JP2008177478A - Sensor ic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sensor IC device where adhesive will not creep up the clearance between the sensor ICs, even if the mounting interval of the sensor ICs is set to 15 μm or smaller. <P>SOLUTION: The sensor IC device includes a substrate 1; a plurality of sensor ICs 2A, 2B, 2C which are located on the substrate in a straight line, interposing a clearance g between each other and are fixed on the substrate by an adhesive 3; a first adhesive storage portion 4, which is formed at a position correspondent to the clearance of the substrate; and second adhesive portions 5A, 5B which are positioned on both sides in the locating direction of the sensor ICs of the first adhesive storage portion and are formed, interposing predetermined intervals 10A, 10B between the first adhesive storage portions and them. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a sensor IC device, such as a CIS (contact image sensor), in which a plurality of sensor ICs are linearly arranged close to each other and mounted.

  In the conventional CIS, a plurality of sensor ICs having a plurality of light receiving portions are linearly arranged close to each other on a substrate and fixed to the substrate using an adhesive. In this case, it is necessary to arrange each sensor IC with high accuracy in order to read a document or an image clearly. Ideally, it is desirable that the pitch of the light receiving portions on one sensor IC is equal to the interval between the light receiving portions located at the ends of the adjacent sensor ICs. For example, it is necessary to make the mounting interval of 100 μm or less, preferably 15 μm or less high.

  However, when the sensor IC mounting interval is narrowed to increase the density, a capillary phenomenon occurs in the gap between the sensor ICs, and the adhesive for fixing the sensor IC to the substrate scoops the gap between the sensor ICs. Further, it may reach the upper surface of the sensor IC to cover the light receiving portion of the sensor IC, adversely affect the photoelectric conversion characteristics of the light receiving portion, and reduce the performance of the contact image sensor.

  Conventionally, in order to avoid this, attempts have been made to reduce the amount of the adhesive. However, if the amount of the adhesive is excessively reduced, the adhesive strength is undesirably lowered. In addition, a recess that forms an adhesive reservoir is formed at a location corresponding to the gap between the sensor ICs on the substrate, and the adhesive that attempts to crawl up the gap by capillary action is stored in the recess to prevent crawl-up. A measure has also been implemented (see, for example, Patent Document 1).

Japanese Patent Laid-Open No. 11-340413

  The conventional sensor IC device has been configured as described above. However, particularly when trying to achieve a high density in which the mounting interval of the sensor IC is 15 μm or less, the adhesive that crawls up in the above-described recess is completely removed. It was not possible to accumulate in the water, and it was not possible to prevent creeping up.

  The present invention has been made to address the above problems, and provides a sensor IC device in which the adhesive does not crawl up between the sensor ICs even when the mounting interval of the sensor ICs is 15 μm or less. The purpose is to do.

  The sensor IC device according to the present invention corresponds to the substrate, a plurality of sensor ICs arranged linearly on the substrate with a gap therebetween and fixed to the substrate by an adhesive, and the gap of the substrate. A predetermined gap is provided between the first adhesive reservoir portion formed at the location and the first adhesive reservoir portion on both sides of the sensor IC arrangement direction, and the first adhesive reservoir portion. And a second adhesive reservoir portion formed therebetween.

  The sensor IC device according to the present invention is configured as described above, and a first adhesive reservoir portion formed at a location corresponding to a gap between the sensor ICs on the substrate, and both sides of the first adhesive reservoir portion. In the process of adhering the sensor IC to the substrate, in the process of adhering the sensor IC to the substrate, the second adhesive reservoir is formed at a predetermined interval between the first adhesive reservoir and the first adhesive reservoir. The adhesive that is going to wet and spread first flows into one end side of the second adhesive reservoir and is absorbed, and the adhesive that cannot be absorbed by the second adhesive reservoir passes through the back surface of the sensor IC. The sensor IC further wets and spreads toward the end of the sensor IC, but the intermediate portion between the second adhesive reservoir and the first adhesive reservoir functions as a bank, and the sensor IC end of the adhesive Block from flowing in the direction. Adhesive can flow into the other end of the unit reservoir second adhesive, to prevent the inflow of the adhesive to the end direction of the sensor IC.

  Even if there is an adhesive that gets over the bank and gets wet in the direction of the edge of the sensor IC, the adhesive stays in the first adhesive reservoir formed at the position over the bank. Since it flows in and is absorbed, it is possible to prevent the adhesive from flowing in the direction of the end of the sensor IC, and it is possible to prevent the adhesive from scooping up the gap between the sensor ICs.

