technique such as resistance welding. The structure is hermetically sealed. However, in the piezoelectric vibration device, by configuring the support member, the overall height of the piezoelectric vibration device is increased, and it is not possible to cope with the reduction in height required on the electronic device side. In addition, there is a problem that the cost is increased as a whole.

Therefore, as shown in Patent Document 1, a piezoelectric vibration device has been proposed in which a support member is omitted, a part of a metal lead terminal is processed, and a piezoelectric diaphragm is directly held on the metal lead terminal.
JP 2001-160730 A

  However, as shown in Patent Document 1, in the piezoelectric vibration device in which a support member is omitted and a part of the metal lead terminal is processed and the piezoelectric diaphragm is directly held by the metal lead terminal, the support member is interposed. Compared with the holding structure, the impact resistance performance is inferior, and it is indispensable to use a silicone-based soft conductive resin adhesive. However, in the configuration using the silicone-based conductive resin adhesive, in the corrosion prevention film such as nickel formed on the outer surface of the metal lead terminal and the metal base, an oxide layer formed on the upper surface of the corrosion prevention film. There was a problem of being adversely affected. That is, the conductive resistance of the bonding interface between the metal lead terminal and the silicone-based conductive resin adhesive increases due to the influence of the oxide layer, and the conductive performance of the piezoelectric vibration device may be lowered. As a result, electrical performance deterioration such as a series resonance resistance value (CI value) of the piezoelectric vibration device may occur.

  The present invention has been made to solve the above-described problems, and an object thereof is to provide a cost-effective piezoelectric vibration device having improved impact resistance and improved conduction performance, and a method for manufacturing the same.

  In order to solve the above problems, a piezoelectric vibration device according to the present invention includes, as shown in claim 1, a metal base in which at least two metal lead terminals are implanted through an insulating material, and the metal lead. A piezoelectric diaphragm having an excitation electrode mounted on a terminal and electrically connected via a conductive resin adhesive, and a metal lid that hermetically covers the piezoelectric diaphragm. In the piezoelectric device, an outer surface of the metal lead terminal and the metal base has a corrosion prevention film and an oxide layer of the corrosion prevention film formed on an upper surface of the corrosion prevention film, and the inner side of the metal lead terminal. In the state where at least the oxide layer of the portion to which the conductive resin adhesive is applied is thinner than the oxide layer of other regions or in the state where the oxide film is dotted, the pencil hardness is formed on the upper surface of the oxide layer of the corrosion prevention film. Softer than 4B Using paddle conductive resin adhesive, wherein said piezoelectric diaphragm is bonded electromechanically directly.

  With the above configuration, on the outer surface of the metal lead terminal and the metal base, a corrosion prevention film and an oxide layer of the corrosion prevention film are formed on the top surface of the corrosion prevention film, and on the inner side of the metal lead terminal, At least a portion of the oxide layer to which the conductive resin adhesive is applied is thinner than an oxide layer in another region or an oxide film is scattered on the upper surface of the oxide layer of the corrosion prevention film, with a pencil hardness of 4B. Since the piezoelectric diaphragm is directly electromechanically bonded using a soft conductive resin adhesive, the electrode of the piezoelectric diaphragm is applied to the inner side of the metal lead terminal where the conductive resin adhesive is applied. And more reliable conduction can be ensured. As a result, it is possible to provide an inexpensive piezoelectric vibration device with excellent electrical connectivity by improving the conduction performance and improving the series resonance resistance value of the piezoelectric vibration device while improving the impact resistance performance.

  That is, even if the buffering action is limited by omitting the support, at least the conductive resin adhesive is applied on the inner side of the metal lead terminal through the conductive resin adhesive softer than the pencil hardness 4B. Since the piezoelectric diaphragm is attached to the portion, impact resistance can be improved. And, on the inner side of the metal lead terminal, at least a portion of the oxide layer to which the conductive resin adhesive is applied is thinner than the oxide layer of other regions or in the state where the oxide film is scattered, the corrosion prevention film Since the piezoelectric diaphragm is directly electromechanically bonded to the upper surface of the oxide layer using a conductive resin adhesive softer than pencil hardness 4B, the conductive film is electrically conductive against a thin oxide film or scattered oxide films. The adhesion strength of the resin component of the adhesive resin adhesive increases. Thereby, the contact probability to a metal filler and a metal lead terminal base material part improves, and a conduction | electrical_connection performance improves.

