JP2008182067A - Treatment structure of wire on board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To fix a wire at a high regular position on a board, and perform wire treatment, which avoids a heating component on the board, while cost reduction is achieved, by using a divided board, which will be an unnecessary portion, as a wire treatment member, and making effective use of the unnecessary portion. <P>SOLUTION: A wire treatment spacer 2 formed by using a remainder of board 1 is attached to the board so that the wire 7 is supported. Each projection 5 to be inserted in two or more oblong holes 1a of the board is provided at a lower portion of the wire treatment spacer, and two or more recess portions 6, by which the wire is inserted and held, is provided at an upper portion of the wire treatment spacer. A pair of jumper wires 3 is bridged over the oblong hole on both edges, and a lower edge of the projection is formed at a locking member 5b. When the projection under the wire treatment spacer is inserted in the oblong hole of the board, the fitting member of the projection on both edges is fitted into and engaged between the jumper wires bridged over the oblong hole on both edges. Then, the wire treatment spacer is fitted against coming-off in a way that it is attachable and removable, and the wire is inserted into two or more recessed portions of the wire treatment spacer and bridged over. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention is a processing of a wire on a substrate, which is composed of a split substrate obtained by cutting out a surplus portion of the substrate, and a wire processing spacer formed on the split substrate is attached to the substrate so that the wire is supported by the line processing spacer. Concerning structure.

  The conventional wire on the board was processed by binding the wires with a binding band, so the range of movement to the left and right and the upper side was wide, and there was a problem that it might come into contact with the heat-generating parts on the board. .

  The first prior art is shown in FIGS. In this conventional circuit board wiring fixing structure, as shown in FIGS. 7A and 7B, the circuit board 111 is provided with a protruding portion 111a having a space above, and holes 110 are provided on both sides of the protruding portion. The wiring 114 is passed through the hole 100, and the wiring 114 is bent and fixed by the protruding portion 111a and the hole 110. (For example, refer to Patent Document 1).

  However, in this case, since the relatively large hole 100 is formed in the circuit board 111, there is a problem that the circuit board 111 becomes large by taking a large space on the board surface. Further, since the wiring 114 is located near the surface of the circuit board 111, there is a problem that the wiring 114 may come into contact with a heat-generating component on the circuit board 111.

  The second prior art is shown in FIGS. 8 (a), (b) and (c). As shown in FIGS. 8A, 8B, and 8C, the wiring board having the conventional line processing function cuts the wiring board main body 201 from the original plate. A wire rod holder 205 to be fixed to the wiring board main body 201 is manufactured using a discarded plate portion of the original plate as a material. The wire rod holder 205 includes a wire rod holding portion and a leg portion 253 provided with a conductor foil 254. The leg 253 of the wire rod holder 205 is inserted into the slit-shaped hole 212 of the wiring board main body 201, and the conductor foil 254 of the leg 253 is soldered to the conductor foil on the back surface of the wiring board main body 201. The seating surface of the wire rod holder 205 is overlaid on the surface of the wiring board main body 201. (For example, refer to Patent Document 2).

  However, in this case, since the wire material holder 205 is fixed to the wiring board body 201 only by soldering, there is a problem that the state in which the wire material holder is held on the wiring board body 201 is weak.

  The third prior art is shown in FIG. As shown in FIG. 9, this conventional printed circuit board connection structure includes a slit 313 having notches 313 a, 313 b, and 313 c for inserting the second printed circuit board 312, and a metal that bridges the slit 313. Lines 315a, 315b, and 315c are arranged, and a slit is formed on the side edge of the board so as to fit the first printed circuit board 311 connected to the circuit by the metal lines 315a, 315b, and 315c and the metal lines 315a, 315b, and 315c. And a second printed circuit board 312 provided with 314a, 314b, and 314c, and the first printed circuit board 311 and the electric circuit arranged on the second printed circuit board 312 can be electrically connected to each other. . (For example, refer to Patent Document 3).

