JP2008186987A - Component built-in substrate, electronic equipment using the same, and manufacturing methods of component built-in substrate and electronic equipment - Google Patents

Component built-in substrate, electronic equipment using the same, and manufacturing methods of component built-in substrate and electronic equipment Download PDF

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JP2008186987A
JP2008186987A JP2007018899A JP2007018899A JP2008186987A JP 2008186987 A JP2008186987 A JP 2008186987A JP 2007018899 A JP2007018899 A JP 2007018899A JP 2007018899 A JP2007018899 A JP 2007018899A JP 2008186987 A JP2008186987 A JP 2008186987A
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component
mounting
resin
substrate
electronic component
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JP4609435B2 (en
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Junichi Kimura
潤一 木村
Motoyoshi Kitagawa
元祥 北川
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To realize low electronic equipment. <P>SOLUTION: In a process for burying electronic components 6 with a resin content flowing out of a resin layer 21 containing a resin base material, a resin inflow prevention part 15 is provided while blocking a component placement hole 24 to a wiring board 13 to prevent the resin content from flowing into a gap 23 formed on a component mount land 16 to which the electronic component 3 is placed and the component placement region of the electronic components 3. Then, the gap 23 is formed in a size for covering the component placement land 17 and the component placement region to which the second electronic component 3 is placed and the component placement hole 24 is allowed to be larger than the component placement region, thus opening the upper portion of the component placement region, placing the electronic components 3 on the component placement land 17, placing the electronic components 3 to the component placement land 17 formed on the inner bottom surface of the gap 23 in the component built-in substrate 11, and hence realizing the low electronic equipment 12. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、電子部品を内蔵した部品内蔵基板と、これを用いた電子機器、ならびにこれらに用いる製造方法に関するものである。   The present invention relates to a component-embedded substrate incorporating an electronic component, an electronic device using the same, and a manufacturing method used for the same.

以下、従来の部品内蔵基板１を用いた電子機器について図面を用いて説明する。図１４は従来の部品内蔵基板１を用いた電子機器の断面図である。図１４において、従来の電子機器２は、部品内蔵基板１の上面に電子部品３や電子部品４が実装されている。   Hereinafter, an electronic apparatus using the conventional component-embedded substrate 1 will be described with reference to the drawings. FIG. 14 is a cross-sectional view of an electronic apparatus using the conventional component-embedded substrate 1. In FIG. 14, the conventional electronic device 2 has an electronic component 3 and an electronic component 4 mounted on the upper surface of the component-embedded substrate 1.

ここで部品内蔵基板１は、配線基板５の上面に電子部品６が装着され、この電子部品６を覆うように部品内蔵層７が形成されている。なお、電子部品３の高さは、電子部品４の高さより高く、かつ部品内蔵層７の厚みより大きい。   Here, in the component-embedded substrate 1, an electronic component 6 is mounted on the upper surface of the wiring substrate 5, and a component-embedded layer 7 is formed so as to cover the electronic component 6. The height of the electronic component 3 is higher than the height of the electronic component 4 and larger than the thickness of the component built-in layer 7.

なお、この出願の発明に関連する先行技術文献情報としては、例えば、特許文献１が知られている。
特開２００５−１５８７７０号公報 As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP 2005-158770 A

しかしながらこのような従来の部品内蔵基板１を用いた電子機器２において、電子部品３は部品内蔵層７の厚みより大きく、部品内蔵基板１内へ内蔵した場合に部品内蔵層７から突出するので、部品内蔵基板１へ内蔵することもできない。そこで、電子部品３を部品内蔵基板１の上に装着した場合、電子機器２の高さ８は、高さの高い電子部品３の高さによって決定付けられてしまう。従って電子機器２の高さ８を低くできないという課題を有していた。   However, in the electronic device 2 using the conventional component built-in substrate 1, the electronic component 3 is larger than the thickness of the component built-in layer 7 and protrudes from the component built-in layer 7 when incorporated in the component built-in substrate 1. It cannot be built in the component built-in substrate 1. Therefore, when the electronic component 3 is mounted on the component-embedded substrate 1, the height 8 of the electronic device 2 is determined by the height of the electronic component 3 having a high height. Therefore, the electronic device 2 has a problem that the height 8 cannot be reduced.

そこで本発明は、この問題を解決したもので、電子機器の高さを低くすることができる部品内蔵基板を提供することを目的としたものである。   SUMMARY OF THE INVENTION The present invention solves this problem and aims to provide a component-embedded substrate that can reduce the height of an electronic device.

この目的を達成するために本発明の部品内蔵基板は、第２の電子部品が装着される部品搭載ランドと前記第２の電子部品が装着される部品装着領域との上に設けられた空隙部が樹脂で埋まることを阻止するために、空隙部と前記樹脂埋設部との間に樹脂流入阻止部を設ける。そして、部品搭載ランドに第２の電子部品を装着可能とするために、少なくとも前記部品装着領域の上方において前記空隙部と連結される部品装着孔を設けるものである。   In order to achieve this object, a component-embedded board according to the present invention includes a gap provided on a component mounting land on which a second electronic component is mounted and a component mounting area on which the second electronic component is mounted. In order to prevent the resin from being buried with the resin, a resin inflow prevention portion is provided between the gap portion and the resin buried portion. Then, in order to allow the second electronic component to be mounted on the component mounting land, a component mounting hole connected to the gap is provided at least above the component mounting area.

以上のように本発明によれば、配線基板と、この配線基板の一方面に接続部材を介して実装された第１の電子部品と、前記配線基板の一方面側において前記第１の電子部品が埋設された樹脂埋設部と、この樹脂埋設部の上に設けられた配線層とを備え、前記配線基板の一方面側に設けられるとともに第２の電子部品が装着される部品搭載ランドと、この部品搭載ランドと前記第２の電子部品が装着される部品装着領域との上に設けられた空隙部と、この空隙部と前記樹脂埋設部との間に設けられた樹脂流入阻止部と、この樹脂流入阻止部の上方において前記空隙部と連結されるとともに、少なくとも前記部品装着領域の上方に開口部を形成させる部品装着孔とを有したものである。   As described above, according to the present invention, the wiring board, the first electronic component mounted on one surface of the wiring board via the connection member, and the first electronic component on the one surface side of the wiring board. Embedded in a resin embedded portion and a wiring layer provided on the resin embedded portion, provided on one side of the wiring board and mounted with a second electronic component, A gap provided on the component mounting land and a component mounting area on which the second electronic component is mounted; a resin inflow blocking portion provided between the gap and the resin buried portion; It is connected to the gap portion above the resin inflow prevention portion, and has a component mounting hole for forming an opening at least above the component mounting region.

これにより、空隙部が形成された部品内蔵基板を実現できるので、空隙部の底の部品搭載ランドへ第２の電子部品を装着できる。そしてこの部品搭載ランドへ高さの高い第２の電子部品を装着しても、部品内蔵基板の上面から第２の電子部品の天面までの突出高さを低くできる。従って、電子機器の高さは高さの高い電子部品の高さにより決定付けられ難くなるので、電子機器の高さを低くできる。   As a result, a component-embedded substrate in which a gap is formed can be realized, so that the second electronic component can be mounted on the component mounting land at the bottom of the gap. Even when the second electronic component having a high height is mounted on the component mounting land, the protruding height from the upper surface of the component-embedded substrate to the top surface of the second electronic component can be reduced. Accordingly, the height of the electronic device becomes difficult to be determined by the height of the electronic component having a high height, so that the height of the electronic device can be reduced.

（実施の形態１）
以下、本実施の形態における部品内蔵基板１１を用いた電子機器１２について図面を用いて説明する。図１は本実施の形態における部品内蔵基板１１を用いた電子機器１２の断面図であり、図２は同、部品内蔵基板１１の上面図である。なお、図１、図２において、図１４と同じものについては同じ番号を用いており、それらについてはここでの説明を簡略化している。 (Embodiment 1)
Hereinafter, an electronic device 12 using the component-embedded substrate 11 in the present embodiment will be described with reference to the drawings. FIG. 1 is a cross-sectional view of an electronic device 12 using a component built-in substrate 11 in the present embodiment, and FIG. 2 is a top view of the component built-in substrate 11. 1 and 2, the same reference numerals are used for the same components as those in FIG. 14, and the description thereof is simplified here.

図１において、配線基板１３は多層基板であり、その上下面にはそれぞれ配線パターンが形成されている。この配線基板１３の上面には電子部品４が装着されるランドが形成され、ハンダ１９を介して電子部品４が接続されている。一方配線基板１３の下面には、部品ランド１４や接続ランド１６が形成されている。この部品ランド１４には電子部品６が装着され、接続ランド１６には樹脂流入阻止部１５が装着されている。ここで本実施の形態における配線基板１３には、内層パターンやスルーホール（図示せず）なども設けられている。なお、本実施の形態において電子部品４は配線基板１３の上面のみに実装されているが、これは配線層２２の下面へも実装しても良い。   In FIG. 1, the wiring board 13 is a multilayer board, and wiring patterns are formed on the upper and lower surfaces thereof. A land on which the electronic component 4 is mounted is formed on the upper surface of the wiring board 13, and the electronic component 4 is connected via the solder 19. On the other hand, component lands 14 and connection lands 16 are formed on the lower surface of the wiring board 13. An electronic component 6 is mounted on the component land 14, and a resin inflow blocking portion 15 is mounted on the connection land 16. Here, the wiring board 13 in the present embodiment is also provided with an inner layer pattern, a through hole (not shown), and the like. In the present embodiment, the electronic component 4 is mounted only on the upper surface of the wiring board 13, but it may also be mounted on the lower surface of the wiring layer 22.

