JP2008166620A - Circuit device and digital broadcast receiver - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide circuit device having an external connection electrode suitable for plug-in mounting, and to provide a digital broadcast receiver. <P>SOLUTION: The plug-in mounting circuit device 11 comprises a wiring board 12 provided with wiring layers on the upper surface (first major surface) and the lower surface (second major surface), and a semiconductor element 34 or the like and a package 14 or the like arranged on the upper and lower surfaces of the wiring board 12. A large number of external connection electrodes are provided along one side of the wiring board 12, and the area of an external connection electrode to which a fixed potential is applied is made larger that of the other external connection electrode. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a circuit device and a digital broadcast receiving device, and more particularly to an insertion mounting type circuit device and a digital broadcast receiving device.

  Along with the downsizing and higher functionality of electronic equipment, circuit devices housed therein are mainly provided with multiple wiring layers. A circuit device having a multilayer substrate 207 will be described with reference to FIG.

  Here, a circuit device is configured by mounting circuit elements such as a package 205 on the first wiring layer 202A formed on the upper surface of the multilayer substrate 207.

  In the multilayer substrate 207, wiring layers are formed on the front surface and the back surface of the base material 201 made of a resin such as glass epoxy. Here, the first wiring layer 202A and the second wiring layer 202B are formed on the upper surface of the base material 201. The first wiring layer 202A and the second wiring layer 202B are stacked with an insulating layer 203 interposed therebetween. A third wiring layer 202 </ b> C and a fourth wiring layer 202 </ b> D are stacked on the lower surface of the base material 201 with an insulating layer 203 interposed therebetween. In addition, each wiring layer is connected at a predetermined location by a connecting portion 204 provided through the insulating layer 203.

  A package 205 is fixed to the uppermost first wiring layer 202A. Here, a package 205 in which a semiconductor element 205A is sealed with a resin is surface-mounted through a connection electrode 206 made of solder or the like. In addition to the package 205, passive elements such as chip capacitors and chip resistors, bare semiconductor elements, and the like may be mounted on the surface of the multilayer substrate 207. Here, the thickness of the multilayer substrate 207 is, for example, about 1.0 mm.

  In the circuit device having the above-described configuration, a bonding material such as solder is welded to the pad-shaped fourth wiring layer 202D formed on the lower surface of the multilayer substrate 207, and is mounted on a mother board such as a computer or a television. Such a mounting form is generally called surface mounting.

  As one of the sets in which the above-described circuit device is incorporated, for example, there is a broadcast receiving device (television). In general, when a circuit device is incorporated in a broadcast receiving device, the circuit device is mounted on a substrate housed inside a housing of the broadcast receiving device. In the current analog television, electronic components such as a tuner and a capacitor are mounted on the upper surface of a mounting board made of paper phenol or the like in which a single-layer conductive path is formed, and are electrically connected to each other. Yes.

  On the other hand, in recent years, broadcasting has been digitized due to advances in video compression technology and digital technology. In digital broadcasting, in addition to television broadcasting and audio broadcasting, data broadcasting that distributes data such as text information and stop-picture information is performed. Is called. As for terrestrial television broadcasting, analog broadcasting will eventually be terminated and it will be planned to shift to digital broadcasting.

One method for mounting a circuit device on a mounting board is plug-in mounting. In this plug-in mounting, an electrode for external connection is provided at an end of a board on which a circuit element is mounted, and this electrode is provided. The printed circuit board is inserted into the motherboard. A technique relating to this insertion mounting is described in, for example, Patent Document 2 below. Referring to FIG. 1 of Patent Document 2, a cut portion is provided in the first printed circuit board 21, and a second printed circuit board 41 is inserted and mounted in the cut portion. By performing such insertion mounting, it is possible to reduce the area required for mounting as compared with the case of surface mounting, and it is possible to improve the mounting density on the mother board side to be inserted and mounted.
JP 2002-182270 A JP 2000-31615 A

  However, in the above-described insertion mounting, the external connection electrodes provided at the end of the board on the side to be inserted are uniformly small and are only fixed to the conductive path of the motherboard via solder. There is a problem in that the resistance of the connecting portion to be connected is high, resulting in a large current transmission loss. In particular, this problem is remarkable in the electrode to which the ground potential or the power supply potential is applied because the flowing current is large.

  Furthermore, in the above-described insertion mounting type circuit device, if the front / back determination is wrong, a “reverse insertion” that causes the circuit device to be inserted into the motherboard in the opposite direction will occur, and the inserted substrate There is a problem that the circuit element placed on the circuit board cannot be operated normally.

  Furthermore, the external connection electrodes provided in a normal plug-mount circuit device are continuously formed from the front surface to the back surface on the side of the circuit device substrate. For this reason, it has been very difficult to form a large number of external connection electrodes on one side of a substrate to be plugged in.

  For the above reasons, there is a problem that it is difficult to apply the plug-in mounting type circuit device to the digital broadcast receiving device.

  The present invention has been made in view of such problems, and a main object of the present invention is to provide a circuit device and a digital broadcast receiving device having external connection electrodes having a configuration suitable for plug-in mounting. is there.

  The circuit device of the present invention includes a wiring board having a wiring layer provided on a surface thereof, a plurality of external connection electrodes including the wiring layer provided along one side of the wiring board to be plugged and mounted, and the wiring board And a circuit element electrically connected to the wiring layer, wherein the external connection electrode to which a fixed potential is applied has a larger area than the other external connection electrodes.

  Further, the circuit device of the present invention includes a wiring board having a wiring layer provided on a surface thereof, a plurality of external connection electrodes including the wiring layer provided along one side of the wiring board to be plugged and mounted, and the wiring And a circuit element electrically connected to the layer, and a slit formed by partially cutting out the wiring board in a region where the external connection electrode is disposed.

  Furthermore, the circuit device of the present invention includes a wiring board in which a first wiring layer is provided on a first main surface, and a second wiring layer is provided on a second main surface opposite to the first main surface; A first circuit element electrically connected to one wiring layer; a second circuit element electrically connected to the second wiring layer; and the first circuit element provided on the wiring substrate in a region to be plugged in. A first external connection electrode composed of a wiring layer and a second external connection electrode composed of the second wiring layer, and the first external connection electrode and the second external connection electrode overlapping in the thickness direction of the wiring substrate. The method is characterized by inputting and outputting different signals.

  The digital broadcast receiving apparatus of the present invention is a digital broadcast receiving apparatus that generates a video signal by performing demodulation and decoding of a received signal of a digital broadcast, which includes a mounting board and an electronic component disposed on the mounting board. The circuit device included in the electronic component includes a wiring board provided with a wiring layer on a surface thereof, and a plurality of external connection electrodes including the wiring layer provided along one side of the wiring board to be plugged and mounted. And a circuit element electrically connected to the wiring layer of the wiring board, wherein the external connection electrode to which a fixed potential is applied has a larger area than the other external connection electrodes. .

