JP2008218916A - Resin molding device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin molding device which is so constructed that the neighborhood of the periphery and the center of a resin package can be simultaneously released from a mold and the amount of warpage of the resin package can be reduced. <P>SOLUTION: The resin molding device has a lower mold 103 which forms the lower half part of the resin package 101 whose planar shape is rectangular, an upper mold 105 which forms the upper half part of the resin package 101, a mold support mechanism 106 which supports the lower mold 103 and the upper mold 105 so that they may have contacts or may be separated freely, a resin injection mechanism 107 which injects molten resin into a lower cavity 102 and an upper cavity 104, several eject pins 108 and 109 which are arranged on the lower cavity 102, a resin release mechanism 110 which projects and retracts the eject pins 108 and 109 toward and from the lower cavity 102. In this case, four eject pins 108 are arranged near the periphery of the planar shape of the resin package 101 and at least one eject pin 109 is arranged inside the four eject pins. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a resin molding apparatus that molds a resin package of a semiconductor device.

  Conventionally, a semiconductor device encapsulating process is performed by setting a lead frame on which a bonded semiconductor element is mounted in a resin molding apparatus, sandwiching the lead frame with a mold, raising the temperature, and feeding liquefied resin into the cavity. The resin package is molded by molding.

  After molding, the resin package needs to be removed from the encapsulating mold. Therefore, the release of the resin package is performed by lifting the upper mold, and then pushing up the eject pin from the lower mold to lift the resin package and release it from the lower mold. The released resin package is transported to the next process in a state where it is easy to transport (for example, Patent Document 1).

Such a semiconductor element encapsulation method has the advantages of being excellent in mass productivity and being inexpensive, but has disadvantages such as poor moisture resistance, heat resistance and thermal radiation. For this reason, it is necessary to devise the reliability of the semiconductor element itself and to optimize the molding resin material.
JP-A-10-321659

  In view of the above background, in recent years, an encapsulating resin has been developed and the resin to be used has been changed in order to improve the adhesion between the resin and the lead frame and improve the reliability of the resin package. Along with this change of resin, the adhesiveness between the resin and the lead frame is improved, so that the reliability of the resin package is improved, but the adhesiveness between the resin package and the mold is also improved at the same time. Therefore, when the resin package is released from the mold, the resin package is difficult to be separated from the mold, and the resin package is warped. In addition, by trying to force apart, there is a problem that the semiconductor element sealed with the resin inside the resin package is broken.

FIG. 7 is a schematic view showing a conventional resin molding apparatus. FIG. 7A is a schematic plan view of a conventional resin molding apparatus. FIG. 7B is a schematic longitudinal sectional front view of a conventional resin molding apparatus.
In the conventional resin molding apparatus, only four eject pins 508 are individually arranged in the vicinity of the center of the four sides in the planar shape of the resin package 501.

FIG. 8 is also a view showing a lower mold of a conventional resin package. FIG. 8A is a schematic plan view of a conventional resin molding apparatus. FIG. 8B is a schematic longitudinal sectional front view of a conventional resin molding apparatus.
In this conventional resin molding apparatus, only four eject pins 608 are individually arranged in the vicinity of the four corners of the planar shape of the resin package 601.

FIG. 9 is a schematic diagram showing the operation of a conventional resin molding apparatus. Fig.9 (a) is a schematic diagram which shows before the mold release of the resin package and lower metal mold | die in the conventional resin molding apparatus. FIG. 9 (b) is a schematic diagram showing the start of release of the resin package and the lower mold in the conventional resin molding apparatus. FIG.9 (c) is a schematic diagram which shows after the mold release of the resin package and lower mold in the conventional resin molding apparatus.
In the arrangement of the eject pins 708 of the conventional resin molding apparatus, the resin package 701 starts to move away from the lower mold 703 from the outside, and finally the central portion leaves. In addition, since the adhesion between the resin and the mold is high with the number of conventional eject pins 708, an excessive load is applied to the resin package 701 as shown in FIG. The resin package 701 has greatly warped. And when the curvature amount of the resin package 701 became large, the problem which an internal semiconductor element cracked generate | occur | produced.