部品ランド１４には電子部品６が装着され、接続ランド１６には樹脂流入阻止部１５が装着されている。この樹脂流入阻止部１５は、樹脂流入阻止体１５ｂと内部基板１５ａとから形成され、配線基板１３に対し樹脂流入阻止体１５ｂが配線基板１３側となる方向で装着される。これによって部品装着孔２４は、樹脂流入阻止部１５によって塞がれることとなる。ここで樹脂流入阻止体１５ｂはロの字形状をした枠体であり、内部に空隙部２３が形成されている。ここで、内部基板１５ａの一方の面には、電子部品３が搭載される部品搭載ランド１７を形成されている。そしてこの部品搭載ランド１７の形成された面と同じ面側に樹脂流入阻止体１５ｂを搭載することによって、配線基板１３に装着された樹脂流入阻止部１５の内側底面に部品搭載ランド１７が形成され、この部品搭載ランド１７が部品装着孔２４を介して見通せるようになる訳である。   An electronic component 6 is mounted on the component land 14, and a resin inflow blocking portion 15 is mounted on the connection land 16. The resin inflow blocking portion 15 is formed of a resin inflow blocking body 15b and an internal substrate 15a, and is attached to the wiring board 13 in a direction in which the resin inflow blocking body 15b is on the wiring board 13 side. As a result, the component mounting hole 24 is blocked by the resin inflow blocking portion 15. Here, the resin inflow blocking body 15b is a frame having a square shape, and a gap portion 23 is formed therein. Here, a component mounting land 17 on which the electronic component 3 is mounted is formed on one surface of the internal substrate 15a. By mounting the resin inflow blocking body 15b on the same side as the surface on which the component mounting land 17 is formed, the component mounting land 17 is formed on the inner bottom surface of the resin inflow blocking portion 15 mounted on the wiring board 13. The component mounting land 17 can be seen through the component mounting hole 24.

ここで樹脂流入阻止体１５ｂはその上下面に接続部を有し、これら上下面の間は接続導体などによって接続されている。そしてこの上面側の接続部と接続ランド１６ａ、接続ランド１６ｂとの間や、下部側の接続部と内部基板１５ａとの間はそれぞれハンダ１８（接続部材の一例として用いたものであり、ここでは封止部材の一例としても用いている）によって接続される。これにより接続ランド１６ａや接続ランド１６ｂは、樹脂流入阻止体１５ｂを介して内部基板１５ａに接続される。本実施の形態において接続ランド１６ａはグランド端子であり、配線基板１３上のグランドパターンと接続されている。これにより、接続ランド１６ａが部品搭載ランド１７を介して電子部品３のグランド端子と接続され、接続ランド１６ｂが部品搭載ランド１７を介して電子部品３の信号端子あるいは電源端子と接続される。なお本実施の形態において樹脂流入阻止体１５ｂには、上下面間を接続する接続導体を有した両面基板を用いたが、これは多層基板を用いても良い。あるいは少なくとも部品装着孔２４に開放部を有するような金属製のケースを用いても良い。また、樹脂成型品などを用いても良い。   Here, the resin inflow blocking body 15b has connection portions on the upper and lower surfaces thereof, and the upper and lower surfaces are connected by a connection conductor or the like. And between the connection part on the upper surface side and the connection land 16a, the connection land 16b, and between the connection part on the lower side and the internal substrate 15a, solder 18 (used as an example of a connection member, It is also used as an example of a sealing member). Thereby, the connection land 16a and the connection land 16b are connected to the internal substrate 15a via the resin inflow blocking body 15b. In the present embodiment, the connection land 16a is a ground terminal and is connected to the ground pattern on the wiring board 13. As a result, the connection land 16 a is connected to the ground terminal of the electronic component 3 through the component mounting land 17, and the connection land 16 b is connected to the signal terminal or power supply terminal of the electronic component 3 through the component mounting land 17. In the present embodiment, a double-sided substrate having connection conductors connecting the upper and lower surfaces is used as the resin inflow blocking body 15b, but a multilayer substrate may be used. Alternatively, a metal case having at least an opening in the component mounting hole 24 may be used. Also, a resin molded product or the like may be used.

ここで部品ランド１４と電子部品６との間もハンダ１８によって接続される。一方部品搭載ランド１７と電子部品３との間の接続や電子部品４の実装は、ハンダ１９によって行われている。このときハンダ１８の融点は、ハンダ１９の融点より高いものを用いると良い。本実施の形態においてハンダ１８には、融点が約２２０℃の鉛フリーはんだを用い、ハンダ１９には融点が約２００℃の鉛フリーはんだを用いている。なお本実施の形態において内部基板１５ａと樹脂流入阻止体１５ｂとの間や、樹脂流入阻止部１５と接続ランド１６との間をハンダ１８で接続したが、これは耐熱性を有する例えば熱硬化性の接着剤などによって接続しても良い。ただしその場合には、配線基板１３と配線層２２との間を貫通するスルーホールなどを用いて配線基板１３と電子部品３との間を電気的に接続する。   Here, the component land 14 and the electronic component 6 are also connected by the solder 18. On the other hand, the connection between the component mounting land 17 and the electronic component 3 and the mounting of the electronic component 4 are performed by the solder 19. At this time, the melting point of the solder 18 may be higher than that of the solder 19. In the present embodiment, lead-free solder having a melting point of about 220 ° C. is used for the solder 18, and lead-free solder having a melting point of about 200 ° C. is used for the solder 19. In the present embodiment, the internal substrate 15a and the resin inflow blocking body 15b, and the resin inflow blocking portion 15 and the connection land 16 are connected by the solder 18, which has heat resistance, for example, thermosetting. It may be connected by an adhesive or the like. However, in that case, the wiring board 13 and the electronic component 3 are electrically connected using a through hole or the like penetrating the wiring board 13 and the wiring layer 22.

次に配線基板１３の下面側には、樹脂埋設部２０と基材入り樹脂層２１とが形成される。樹脂埋設部２０には、熱硬化性の樹脂中に電子部品６や樹脂流入阻止部１５が埋設されている。そして基材入り樹脂層２１は樹脂埋設部２０を囲むように形成される。なお、本実施の形態における基材入り樹脂層２１における基材はガラス織布であり、樹脂はエポキシ樹脂である。そして、これらの樹脂埋設部２０と基材入り樹脂層２１との下側に配線層２２が設けられている。この配線層２２の上下面にはパターンが形成され、それらの間がスルーホール（図示無し）によって接続されている。   Next, on the lower surface side of the wiring substrate 13, a resin buried portion 20 and a base material-containing resin layer 21 are formed. In the resin embedding part 20, the electronic component 6 and the resin inflow prevention part 15 are embedded in a thermosetting resin. The base material-containing resin layer 21 is formed so as to surround the resin buried portion 20. In addition, the base material in the resin layer 21 with a base material in this Embodiment is a glass woven fabric, and resin is an epoxy resin. And the wiring layer 22 is provided below these resin embedding parts 20 and the resin layer 21 containing a base material. Patterns are formed on the upper and lower surfaces of the wiring layer 22 and are connected by through holes (not shown).

以上のような構成において部品装着孔２４を通じて、内部基板１５ａ上の部品搭載ランド１７へ電子部品３を装着するためには、電子部品３が装着される可能性のある領域（以降、部品装着領域という）の上方に開口部が形成される必要がある。そこで、空隙部２３の大きさは、部品装着領域と部品搭載ランド１７とを含む領域を囲むような大きさとし、かつ、部品装着孔２４は部品装着領域よりも大きくしておくことが重要である。   In order to mount the electronic component 3 on the component mounting land 17 on the internal substrate 15a through the component mounting hole 24 in the above configuration, there is a region where the electronic component 3 may be mounted (hereinafter referred to as component mounting region). It is necessary to form an opening above the above. Therefore, it is important that the size of the gap 23 is such that it encloses a region including the component mounting region and the component mounting land 17 and that the component mounting hole 24 is larger than the component mounting region. .

つまり、部品内蔵基板１１を上から見た場合に、部品装着孔２４を通じて部品装着領域全てが見通せるようにする訳である。そのために、本実施の形態では部品装着孔２４と電子部品３との間の隙間の寸法は、電子部品３の実装時に発生する装着ズレ寸法以上の寸法とする。これによって、電子部品３がずれて実装された場合でも、実装することができる。   That is, when the component-embedded substrate 11 is viewed from above, the entire component mounting area can be seen through the component mounting hole 24. Therefore, in the present embodiment, the size of the gap between the component mounting hole 24 and the electronic component 3 is set to a size larger than the mounting displacement generated when the electronic component 3 is mounted. As a result, even when the electronic component 3 is mounted out of position, it can be mounted.