  Furthermore, the digital broadcast receiving apparatus of the present invention is a digital broadcast receiving apparatus that includes a mounting board and an electronic component disposed on the mounting board and generates a video signal by demodulating and decoding the received signal of the digital broadcasting. The circuit device included in the electronic component includes a plurality of external connection electrodes including a wiring board having a wiring layer provided on a surface thereof and the wiring layer provided along one side of the wiring board to be plugged and mounted. And a circuit element electrically connected to the wiring layer, and a slit formed by partially cutting out the wiring board in a region where the external connection electrode is disposed.

  Furthermore, the digital broadcast receiving apparatus of the present invention is a digital broadcast receiving apparatus that includes a mounting board and an electronic component disposed on the mounting board and generates a video signal by demodulating and decoding the received signal of the digital broadcasting. The circuit device included in the electronic component includes a wiring board in which a first wiring layer is provided on a first main surface and a second wiring layer is provided on a second main surface opposite to the first main surface; A first circuit element electrically connected to the first wiring layer, a second circuit element electrically connected to the second wiring layer, and the wiring board in a region to be plugged in A first external connection electrode comprising the first wiring layer and a second external connection electrode comprising the second wiring layer, wherein the first external connection electrode and the second external electrode overlap each other in the thickness direction of the wiring board. Input and output different signals from the connection electrode Characterized in that to.

  According to the circuit device and the digital broadcast receiving device of the present invention, the width of the external connection electrode (fixed potential electrode) to which the ground potential or the power supply potential is applied is wider than the external connection electrode through which other types of signals pass. ing. Therefore, when this circuit device is inserted and mounted via solder or the like, the area where the conductive path on the mounting substrate side contacts the fixed potential electrode of the circuit device can be increased, and the resistance value of the connection portion can be reduced. Can do. Since the fixed potential electrode is an electrode through which a large current passes as compared with other external connection electrodes, the current transmission loss is reduced by configuring in this way.

  Furthermore, in the present invention, a slit is provided by partially removing the wiring board of the circuit device to be inserted and mounted. As a result, the circuit device cannot be inserted in the original orientation, so that so-called reverse insertion can be prevented.

  Furthermore, according to the present invention, the first external connection electrode and the second external connection electrode are provided on the first main surface and the second main surface of the wiring board that is mounted by insertion, and different signals from both external connection electrodes that are superimposed. Can be input and output. Therefore, a large number of input / output terminals can be provided on both main surfaces of the wiring board, and a more versatile system can be built in the circuit device.

<First Embodiment>
In the present embodiment, a configuration of the circuit device 11, a structure in which the circuit device 11 is inserted and mounted, and a function built in the circuit device will be described with reference to FIGS.

  With reference to FIG. 1 and FIG. 2, the structure of the circuit device 11 of this Embodiment is demonstrated first. 1A and 1B are plan views of the circuit device 11, and FIG. 1C is an enlarged plan view of the circuit device 11 in a region where the first external connection electrode 18A is provided. 2 is a cross-sectional view of the circuit device 11. Here, FIG. 1A is a plan view of the circuit device 11 shown in FIG. 2 viewed from below, and FIG. 1B is a plan view of the circuit device 11 viewed from above.

  1 and 2, a circuit device 11 includes a wiring board 12 having wiring layers provided on an upper surface (first main surface) and a lower surface (second main surface), and an upper surface of the wiring board 12. And a plug-in circuit device including the semiconductor element 34 and the like disposed on the lower surface and the package 14 and the like. A large number of external connection electrodes are provided along one side of the wiring board 12, and the area of the external connection electrodes to which a fixed potential is applied is made larger than the others.

  Referring to FIG. 2, wiring board 12 includes a base material 22 having a wiring layer formed on the lower surface and the upper surface. Here, the base material 22 is made of a resin-based material such as glass epoxy in which a fibrous filler (for example, glass fiber) is impregnated with an epoxy resin, and is bent or cracked even when pressure is applied during insertion mounting. Has no mechanical strength. For example, a glass epoxy substrate having a thickness of about 0.5 mm to 1.0 mm has sufficient mechanical strength and can be used as the base material 22.

  A wiring layer is formed on the upper surface and the lower surface of the base material 22 described above. Here, two wiring layers comprising a first wiring layer 24 and a second wiring layer 26 are laminated on the upper surface of the base material 22, and from the third wiring layer 28 and the fourth wiring layer 30 on the lower surface of the base material 22. The two wiring layers are stacked, and a total of four wiring layers are provided. Here, the wiring layers are laminated via an insulating layer made of resin. Further, the first wiring layer 24 and the second wiring layer 26 are connected to each other at a predetermined location by a connecting portion 58 made of a plating film or the like provided so as to penetrate the insulating layer. The third wiring layer 28 and the fourth wiring layer 30 are also electrically connected at a predetermined location by a connection portion 60 made of a plating film provided through the insulating layer.

  Further, the second wiring layer 26 and the third wiring layer 28 provided on the upper surface and the lower surface of the base material 22 are formed at predetermined positions by a through connection portion 44 made of a plating film or the like provided through the base material 22 in the thickness direction. Connected with.

  Here, a total of four multilayer wirings are provided on the upper surface and the lower surface of the base material 22, but the total number of wiring layers formed may be other than four layers. For example, one wiring layer may be provided on each of the upper surface and the lower surface of the base material 22 to form a total of two wiring layers, or a total of five or more wiring structures may be configured.

  The first wiring layer 24 described above is covered with a coating resin 42 except for a region that becomes an electrical connection region (pad). Specifically, referring to FIG. 2, the first wiring layer 24 formed on the upper surface of the base material 22 is covered with a coating resin 42, and the upper surface of the pad that is a part of the first wiring layer 24 is the coating resin. It is exposed without being covered with 42. Furthermore, the upper surface of the pad exposed from the coating resin 42 is covered with a plating film made of, for example, gold plating. The fourth wiring layer 30 formed on the lower surface of the base material 22 is covered with the coating resin 40, and the surface of the pad that is a part of the fourth wiring layer 30 is partially exposed from the coating resin 40. . Here, the coating resin 42 covering the first wiring layer 24 does not cover the entire surface of the wiring substrate 12, and the coating resin 42 is not formed in the peripheral portion of the upper surface of the wiring substrate 12. The peripheral portion of the exposed wiring board 12 is covered with a sealing resin 20.