  According to the present invention, there is provided a resin molding apparatus for molding a resin package of a semiconductor device, wherein a lower mold in which a lower cavity for molding a lower half portion of a resin package having a rectangular planar shape is formed, and a resin package An upper mold in which an upper cavity for molding the upper half is formed, a mold support mechanism that supports the lower mold and the upper mold in a freely detachable manner, and a lower mold and an upper mold. A resin injection mechanism that injects molten resin into the lower cavity and the upper cavity that are integrated by bonding, a plurality of eject pins that are disposed at positions that appear and disappear in the lower cavity of the lower mold, and the eject pins into the lower cavity. And a resin release mechanism that moves up and down, and four eject pins are arranged in the vicinity of the outer periphery of the planar shape of the resin package, and the inside of the four eject pins Resin molding apparatus is provided at least one of the eject pin is disposed.

  In the resin molding apparatus of the present invention, four eject pins are disposed in the vicinity of the outer periphery of the planar shape of the resin package, and at least one eject pin is disposed inside the four eject pins. The eject pin can appear and disappear in the lower cavity of the lower mold. As a result, the vicinity of the outer periphery and the center of the resin package can be simultaneously released from the lower mold and the upper mold that are joined by resin injection, and the amount of warpage of the resin package can be reduced.

  In the present invention, the vertical direction is defined, but this is defined for convenience in order to briefly explain the relative relationship of the components of the present invention. It does not limit the direction of time or use.

  Four eject pins are arranged near the outer periphery of the planar shape of the resin package, and at least one eject pin is arranged inside the four eject pins, so that the vicinity and the center of the outer periphery of the resin package are arranged. Can be released at the same time, and the amount of warpage of the resin package can be reduced. Thereby, it is possible to suppress the influence of the warp on the semiconductor element inside the resin package.

  An embodiment of the present invention will be described below with reference to the drawings. However, the same portions as those of the conventional example described above with respect to the present embodiment are denoted by the same names, and detailed description thereof is omitted.

(First embodiment)
FIG. 1 is a schematic diagram illustrating a resin molding apparatus according to this embodiment.
FIG. 1A is a schematic plan view of the resin molding apparatus of this embodiment. Moreover, FIG.1 (b) is a typical longitudinal cross-sectional front view of the resin molding apparatus of this embodiment.
The resin molding apparatus according to the present embodiment is a resin molding apparatus that molds a resin package 101 of a semiconductor device, and a lower mold in which a lower cavity 102 that molds the lower half of a resin package 101 having a rectangular planar shape is formed. A mold support that supports the mold 103, an upper mold 105 in which an upper cavity 104 for molding the upper half of the resin package 101 is formed, and a lower mold 103 and the upper mold 105 are detachably supported. A mechanism 106; a resin injection mechanism 107 that injects molten resin into the lower cavity 102 and the upper cavity 104 that are integrated by joining the lower mold 103 and the upper mold 105; and a lower cavity 102 of the lower mold 103. A plurality of eject pins 108 and 109 arranged at positions where they appear and disappear, and the eject pins 108 and 109 are connected to the lower cavity 1. 2 and a resin release mechanism 110 that protrudes and retracts in the plane, and four eject pins 108 are disposed in the vicinity of the four corners of the planar shape of the resin package, and one eject pin 108 is provided inside the four eject pins 108. An eject pin 109 is arranged.

  In the present embodiment, four eject pins 108 are individually arranged in the vicinity of the four corners of the planar shape of the resin package 101, and one eject pin 109 is arranged inside the four eject pins 108. Has been. The eject pins 108 and 109 appear and disappear in the lower cavity 102 of the lower mold 103.

  Here, “inside” refers to the inside of the arrangement of the four eject pins 108. That is, the eject pin 109 is positioned inside the four sides of a rectangular area having the eject pin 108 as a vertex.