ここで、電子部品３は電子部品４の高さより高く、かつ電子部品３が配線基板１３へ装着状態において、電子部品３の天面は配線層２２の上面から突出する。つまり、電子部品３は電子部品６のように部品内蔵基板１１内への内蔵はできない部品である。   Here, the electronic component 3 is higher than the height of the electronic component 4, and when the electronic component 3 is mounted on the wiring board 13, the top surface of the electronic component 3 protrudes from the upper surface of the wiring layer 22. That is, the electronic component 3 is a component that cannot be embedded in the component-embedded substrate 11 like the electronic component 6.

以上の構成により、空隙部２３が形成された部品内蔵基板１１を実現できるので、空隙部２３の底の部品搭載ランド１７へ電子部品３を装着できる。これにより部品内蔵基板１１の上面から第２の電子部品の天面までの突出高さを低くできる。従って、電子機器１２の高さは、高さの高い電子部品３の高さにより決定付けられ難くなるので、電子機器１２の高さを低くできる。   With the above configuration, the component-embedded substrate 11 in which the gap 23 is formed can be realized, so that the electronic component 3 can be mounted on the component mounting land 17 at the bottom of the gap 23. Thereby, the protrusion height from the upper surface of the component-embedded substrate 11 to the top surface of the second electronic component can be lowered. Accordingly, the height of the electronic device 12 is difficult to be determined by the height of the electronic component 3 having a high height, so that the height of the electronic device 12 can be reduced.

また一般のチップ部品に比べて背が高く、かつ樹脂内に埋設すると大気との誘電率の差などにより電気的特性に影響が発生する恐れの有るような部品に対して有用である。つまり空隙部２３を有しているので、このような電子部品に対し、電子部品が配線層２２上に実装された場合とほぼ同じ特性を得易くなる。   Also, it is useful for parts that are taller than general chip parts and that may have an effect on electrical characteristics due to a difference in dielectric constant from the atmosphere when embedded in resin. In other words, since the gap portion 23 is provided, it becomes easier to obtain substantially the same characteristics as when the electronic component is mounted on the wiring layer 22 with respect to such an electronic component.

次に、本実施の形態における電子機器１２の製造方法について図面を用いて説明する。では、最初に樹脂流入阻止部１５の製造方法から説明する。内部基板１５ａの一方面には電子部品３が搭載される部品搭載ランド１７と、樹脂流入阻止体１５ｂが装着される樹脂流入阻止体装着ランドとが形成されている。まずはメタルマスクなどを用い、これら部品搭載ランド１７と樹脂流入阻止体装着ランドとに対しクリーム状のハンダ１９を塗布する。次に、ハンダ１９を塗布した後で、電子部品実装機などを用いて内部基板１５ａへ樹脂流入阻止体１５ｂを装着する。そして、この実装の後のリフロー炉などによる加熱によって、樹脂流入阻止体１５ｂと内部基板１５ａとが接続され、樹脂流入阻止部１５が形成される。   Next, a method for manufacturing electronic device 12 in the present embodiment will be described with reference to the drawings. First, the manufacturing method of the resin inflow prevention portion 15 will be described. A component mounting land 17 on which the electronic component 3 is mounted and a resin inflow blocking body mounting land on which the resin inflow blocking body 15b is mounted are formed on one surface of the internal substrate 15a. First, using a metal mask or the like, cream-like solder 19 is applied to these component mounting lands 17 and the resin inflow blocking body mounting lands. Next, after applying the solder 19, the resin inflow blocking body 15b is mounted on the internal substrate 15a using an electronic component mounting machine or the like. And the resin inflow prevention body 15b and the internal substrate 15a are connected by the heating by the reflow furnace etc. after this mounting, and the resin inflow prevention part 15 is formed.

このとき樹脂流入阻止体１５ｂにおける配線基板１３への装着面には、接続ランド１６ａや接続ランド１６ｂのそれぞれに接続される接続部が形成されている。そして本実施の形態においては、この内部基板１５ａと樹脂流入阻止体１５ｂとの接続をハンダによって接続することにより、接続ランド１６ａに対応する接続部が電子部品３のグランド端子と接続され、接続ランド１６ｂに対応する接続部が電子部品３の信号端子あるいは電源端子に接続される。なお本実施の形態では内部基板１５ａと樹脂流入阻止体１５ｂとの接続はハンダによって行っているが、耐熱性を有した接着剤などで行ってもよい。ただしその場合には、後述する配線処理工程４１などにおいて配線基板１３と内部基板１５ａとの間をスルーホールなどによって接続すれば良い。   At this time, a connection portion connected to each of the connection land 16a and the connection land 16b is formed on the mounting surface of the resin inflow blocking body 15b to the wiring board 13. In the present embodiment, the connection between the internal substrate 15a and the resin inflow blocking body 15b is connected by solder, so that the connection portion corresponding to the connection land 16a is connected to the ground terminal of the electronic component 3, and the connection land A connection portion corresponding to 16b is connected to a signal terminal or a power supply terminal of the electronic component 3. In the present embodiment, the connection between the internal substrate 15a and the resin inflow blocking body 15b is made by solder, but it may be made by an adhesive having heat resistance. However, in that case, the wiring board 13 and the internal board 15a may be connected by a through hole or the like in the wiring processing step 41 described later.

次に部品内蔵基板１１の製造方法を説明する。図３は、本実施の形態における部品内蔵基板１１の製造フローチャートである。なお図３及び以下の説明で使用する図４から図８において、図１、図２と同じものには同じ番号を用いており、その説明は簡略化している。以下本実施の形態における部品内蔵基板１１の製造方法を、図３の製造フローチャートに示した工程の順に説明する。図４は、実装工程３２が完了した配線基板１３の断面図である。   Next, a manufacturing method of the component built-in substrate 11 will be described. FIG. 3 is a manufacturing flowchart of the component-embedded substrate 11 in the present embodiment. 3 and FIG. 4 to FIG. 8 used in the following description, the same reference numerals are used for the same components in FIG. 1 and FIG. 2, and the description is simplified. Hereinafter, a method of manufacturing the component-embedded substrate 11 in the present embodiment will be described in the order of the steps shown in the manufacturing flowchart of FIG. FIG. 4 is a cross-sectional view of the wiring board 13 after the mounting process 32 is completed.

図３、図４において、配線基板１３には部品装着孔２４が設けられ、またその一方の面には配線パターン（図示せず）や、部品ランド１４、接続ランド１６ａ、接続ランド１６ｂが形成されている。この部品装着孔２４は、後述する実装工程５４において部品装着孔２４を通して電子部品３を実装するための孔である。従って、部品装着孔２４は電子部品３（図１に示す）の部品装着領域よりも大きくすることが必要である。そこで本実施の形態においては、部品装着孔２４と電子部品３との間の隙間を電子部品３の実装ズレ量以上の間隔としている。従って電子部品３を確実に内部基板１５ａ上に装着できる。なお本実施の形態において、配線基板１３の他方面側は全面に銅箔が形成されているが、予め配線パターンを形成しておいても良い。なお、接続ランド１６ａは「ロ」の字形状であり、部品装着孔２４の周囲を囲むように形成されている。   3 and 4, a component mounting hole 24 is provided in the wiring board 13, and a wiring pattern (not shown), a component land 14, a connection land 16a, and a connection land 16b are formed on one surface thereof. ing. The component mounting hole 24 is a hole for mounting the electronic component 3 through the component mounting hole 24 in a mounting step 54 described later. Accordingly, the component mounting hole 24 needs to be larger than the component mounting region of the electronic component 3 (shown in FIG. 1). Therefore, in the present embodiment, the gap between the component mounting hole 24 and the electronic component 3 is set to be equal to or larger than the mounting displacement amount of the electronic component 3. Therefore, the electronic component 3 can be reliably mounted on the internal substrate 15a. In the present embodiment, the copper foil is formed on the entire other surface side of the wiring board 13, but a wiring pattern may be formed in advance. The connection land 16 a has a “B” shape and is formed so as to surround the component mounting hole 24.