  Referring to FIGS. 1A and 2, the lowermost fourth wiring layer 30 formed on the lower surface of the wiring board 12 includes, as circuit elements, a package 14, a chip element 38, and crystal oscillators 54 and 56. Are electrically connected.

  The structure of the package 14 will be described with reference to FIG. 2. The semiconductor element 32 fixed to the land is sealed with resin, and a plurality of leads 48 electrically connected to the semiconductor element 32 are opposed to the package 14. Are derived from two sides. Then, the lead 48 of the package 14 is bonded to the upper surface of the pad made of the fourth wiring layer 30 via a conductive adhesive (bonding material) such as solder. Further, the sealing resin for sealing the semiconductor element 32 of the package 14 has a flat upper surface. Here, as the semiconductor element 32 incorporated in the package 14, for example, a semiconductor memory such as a DDR SDRAM (Double Data Rate SDRAM) can be considered.

  Furthermore, the chip element 38 is a bypass capacitor, a chip resistor or the like for noise reduction, and electrodes at both ends are joined to the pad via solder.

  Further, referring to FIG. 1A, the crystal oscillators 54 and 56 are bonded together with other circuit elements to a pad made of the fourth wiring layer 30 via a bonding material. The crystal oscillators 54 and 56 are elements that generate a clock (pulse signal) for operating the semiconductor element 34 and the like. Specifically, the crystal oscillator 54 generates a clock for the semiconductor element 34 to perform various calculations, and is a metal package. Furthermore, the crystal oscillator 54 is voltage-controlled by a built-in IC, and an extremely accurate clock is generated. The clock generated by the crystal oscillator 54 is also supplied to the semiconductor element 32 incorporated in the package 14. Further, a clock may be supplied from the semiconductor element 34 located on the upper surface of the wiring board 12 to the semiconductor element 32 built in the package 14. On the other hand, the crystal oscillator 56 is a resin-sealed package, and the semiconductor element 34 mounted on the opposite surface of the wiring board 12 generates a clock required for demodulating a received signal of digital broadcasting. Yes. The crystal oscillator 54 and the crystal oscillator 56 differ in the frequency of the generated clock.

  Here, as the circuit elements connected to the fourth wiring layer 30, in addition to the above-described elements, there are a resin-sealed package arranged by surface mounting, a semiconductor element (LSI) mounted by flip chip mounting, and the like. It can be adopted. Furthermore, all circuit elements connected to the fourth wiring layer 30 may be surface-mounted by a reflow process using a bonding material made of solder. As a result, the mounting process can be facilitated.

  Referring to FIG. 2, semiconductor elements 34 and 36 are connected to the first wiring layer 24 formed on the upper surface of the wiring board 12. The semiconductor element 34 is, for example, an LSI that performs signal processing of an input signal of a digital broadcast that is input, and a large number of about 500 electrodes are formed on the surface thereof. The semiconductor element 34 is arranged face-up on the upper surface of the wiring substrate 12, and its electrode is connected to a pad made of a part of the first wiring layer 24 via a thin metal wire 46. On the other hand, the semiconductor element 36 is, for example, a semiconductor memory (a flash memory as a specific example). The semiconductor element 36 is mounted face-up, and the electrode on the surface is connected to the pad formed of the first wiring layer 24 via the fine metal wire 46. Here, all the semiconductor elements connected to the first wiring layer 24 are connected face-up and connected using the metal thin wire 46, whereby the cost for mounting can be reduced. However, if the pitch between the electrodes of the semiconductor element 34 is, for example, about 80 μm or more, the semiconductor elements 34 and 36 may be flip-chip mounted by flip-chip mounting using bump electrodes.

  The sealing resin 20 is made of a thermosetting resin or a thermoplastic resin, and is formed so as to cover the upper surface of the wiring board 12 and the semiconductor elements 34 and 36 disposed thereon in FIG. In order to improve the heat dissipation of the semiconductor element 34 and the like, the sealing resin 20 may be made of a resin material mixed with an inorganic filler such as silica. As a method for forming the sealing resin 20, transfer molding, injection molding, potting, and the like are conceivable. Referring to FIG. 1B, the three sides (upper side, right side, and lower side) of the wiring board 12 are covered with the sealing resin 20 up to the terminal portion of the wiring board 12. On the other hand, the peripheral portion of the wiring substrate 12 on the left side where a large number of first external connection electrodes 18A are provided is not formed with the sealing resin 20, and the first external connection electrode 18A and the peripheral portion of the wiring substrate 12 are provided. The main surface is exposed to the outside. This is because the wiring board 12 in the region where the first external connection electrode 18A is provided is inserted and mounted on the mother board (mounting board). Here, by forming the sealing resin 20, there is an advantage that the mechanical strength of the entire device is reinforced and bending or the like when the circuit device 11 is inserted and mounted is suppressed.

  Furthermore, since the upper surface of the sealing resin 20 formed by transfer molding using a mold is a flat surface, a heat radiator is brought into contact with the flat surface of the sealing resin 20 to generate from the semiconductor element 34 or the like. The heat to be released can be released to the outside via the sealing resin 20 and the radiator. Here, referring to FIG. 2, semiconductor elements 34 and 36 connected via thin metal wires 46 are arranged on the upper surface of wiring substrate 12, and semiconductor elements 34 and 36 and thin metal wires 46 are sealed. Thus, the sealing resin 20 is formed. As a result, the semiconductor elements 34 and 36 and the fine metal wire 46 are covered and protected by the sealing resin 20, so that damage to the semiconductor element 34 and disconnection / deformation of the fine metal wire 46 are suppressed.

  On the other hand, referring to FIG. 2, the elements arranged on the lower surface of wiring substrate 12 are package 14 and chip element 38 and are not sealed by the sealing resin and exposed to the outside. All (or most) of these circuit elements are surface-mounted using a conductive adhesive such as solder, and there is a danger of short-circuiting compared to the semiconductor element 34 or the like connected by a thin metal wire. Is a low circuit element. Therefore, manufacturing cost can be reduced by not covering such a circuit element with sealing resin.

  Further, referring to FIG. 1A, cut portions 50 in which the wiring board 12 is partially removed are provided at both ends of the wiring board 12 where the second external connection electrodes 18B are provided. For this reason, the width of the portion of the wiring board 12 where the external connection electrode 18 is provided (the length in the vertical direction of this portion on the paper surface) is shorter than the other portions of the wiring board 12. Therefore, when the wiring board 12 is inserted and mounted, the terminal portion of the cut portion 50 abuts on the mounting board on the side to be inserted and mounted, and functions as a stopper that suppresses excessive insertion of the wiring board 12.

