JP2008166014A - Method of bending work of pin connector - Google Patents

Method of bending work of pin connector Download PDF

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JP2008166014A
JP2008166014A JP2006351295A JP2006351295A JP2008166014A JP 2008166014 A JP2008166014 A JP 2008166014A JP 2006351295 A JP2006351295 A JP 2006351295A JP 2006351295 A JP2006351295 A JP 2006351295A JP 2008166014 A JP2008166014 A JP 2008166014A
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pin connector
bending
shaft
bent
mold
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JP4919797B2 (en
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Mitsuhiro Takano
光裕 高野
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Nippon Seiki Co Ltd
Kyocera Display Corp
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Nippon Seiki Co Ltd
Kyocera Display Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for bending a shaft in a pin connector capable of accurately bending it at a predetermined angle, in a bending jig for externally bending the shaft of the pin connector. <P>SOLUTION: The shaft of the pin connector has an extension 123, an external flexure 124 externally bent at a first bending point 121 in the extremity of the extension, and a parallel portion 126 bent in a direction parallel to the extension 123 at a second bending point 122 in the extremity of the external flexure. The method for bending the pin connector includes a step for externally bending the external flexure 124 at the first bending point 121 in the holding state of the extension 123 with respect to the shaft 12 of the linear pin connector, and bending the parallel portion 126 in the direction parallel to the extension 123 without holding it at the second bending point 122. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、コネクタとして使用されるコンタクトピンの曲げ加工方法に関し、さらに詳しく言えば、表示素子の電極基板に形成された電極端子と外部機器とを電気的に導通させるピンコネクタの曲げ加工方法に関するものである。   The present invention relates to a method for bending a contact pin used as a connector, and more particularly, to a method for bending a pin connector for electrically connecting an electrode terminal formed on an electrode substrate of a display element and an external device. Is.

従来から、液晶表示素子と外部機器とを電気的に導通させるために、ピンコネクタが使用されている。ピンコネクタは、液晶表示素子の製造過程において透明電極基板に形成された電極端子部をピンコネクタのクリップ部で挟持し、樹脂を用いて固定している。ここで、液晶表示素子を外部機器に接続する工程を詳しく述べれば、ピンコネクタの軸部をソケット等に差し込んで外部機器の回路基板に固定し、これによりピンコネクタを介して液晶表示素子と外部機器とを確実に導電接続している。   Conventionally, a pin connector has been used to electrically connect a liquid crystal display element and an external device. In the pin connector, the electrode terminal portion formed on the transparent electrode substrate in the manufacturing process of the liquid crystal display element is sandwiched between the clip portions of the pin connector and fixed using resin. Here, the process of connecting the liquid crystal display element to the external device will be described in detail. The shaft portion of the pin connector is inserted into a socket or the like and fixed to the circuit board of the external device, and thereby the liquid crystal display element and the external device are connected via the pin connector. The device is securely connected electrically.

また、外部機器に対してピンコネクタを介して液晶表示素子を取着する場合、無駄なスペースを無くし、可能な限りコンパクトなモジュールの設計を行うために、液晶表示素子を外部機器の近傍に取着し、ピンコネクタの軸部を折り曲げて使用するケースが多い。   In addition, when a liquid crystal display element is attached to an external device via a pin connector, the liquid crystal display element is mounted in the vicinity of the external device in order to eliminate a useless space and to design a module as compact as possible. There are many cases where the pin connector shaft is bent and used.

ここで、特許文献1には、プリント配線板の回路を他の回路に接続するためのコンタクトピンを回転治具により適度な角度に曲げる技術が提案されている。   Here, Patent Document 1 proposes a technique for bending a contact pin for connecting a circuit of a printed wiring board to another circuit to an appropriate angle by a rotating jig.

図4(a)は、外部電極4 に対して液晶表示素子1における液晶基板11の電極端子部に接続されたピンコネクタの軸部12を、第一屈折点121で内曲げ加工して取着した状態を示している。また、図4(b)は、外部電極4 に対して液晶表示素子1における液晶基板11の電極端子部に接続されたピンコネクタの軸部12を、第一屈折点121で外曲げ加工して取着した状態を示している。図4から明らかなように、ピンコネクタの軸部12 を折り曲げて取着することで、機器全体が非常にコンパクトとなる。ここで、ピンコネクタの曲げ加工は折り曲げ治具金型を使用して行われている。   FIG. 4A shows the pin connector shaft portion 12 connected to the electrode terminal portion of the liquid crystal substrate 11 in the liquid crystal display element 1 with respect to the external electrode 4. Shows the state. FIG. 4B shows a pin connector shaft portion 12 connected to the electrode terminal portion of the liquid crystal substrate 11 in the liquid crystal display element 1 with respect to the external electrode 4. The attached state is shown. As is apparent from FIG. 4, the entire device is very compact by bending and attaching the shaft portion 12 of the pin connector. Here, bending of the pin connector is performed using a bending jig mold.

