JP2008162116A - Sheet for cut marking and method of sticking cut mark - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet for cut marking which enables formation of a cut mark with no decoloring, fading or blurring after repeated washing in daily life and a method of adhering a cut mark which enables easy and reliable formation of a cut mark ensuring excellent design and high quality and allows arranging of colors, pictures, patterns and/or images desirable for users like order-made counterparts. <P>SOLUTION: The sheet has an adhesive sheet layer 11 composed of a urethane based resin, a concealing white sheet layer 12 formed on one side of the adhesive sheet layer 11, being 20-30 μm thick and composed of a hardenable urethane based resin and a sheet layer 13 for marking formed on one side of the concealing white sheet layer 12 and composed of a curable urethane based resin being 25-50 μm thick. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a cut mark sheet and a cut mark adhesion method, and in particular, it is attached to a raw fabric body of an object to be bonded that is forcibly and frequently expanded and contracted, such as gymnastics and uniform, and expands and contracts together therewith. In addition, the present invention relates to a cut mark sheet and a cut mark adhesion method that are easy to attach even under conditions such as washing.

  Conventionally, for example, a uniform is suitably used for a plurality of players to form a team and play a game such as baseball and soccer. In that case, it is common to attach to the uniform a mark fabric designed with a predetermined character or pattern to represent the team to which it belongs.

  When the mark fabric is attached to the uniform, it is melted by heating the hot melt material laminated on the back of the mark fabric, rather than being anchored by a thread, and the hot melt material is melted into the mark fabric and the uniform body. They are impregnated with each other and integrated by the anchor effect (see Patent Document 1).

This mark fabric is made of a nylon-based fabric in which the main mark fabric is stretchable, and this is usually pre-colored by forming a toner layer on the surface layer by dyeing or printing. Yes.
JP-A-1-234238 (Claims)

  However, the mark fabric described in Patent Document 1 is limited to about 20 colors for manufacturing reasons, and the user who uses the mark selects the mark only within the limited color range. Can not. As a result, the range of user mark selection is limited. There has been a problem that a color, pattern, figure, image, or the like that the user likes can not be freely applied to the mark fabric.

  In addition, since it is very difficult for the mark fabric manufacturer to match the colors of the toner, it is not easy to repeatedly manufacture the mark fabric of the same color. As a result, there is a problem that the mark fabric dyed in the same color must be kept in stock in preparation for the repeat of the mark fabric from the user, and can be dealt with only by mass production of small varieties. It was.

  In addition, since the mark fabric is dyed or printed on the surface layer to form a toner layer and is colored to a desired single color, color loss, color blur, and color blur will occur when washing is repeated in daily life. May occur, and there is a problem that the commercial value is impaired.

  Therefore, the present invention is intended to solve the above-described problem, and a sheet for a cut mark that can be a cut mark that does not cause discoloration, color blur, or color bleeding even after repeated washing in daily life. Cut mark adhesion that can easily and reliably form cut marks that can ensure the high quality of products with excellent design properties and that can be applied to the user's preferred colors, designs, figures, images, etc. It aims to provide a method.

  The means taken by the invention according to claim 1 to solve the problems as described above is an adhesive sheet layer made of urethane resin, and is provided on one side of the adhesive sheet layer and has a thickness of 20 to 30 μm. A concealing white background sheet layer made of a curable urethane-based resin having a thickness, and a mark sheet layer made of a curable urethane-based resin having a thickness of 25 to 50 μm provided on the concealing white background sheet layer side. The sheet for cutting marks is characterized by being provided.

  Accordingly, since the mark sheet layer is made of urethane resin, one of the features is that sublimation transfer is possible. The cut mark sheet is cut into a desired shape to form a cut mark. A cut mark can be provided on the adherend simply by superimposing and pressing and heating the adherend layer so that the adhesive sheet layer is on the adherend side.

