JP2008166565A5 - - Google Patents

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Publication number
JP2008166565A5
JP2008166565A5 JP2006355461A JP2006355461A JP2008166565A5 JP 2008166565 A5 JP2008166565 A5 JP 2008166565A5 JP 2006355461 A JP2006355461 A JP 2006355461A JP 2006355461 A JP2006355461 A JP 2006355461A JP 2008166565 A5 JP2008166565 A5 JP 2008166565A5
Authority
JP
Japan
Prior art keywords
wiring board
circuit
connection electrodes
wiring
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006355461A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008166565A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006355461A priority Critical patent/JP2008166565A/ja
Priority claimed from JP2006355461A external-priority patent/JP2008166565A/ja
Publication of JP2008166565A publication Critical patent/JP2008166565A/ja
Publication of JP2008166565A5 publication Critical patent/JP2008166565A5/ja
Pending legal-status Critical Current

Links

JP2006355461A 2006-12-28 2006-12-28 回路装置及びデジタル放送受信装置 Pending JP2008166565A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006355461A JP2008166565A (ja) 2006-12-28 2006-12-28 回路装置及びデジタル放送受信装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006355461A JP2008166565A (ja) 2006-12-28 2006-12-28 回路装置及びデジタル放送受信装置

Publications (2)

Publication Number Publication Date
JP2008166565A JP2008166565A (ja) 2008-07-17
JP2008166565A5 true JP2008166565A5 (enExample) 2010-01-21

Family

ID=39695627

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006355461A Pending JP2008166565A (ja) 2006-12-28 2006-12-28 回路装置及びデジタル放送受信装置

Country Status (1)

Country Link
JP (1) JP2008166565A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3531806B1 (de) * 2018-02-26 2020-03-25 ZKW Group GmbH Elektronische leiterplattenbaugruppe für hochleistungsbauteile
JP7729080B2 (ja) 2021-06-11 2025-08-26 古河ファイテルオプティカルコンポーネンツ株式会社 光デバイス及び光通信装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11265975A (ja) * 1998-03-17 1999-09-28 Mitsubishi Electric Corp 多層化集積回路装置
JP2001203318A (ja) * 1999-12-17 2001-07-27 Texas Instr Inc <Ti> 複数のフリップチップを備えた半導体アセンブリ
JP2004022664A (ja) * 2002-06-13 2004-01-22 Matsushita Electric Ind Co Ltd 半導体装置のパッケージおよび検査回路

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