図6は、ピンコネクタの軸部12を内曲げ加工する折り曲げ治具金型100を示す。図6に示すように、下金型2は、液晶基板11の一端から垂直方向に延在するピンコネクタの軸部12を水平に維持する固定部21と、凹部22を有する。また、上金型3は、下金型2の固定部21に嵌合する凹部31と、下金型2の凹部22 に嵌合する凸部32を有している。このように、ピンコネクタの軸部12を下金型2に水平にセットした状態で、上金型3 を降下して先端の凸部32 にて押圧すると、図4(a)に示すように第1折り曲げ部121と第2折り曲げ部122を有する内曲げされたピンコネクタの軸部12 が出来上がる。   FIG. 6 shows a bending jig mold 100 for bending the shaft portion 12 of the pin connector. As shown in FIG. 6, the lower mold 2 includes a fixing portion 21 that maintains the pin connector shaft portion 12 extending in the vertical direction from one end of the liquid crystal substrate 11 and a recess 22. The upper mold 3 has a concave portion 31 that fits into the fixing portion 21 of the lower mold 2 and a convex portion 32 that fits into the concave portion 22 of the lower mold 2. In this way, when the shaft 12 of the pin connector is set horizontally on the lower mold 2 and the upper mold 3 is lowered and pressed by the convex portion 32 at the tip, as shown in FIG. An internally bent pin connector shaft 12 having a first bent portion 121 and a second bent portion 122 is completed.

ここで、ピンコネクタの軸部12が、内曲げされる原理を図6により詳述すれば、上金型3の先端の凸部32で、押されながら、下金型2の凹部22の先端に位置する部位23で曲がり始め、ピンコネクタの軸部12の第1折り曲げ部121と第2折り曲げ部122が同時に形成される。よって、スプリングバック等することなく、所定の角度に内曲げされたピンコネクタの軸部12 が出来上がる。   Here, the principle by which the shaft connector 12 of the pin connector is bent inward will be described in detail with reference to FIG. 6. The tip of the concave portion 22 of the lower die 2 while being pushed by the convex portion 32 of the tip of the upper die 3. The first bent portion 121 and the second bent portion 122 of the shaft portion 12 of the pin connector are formed at the same time at the portion 23 located at the position. Therefore, the shaft portion 12 of the pin connector bent inward at a predetermined angle without springback or the like is completed.

次に、図7は、ピンコネクタ11の軸部12を外曲げ加工する折り曲げ治具金型101を示す。図7に示すように、下金型2は、液晶表示素子1における液晶基板11の電極端子部に接続され垂直方向に延在するピンコネクタの軸部12を、水平に維持する可動式の吸着板24と、凸部25を有する。また、上金型3は、下金型2の吸着板24に嵌合する凸部33と、下金型2の凸部25 に嵌合する凹部34を有している。このように、ピンコネクタの軸部12を下金型2に水平にセットした状態で、上金型3を降下し、下金型2の吸着板24に当接させた後、吸着板24を下降させながらピンコネクタ11を押圧し、さらに凸部25に押圧する。このようにすることで、外曲げされたピンコネクタ11 が出来上がるが、所定の角度に設計することが難しい。この折り曲げ治具金型101で外曲げされたピンコネクタの軸部12を図5(a)に示す。   Next, FIG. 7 shows a bending jig mold 101 for bending the shaft portion 12 of the pin connector 11 outward. As shown in FIG. 7, the lower mold 2 is a movable suction that maintains the pin connector shaft portion 12 connected to the electrode terminal portion of the liquid crystal substrate 11 in the liquid crystal display element 1 and extending in the vertical direction horizontally. It has the board 24 and the convex part 25. FIG. Further, the upper mold 3 has a convex portion 33 fitted to the suction plate 24 of the lower mold 2 and a concave portion 34 fitted to the convex portion 25 of the lower mold 2. In this manner, with the shaft portion 12 of the pin connector set horizontally on the lower mold 2, the upper mold 3 is lowered and brought into contact with the suction plate 24 of the lower mold 2, and then the suction plate 24 is moved. The pin connector 11 is pressed while being lowered, and further pressed to the convex portion 25. By doing so, the externally bent pin connector 11 is completed, but it is difficult to design at a predetermined angle. FIG. 5A shows the shaft 12 of the pin connector that is bent outward by the bending jig mold 101.

