JP2008190893A - Electronic component inspection system, electronic component inspection system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component inspection device capable of inspecting the output in a very short time while keeping the electronic components in the pressurized vessel in the state of the prescribed pressure and prescribed temperature. <P>SOLUTION: The electronic components A are accommodated in the pressurized vessel and hermetically sealed for inspecting the outputs of output terminals of the electronic components. The pressurized vessels are composed of upper movable vessel 11 and a lower vessel 12 fixed under the upper moveable vessel 11. The upper moveable vessel 11 is raised from the position closely being in contact with the lower vessel 12 by the elevation means. Moreover, the pressurizing means is provided for securing the sealing of the lower opening by pressing the upper moveable vessel 11 in the state where the vessel 11 is mounted on the lower vessel 12. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component inspection apparatus suitable for inspecting whether or not an electronic component functions normally under various temperature and atmospheric pressure environments.

  A technique for molding a pressure sensor having a wireless communication function on a tire has been realized (see, for example, Patent Documents 1, 2, and 3). According to this technique, it becomes possible to always manage the temperature and air pressure of the tire, and the safety during driving can be improved. Further, for example, a technique disclosed in Patent Document 4 has been proposed as an inspection apparatus for inspecting temperature characteristics when manufacturing the pressure sensor.

  In the manufacturing process of electronic component elements such as semiconductor devices, the temperature dependency inspection of electrical characteristics is one of the important items. Therefore, an apparatus for measuring the electrical characteristics of a measurement target element by adjusting the temperature of the measurement target element, which is a product to be inspected, to a low temperature or a high temperature is well known. This type of electrical characteristic measuring apparatus is proposed in Patent Document 5 as an example. This device is a low-temperature handler device using an electronic cooler in which an IC to be measured is set in the vicinity of a cooling unit in which a Peltier thermoelectric element is embedded, and an air curtain prevents condensation during cooling.

Since a pressure sensor molded on a tire, which is one of electronic components, operates throughout the seasons, it is necessary to always exhibit a normal sensor function at any of room temperature, high temperature, and below freezing temperature. For this reason, in the manufacturing process of the atmospheric pressure sensor, it is necessary to inspect whether or not it functions normally at normal temperature, high temperature, and below freezing temperature. 2. Description of the Related Art A conventional electronic component inspection apparatus used for an atmospheric pressure sensor or the like arranges a plurality of temperature sensors on a printed circuit board for inspection and accommodates them in a pressure vessel having a very thick wall with heat and pressure resistance. Secure the inside of the pressure vessel in a state where the data extraction line extending from the substrate is pulled out of the pressure vessel, and heat or cool the pressure vessel itself and the gas in the pressure vessel using, for example, a heating and cooling device such as a constant temperature bath Thus, the electronic components in the pressure vessel are kept at the inspection temperature via this gas, and high pressure air is supplied into the pressure vessel to change the pressure, thereby inspecting the output of the output terminal of each sensor.
Japanese Patent Laid-Open No. 2005-212514 JP 2004-205476 A JP 2004-163134 A Japanese Patent Laid-Open No. 10-002825 JP-A-61-68568

  However, the conventional electronic component inspection apparatus warms the gas in the pressure vessel and controls the temperature of the atmospheric pressure sensor using this gas as a heat conduction medium. Therefore, it takes a long time to equilibrate the atmospheric pressure sensor to the inspection temperature, and the mass productivity is low. There was a problem. Further, since the data extraction line extending from the printed circuit board is pulled out of the pressure vessel and closed, automatic sealing is difficult and it is difficult to automate.

  Furthermore, since the space in the pressure vessel becomes large, if the entire gas is heated to a high temperature or a low temperature, the atmospheric pressure tends to become unstable due to thermal expansion or contraction of the gas, and it is difficult to perform accurate measurement in a short time. Similarly, when the internal pressure of the pressure vessel is changed, the temperature of the gas in the pressure vessel changes, so that there is a problem that the temperature tends to become unstable and it takes time to equilibrate the temperature.

  The present invention has been made in view of such a problem. The pressure vessel can be formed in a small size with a high pressure resistance and a high hermetic state, and electronic parts such as an atmospheric pressure sensor can be easily carried in and out of the pressure vessel in a short time. The electronic components housed in the pressure vessel can be kept at the inspection temperature in a short time by heat conduction, and the pressure inside the pressure vessel is boosted, and the sensor output accurately corresponds to this boosting. It is an object of the present invention to provide an electronic component inspection apparatus capable of performing an inspection for a failure in a short time.

  In order to achieve such an object, the invention described in claim 1 is to store an electronic component in a pressure vessel and hermetically seal it, maintain a predetermined inspection temperature, and supply a high-pressure gas into the pressure vessel to obtain a predetermined pressure. In an electronic component inspection apparatus that inspects an electronic component by inspecting an output of an output terminal of the electronic component, the pressure vessel is fixed to an upper movable container and a lower side of the upper movable container. A lower container that seals the lower end opening of the upper movable container when lowered, and a container guiding means that guides the upper movable container in a vertically movable manner, and a position in which the upper movable container is in close contact with the lower container. A container raising / lowering means for raising, and a pressurizing means for pressurizing the upper movable container after the upper movable container is placed on the lower container to ensure sealing of the lower end opening. .

  According to the first aspect of the present invention, when inspecting an electronic component such as an atmospheric pressure sensor, the upper and lower movable containers are moved up by operating the container elevating means to ensure a gap between the upper movable container and the lower container. Then, it can be carried into the gap through the electronic component and placed on the heat conduction means provided in the lower container. After that, the container lifting / lowering means is operated to lower the upper movable container so as to be in close contact with the lower container.

  Further, on the pressurizing means side, the upper movable container is pressurized to ensure sealing between the lower container and the upper movable container. When the inspection environment for electronic components is ready, high pressure air is supplied into the pressure vessel to increase the pressure, and the output characteristics of the electronic components in a predetermined pressure environment can be inspected. The inspection device may increase / decrease pressure in the pressure vessel, detect a change in the output of the output terminal of the electronic component, collect the data and store it in a memory, or increase the pressure to a constant pressure. In this state, it is of course possible to inspect the output data by changing other parameters (temperature, humidity, atmosphere medium).

  In the first aspect of the invention, it is desirable that the upper movable container is an inverted pan shape. In this way, since the gap between the upper movable container and the lower container only needs to be increased by a minute dimension necessary for insertion / removal of electronic components, the ascending / descending time of the upper movable container can be shortened.

  According to a second aspect of the present invention, in the above invention, the electronic component is installed on a peripheral wall of the pressure vessel and is in direct contact with the electronic component or indirectly through a carrier of the electronic component, thereby bringing the electronic component into an inspection temperature. The heat conduction means is provided in close contact with the heat conduction plate disposed so as to close the opening provided in the pressure vessel and the back surface of the heat conduction plate. And a heat transfer element for applying heat or cold to the heat conducting plate.