  As a result, on the inner side of the metal lead terminal, at least the conductive performance of the joint interface between the conductive resin adhesive and the portion where the conductive resin adhesive is applied is not reduced, and the series resonance of the piezoelectric vibration device is prevented. It is possible to suppress electrical performance deterioration such as resistance value (CI value).

  In addition to the above-described configuration, a wide nail head portion on which a rectangular piezoelectric diaphragm is mounted is formed on the inner side of the metal lead terminal, and an oxide layer of a corrosion prevention film on the top surface of the nail head portion is formed. Using a conductive resin adhesive softer than pencil hardness 4B, both ends of the long side of the piezoelectric vibration plate are directly and electromechanically directly on the nail head portion in a state thinner than other regions or in a state dotted with oxide films. You may join. With this configuration, in addition to the above-described effects, the mounting is stable when the piezoelectric diaphragm is joined to the inner side of the lead terminal, the joint strength between the piezoelectric diaphragm and the nail head is strengthened and stabilized, and the It is possible to suppress twisting at the short side portion of the piezoelectric diaphragm during impact. As a result, the problem that the piezoelectric diaphragm is cracked and the conductive bonding material is peeled off from the nail head portion of the lead terminal is eliminated.

  As a manufacturing method for obtaining the piezoelectric vibration device of the present invention as described above, as shown in claim 2, a metal base in which at least two metal lead terminals are implanted through an insulating material, A piezoelectric diaphragm formed with excitation electrodes mounted on a metal lead terminal and electrically connected via a conductive resin adhesive; and a metal lid formed by hermetically covering the piezoelectric diaphragm; A method of manufacturing a piezoelectric device comprising: forming a corrosion prevention film on the outer surface of the metal lead terminal and the metal base; cleaning the outer surface of the metal lead terminal and the metal base with dilute hydrochloric acid; Applying a conductive resin adhesive softer than pencil hardness 4B to the inner side of the lead terminal, and both ends of the piezoelectric diaphragm on the inner side of the metal lead terminal coated with the conductive resin adhesive It mounted to, characterized by comprising the step of bonding electromechanically directly the inner side of the piezoelectric vibrating plate and the metal lead terminal via the conductive resin adhesive.

  By the above manufacturing method, a corrosion prevention film is formed on the outer surface of the metal lead terminal and the metal base, the outer surface of the metal lead terminal and the metal base is washed with dilute hydrochloric acid, and then the pencil is formed on the inner side of the metal lead terminal. A conductive resin adhesive softer than hardness 4B is applied, and both ends of the piezoelectric diaphragm are mounted on the inner side of the metal lead terminal to which the conductive resin adhesive is applied, and the conductive resin adhesive Since the piezoelectric diaphragm and the inner side of the metal lead terminal are directly joined mechanically via the metal lead terminal and the outer surface of the metal base cleaned with dilute hydrochloric acid, the top surface of the corrosion prevention film is oxidized. The layer is removed or the oxide film is scattered.

  Before the thickness of the oxide layer increases from this state, a conductive resin adhesive softer than pencil hardness 4B is applied to the inner side of the metal lead terminal, and the metal lead terminal to which the conductive resin adhesive is applied is applied. Since both ends of the piezoelectric diaphragm are mounted on the inner side, the piezoelectric diaphragm and the inner side of the metal lead terminal can be directly joined electromechanically via the conductive resin adhesive, The lead terminal and the piezoelectric diaphragm are joined together without being adversely affected by the oxide layer formed on the upper surface of the prevention film. In particular, the adhesion strength of the resin component of the conductive resin adhesive increases with respect to thin oxide films or scattered oxide films. Thereby, the contact probability to a metal filler and a metal lead terminal base material part improves, and a conduction | electrical_connection performance improves.