実装工程３２は、配線基板１３の一方の面に電子部品６や樹脂流入阻止部１５を実装する工程であり、はんだ塗布工程３１、装着工程３３と、リフロー工程３４とからなる。最初にはんだ塗布工程３１では、メタルマスクなどを用いて接続ランド１６ａ、接続ランド１６ｂと部品ランド１４上にクリーム状のハンダ１８を塗布する。次に装着工程３３は、はんだ塗布工程３１の後で電子部品６や樹脂流入阻止部１５が配線基板１３に装着される。このとき部品ランド１４上には電子部品６が装着され、接続ランド１６上には樹脂流入阻止部１５が装着される。ここで、樹脂流入阻止部１５は樹脂流入阻止体１５ｂが接続ランド１６へ対向するように装着される。これにより部品装着孔２４は樹脂流入阻止部１５によって塞がれた状態となる。本実施の形態ではこのように電子部品６と樹脂流入阻止部１５とを共にこの実装工程３２で同時に実装することができるので、非常に生産性が良好である。   The mounting step 32 is a step of mounting the electronic component 6 and the resin inflow blocking portion 15 on one surface of the wiring board 13, and includes a solder application step 31, a mounting step 33, and a reflow step 34. First, in the solder application step 31, cream-like solder 18 is applied on the connection lands 16 a, the connection lands 16 b, and the component lands 14 using a metal mask or the like. Next, in the mounting process 33, the electronic component 6 and the resin inflow blocking portion 15 are mounted on the wiring board 13 after the solder application process 31. At this time, the electronic component 6 is mounted on the component land 14, and the resin inflow blocking portion 15 is mounted on the connection land 16. Here, the resin inflow prevention portion 15 is mounted so that the resin inflow prevention body 15 b faces the connection land 16. As a result, the component mounting hole 24 is closed by the resin inflow blocking portion 15. In the present embodiment, since the electronic component 6 and the resin inflow blocking portion 15 can be simultaneously mounted in the mounting step 32 in this way, the productivity is very good.

そしてリフロー工程３４では、装着工程３３の後でクリーム状のハンダ１８とハンダ１９とを溶融させ、電子部品６や樹脂流入阻止部１５を配線基板１３上にはんだ付け接続する。このときリフロー工程３４の温度は、ハンダ１８の融点より高くする。これによりハンダ１９の融点はハンダ１８の融点より低いので、ハンダ１９も溶融し、部品搭載ランド１７上にハンダ１９による保護層が形成される。   In the reflow process 34, after the mounting process 33, the creamy solder 18 and the solder 19 are melted, and the electronic component 6 and the resin inflow blocking portion 15 are soldered and connected to the wiring board 13. At this time, the temperature of the reflow process 34 is set higher than the melting point of the solder 18. Accordingly, since the melting point of the solder 19 is lower than the melting point of the solder 18, the solder 19 is also melted, and a protective layer is formed by the solder 19 on the component mounting land 17.

なお本実施の形態における実装工程３２では、ハンダ１８を用いて樹脂流入阻止部１５を配線基板１３へ接続固定したが、これは耐熱性を有した接着剤を用いても良い。なおこの場合、装着工程３３の前であらかじめ配線基板１３あるいは樹脂流入阻止体１５ｂの接続箇所へ熱硬化性の接着剤を塗布すれば、リフロー工程３４で接着剤の硬化も行うことができるので、別途硬化工程を設ける必要がなく生産性が良好である。   In the mounting process 32 in the present embodiment, the resin inflow blocking portion 15 is connected and fixed to the wiring board 13 using the solder 18, but an adhesive having heat resistance may be used. In this case, if the thermosetting adhesive is applied to the connection portion of the wiring board 13 or the resin inflow blocking body 15b in advance before the mounting step 33, the adhesive can be cured in the reflow step 34. Productivity is good because there is no need to provide a separate curing step.

次に、図５は本実施の形態における積層工程３５における部品内蔵基板１１の断面図であり、図６は積層工程３５において配線層２２積層前の部品内蔵基板１１の上面図である。図３、図５、図６において、積層工程３５は実装工程３２の後で、配線基板１３の電子部品６搭載面側に未硬化状態の熱可塑性の樹脂３６を搭載する工程である。樹脂３６は予め孔加工工程３７によって電子部品６や樹脂流入阻止部１５およびハンダ１８に対応する位置に孔３８が形成されている。そして積層工程３５において樹脂３６は、孔３８が電子部品６に対応するように積層される。本実施の形態において樹脂３６は、ガラス基材にエポキシ樹脂が含浸された未硬化状態のプリプレグである。   Next, FIG. 5 is a cross-sectional view of the component built-in substrate 11 in the lamination step 35 in the present embodiment, and FIG. 6 is a top view of the component built-in substrate 11 before the wiring layer 22 is laminated in the lamination step 35. 3, 5, and 6, the stacking step 35 is a step of mounting an uncured thermoplastic resin 36 on the electronic component 6 mounting surface side of the wiring board 13 after the mounting step 32. A hole 38 is formed in the resin 36 at a position corresponding to the electronic component 6, the resin inflow prevention portion 15, and the solder 18 in advance by a hole processing step 37. In the lamination step 35, the resin 36 is laminated so that the holes 38 correspond to the electronic components 6. In the present embodiment, the resin 36 is an uncured prepreg in which a glass substrate is impregnated with an epoxy resin.

なお積層する樹脂３６は１層としているので、積層回数が少なくなり生産性が良好となる。逆に薄いプリプレグを複数層積層した場合、積層する枚数を調整すれば容易に部品内蔵基板１１厚みを調整できる。そしてさらにこのプリプレグと配線済みであり上下面間での接続が完了した内層基板とを交互に積層すれば、配線基板１３と配線層２２との間にも内層導体層を形成できる。   Since the resin 36 to be laminated is a single layer, the number of laminations is reduced and the productivity is improved. Conversely, when a plurality of thin prepregs are laminated, the thickness of the component built-in substrate 11 can be easily adjusted by adjusting the number of laminated layers. Further, if this prepreg and the inner layer substrate that has been wired and the connection between the upper and lower surfaces is alternately laminated, an inner layer conductor layer can also be formed between the wiring substrate 13 and the wiring layer 22.

ここで、孔３８と電子部品６との間、孔３８と樹脂流入阻止部１５との間には隙間３９が形成される。これは、樹脂３６を配線基板１３上に積層し易くするために設けられたものであり、そのために孔３８と電子部品６との間の隙間３９や、孔３８と樹脂流入阻止部１５との間の隙間３９の寸法は、電子部品６や樹脂流入阻止部１５の実装ズレ寸法と樹脂３６を配線基板１３上へ搭載時のズレ寸法との合算寸法以上としておくことが望ましい。   Here, a gap 39 is formed between the hole 38 and the electronic component 6 and between the hole 38 and the resin inflow blocking portion 15. This is provided for facilitating the lamination of the resin 36 on the wiring board 13, and for this reason, the gap 39 between the hole 38 and the electronic component 6, and the gap 38 and the resin inflow blocking portion 15 are not provided. It is desirable that the size of the gap 39 be equal to or greater than the sum of the mounting displacement size of the electronic component 6 and the resin inflow blocking portion 15 and the displacement size when the resin 36 is mounted on the wiring board 13.

このように積層された樹脂３６上に配線層２２が積層され、配線層２２によって孔３８が塞がれる。このとき、隙間３９は電子部品６や樹脂流入阻止部１５と配線層２２との間にも形成する。これは、後述する部品埋設工程４０における圧縮によって、樹脂３６の厚みが減少する為である。   The wiring layer 22 is laminated on the resin 36 thus laminated, and the hole 38 is blocked by the wiring layer 22. At this time, the gap 39 is also formed between the electronic component 6 or the resin inflow blocking portion 15 and the wiring layer 22. This is because the thickness of the resin 36 is reduced by compression in the component embedding process 40 described later.

図７は部品内蔵基板１１の断面図であり、図８は同、上面図である。図３、図７、図８において部品埋設工程４０は、積層工程３５の後で未硬化の樹脂３６（図５に示す）を溶融させ、この溶融した樹脂３６を流動させて、隙間３９（図５に示す）を樹脂３６で充填する工程である。そのために部品埋設工程４０では、配線基板１３上に樹脂３６と配線層２２とが積層された状態で、上下方向から加熱すると共に圧縮する。これによって樹脂３６から樹脂分だけが流れ出し、この流れ出た樹脂分によって隙間３９が充満される。そして、この状態のままで樹脂３６の硬化温度以上の温度まで上昇させて樹脂３６を硬化させる。その後に冷却して部品埋設工程４０が完了する。   FIG. 7 is a cross-sectional view of the component-embedded substrate 11, and FIG. 8 is a top view of the same. 3, 7, and 8, the component embedding process 40 melts the uncured resin 36 (shown in FIG. 5) after the laminating process 35 and causes the melted resin 36 to flow, thereby causing a gap 39 (FIG. 5) is filled with the resin 36. Therefore, in the component embedding process 40, the resin 36 and the wiring layer 22 are laminated on the wiring board 13 and heated and compressed in the vertical direction. As a result, only the resin component flows out from the resin 36, and the gap 39 is filled with the resin component that flows out. In this state, the resin 36 is cured by raising the temperature to a temperature equal to or higher than the curing temperature of the resin 36. Thereafter, cooling is performed to complete the component embedding process 40.

