JP2008205225A - Guide rail, electronic equipment, and method for manufacturing electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a guide rail which improves the cooling effects, using a simple constitution. <P>SOLUTION: In the guide rail having a substantially U-shaped support for supporting a printed board on which electronic components are arranged, and a base for mounting it to a cabinet of electronic equipment, by having a through hole along the axial direction formed in the base, by the flowing of air via this through hole, the guide rail is readily cooled, and the heat transmitted from the printed board to the support can be radiated efficiently. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a guide rail for holding a printed board on which electronic components are mounted, an electronic device using the guide rail, and a method for manufacturing the electronic device.

  As an example of a conventional electronic device that cools a printed board by this type of indirect method, a method of welding or bonding to a housing with a flow passage for passing a cooling medium such as air as a honeycomb structure is adopted. It was. This example will be described with reference to FIG.

  An electronic device 301 can support a plurality of printed boards. Reference numeral 302 denotes a printed board on which a plurality of electronic components are mounted. Reference numeral 303 denotes a retainer for the printed board 302. Reference numeral 304 denotes an air inlet, from which air for cooling the printed board 302 is sucked. Reference numeral 305 denotes an exhaust path. Air that has cooled the printed board 302 is exhausted from the exhaust path. A cover 306 is detachably attached to the housing with screws or the like.

  Reference numeral 307 denotes a guide rail, which is formed to face both side plates. The printed board 302 described above is inserted between the guide rail 307 and the guide rail 307 and attached.

  To the exhaust port (not shown) of the intake port 304 and the exhaust passage 305, a honeycomb structure is attached by welding or bonding to enhance the cooling effect by heat radiation.

  Japanese Patent Laid-Open No. 9-51185 also discloses an electronic device for mounting a printed board between guide rails arranged on the upper and lower surfaces of a casing through which cooling air flows.

JP-A-9-51185

  However, the electronic device shown in FIG. 3 requires a special technique such as welding or adhesion for the manufacture of the casing, and there is a problem in that the number of contractors that can be manufactured is limited. Naturally, the price of the casing was expensive, and the manufacturing days were about three times that of sheet metal work alone. In particular, the length of the manufacturing days greatly affects the design period and has a drawback of hindering freedom of design change. Further, the device shown in FIG. 3 does not devise a guide rail to enhance the cooling effect or provide an electronic device that is easy to manufacture.

  Further, the one described in Japanese Patent Application Laid-Open No. 9-51185 relates to a structure for plugging the printed board into the back panel, and devised the structure of the guide rail that supports the printed board to provide a cooling effect. It was not intended to enhance or make it easier to manufacture.

  The present invention is to solve the above-described problems, and provides a guide rail, an electronic device, and a method for manufacturing the electronic device, which have a simple structure and enhanced a cooling effect.

  According to a first aspect of the present invention, there is provided a guide rail having a substantially U-shaped support portion for supporting a printed board on which electronic components are arranged, and a base portion for mounting on a casing of an electronic device. A through hole is formed along the axial direction of the base.

  According to a second aspect of the present invention, a guide rail having a substantially U-shaped support portion is disposed facing the inside of the housing, and an electron is provided between the support portion of the guide rail and the support portion. In an electronic device that supports a printed board on which components are arranged, a through hole is formed in the guide rail along the axial direction.

  In the invention according to claim 3 of the present invention, a guide rail having a substantially U-shaped support portion is disposed facing the inside of the housing, and an electron is provided between the support portion of the guide rail and the support portion. In the electronic device configured to support the printed board on which the components are arranged and to allow cooling air to flow along the extending direction of the guide rail and the printed board, the guide rail has a through hole along the axial direction. Formed.

  According to a fourth aspect of the present invention, the guide rail is made of metal.

  According to a fifth aspect of the present invention, there is provided a guide rail having a substantially U-shaped support portion for supporting a printed board on which electronic components are arranged, and a base portion for attachment to the housing. In a method for manufacturing an electronic device mounted in a housing, a guide rail provided with a through hole in the axial direction of the base is cut to a length corresponding to the printed board to support the guide rail, and the cut guide rail is cut into the housing. It is arranged inside and is screwed from the outside of the housing.

  Furthermore, an invention according to claim 6 of the present invention is a guide rail having a substantially U-shaped support portion for supporting a printed board on which electronic components are arranged, and a base portion for mounting on the case. In the method of manufacturing an electronic device mounted in a housing, the guide rail is formed longer than the length of the printed board to be supported by extrusion so as to have a shape having a through hole in its axial direction. The guide rail is cut to a length corresponding to the printed board supported, the cut guide rail is disposed inside the housing, and is screwed from the outside of the housing.

  According to the present invention, the following effects can be obtained.

  According to the guide rail and the electronic device of the present invention, the heat transmitted from the supported printed board can be efficiently radiated by the cooling air flowing through the through hole in the base portion of the guide rail.