  After that, on the inner side of the metal lead terminal, the thickness of the oxide layer formed on the upper surface of the corrosion prevention film increases at least on the other metal lead terminal to which the conductive resin adhesive is not applied and the outer surface of the metal base Therefore, the corrosion prevention function is improved.

  As another manufacturing method for obtaining the piezoelectric vibration device of the present invention as described above, a metal base in which at least two metal lead terminals are embedded through an insulating material, and mounted on the metal lead terminal are mounted. And a piezoelectric device comprising a piezoelectric diaphragm formed with an excitation electrode that is electrically connected via a conductive resin adhesive, and a metal lid that hermetically covers the piezoelectric diaphragm. A method of forming a corrosion prevention film on an outer surface of the metal lead terminal and the metal base; and grinding at least a portion to which the conductive resin adhesive is applied on the inner side of the metal lead terminal After that, a step of applying a conductive resin adhesive softer than pencil hardness 4B to the inner side of the metal lead terminal including the ground region, and a metal layer coated with the conductive resin adhesive. Mounting both ends of the piezoelectric diaphragm on the inner side of the terminal, and electromechanically directly joining the piezoelectric diaphragm and the inner side of the metal lead terminal via the conductive resin adhesive. May be.

  After forming a corrosion prevention film on the outer surface of the metal lead terminal and the metal base by the above manufacturing method and grinding at least a portion to which the conductive resin adhesive is applied on the inner side of the metal lead terminal The conductive resin adhesive softer than pencil hardness 4B is applied to the inner side of the metal lead terminal including the ground region, and the inner side of the metal lead terminal to which the conductive resin adhesive is applied Since both ends of the piezoelectric diaphragm are mounted and the piezoelectric diaphragm and the inner side of the metal lead terminal are directly electromechanically joined via the conductive resin adhesive, the ground metal lead terminal In the inner side region, the oxide layer on the top surface of the corrosion prevention film is removed.

  Before the thickness of the oxide layer in the ground region from this state increases, a conductive resin adhesive softer than pencil hardness 4B is applied to the inner side of the metal lead terminal, and the conductive resin adhesive is applied. Both ends of the piezoelectric vibration plate are mounted on the inner side of the metal lead terminal, and the piezoelectric vibration plate and the inner side of the metal lead terminal are directly joined mechanically via the conductive resin adhesive. Therefore, the lead terminal and the piezoelectric diaphragm are joined without being adversely affected by the oxide layer formed on the top surface of the corrosion prevention film. In particular, the adhesion strength of the resin component of the conductive resin adhesive increases with respect to thin oxide films or scattered oxide films. Thereby, the contact probability to a metal filler and a metal lead terminal base material part improves, and a conduction | electrical_connection performance improves. An anchor effect by the conductive resin adhesive is also generated in the ground region, and not only the electrical connectivity is improved but also the mechanical bonding strength is improved.

  After that, on the inner side of the metal lead terminal, the thickness of the oxide layer formed on the upper surface of the corrosion prevention film increases at least on the other metal lead terminal to which the conductive resin adhesive is not applied and the outer surface of the metal base Therefore, the corrosion prevention function is improved.

  As described above, an inexpensive piezoelectric vibrating device with excellent electrical connectivity and a method for manufacturing the piezoelectric vibrating device are provided by improving conduction performance while improving impact resistance and eliminating an increase in the series resonance resistance value of the piezoelectric vibrating device. Can do.

  Next, embodiments of the present invention will be described with reference to the drawings, taking a crystal resonator as an example. FIG. 1 is a cross-sectional view showing an embodiment of the present invention, FIG. 2 is a plan view before covering the cover of FIG. 1, and FIG. 3 is a plan view before mounting the piezoelectric diaphragm of FIG. is there.