  Thus, the temperature of the electronic component housed in the pressure vessel is controlled by the heat transfer element until it reaches the inspection temperature. On the other hand, on the pressurizing means side, the upper movable container is pressurized to ensure sealing between the lower container and the upper movable container. When the electronic component reaches the inspection temperature, high pressure air is supplied into the pressure vessel to increase the pressure, and when the predetermined pressure is reached, the output characteristics of the electronic component can be inspected. As described above, this inspection apparatus boosts the pressure vessel of the electronic component that has reached the inspection temperature, detects the output of the output terminal of the electronic component, and collects data corresponding to the inspection temperature. Can be stored in memory. It is also possible to inspect the output data by changing the temperature of the electronic component by the heat transfer element in a state where the pressure is increased to a constant pressure.

  According to the second aspect of the present invention, heat for heating to the inspection temperature is supplied from the outside of the pressure vessel to the electronic component housed in the pressure vessel which is the isolated space by the heat conducting means. However, it can be directly supplied depending on the contact state. As a result, the electronic component can be maintained at the inspection temperature with high thermal efficiency. That is, the heat conduction plate is made a part of the outer wall of the pressure vessel, and the outer heat transfer element is brought into close contact with the heat conduction plate, and the electronic component is controlled to an accurate inspection temperature using the outer wall of the pressure vessel. This makes it possible to maintain both pressure resistance and precise temperature control. The material of the heat conduction plate may be a material with high heat conductivity other than metal, and it is also preferable to use a ceramic with high heat conductivity such as aluminum nitride or alumina.

  According to a third aspect of the present invention, in the above invention, a probe is provided on an inner wall of the upper movable container of the pressure vessel, and at the same time the upper movable container is lowered, the probe contacts a terminal of the electronic component. It is characterized by comprising.

  According to this configuration, it is possible to ensure contact between the electronic component located in the pressure vessel and the probe simultaneously with the raising and lowering operation of the upper movable container, and in a very short time, preparation for inspection having a pressure resistance state is achieved. It becomes possible to arrange.

  According to a fourth aspect of the present invention, in the above invention, the pressurizing means includes an elevating side cam follower provided in the container guiding means, and a fixed side provided above the elevating side cam follower and opposed to the fixed frame. When the upper movable container comes into close contact with the lower container at the time of inspection, the cam follower is sandwiched between the cam follower of the lift cam follower and the fixed cam follower to generate a wedge action, and the lift cam follower A pressurizing cam that pressurizes the pressurizing cam, and a pressurizing cylinder device that moves the pressurizing cam between a standby position and a sandwiching position between the cam followers.

  According to this configuration, when the upper movable container is brought into close contact with the lower container by the pressurizing cylinder device during the inspection, the elevating side cam follower is lowered integrally with the upper movable container, and the elevating side cam follower is moved to the upper fixed side. Separated from the cam follower. As a result, the pressurizing cam is moved by the cylinder device and is inserted between the cam followers to cause a wedge action to pressurize the ascending / descending side roller. Therefore, even if the thrust force of the pressurizing cylinder device is small, an extremely large thrust can be generated in the upper movable container by the wedge action, and the close contact between the upper movable container and the lower container is performed strongly. A high-pressure seal can be secured.

  Further, even when the pressure of the pressurizing cylinder device drops during pressurization, the pressurization state can be maintained by the wedge action.

  According to a fifth aspect of the present invention, during the maintenance in the above-described invention, the pressurizing cam is positioned at a standby position spaced apart from between the cam followers, and the elevating side cam follower approaches the fixed side cam follower. The container elevating means raises the upper movable container until the height reaches the height.

  According to this configuration, the upper movable container is lifted at the maximum stroke at the time of maintenance, so that the separation distance between the upper movable container and the lower container can be increased, so that maintenance of the probe provided in the upper movable container, Space for maintenance of the heat conduction plate provided is secured, and maintenance and adjustment are easy.

  According to a sixth aspect of the present invention, at the time of inspection in the above-mentioned invention, the container lifting / lowering means raises the upper movable container by a supply / discharge stroke to such an extent that the electronic component can be supplied / discharged. It is characterized by.

  According to this structure, since the raising / lowering stroke of the upper movable container at the time of inspection is small, the inspection time can be shortened.

  According to a seventh aspect of the present invention, in the above invention, the container lifting and lowering means lowers the upper movable container that has been raised by the supply / discharge stroke to stop halfway, and the upper movable container and the electronic component are After confirming the positional relationship, the upper movable container is lowered until it comes into close contact with the lower container.

  According to this configuration, when the upper movable container is brought into close contact with the lower container, the deficiency in positioning of the electronic component is avoided, so that the upper container is prevented from descending, so that the probe or the electronic component is broken, Inspection in a state where the probe does not contact the terminal of the electronic component can be suppressed. In addition, when using a conveyance carrier for conveyance of an electronic component, the positional relationship of an electronic component can be indirectly confirmed by confirming the positional relationship of an upper movable container and this conveyance carrier.

  According to an eighth aspect of the present invention, in the above invention, the heat conducting means is further disposed on a back surface of the heat transfer element and is capable of conducting heat with the outside of the pressure vessel, and the heat sink is liquid or gas. It is characterized by comprising a circulating means for cooling or heating by means of the above and an urging means for urging the heat sink to the heat transfer element side.

  In order to efficiently transfer the heat of the heat transfer element to the electronic component, it is necessary to reduce the thickness of the heat conduction plate. On the other hand, since the rigidity of the heat conduction plate is insufficient, there is a possibility that the heat conduction plate is bent outward when the pressure in the pressure vessel rises. Therefore, according to this configuration, it is possible to escape outward while the heat sink is in close contact with the heat transfer element, and destruction of the heat transfer element or the like is avoided by the outward bending of the heat conducting plate. On the other hand, when the pressure in the pressure vessel becomes negative, the heat conduction plate may be curved inward. In this case, the heat sink and the heat transfer element are further pressed against the heat conduction plate by the biasing means. The formation of gaps is prevented and heat transfer can be performed reliably.

  The electronic component inspection system according to claim 9 is characterized in that a plurality of the electronic component inspection devices of the present invention are arranged in the line direction.

  According to this configuration, a plurality of different temperature bands and pressure bands can be assigned to each electronic component inspection apparatus, so that overall inspection efficiency can be increased.

  According to a tenth aspect of the present invention, in the above invention, a preheating unit for controlling the temperature of the electronic component to a predetermined temperature is disposed upstream of the electronic component inspection apparatus, and the electronic component is placed on a transport carrier. The preheating unit and the electronic component inspection apparatus are sequentially moved.

  According to this configuration, since the preheated electronic component can be carried into the pressure vessel of each electronic component inspection apparatus, the electronic component can be equilibrated to each inspection temperature in a short time, and the inspection efficiency can be further improved. .

  According to the present invention, the pressure vessel can be formed in a small size with a high pressure resistance and a high hermetic state, and electronic components can be carried into and out of the pressure vessel easily and in a short time.