  The above is the schematic configuration of the circuit device 11.

  Here, the external connection electrodes provided in the circuit device 11 will be described.

  In the circuit device 11 according to the present embodiment, a plurality of external connection electrodes arranged in parallel to one side of the wiring board 12 are provided as electrodes for insertion mounting. In the present embodiment, as shown in FIG. 2, the first external connection electrode 18A composed of the first wiring layer 24 is provided on the upper surface of the wiring board 12, and the second external connection electrode composed of the fourth wiring layer 30 is provided on the lower surface. 18B is provided.

  Referring to FIGS. 1A and 1B, a large number of external connection electrodes (first external connection electrode 18A and second external connection electrodes 18A and 2B are formed along one side of the wiring board 12 (the left side in the figure). An external connection electrode 18B) is provided. These external connection electrodes include, for example, the first wiring layer 24 or the fourth wiring layer 30 formed in a pad shape of about vertical × horizontal = 1.0 mm × 2.0 mm. Here, the external connection electrodes 18 are provided on both the upper surface and the lower surface along one side of the wiring substrate 12, but the external connection electrodes may be provided only on one of the surfaces. The upper surface of the external connection electrode is covered with a plating film such as gold plating in order to prevent corrosion and improve solder wettability.

  Referring to FIG. 1C, the first external connection electrode 18 </ b> A is provided in a large number along the side in the peripheral portion of the wiring board 12. As described above, the specific planar size of the first external connection electrode 18A is vertical (L4) × horizontal (L1) = 2.0 mm × 1.0 mm. The distance (L2) at which the first external connection electrodes 18A are separated from each other may be about the same as the width L1 of the first external connection electrodes 18A, for example, about 0.8 mm to 1.2 mm. Thus, by separating the first external connection electrodes 18A at equal intervals, the design of the wiring board 12 of the circuit device 11 and the design of the conductive path on the mounting board side on which the circuit device 11 is inserted and mounted can be simplified. Can be easily.

  The first external connection electrode 18A can be broadly divided into a fixed potential electrode 17 to which a fixed potential (ground potential or power supply potential) is applied and a signal electrode 19 to which other electric signals are applied. Here, the other electrical signals are, for example, digital signals for switching TV channels, analog audio signals and video signals output to the outside, received digital broadcast signals obtained from tuners, etc. Can be considered. Since the fixed potential electrode 17 has a larger current value to pass than the signal electrode 19, the area of the fixed potential electrode 17 is made larger than that of the signal electrode 19 in the present embodiment.

  Specifically, referring to FIG. 1C, the height (L 4) of fixed potential electrode 17 is the same as that of signal electrode 19, and the width (L 3) is wider than that of signal electrode 19. As an example, the width (L3) of the fixed potential electrode 17 is a length obtained by adding the width (L1) of the two signal electrodes 19 and the width (L2) at which they are separated from each other. That is, the mathematical formula L3 = L1 × 2 + L2 holds. In this way, all the first external connection electrodes 18A including the wide fixed potential electrode 17 can be arranged at regular intervals. Here, when a fixed potential electrode 17 having a wider width is required, for example, the width may be set to a length obtained by adding three signal electrodes 19 and two gaps therebetween.

  A plurality of fixed potential electrodes 17 having the above-described configuration are provided on both main surfaces of the wiring board 12. For example, when the circuit device 11 includes a digital circuit that processes a digital signal and an analog circuit that processes an analog signal, each circuit requires a ground potential and a power supply potential. A potential electrode 17 is provided. Furthermore, in a digital circuit, a plurality of power supply potentials having different potentials and a corresponding ground potential may be required. In this case, a larger number (eg, 6 or 8) is required. The fixed potential electrode 17 is provided.

  Here, the signal electrode 19 and the fixed potential electrode 17 having the same configuration as described above are also provided on the second external connection electrode 18B provided on the surface facing the first external connection electrode 18A.

  As described above, by making the area of the fixed potential electrode 17 to which the ground potential or the power supply potential is applied larger than that of the other external connection electrodes, the cross-sectional area of the connection portion connecting the fixed potential electrode 17 and the outside is increased. Thus, power loss can be reduced. In particular, since a relatively large current passes through the fixed potential electrode 17 to which the ground potential or the power supply potential is applied, the effect of reducing the power loss by increasing the area of the fixed potential electrode 17 is great.

  Furthermore, by increasing the area of the fixed potential electrode 17, a larger amount of solder can be attached to the fixed potential electrode 17 when the circuit device 11 is plugged and mounted on the mounting substrate. As a result, the fixed potential electrode 17 of the circuit device 11 and the conductive path on the mounting substrate side are firmly bonded by a large amount of solder, and the both are prevented from peeling off.

  Next, the structure of the circuit module 10 in which the circuit device 11 having the above-described configuration is inserted and mounted on the mounting substrate 110 will be described with reference to FIG. FIG. 3A is a perspective view showing the circuit module 10, and FIG. 3B is a plan view of a region where the circuit device 11 is mounted as viewed from below. In FIG. 3A, in order to clearly show the related configuration of the circuit device 11 and the mounting substrate 110 constituting the circuit module 10, these are shown separately, but in reality, the connection region 13 of the circuit device 11 is shown. Are inserted into the openings 15 and 16 of the mounting substrate 110.

  Referring to FIG. 3A, as described above, the circuit device 11 includes a wiring board 12 provided with a circuit element such as a package on the surface, and a surface of the wiring board 12 so that the circuit element is sealed. And a sealing resin 20 for coating. Further, a part of the lower side of the wiring board 12 protrudes downward (outside) from the sealing resin 20, and a large number of external connection electrodes 18 are provided on the surface of the wiring board 12 in this part. The portion of the wiring board 12 provided with the external connection electrodes 18 becomes a connection region 13 that is inserted into the mounting board 110 and used for connection.

  The mounting substrate 110 is provided with openings 15 and 16 for inserting and mounting the circuit device 11. The widths of the openings 15 and 16 are such that the connection region 13 of the wiring board 12 can be inserted, and specifically, about 0.7 mm to 1.5 mm, which is equal to or greater than the thickness of the wiring board 12 to be inserted. There must be.