  The piezoelectric diaphragm 2 is made of an AT-cut quartz diaphragm, and is processed into a rectangular shape having a short side and a long side. Excitation electrodes 21 and 22 and extraction electrodes 21a and 22a are provided on the front and back surfaces by means such as vacuum deposition. In addition, the extraction electrode is made to wrap around the opposite main surface in order to ensure electrical connection described later. A main electrode layer mainly composed of silver or gold is formed in a laminated structure of at least one layer on a base electrode layer of chromium or nickel as the electrode material.

  The base 1 as a whole has a low-profile long cylindrical shape, and has a structure in which metal lead terminals 11 and 12 are planted through a base body 10 mainly including a metal shell, and an insulating glass G is used as a base body. These metal lead terminals 11 and 12 are electrically independent by being filled in a part. A circumferential flange 10a is integrally provided at the lower peripheral portion of the base body. In addition, although not shown in figure, the circumferential protrusion part (projection) is integrally formed in the flange 10a.

  The lead terminals 11 and 12 have an elongated columnar shape made of Kovar or the like, and wide, substantially circular shape in plan view and a flat upper portion are formed on the inner end of the upper part of the base. Yes. These nail head portions 11a and 12a are formed by press working using metal ductility or the like. Exemplifying specific dimensions of the lead terminal portion, the lead terminals 11 and 12 have a wire diameter of about 0.32 to 0.45 mm, whereas the nail head portions 11a and 12a have a width dimension d of 0.7 to 0.7 mm. It is formed to about 0.9 mm.

  Although not shown, metal parts exposed on the surfaces of the base 1 and the lead terminals 11 and 12 are provided with an inexpensive and practical nickel plating film for preventing corrosion. In particular, in this embodiment, an electrolytic nickel plating film by an electrolytic plating technique is formed to about 4 μ to 6 μm, and an electroless nickel plating film by an electroless plating technique is formed to about 2 μ to 5 μm on the upper surface. The electrolytic nickel plating film has a higher melting point than the electroless nickel plating, and can be formed before the insulating glass G is fired to obtain a corrosion prevention function before and after the firing. The electroless nickel plating film is formed with a more uniform film quality than the electrolytic nickel plating film, so it not only improves the wettability of solder etc. but also the upper surface contains phosphorus, boron, etc. caused by the reducing agent. By eutectoid, a hard corrosion-preventing film having an amorphous structure and better corrosion resistance can be obtained. In other words, the electroless nickel plating film is an inexpensive and extremely practical and reliable film as a corrosion prevention film on the metal lead terminals and the metal base, but it is a conductive resin adhesive due to the adverse effect of the oxide layer. There is also a problem that the conduction resistance at the bonding interface with the substrate tends to be high. In the present invention, these problems can be improved by combining with acid treatment and grinding described later.

  The metal lid 3 has a long cylindrical shape with an open bottom surface, and has a flange 31 corresponding to the flange 10a of the base at the opening, and is hermetically sealed by resistance welding to the base 1. Done.

  Before the electromechanical direct bonding of the piezoelectric diaphragm 2 and the nail head portions 11a, 12a on the inner side of the metal lead terminals 11, 12 via the conductive resin adhesive S, the outer surface of the base 1 is applied. Acid treatment. In particular, in the nickel plating film of this embodiment, the acid treatment was performed by washing with dilute hydrochloric acid, for example. On the outer surface of the base 1 (the metal lead terminals 11 and 12 and the base body 10) cleaned with dilute hydrochloric acid, the oxide layer on the upper surface of the electroless nickel plating film (corrosion prevention film) is removed. Before the thickness of the oxide layer is adversely affected from this state, the central portion of the short side of the piezoelectric diaphragm 2 is close to the vicinity of the center of gravity of the nail head portions 11a and 12a on the inner side of the metal lead terminal. The both ends of the long side of the piezoelectric diaphragm 2 and the nail head portions 11a and 12a are directly electromechanically joined and attached via a conductive resin adhesive S which is mounted in a state and is softer than pencil hardness 4B. At this time, a bonding region of the conductive resin adhesive S is formed on the entire upper surface of the nail head portion. As the conductive resin adhesive S softer than the pencil hardness 4B, a silicone type conductive resin adhesive (pencil hardness of about 6B) or a modified epoxy type conductive resin adhesive (pencil hardness of about 4B) is used. By forming in this way, the lead terminals 11 and 12 and the piezoelectric diaphragm 2 can be joined without being adversely affected by the oxide layer on the upper surface of the electroless nickel plating film (corrosion prevention film). In particular, the resin component of the conductive resin adhesive S increases the adhesion strength on the inner side of the metal lead terminals 11 and 12 with respect to the thin oxide film or the scattered oxide film on the upper surface of the nail head portions 11a and 12a. Thereby, the contact probability to the metal filler and metal lead terminal base material part of the conductive resin adhesive S improves, and conduction | electrical_connection performance improves. As a result, not only the electrical connection between the piezoelectric diaphragm 2 and the nail head portions 11a and 12a is improved, but also the mechanical bonding strength is improved.