  Next, embodiments of the present invention will be described with reference to the drawings.

  An electronic component inspection apparatus according to this embodiment is shown in FIGS. In the electronic component inspection apparatus 100 according to this embodiment, an object sheet B on which an atmospheric pressure sensor A serving as an electronic component is arranged and mounted is placed on a carrier C, accommodated in a pressure vessel 10, and sealed. The heat conduction plate 51 conducts heat or cold, while the high pressure air is supplied into the pressure vessel 10 to change the pressure, and when the pressure of the gas in the pressure vessel 10 reaches a predetermined pressure, The output value of the electronic component is inspected by a PC or an analysis program (not shown) via the detection module 70. As a result, it can be inspected whether or not the atmospheric pressure sensor A functions normally at normal temperature, high temperature, below freezing point temperature and the like.

  The inspection object of the electronic component inspection apparatus 100 is not specified as a specific type, and an electrical output value corresponding to the pressure of the sensor atmosphere, for example, a voltage value is required to be output from at least one terminal. Electronic parts are the target. Here, as a representative example, a case where a chip-shaped pressure sensor A molded on a tire of a vehicle is inspected is shown, and the output of all output terminals is inspected for one pressure sensor A. The electronic component inspection apparatus 100 can inspect a large number of pieces at a time, and greatly facilitates supply, positioning, data detection, and unloading as compared to a case where a plurality of pressure sensors A are handled separately. . Here, in order to handle a plurality of pressure sensors A at the same time, a subject sheet B in which a plurality of pressure sensors A are arranged and attached to a film sheet is set as an inspection target. The atmospheric pressure sensors A are arranged on the transparent film sheet at a precise pitch. After the inspection, the atmospheric pressure sensor A puts a discrimination mark on the defective product and peels it from the transparent film sheet to make one unit, or the transparent film sheet is divided and cut by a cutter to make one unit.

  The supply of the specimen sheet B into the pressure container 10 is performed by positioning and placing the specimen sheet B on the upper surface of the carrier C in advance, and the carrier C is placed in the pressure container by unillustrated loading means (for example, a pusher with a claw). 10 is inserted. Specifically, in the pressure vessel 10, it is fed into the pressure vessel 10 through the carrier C into a gap in which the upper movable vessel 11 and the lower fixed vessel 12 are separated from each other, and on the upper surface of the heat conduction plate 51 provided in the lower fixed vessel 12. Position precisely. After the inspection of the atmospheric pressure sensor A, the upper movable container 11 and the lower fixed container 12 are separated from each other, and unillustrated unloading means takes out the carrier C to the other side of the pressure container 10 through the gap.

  The positioning and placement of the subject sheet B on the carrier C and the positioning and placement of the carrier C on the heat conduction plate 51 are performed as follows, for example. The carrier C has two pins (not shown) at diagonal positions on the upper surface thereof, and these two pins are fitted into pinholes opened in the transparent film sheet of the subject sheet B, so that the subject The sheet B can be positioned on the carrier C.

  The electronic component inspection apparatus 100 includes a container guiding means 20 that guides the upper movable container 11 of the pressure container 10 so as to be movable up and down, a container lifting / lowering means 30 that raises and lowers the upper movable container 11 of the pressure container 10, and a lower part of the upper movable container 11. Pressurizing means 40 for ensuring the sealing of the pressure vessel 10, a heat conducting means 50 for conducting heat so that the atmospheric pressure sensor A reaches the inspection temperature, an apparatus frame 60, a detection module 70, and the like. .

  The pressure vessel 10 includes an upside-down movable upper container 11 and a table-like lower fixed container 12 facing each other vertically. The upper movable container 11 is guided by the container guiding means 20 so as to be movable up and down. Further, the upper movable container 11 can be pressurized downward by the pressurizing means 40. On the other hand, the lower fixed container 12 is fixed to the apparatus frame 60. A sealing member for ensuring sealing is provided in an annular shape on the close contact surface between the upper movable container 11 and the lower fixed container 12. For convenience of assembly and maintenance, the upper movable container 11 has a handle 85 on the upper surface, and by releasing the connection with the container guiding means 20, the handle 85 can be grasped and pulled out.

  The apparatus frame 60 includes a base frame 61 and a frame-shaped upper frame 62. A lower fixed container 12 is placed and fixed on the table portion of the base frame 61. Container guide means 20 is installed on the upper frame 62, and the upper movable container 11 is supported through the container guide means 20 so as to be movable up and down.

  The container guiding means 20 is positioned above the upper movable container 11 and is guided in the vertical direction by the arch bracket 21 that supports both ends of the upper surface of the upper movable container 11, and the lower side 62a and the upper side 62b of the upper frame 62. Four rods 22a to 22d. Male screws are formed at the upper ends of the four rods 22a to 22d, and an end connecting plate 23 is fixedly connected to the upper ends by nuts 24. As a result, the upper ends of the four rods 22 a to 22 d are integrated by the end connecting plate 23. Similarly, male screw portions are formed at the lower ends of the four rods 22a to 22d, and the arch bracket 21 is fixedly connected to the lower ends by nuts 25. As a result, the lower ends of the four rods 22a to 22d are integrated by the arch bracket 21.

  The container lifting / lowering means 30 is fixed to a horizontal linear motion guide rail 31a, a linear motion cam 32 fixed to a slider 31b guided by the horizontal linear motion guide rail 31a, and a slider 31c guided to the horizontal linear motion guide rail 31a. Slider bracket 33, a first air cylinder device 34 that is fixed to the slider bracket 33 and relatively linearly drives the linear cam 32, a bracket 35 provided on the base frame 61, and the bracket 35 A second air cylinder device 36 that is fixed to the slider bracket 33 and linearly drives the slider bracket 33, a vertical linear motion guide rail 37a provided on the base frame 61, and a slider 37b guided by the vertical linear motion guide rail 37a. And an elevating bracket 37c connected and fixed to the upper surface of the arch bracket 21 and the slider 37b. A vertical third air cylinder device 39 having a cam follower (roller) 38 on the lower end side (that is, the lower end of the cylinder body) and the upper end side (that is, the head portion of the piston rod 39a) fixed to the lifting bracket 37c. .

  The linear cam 32 includes, as cam surfaces, a first smoothing part (low part smoothing part) 32a, a second smoothing part (center smoothing part) 32b, and a third smoothing part (high part smoothing part) 32c. When the linear motion cam 32 moves by extending the first air cylinder device 34 from the state in which the pistons of the first air cylinder device 34 and the second air cylinder device 36 are both contracted, The cam follower 38 that is in contact relatively rolls on the cam surface of the linear cam 32 and is, for example, 12.5 mm higher than the first smooth portion (low portion smooth portion) 32a. Move to 32b. Subsequently, when the second air cylinder device 36 is extended, the first air cylinder device 34 and the linear motion cam 32 move together, and the cam follower 38 is moved from the second smoothing portion (center smoothing portion) 32b. For example, it moves to the 3rd smooth part (high part smooth part) 32c higher by 12.5 mm. As a result, the container lifting / lowering means 30 can position the upper movable container 11 in three stages by the linear motion cam 32.