図5(a)に示すように、ピンコネクタの軸部12は、液晶基板11の一端から垂直方向に延在する延在部123と、延在部123の先端の第一屈折点121において外側に外曲げされた外曲げ部124と、外曲げ部124の先端の第二屈折点122において延在部123に対して内側に屈曲された屈曲部125を形成している。   As shown in FIG. 5 (a), the shaft connector 12 has a pin connector shaft portion 12 that extends outward from one end of the liquid crystal substrate 11 in the vertical direction and a first refraction point 121 at the tip of the extension portion 123. And a bent portion 125 bent inward with respect to the extending portion 123 at the second refraction point 122 at the tip of the outer bent portion 124 is formed.

ここで、ピンコネクタの軸部12の屈曲部125が、延在部123に対して内側に屈曲される原理を図7、8、9により詳述する。図7に示すように、液晶基板11の一端から垂直方向に延在するピンコネクタの軸部12を、吸着板24と、凸部25からなる下金型2に水平に維持するように配置し、上金型3を下降させる。次に、図8に示すように、上金型3の凸部33と、下金型2の吸着板24が接触すると、上金型3の凸部33と、下金型2の吸着板24で、ピンコネクタの軸部12の接続部から所定範囲の延在部123を挟み、水平にセットした状態を維持し、上金型3 の降下に合わせて、下金型2の吸着板24のみが下降する。ここで、下金型2の凸部25は固定され、移動しない。次に、ピンコネクタの軸部12の残りの部分は、下金型2の先端の凸部25と上金型3の凹部34で、押されながら、下金型2の凸部25の先端に位置する部位26で曲がり始め、ピンコネクタの軸部12の第一屈折点121と第二屈折点122が同時に形成される。このように上金型3と下金型2が嵌合した状態を図9は示す。   Here, the principle that the bent portion 125 of the shaft portion 12 of the pin connector is bent inward with respect to the extending portion 123 will be described in detail with reference to FIGS. As shown in FIG. 7, the pin connector shaft portion 12 extending in the vertical direction from one end of the liquid crystal substrate 11 is disposed horizontally on the lower mold 2 including the suction plate 24 and the convex portion 25. Then, the upper mold 3 is lowered. Next, as shown in FIG. 8, when the convex portion 33 of the upper mold 3 and the suction plate 24 of the lower mold 2 come into contact, the convex portion 33 of the upper mold 3 and the suction plate 24 of the lower mold 2. Then, the extension part 123 in a predetermined range is sandwiched from the connection part of the shaft part 12 of the pin connector, and the horizontal setting state is maintained, and only the suction plate 24 of the lower mold 2 is matched with the lowering of the upper mold 3. Descends. Here, the convex portion 25 of the lower mold 2 is fixed and does not move. Next, the remaining portion of the shaft portion 12 of the pin connector is pushed by the convex portion 25 at the tip of the lower die 2 and the concave portion 34 of the upper die 3 while being pushed to the tip of the convex portion 25 of the lower die 2. The first refraction point 121 and the second refraction point 122 of the shaft portion 12 of the pin connector are formed at the same time when the portion 26 is located. FIG. 9 shows a state in which the upper mold 3 and the lower mold 2 are thus fitted.

ここで、上金型3の凸部33と下金型2の吸着板24でピンコネクタの軸部12の延在部123が挟まれているため、部位26で曲がり始め、後に外曲げ部124となる部分を引っ張る力が作用する。よって、上金型3と下金型2を解除すれば、外曲げ部124には戻ろうとする力が作用し、図5(a)に示すように、第二屈折点122において延在部123に対して内側に屈曲された屈曲部125が形成される。よって、この折り曲げ治具金型101で外曲げされた液晶表示素子1を使用した場合、精度よくモジュールの設計を行うことができず、液晶表示素子1を外部機器4に接続する工程をコンパクトに設計することができなかった。   Here, since the extension part 123 of the shaft part 12 of the pin connector is sandwiched between the convex part 33 of the upper mold 3 and the suction plate 24 of the lower mold 2, it begins to bend at the part 26 and is later bent outward 124. The force that pulls the part becomes. Therefore, if the upper mold 3 and the lower mold 2 are released, a force for returning to the outer bent portion 124 acts, and the extending portion 123 at the second refraction point 122 as shown in FIG. Accordingly, a bent portion 125 bent inward is formed. Therefore, when the liquid crystal display element 1 bent outward by the bending jig mold 101 is used, the module cannot be designed with high accuracy, and the process of connecting the liquid crystal display element 1 to the external device 4 is made compact. I couldn't design it.

