JP2008218837A5 - - Google Patents

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Publication number
JP2008218837A5
JP2008218837A5 JP2007056350A JP2007056350A JP2008218837A5 JP 2008218837 A5 JP2008218837 A5 JP 2008218837A5 JP 2007056350 A JP2007056350 A JP 2007056350A JP 2007056350 A JP2007056350 A JP 2007056350A JP 2008218837 A5 JP2008218837 A5 JP 2008218837A5
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JP
Japan
Prior art keywords
pad
solder
package
guide portion
package according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2007056350A
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English (en)
Japanese (ja)
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JP2008218837A (ja
JP4905968B2 (ja
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Priority to JP2007056350A priority Critical patent/JP4905968B2/ja
Priority claimed from JP2007056350A external-priority patent/JP4905968B2/ja
Publication of JP2008218837A publication Critical patent/JP2008218837A/ja
Publication of JP2008218837A5 publication Critical patent/JP2008218837A5/ja
Application granted granted Critical
Publication of JP4905968B2 publication Critical patent/JP4905968B2/ja
Active legal-status Critical Current
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JP2007056350A 2007-03-06 2007-03-06 パッケージ Active JP4905968B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007056350A JP4905968B2 (ja) 2007-03-06 2007-03-06 パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007056350A JP4905968B2 (ja) 2007-03-06 2007-03-06 パッケージ

Publications (3)

Publication Number Publication Date
JP2008218837A JP2008218837A (ja) 2008-09-18
JP2008218837A5 true JP2008218837A5 (zh) 2010-03-04
JP4905968B2 JP4905968B2 (ja) 2012-03-28

Family

ID=39838501

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007056350A Active JP4905968B2 (ja) 2007-03-06 2007-03-06 パッケージ

Country Status (1)

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JP (1) JP4905968B2 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5398689B2 (ja) * 2010-02-22 2014-01-29 日本電波工業株式会社 圧電デバイス及びその製造方法
TWI570854B (zh) * 2015-08-10 2017-02-11 頎邦科技股份有限公司 具中空腔室之半導體封裝結構及其下基板及製程
JP7257472B2 (ja) * 2020-10-29 2023-04-13 みずほリサーチ＆テクノロジーズ株式会社 設計支援システム、設計支援方法及び設計支援プログラム

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0224552A (ja) * 1988-07-12 1990-01-26 Kikuo Oikawa 二酸化塩素の定量法
JP3415192B2 (ja) * 1993-04-19 2003-06-09 日本特殊陶業株式会社 シールリング用ロー材及びこれを用いた半導体素子用パッケージの製造方法並びに半導体素子用パッケージ
US6218730B1 (en) * 1999-01-06 2001-04-17 International Business Machines Corporation Apparatus for controlling thermal interface gap distance
JP2005340444A (ja) * 2004-05-26 2005-12-08 Kyocera Corp 電子部品収納用パッケージ
JP4761441B2 (ja) * 2005-08-08 2011-08-31 株式会社住友金属エレクトロデバイス 電子部品収納用セラミックパッケージ

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