  Further, the third air cylinder device 39 always maintains a reduced state at the time of inspection. Accordingly, when the first air cylinder device 34 and the second air cylinder device 36 are simultaneously extended from the state in which the upper movable container 11 and the lower fixed container 12 are in close contact with each other, the cam follower 38 is removed from the first smoothing portion 32a. By moving to the 3rd smooth part 32c at a stretch, the upper side movable container 11 raises 25 mm with respect to the lower side fixed container 12, for example. Thus, when the separation distance between the upper movable container 11 and the lower fixed container 12 is about 25 mm, a gap necessary and sufficient for loading and unloading the subject sheet B is obtained.

  When lowering the upper movable container 11 for measurement, first, the second air cylinder device 36 is contracted to lower the upper movable container 11 by 12.5 mm. At this time, the positioning pin 81 and the positioning check pin 82 provided in the upper movable container 11 pass through the positioning pinhole of the carrier C on which the subject sheet B is placed. Therefore, when both pins 81 and 82 pass through the pinholes, it is determined that the positioning of the carrier C has been accurately performed, and the first air cylinder device 34 is subsequently contracted to operate the upper side. The movable container 11 is further lowered by 12.5 mm. As a result, the upper movable container 11 is in close contact with the lower fixed container 12. On the other hand, when the positioning check pin 82 does not pass through the positioning pin hole of the carrier C, the positioning check pin 81 comes into contact with the carrier C so that the positioning check pin 81 is in contact with the upper movable container 11. It is designed to lift relatively. Since the lift is detected by the position check sensor 83, when the position check sensor 83 reacts, the second air cylinder device 36 extends without reducing the first air cylinder device 34. It operates to raise the upper movable container 11 again and generate a warning. That is, the upper movable container 11 is lowered 12.5 mm from the upper standby position 25 mm away from the lower fixed container 12 and stopped halfway, and the probe 73 provided on the upper movable container 11 is attached to the subject sheet B. After confirming that it is accurately opposed so as to contact the terminal of the atmospheric pressure sensor A, the upper movable container 11 is further lowered by 12.5 mm and brought into close contact with the lower fixed container 12.

  At the time of maintenance, the container lifting / lowering means 30 extends the first air cylinder device 34 and the second air cylinder device 36 and further expands the third air cylinder device 39 to move the upper movable container 11. It is designed to increase greatly.

  The pressing means 40 includes an extension rod 41 erected at the center of the upper surface of the arch bracket 21, a support bracket 42 that holds the upper end of the extension rod 41 slidably with respect to the rods 22 a and 22 c, and the extension rod 41. A lift cam follower (roller) 43 provided at the upper end, a plurality of fixed cam followers (rollers) 44 provided on the base frame 61 so as to oppose the lift cam follower 43, and movable upward during inspection. A pressurizing cam 46 sandwiched between rollers of the up-and-down cam follower 43 and the upper fixed-side cam follower 44 when the container 11 is in the lowest position and comes into close contact with the lower fixed container 12; The guide rail 45a and the pressing cam 46 fixed to the slider 45b guided by the horizontal linear guide rail 45a are placed between the standby position and the roller insertion position. And a pressurizing air cylinder device 47 for moving between.

  A lower inclined surface 46a is formed on the lower side of the pressure cam 46, and is set so that the vertical distance on the protruding end side of the pressure cam 46 is small and the vertical distance on the base side is large. Accordingly, when the pressurizing cam 46 is advanced by the pressurizing air cylinder device 47, the upper side of the pressurizing cam 46 is restricted from moving upward by the fixed cam follower 44. As a result, the lower inclined surface 46a performs the wedge action. Occurs and pressurizes the elevating cam follower 43 downward. As a result, even if the driving force of the cylinder device is small, an extremely large thrust can be generated in the upper movable container 11, and the close contact between the upper movable container 11 and the lower fixed container 12 is performed strongly, and the pressure at the time of inspection A high pressure seal of the container 10 is ensured. In addition, the pressurizing cam 46 only applies final pressure in this way, and the opening / closing operation of the upper movable container 11 is assigned to the container lifting / lowering means 30 side, so that it is temporarily supplied to the pressurized air cylinder device 47. Even if the air is blocked or released due to some trouble, the pressurizing cam 46 causing the minute wedge action can continue to be pressurized, so that the trouble that the upper movable container 11 jumps up can be avoided. Specifically, the pressure cam 46 can apply a pressure of about 2 tons to the lower side.

  In the maintenance, the pressurizing means 40 retracts the pressurizing cam 46 from between the rollers of the elevating side cam follower 43 and the fixed side cam follower 44 by reducing the pressurizing air cylinder device 47, The raising / lowering side cam follower 43 is not hindered.

  That is, the container elevating means 30 raises the elevating side cam follower 43 to the maximum by extending the third air cylinder device 39 when the pressurizing cam 46 is at the standby position separated from the rollers as described above. To approach the fixed cam follower 44 side. As a result, the distance between the upper movable container 11 and the lower fixed container 12 can be maximized, and a sufficient space necessary for maintenance inside the pressure container 10 is secured. If it is sufficient that the pressurization cam 46 has only a pressurization function, the size in the vertical direction of the member may be small, but here, the vertical dimension of the pressurization cam 46 is large. The reason for this is that when the pressurizing cam 46 is at the standby position spaced apart from the rollers, as described above, the ascending stroke of the elevating side cam follower 43 can be increased so that it is necessary and sufficient for maintenance inside the pressure vessel 10. This is to secure a sufficient space.

  According to this configuration, since the upper movable container 11 is lifted at the maximum stroke during maintenance, the distance between the upper movable container 11 and the lower fixed container 12 can be increased, so that the probe 73 provided in the upper movable container 11 is provided. Space for maintenance, adjustment of the heat conduction plate 51 provided in the lower fixed container 12 and adjustment of the subject sheet B placed on the heat conduction plate 51 is secured, and maintenance and adjustment are easy to perform.

  The heat conducting means 50 includes a heat conducting plate 51, a Peltier element 52 which is a kind of heat transfer element, a heat conducting fin 53 serving as a heat sink, a liquid circulating means 54, and an urging means 55. The liquid circulation means 54 includes a circulation tank 54a in which the heat conduction fins 53 are immersed in cold water or hot water, a liquid circulation pipe 54b, and a pump 54c, and cools or heats the heat conduction fins 53. As a result, the heat conducting means 50 can exchange heat between the inside and the outside of the pressure vessel 10.

  In the present embodiment, the contact surface (contact surface) in which the heat conduction plate 51 and the Peltier element 52 are in contact with each other, or the contact surface in which the Peltier element 52 and the heat conduction fin 53 are in contact with each other (current section). At least one of the surfaces is provided to be separated.