特開平11−135227号公報JP-A-11-135227

上述のように、下金型2が、液晶表示素子1のピンコネクタの軸部12を水平に維持する可動式の吸着板24を有し、下金型2の凸部25と、上金型3の凹部34で嵌合することにより、ピンコネクタの軸部12を外曲げ加工する折り曲げ治具金型101においては、ピンコネクタの軸部12の屈曲部125を延在部123と平行となる角度に折り曲げることができなかった。よって、精度よくモジュールの設計を行うことができず、液晶表示素子1を外部機器4に接続する工程をコンパクトに設計することができなかった。   As described above, the lower mold 2 has the movable suction plate 24 that keeps the shaft portion 12 of the pin connector of the liquid crystal display element 1 horizontal, the convex portion 25 of the lower mold 2, and the upper mold In the bending jig mold 101 for externally bending the pin connector shaft 12, the bent portion 125 of the pin connector shaft 12 is parallel to the extending portion 123. Could not be bent to an angle. Therefore, the module cannot be designed with high accuracy, and the process of connecting the liquid crystal display element 1 to the external device 4 cannot be designed in a compact manner.

本発明は、このような事情を背景としてなされたものであり、本発明の目的は、
ピンコネクタの軸部を外曲げ加工する折り曲げ治具金型において、ピンコネクタの軸部を、所定の角度に精度よく折り曲げることを可能とするピンコネクタの曲げ加工方法を、提供することである。
The present invention was made against the background of such circumstances, the purpose of the present invention is
It is an object of the present invention to provide a bending method for a pin connector that can bend the shaft portion of the pin connector accurately at a predetermined angle in a bending jig mold for bending the shaft portion of the pin connector.

本発明に係るピンコネクタの外曲げ加工方法は、表示素子の一端より表示素子の基板に対して垂直方向に延在する延在部と、当該延在部の先端の第一屈折点において外側に外曲げされた外曲げ部と、前記外曲げ部の先端の第二屈折点において前記延在部と平行な方向に屈曲された平行部とを有するピンコネクタの軸部の外曲げ加工方法であって、前記延在部、前記外曲げ部および前記平行部が、形成される前の直線状のピンコネクタの軸部に対して、前記延在部を保持した状態で前記外曲げ部を第一屈折点において外曲げし、前記第二屈折点において前記平行部を非保持状態で前記延在部と平行な方向に屈曲させることを特徴としている。   An external bending method for a pin connector according to the present invention includes an extending portion extending in a direction perpendicular to a substrate of a display element from one end of the display element, and an outer side at a first refraction point at a tip of the extending portion. An outer bending method for an axial portion of a pin connector having an outer bent portion bent outward and a parallel portion bent in a direction parallel to the extending portion at a second refraction point at the tip of the outer bent portion. The extension portion, the outer bending portion, and the parallel portion are arranged in a state in which the extension portion is held in a state where the extension portion is held with respect to the shaft portion of the linear pin connector before being formed. It is characterized by bending outward at a refraction point and bending the parallel part in a non-holding state at the second refraction point in a direction parallel to the extension part.

このようなピンコネクタの外曲げ加工方法は、ピンコネクタの軸部を、所定の角度に精度よく折り曲げることできる。よって、精度よくモジュールの設計を行うことができ、表示素子を外部機器に接続する工程をコンパクトに設計することができる。   Such an outer bending method of the pin connector can bend the shaft portion of the pin connector accurately at a predetermined angle. Therefore, the module can be designed with high accuracy, and the process of connecting the display element to the external device can be designed in a compact manner.

また、このようなピンコネクタの外曲げ加工方法として、前記ピンコネクタの軸部の外曲げにおいて金型を用いる際、当該平行部を挟持する金型の隙間の間隔を、前記ピンコネクタの軸部の厚み寸法よりも大きくすることによって非保持状態を形成するように構成されていてもよい。このような構成により、精度よくモジュールの設計を行うことができ、表示素子を外部機器に接続する工程をコンパクトに設計することができる。   Further, as such an external bending method of the pin connector, when a mold is used in the external bending of the shaft portion of the pin connector, the interval of the gap between the molds sandwiching the parallel portion is determined by the shaft portion of the pin connector. It may be configured to form a non-holding state by making it larger than the thickness dimension. With such a configuration, the module can be designed with high accuracy, and the process of connecting the display element to the external device can be designed in a compact manner.