However, this only shows the arrangement state of the first printed circuit board 311 and the second printed circuit board 312, and does not describe anything about the processing of wiring on the printed circuit board. It was.
Japanese Utility Model Publication No. 5-57882 Utility Model Registration No. 3085841 JP-A-9-237951

  The present invention has been made in view of the above-described conventional problems, and the wire arranged on the substrate can be wired at a position higher than the surface of the substrate, so that the heating component on the substrate can be avoided. Processing can be performed easily, the wire can be fixed stably at a fixed position, and the unnecessary part of the substrate can be used as a member for wire processing. An object of the present invention is to provide a wire processing structure on a substrate that can reduce costs.

  The present invention has been proposed in order to solve the above-mentioned problems, and the invention according to claim 1 is composed of a split substrate obtained by cutting out a surplus portion of the substrate, and a line process formed by the split substrate. In the wire processing structure on the substrate in which the spacer is attached to the substrate and the wire is supported by the line processing spacer, the spacer is inserted into a plurality of long holes provided in the substrate below the line processing spacer. And a plurality of recesses for inserting and holding the wire in the upper portion of the line processing spacer, and a pair of jumper wires in the long holes at both ends provided in the substrate. The line processing spacer is formed so as to straddle, and recessed portions are provided on both sides of the protrusions at both ends of the lower portion of the line processing spacer, and the lower ends thereof are formed on the locking piece portions. When inserting the protrusions on the lower part of the substrate into the long holes of the substrate, the locking pieces of the protrusions on both ends are engaged and locked between a pair of jumper wires spanned in the long holes on both ends. A processing spacer is detachably retained, and the wire is inserted and bridged in a plurality of recesses of the line processing spacer so that the wire is placed above the surface of the substrate by the line processing spacer. It is characterized by being configured to be held.

  The invention according to claim 2 is constituted by a split substrate obtained by cutting out a surplus portion of the substrate, and a wire processing spacer formed by the split substrate is attached to the substrate so that the wire is supported by the line processing spacer. In the processed structure of the wire on the substrate, a plurality of protrusions for insertion into a plurality of long holes provided in the substrate are provided below the line processing spacer and a wire is provided above the line processing spacer. A plurality of line processing sections for bridging are provided, and a pair of jumper wires are bridged over a long hole provided in the substrate, and a protrusion on a lower portion of the line processing spacer is provided in the long hole of the substrate. A locking piece portion that is engaged and locked between the jumper wires when inserted is formed, and the wire is bridged over a plurality of line processing portions of the line processing spacer. It makes is characterized in that the wire is configured to be held higher than the surface portion of said substrate in said line processing spacer.

  According to a third aspect of the present invention, in the invention of the second aspect, the plurality of line processing portions are formed by recesses, and incisions are formed on both sides of the lower ends of the recesses, and the wires are formed in the recesses. The wire was prevented from coming out upward by entering the notch.

  The invention according to claim 4 is the invention according to claim 2, wherein the plurality of line processing portions are formed in recesses into which the wires enter, and the wires enter into these recesses and are bridged. A binding band was inserted into a plurality of holes formed in the line processing spacer, and the wire was fixed by these binding bands.

  According to a fifth aspect of the present invention, in the invention according to any one of the second to fourth aspects, a copper foil pattern is formed at a lower portion of the protrusion, and the lower portion of the protrusion is inserted into a long hole of the substrate. Thus, the lower part of the protrusion is fixed to the substrate by soldering on the back side of the substrate.

  According to the first aspect of the present invention, among the plurality of protrusions provided at the lower portion of the line processing spacer formed of the split substrate, the locking piece portion is provided at the lower end portion of the protrusions at both ends, Since a pair of jumper wires straddle the long holes at both ends of the plurality of long holes formed, the protrusions at both ends of the line processing spacer are placed between the jumper wires at the long holes at both ends of the substrate. By engaging and locking, when the line processing spacer is attached to the board, the locking pieces of the protrusions at the lower ends of the line processing spacer are locked to the jumper wire, and the line processing spacer is pulled out. Can be fixed. The line processing spacer can be detachably attached to the substrate. Furthermore, the wire can be routed higher than the surface of the board by bridging the wire in the recess provided on the upper part of the spacer for line processing attached to the board, thereby avoiding the heat generating parts on the board. The wire can be easily processed, and the wire can be stably fixed in place. Further, since the split substrate where the substrate is unnecessary is used as the spacer for line processing, the unnecessary portion of the substrate can be effectively used and the cost can be reduced.

