JP2008177289A5 - - Google Patents

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Publication number
JP2008177289A5
JP2008177289A5 JP2007008306A JP2007008306A JP2008177289A5 JP 2008177289 A5 JP2008177289 A5 JP 2008177289A5 JP 2007008306 A JP2007008306 A JP 2007008306A JP 2007008306 A JP2007008306 A JP 2007008306A JP 2008177289 A5 JP2008177289 A5 JP 2008177289A5
Authority
JP
Japan
Prior art keywords
film
forming
substrate processing
light
film formation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007008306A
Other languages
English (en)
Japanese (ja)
Other versions
JP4361568B2 (ja
JP2008177289A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007008306A priority Critical patent/JP4361568B2/ja
Priority claimed from JP2007008306A external-priority patent/JP4361568B2/ja
Priority to TW097100472A priority patent/TW200849455A/zh
Priority to KR1020080003358A priority patent/KR100967923B1/ko
Priority to CN2008100023991A priority patent/CN101226877B/zh
Publication of JP2008177289A publication Critical patent/JP2008177289A/ja
Publication of JP2008177289A5 publication Critical patent/JP2008177289A5/ja
Application granted granted Critical
Publication of JP4361568B2 publication Critical patent/JP4361568B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007008306A 2007-01-17 2007-01-17 基板処理装置および基板処理方法 Expired - Fee Related JP4361568B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007008306A JP4361568B2 (ja) 2007-01-17 2007-01-17 基板処理装置および基板処理方法
TW097100472A TW200849455A (en) 2007-01-17 2008-01-04 Apparatus and method for processing substrate
KR1020080003358A KR100967923B1 (ko) 2007-01-17 2008-01-11 기판 처리 장치 및 기판 처리 방법
CN2008100023991A CN101226877B (zh) 2007-01-17 2008-01-17 基板处理装置及基板处理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007008306A JP4361568B2 (ja) 2007-01-17 2007-01-17 基板処理装置および基板処理方法

Publications (3)

Publication Number Publication Date
JP2008177289A JP2008177289A (ja) 2008-07-31
JP2008177289A5 true JP2008177289A5 (enrdf_load_stackoverflow) 2008-10-02
JP4361568B2 JP4361568B2 (ja) 2009-11-11

Family

ID=39704110

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007008306A Expired - Fee Related JP4361568B2 (ja) 2007-01-17 2007-01-17 基板処理装置および基板処理方法

Country Status (4)

Country Link
JP (1) JP4361568B2 (enrdf_load_stackoverflow)
KR (1) KR100967923B1 (enrdf_load_stackoverflow)
CN (1) CN101226877B (enrdf_load_stackoverflow)
TW (1) TW200849455A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100988667B1 (ko) 2009-01-23 2010-10-18 장석호 발전 효율과 회전력 향상이 이루어진 발전장치
JP4681084B1 (ja) * 2010-02-23 2011-05-11 株式会社テオス Ｃｖｄ処理方法およびその方法を使用するｃｖｄ装置
JP5902073B2 (ja) * 2012-09-25 2016-04-13 株式会社日立国際電気 半導体装置の製造方法、基板処理方法及び基板処理装置
CN107217240A (zh) * 2017-07-11 2017-09-29 江苏星特亮科技有限公司 一种石墨烯薄膜的制备方法
CN109402575A (zh) * 2018-12-27 2019-03-01 北京铂阳顶荣光伏科技有限公司 基座以及蒸镀设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05235391A (ja) * 1991-03-07 1993-09-10 Mitsubishi Electric Corp 薄膜太陽電池及びその製造方法並びに半導体装置の製造方法
JPH1126470A (ja) * 1997-07-08 1999-01-29 Sony Corp 半導体基板、半導体装置および太陽電池、半導体基板の製造方法および薄膜半導体の製造方法、半導体基板に対する処理装置
JP4433858B2 (ja) * 2004-03-31 2010-03-17 パナソニック電工株式会社 電子源装置

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