さらに、このようなピンコネクタの外曲げ加工方法として、前記隙間の間隔を、前記平行部が前記延在部に対して平行になるように調整することができる構成にしてもよい。このような構成により、精度よくモジュールの設計を行うことができ、表示素子を外部機器に接続する工程をコンパクトに設計することができる。   Further, as such an external bending method for the pin connector, the gap may be configured such that the gap can be adjusted so that the parallel portion is parallel to the extending portion. With such a configuration, the module can be designed with high accuracy, and the process of connecting the display element to the external device can be designed in a compact manner.

本発明により、ピンコネクタの軸部を外曲げ加工する折り曲げ治具金型において、ピンコネクタの軸部を、所定の角度に精度よく折り曲げることを可能とするピンコネクタの曲げ加工方法を、提供することができる。   According to the present invention, there is provided a bending method of a pin connector that enables the shaft portion of the pin connector to be accurately bent at a predetermined angle in a bending jig mold for externally bending the shaft portion of the pin connector. be able to.

発明の実施の形態.
本発明の実施の形態に係るピンコネクタの軸部の外曲げ加工方法に使用する折り曲げ治具金型10により、ピンコネクタを外曲げ加工する方法について、図1、図2および図3に基づいて説明する。また図5(b)は、折り曲げ治具金型10で、外曲げ加工されたピンコネクタの軸部を示す。
BEST MODE FOR CARRYING OUT THE INVENTION
A method of externally bending a pin connector using a bending jig mold 10 used in an external bending method of a shaft portion of a pin connector according to an embodiment of the present invention will be described with reference to FIGS. 1, 2, and 3. explain. FIG. 5B shows the shaft portion of the pin connector which is bent outward with the bending jig mold 10.

ここで、液晶表示素子1は、配向処理された一対の透明液晶基板11がシール材(不図示)を介して貼り合わされており、透明液晶基板11間に液晶(不図示)が封入されている。ここで、一対の透明液晶基板11のうち下側の透明液晶基板の端部は、上側の透明液晶基板よりも外側に延出されており、その上面に複数の電極端子を有する電極端子部(不図示)が形成されている。この電極端子部には、断面略コの字形状の弾性部(不図示)を有するピンコネクタがはめ込まれて電極端子と電気的に接続され、紫外線硬化樹脂やエポキシ樹脂などの固定用樹脂によりピンコネクタが固定されている。   Here, in the liquid crystal display element 1, a pair of transparent liquid crystal substrates 11 subjected to alignment treatment are bonded together via a sealing material (not shown), and liquid crystal (not shown) is sealed between the transparent liquid crystal substrates 11. . Here, an end portion of the lower transparent liquid crystal substrate of the pair of transparent liquid crystal substrates 11 extends outward from the upper transparent liquid crystal substrate, and has an electrode terminal portion having a plurality of electrode terminals on the upper surface ( (Not shown) is formed. A pin connector having an approximately U-shaped elastic portion (not shown) is fitted into the electrode terminal portion, and is electrically connected to the electrode terminal, and is pinned by a fixing resin such as an ultraviolet curable resin or an epoxy resin. The connector is fixed.

また、折り曲げ治具金型10は、ポンチとダイスの役割を担う上金型3と下金型2より構成され、超鋼などの高剛性の金属でできている。また、ピンコネクタの軸部12は電気導通性の良い銅でできている。さらに、軸部12は、断面矩形状であり、例えば、幅5mm、厚み3mmの棒状である。   The bending jig mold 10 includes an upper mold 3 and a lower mold 2 that serve as punches and dies, and is made of a highly rigid metal such as super steel. The shaft portion 12 of the pin connector is made of copper having good electrical conductivity. Furthermore, the shaft portion 12 has a rectangular cross section, for example, a rod shape having a width of 5 mm and a thickness of 3 mm.

本発明の実施の形態に係るピンコネクタの軸部の外曲げ加工方法は、図1に示されるように、液晶基板11の一端から垂直方向に延在するピンコネクタの軸部12を、吸着板24と、凸部25からなる下金型2に水平に維持するように先ず配置する。次に、上金型3を下降させる。   As shown in FIG. 1, the pin connector shaft portion 12 extending in the vertical direction from one end of the liquid crystal substrate 11 is used as the pin connector shaft bending method according to the embodiment of the present invention. 24 and the lower mold 2 composed of the convex portions 25 are first arranged so as to be kept horizontal. Next, the upper mold 3 is lowered.