  According to the second aspect of the present invention, the locking pieces are provided on the plurality of protrusions provided at the lower portion of the line processing spacer formed of the split substrate, and a pair of the plurality of long holes formed on the substrate are paired. When the line processing spacer is attached to the substrate by engaging and locking the projection of the line processing spacer between the jumper wires of the long holes of the substrate, The locking piece of the protrusion on the lower part of the line processing spacer is locked to the jumper wire, so that the line processing spacer can be fixed and prevented from coming off. Furthermore, the wires can be routed to a position higher than the surface of the substrate by bridging the wires to a plurality of line processing units provided on the upper part of the spacer for line processing attached to the substrate, and the heat generated on the substrate The processing of the wire that avoids the parts can be easily performed, and the wire can be stably fixed in place. Further, since the split substrate which does not require the substrate is used as the line processing spacer, the unnecessary portion of the substrate can be effectively used and the cost can be reduced. In addition, the line processing part on the upper part of the line processing spacer can be formed not only by the recesses but also by a plurality of protrusions.

  According to the invention described in claim 3, since the plurality of line processing parts are formed by the recesses and the cuts are formed on both sides of the lower end of the recesses, when the wire is bridged over the recesses, the wire Since the wire enters the cut, the wire is locked to the upper end of the cut and the wire can be prevented from coming out upward, and the wire can be bridged in a stable state.

  According to the invention described in claim 4, these binding bands are inserted by inserting a binding band into the hole portion of the spacer for line processing in a state where the wire is put in and spanned over the concave portions forming the plurality of line processing portions. Since the wire is fixed by the wire, the wire does not come off from the recess, and the wire can be bridged in a stable state.

  According to the fifth aspect of the present invention, since the copper foil pattern is formed under the protrusions of the line processing spacer, after inserting the protrusions into the long holes of the substrate, the lower portions of the protrusions are formed on the back side of the substrate. Since it is fixed by soldering, the spacer for line processing can be firmly fixed to the substrate.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of a wire processing structure on a substrate according to the present invention will be described with reference to the drawings.

  FIG. 1 is an exploded perspective view showing a wire processing structure on a substrate according to the first embodiment of the present invention, and FIG. 2 is a perspective view showing a state where a wire processing spacer is attached to the substrate and the wire is held in the processing structure. .

  As shown in FIG. 1, the wire processing structure on the substrate according to the first embodiment is composed of a substrate 1 and a line processing spacer 2 made of a split substrate obtained by cutting off the remainder of the substrate 1. Four long holes 1 a are formed in the substrate 1, and a pair of jumper wires 3 and 3 are bridged over the long holes 1 a at both ends so as to straddle both ends fixed to the surface of the substrate 1 by soldering. Yes. A heat generating component 4 is mounted in the vicinity of the long hole 1 a of the substrate 1. Four projections 5 project downward from the lower portion of the line processing spacer 2, and recessed portions 5a and 5a are formed on both sides of the projections 5 at both ends, and the lower portions are formed on the locking piece portions 5b and 5b. Has been. Further, three concave portions 6 are formed on the upper portion of the line processing spacer 2. As shown in FIG. 2, when the protrusion 5 at the bottom of the line processing spacer 2 is inserted into the long hole 1 a of the substrate 1, the locking pieces 5 b and 5 b of the protrusions 5 and 5 on both sides are the long holes at both ends of the substrate 1. The jumper wires 3 and 3 spanned between 1a and 1a are respectively engaged and locked. The wires 7 are inserted into the three recesses 6 on the upper part of the line processing spacer 2 and bridged, so that the wires 7 are held at a portion higher than the surface of the substrate 1.