  The mold support mechanism 106 of the present embodiment supports the lower mold 103 and the upper mold 105 so as to be able to contact and separate. A lower cavity 102 is formed in the lower mold 103. The upper mold has an upper cavity 104 for molding the upper half of the resin package. The lower cavity 102 molds the lower half of the resin package 101. The planar shape of the resin package 101 is a rectangle.

  Further, the resin injection mechanism 107 of the present embodiment injects molten resin into the lower cavity 102 and the upper cavity 104 that are integrated by joining the lower mold 103 and the upper mold 105.

  Further, the resin release mechanism 110 according to the present embodiment causes the five eject pins 108 and 109 to appear and disappear in the lower cavity 102.

The operation of this embodiment will be described below.
FIG. 2 is a schematic view showing an operation at the time of releasing the resin package 101 and the lower mold 103 of the present embodiment.
FIG. 2A is a schematic diagram illustrating the resin package 101 and the lower mold 103 before release of the present embodiment, and FIG. 2B illustrates the resin package 101 and the lower mold 103 of the present embodiment. FIG. 2C is a schematic diagram showing the state after the release of the resin package 101 and the lower mold 103 according to the present embodiment.
After the bonding is completed, the lead frame on which the semiconductor element is mounted is set in the lower cavity 102. The lower mold 103 and the upper mold 105 are joined by the mold support mechanism 106, and the lower cavity 102 and the upper cavity 104 are integrated. The resin liquefied from the resin injection mechanism 107 is pumped and poured into the integrated lower cavity 102 and upper cavity 104. By applying a specific pressure and time, the resin is cured. Thereafter, the resin release mechanism 110 pushes up the eject pins 108 and 109 to release the end and the center of the resin package 101 from the lower mold 103 simultaneously.

The operations of the eject pin 108 and the eject pin 109 can be performed independently.
For example, it is possible to shift the operation timing between the eject pin 108 and the eject pin 109 or to make a difference in the push-up speed.

  Below, the effect of this embodiment is shown.

In the present embodiment, there are five eject pins, and the four eject pins 108 are arranged in the vicinity of the four corners of the planar shape of the resin package 101. In addition, one eject pin 109 is disposed inside the four eject pins 108.
Thereby, the mold release at the end and the center of the resin package 101 can be started at the same time (FIG. 2B). Moreover, the edge and center part of the resin package 101 can be simultaneously released from the lower mold 103 (FIG. 2C). Therefore, warping of the resin package 101 can be suppressed, and the molded resin package 101 can be separated from the lower mold 103 without any problem.

Since the conventional resin has low adhesion, the entire package can be released even if the ejecting amount of the eject pin is small. Therefore, the amount of warping given to the resin package was small. However, if the adhesive strength of the resin is high, a large amount of ejection of the eject pin is required, and the amount of warpage applied to the resin package increases.
According to the present embodiment, the number of eject pins that have been conventionally four is increased to five, and the eject pins are pushed up and distributed evenly with respect to the resin package. Thereby, the curvature amount given to a resin package can be decreased.

When the resin package is released from the lower mold, the part close to the eject pin starts to be released immediately, but the part far from the eject pin remains in close contact with the mold.
Since the conventional eject pin is disposed only at a position corresponding to the outer periphery of the resin package, the central portion of the resin package is in close contact with the lower mold. Therefore, the amount of warping applied to the resin package increases.
On the other hand, according to the present embodiment, in the case of the conventional resin molding apparatus, the ejector pins are added to the positions corresponding to the part (resin package central part) where the resin package is finally separated from the lower mold to obtain five. Thus, the end and the center of the resin package can be simultaneously released from the lower mold. As a result, the amount of warping applied to the resin package can be reduced as compared with the conventional case, and the problem that the semiconductor element inside the resin package breaks can be solved.