次に、図2に示すように、上金型3の凸部33と、下金型2の吸着板24が接触すると、上金型3の凸部33と、下金型2の吸着板24で、ピンコネクタの軸部12の接続部から所定範囲の延在部123を挟み、水平にセットした状態を維持する。   Next, as shown in FIG. 2, when the projection 33 of the upper mold 3 and the suction plate 24 of the lower mold 2 come into contact with each other, the projection 33 of the upper mold 3 and the suction plate 24 of the lower mold 2. Thus, the extending portion 123 in a predetermined range is sandwiched from the connecting portion of the shaft portion 12 of the pin connector, and the state of being set horizontally is maintained.

ここで、電極端子部とピンコネクタは、前述の通り紫外線硬化樹脂やエポキシ樹脂などの固定用樹脂により固定されているので、樹脂の固定が剥がれる場合がある。剥がれることによりピンコネクタの固定力が弱くなってしまと、外部機器等との電気的導通を維持できず、本来の機能を果たせなくなるため、ピンコネクタの軸部12の接続部から所定範囲の延在部123を挟み、液晶基板11とピンコネクタの軸部12を垂直方向に維持するようにセットしている。   Here, since the electrode terminal portion and the pin connector are fixed by a fixing resin such as an ultraviolet curable resin or an epoxy resin as described above, the resin may be peeled off. If the pin connector fixing force is weakened due to peeling, the electrical continuity with the external device cannot be maintained and the original function cannot be performed. The liquid crystal substrate 11 and the shaft portion 12 of the pin connector are set so as to be maintained in the vertical direction with the existing portion 123 interposed therebetween.

次に、上金型3の降下に合わせて、下金型2の吸着板24が下降する。次に、ピンコネクタの軸部12の延在部123以外の部分は、下金型2の凸部25と上金型3の調整部35で押されながら、下金型2の凸部25の先端に位置する部位26で曲がり始め、ピンコネクタの軸部12の第一屈折点121と第二屈折点122が同時に形成される。このように上金型3の凸部33と下金型2が嵌合した状態を図3は示す。   Next, the suction plate 24 of the lower mold 2 is lowered in accordance with the lowering of the upper mold 3. Next, the portions other than the extending portion 123 of the shaft portion 12 of the pin connector are pushed by the convex portion 25 of the lower mold 2 and the adjusting portion 35 of the upper mold 3, while the convex portion 25 of the lower mold 2. The first refracting point 121 and the second refracting point 122 of the shaft portion 12 of the pin connector are simultaneously formed at the portion 26 located at the tip. FIG. 3 shows a state in which the convex portion 33 of the upper mold 3 and the lower mold 2 are thus fitted.

ここで、上金型3の凸部33と下金型2の吸着板24でピンコネクタの軸部12の延在部123が挟まれているため、部位26で曲がり始め、後に外曲げ部124となる部分を引っ張る力が作用する。しかしながら、上金型3の調整部35と下金型2の凸部25との間隔には、ピンコネクタの軸部12の厚み寸法よりも大きい隙間を空けている。このように隙間を空けることにより、外曲げ部124の先端の第二屈折点122より先端であって、後に平行部126となる部位は、金型に対して非保持状態となっているので、先述の外曲げ部124となる部分を引っ張る力に伴い移動する。よって、上金型3と下金型2を解除すれば、外曲げ部124に戻ろうとする力は作用せず、図5(b)に示すように、第二屈折点122において延在部123に対して内側に屈曲されていない平行部126が形成される。   Here, since the extension part 123 of the shaft part 12 of the pin connector is sandwiched between the convex part 33 of the upper mold 3 and the suction plate 24 of the lower mold 2, it begins to bend at the part 26 and is later bent outward 124. The force that pulls the part becomes. However, a gap larger than the thickness dimension of the shaft portion 12 of the pin connector is provided in the gap between the adjustment portion 35 of the upper die 3 and the convex portion 25 of the lower die 2. By making a gap in this way, the portion that is the tip from the second refraction point 122 at the tip of the outer bending portion 124 and later becomes the parallel portion 126 is in a non-holding state with respect to the mold. It moves in accordance with the pulling force of the portion that becomes the outer bending portion 124 described above. Therefore, if the upper mold 3 and the lower mold 2 are released, the force to return to the outer bent portion 124 does not act, and the extending portion 123 at the second refraction point 122 as shown in FIG. A parallel portion 126 that is not bent inward is formed.

また、上金型3の調整部35と下金型2の凸部25との間隔は、ピンコネクタの軸部12の延在部123と平行な方向に屈曲された平行部126を形成するために、上金型3の調整部35により、下金型2の凸部25との間隔を調整できるように構成されている。   Further, the interval between the adjustment portion 35 of the upper mold 3 and the convex portion 25 of the lower mold 2 forms a parallel portion 126 that is bent in a direction parallel to the extending portion 123 of the shaft portion 12 of the pin connector. In addition, the adjustment portion 35 of the upper mold 3 is configured so that the distance from the convex portion 25 of the lower mold 2 can be adjusted.