このようにすることによって、部品内蔵基板１１内に電子部品６が内蔵され、電子部品６や樹脂流入阻止部１５の周りに樹脂埋設部２０が形成される。そしてこのとき樹脂３６中のガラス基材は隙間３９へ流れ出さないので、樹脂埋設部２０の周りに基材入り樹脂層２１が形成されることとなる。なおこの工程によって、電子部品６と配線基板１３との間や、はんだバンプなどによってフェイスダウンでフリップチップ実装された半導体素子と配線基板１３との間に形成された隙間３９も樹脂３６から流れ出た樹脂によって埋まる。
従って、フリップチップ実装された半導体素子と配線基板５との間に樹脂（いわゆるアンダーフィル）などを充填する必要もなく、生産性も良好である。 By doing so, the electronic component 6 is built in the component built-in substrate 11, and the resin embedded portion 20 is formed around the electronic component 6 and the resin inflow prevention portion 15. At this time, since the glass base material in the resin 36 does not flow out into the gap 39, the base material-containing resin layer 21 is formed around the resin embedding portion 20. By this process, the gap 39 formed between the electronic component 6 and the wiring board 13 or between the semiconductor element flip-chip mounted face down by a solder bump or the like and the wiring board 13 also flows out of the resin 36. Filled with resin.
Therefore, it is not necessary to fill a resin (so-called underfill) between the semiconductor element mounted on the flip chip and the wiring substrate 5, and the productivity is also good.

そしてこのとき樹脂流入阻止部１５は、部品埋設工程４０における加圧によって樹脂３６から流れ出た樹脂分が、樹脂流入阻止部１５の内部に形成された空隙部２３へ入り込むことを阻止する。そしてそのためには、樹脂流入阻止体１５ｂと内部基板１５ａとの間に隙間が発生しないようにすることが重要である。そこで、本実施の形態では、樹脂流入阻止体１５ｂをロの字形状とし、この樹脂流入阻止体１５ｂの全周で内部基板１５ａとハンダ１８で接続している。このようにすることにより、溶融した樹脂分が内部基板１５ａと樹脂流入阻止体１５ｂとの間から空隙部２３へ流れ込むことを阻止できる。   At this time, the resin inflow prevention portion 15 prevents the resin component that has flowed out of the resin 36 due to the pressurization in the component embedding process 40 from entering the gap portion 23 formed inside the resin inflow prevention portion 15. For this purpose, it is important to prevent a gap from being generated between the resin inflow blocking body 15b and the internal substrate 15a. Therefore, in the present embodiment, the resin inflow blocking body 15b is formed in a square shape and is connected to the internal substrate 15a by the solder 18 along the entire circumference of the resin inflow blocking body 15b. By doing in this way, it can prevent that the molten resin part flows into the space | gap part 23 from between the internal board | substrate 15a and the resin inflow blocker 15b.

さらに、樹脂流入阻止部１５は部品装着孔２４を覆うように装着される。このようにすることにより、溶融した樹脂分が部品装着孔２４から空隙部２３へ流れ込むことを阻止できる。さらに、樹脂流入阻止体１５ｂの全周で接続ランド１６ａとハンダ１８（封止部材の一例として用いた）で接続することによって、溶融した樹脂分が配線基板１３と樹脂流入阻止体１５ｂとの間から空隙部２３へ流れ込むことを阻止できる。そしてその結果樹脂埋設部２０内に樹脂流入阻止部１５が埋設されるとともに、空隙部２３と樹脂埋設部２０との間を仕切るように樹脂流入阻止部１５が形成されることとなる。なお本実施の形態では、ハンダ１８を封止部材としても利用するので、別途封止用の材料が不要であるとともに、別途封止処理を行う必要も無い。   Further, the resin inflow blocking portion 15 is mounted so as to cover the component mounting hole 24. By doing so, it is possible to prevent the molten resin component from flowing into the gap portion 23 from the component mounting hole 24. Further, by connecting the connection land 16a and the solder 18 (used as an example of a sealing member) around the entire periphery of the resin inflow blocking body 15b, the molten resin component is between the wiring board 13 and the resin inflow blocking body 15b. Can be prevented from flowing into the gap 23. As a result, the resin inflow prevention portion 15 is embedded in the resin embedding portion 20, and the resin inflow prevention portion 15 is formed so as to partition the gap portion 23 and the resin embedding portion 20. In the present embodiment, since the solder 18 is also used as a sealing member, a separate sealing material is not required and a separate sealing process is not required.

そして配線処理工程４１は部品埋設工程４０の後で、部品内蔵基板１１の上下面の配線処理や、上下面間を接続するスルーホールの加工が行われ、部品内蔵基板１１が完成する。なお、樹脂流入阻止部１５の接続にハンダ１８に代えて接着剤を用いた場合には、この配線処理工程４１で部品内蔵基板１１を貫通し、内部基板１５ａと配線基板１３あるいは配線層２２とを接続するスルーホールが加工される。   Then, in the wiring processing step 41, after the component embedding step 40, wiring processing is performed on the upper and lower surfaces of the component built-in substrate 11 and through holes for connecting the upper and lower surfaces are completed, and the component built-in substrate 11 is completed. In the case where an adhesive is used instead of the solder 18 to connect the resin inflow blocking portion 15, the wiring board process step 41 penetrates the component built-in substrate 11, and the internal substrate 15 a and the wiring substrate 13 or the wiring layer 22 are connected. A through hole connecting the two is processed.

本実施の形態では、部品搭載ランド１７上には、予めハンダ１９が設けられているので、後述する電子部品３の実装工程においてクリーム上のハンダを供給する必要はない。しかし、予めこのハンダ１９を設けていない場合には、後の工程にて部品搭載ランド１７上にハンダを供給する必要があるので、部品装着孔２４は部品搭載ランド１７を含む部品実装領域より大きくする。このようにすれば、容易に後の工程で部品搭載ランド１７上へハンダ１９を供給できる。   In the present embodiment, since the solder 19 is provided in advance on the component mounting land 17, it is not necessary to supply solder on the cream in the mounting process of the electronic component 3 described later. However, when the solder 19 is not provided in advance, it is necessary to supply solder onto the component mounting land 17 in a later process, so that the component mounting hole 24 is larger than the component mounting area including the component mounting land 17. To do. In this way, the solder 19 can be easily supplied onto the component mounting land 17 in a later process.

以上のような工程によって、部品実装領域上に空隙部２３が形成された部品内蔵基板１１を実現できる。従ってこの空隙部２３の内部底面に設けられた部品搭載ランド１７へ、部品装着孔２４を通して電子部品３を装着できる。従ってこの部品搭載ランド１７へ高さの高い電子部品３を装着しても、部品内蔵基板１１の上面から電子部品３の天面までの突出高さを低くできる。従って、電子機器１２の高さは高さの高い電子部品３の高さにより決定付けられなくなり、その分電子機器１２の高さを低くできる。   Through the steps as described above, the component built-in substrate 11 in which the gap 23 is formed on the component mounting region can be realized. Accordingly, the electronic component 3 can be mounted through the component mounting hole 24 to the component mounting land 17 provided on the inner bottom surface of the gap 23. Therefore, even if the electronic component 3 having a high height is mounted on the component mounting land 17, the protruding height from the upper surface of the component-embedded substrate 11 to the top surface of the electronic component 3 can be reduced. Accordingly, the height of the electronic device 12 cannot be determined by the height of the electronic component 3 having a high height, and the height of the electronic device 12 can be reduced accordingly.

次に、このようにして製造された部品内蔵基板１１を用いた電子機器１２の製造方法について図面を用いて説明する。図９は、本実施の形態における部品内蔵基板１１を用いた電子機器の製造フローチャートである。なおこの図９において図１と同じものには同じ番号を用いて、その説明は簡略化している。   Next, a method for manufacturing the electronic device 12 using the component-embedded substrate 11 manufactured as described above will be described with reference to the drawings. FIG. 9 is a manufacturing flowchart of an electronic device using the component built-in substrate 11 in the present embodiment. In FIG. 9, the same components as those in FIG. 1 are denoted by the same reference numerals, and the description thereof is simplified.

フラックス塗布工程５１では、部品内蔵基板１１の部品搭載ランド１７上にフラックス５２を塗布する。そしてはんだ塗布工程５３は、フラックス塗布工程５１の後で、メタルマスクなどを用いて、配線基板１３上にクリーム状のハンダ１９を供給する。この時点では配線基板１３上には凹凸が無いので、一般的なスクリーン印刷によって容易にハンダ１９を塗布できる。   In the flux application step 51, the flux 52 is applied on the component mounting land 17 of the component built-in substrate 11. In the solder application step 53, after the flux application step 51, the creamy solder 19 is supplied onto the wiring board 13 using a metal mask or the like. At this time, since there is no unevenness on the wiring board 13, the solder 19 can be easily applied by general screen printing.