  In the present embodiment, a slit 52 is provided in the wiring board 12 of the circuit device 11 in order to prevent “reverse insertion” that causes the circuit device 11 to be inserted in the opposite direction to the original. Specifically, the slit 52 is provided by partially removing the connection region 13 of the wiring board 12. The position of the slit 52 is provided at a portion excluding the central portion in the horizontal direction of the circuit device 11 (position biased to the left or right). The horizontal width of the slit 52 is, for example, about 3.0 mm, and is longer than the distance (for example, about 0.8 mm) that the external connection electrodes 18 are separated from each other. Furthermore, the openings 15 and 16 provided by partially penetrating and removing the mounting substrate 110 are not provided in a region corresponding to the slit 52. With such a configuration, the circuit device 11 can be mounted on the mounting substrate 110 only when the circuit device 11 faces the correct direction. On the other hand, if the circuit device 11 is to be inserted into the mounting substrate 110 in the direction opposite to the original direction, the connection region 13 and the openings 15 and 16 do not match, and the insertion itself is not possible.

  Referring to FIG. 3B, external connection electrodes 18 provided on both main surfaces of wiring substrate 12 of circuit device 11 are connected to conductive paths 112 formed on the back surface of mounting substrate 110. Specifically, the first external connection electrode 18 </ b> A and the second external connection electrode 18 </ b> B are provided on both main surfaces of the wiring substrate 12 at the portions inserted into the openings 15 and 16 of the mounting substrate 110. The first external connection electrode 18A and the second external connection electrode 18B provided on the opposing surfaces of the wiring board 12 are separately connected to the conductive path 112 of the mounting board 110. That is, even if the first external connection electrode 18A and the second external connection electrode 18B are located at a place where they overlap each other in the thickness direction of the wiring board 12, they are not continuous, and different electric signals are input / output individually. Is possible. Each external connection electrode and the conductive path 112 are electrically connected using a bonding material such as solder.

  Further, the conductive path 112A connected to the fixed potential electrode 17 provided on the wiring board 12 may be thicker than the other conductive paths 112A.

  Here, the mounting method of the circuit device 11 on the mounting substrate 110 is as follows. First, a mounting substrate 110 is prepared in which openings 15 and 16 having a predetermined size are provided and the conductive path 112 is provided on the lower surface. Next, the connection region 13 of the circuit device 11 is inserted into the openings 15 and 16 of the mounting substrate 110. At this time, the circuit device 11 is not soldered to the mounting substrate 110 and is temporarily fixed. Further, the mounting substrate 110 to which the circuit device 11 is temporarily fixed is immersed in a solder bath made of molten solder, and the conductive path 112 formed on the back surface of the mounting substrate 110 and the external connection electrode 18 of the circuit device 11. Solder between the two. Next, after the mounting substrate 110 is pulled up from the solder layer, it is exposed to room temperature, and the solder attached to the mounting substrate 110 is cooled and solidified. The circuit device 11 is mounted on the mounting substrate 110 through the above steps.

  In the above process, since only the connection region 13 between the mounting substrate 110 and the circuit device 11 is in contact with the solder layer, heat generated from the melted solder is transferred to the wiring substrate 12 of the circuit device 11. The circuit element incorporated in the circuit device 11 is not heated so much. Therefore, it can suppress that the circuit element incorporated in the circuit apparatus 11 deteriorates by the heating at the time of mounting.

  Next, the configuration of the wiring layer provided on the wiring substrate 12 of the circuit device 11 shown in FIG. 1 and the like will be described with reference to FIG. 4A is a plan view of the first wiring layer 24 that is the uppermost layer, and FIG. 4B is a plan view of the fourth wiring layer that is the lowermost layer. These drawings are views of the circuit device 11 shown in FIG. 2 as viewed from above (surface on which the sealing resin 20 is formed).

  Referring to FIG. 4A, the first wiring layer 24 includes pads 62 and 66, wiring 64, a conductive pattern 68, and a first external connection electrode 18A. Here, the region where the semiconductor elements 34 and 36 are mounted is indicated by a dotted line. The pad 66 is provided in the peripheral part of the semiconductor element 36 and is connected to a metal thin line (not shown). Further, for example, about 500 pads 62 are arranged so as to surround the semiconductor element 34 which is a system LSI for processing a received signal of digital broadcasting.

  Further, the pad 62 is connected to the connection portion 58 via a wiring 64 made of the first wiring layer 24 formed to be elongated. Here, referring to FIG. 2, the connection portion 58 is a portion that penetrates the insulating layer and connects the first wiring layer 24 and the second wiring layer 26 below the first wiring layer 24. The same applies to the pad 66. Further, the semiconductor element 34 and the semiconductor element 36 are connected by connecting the pad 66 and the pad 62 via the wiring 64.

  Furthermore, a first external connection electrode 18 </ b> A composed of a part of the first wiring layer 24 is provided along the lower side surface of the wiring substrate 12. The first external connection electrode 18A is connected to the semiconductor elements 34 and 36 via the wiring 64 and the pad 62 described above.

  In the region where the pad 62 or the like is not provided, a conductive pattern 68 composed of a solid first wiring layer 24 that is not patterned is provided. Further, the conductive pattern 68 functions as a shield layer by being connected to a fixed potential (for example, ground potential or power supply potential) via a wiring or the like, and absorbs noise generated from circuit elements such as the semiconductor element 34. Can be reduced. Also, by providing the conductive pattern 68, the residual rate of the conductive material such as copper having excellent thermal conductivity is increased, the thermal conductivity of the wiring board 12 itself is improved, and the heat dissipation of the entire circuit device is improved. be able to. Furthermore, by providing the conductive pattern 68 in each wiring layer provided on the wiring board 12, the ratio of the pattern remaining to the area of the wiring board 12 in each wiring layer can be made substantially constant. The effect which reduces the curvature which generate | occur | produces when 12 is heated is also anticipated.

  Further, a removal portion 76 is provided by partially removing the conductive pattern 68. The removal portions 76 are provided in a matrix at regular intervals over almost the entire area of the conductive pattern 68, and each removal portion 76 has a rhombus shape. In other words, by providing the removal portion 76, the conductive pattern 68 has a mesh shape (mesh shape). Thus, by providing the removal part 76 in the conductive pattern 68, the thickness of the insulating material (for example, the coating resin 42 shown in FIG. 2) covering the first wiring layer 24 can be made uniform. Furthermore, it is possible to suppress delamination (a phenomenon in which the base material of the wiring board expands) that easily occurs during reflow.

  Referring to FIG. 4B, the fourth wiring layer 30 includes a pad 70 connected to a circuit element, a wiring 72 and a connection portion 60, a conductive pattern 74, and a second external connection electrode 18B. Crystal oscillators 54 and 56, a chip element 38, a package 14, and a connector 80 are mounted on the fourth wiring layer 30, and these elements are indicated by dotted lines here. The pad 70 includes a fourth wiring layer 30 formed in a quadrangular shape, and circuit elements such as the crystal oscillator 54 are surface-mounted. Therefore, the pad 70 is provided by a wire bonding pad 62 provided in the first wiring layer 24. Is also formed large. Further, the pad 70 is connected to the connection portion 60 via the wiring 72 formed of the fourth wiring layer 30 formed to be thin. Here, referring to FIG. 2, the connection portion 60 is a portion that penetrates through the interlayer insulating film and connects the fourth wiring layer 30 and the third wiring layer 28. Furthermore, the circuit elements (for example, the package 14 and the chip element 38) fixed to the fourth wiring layer 30 may be electrically connected by connecting the pads 70 to each other via the wiring 72.