  Thereafter, on the inner side of the metal lead terminals 11 and 12, the other metal lead terminals 11 and 12 or the base body 10 to which at least the conductive resin adhesive S other than the upper surface portions of the nail head portions 11a and 12a is not applied are applied. On the outer surface, the thickness of the oxide layer formed on the upper surface of the electroless nickel plating film (corrosion prevention film) increases with time, so that the corrosion prevention function is improved.

  In addition, it is more preferable to use the metal filler contained in the conductive resin adhesive having a flake shape mainly composed of silver or the like and having an average particle diameter of 3 μm to 6 μm. This is because the flake-shaped metal filler contained in the conductive resin adhesive S is more likely to establish contact with the nail head portions 11a, 12a of the metal lead terminals, and the conduction performance is more stably and reliably increased.

  After mounting the piezoelectric diaphragm 2, after performing necessary processing such as annealing, the base 1 is covered with the lid 3, although not shown, the welding electrode bodies are brought into contact with both flanges, and pressure is applied to both. Energization is performed while applying resistance welding, and the hermetic sealing is completed.

  By the above manufacturing method, the final piezoelectric vibrating device is a nail head portion 11a, 12a that is a portion to which at least the conductive resin adhesive S is applied on the inner side of the metal lead terminals 11, 12. An oxide layer formed on the upper surface of the electroless nickel plating film (corrosion prevention film) on the upper surface of the electroless nickel plating film in other regions (the other metal lead terminals 11 and 12 and the base body 10). With the conductive resin adhesive S softer than the pencil hardness 4B in a state thinner than the oxide layer formed on the upper surface of the (corrosion prevention film) or in a state dotted with the oxide film, the long side of the piezoelectric diaphragm 2 is used. Both ends can be directly electromechanically joined.

-Other embodiments-
In the present embodiment, the nail head portions 11a and 12a are formed on the inner side of the metal lead terminal, but may be directly joined to the inner side of the metal lead terminal without forming the nail head portions 11a and 12a. Also, as shown in FIGS. 4 and 5, on the inner side of the metal lead terminals 11, 12, connecting portions 13, 14 that extend in directions close to each other and are gradually thinned and gradually widened, The present invention can also be applied to the configuration of a metal lead terminal in which the flat mounting portions 15 and 16 are formed wider than the lead terminal formed at the tip of the connection portion. That is, on the inner side of the metal lead terminals 11 and 12, the electroless nickel plating film (corrosion prevention film) on the upper surface portion of the mounting portions 15 and 16 that is at least the portion to which the conductive resin adhesive S is applied. The oxide layer formed on the upper surface is thinner than the oxide layer formed on the upper surface of the electroless nickel plating film (corrosion prevention film) in other regions (other metal lead terminals 11 and 12 and the base body 10). Thus, both ends of the long side of the piezoelectric diaphragm 2 are directly electromechanically joined using a conductive resin adhesive S softer than the pencil hardness 4B. In such a configuration, the mounting portions 15 and 16 are disposed in the inner portions where the inner metal lead terminals 11a and 12a are implanted, so that the mounting portions 15 and 16 are smaller than those made for surface-mounted piezoelectric vibrators. In addition to being applicable to the quartz crystal diaphragm, it is possible to reduce the transmission of stress by the connecting portion and enhance the buffer function.