  The eject pin added to the conventional resin molding apparatus is the center of the back surface of the resin package. Usually, the dimensions of the resin package are the overall length, the full width, the thickness, the lead-related dimensions, and the like, and the recess at the center of the back surface of the package does not affect the external dimensions of the resin package.

  In the resin package, all the eject pin marks are concave. If it protrudes from the resin package surface, it interferes when the resin package is mounted, and each lead does not reach the mounting substrate. Since the eject pin to be added is on the back side of the package, it cannot be seen from the table when mounted. Therefore, the appearance after mounting the resin package is the same as the conventional one.

  In the conventional technology, there is a concern that a thin resin package or the like cannot secure the resin package thickness of the eject pin portion, and the internal wire is exposed. At present, efforts are being made to lower the wire height and the problems are decreasing. Therefore, it is not necessary to consider such a problem even if the eject pin is increased.

  Conventionally, regarding the eject pin position, it has not been specified how many or how many eject pins are used. According to this embodiment, the productivity of the resin package can be improved by specifying the number and position. Also, workability can be the same as in the prior art.

Further, by reducing the amount of package warpage in the enclosing process, it is possible to suppress cracks in the internal semiconductor elements and improve productivity.
In addition, since the resin package that has warped damage to the semiconductor element is weakened by warping, there is a possibility of causing a problem after passing to the end user. Can be reduced.

In addition, the four eject pins near the four corners in the planar shape of the resin package and the one eject pin arranged inside the four eject pins can be operated independently.
Thereby, the adjustment which suppresses generation | occurrence | production of curvature suitably to the minimum according to the shape of various kinds of resin and resin package can be performed.

(Second Embodiment)
FIG. 3 is a schematic diagram for explaining the resin molding apparatus of the present embodiment.
FIG. 3A is a schematic plan view of the resin molding apparatus of this embodiment. FIG. 3B is a schematic longitudinal sectional front view of the resin molding apparatus of the present embodiment.
The resin molding apparatus according to the present embodiment is a resin molding apparatus that molds a resin package 301 of a semiconductor device, and includes a lower metal having a lower cavity 302 that molds the lower half of a resin package 301 having a rectangular planar shape. A mold support that supports a mold 303, an upper mold 305 in which an upper cavity 304 for molding the upper half of the resin package 301 is formed, and a lower mold 303 and an upper mold 305 that are detachably supported. A mechanism 306, a resin injection mechanism 307 that injects molten resin into the lower cavity 302 and the upper cavity 304 integrated by joining the lower mold 303 and the upper mold 305, and the lower cavity 302 of the lower mold 303 A plurality of eject pins 308 and 309 arranged at positions where they appear and disappear, and the eject pins 308 and 309 are connected to the lower cavity 3. 2 and a resin release mechanism 310 that protrudes and retracts to and from the center of the four sides in the planar shape of the resin package, and four eject pins 308 are arranged inside the four eject pins 308. Eject pin 309 is arranged

  In the present embodiment, four eject pins 308 are individually arranged in the vicinity of the center of the four sides of the planar shape of the resin package 301, and one eject pin 309 is disposed inside the four eject pins 308. Is arranged. The eject pins 308 and 309 can freely move in and out of the lower cavity 302 of the lower mold 303.

  Here, “inside” refers to the inside of the arrangement of the four eject pins 308. That is, the eject pin 309 is located inside the four sides of the rectangular area having the eject pin 308 as a vertex.

  The mold support mechanism 306 of the present embodiment supports the lower mold 303 and the upper mold 305 so as to be able to contact and separate. A lower cavity 302 is formed in the lower mold 303. The upper mold 305 has an upper cavity 304 for molding the upper half of the resin package 301. The lower cavity 302 molds the lower half of the resin package 301. The planar shape of the resin package 301 is a rectangle.

  Further, the resin injection mechanism 307 of the present embodiment injects molten resin into the lower cavity 302 and the upper cavity 304 that are integrated by joining the lower mold 303 and the upper mold 305.