尚、延在部123に対して内側に屈曲する平行部126を形成したい場合は、上金型3の調整部35と下金型2の凸部25との間隔を短くし、外曲げ部124となる部分を引っ張る力を作用させることによって加工することもできる。   When it is desired to form the parallel part 126 that is bent inward with respect to the extending part 123, the distance between the adjusting part 35 of the upper mold 3 and the convex part 25 of the lower mold 2 is shortened, and the outer bent part 124 is formed. It can also be processed by applying a pulling force to the part.

本発明の実施の形態によれば、ピンコネクタの軸部12の平行部126を延在部123と平行となる角度に折り曲げることができ、ピンコネクタの軸部12を、所定の角度に精度よく折り曲げることができる。よって、精度よくモジュールの設計を行うことができ、表示素子を外部機器4に接続する工程をコンパクトに設計することができる。なお、本実施の形態において、表示素子の一端にピンコネクタを配設したが、表示素子の両端にピンコネクタを配設してもよい。また、表示素子としては、有機EL表示素子、プラズマ表示素子を例示することができる。   According to the embodiment of the present invention, the parallel portion 126 of the pin connector shaft portion 12 can be bent at an angle parallel to the extending portion 123, and the pin connector shaft portion 12 can be accurately adjusted to a predetermined angle. Can be folded. Therefore, the module can be designed with high accuracy, and the process of connecting the display element to the external device 4 can be designed in a compact manner. In this embodiment, the pin connector is disposed at one end of the display element, but the pin connector may be disposed at both ends of the display element. Moreover, as a display element, an organic EL display element and a plasma display element can be illustrated.

本発明に係るピンコネクタの軸部の外曲げ加工方法に使用する折り曲げ治具金型10の工程を説明する図である。It is a figure explaining the process of the bending jig metal mold | die 10 used for the outer bending process method of the axial part of the pin connector which concerns on this invention. 本発明に係るピンコネクタの軸部の外曲げ加工方法に使用する折り曲げ治具金型10の工程を説明する図である。It is a figure explaining the process of the bending jig metal mold | die 10 used for the outer bending process method of the axial part of the pin connector which concerns on this invention. 本発明に係るピンコネクタの軸部の外曲げ加工方法に使用する折り曲げ治具金型10の工程を説明する図である。It is a figure explaining the process of the bending jig metal mold | die 10 used for the outer bending process method of the axial part of the pin connector which concerns on this invention. ピンコネクタの軸部と外部電極との接続を示す図である。It is a figure which shows the connection of the axial part of a pin connector, and an external electrode. 従来の外曲げ加工方法でできたピンコネクタの軸部と本発明に係る外曲げ加工方法でできたピンコネクタの軸部の違いを説明する図である。It is a figure explaining the difference of the axial part of the pin connector made by the conventional external bending method, and the axial part of the pin connector made by the external bending method which concerns on this invention. ピンコネクタの軸部の内曲げ加工方法に使用する折り曲げ治具金型100の工程を説明する図である。It is a figure explaining the process of the bending jig metal mold | die 100 used for the internal bending method of the axial part of a pin connector. 従来のピンコネクタの軸部の外曲げ加工方法に使用する折り曲げ治具金型101の工程を説明する図である。It is a figure explaining the process of the bending jig metal mold | die 101 used for the external bending method of the axial part of the conventional pin connector. 従来のピンコネクタの軸部の外曲げ加工方法に使用する折り曲げ治具金型101の工程を説明する図である。It is a figure explaining the process of the bending jig metal mold | die 101 used for the external bending method of the axial part of the conventional pin connector. 従来のピンコネクタの軸部の外曲げ加工方法に使用する折り曲げ治具金型101の工程を説明する図である。It is a figure explaining the process of the bending jig metal mold | die 101 used for the external bending method of the axial part of the conventional pin connector.