このとき予め部品搭載ランド１７上にはハンダ１９が設けられるので、部品内蔵基板１１の状態で電子部品３を実装する時に別途はんだを供給する必要がない。そしてこれにより、部品装着孔２４は部品搭載ランド１７を見通せる大きさとする必要がなく、部品装着孔２４による開口を小さくできる。従って、配線層２２において配線パターンが形成可能な領域や、電子部品４が実装可能な領域を大きくできる。なお本実施の形態においてハンダ１９は、はんだ塗布工程３１で供給したが、完成した部品内蔵基板１１へ電子部品３を実装する前でピン転写などの方法によって塗布することもできる。   At this time, since the solder 19 is provided on the component mounting land 17 in advance, it is not necessary to separately supply solder when the electronic component 3 is mounted in the state of the component-embedded substrate 11. As a result, the component mounting hole 24 does not need to have a size allowing the component mounting land 17 to be seen, and the opening by the component mounting hole 24 can be reduced. Therefore, a region where the wiring pattern can be formed in the wiring layer 22 and a region where the electronic component 4 can be mounted can be increased. In this embodiment, the solder 19 is supplied in the solder application step 31. However, the solder 19 can be applied to the completed component-embedded substrate 11 by a method such as pin transfer before mounting the electronic component 3.

実装工程５４ははんだ塗布工程５３の後で、配線基板１３上に電子部品４を実装するとともに、部品搭載ランド１７上に電子部品３を装着する。そしてリフロー工程５５でハンダ１９を溶融させることによって、電子部品３や電子部品４が部品内蔵基板１１へ実装され、電子機器１２が完成する。なお、このリフロー工程５５の後で、部品内蔵基板１１を子基板へと分割することや、子基板毎にカバーを装着したりしても良い。   In the mounting step 54, the electronic component 4 is mounted on the wiring board 13 and the electronic component 3 is mounted on the component mounting land 17 after the solder application step 53. Then, by melting the solder 19 in the reflow process 55, the electronic component 3 and the electronic component 4 are mounted on the component built-in substrate 11, and the electronic device 12 is completed. After the reflow process 55, the component built-in board 11 may be divided into child boards, or a cover may be attached to each child board.

以上のように部品内蔵基板１１には、部品実装領域上に空隙部２３が形成されるので、この空隙部２３の内部底面に設けられた部品搭載ランド１７へ部品装着孔２４を通して電子部品３が装着される。これによって部品搭載ランド１７に対して、高さの高い電子部品３を装着しても、部品内蔵基板１１の上面から電子部品３の天面までの突出高さを低くできる。従って、電子機器１２の高さは高さの高い電子部品３の高さにより決定付けられなくなり、その分電子機器１２の高さを低くできる。   As described above, since the gap portion 23 is formed on the component mounting area in the component-embedded substrate 11, the electronic component 3 is passed through the component mounting hole 24 to the component mounting land 17 provided on the inner bottom surface of the gap portion 23. Installed. Thereby, even if the electronic component 3 having a high height is mounted on the component mounting land 17, the protruding height from the upper surface of the component-embedded substrate 11 to the top surface of the electronic component 3 can be reduced. Accordingly, the height of the electronic device 12 cannot be determined by the height of the electronic component 3 having a high height, and the height of the electronic device 12 can be reduced accordingly.

なお、本実施の形態において接続ランド１６ａは配線基板１３のグランド端子へと接続されているので、容易に電子部品３をシールドすることができる。そしてこれは電子機器１２が高周波信号を扱う機器である場合や、電子部品３が高周波回路と干渉を発生し易い水晶発振子などである場合に特に有用となる。また樹脂流入阻止体１５ｂとして金属体を用いれば、ハンダ１８を用いて容易に接続ランド１６ａへ固定することができるとともに、電子部品３の側面が金属で覆われることとなり、さらにしっかりと電子部品３のシールドを行える。   In this embodiment, since the connection land 16a is connected to the ground terminal of the wiring board 13, the electronic component 3 can be easily shielded. This is particularly useful when the electronic device 12 is a device that handles high-frequency signals, or when the electronic component 3 is a crystal oscillator that easily interferes with the high-frequency circuit. If a metal body is used as the resin inflow blocking body 15b, it can be easily fixed to the connection land 16a by using the solder 18, and the side surface of the electronic component 3 is covered with metal, so that the electronic component 3 is more firmly secured. Can be shielded.

また、本実施の形態では、１個の電子部品６に対して１個の孔３８を設けたが、これは複数個の電子部品６に対して１個の孔３８としても良い。この場合、電子部品６間の間隔が狭いような場合に有用である。   In the present embodiment, one hole 38 is provided for one electronic component 6, but this may be one hole 38 for a plurality of electronic components 6. This is useful when the interval between the electronic components 6 is narrow.

さらに、本実施の形態では樹脂３６から流れ出た樹脂分によって孔３８内の電子部品６を埋設したが、これは積層工程３５において樹脂３６を配線基板１３の上へ積層した後で、孔３８内にペースト状の樹脂を供給しても良い。この場合においても樹脂流入阻止部１５は溶融したペースト状樹脂の空隙部２３への流れ込みを阻止できる。このとき、プリプレグには予め設けたビアホール内に導電ペーストを充填したものを用い、積層工程３５においてこのプリプレグと配線済みであり上下面間での接続が完了した内層基板とを交互に積層すれば、内層導体間同士での接続も可能となる。そしてこの場合、樹脂はスクリーン印刷で行うと生産性が良好である。ただしこの場合メタルマスクの開口は孔３８より小さくする。そして樹脂３６と配線層２２との間に、プリプレグを挿入する。このようにすれば、孔３８へ供給したペースト状樹脂が配線層２２と基材入り樹脂層２１との間に入り込み難くなる。従って、基板の内層導体、配線基板１３と配線層２２間での接続信頼性が良好である。   Further, in the present embodiment, the electronic component 6 in the hole 38 is embedded by the resin component flowing out from the resin 36. This is because the resin 36 is laminated on the wiring board 13 in the lamination step 35, and then the inside of the hole 38 is filled. A paste-like resin may be supplied. Even in this case, the resin inflow prevention portion 15 can prevent the molten paste resin from flowing into the gap portion 23. At this time, if a prepreg is filled with a conductive paste in a via hole provided in advance, this prepreg and the inner layer substrate that has been wired and the connection between the upper and lower surfaces is alternately laminated in the lamination step 35 The connection between the inner layer conductors is also possible. In this case, the resin has good productivity when screen printing is performed. In this case, however, the opening of the metal mask is made smaller than the hole 38. Then, a prepreg is inserted between the resin 36 and the wiring layer 22. This makes it difficult for the paste-like resin supplied to the hole 38 to enter between the wiring layer 22 and the resin layer 21 with the base material. Therefore, the connection reliability between the inner layer conductor of the substrate, the wiring substrate 13 and the wiring layer 22 is good.

さらにまた本実施の形態における積層工程３５では、基材に樹脂が含浸されたプリプレグに孔３８を加工したものを積層したが、孔３８を加工しない樹脂を電子部品６の上に積層しても良い。このときに、樹脂は電子部品６の上に載置され、電子部品６の側面と電子部品６と配線基板１３との間に形成された隙間３９は、部品埋設工程４０においてゲル状樹脂が流れ出して樹脂埋設部２０が形成されることとなる。なおこの場合、樹脂にはゲル状の樹脂を用いれば、孔３８の加工が不要となる。   Furthermore, in the laminating step 35 in the present embodiment, the prepreg whose base material is impregnated with the resin is laminated with the hole 38 processed, but the resin that does not process the hole 38 may be laminated on the electronic component 6. good. At this time, the resin is placed on the electronic component 6, and the gap 39 formed between the side surface of the electronic component 6 and the electronic component 6 and the wiring substrate 13 flows out in the component embedding process 40. Thus, the resin embedding part 20 is formed. In this case, if a gel-like resin is used as the resin, the hole 38 need not be processed.

あるいは、積層工程３５において、電子部品６を実装済みの配線基板１３上にディスペンサやスクリーン印刷などによって、ペースト状の樹脂を積層しても良い。この場合、主に電子部品６と配線基板１３との間に隙間３９が形成される。そして部品埋設工程４０においてペースト状樹脂が隙間３９へ流れ込むことによって樹脂埋設部２０が形成される。   Alternatively, in the laminating step 35, a paste-like resin may be laminated on the wiring board 13 on which the electronic component 6 has been mounted by a dispenser, screen printing, or the like. In this case, a gap 39 is mainly formed between the electronic component 6 and the wiring board 13. Then, in the component embedding process 40, the resin resin embedded portion 20 is formed by the paste resin flowing into the gap 39.

図１０は第２の例における部品内蔵基板の断面図である。図１０において図１と同じものには、同じ番号を用いているので、ここではその説明を割愛している。この第２の例の部品内蔵基板６１は部品内蔵基板１１に対し、配線基板１３と配線層２２との間の間隔が樹脂流入阻止部１５の高さより小さいものである。この場合、配線部６２には積層前に予め樹脂流入阻止部１５よりも大きな孔６３を設けておく。これにより、部品内蔵基板１１に比べて、厚みの薄い部品内蔵基板６１を実現できる。   FIG. 10 is a cross-sectional view of the component-embedded substrate in the second example. 10 that are the same as those in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted here. In the component-embedded substrate 61 of the second example, the distance between the wiring substrate 13 and the wiring layer 22 is smaller than the height of the resin inflow blocking portion 15 with respect to the component-embedded substrate 11. In this case, a hole 63 larger than the resin inflow prevention portion 15 is provided in the wiring portion 62 in advance before lamination. As a result, the component-embedded substrate 61 that is thinner than the component-embedded substrate 11 can be realized.