  Further, the conductive pattern 74 is also formed on the fourth wiring layer 30 as in the first wiring layer 24 described above. Also here, by providing the conductive pattern 74, the remaining rate of the pattern in the fourth wiring layer 30 is improved, the heat dissipation of the entire circuit device is improved, and the warp of the wiring board 12 due to heating can be suppressed. Furthermore, here, the conductive pattern 74 is partially removed to provide a removal portion 78, which improves the adhesion between the coating resin 40 covering the fourth wiring layer 30 and the wiring board 12.

  Furthermore, although a plan view is not shown here, in the second wiring layer 26 shown in FIG. 2, wirings that connect the connection portions 58 and the through-connection portions 44 are mainly configured. In a region where the wiring is not formed, a conductive pattern made of the second wiring layer 26 that is not patterned is formed, and the removal portion described above is also provided in this conductive pattern.

  Further, in the third wiring layer 28, wirings that connect the through connection portions 44 and the connection portions 60 are mainly formed. Further, the third wiring layer 28 is also provided with the conductive pattern and the removal portion having the above-described configuration.

  Here, referring to FIG. 4A, the external connection electrodes (first external connection electrode 18A and second external connection electrode 18B) provided on the lower surface of the wiring board 12 along the side edges receive analog signals. An analog electrode 23 for inputting / outputting and a digital electrode 21 for inputting / outputting a digital signal are included. In the present embodiment, all (or most) analog electrodes are concentrated and arranged on one side with the slit 52 as a boundary to prevent noise from being mixed into the analog signal passing through the analog electrode. Yes. Specifically, when noise is mixed in an analog signal passing through the analog electrode 23, an output video signal or audio signal is deteriorated. On the other hand, when a digital signal passes through the digital electrode 21, a large amount of noise may occur. Therefore, if the digital electrode 21 is provided close to the analog electrode 23, noise generated from the digital electrode 21 may be mixed into the analog signal passing through the analog electrode 23. For this reason, in this embodiment, all or most of the analog electrodes are concentrated on one side (left side in FIG. 4A) of the slit 52 provided by removing the wiring substrate 12. Here, the width of the slit 52 is longer than the distance at which the external connection electrodes 18 are separated from each other, and is, for example, about 3.0 mm to 5.0 mm. By doing in this way, it becomes possible to separate an analog electrode and a digital electrode with the wide width | variety of the slit 52, and it can suppress that the noise which generate | occur | produces from a digital electrode reaches an analog electrode.

  In the present embodiment, the slit 52 is formed at a position closer to the left side, the analog electrodes 23 are integrated on the left side of the slit 52, and the digital electrode 21 is provided on the right side. Here, it is not necessary that all the external connection electrodes 18 on the left side of the slit 52 be the analog electrodes 23, and the digital electrodes 21 may be disposed in this portion. However, in this case, the digital electrode 21 through which a digital signal passes is employed in which the amount of generated noise is smaller than that arranged on the right side of the slit 52 (that is, the frequency of the passing digital signal is low).

  Further, all of the first external connection electrodes 18 </ b> A located in the region on the right side of the slit 52 may be the digital electrodes 21. Since the digital signal is a signal that is strong against noise as compared with the analog signal, even if the digital electrodes 21 are densely packed, there is little possibility that they will adversely affect the noise.

  Next, a planar arrangement of the semiconductor element 34 and the crystal oscillators 54 and 56 will be described with reference to FIG. In FIG. 4B, the semiconductor element 34 is indicated by hatching without a frame. Here, the planar positions of the crystal oscillators 54 and 56 are in the vicinity of the semiconductor element 34. That is, the crystal oscillators 54 and 56 are disposed in the vicinity of the semiconductor element 34 on the surface of the wiring substrate 12 on the surface opposite to the surface on which the semiconductor element 34 is mounted. As a result, the crystal oscillators 54 and 56 and the semiconductor element 34 are connected at a short distance, so that the clock generated by the crystal oscillator can be prevented from being deteriorated and transmitted to the semiconductor element 34. Further, here, the crystal oscillators 54 and 56 are arranged in a region not overlapping with the semiconductor element 34. By doing so, it is possible to suppress the heat generated by the operation of the semiconductor element 34 from being transmitted to the crystal oscillators 54 and 56, and to suppress the deterioration of the clock generated from the crystal oscillators 54 and 56. On the other hand, the bypass capacitor included in the chip element 38 is less likely to be adversely affected by heat, and may be disposed in the vicinity of the semiconductor element 34 or directly below.

  FIG. 5 is a block diagram illustrating a configuration of the circuit device 11 that generates a video signal and the like from the received digital broadcast reception signal. With reference to this figure, the circuit device 11 includes a semiconductor element 34, a storage unit 82 (semiconductor element 36), crystal oscillators 54 and 56, and a storage unit 98 (semiconductor element 32). Further, in the semiconductor element 34, an A / D converter 84, a demodulator 86, a separator 88, a video decoder 90, an audio decoder 92, a caption decoder 94, a controller 96, an encoder 102, The D / A converter 100 is built in. The schematic function of the entire circuit device 11 will be described. The circuit device 11 generates an analog audio signal and a video signal from an input analog reception signal of a digital broadcast of a predetermined channel and outputs it to the outside.

  The details of the circuit device 11 processing the received signal of the digital broadcast are as follows. First, a digital broadcast reception signal of a predetermined channel is input to the A / D conversion unit 84 of the semiconductor element 34. The A / D conversion unit 84 generates a digital reception signal from the analog reception signal. The signal is transmitted to the demodulator 86. The circuit device 11 and the outside perform input / output of electrical signals via external connection electrodes (first external connection electrode 18A and second external connection electrode 18B) provided in the circuit device.

  The demodulator 86 demodulates the digital received signal and extracts the original data contained in the received signal. The extracted data is separated into video information, audio information, and character information by the separation unit 88, and each piece of information is transmitted to the video decoder 90, the audio decoder 92, and the caption decoder 94.