  The biasing means 55 is constituted by a coil spring at a plurality of positions provided on the lower surface of the liquid circulation means 54, holds the liquid circulation means 54 and the heat conducting fins 53 from the lower side, and is attached to the Peltier element 52 side. It is designed to push (push up). With this floating structure, it is possible to realize the close contact of the separate contact surfaces by the biasing force of the spring.

  The heat conduction plate 51 is made of a material having wear resistance and high thermal conductivity such as a metal such as gun metal, brass, and aluminum, or ceramics such as alumina and aluminum nitride, and has an opening 12a provided in the lower fixed container 12. Is arranged so as to occlude. The lower fixed container 12 including the periphery of the opening 12a is made of a heat insulating material (for example, a curable resin) so that the heat of the heat conduction plate 51 does not escape through the lower fixed container 12. .

  As a result, when the carrier C is placed on the heat conduction plate 51, the heat of the heat conduction plate 51 is efficiently conducted to the pressure sensor A side through the carrier C. The Peltier element 52 is provided in close contact with the outer surface of the heat conducting plate 51, and supplies hot heat or cold heat to the heat conducting plate 51. The heat conducting fins 53 are in close contact with the other surface (outer surface) of the Peltier element 52 to promote heat transfer. The heat conductive plate 51 preferably includes a step or a groove for guiding and positioning the carrier C.

  The carrier C has a function of positioning and mounting the atmospheric pressure sensor A. In addition, although the case where the atmospheric pressure sensor A is indirectly heated and cooled through the carrier C is shown here, for example, the lower part of the lower surface of the atmospheric pressure sensor A is opened, and the lower surface of the atmospheric pressure sensor A is It is also preferable to have a configuration in which the heat conductive plate 51 is directly adhered.

  A plurality of Peltier elements 52 are arranged in close contact with the lower surface of the heat conducting plate 51 in an even manner. In the Peltier element 52, the heat dissipation side and the heat absorption side are determined in the direction in which current flows, and heat is transferred from the low temperature side (heat absorption side) to the high temperature side (heat dissipation side). The principle of operation of the Peltier element 52 is that when a current is passed through the PN junction, an endothermic phenomenon occurs in the N → P junction and a heat dissipation phenomenon occurs in the P → N junction when viewed in the current direction. Therefore, it is possible to switch between heat dissipation (heating) and heat absorption (cooling) with respect to the heat conduction plate 51 by the Peltier element 52 only by switching the direction of the current. In addition, since the temperature difference of both surfaces of this Peltier element 52 arises relatively, if heat is supplied with respect to the heat absorption side (cooling side) of this Peltier element 52, the temperature of the thermal radiation side will rise. On the other hand, when the heat on the heat dissipation (heating) side of the Peltier element 52 is taken away, the temperature on the heat absorption (cooling) side decreases.

  Accordingly, when the pressure sensor A is heated by the heat conduction plate 51 and inspected at a desired temperature in the range of 20 ° C. to 80 ° C., for example, the heat conduction means 50 uses the hot water of the liquid circulation means 54 to produce the heat conduction fins 53. Warm up. In this state, in order to heat the heat conduction plate 51, if power is supplied to the Peltier element 52 so that the contact surface of the Peltier element 52 with the heat conduction plate becomes a heat radiation surface (heating surface), the heat of the Peltier element 52 is heated. Is released to the heat conduction plate 51 side, and the heat conduction plate 51 further heats the atmospheric pressure sensor A through the carrier C to bring the inspection temperature higher than the normal temperature. Here, although the case where hot water is used in the liquid circulation means 54 is shown, an electric heating coil or the like may be installed in the vicinity of the heat conducting fins 53 to be electrically heated. Moreover, it is also possible to take away the cold heat of the heat conductive fins 53 by supplying normal temperature air with a fan.

  When the pressure sensor A is cooled by the heat conduction plate 51 and inspected at a desired temperature in the range of, for example, −10 ° C. to 20 ° C., the heat conduction means 50 uses the cold water of the liquid circulation means 54 to obtain the heat conduction fins. Cool 53. In this state, in order to cool the heat conduction plate 51, if power is supplied to the Peltier element 52 so that the contact surface of the Peltier element 52 with the heat conduction plate becomes a heat absorption surface (cooling surface), the heat absorption surface of the Peltier element 52 Takes heat from the heat conduction plate 51, and the heat conduction plate 51 further takes heat from the atmospheric pressure sensor A to make the inspection temperature lower than room temperature. Here, although the case where cold water is used in the liquid circulation means 54 is shown, the heat conducting fins 53 may be cooled by using other refrigerants or supplying cold air with a fan.

  The heat conduction plate 51 needs to be formed thin in order to perform temperature control by the Peltier element 52 quickly and accurately. On the other hand, when the thickness of the heat conduction plate 51 is reduced, the pressure in the pressure vessel 10 increases, so that the heat conduction plate 51 is curved outward, and the heat conduction plate 51 and the heat conduction fins 53 The Peltier element 52 sandwiched between the two may be destroyed by the bending pressure. Therefore, in the present embodiment, the heat conduction fins 53 are used as a floating structure to avoid pressure breakdown of the Peltier element 52. That is, either or both of the close contact between the heat conductive plate 51 and the Peltier element 52 and the close contact between the Peltier element 52 and the heat conductive fin 53 are provided so as to be separated from each other, and the heat conductive fin 53 is formed using a spring. The urging means 55 holds the urging force from the outside. Accordingly, the heat conduction plate 51 and the Peltier element 52 are held by the biasing means 55. When the pressure in the pressure vessel 10 rises and the heat conduction plate 51 curves outward, the heat conduction fins 53 and the Peltier element It is avoided that 52 escapes outward and this contact pressure rises more than necessary. This enables efficient heat transfer while avoiding pressure breakdown of the Peltier element 52. Here, in order to avoid the Peltier element 52 from being bent and broken due to the curvature of the heat conduction plate 51, the adhesion between the heat conduction plate 51 and the Peltier element 52 and the adhesion between the Peltier element 52 and the heat conduction fin 53 are not affected. Although the case where either one or both of them is a contact surface that can be separated from each other is shown, it may be in an adhesive state as long as it has flexibility to follow the curvature of the heat conduction plate 51.

  The lower fixed container 12 is an annular member that is thicker than the heat conduction plate 51, and directly receives the load of the upper movable container 11 (that is, the pressure of the pressurizing means 40) by the member itself, Thus, the outer periphery (entire circumference) of the heat conducting plate 51 is held. Therefore, when the internal pressure of the pressure vessel 10 acts on the heat conduction plate 51, this force is distributed to the lower fixed vessel 12 through the entire periphery of the heat conduction plate 51, and the curvature of the heat conduction plate 51 is suppressed to a slight extent. Is possible. For example, the heat conducting plate 51 is preferably rectangular, and the rigidity against the internal pressure can be increased by holding the entire periphery.