図１１は、積層工程３５における第３の例の部品内蔵基板の上面図である。図１１において図１と同じものには、同じ番号を用いているので、ここではその説明を割愛している。第３の例において、配線基板１３上に積層される樹脂７２には、複数個の電子部品６や樹脂流入阻止部１５が実装された領域を囲むように孔７３が形成される。このようにすれば、孔７３を１箇所加工するだけで良いので、生産性が良好である。   FIG. 11 is a top view of the component-embedded substrate of the third example in the stacking step 35. In FIG. 11, the same reference numerals are used for the same components as those in FIG. 1, and the description thereof is omitted here. In the third example, a hole 73 is formed in the resin 72 laminated on the wiring board 13 so as to surround a region where the plurality of electronic components 6 and the resin inflow blocking portion 15 are mounted. In this way, the productivity is good because only one hole 73 needs to be processed.

図１２は第４の例における部品内蔵基板の断面図である。この例における樹脂流入阻止部１５には樹脂流入阻止体１５ｂを有しておらず、内部基板１５ａがハンダ１８によって配線基板１３へ直接に接続固定される。そしてこのようにすることにより、配線層２２と内部基板１５ａとの間の樹脂埋設部２０内にも電子部品６を埋設させることも可能となる。従って、電子機器１２を薄型化するとともに、小型化することができる。   FIG. 12 is a cross-sectional view of the component built-in substrate in the fourth example. The resin inflow blocking portion 15 in this example does not have the resin inflow blocking body 15 b, and the internal substrate 15 a is directly connected and fixed to the wiring substrate 13 by the solder 18. In this way, the electronic component 6 can be embedded in the resin embedded portion 20 between the wiring layer 22 and the internal substrate 15a. Therefore, the electronic device 12 can be reduced in thickness and size.

図１３は、第５の例における部品内蔵基板の断面図である。この例では両面基板による樹脂流入阻止体１５ｂに代えて、樹脂成型による樹脂流入阻止体８１を用いたものである。このような複雑な形状の成型品に対しては、接続部が形成し難い。そこで本例における内部基板１５ａと配線基板１３との間の接続は、配線処理工程４１で形成されるスルーホール８２によって行われる。   FIG. 13 is a cross-sectional view of the component-embedded substrate in the fifth example. In this example, a resin inflow blocking body 81 by resin molding is used instead of the resin inflow blocking body 15b by the double-sided substrate. It is difficult to form a connecting portion for such a complicated shaped product. Therefore, the connection between the internal substrate 15a and the wiring substrate 13 in this example is performed by the through hole 82 formed in the wiring processing step 41.

なおこの例における樹脂流入阻止体８１の場合、樹脂流入阻止体８１は少なくとも部品埋設工程４０の前に配線基板１３へ装着しておけばよい。また、樹脂流入阻止体８１には内部基板１５ａを圧接状態で保持されるように保持爪を形成している。また樹脂流入阻止体８１の外部側面には凸部８１ａが形成され、この凸部８１ａ部が配線基板１３に当接する。さらに、樹脂流入阻止体８１の先端部８１ｂは、部品装着孔２４に圧入される。このような構成とすることにより、内部基板１５ａと樹脂流入阻止体８１との間や、樹脂流入阻止体８１と配線基板１３との間から空隙部２３へ樹脂が流れ込み難くなる。   In the case of the resin inflow blocking body 81 in this example, the resin inflow blocking body 81 may be attached to the wiring board 13 at least before the component embedding process 40. The resin inflow blocking body 81 is formed with holding claws so as to hold the internal substrate 15a in a pressed state. Further, a convex portion 81 a is formed on the outer side surface of the resin inflow blocking body 81, and the convex portion 81 a abuts against the wiring board 13. Further, the tip 81 b of the resin inflow blocking body 81 is press-fitted into the component mounting hole 24. With such a configuration, it becomes difficult for the resin to flow into the gap portion 23 between the internal substrate 15 a and the resin inflow blocking body 81 or between the resin inflow blocking body 81 and the wiring substrate 13.

本発明にかかる部品内蔵基板は、電子機器の高さを低くできるという効果を有し、薄型化が要求される携帯機器等へ用いる部品内蔵基板として有用である。   The component-embedded substrate according to the present invention has an effect that the height of the electronic device can be reduced, and is useful as a component-embedded substrate used for portable devices and the like that are required to be thin.

本実施の形態における部品内蔵基板を用いた電子機器の断面図Sectional drawing of the electronic device using the component built-in board in this Embodiment 同、部品内蔵基板の上面図Same as above, top view of component built-in board 同、部品内蔵基板の製造フローチャートSame as above, manufacturing flowchart of component built-in board 同、実装工程が完了した配線基板の断面図Cross-sectional view of the wiring board after the mounting process is completed 同、積層工程における部品内蔵基板の断面図Cross-sectional view of component built-in board in the same lamination process 同、積層工程において配線層積層前の部品内蔵基板の上面図Same as above, top view of component built-in board before wiring layer lamination in the lamination process 同、部品内蔵基板の断面図Same as above, sectional view of component built-in board 同、上面図Same top view 同、部品内蔵基板を用いた電子機器の製造フローチャートSame as above, manufacturing flowchart of electronic equipment using component-embedded substrate 同、第２の例による部品内蔵基板の断面図Sectional view of the component built-in board according to the second example 同、積層工程における第３の例の部品内蔵基板の上面図Same as above, top view of component built-in substrate of third example in lamination process 同、第４の例による部品内蔵基板の断面図Sectional view of the component built-in board according to the fourth example 同、第５の例による部品内蔵基板の断面図Sectional drawing of the component built-in board according to the fifth example 従来の部品内蔵基板を用いた電子機器の断面図Sectional view of a conventional electronic device using a component-embedded substrate

符号の説明Explanation of symbols

３ 電子部品
６ 電子部品
１３ 配線基板
１５ 樹脂流入阻止部
１７ 部品搭載ランド
１８ ハンダ
２０ 樹脂埋設部
２２ 配線層
２３ 空隙部
２４ 部品装着孔 3 Electronic Components 6 Electronic Components 13 Wiring Board 15 Resin Inflow Blocking Portion 17 Component Mounting Land 18 Solder 20 Resin Embedding Portion 22 Wiring Layer 23 Cavity Portion 24 Component Mounting Hole

Claims (16)

