JP2008164543A - Semiconductor testing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a leakage voltage from being applied from a semiconductor relay to a DUT. <P>SOLUTION: In a pin electronics part 100 of this semiconductor testing device, when a control part 150 performs OFF-control of the semiconductor relay 130 at a time other than a test time of the DUT 180, ON-control of a relay 140 for direct current measurement is performed simultaneously even when the direct current measurement is not performed. Even when a signal is outputted from a driver 110 in the OFF state of the semiconductor relay 130, and a leakage voltage is generated from an inter-output terminal capacity inside the semiconductor relay 130, the voltage is transmitted to a direct current measuring part 182 through the relay 140 for direct current measurement, thereby unexpected voltage application to the DUT 180 can be prevented. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a semiconductor test apparatus that performs a test by being connected to an object to be tested such as an IC device or a memory device via a pin electronics unit, and more particularly to a circuit configuration of the pin electronics unit.

  Conventionally, in a semiconductor test apparatus that performs a test such as a function check on a device under test (hereinafter referred to as a DUT) that is a semiconductor device such as an IC device or a memory device, it is connected to the DUT via a pin electronics section. Test signal output, signal input from the DUT, and determination are performed. In this pin electronics section, the connection with the DUT is switched, that is, ON / OFF control is performed using a semiconductor relay due to the feature that the service life is longer than that of a mechanical relay in recent years.

In the semiconductor test apparatus described in Patent Document 1 below, an example of a semiconductor apparatus including a pin electronics unit having a semiconductor relay therein is described. In this example, all the relays on the path from the pin electronics section to the performance board are semiconductor relays, and the common connection point of the driver, the comparator and the electronic load connected in parallel in the pin electronics section is a pogo pin via the first semiconductor relay. It is connected to the. An interrupt signal input terminal for DC measurement is connected to a connection point between the first semiconductor relay and the pogo pin via a series circuit of the second semiconductor relay and the third semiconductor relay, and the second semiconductor relay and the third semiconductor relay The connection point of the semiconductor relay is connected to the common potential point via the fourth semiconductor relay. With such a configuration, a pulse signal is prevented from being sent to the DUT side during calibration / diagnosis of the semiconductor test apparatus itself.
JP 2006-64488 A (FIG. 1)

  Moreover, in the conventional general semiconductor test apparatus, the pin electronics part which has a semiconductor relay inside is comprised as follows. FIG. 3 is an explanatory diagram showing a configuration around the pin electronics unit 200 in the semiconductor test apparatus in the prior art. In the pin electronics unit 200, a driver 210 and a comparator 220 are connected in parallel, and a semiconductor relay 230 connects these connection points and the DUT 300. A test signal generated inside the semiconductor test apparatus is output from the driver 210 to the DUT 300, and the signal input from the DUT 300 is compared with an expected value by the comparator 220. In addition, a DC measurement relay 240 is provided on a connection line that connects a connection point between the semiconductor relay 230 and the DUT 300 and, for example, a DC measurement unit provided outside, and ON / OFF of the connection between the DC measurement unit and the DUT 300 is established. OFF is controlled by the DC measurement relay 240.

  When the semiconductor test apparatus is used, the connection between the pin electronics unit 200 and the DUT 300 is ON / OFF controlled by the semiconductor relay 230 to input / output signals between the pin electronics unit 200 and the DUT 300, and the inside of the semiconductor test apparatus. Signal timing correction, deskew measurement and the like for the driver 210 and the comparator 220 are performed.

  However, in the pin electronics unit 200 of such a conventional semiconductor test apparatus, when the signal is input / output inside the semiconductor test apparatus, the semiconductor relay 230 is controlled to be OFF and the pin electronics unit 200 and the DUT 300 are not connected. Even if the connection between them is interrupted, if a signal voltage is output from the driver 210, a leakage voltage is generated from the capacitance between the output terminals (parasitic capacitor) inside the semiconductor relay 230, and the voltage is unexpectedly applied to the DUT 300. May be.

  Therefore, an object of the present invention is to provide a semiconductor test apparatus capable of suppressing the leakage voltage from the semiconductor relay from being applied to the test object.

  In order to achieve the above-described problems, a semiconductor test apparatus according to the present invention includes a direct current measurement unit that measures direct current characteristics of a test object and a signal that is connected to the test object separately from the direct current measurement unit. Pin electronics unit that performs input / output, a semiconductor relay that is provided in the pin electronics unit and performs ON / OFF control of connection with the test object, a connection point of the semiconductor relay, the test object, and a DC measurement unit And a DC measurement relay that performs ON / OFF control of the connection with the DC measurement unit and that is ON-controlled when the semiconductor relay is OFF controlled.