Embodiment 1 FIG.
Embodiment 1 of the present invention will be described below with reference to the drawings. 1A and 1B are schematic views of a contact image sensor showing the configuration of the first embodiment, where FIG. 1A is a front view, FIG. 1B is a side view, and FIG. 1C is a front view of a portion surrounded by a circle in the front view. FIG. 2 is an enlarged view showing a state where the adhesive is removed in a configuration viewed from below, FIG. 2 is a diagram illustrating the size of the first and second adhesive reservoir portions in actual size, and (a) is a plan view; (B) is a side view.

  The contact image sensor according to the first embodiment includes a substrate 1 and a plurality of sensors IC2A, 2B, 2C,... That have light receiving portions 20A, 20B, 20C,. An adhesive 3 that is applied onto the substrate 1 and fixes the sensor ICs 2A, 2B, 2C... To the substrate 1, and a first adhesive reservoir 4 that is formed at a location corresponding to the gap between the sensor ICs on the substrate 1. 2nd adhesion | attachment located in the both sides of the arrangement direction of sensor IC of the 1st adhesive sump part 4 and formed through intermediate part 10A, 10B of a predetermined dimension between the 1st adhesive sump part 4 The plurality of wire pads 6 provided on the sensor IC and the wiring pattern 7 provided on the substrate 1 are connected to electrically connect the agent reservoirs 5A and 5B, the sensor ICs 2A, 2B, 2C. With gold wire 8 It is provided.

  In addition, in order to clarify the structural features of the first embodiment, FIG. 1 (c) shows a side configuration of the portion surrounded by a circle in FIG. 1 (a) viewed from the lower side of FIG. 1 (a). Yes. From this figure, it is possible to clearly understand the relationship between the first adhesive reservoir portion 4, the second adhesive reservoir portions 5A and 5B, the intermediate portions 10A and 10B, the substrate 1, and the sensor ICs 2A and 2B. it can.

  Further, when the wire pad 6 is connected to the gold wire 8 for electrical connection with the wiring pattern 7 of the substrate 1, pressure is applied and the adhesive 3 applied to the back surface of the wire pad 6 becomes thin. It is necessary to apply a sufficient amount of adhesive on the back surface in advance. The first and second adhesive reservoirs 4, 5 </ b> A, and 5 </ b> B are formed so as to avoid positions corresponding to the wire pads 6. FIG. 2 shows an example of the actual size when the first and second adhesive reservoirs 4, 5A, 5B are formed.

  Next, the effects of the first embodiment will be described in comparison with the conventional configuration. (A-1) to (a-3) in FIG. 3 show the flow state of the adhesive in the bonding process of the conventional sensor IC device, and the portion corresponding to the portion surrounded by a circle in FIG. 1 (a). Indicates the state.

  First, as shown in (a-1), the adhesive 3 is transferred to the bonding portion 1A of the substrate 1, and the sensor ICs 2A and 2B are linearly arranged on the upper surface via the gap g and pressed to the substrate 1 for bonding. To do. In this state, a part of the adhesive 3 flows in the direction of the ends (gap g) of the sensor ICs 2A and 2B, and flows into the adhesive reservoir part 4 formed at a location corresponding to the gap g of the substrate 1 and is absorbed. .

  As shown in (a-2), the adhesive 3 that has not been absorbed by the adhesive reservoir 4 flows along the back surfaces of the sensor ICs 2A and 2B, and further flows toward the end (gap g) of the sensor IC. As shown in (a-3), the gap g is scooped up by the capillary phenomenon of the gap g of the sensor IC. In some cases, it overflows onto the upper surfaces of the sensor ICs 2A and 2B, reaches the surfaces of the light receiving portions 20A and 20B as described above, and adversely affects the photoelectric conversion characteristics.

  Further, when the adhesive 3 enters the gap g, the distance between the sensor ICs 2A and 2B changes due to the attraction generated when the adhesive is cured, and it becomes difficult to mount the sensor ICs adjacently at a narrow pitch of 15 μm or less.

  On the other hand, (b-1) to (b-4) in FIG. 3 show the flow state of the adhesive in the bonding process of the sensor IC device according to the first embodiment.

  First, as shown in (b-1), the adhesive 3 is transferred to the bonding portion 1A of the substrate 1, and the sensor ICs 2A and 2B are linearly arranged on the upper surface thereof via the gap g and bonded to the substrate 1 by bonding. To do. In this state, like (a-1) described above, a part of the adhesive 3 flows in the direction of the ends (gap g) of the sensor ICs 2A and 2B, and reaches one end of the second adhesive reservoirs 5A and 5B. It flows in and is absorbed.

  The adhesive 3 that has not been absorbed by the second adhesive reservoirs 5A and 5B is transmitted along the back surface of the sensor IC and further wets and spreads toward the end (gap g) of the sensor IC. ), The intermediate portions 10A and 10B between the second adhesive reservoir 5A or 5B and the first adhesive reservoir 4 function as a bank, and the adhesive 3 is in the direction of the end of the sensor IC. In order to block the inflow of the adhesive, the blocked adhesive flows into the other end side of the second adhesive reservoirs 5A and 5B and is absorbed as shown in the figure.