  In the video decoder 90, the video information is decoded (restored) according to the MPEG2 (Moving Picture Expert Group 2) standard, and the restored video information is transmitted to the encoder 102. The audio decoder 92 decodes the audio information and outputs the restored audio information to the outside in an analog state. Further, the caption decoder 94 restores character information constituting the closed caption. Here, closed captioning is a method developed for people with hearing loss to enjoy broadcasting, and is a method of displaying characters on the screen of a television.

  In the encoder 102, the video information output from the video decoder 90 and the character information output from the caption decoder 94 are combined and encoded (converted). For example, the video information is encoded in accordance with a terrestrial analog television standard such as NTSC (National Television System Committee). The encoded information is analog-converted by the D / A converter 100 and output to the outside. This information can be displayed on the display by the same processing as in the case of a conventional analog television.

  The crystal oscillator 54 supplies the semiconductor element 34 with a clock used when the demodulator 86 demodulates the received signal. The crystal oscillator 56 supplies a system clock used when performing calculations in the entire system to the semiconductor element 36 and the storage unit 98 (semiconductor element 32).

  Furthermore, the storage unit 98 (semiconductor element 32) has a role of temporarily storing image data and audio data, and has a storage capacity of about 256 megabytes, for example. On the other hand, the storage unit 82 (semiconductor element 36) stores a program for operating the semiconductor element 34, and is formed of, for example, a flash memory.

  The controller 96 is a part having a function of controlling an interface between an external element such as the storage unit 98 and the semiconductor element 34.

<Second Embodiment>
In the present embodiment, a configuration of a digital broadcast receiving device 114 in which the circuit device 11 having the configuration described in the first embodiment is incorporated will be described with reference to FIG. Here, FIG. 6A is a cross-sectional view of the digital broadcast receiving apparatus 114, and FIG. 6B is a block diagram showing its electrical configuration.

  With reference to FIG. 6A, the digital broadcast receiving apparatus 114 is configured by mounting required electronic components on the upper surface of the mounting substrate 110. Here, a tuner 104, a circuit device 11, a circuit device 106, a capacitor 108, and the like are inserted and mounted on the mounting substrate 110 as electronic components. A heat radiator 150 that sandwiches the circuit device 11 from both sides is also mounted on the mounting substrate 110.

  The tuner 104 has a function of obtaining a reception signal of a predetermined channel. The configuration of the circuit device 11 is as described above, and the wiring board is partially inserted and mounted on the mounting board 110. The circuit device 106 is a package in which a plurality of semiconductor elements are resin-molded, and leads that are led out from both sides are inserted and mounted on the mounting substrate 110. The capacitor 108 is an electrolytic capacitor having a columnar shape with a height of about 1 cm for noise removal, for example, and two leads led out are inserted and mounted on the mounting substrate 110. The function of each component will be described later with reference to FIG.

  As described above, the mounting substrate 110 is, for example, a paper phenol resin substrate, and a single-layer conductive path 112 is provided only on the lower surface. An opening (slit) for inserting and mounting the electronic component is provided in a region where the electronic component such as the tuner 104 is disposed. The electronic components are electrically connected via the conductive path 112.

  The above-described mounting of each electronic component on the mounting substrate 110 is as follows. First, a mounting substrate 110 is prepared in which a conductive path having a predetermined pattern shape is provided on the lower surface and an opening for insertion is provided in a desired region. Next, an electronic component including the circuit device 11 is inserted and mounted at a predetermined location. Here, the tuner 104, the circuit device 11, the radiator 150, the circuit device 106, the capacitor 108, a power supply circuit device (not shown), and the like are inserted into an opening provided in the mounting substrate 110. Further, the mounting substrate 110 into which the electronic components are inserted is immersed in a bath in which the molten solder is stored. Then, the solder attached to the connection portion between the conductive path 112 of the mounting substrate 110 and the electronic component is solidified at room temperature, and the plug-in mounting is completed.

  The digital broadcast receiving apparatus 114 having the above configuration is built in the housing of the television apparatus.

  With reference to FIG. 6B, the role of each block constituting the digital broadcast receiving apparatus 114 having the above-described configuration will be described. Referring to this figure, digital broadcast receiving apparatus 114 includes tuner 104, circuit apparatus 11, circuit apparatus 106, power supply circuit 120, speaker 122, and display 124.

  The tuner 104 extracts a digital broadcast reception signal of a predetermined channel from a digital broadcast reception signal input via an antenna 116 located outside the digital broadcast reception device 114. Then, the received signal is input to the circuit device 11, and a video signal and an audio signal are generated from the received signal. Each signal generated by the circuit device is an analog signal. The generated video signal is input to the circuit device 106, superimposed with characters indicating the channel, volume, etc., and output to the display 124. Here, the display 124 is, for example, a liquid crystal display, a plasma display, an organic EL display, a cathode ray tube display, or the like. On the other hand, the audio signal generated by the circuit device 11 is input to the speaker 122, and sound based on the audio signal is generated from the speaker 122.

  The power supply circuit 120 has a function of converting, for example, 100 V AC power (commercial power) into DC power having a predetermined voltage. The DC power generated by the power supply circuit 120 is supplied to each part constituting the digital broadcast receiver 114.

  The above is the configuration of the digital broadcast receiving apparatus 114. In the present embodiment, semiconductor elements and the like necessary for processing digital broadcast reception signals are collected in the circuit device 11, and analog audio signals and video signals are output from the circuit device 11. In the circuit device 11, image processing semiconductor elements having a very large number of electrodes are connected to other circuit elements by laminating fine pitch wiring layers in multiple layers.

  As a result, the digital broadcast reception signal is input as an analog signal from the tuner 104 to the circuit device 11, converted into a digital signal inside the circuit device 11, and decoded. Further, analog video signals and audio signals are generated and output inside the circuit device 11. Therefore, since complicated processing is not required on the mounting substrate 110 side, the wiring structure of the mounting substrate 110 can be simplified. That is, when the wiring board of the circuit device 11 and the mounting board 110 are compared, the wiring layer formed on the wiring board of the circuit device 11 has a wiring width and wiring higher than the conductive path 112 formed on the lower surface of the mounting board 110. The space is narrow. Further, the wiring board of the circuit device 11 has a multilayer wiring structure than the mounting board.

  From the above, in the digital broadcast receiving apparatus 114 of the present embodiment, the single-layer mounting board 110 made of paper phenol resin that has been conventionally used can be used as it is.

