JP3111232U - Board mounting structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To satisfy a mounting strength of a second substrate with respect to a first substrate without using a reinforcing metal fitting, to secure the necessary number of poles without increasing the size of the second substrate, and to prevent inconvenience such as electromagnetic interference. Provide mounting structure.
A first substrate 1 and a second substrate 2 inserted into a slit 12 of the first substrate 1 are provided. The terminal patterns 22 and 23 are staggered on both front and back surfaces of the insertion end 21 of the second substrate 2, and the front side terminal pattern 22 and the back side terminal pattern 23 are connected to the soldering patterns 13 and 14 of the first substrate 1. Solder to. The mounting strength of the second substrate 2 is satisfied by the solder joint strength at the soldering location and the holding strength due to the fitting between the slit 12 and the insertion end 21.
[Selection] Figure 1

Description

  The present invention relates to a board mounting structure, and more particularly to a board mounting structure in which a second board such as a digital circuit board is mounted upright on a first board such as a main board.

  In a television receiver with a built-in terrestrial digital television, a multi-layer digital circuit board as a multi-layer digital circuit board is located near the tuner mounting position of the first board as a main board (television chassis) mounted with a terrestrial digital tuner. The second substrate is mounted in an upright posture.

  FIG. 4 is a schematic perspective view of such a board mounting structure. In the board mounting structure shown in FIG. 4, the first board 1 and the second board 2 arranged in an upright posture on the first board 1 are connected to the reinforcing bracket 4. The first board 1 and the second board 2 are electrically connected by the multipolar connector 3 after connecting by the above and satisfying the mounting strength of the second board 2. Reference numeral 5 denotes a terrestrial digital tuner.

  FIG. 5 illustrates an electrical connection structure between the first substrate 1 and the second substrate 2 by the multipolar connector 3, and in this case, the electrode pin 31 on one side of the multipolar connector 3 is the first electrode pin 31. Soldered to the substrate 1, the surface-mount type electrode pins 32 on the other side of the multipolar connector 3 are soldered to a terminal pattern formed on one surface of the second substrate 2. FIG. 6 shows another example of an electrical connection structure between the first board 1 and the second board 2 by the multipolar connector 3. In this example, one side of the multipolar connector 3 is shown. The electrode pins 31 ′ are soldered to the first substrate 1, and the electrode pins 32 ′ on the other side of the multipolar connector 3 are inserted into the holes of the second substrate 2 and formed on the other surface of the second substrate 2. Soldered to the terminal pattern.

By the way, the technique of electrically connecting the second substrate by inserting the second substrate into the slit of the first substrate and soldering the patterns of both the substrates is conventionally known (see, for example, Patent Document 1 and Patent Document 2). ). In addition, when joining a wiring board and a metal plate, a technique is also known in which the wiring board is sandwiched between a pair of claw portions formed on the metal plate and soldered at the location (see, for example, Patent Document 3). .
Utility Model Registration No. 3090836 JP 2000-286728 A Japanese Utility Model Publication No. 5-67092

  However, since the substrate mounting structure described with reference to FIGS. 4 to 6 satisfies the mounting strength of the second substrate 2 with respect to the first substrate 1 by using the additional reinforcing bracket 4, the reinforcing bracket 4 is used. It is indispensable to use, and the cost of parts is high accordingly.

  On the other hand, the technique described in Patent Document 1 or Patent Document 2 is a technique for electrically connecting the first substrate and the second substrate upright on the first substrate, and mounting the second substrate. It is not a technique to meet strength. Further, in the techniques described in these Patent Documents 1 and 2, it is considered that the soldering location between the two boards is useful for increasing the mounting strength of the second board. However, soldering is performed on one side of the second board. Since it is formed only on the side, it is obvious that the mounting strength is not so great and the mounting strength of the second substrate is not satisfied.

  Further, in the substrate mounting structure described with reference to FIG. 4 and the technique described in Patent Document 1 or Patent Document 2, a required number of electrodes are secured by using only one side of the second substrate. However, with such a configuration, if the number of poles required is large, such as a multi-layer digital circuit board used in a television receiver with a built-in terrestrial digital television, it is commensurate with the increase in the number of poles. It becomes necessary to increase the size of the second substrate, which hinders high density of component mounting. For example, in the substrate mounting structure of FIG. 4, when the second substrate 2 has a terminal pattern of 30 poles at a pitch of 2 mm (the former) and a case of having a terminal pattern of 60 poles at a pitch of 2 mm (the latter), The width of the second substrate 2 is twice that of the former, and the length of the multipolar connector 3 is also doubled. That is, with respect to the multi-pole connector 3, 60 mm is sufficient for 30 poles, but 120 mm for 60 poles.

  The present invention has been made under the above circumstances, and satisfies the mounting strength of the second board even if the reinforcing metal fitting used in the board mounting structure described with reference to FIGS. 4 to 6 is omitted. PCB mounting that does not cause the size of the second substrate to increase even if the required number of poles required for the second substrate increases and does not cause inconveniences such as electromagnetic interference The purpose is to provide a structure.