  As a result of the above, heat is applied from the outside of the pressure vessel 10 to heat the pressure sensor A accommodated in the pressure vessel 10 which is a heat insulation space, or the pressure sensor A is inspected. The heat absorbed from the pressure sensor A for cooling to the temperature can be released to the outside of the pressure vessel 10, and the pressure sensor A can be maintained at the inspection temperature with high thermal efficiency.

  The lower fixed container 12 is formed in a ring shape by a heat insulating resin, and a heat conduction plate 51 is disposed so as to cover the hollow portion. Therefore, since the heat of the heat conduction plate 51 does not escape from the lower fixed container 12, more precise temperature control is possible. Further, in a state where the upper movable container 11 is lowered with respect to the lower fixed container 12, a minute gap is secured so that the heat conduction plate 51 and the upper movable container 11 do not contact (except for the pins 81 and 82). It is like that. By doing in this way, the heat of the heat conducting plate 51 is not radiated through the upper movable container 11.

  The detection module 70 is formed on a block plate 71 and a block plate 71 that are detachably fixed with bolts and the like and are made of an insulating material so as to close the socket mounting opening 11 a that is opened in the upper movable container 11. A pin socket 72 made of a conductive metal (for example, beryllium) forcibly fitted in the socket mounting hole so as to have a high pressure-resistant sealing property, and a probe detachably fitted in the probe mounting hole of the pin socket 72 73, a metal reinforcing plate 77 provided so as to cover the upper surface of the block plate 71 and preventing external bending of the block plate 71 due to internal pressure, and a cord connection socket 74 provided on the upper surface of the metal reinforcing plate 77 , A data take-out line 75 comprising a conductive wire connecting the pin socket 72 and the cord connection socket 74, and a cord connection socket 4 is stored in the memory, and a test program is used to test and determine whether or not the detection signal is a normal value. Become. The electronic component inspection apparatus 100 preferably prints an abnormality detection mark on an atmospheric pressure sensor that outputs an abnormal value by an inkjet printer connected to a PC.

  The pin socket 72 is a bottomed (non-penetrating) sleeve and is press-fitted into the socket mounting hole of the block plate 71. In addition to press-fitting, confidentiality can be enhanced by mounting with an O-ring or an adhesive. As a result, the inside of the pressure vessel 10 is secured, and the probe 73 can be detachably disposed, and the block plate 71 can be easily maintained. In addition, if a spare detection module 70 is prepared separately, the external cable connected to the cord connection socket 74 can be removed and the entire detection module 70 can be replaced when a problem such as the probe 73 occurs. As a result, it is possible to greatly reduce the time during which the apparatus is stopped during maintenance.

  The probe 73 is configured to come into contact with the terminal of each atmospheric pressure sensor A when the upper movable container 11 is lowered and placed on the lower fixed container 12. Accordingly, the state in which the output of the atmospheric pressure sensor A can be detected by the probe 73 is ensured simultaneously with the operation in which the container elevating means 30 descends the upper movable container 11 and places it on the lower fixed container 12. For example, normally, about 10 to 20 wires are used for each pressure sensor A to inspect the output of an electronic component. Hundreds of wires are required. Accordingly, by installing the detection module 70 integrally with the upper movable container 11 as in the present embodiment, this large amount of wiring can be arranged outside the pressure container 10, and the cord connection socket 74 In particular, they can be connected together in a collective cable (not shown).

  As a result, it is possible to prevent the wiring from being routed inside the pressure vessel 10 and to make maintenance extremely easy. Further, since the probe 73 is directly fixed to the pressure vessel 10, the volume of the pressure vessel 10 can be reduced to a level necessary and sufficient for accommodating electronic components, and the excess atmosphere is reduced, so that a precise temperature is reduced. Control becomes possible. Further, since the volume of the pressure vessel 10 can be made small, the pressure increase by air can be controlled in a short time, and both pressure and temperature can be controlled synergistically in a short time.

  Next, the operation of the electronic component inspection apparatus 100 configured as described above will be described.

  The operation at the time of inspection will be described. First, the third air cylinder device 39 is held in a contracted state, and the first air cylinder device 34 and the second air cylinder device 36 are operated simultaneously or one of them first to extend the cam follower 38. The first movable portion 32 is shifted from the first smooth portion (high portion smooth portion) 32 a to the third smooth portion (high portion smooth portion) 32 c to raise the upper movable container 11, and the upper movable container 11 and the lower fixed container 12 are separated from each other. A distance of 25 mm is secured (see FIG. 3). Then, a carrier C on which a subject sheet B on which a plurality of pressure sensors A are arranged and mounted in advance is inserted into a gap between the upper movable container 11 and the lower fixed container 12 by a loading means (not shown). And positioning on the heat conduction plate 51. As a result, the atmospheric pressure sensor A is brought into close contact with the heat conduction plate 51 using the Peltier element 52 as a cooling / heating source via the carrier C, and the temperature is gradually changed to the inspection temperature by predetermined heat conduction control.

  At the same time, either the first air cylinder device 34 or the second air cylinder device 36 is contracted to move the cam follower 38 from the third smoothing portion 32c of the linear cam 32 to the second smoothing portion (center smoothing). Part) 32b, the second smoothing part 32c is lowered to the first smoothing part 32a in two steps, and the upper movable container 11 is placed on the lower fixed container 12 (see FIG. 1). When the cam follower 38 is shifted from the third smoothing portion 32c of the linear motion cam 32 to the second smoothing portion (center smoothing portion) 32b (see FIG. 4) in the middle of the descent, the carrier C moves to the heat conducting plate 51. It is detected whether the positioning is accurately placed on the top. This is because the plurality of probes 73 suspended in the upper movable container 11 must be brought into precise contact with the corresponding output terminals of the atmospheric pressure sensor A. In addition, the detection of positioning is judged by whether the positioning pin 81 and the positioning check pin 82 provided in the upper movable container 11 pass through the positioning pinhole of the carrier C or not. If the positioning is normal, the second stage descent is performed (see FIG. 1). On the contrary, if an abnormality is detected, the original height of FIG. 3 is restored, the inspection is stopped, and a warning is given.

  When the descent is completed successfully, the pressurizing air cylinder device 47 is then extended, whereby the pressurizing cam 46 is sandwiched between the elevating side cam follower 43 and the fixed side cam follower 44, and the pressurizing cam 46. The lower side cam follower 43 is pushed down by causing the wedge action by the extremely gentle inclined surface 46a. As a result, the upper movable container 11 is pressurized downward, and the upper movable container 11 and the lower fixed container 12 are sealed to make the pressure container 10 a pressure-resistant space. Then, time is allowed to elapse until the subject sheet B placed in close contact with the heat conducting plate 51 reaches the inspection temperature. This elapsed time can be made extremely short if a preheating unit before being inserted into the electronic component inspection apparatus 100 is arranged and the temperature of the subject sheet B is controlled in the vicinity of the inspection temperature in advance. .