  Therefore, according to the first embodiment, the locking pieces 5b and 5b of the protrusions 5 and 5 at both lower ends of the line processing spacer 2 are formed as a pair of jumper wires 3 and 3 in the long holes 1a at both ends of the substrate 1. Since the line processing spacer 2 can be fixed while being engaged, the line processing spacer 2 can be detached from the substrate 1 as needed. Furthermore, the wire 7 can be wired to a position higher than the surface of the substrate 1 by bridging the wire 7 in the recess 6 provided on the upper part of the line processing spacer 2 attached to the substrate 1. The processing of the wire 7 avoiding the upper heat generating component 4 can be easily performed, and the wire 7 can be stably fixed in place. Further, since the unnecessary portion of the substrate 1 is used as the line processing spacer 2, the unnecessary portion of the substrate 1 can be used effectively, and the cost can be reduced.

  FIG. 3 is an exploded perspective view showing a wire processing structure on a substrate according to the second embodiment, and FIG. 4 is a perspective view showing a state in which a wire processing spacer is attached to the substrate and the wire is held in the processing structure. In addition, the same code | symbol is attached | subjected to the same member and the same location as above-mentioned 1st Embodiment, and the description is abbreviate | omitted.

  As shown in FIG. 3, in the second embodiment of the wire processing structure on the substrate, the recesses 6 and 6 on both sides of the upper part of the line processing spacer 2 are formed with notches 6a and 6a on both sides of the lower end thereof. Has been. As shown in FIG. 4, with the wire processing spacer 2 attached to the substrate 1, the wire 7 is inserted into three recesses 6, and the wires 7 enter the notches 6 a and 6 a on both sides of the recesses 6 at both ends. It becomes like this.

  Therefore, according to the second embodiment, when the wire 7 is bridged over the recess 6, the wire 7 enters the cuts 6a and 6a, so that the wire 7 is locked to the upper ends of the cuts 6a and 6a. The wire 7 can be prevented from coming out upward, and the wire 7 can be bridged in a stable state.

  FIG. 5 is a perspective view showing a wire processing structure on a substrate according to the third embodiment. In addition, the same code | symbol is attached | subjected to the same member and the same location as above-mentioned 1st Embodiment, and the description is abbreviate | omitted.

  The wire processing structure on the substrate of the third embodiment is formed in the line processing spacer 2 with the wire 7 inserted and bridged in the recess 6 of the line processing spacer 2 as shown in FIG. The binding band 8 is inserted into the plurality of holes 2 a formed, and the wire 7 is fixed by the binding band 8.

  Therefore, according to the third embodiment, the wire 7 is bound and fixed to the line processing spacer 2 by the binding band 8 in a state where the wire 7 is inserted and bridged in the recess 6 of the line processing spacer 2. Therefore, the wire 7 can be bridged in a stable state without the wire 7 being detached from the recess 6.

  6A and 6B show a wire processing structure on a substrate according to the fourth embodiment. FIG. 6A is an exploded perspective view thereof, and FIG. 6B is a partial longitudinal sectional view of an essential part thereof. In addition, the same code | symbol is attached | subjected to the same member and the same location as above-mentioned 1st Embodiment, and the description is abbreviate | omitted.

  In the wire processing structure on the substrate according to the fourth embodiment, as shown in FIG. 6A, copper foil patterns 9 are formed below the protrusions 5 at both ends of the line processing spacer 2. As shown in FIG. 6 (b), the lower projection 5 of the line processing spacer 2 is inserted into the long hole 1 a of the substrate 1 and fixed to the substrate 1 by the solder 10 on the back side of the substrate 1. Yes.

  Therefore, according to the fourth embodiment, since the copper foil pattern 9 is formed below the protrusion 5 of the line processing spacer 2, after the protrusion 5 is inserted into the long hole 1 a of the substrate 1, Since the lower part of the protrusion 5 is fixed by the solder 10 on the back side, the line processing spacer 2 can be firmly fixed to the substrate 1 and attached.

  In the above-described embodiment, the line processing spacer 2 is provided with four protrusions 5 and the recess 6 is provided with three places. However, the present invention is not limited to this, and the protrusion 5 is provided with two places, three places, or five places. Of course, a plurality of locations may be provided, the recesses 6 may be provided at 2 locations, or at least 4 locations, and a long hole 1a may be provided at 2 locations, 3 locations, or 5 locations or more in the substrate 1. .