  In this embodiment, the piezoelectric diaphragm 2 and the inner side nail head portions 11a and 12a of the metal lead terminals 11 and 12 are directly electromechanically joined with the conductive resin adhesive S before being washed with dilute hydrochloric acid. Thus, an oxide layer formed on the upper surface of the electroless nickel plating film (corrosion prevention film) on the upper surface portion of the nail head portions 11a and 12a, which is at least the portion to which the conductive resin adhesive S is applied, It is configured to be thinner than the oxide layers in other regions or in a state where oxide films are scattered. However, before the electromechanical direct bonding of the piezoelectric diaphragm 2 and the nail head portions 11a, 12a on the inner side of the metal lead terminals 11, 12 via the conductive resin adhesive S, the inner side of the metal lead terminal is performed. Even if grinding is performed on at least a portion to which the conductive resin adhesive is applied, for example, the upper surface portion of the nail head portions 11a and 12a, it is formed on the upper surface of the electroless nickel plating film (corrosion prevention film). The oxidized layer can be removed, and the same effect can be obtained.

  In addition, although the crystal resonator was illustrated as an example of the piezoelectric vibration device of the present invention, a crystal filter, a crystal oscillator, or the like may be used.

  The present invention can be implemented in various other forms without departing from the spirit or main features thereof, and should not be interpreted in a limited manner. The scope of the present invention is indicated by the claims, and is not limited by the text of the specification. Further, all modifications and changes belonging to the equivalent scope of the claims are within the scope of the present invention.

Sectional drawing which shows embodiment of this invention. The top view before putting the cover of FIG. The top view before mounting the piezoelectric diaphragm of FIG. Sectional drawing which shows other embodiment of this invention. The top view before mounting the piezoelectric diaphragm of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base 10 Base main body 11,12 Lead terminal 2 Piezoelectric diaphragm 3 Lid

Claims (2)

Formed is a metal base in which at least two metal lead terminals are embedded through an insulating material, and an excitation electrode mounted on the metal lead terminal and electrically connected via a conductive resin adhesive A piezoelectric device comprising a piezoelectric diaphragm and a metal lid formed by airtightly covering the piezoelectric diaphragm,
On the outer surface of the metal lead terminal and the metal base, a corrosion prevention film and an oxidation layer of the corrosion prevention film are formed on the top surface of the corrosion prevention film,
On the inner side of the metal lead terminal, at least a portion of the oxide layer to which the conductive resin adhesive is applied is thinner than the oxide layer of other regions or in the state where the oxide film is dotted, the oxidation of the corrosion prevention film A piezoelectric vibration device characterized in that the piezoelectric diaphragm is directly electromechanically bonded to the upper surface of the layer using a conductive resin adhesive softer than pencil hardness 4B. Formed is a metal base in which at least two metal lead terminals are embedded through an insulating material, and an excitation electrode mounted on the metal lead terminal and electrically connected via a conductive resin adhesive A method of manufacturing a piezoelectric device comprising: a piezoelectric diaphragm made of; and a metal lid formed by airtightly covering the piezoelectric diaphragm,
Forming a corrosion prevention film on the outer surface of the metal lead terminal and the metal base;
After the acid treatment of the outer surface of the metal lead terminal and the metal base, a step of applying a conductive resin adhesive softer than pencil hardness 4B to the inner side of the metal lead terminal;
Both ends of the piezoelectric diaphragm are mounted on the inner side of the metal lead terminal to which the conductive resin adhesive is applied, and the piezoelectric diaphragm and the inner side of the metal lead terminal are connected via the conductive resin adhesive. A method of manufacturing a piezoelectric vibration device comprising a step of directly joining electromechanically.

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