配線基板と、この配線基板の一方面に接続部材を介して実装された第１の電子部品と、前記配線基板の一方面側において前記第１の電子部品が埋設された樹脂埋設部と、この樹脂埋設部における前記配線基板形成側の反対に設けられた配線層とを備え、前記配線基板を貫通する部品装着孔と、この部品装着孔を塞ぐように前記配線基板の一方面側に搭載されるとともに、内部に空隙部が形成された樹脂流入阻止部と、この樹脂流入阻止部の内側底面であって第２の電子部品が装着されるとともに、少なくとも前記配線基板と前記配線層のいずれか一方と電気的に接続された部品搭載ランドとを設け、前記空隙部は前記部品搭載ランドと前記第２の電子部品が装着される部品装着領域を覆うとともに、前記部品装着孔は前記部品装着領域の大きさより大きくし、前記空隙部と前記部品装着孔とによって少なくとも前記部品装着領域の上方が開放される部品内蔵基板。 A wiring board, a first electronic component mounted on one side of the wiring board via a connecting member, a resin embedded part in which the first electronic component is embedded on one side of the wiring board, and A wiring layer provided opposite to the wiring board forming side in the resin embedding part, and mounted on one side of the wiring board so as to close the component mounting hole penetrating the wiring board. In addition, a resin inflow blocking portion having a gap formed therein, a second electronic component on the inner bottom surface of the resin inflow blocking portion, and at least one of the wiring board and the wiring layer A component mounting land electrically connected to one of the components is provided, the gap covers a component mounting area in which the component mounting land and the second electronic component are mounted, and the component mounting hole is in the component mounting area. Size of More significantly, the component-embedded substrate above at least the component attachment area by said component mounting hole and the gap portion is opened. 樹脂流入阻止部は内部基板と、空隙部を囲うように前記内部基板に装着された枠状の樹脂流入阻止体とから形成された請求項１に記載の部品内蔵基板。 The component built-in substrate according to claim 1, wherein the resin inflow blocking portion is formed of an internal substrate and a frame-shaped resin inflow blocking body mounted on the internal substrate so as to surround the gap portion. 樹脂流入阻止体は、前記樹脂流入阻止体が配線基板の一方面上に実装されることによって形成された請求項２に記載の部品内蔵基板。 The component built-in board according to claim 2, wherein the resin inflow blocking body is formed by mounting the resin inflow blocking body on one surface of the wiring board. 樹脂流入阻止体と配線基板との間には、封止部材が設けられた請求項３に記載の部品内蔵基板。 The component built-in board according to claim 3, wherein a sealing member is provided between the resin inflow blocking body and the wiring board. 封止部材にははんだを用い、配線基板の一方面には、部品装着孔の周りを囲んで形成された接続ランドを設けるとともに、樹脂流入阻止体には接続部を設け、前記接続ランドと前記接続部との間が前記はんだで接続された請求項３に記載の部品内蔵基板。 Solder is used as the sealing member, and a connection land formed so as to surround the component mounting hole is provided on one surface of the wiring board, and a connection portion is provided in the resin inflow blocking body. The component built-in board according to claim 3, wherein a connection portion is connected with the solder. 請求項１に記載の部品内蔵基板と、この部品内蔵基板の配線層上に搭載された第３の電子部品と、部品搭載ランド上に装着された第２の電子部品とを有し、前記第２の電子部品の高さは前記第３の電子部品の高さより高い電子部品であるとともに、前記第２の電子部品の天面は前記配線基板から突出した電子機器。 A component-embedded board according to claim 1, a third electronic component mounted on a wiring layer of the component-embedded substrate, and a second electronic component mounted on a component mounting land, 2 is an electronic device in which the height of the second electronic component is higher than the height of the third electronic component, and the top surface of the second electronic component protrudes from the wiring board. 少なくとも樹脂流入阻止部の側面には金属部を有し、前記金属部は第２の電子部品の周囲を囲むように設けられた請求項６に記載の電子機器。 The electronic device according to claim 6, wherein at least a side surface of the resin inflow prevention portion has a metal portion, and the metal portion is provided so as to surround the second electronic component. 配線基板の一方の面にはグランド端子を形成し、前記金属部は前記グランド端子に接続された請求項７に記載の電子機器。 The electronic device according to claim 7, wherein a ground terminal is formed on one surface of the wiring board, and the metal portion is connected to the ground terminal. 請求項１に記載の部品内蔵基板の製造方法において、配線基板の一方の面に第１の電子部品を接続部材によって実装する第１の実装工程と、この第１の実装工程の後で前記配線基板の一方の面側に、前記第１の電子部品の周囲に第１の隙間を設けるがごとく樹脂を載置するとともに、この樹脂において前記配線基板の反対側に配線層を積層する積層工程と、この積層工程の後で前記未硬化の樹脂を溶融して前記隙間に前記樹脂を充填し、前記第１の電子部品を覆う樹脂埋設部を形成するとともにこの樹脂埋設部上に配線層を形成する部品埋設工程とを備え、少なくとも前記積層工程の前で第２の電子部品よりも大きな部品装着孔を前記配線基板へ形成する工程と、少なくとも前記部品埋設工程より前で前記部品装着孔を塞ぐとともに、部品搭載ランドと前記第２の電子部品の装着領域上とに空隙部が形成されるように樹脂流入阻止部を前記配線基板へ装着する工程とを設け、前記部品埋設工程において樹脂流入阻止部が空隙部への前記樹脂の流れ込みを阻止することにより、部品装着領域の上方に開口部を形成させる部品内蔵基板の製造方法。 2. The manufacturing method of a component built-in board according to claim 1, wherein a first mounting step of mounting a first electronic component on one surface of the wiring substrate by a connecting member, and the wiring after the first mounting step. A step of laminating a resin on one side of the substrate as if providing a first gap around the first electronic component, and laminating a wiring layer on the opposite side of the wiring substrate in the resin; After the laminating step, the uncured resin is melted and the gap is filled with the resin, thereby forming a resin buried portion covering the first electronic component and forming a wiring layer on the resin buried portion. A component embedding step, and forming a component mounting hole larger than the second electronic component in the wiring board at least before the laminating step, and closing the component mounting hole at least before the component embedding step. With parts And a step of mounting the resin inflow blocking portion on the wiring board so that a gap is formed between the land and the mounting region of the second electronic component, and the resin inflow blocking portion is the gap in the component embedding step. A method of manufacturing a component-embedded substrate, wherein an opening is formed above the component mounting region by preventing the resin from flowing into the substrate. 配線基板に内部基板を装着する工程は、第１の実装工程とした請求項９に記載の部品内蔵基板の製造方法。 The method for manufacturing a component built-in substrate according to claim 9, wherein the step of mounting the internal substrate on the wiring substrate is a first mounting step. 樹脂流入阻止部は内部基板と、空隙部を囲うように前記内部基板に装着された枠状の樹脂流入阻止体とから形成され、樹脂流入阻止部を前記配線基板へ装着する工程の前に、前記内部基板へ前記樹脂流入阻止体とを一体化する請求項９に記載の部品内蔵基板の製造方法。 The resin inflow blocking portion is formed from an internal substrate and a frame-shaped resin inflow blocking body mounted on the internal substrate so as to surround the gap, and before the step of mounting the resin inflow blocking portion on the wiring substrate, The method for manufacturing a component built-in substrate according to claim 9, wherein the resin inflow blocking body is integrated with the internal substrate. 積層工程では、第１の電子部品に対応する位置に予め孔が形成された板状樹脂を配線基板における一方の面上に積層し、第１の隙間は前記孔と前記第１の電子部品との間に設けられる請求項９に記載の部品内蔵基板の製造方法。 In the laminating step, a plate-like resin having holes formed in advance at positions corresponding to the first electronic components is laminated on one surface of the wiring board, and the first gap is formed between the holes and the first electronic components. The method for manufacturing a component-embedded substrate according to claim 9, which is provided between the components. 積層工程では、樹脂流入阻止体に対応する位置に予め孔が形成された板状樹脂を配線基板における一方の面上に積層し、第１の隙間は前記孔と前記樹脂流入阻止体との間に設けられる請求項９に記載の部品内蔵基板の製造方法。 In the laminating step, a plate-like resin having a hole formed in advance at a position corresponding to the resin inflow blocking body is stacked on one surface of the wiring board, and the first gap is between the hole and the resin inflow blocking body. The method for manufacturing a component-embedded substrate according to claim 9, wherein the component-embedded substrate is provided. 接続部材ははんだを用い、第１の実装工程には、第１の電子部品が搭載される部品ランドへクリーム状の第１のはんだを塗布する第１のはんだ塗布工程と、この第１のはんだ塗布工程の後で前記部品ランド上に第１の電子部品を装着する装着工程と、この装着工程の後で前記はんだを溶融させるリフロー工程とを有し、少なくとも前記リフロー工程の前で、部品搭載ランドへ前記リフロー工程の温度で溶融可能なはんだが塗布される請求項９に記載の部品内蔵基板の製造方法。 The connecting member uses solder, and in the first mounting step, a first solder application step of applying a cream-like first solder to a component land on which the first electronic component is mounted, and the first solder A mounting step of mounting the first electronic component on the component land after the coating step, and a reflow step of melting the solder after the mounting step, and at least before the reflow step, the component mounting The method for manufacturing a component-embedded board according to claim 9, wherein a solder that can be melted at a temperature of the reflow process is applied to the land. 請求項６に記載の電子部品の製造方法において、部品内蔵基板には請求項９に記載の部品内蔵基板の製造方法で製造された部品内蔵基板を用い、前記部品内蔵基板の配線層上に第３の電子部品を装着する第２の実装工程を有し、この第２の実装工程では、第３の電子部品の高さより高さの高く、かつ樹脂埋設部の厚みより高さの高い第２の電子部品を部品搭載ランドへ装着する電子機器の製造方法。 The electronic component manufacturing method according to claim 6, wherein the component-embedded substrate is the component-embedded substrate manufactured by the component-embedded substrate manufacturing method according to claim 9, and is formed on the wiring layer of the component-embedded substrate. The second mounting step of mounting the three electronic components. In the second mounting step, the second mounting step is higher than the height of the third electronic component and higher than the thickness of the resin buried portion. Electronic device manufacturing method for mounting electronic components to component mounting lands. 請求項６に記載の電子部品の製造方法において、部品内蔵基板には請求項１４に記載の部品内蔵基板の製造方法で製造された部品内蔵基板を用い、前記部品内蔵基板の配線層上にクリーム状の第２のはんだを塗布すると共に部品搭載ランド上に少なくともフラックスを塗布する第２のはんだ塗布工程と、この第２のはんだ塗布工程の後で、第３の電子部品を配線層上に装着するとともに前記第３の電子部品の高さより高い第２の電子部品を前記部品搭載ランドへ装着する第２の実装工程と、この第２の実装工程の後で前記第２のはんだと前記部品搭載ランド上に形成されたはんだとを溶融させて前記第２と第３の電子部品を前記部品内蔵基板へ接続する電子機器の製造方法。 The electronic component manufacturing method according to claim 6, wherein the component-embedded substrate is the component-embedded substrate manufactured by the component-embedded substrate manufacturing method according to claim 14, and the cream is formed on the wiring layer of the component-embedded substrate. A second solder application step of applying a second solder in the form of at least a flux on the component mounting land, and mounting the third electronic component on the wiring layer after the second solder application step And mounting a second electronic component higher than the third electronic component on the component mounting land, and mounting the second solder and the component after the second mounting step. A method of manufacturing an electronic device, wherein the second and third electronic components are connected to the component-embedded substrate by melting solder formed on the land.
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