符号の説明Explanation of symbols

1 液晶表示素子
2 下金型
3 上金型
4 外部電極
11 液晶基板
12 ピンコネクタの軸部
21 固定部
22 凹部
23 部位
24 吸着板
25 凸部
26 部位
31 凹部
32 凸部
33 凸部
34 凹部
35 調整部
121 第一屈折点
122 第二屈折点
123 延在部
124 外曲げ部
125 屈曲部
126 平行部
DESCRIPTION OF SYMBOLS 1 Liquid crystal display element 2 Lower metal mold 3 Upper metal mold 4 External electrode 11 Liquid crystal substrate 12 Pin connector shaft part 21 Fixing part 22 Recess 23 Part 24 Adsorption plate 25 Protrusion 26 Part 31 Recess 32 Protrusion 33 Protrusion 34 Recess 35 Adjustment part 121 First refraction point 122 Second refraction point 123 Extension part 124 Outer bending part 125 Bending part 126 Parallel part

Claims (3)

表示素子の一端より表示素子の基板に対して垂直方向に延在する延在部と、
当該延在部の先端の第一屈折点において外側に外曲げされた外曲げ部と、
前記外曲げ部の先端の第二屈折点において前記延在部と平行な方向に屈曲された平行部と、を有するピンコネクタの軸部の外曲げ加工方法であって、
前記延在部、前記外曲げ部および前記平行部が、形成される前の直線状のピンコネクタの軸部に対して、前記延在部を保持した状態で前記外曲げ部を第一屈折点において外曲げし、前記第二屈折点において前記平行部を非保持状態で前記延在部と平行な方向に屈曲させるピンコネクタの軸部の外曲げ加工方法。
An extending portion extending in a direction perpendicular to the substrate of the display element from one end of the display element;
An outer bent portion that is bent outward at the first refraction point at the tip of the extending portion;
A parallel portion bent in a direction parallel to the extending portion at a second refraction point at the tip of the outer bent portion, and an outer bending method of the shaft portion of the pin connector,
The extension part, the outer bending part, and the parallel part are formed on the first bending point with the extension part being held with respect to the shaft part of the linear pin connector before being formed. And bending the shaft portion of the pin connector in a direction parallel to the extending portion in a non-holding state at the second refraction point.
前記ピンコネクタの軸部の外曲げにおいて金型を用いる際、当該平行部を挟持する金型の隙間の間隔を、前記ピンコネクタの軸部の厚み寸法よりも大きくすることによって非保持状態を形成することを特徴とする請求項1に記載のピンコネクタの軸部の外曲げ加工方法。   When a mold is used for external bending of the pin connector shaft portion, a non-holding state is formed by making the gap between the mold sandwiching the parallel portion larger than the thickness dimension of the pin connector shaft portion. The outer bending method of the axial part of the pin connector of Claim 1 characterized by the above-mentioned. 前記隙間の間隔を、前記平行部が前記延在部に対して平行になるように調整することを特徴とする請求項2に記載のピンコネクタの軸部の外曲げ加工方法。   3. The outer bending method for a shaft portion of a pin connector according to claim 2, wherein an interval of the gap is adjusted so that the parallel portion is parallel to the extending portion.
JP2006351295A 2006-12-27 2006-12-27 Bending method of pin connector Expired - Fee Related JP4919797B2 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010221263A (en) * 2009-03-24 2010-10-07 Denso Corp Bending machine
EP3944907A1 (en) * 2020-07-27 2022-02-02 Jeilfa Co., Ltd. Terminal bending equipment

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JPH0290659A (en) * 1988-09-28 1990-03-30 Nec Corp Formation of resin sealed type semiconductor device outer lead
JPH03157623A (en) * 1989-11-15 1991-07-05 Sharp Corp Liquid crystal display device
JPH0442956A (en) * 1990-06-06 1992-02-13 Toowa Kk Work of lead of electronic component and device
JPH1126668A (en) * 1997-07-03 1999-01-29 Toshiba Corp Outer lead bending method and outer lead bending device
JP2002076653A (en) * 2000-08-24 2002-03-15 Seiko Epson Corp Display device and electronic apparatus using the same

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Publication number Priority date Publication date Assignee Title
JPH0290659A (en) * 1988-09-28 1990-03-30 Nec Corp Formation of resin sealed type semiconductor device outer lead
JPH03157623A (en) * 1989-11-15 1991-07-05 Sharp Corp Liquid crystal display device
JPH0442956A (en) * 1990-06-06 1992-02-13 Toowa Kk Work of lead of electronic component and device
JPH1126668A (en) * 1997-07-03 1999-01-29 Toshiba Corp Outer lead bending method and outer lead bending device
JP2002076653A (en) * 2000-08-24 2002-03-15 Seiko Epson Corp Display device and electronic apparatus using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010221263A (en) * 2009-03-24 2010-10-07 Denso Corp Bending machine
EP3944907A1 (en) * 2020-07-27 2022-02-02 Jeilfa Co., Ltd. Terminal bending equipment

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