It is a disassembled perspective view which shows the processing structure of the wire on the board | substrate of 1st Embodiment of this invention. It is a perspective view of the state which attached the spacer for line processing in the processing structure to a substrate, and held a wire. It is a disassembled perspective view which shows the processing structure of the wire on the board | substrate of 2nd Embodiment. It is a perspective view of the state which attached the spacer for line processing in the processing structure to a substrate, and held a wire. It is a perspective view which shows the processing structure of the wire on the board | substrate of 3rd Embodiment. The processing structure of the wire on the board | substrate of 4th Embodiment is shown, (a) is the disassembled perspective view, (b) is the fragmentary longitudinal cross-section of the principal part. The conventional circuit board wiring fixing structure is shown, (a) is the partial top view, (b) is the side view. The wiring board provided with the conventional wire processing function is shown, (a) is a schematic perspective view of the wire rod holder, (b) is sectional drawing of the wiring board which fixed the wire rod holder, (c) is (b) FIG. It is a disassembled perspective view which shows the connection structure of the conventional printed circuit board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 1a Long hole 2 Line processing spacer 2a Hole part 3 Jumper wire 4 Heat generating component 5 Protrusion 5a Recessed part 5b Locking piece part 6 Recessed part 6a Cut 7 Wire 8 Binding band 9 Copper foil pattern 10 Solder

Claims (5)

  In a wire processing structure on a substrate, which is composed of a split substrate obtained by cutting off the remainder of the substrate, and a wire processing spacer formed on the split substrate is attached to the substrate so that the wire is supported by the line processing spacer. A plurality of protrusions for insertion into a plurality of elongated holes provided in the substrate at a lower portion of the line processing spacer and a plurality of protrusions for inserting and holding the wire above the line processing spacer; A recess is provided, and a pair of jumper wires are bridged across the long holes provided at both ends of the substrate, and recesses are provided on both sides of the protrusions at the lower ends of the line processing spacer. The lower end thereof is formed in the locking piece portion, and the locking piece portions of the protrusions on both ends are inserted into the both ends when the protrusions on the lower part of the line processing spacer are inserted into the long holes of the substrate. The line processing spacer is detachably retained by being engaged and locked between a pair of jumper wires spanned in the long hole of the wire, and the wire is inserted into a plurality of recesses of the line processing spacer. A structure for processing a wire on a substrate, wherein the wire is held at a portion higher than the surface of the substrate by the line processing spacer when passed.   In a wire processing structure on a substrate, which is composed of a split substrate obtained by cutting off the remainder of the substrate, and a wire processing spacer formed on the split substrate is attached to the substrate so that the wire is supported by the line processing spacer. A plurality of protrusions for insertion into a plurality of long holes provided in the substrate at a lower portion of the spacer for line processing and a plurality of line processing portions for bridging a wire above the spacer for line processing And a pair of jumper wires are straddled across the long holes provided in the substrate, and between the jumper wires when inserted into the long holes of the substrate into the protrusions below the line processing spacer A locking piece portion to be engaged and locked is formed, and the wire is bridged over a plurality of line processing portions of the line processing spacer, whereby the wire Processing structure of a wire on a substrate but which is characterized by being configured to be held higher than the surface portion of said substrate in said line processing spacer.   The plurality of line processing parts are formed of recesses, and incisions are formed on both sides of the lower ends of the recesses, and the wires are prevented from coming out upward by entering the notches of the recesses. The processing structure of the wire on the board | substrate of Claim 2.   The plurality of line processing portions are formed in concave portions into which the wires enter, and a binding band is inserted into the plurality of hole portions formed in the line processing spacer in a state where the wires enter and span over the concave portions. The wire processing structure on a substrate according to claim 2, wherein the wire is fixed by these binding bands.   A copper foil pattern is formed on the lower portion of the protrusion, and the lower portion of the protrusion is inserted into the long hole of the substrate, and then the lower portion of the protrusion is fixed to the substrate by soldering on the back side of the substrate. The processing structure of the wire on the board | substrate in any one of Claim 2 thru | or 4.