  Further, the resin release mechanism 310 causes the five eject pins 308 and 309 to appear and disappear in the lower cavity 302.

The operation of this embodiment will be described below.
FIG. 4 is a schematic view showing an operation at the time of releasing the resin package 301 and the lower mold 303 of this embodiment.
FIG. 4A is a schematic diagram showing the resin package 301 and the lower mold 303 before release of the present embodiment, and FIG. 4B shows the resin package 301 and the lower mold 303 of the present embodiment. FIG. 4C is a schematic diagram showing the state after the release of the resin package 301 and the lower mold 303 according to the present embodiment.
After the bonding is completed, the lead frame on which the semiconductor element is mounted is set in the lower cavity 302. The lower mold 303 and the upper mold 305 are joined by the mold support mechanism 306, and the lower cavity 302 and the upper cavity 304 are integrated. The resin liquefied from the resin injection mechanism 307 is pumped and poured into the integrated lower cavity 302 and upper cavity 304. By applying a specific pressure and time, the resin is cured. Thereafter, the resin release mechanism 310 pushes up the eject pins 308 and 309 to release the end and the center of the resin package 301 from the lower mold 303 simultaneously.

The operations of the eject pin 308 and the eject pin 309 can be performed independently.
For example, the timing of operation can be shifted between the eject pin 308 and the eject pin 309, or the push-up speed can be made different.

The present invention is not limited to the present embodiment, and various modifications are allowed without departing from the scope of the present invention. Furthermore, as a matter of course, the above-described embodiment and a plurality of modifications can be combined within a range in which the contents do not conflict with each other.
For example, the resin molding apparatus described in the embodiment has a structure that reduces the amount of warping of the package at the time of mold release by adding an eject pin to the center of the package. However, depending on the size of the package, the resin molding apparatus is added to the center of the package. The eject pin may be thickened. Thereby, it is possible to further reduce the amount of warping applied to the package.

  Further, in the present embodiment, a resin molding apparatus in which four eject pins are arranged near the outer periphery of the planar shape of the resin package and one eject pin is arranged inside the four eject pins. Although shown, the number of eject pins on the inside is not limited to one, and a plurality of eject pins can be provided. The inner eject pins can be located inside the four sides of the rectangular area having the four eject pins near the outer periphery as vertices, or can be located on the four sides of the rectangular area. The modification is shown below.

FIG. 5 is a schematic plan view of a resin molding apparatus that is a modification of the first embodiment.
5A and 5B show that four eject pins 108 are arranged in the vicinity of the four corners of the planar shape of the resin package, and that four eject pins 109 are inside the four eject pins 108. FIG. Has been placed. 5C and 5D show that four eject pins 108 are arranged in the vicinity of the four corners of the planar shape of the resin package, and five eject pins 109 are arranged inside the four eject pins 108. FIG. Has been placed.

FIG. 6 is a schematic plan view of a resin molding apparatus that is a modification of the second embodiment.
In FIG. 6A, four eject pins 308 are arranged near the center of the four sides of the planar shape of the resin package, and four eject pins 309 are arranged inside the four eject pins 308. ing. In FIG. 5B, four eject pins 308 are arranged near the four corners of the planar shape of the resin package, and five eject pins 309 are arranged inside the four eject pins 308. .