  The adhesive 3 that could not be absorbed by the second adhesive reservoir 5A or 5B further flows between the banks 10A and 10B and the back surfaces of the sensor ICs 2A and 2B as shown in (b-3). The adhesive spread wet beyond the banks 10A and 10B flows into the first adhesive reservoir 4 from both sides and is absorbed, as shown in (b-4).

  In the first embodiment, as described above, the adhesive reservoir is doubled and an intermediate portion serving as a bank is formed between the two, so that the adhesive flows into the gap g of the sensor IC as in the prior art. It can be effectively prevented. If the adhesive is prevented from creeping up in the gap g of the sensor IC, the sensor ICs 2A, 2B, 2C,... Can be mounted adjacent to each other with a narrow pitch of 15 μm or less without being affected by the inquiry generated when the adhesive is cured. It becomes possible.

Embodiment 2. FIG.
Next, a second embodiment of the present invention will be described with reference to the drawings. FIG. 4 is a plan view showing the configuration of the second embodiment. In this figure, the same or corresponding parts as those in FIGS. 1 and 2 are denoted by the same reference numerals. The difference from FIGS. 1 and 2 is that the second adhesive reservoir portions 5A and 5B are formed in a ring shape, and the portions 11A and 11B serving as banks are also formed in the respective central portions.

  By comprising in this way, before the flow of the adhesive agent which has not been absorbed by the second adhesive reservoir portions 5A, 5B reaches the above-mentioned banks 10A, 10B, the banks 11A, 11B according to this embodiment. Therefore, the blocking effect is increased from double to triple, and it is possible to more firmly prevent the adhesive from creeping into the gap g of the sensor IC.

  In addition, since the adhesive force between the sensor IC and the substrate is enhanced by the newly attached adhesive on the surfaces of the banks 11A and 11B, and the adhesive strength near the wire pad 6 is increased, stable wire bonding is possible. Can be performed.

Embodiment 3 FIG.
Next, a third embodiment of the present invention will be described with reference to the drawings. FIG. 5 is a plan view showing the configuration of the third embodiment. In this figure, the same or corresponding parts as those in FIGS. 1 and 2 are denoted by the same reference numerals. The difference from FIGS. 1 and 2 is that the second adhesive reservoir portions 5A and 5B are formed in an approximately L shape so as to avoid the wire pad 6.

  By comprising in this way, since the adhesive force with sensor IC will be strengthened with the adhesive agent adhering to the surface of the board | substrates 12A and 12B near wire pad 6, and the adhesive strength near wire pad 6 increases, Stable wire bonding can be performed.

BRIEF DESCRIPTION OF THE DRAWINGS It is the schematic of the contact | adherence image sensor which shows the structure of Embodiment 1 of this invention, (a) is a front view, (b) is a side view, (c) is the lower part of the front view of the part enclosed by (circle) of the front view. It is an enlarged view which shows the structure seen from. It is a figure which illustrates the magnitude | size of the 1st and 2nd adhesive agent storage part in an actual size, (a) is a front view, (b) is a side view. It is explanatory drawing which shows the effect of Embodiment 1 in contrast with the conventional sensor IC apparatus. It is a top view which shows the structure of Embodiment 2 of this invention. It is a top view which shows the structure of Embodiment 3 of this invention.

Explanation of symbols

1 substrate, 1A adhesive part, 2A, 2B, 2C sensor IC, 3 adhesive,
4 First adhesive reservoir 5A, 5B Second adhesive reservoir 6
Wire pad, 7 Wiring pattern, 8 Gold wire, 10A, 10B, 11A, 11B Bank, 12A, 12B Substrate near the wire pad.

Claims (3)

  A substrate, a plurality of sensor ICs arranged linearly on the substrate via a gap and fixed to the substrate by an adhesive, and a first bond formed at a location corresponding to the gap of the substrate The second adhesive formed on the both sides in the sensor IC arrangement direction of the first adhesive reservoir portion and the first adhesive reservoir portion with a predetermined gap between the first adhesive reservoir portion and the first adhesive reservoir portion. A sensor IC device comprising an agent reservoir.   2. The sensor IC device according to claim 1, wherein the second adhesive reservoir portion is formed in a ring shape.   A wire pad is formed on the sensor IC to electrically connect the sensor IC to the wiring pattern on the substrate, and the second adhesive reservoir is substantially L-shaped so as to avoid the wire pad. The sensor IC device according to claim 1, wherein the sensor IC device is formed as described above.

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