  In addition, in an electronic device configured so that cooling air flows along the direction in which the guide rail or the printed board extends, the cooling air can be naturally circulated in the through hole, so that the heat dissipation effect is further improved. Can be increased.

  Furthermore, when the guide rail is made of metal, it is easy to conduct heat from the printed board to the guide rail, and a further cooling effect can be expected.

  According to the electronic device manufacturing method of the present invention, the guide rail provided with the through hole in the axial direction of the base is cut to a length corresponding to the printed board to be supported, and the cut guide rail is cut into the casing. Since it is placed inside and screwed from the outside of the housing, it does not require special technology or materials for manufacturing, its guide rail is easy to cut, and it is screwed for screwing from the outside of the housing Easy and simple to manufacture.

  An embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 is a perspective view showing an exploded state of the electronic device of the present invention. 1 is an electronic apparatus 101. Although only one sheet is supported in FIG. 1, a plurality of printed boards 110 can be supported and stored. Reference numeral 102 denotes a side cover, and the side cover 102 includes a top cover 103, a detachable cover 104, a bottom cover 105, and side covers 106 and 107. Although not shown, the detachable cover 104 is formed with a suction port through which air is sucked, and the upper cover 103 shown in FIG. 1 is partially cut away.

  Reference numeral 108 denotes a guide rail, which is made of a metal material, and is fixed by screws 109 from the outside of the casing so as to face each other inside the casing.

  Reference numeral 111 denotes a partition plate, which is not shown, and has an air circulation port. This distribution port is a distribution port through which air that flows along the front and back surfaces of the printed board flows, or a distribution port through which air flows through a through hole (described later) when the guide rail 108 is attached. .

  Further, a fan (not shown) is arranged between the partition plate 111 and the side cover 107, and an air flow is generated by the operation of the fan, and the printed board 110 is cooled. Reference numeral 112 denotes an exhaust port formed in the side cover 107, and 113 denotes an exhaust path attached to the side cover 107. Air that has cooled the printed board 110 is exhausted from the exhaust path 113.

  FIG. 2 is a perspective view showing a guide rail of the electronic device. The guide rail 108 has the same cross-sectional shape and is formed to extend in the axial direction. The guide rail 108 is formed with a substantially U-shaped support portion 201 for supporting the printed board 110 and a base portion 202 for attachment to the housing. Further, a through hole 203 is formed in the base portion 202 along the axial direction thereof. When the electronic device 101 is used, cooling air flows into the through hole 203 to cool the guide rail 108, and the guide rail 108 cools to cool the supporting printed board 110. It is.

  The dimension X is set to a length necessary to support the end of the printed board 110 to be attached, and the dimension Y is a length considering the dimensions of the printed board 110 and the retainer of the printed board. Is set.

  The through hole 203 is considered to be a round hole in consideration of machine workability, but is not limited to the shape. For example, in order to improve the heat dissipation, that is, in order to improve the heat exchange performance with the circulating air, a groove may be formed, or the shape of the hole may be a square.

  A manufacturing method of the housing of the electronic device configured as described above will be described.

  It is assumed that the covers 102, 105, 106, 107, the partition plate 111, the exhaust fan (not shown), and the exhaust passage 113 are already attached, and manufacturing from this state will be described. Next, the guide rail 108 is attached to the housing in the middle of the assembly, and the detachable cover 104 and the upper cover 103 are attached. The guide rail 108 is formed of a metal rod-like shape, and a support portion 201, a base portion 202, and a through hole 203 are formed by machining. Moreover, the length is set according to the length of the printed board 110 to support.

  And this guide rail 108 is attached to the predetermined position in a housing | casing so that the support part 201 may oppose. This attachment is performed by screws 109 from the outside of the casing. At that time, screwing may be facilitated by forming screw holes in the side covers 102 and 106 of the housing and the base 202 of the guide rail 108 in advance.

  Then, when the required number of guide rails 108 are mounted inside, the mounting of the guide rails 108 is finished. At this time, if the printed board to be attached is prepared, it is attached between the guide rails 108, and if the printed board to be attached is not yet prepared or has not been determined, the covers 103 and 104 are installed. Move on to installation.

  When the printed board 110 to be attached is ready, the printed board 110 is attached, and both sides of the printed board 110 are inserted into the support portion 201 of the guide rail 108 and slid to a predetermined position.

  Finally, the detachable cover 104 and the upper cover 103 are attached to the predetermined positions with screws. This completes the manufacture of the electronic device.

  According to the electronic device 101 manufactured by such a method, the guide rail 108 in which the through hole 203 is formed in the axial direction of the base portion 202 is disposed inside the housing and screwed from the outside of the housing. On the other hand, special techniques such as welding and adhesion are not required, and the manufacturing can be simplified.