It is a figure which shows the circuit apparatus of this invention, (A) and (B) are top views, (C) is the expanded top view. It is sectional drawing which shows the circuit apparatus of this invention. It is a figure which shows the circuit module containing the circuit apparatus of this invention, (A) is a perspective view, (B) is the partial top view which looked at the circuit module from the downward direction. 2 is a plan view showing a wiring layer configured in the circuit device of the present invention, (A) is a plan view of a first wiring layer 24, and (B) is a plan view of a fourth wiring layer 30. FIG. It is a block diagram which shows the electrical constitution of the circuit apparatus of this invention. (A) is sectional drawing which shows the digital broadcast receiver of this invention, (B) is a block diagram which shows the electrical constitution. It is sectional drawing which shows the conventional circuit apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Circuit module 11 Circuit apparatus 12 Wiring board 13 Connection area 14 Package 15 Opening part 17 Fixed potential electrode 18 External connection electrode 18A 1st external connection electrode 18B 2nd external connection electrode 19 Signal electrode 20 Sealing resin 21 Digital electrode 22 Base material DESCRIPTION OF SYMBOLS 23 Analog electrode 24 1st wiring layer 26 2nd wiring layer 28 3rd wiring layer 30 4th wiring layer 32 Semiconductor element 34 Semiconductor element 36 Semiconductor element 38 Chip element 40 Cover resin 42 Cover resin 44 Through-connection part 46 Metal fine wire 48 Lead DESCRIPTION OF SYMBOLS 50 Cut part 52 Slit 54 Crystal oscillator 56 Crystal oscillator 58 Connection part 60 Connection part 62 Pad 64 Wiring 66 Pad 68 Conductive pattern 70 Pad 72 Wiring 74 Conductive pattern 76 Removal part 78 Removal part 80 Connector 82 Memory | storage part 84 A / D Conversion unit 86 Control unit 88 Separation unit 90 Video decoder 92 Audio decoder 94 Caption decoder 96 Controller 98 Storage unit 100 D / A conversion unit 102 Encoder 104 Tuner 106 Circuit device 108 Capacitor 110 Mounting substrate 112 Conductive path 112A Conductive path 114 Digital broadcast receiver 116 Antenna 120 Power supply circuit 122 Speaker 124 Display 150 Heat radiator

Claims (14)

A wiring board provided with a wiring layer on the surface;
A plurality of external connection electrodes made of the wiring layer provided along one side of the wiring board to be plugged and mounted;
A circuit element electrically connected to the wiring layer of the wiring board;
The circuit device characterized in that the external connection electrode to which a fixed potential is applied has a larger area than the other external connection electrodes.   The circuit device according to claim 1, wherein the external connection electrodes are spaced apart at equal intervals including the external connection electrodes to which a fixed potential is applied.   The circuit device according to claim 1, wherein the fixed potential is a ground potential or a power supply potential.   The width of the external connection electrode to which the fixed potential is applied is a length obtained by adding the widths of the plurality of other external connection electrodes and the width at which the other external connection electrodes are separated from each other. The circuit device according to claim 1. A first wiring layer is provided on the first main surface of the wiring board; a second wiring layer is provided on the second main surface of the wiring board;
A first external connection electrode made of the first wiring layer is provided on the first main surface of the wiring substrate in a region to be plugged in, and a second outer electrode made of the second wiring layer is formed on the second main surface. An external connection electrode is provided,
The area of the external connection electrode to which a fixed potential is applied is made larger than that of the other external connection electrode in both the first external connection electrode and the second external connection electrode. The circuit device described. A wiring board provided with a wiring layer on the surface;
A plurality of external connection electrodes made of the wiring layer provided along one side of the wiring board to be plugged and mounted;
A circuit element electrically connected to the wiring layer;
A circuit device comprising a slit in which the wiring substrate is partially cut out in a region where the external connection electrode is disposed.   The circuit device according to claim 6, wherein the slit is arranged so as to be biased to one end of the wiring board on which the external connection electrode is provided.   The external connection electrode includes a digital electrode through which a digital signal passes and an analog electrode through which an analog signal passes, and the analog electrodes are aggregated on the wiring board on one side with the slit as a boundary. The circuit device according to claim 6. A part of all the analog electrodes and digital electrodes are arranged on the one side of the wiring board with the slit as a boundary, and digital electrodes are arranged on the other side,
The amount of noise generated from the digital electrode disposed on one side of the wiring board together with the analog electrode is smaller than that of the digital electrode disposed on the other side of the wiring board. Circuit device. A wiring board provided with a first wiring layer on a first main surface and a second wiring layer provided on a second main surface opposite to the first main surface;
A first circuit element electrically connected to the first wiring layer and a second circuit element electrically connected to the second wiring layer;
A first external connection electrode made of the first wiring layer and a second external connection electrode made of the second wiring layer provided on the wiring board in a region to be inserted and mounted;
A circuit device characterized in that different signals are inputted / outputted from the first external connection electrode and the second external connection electrode overlapping in the thickness direction of the wiring board. Each of the first external connection electrode and the second external connection electrode includes a digital electrode through which a digital signal passes and an analog electrode through which an analog signal passes,
The circuit device according to claim 10, wherein the analog electrodes are arranged in a concentrated manner on one side of the wiring board. In a digital broadcast receiver comprising a mounting board and an electronic component arranged on the mounting board for generating a video signal by demodulating and decoding a received signal of a digital broadcast,
The circuit device included in the electronic component includes a wiring board provided with a wiring layer on a surface thereof, and a plurality of external connection electrodes including the wiring layer provided along one side of the wiring board to be plugged and mounted. And a circuit element electrically connected to the wiring layer of the wiring board, wherein the external connection electrode to which a fixed potential is applied has a larger area than the other external connection electrodes. Digital broadcast receiver. In a digital broadcast receiver comprising a mounting board and an electronic component arranged on the mounting board for generating a video signal by demodulating and decoding a received signal of a digital broadcast,
The circuit device included in the electronic component includes a wiring board provided with a wiring layer on a surface thereof, and a plurality of external connection electrodes including the wiring layer provided along one side of the wiring board to be plugged and mounted. A digital broadcast receiving apparatus comprising: a circuit element electrically connected to the wiring layer; and a slit formed by partially cutting the wiring board in a region where the external connection electrode is disposed. In a digital broadcast receiver comprising a mounting board and an electronic component arranged on the mounting board for generating a video signal by demodulating and decoding a received signal of a digital broadcast,
The circuit device included in the electronic component includes a wiring board having a first wiring layer provided on a first main surface and a second wiring layer provided on a second main surface opposite to the first main surface; A first circuit element electrically connected to one wiring layer; a second circuit element electrically connected to the second wiring layer; and the first circuit element provided on the wiring substrate in a region to be plugged in. A first external connection electrode composed of a wiring layer and a second external connection electrode composed of the second wiring layer, and the first external connection electrode and the second external connection electrode overlapping in the thickness direction of the wiring substrate. A digital broadcast receiver characterized by inputting and outputting different signals.

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