(A) It is a typical top view of the resin molding apparatus of 1st Embodiment. (B) It is a typical vertical front view of the resin molding apparatus of 1st Embodiment. (a) It is a schematic diagram which shows before the mold release of the resin package of 1st Embodiment, and a lower mold. (b) It is a schematic diagram which shows the time of mold release start of the resin package of 1st Embodiment, and a lower mold. (c) It is a schematic diagram which shows after the mold release of the resin package of 1st Embodiment, and a lower mold. (A) It is a typical top view of the resin molding apparatus of 2nd Embodiment. (B) It is a typical vertical front view of the resin molding apparatus of 2nd Embodiment. (a) It is a schematic diagram which shows before the mold release of the resin package and lower metal mold | die of 2nd Embodiment. (b) It is a schematic diagram which shows the time of the mold release start of the resin package and lower metal mold | die of 2nd Embodiment. (A) It is a typical top view of the resin molding apparatus which is a modification of 1st Embodiment. (B) It is a typical top view of the resin molding apparatus which is a modification of 1st Embodiment. (c) It is a typical top view of the resin molding apparatus which is a modification of 1st Embodiment. (D) It is a typical top view of the resin molding apparatus which is a modification of 1st Embodiment. (A) It is a typical top view of the resin molding apparatus which is a modification of 2nd Embodiment. (B) It is a typical top view of the resin molding apparatus which is a modification of 2nd Embodiment. (A) It is a typical top view of the conventional resin molding apparatus. (B) It is a typical longitudinal front view of the conventional resin molding apparatus. (A) It is a typical top view of the conventional resin molding apparatus. (B) It is a typical longitudinal front view of the conventional resin molding apparatus. (a) It is a schematic diagram which shows before the mold release of the resin package and lower mold in the conventional resin molding apparatus. (b) It is a schematic diagram which shows the time of the mold release start of the resin package and lower mold in the conventional resin molding apparatus. (c) It is a schematic diagram which shows after the mold release of the resin package and lower metal mold | die in the conventional resin molding apparatus.

Explanation of symbols

101 Resin Package 102 Lower Cavity 103 Lower Mold 104 Upper Cavity 105 Upper Mold 106 Mold Support Mechanism 107 Resin Injection Mechanism 108 Eject Pin 109 Eject Pin 110 Resin Release Mechanism 301 Resin Package 302 Lower Cavity 303 Lower Mold 304 Upper Cavity 305 Upper mold 306 Mold support mechanism 307 Resin injection mechanism 308 Eject pin 309 Eject pin 310 Resin mold release mechanism 501 Resin package 502 Lower cavity 503 Lower mold 504 Upper cavity 505 Upper mold 506 Mold support mechanism 507 Resin injection mechanism 508 Eject pin 510 Resin release mechanism 601 Resin package 602 Lower cavity 603 Lower mold 604 Upper cavity 605 Upper mold 606 Mold support mechanism 607 Resin Input mechanism 608 eject pin 610 resin releasing mechanism 701 resin package 702 lower cavity 703 lower mold 708 eject pin

Claims (5)

A resin molding apparatus for molding a resin package of a semiconductor device,
A lower mold in which a lower cavity for molding the lower half of the resin package having a rectangular planar shape is formed;
An upper mold in which an upper cavity for molding the upper half of the resin package is formed;
A mold support mechanism for supporting the lower mold and the upper mold in a freely detachable manner;
A resin injection mechanism for injecting molten resin into the lower cavity and the upper cavity integrated by joining the lower mold and the upper mold;
A plurality of eject pins arranged at positions in and out of the lower cavity of the lower mold;
A resin release mechanism that causes the eject pin to appear and disappear in the lower cavity,
A resin molding apparatus in which four eject pins are arranged in the vicinity of the outer periphery of the resin package in a planar shape, and at least one eject pin is arranged inside the four eject pins.   4. The four eject pins are individually arranged in the vicinity of four corners of the planar shape of the resin package, and at least one eject pin is arranged inside the four eject pins. 1. The resin molding apparatus according to 1.   The four eject pins are individually arranged in the vicinity of the center of the four sides of the planar shape of the resin package, and at least one eject pin is arranged inside the four eject pins. The resin molding apparatus according to claim 1.   The one eject pin provided at the center of the planar shape of the resin package is thicker than the four eject pins arranged evenly in the vicinity of the outer periphery of the planar shape of the resin package. Item 4. The resin molding apparatus according to Item 1.   5. The resin molding apparatus according to claim 1, wherein the four eject pins and at least one eject pin arranged inside the four eject pins operate independently of each other. 6.

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