  The board mounting structure according to the present invention is a board mounting structure in which a first board and a second board inserted into the slit of the first board are soldered, and the second board inserted into the slit is inserted. Each of the terminal patterns formed at a plurality of positions on both the front and back surfaces of the end is soldered to a soldering pattern formed on both sides sandwiching the slit of the first substrate, and the solder joint strength of these soldered positions. Further, the mounting strength of the second substrate with respect to the first substrate is satisfied by the holding strength by fitting between the slit and the insertion end.

  With this configuration, since the terminal patterns on both the front and back sides of the insertion end of the second board are soldered to the soldering pattern of the first board, only one side as described in the beginning is soldered. Compared with that, a larger solder joint strength can be obtained. In addition, in this device, since the holding strength by fitting the slit of the first substrate and the insertion end of the second substrate is added to the solder joint strength, the mounting strength of the second substrate is satisfied as a whole. Thus, it is not necessary to use extra parts such as the reinforcing metal fitting 4 (see FIG. 4). In addition, when securing the required number of poles required for the second substrate, terminal patterns formed at a plurality of locations on both the front and back surfaces of the insertion end of the second substrate can be used, so only on one side The size of the second substrate can be made smaller than when the terminal pattern is formed to ensure the necessary number of poles.

  In the present invention, individual terminal patterns formed at a plurality of positions on the front surface side of the insertion end of the second substrate and individual terminal patterns formed at a plurality of positions on the rear surface side thereof are staggered in the longitudinal direction of the insertion end. Therefore, it is desirable to adopt a configuration in which electromagnetic interference between terminal patterns is avoided.

  Further, it is possible to adopt a configuration in which the second substrate is a multilayer substrate, and the necessary number of poles is secured by the number of terminal patterns formed on both the front and back surfaces of the insertion end.

  In the board mounting structure according to the present invention, the first board and the second board inserted into the slit of the first board are soldered, and the reinforcing metal fitting for joining the first board and the second board. In the board mounting structure satisfying the mounting strength of the second board by the above, the reinforcing metal fittings are omitted, and the terminal pattern is formed on each of the front and back surfaces of the insertion end of the second board made of the multilayer board inserted into the slit. Are formed, and each terminal pattern formed at a plurality of positions on the front surface side and each terminal pattern formed at a plurality of positions on the back surface side thereof are arranged in a staggered manner in the longitudinal direction of the insertion end, thereby mutual connection of the terminal patterns. Electromagnetic interference is avoided, and the necessary number of poles is secured by the number of terminal patterns formed on both the front and back surfaces of the insertion end. Soldering is individually performed on soldering patterns formed on both sides of the slit of the first substrate, and the soldering strength of those soldering locations and the holding strength by fitting the slit and the insertion end are the first. It is possible to adopt a configuration in which the mounting strength of the second substrate with respect to one substrate is satisfied. The effect | action by this invention is demonstrated in detail with reference to embodiment mentioned later.

  As described above, according to the present invention, the insertion end of the second substrate is inserted into the slit of the first substrate, and the terminal patterns on both the front and back surfaces are soldered to the soldering pattern of the first substrate. In addition to satisfying the mounting strength of the second substrate even if is omitted, it is possible to increase the required number of poles of the second substrate without increasing the size of the second substrate. Further, by arranging the terminal pattern arrangement on both the front and back surfaces of the insertion end of the second board in a staggered arrangement, it is possible to provide a board mounting structure that does not cause inconveniences such as electromagnetic interference. Therefore, the mounting strength of the second substrate is satisfied, the number of poles of the second substrate can be easily increased, and a highly durable substrate mounting structure that does not cause problems such as electromagnetic interference can be provided at low cost. In addition, there is an effect that a board mounting structure having excellent durability can be obtained for the user. In addition, it is not necessary to assemble extra parts such as reinforcing metal fittings, and it can be said that the structure is suitable for mass production.

  FIG. 1 is a schematic perspective view of a substrate mounting structure according to an embodiment of the present invention, FIG. 2A is a schematic perspective view of a main part of a second substrate 2, and FIG. FIG. 3 is a cross-sectional view of the main part of the substrate mounting structure.

  This embodiment relates to a board mounting structure used for a television receiver incorporating a terrestrial digital television. As shown in FIG. 1, the first board as a main board on which a terrestrial digital tuner 5 is mounted. A board 1 and a second board 2 as a multilayer digital circuit board arranged in an upright posture on the first board 1 are provided, and the reinforcing metal fitting 4 shown in FIG. 4 is not used.

  As shown in FIGS. 2A and 2B, terminal patterns 22..., 23... Are formed at a plurality of locations on both the front and back surfaces of the insertion end 21 of the second substrate 2 and formed at a plurality of locations on the front side. The individual terminal patterns 22 and the individual terminal patterns 23 formed at a plurality of locations on the back side thereof are staggered in the longitudinal direction of the insertion end 21. By doing so, it is possible to avoid electromagnetic interference between the terminal patterns 22..., 23.