  With such a configuration, since the DC measurement relay is always controlled to be ON while the semiconductor relay is controlled to be OFF, even if leakage voltage is generated from the capacitance between the output terminals of the semiconductor relay in this state, This leakage voltage is applied to a direct current measurement unit (GND or the like) via a direct current measurement relay. For this reason, leakage voltage is reliably prevented from being applied to the test object while the semiconductor relay is controlled to be OFF. In addition, the DC measurement unit is an element necessary for applying / measuring DC voltage to the object under test separately from the application of the test signal, so there is no need to change the circuit configuration of the pin electronics unit on a large scale. May be.

  In the semiconductor test apparatus described above, the semiconductor relay may be connected to a driver provided in the pin electronics section for outputting a signal to the test target.

  With such a configuration, in the semiconductor test apparatus that inputs signals from the pin electronics unit to the measurement target using a driver, it is possible to prevent leakage voltage from flowing to the measurement target and prevent the risk of damage. .

  Another semiconductor test apparatus according to the present invention includes a pin electronics unit that is connected to an object to be tested and inputs / outputs a signal, and an ON / OFF control of connection with the object to be tested provided in the pin electronics unit. The semiconductor relay to be connected, and the semiconductor relay, the connection point to be tested, and a predetermined ground point are connected to the ground point to perform ON / OFF control, and the semiconductor relay is ON-controlled at the time of OFF control. And a grounding relay.

  With this configuration, since the grounding relay is controlled to be ON while the semiconductor relay is controlled to be OFF, even if a leakage voltage is generated from the capacitance between the output terminals of the semiconductor relay in this state, this leakage The voltage flows to the ground side via the grounding relay. Thereby, it is possible to reliably prevent the leakage voltage from the semiconductor relay from being applied to the test object.

  According to the semiconductor test apparatus according to the present invention, it is possible to reliably prevent the leakage voltage from the semiconductor relay from being applied to the test object and to ensure the safety thereof.

  In addition, since the direct current measurement unit is an essential element for the semiconductor test apparatus, the configuration for absorbing the leakage voltage using this function is extremely rational, and particularly enhances the usefulness of the present invention.

[First Embodiment]
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is an explanatory diagram showing a configuration around a pin electronics unit 100 provided in a test head of the semiconductor test apparatus according to the first embodiment. The pin electronics unit 100 is connected to a device under test (hereinafter referred to as a DUT) 180 through a signal transmission path or the like.

  The pin electronics unit 100 outputs a test signal generated in the semiconductor test apparatus from the driver 110 to the DUT 180, and inputs the signal from the DUT 180 by the comparator 120 connected in parallel with the driver 110 to compare and determine the signal. And so on.

  In addition, the pin electronics unit 100 includes a semiconductor relay 130 that connects a connection point between the driver 110 and the comparator 120 and the DUT 180. The semiconductor relay 130 is a relay element such as a photo MOS, for example, and has a function of switching the connection between the driver 110, the comparator 120 and the DUT 180 by ON / OFF control. Controlled by the controller 150, the connection is switched ON / OFF so that signals can be transmitted between the driver 110, the comparator 120, and the DUT 180.

  The pin electronics unit 100 includes a direct current measurement relay 140 that connects a connection point between the semiconductor relay 130 and the DUT 180 and a direct current measurement unit 182 having a direct current (DC) application / measurement function provided in the semiconductor test apparatus. Yes. The DC measurement relay 140 has a function of switching the connection between the connection point between the semiconductor relay 130 and the DUT 180 and the DC measurement unit 182 by ON / OFF control. The DC measurement relay 140 is switched ON / OFF by the control unit 150, thereby enabling DC application from the DC measurement unit 182 to the DUT 180 and output for DC measurement from the DUT 180.

  Here, the direct current measurement unit 182 is a device for performing a basic inspection as to whether or not the DUT 180 operates as designed, and is an element equipped in an existing semiconductor test apparatus. The DC measurement unit 182 has a function of supplying a current by using an interrupt signal or the like and measuring a power supply, a function of supplying a current and measuring a voltage, and the like.

  Furthermore, the pin electronics unit 100 includes a control unit 150 that controls the semiconductor relay 130 and the DC measurement relay 140 to switch connection ON / OFF.

  Subsequently, the operation of the pin electronics unit 100 of the semiconductor test apparatus in the first embodiment will be described. First, when performing signal timing correction, deskew measurement, and the like for the driver 110 and the comparator 120 inside the semiconductor test apparatus other than during the test of the DUT 180, the control unit 150 controls the semiconductor relay 130 to be OFF, and the pin electronics unit When the connection between 100 and the DUT 180 is cut off, the direct current measurement relay 140 is turned ON to connect the connection point between the semiconductor relay 130 and the DUT 180 and the direct current measurement unit 182 even when direct current measurement is not performed. Keep it.