  Further, when the guide rail 108 of the present invention is used, as described in the background art section, there is no need for technology, parts, and labor for attaching a separate part that exchanges heat with air at the intake and exhaust ports. The price of manufacturing the product can be reduced, and the material cost of the product itself can be reduced. In addition, since the manufacturing period can be shortened as compared with the conventional method, the influence on the manufacturing delivery time can be reduced.

  In this embodiment, the example using the guide rail 108 in which the through hole 203 is formed by machining has been described. However, a method of manufacturing the guide rail 108 by extrusion molding is also conceivable.

  In this case, the guide rail 108 is formed with the support portion 201, the base portion 202, and the through hole 203 at the same time by extrusion molding. At the time of the extrusion molding, the guide rail 108 is formed to have a considerably longer dimension than a necessary length. And according to the dimension of the printed board to mount, it is cut | disconnected and processed into the guide rail 108 of required length.

  As described above, if the guide rail 108 having a length to be used is cut according to the depth dimension of the printed board 110, the electronic device 101 for mounting the guide rail 108 formed in such a manner on the housing is also provided. In this case, there is an advantage that the same guide rail 108 can be used for the printed board 110 having different depth dimensions and for the printed board 110 having different widths.

  In the electronic device 101 configured as described above, since a large number of electronic components are mounted on the printed board 110, the overall heat generation amount is increased even if the individual heat generation amount is small. Therefore, the printed board 110 is cooled by operating a cooling fan and circulating air. The circulating air may flow along the surface or the back surface of the printed board 110, but may flow through the through-hole 203 formed in parallel with the flow. The printed board 110 is supported by a metal guide rail 108, and heat of the printed board 110 is easily transferred to the guide rail 108 by conduction. Therefore, the heat of the printed board 110 is also radiated from the guide rail 108. As a result, the printed board 110 is also cooled.

  As described above, according to the guide rail 108 according to the present invention and the electronic device 101 using the guide rail 108, the guide rail 108 is arranged in the direction along the air flow, and the base 202 of the guide rail 108 is arranged. In addition, the through hole 203 is formed, and the air passage formed by the through hole 203 becomes a flow parallel to the air flow flowing along the front surface and the back surface of the printed board 110, so that the air easily flows. ing. For this reason, when the electronic device 101 is used, air easily flows into the through-hole 203 of the guide rail 108 and the guide rail 108 is also easily cooled. Accordingly, the printed board 110 also promotes heat dissipation due to heat conduction. It becomes easy to be cooled.

It is a disassembled perspective view which shows the state which notched some electronic apparatuses of this invention. It is a perspective view which shows the guide rail of the same electronic device. It is a disassembled perspective view which shows the state which notched some conventional electronic devices.

Explanation of symbols

DESCRIPTION OF SYMBOLS 101 Electronic device 102 Side cover 103 Top cover 104 Detachable cover 105 Bottom cover 106 Side cover 107 Side cover 108 Guide rail 109 Screw 110 Print board 111 Partition plate 112 Exhaust port 113 Exhaust path 201 Support part 202 Base 203 Through hole X dimension Y dimension

Claims (6)

In a guide rail having a substantially U-shaped support portion for supporting a printed board on which electronic components are arranged and a base portion for mounting on a housing of an electronic device, a through hole along the axial direction of the base portion is formed. A guide rail that is formed. In an electronic device in which a guide rail having a substantially U-shaped support portion is arranged facing the inside of the housing, and the printed board on which electronic components are arranged is supported between the support portion of the guide rail and the support portion. An electronic device characterized in that a through hole is formed in the guide rail along the axial direction. A guide rail having a substantially U-shaped support portion is arranged facing the inside of the housing, and the printed board on which the electronic component is placed is supported between the support portion of the guide rail and the support rail. An electronic apparatus configured to allow cooling air to flow along a direction in which a guide rail or a printed board extends, wherein the guide rail has a through hole formed in an axial direction. The guide rail according to claim 1, or the electronic device according to claim 2, wherein the guide rail is made of metal. In a method for manufacturing an electronic device, wherein a guide rail having a substantially U-shaped support portion for supporting a printed board on which electronic components are arranged and a base portion for attachment to the case is attached in the case. The guide rail provided with a through hole in the axial direction of the base was cut to a length corresponding to the printed board to be supported, the cut guide rail was placed inside the housing, and screwed from the outside of the housing A method for manufacturing an electronic device. In a method for manufacturing an electronic device in which a guide rail having a substantially U-shaped support part for supporting a printed board on which electronic components are arranged and a base part for attachment to the case is attached in the case. The guide rail is formed longer than the length of the lint plate to be supported by extrusion so as to have a shape having a through hole in its axial direction, and is cut to a required length from the longer guide rail, A method for manufacturing an electronic device, characterized in that a cut guide rail is arranged inside a housing and screwed from the outside of the housing.

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