  On the other hand, slits 12 are formed on the first substrate 1 as shown in FIG. 3 at locations close to the mounting location of the terrestrial digital tuner 5. The slit 12 has a length and a width corresponding to the length and thickness of the insertion end 21 of the second substrate 2. When the insertion end 21 of the second substrate 2 is inserted into the slit 12, the insertion end 21 is inserted. The second substrate 2 becomes self-supporting with respect to the first substrate 1 in such a state that the slit 21 is lightly press-fitted to the extent that no rattling occurs. As shown in FIG. 3, the terminal patterns 22 and 23 on both the front and back surfaces of the insertion end 21 are individually soldered to the soldering patterns 13 and 14 formed on both sides of the slit 12 of the first substrate 1. Yes.

  With this configuration, since the terminal patterns 22 and 23 on both the front and back surfaces of the insertion end 21 of the second substrate 2 are soldered to the soldering patterns 13 and 14 of the first substrate 1, only one side of the insertion end 21 is present. Not only can the solder joint strength be higher than that of the soldered one, but also the fitting between the slit 12 of the first substrate 1 and the insertion end 21 of the second substrate 2 can achieve such a large solder joint strength. Therefore, the mounting strength of the second substrate 2 is satisfied as a whole.

  In addition, since the necessary number of poles required for the second substrate 2 can be ensured by using the terminal patterns 22 and 23 formed at a plurality of locations on both the front and back surfaces of the insertion end 21, Without increasing the size of the substrate 2, it is possible to secure the number of two poles when the terminal pattern is formed only on one side of the insertion end. Therefore, the size reduction of the 2nd board | substrate 2 is accelerated | stimulated rather than the case where a terminal pattern is formed only on one side and the required number of poles is ensured. For example, the width dimension of one terminal pattern 22, 23 shown in FIG. 2 is W, the pitch on one side of the terminal patterns 22, 23 is P, the width dimension W is 2.0 mm, and the pitch P is 1 When 15 poles are formed on one side with a thickness of 0.5 mm, the total width of the second substrate 2 can be suppressed to 60 mm, and a total of 30 poles can be secured.

  1 to 3, the same or corresponding elements as those shown in FIGS. 4 to 6 are denoted by the same reference numerals.

1 is a schematic perspective view of a substrate mounting structure according to an embodiment of the present invention. (A) is a schematic perspective view of the principal part of the 2nd board | substrate 2, (B) is the IIB arrow directional view of (A). It is sectional drawing of the principal part of a board | substrate mounting structure. It is a schematic perspective view of the conventional board mounting structure. It is sectional drawing which showed the electrical connection structure of the 1st board | substrate and 2nd board | substrate by a multipolar connector. It is sectional drawing which showed the modification of the electrical connection structure of the 1st board | substrate and 2nd board | substrate by a multipolar connector.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st board | substrate 2 2nd board | substrate 4 Reinforcing bracket 12 Slit 13, 14 Soldering pattern 21 Insertion end 22, 23 terminal pattern of 2nd board | substrate

Claims (4)

The first substrate and the second substrate inserted into the slit of the first substrate are soldered, and the mounting strength of the second substrate is satisfied by the reinforcing metal fitting that joins the first substrate and the second substrate. Board mounting structure
The reinforcing bracket is omitted,
Terminal patterns are formed at a plurality of locations on both the front and back surfaces of the insertion end of the second substrate, which is a multilayer substrate inserted into the slit, and each terminal pattern formed at a plurality of locations on the front surface side and a plurality of back surface sides thereof. Each terminal pattern formed at the location is staggered in the longitudinal direction of the insertion end to avoid electromagnetic interference between the terminal patterns, and the terminal pattern formed on both the front and back sides of the insertion end The necessary number of poles is ensured by the number, and each of the terminal patterns is individually soldered to the soldering patterns formed on both sides of the slit of the first substrate, and the solder at the soldering points thereof The mounting strength of the second substrate to the first substrate is satisfied by the bonding strength and the holding strength by fitting the slit and the insertion end. Board mounting structure that. In the substrate mounting structure in which the first substrate and the second substrate inserted into the slit of the first substrate are soldered,
Each of the terminal patterns formed at a plurality of locations on both the front and back surfaces of the insertion end of the second substrate inserted into the slit is soldered to a soldering pattern formed on both sides sandwiching the slit of the first substrate. A board mounting structure characterized by satisfying the mounting strength of the second board to the first board by the solder joint strength of those soldering locations and the holding strength by fitting the slit and the insertion end. By arranging the individual terminal patterns formed at a plurality of locations on the front surface side of the insertion end of the second substrate and the individual terminal patterns formed at a plurality of locations on the rear surface side in a staggered manner in the longitudinal direction of the insertion ends, The substrate mounting structure according to claim 2, wherein electromagnetic interference is avoided. 4. The substrate mounting structure according to claim 2, wherein the second substrate is a multilayer substrate, and a necessary number of poles is secured by the number of terminal patterns formed on both front and back surfaces of the insertion end.

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