  Next, by turning on a standard pressure generator to which high-pressure air from a high-pressure air supply source (compressor) (not shown) is supplied, the lower side is connected via an intake pipe 84 passing through the inside of the lower fixed container 12. High pressure air is supplied into the pressure vessel 10 through the high pressure air supply hole 12b provided in the fixed vessel 12, and the pressure is changed. Note that this introduction pressure is always detected by a highly accurate pressure sensor (not shown), and the output of the output terminal of each atmospheric pressure sensor A generated at this time is detected by the probe 73, together with the pressure sensor data, The data is inputted to a PC or the like (not shown) via the data extraction line 75, and the collected data is stored in the memory, and the collected data is analyzed by a program to check whether or not the atmospheric pressure sensor A functions normally.

  After completion of the inspection, the internal air is instantaneously released through the intake pipe 84 and the high-pressure air supply hole 12b passing through the inside of the lower fixed container 12, and the pressurizing air cylinder device 47 is contracted to perform pressurization. The cam 46 is retracted to the standby position. Then, both the first air cylinder device 34 and the second air cylinder device 36 are extended to operate the cam follower 38 from the first smoothing portion 32a of the linear cam 32 through the second smoothing portion 32b to the third smoothing portion 32c. And the upper movable container 11 is raised at once (see FIG. 3). Then, unillustrated unloading means unloads the carrier C placed on the heat conducting plate 51, and completes one cycle of inspection.

  During maintenance in the pressure vessel 10, the first air cylinder device 34, the second air cylinder device 36, and the third air cylinder device 39 are extended to move the elevating side cam follower 43 closer to the fixed side cam follower 44. Raised to position (see FIG. 5). As a result, a sufficiently large separation distance between the upper movable container 11 and the lower fixed container 12 can be ensured, so that maintenance of the inside of the upper movable container 11 and the upper surface area of the lower fixed container 12 can be performed.

  According to this embodiment, since the inside of the pressure vessel 10 becomes a pressure-resistant sealed space for inspection, and the heat conduction plate 51 is directly installed in the pressure vessel 10, the pressure sensor A is brought to an accurate inspection temperature simultaneously with the carrying-in. Can be held. Further, the output of the output terminal of each atmospheric pressure sensor A can be detected by increasing the pressure in the pressure vessel 10. In particular, since the probe 73 is directly installed in the pressure vessel 10, the detection is possible simultaneously with the opening / closing operation, and an extremely high-speed inspection is possible. That is, when the atmospheric pressure sensor A is loaded into the pressure vessel 10 and closed, it is possible to prepare for inspection.

  Furthermore, since the heat conduction means 50 is provided outside the pressure vessel 10 except for the heat conduction plate 51, and the probe 73 is directly fixed to the pressure vessel 10, the volume of the pressure vessel 10 is necessary for accommodating electronic components. It can be made sufficiently small, and the extra atmosphere is reduced, enabling precise temperature control. In addition, since the pressure vessel 10 is small and simple, a pressure-resistant and heat-insulating vessel can be configured at low cost. Further, since the volume of the pressure vessel 10 is small, the pressure can be increased by air in a short time, so that both pressure and temperature can be controlled synergistically in a short time. Furthermore, since the pressure vessel 10 becomes small in size, the contact surface between the upper movable container 11 and the lower fixed container 12 can be made smaller. Therefore, when the pressure vessel 10 is held at a high pressure, The acting reaction force can be reduced. As a result, a sufficient sealing force can be secured by utilizing the wedge action of the cam, and a large-scale device such as a hydraulic press is not required. Therefore, the pressure vessel 10 having high pressure resistance can be easily manufactured at low cost. be able to. For example, in the present embodiment, it can withstand a pressure of about 100 kPa to 600 kPa.

  Since the pressure vessel 10 includes the upper movable container 11 on the upper side and the lower fixed container 12 on the lower side, the gap between the upper movable container 11 and the lower fixed container 12 is necessary for inserting / removing the subject sheet B. Since it is sufficient to raise the weak dimensions, the up and down time of the upper movable container 11 can be shortened.

  Furthermore, according to this embodiment, the pressure sensor A is brought into close contact with the heat conducting plate 51 via the carrier C, so that the pressure sensor A is directly or indirectly contacted by the Peltier element 52 while being a pressure space. It is possible to control the temperature directly (that is, without using air as a medium), and it is possible to reduce the temperature effect of the air injected into the surroundings. That is, the inspection state suitable for both pressure and temperature control can be maintained.

  Further, according to this embodiment, the upper movable container 11 is lowered from the upper standby position and stopped halfway, and the probe 73 faces the terminal of the atmospheric pressure sensor A attached to the subject sheet B. After confirming this, since the upper movable container 11 is lowered until it comes into close contact with the lower fixed container 12, the destruction of the carrier C and the pressure sensor A due to the lowering of the upper movable container 11 can be avoided. An inspection error of the atmospheric pressure sensor A caused by the displacement of the atmospheric pressure sensor A can be prevented.

  Furthermore, according to this embodiment, the probe 73 is brought into contact with the terminal of the atmospheric pressure sensor A just by lowering the upper movable container 11 and overlaying it on the lower fixed container 12 so as to be in a sealed state. Can be boosted. In addition, since the upper movable container 11 has an inverted pan shape, the internal space can be made high, so that the probe 73 can be provided directly on the inner wall. Similarly, when the upper movable container 11 is raised, the probe 73 is positioned in the upper movable container 11 and is integrally raised, so that the electronic component positioned in the lower fixed container 12 can be immediately carried out. Thus, the destruction of the probe 73 can also be reduced. As a result, automation of the transfer line is achieved and maintenance is easy. In particular, since the probe 73 is integrally held by the upper movable container 11 and a sliding portion or the like is not necessary on the peripheral wall of the pressure container 10, confidentiality can be improved. As a result, the internal pressure is stabilized, so that the inspection accuracy can be increased.

  Furthermore, according to the present embodiment, even if a part of the plurality of probes 73 is worn due to contact with the terminals of the atmospheric pressure sensor A during a long period of use, the block plate 71 is removed and the tip of the probe 73 is viewed. In this case, for example, it can be seen that a probe with no gloss is poor in contact, and a probe with excessive gloss and deformation is also in poor contact, so that only the probe 73 with poor characteristics is removed and a new probe 73 is removed. It is possible to easily exchange or adjust the height of the probe 73. Further, when the probe 73 is replaced, it is not necessary to replace the block plate 71 itself, so that low-cost operation is possible. Further, when urgently required, the entire detection module 70 can be replaced in a very short time, so that the maintenance work of the probe 73 can be performed in another place, and the inspection efficiency can be drastically improved. It has become.