  When a signal such as a waveform is output from the driver 110 by performing timing correction and deskew measurement in the semiconductor test apparatus, a leakage voltage is generated from the capacitance between the output terminals in the semiconductor relay 130, and this leakage voltage is generated. Is transmitted to the DUT 180 side.

  At this time, since the DC measurement relay 140 is ON-controlled and connected to the DC measurement unit 182, the leakage voltage is transmitted to the DC measurement unit 182 via the DC measurement relay 140. Then, the leakage voltage is applied to the DC measurement unit 182 so that the voltage is not unexpectedly applied to the DUT 180, and the danger that the DUT 180 is damaged is prevented.

  As described above, in the pin electronics unit 100 of the semiconductor test apparatus according to the first embodiment, when the control unit 150 performs OFF control of the semiconductor relay 130 except when testing the DUT 180, the DC measurement is not performed at the same time. Also, the DC measurement relay 140 is ON-controlled. Even if the signal output from the driver 110 is transmitted by performing timing correction, deskew measurement, etc. inside the semiconductor test apparatus and leakage voltage is generated from the capacitance between the output terminals inside the semiconductor relay 130, the DC measurement relay 140 is Thus, the voltage is transmitted to the DC measurement unit 182 and the voltage is not unexpectedly applied to the DUT 180.

  For this reason, even if a leakage voltage occurs other than during the test due to the use of the semiconductor relay 130, the leakage voltage is applied to the DUT 180 to about 50% as compared with the conventional technique (configuration of FIG. 3). Can be suppressed, thereby effectively preventing the DUT 180 from being damaged.

  Further, since the DC measuring unit 182 and the DC measuring relay 140 which are existing elements are used in the semiconductor test apparatus, it is not necessary to add a new function. Therefore, it is possible to rationally eliminate the disadvantages of adopting the semiconductor relay 130 without increasing the configuration of the pin electronics unit 100 and the like.

[Second Embodiment]
FIG. 2 is an explanatory diagram showing a configuration around the pin electronics unit 100 provided in the test head of the semiconductor test apparatus according to the second embodiment. In FIG. 2, a grounding relay 160 is connected between a connection point between the semiconductor relay 130 and the DUT 180 and a grounding point (GND point). The grounding relay 160 has a function of switching the connection between the connection point between the semiconductor relay 130 and the DUT 180 and the grounding point by controlling the controller 150 to ON / OFF control. Other configurations are the same as those in the first embodiment, and a description thereof will be omitted.

  In the pin electronics unit 100 of the semiconductor test apparatus according to the second embodiment, when the control unit 150 performs OFF control of the semiconductor relay 130 except during testing of the DUT 180, the grounding relay 160 is simultaneously ON controlled. Even if a signal output from the driver 110 is transmitted by performing timing correction, deskew measurement, etc. inside the semiconductor test apparatus and leakage voltage is generated from the capacitance between the output terminals inside the semiconductor relay 130, the grounding relay 160 is used. Therefore, the voltage is not unexpectedly applied to the DUT 180 by being transmitted to the ground point.

It is explanatory drawing which shows the structure of the pin electronics part of the semiconductor test apparatus of 1st Embodiment. It is explanatory drawing which shows the structure of the pin electronics part of the semiconductor test apparatus of 2nd Embodiment. It is explanatory drawing which shows the structure of the pin electronics part of the semiconductor test apparatus in a prior art.

Explanation of symbols

100, 200 Pin electronics section 110, 210 Driver 120, 220 Comparator 130, 230 Semiconductor relay 140, 240 DC measurement relay 150 Control section 160 Grounding relay 180, 300 DUT
182 DC measurement unit

Claims (3)

A direct current measurement unit for measuring the direct current characteristics of the test object;
A pin electronics unit that is connected to an object to be tested separately from the DC measurement unit and inputs and outputs signals,
A semiconductor relay that is provided in the pin electronics unit and performs ON / OFF control of connection with the test object;
Connected to the semiconductor relay, the connection point of the object to be tested, and the DC measurement unit to perform ON / OFF control of the connection with the DC measurement unit, and the semiconductor relay is ON-controlled during OFF control A semiconductor test apparatus comprising a relay. The semiconductor test apparatus according to claim 1,
The semiconductor test apparatus is characterized in that the semiconductor relay is connected to a driver provided in the pin electronics section for outputting a signal to the object to be tested. A pin electronics unit that is connected to the device under test to input and output signals;
A semiconductor relay that is provided in the pin electronics unit and performs ON / OFF control of the connection between the driver and the test object;
A grounding relay that is connected to the connection point of the semiconductor relay, the test target, and a predetermined grounding point, and performs ON / OFF control of the connection with the grounding point, and the semiconductor relay is ON-controlled during OFF control; A semiconductor test apparatus comprising:

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