  In order to further increase the inspection efficiency, as shown in FIG. 6, as the electronic component inspection system 300, a plurality of electronic component inspection apparatuses 100 (three in this case) are arranged in the line direction, and each electronic component is arranged. A preheating unit 200 is disposed upstream of the inspection apparatus 100. As a result, it is possible to discriminate and inspect for normality and abnormality of values output by the atmospheric pressure sensor A at each inspection temperature of, for example, 20 ° C., 80 ° C., and −10 ° C., one after another. The first electronic component inspection apparatus 100 maintains the atmospheric pressure sensor A, for example, at an inspection temperature of 20 ° C., and the second electronic component inspection apparatus 100 maintains the atmospheric pressure sensor A, for example, at an inspection temperature of 80 ° C., for example. The component inspection apparatus 100 is configured to keep the pressure sensor A at, for example, an inspection temperature of −10 ° C. Further, the preheating unit 100 controls in advance the atmospheric pressure sensor A set on the carrier C before each of the three electronic component inspection apparatuses 100 to around 20 ° C., 80 ° C., or −10 ° C. As a result, since the preheated atmospheric pressure sensor A is carried into the pressure vessel 10 of each electronic component inspection apparatus 100 and the pressure vessel 10 is sealed, the atmospheric pressure sensor A can be set to 20 ° C., 80 ° C., or It is possible to equilibrate to each inspection temperature of −10 ° C., and to inspect each atmospheric pressure sensor A in real time. As described above, in the electronic component inspection system 300 in which the temperature characteristic inspection is performed by sharing one of the inspection temperatures of 20 ° C., 80 ° C., and −10 ° C. with the three electronic component inspection apparatuses 100, the inspection efficiency is extremely high. can get.

  Moreover, it is preferable to use the electronic component inspection system 300 also when inspecting the output of the electronic component when the temperature is changed under a plurality of fixed pressures. For example, the first electronic component inspection apparatus 100 performs the inspection while maintaining the pressure at 100 kPa while changing the temperature of the electronic component, and the second electronic component inspection apparatus 100 performs the inspection while maintaining the pressure at 300 kPa. In the third electronic component inspection apparatus 100, it is possible to perform the inspection at a pressure of 400 kPa.

  In the above embodiment, the heat conduction fin is provided with water or hot water circulation means for cooling the heat conduction fin with water or heating with hot water, but it may be configured to blow cold air, room temperature air, hot air, or the like on the heat conduction fin.

  The technical scope of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit and technical idea thereof.

  The present invention can be used for various applications in which an electronic component is supplied into a container to inspect the electronic component.

The partial cross section side view which shows the pressure vessel sealed state of the electronic component inspection apparatus which concerns on embodiment of this invention Front view of the electronic component inspection apparatus of FIG. The side view which shows the pressure vessel open state at the time of the test | inspection of the electronic component inspection apparatus of FIG. The side view which shows the temporary stop state in the middle of the fall of the pressure vessel at the time of the test | inspection of the electronic component inspection apparatus of FIG. The side view which shows the pressure vessel open state at the time of the maintenance of the electronic component inspection apparatus of FIG. The block diagram which shows the outline | summary of the electronic component inspection system which concerns on embodiment of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Electronic component inspection apparatus A Barometric pressure sensor B Test object sheet C Carrier 10 Pressure vessel 11 Upper movable container 12 Lower fixed container 20 Container guide means 30 Container raising / lowering means 40 Pressurizing means 50 Thermal conduction means 51 Thermal conduction plate 60 Apparatus frame 70 Detection module 43 Elevating side cam follower 44 Fixed side cam follower 46 Pressurizing cam 47 Pressurizing air cylinder device 52 Peltier element 53 Thermal conduction fin 55 Biasing means 71 Block plate 72 Pin socket 73 Probe 75 Data extraction line 300 Electronic component inspection system

Claims (10)

Electronic parts are sealed by placing them in a pressure vessel, maintaining a predetermined inspection temperature, supplying high-pressure gas into the pressure vessel to a predetermined pressure, and inspecting the output of the output terminal of the electronic component In electronic component inspection equipment,
The pressure vessel is composed of an upper movable container and a lower container that is fixed to the lower side of the upper movable container and seals the lower end opening of the upper movable container when the upper movable container is lowered.
Container guiding means for guiding the upper movable container to be raised and lowered; container lifting means for raising the upper movable container from a position in close contact with the lower container; and the upper movable container is placed on the lower container. Pressurizing means for pressurizing the upper movable container to ensure sealing of the lower end opening. A heat conduction means installed on the peripheral wall of the pressure vessel and in direct contact with the electronic component or indirectly through the carrier of the electronic component to conduct heat so that the electronic component reaches an inspection temperature;
The heat conduction means is provided in close contact with a back surface of the heat conduction plate disposed so as to close an opening provided in the pressure vessel, and applies heat or cold to the heat conduction plate. The electronic component inspection apparatus according to claim 1, further comprising a heat transfer element.   3. A probe is provided on an inner wall of the upper movable container of the pressure vessel, and the probe is configured to come into contact with a terminal of the electronic component at the same time as the upper movable container is lowered. Electronic component inspection equipment.   The pressurizing means includes an elevating side cam follower provided in the container guiding means, a fixed side cam follower provided on a fixed frame so as to be opposed to the upper side of the elevating side cam follower, and the upper movable container is located on the lower side during inspection. A pressurizing cam that is sandwiched between the cam followers of the ascending / descending side cam follower and the fixed side cam follower to cause the wedge action to pressurize the ascending / descending side cam follower, and the pressurizing cam. 4. The electronic component inspection apparatus according to claim 1, further comprising a pressurizing cylinder device that moves between a standby position and a cam follower insertion position.   At the time of maintenance, the container raising / lowering means is located until the pressure cam is located at a standby position spaced apart from between the cam followers, and the raising / lowering cam follower reaches a height close to or abuts the fixed cam follower. The electronic component inspection apparatus according to claim 4, wherein the upper movable container is raised.   6. The electronic apparatus according to claim 1, wherein the container lifting / lowering means is configured to raise the upper movable container by a supply / discharge stroke to an extent that enables the supply / discharge of the electronic component during inspection. Parts inspection device.   The container lifting / lowering means lowers the upper movable container that has been lifted by the supply / discharge stroke and stops halfway, and after confirming the positional relationship between the upper movable container and the electronic component, moves the upper movable container to the lower side. The electronic component inspection apparatus according to claim 1, wherein the electronic component inspection apparatus is lowered until it comes into close contact with the container.   The heat conducting means further includes a heat sink disposed on the back surface of the heat transfer element and capable of conducting heat with the outside of the pressure vessel, a circulation means for cooling or heating the heat sink with liquid or gas, and the heat sink. The electronic component inspection apparatus according to claim 2, further comprising: an urging unit that urges the heat transfer element side.   9. An electronic component inspection system, wherein a plurality of electronic component inspection devices according to claim 1 are arranged in a line direction.   A preheating unit for controlling the temperature of the electronic component to a predetermined temperature is disposed upstream of the electronic component inspection device, the electronic component is placed on a transport carrier, and the preheating unit and the electronic component inspection device are sequentially installed. The electronic component inspection system according to claim 9, wherein the electronic component inspection system moves.

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