  Here, the adhesive sheet layer is prepared by mixing a diisocyanate such as tolylene diisocyanate, diphenylmethane diisocyanate, or hexamethylene diisocyanate with a polyol such as polyether polyol, polyester polyol, polycarbonate polyol, or polycaprolactone polyol. For example, what was formed in the sheet form which has a thickness of 80-100 micrometers is mentioned.

  Examples of the urethane resin for the adhesive sheet layer include a urethane resin having a melting temperature of 90 to 150 ° C., more preferably 95 to 105 ° C., manufactured by Nippon Polyurethane Industry Co., Ltd. The adhesive sheet layer may have a laminated structure. One layer of the laminated structure is made of a urethane-based resin having a melting temperature of 90 to 105 ° C., and the other layer is a urethane having a higher melting temperature than the one layer. A laminated adhesive sheet layer made of a resin may be used.

  The white sheet layer for concealment is prepared by mixing a diisocyanate such as tolylene diisocyanate, diphenylmethane diisocyanate, or hexamethylene diisocyanate with a polyol such as polyether polyol, polyester polyol, polycarbonate polyol, or polycaprolactone polyol. The white thing formed in the sheet form which adds 3-5% to 20-30 micrometers in thickness is mentioned.

  As the urethane-based resin of the white sheet layer for concealment, a curable resin containing a thermosetting compound is preferable. In particular, a heat-resistant urethane resin having a thermosetting property (curing type) having a melting temperature of 160 to 180 ° C., a curing temperature of 230 to 240 ° C., and a Duro hardness of 60 A to 80 A is preferable. In this case, dispersion of the sublimation dye held in the mark sheet layer can be prevented.

  The urethane resin and its cured product are described below. Here, the urethane-based resin refers to a large molecule (referred to as a polymer, a polymer, a resin, etc.) formed by reaction of isocyanate and alcohol with each other. When written in chemical formula,

  Resin molecules formed by reaction usually consist of a linear polymer, conceptually like a single long “string”. Therefore, it can be said that the resin is in a state where a large number of “strings” are entangled with each other indefinitely at normal temperature. When heat (force) is applied to this resin, the “string” is not subject to any restrictions, so if it slips, it will slip and change the shape of the assembled “string”. However, once the heating is stopped, it will keep its shape as if it were slid. In this way, when heat (force) is applied, it easily deforms and does not return to its original state is called thermoplasticity (just like clay-worked clay properties). Therefore, the urethane resin is just a thermoplastic resin.

  However, when an isocyanate called a curing agent is added to this urethane resin and heated, the polar group (reactive group of molecules) in the side chain of the “string” -like molecule of the urethane resin and the isocyanate molecule (compared to the string) (Relatively short) causes a reaction, and the “strings” are cross-linked. That is, a knot can be formed on the “string”.

  Incidentally, an isocyanate as a curing agent has one highly reactive polar group at each end of the molecule, so it is very efficient to connect hands. In addition, since the resin thus obtained is three-dimensionally cross-linked, it is not easily deformed even when it is heated (good heat resistance) and hardly dissolves in a solvent (good solvent resistance). Similarly, the urethane-based resin of the mark sheet layer is changed from a thermoplastic resin to a thermosetting resin by adding isocyanate.

  The mark sheet layer is prepared by mixing a diisocyanate such as tolylene diisocyanate, diphenylmethane diisocyanate, or hexamethylene diisocyanate with a polyol such as polyether polyol, polyester polyol, polycarbonate polyol, or polycaprolactone polyol. What was formed in the sheet form which has a thickness of 50 micrometers is mentioned.

  As the urethane resin of the mark sheet layer, a curable resin containing a thermosetting compound is preferable. In particular, a heat-resistant urethane resin having a thermosetting property (curing type) having a melting temperature of 170 to 200 ° C., a curing temperature of 230 to 240 ° C., and a durometer of 85 A to 95 A is preferable. In this case, it is excellent in robustness. For example, this is a product name (manufactured by Nippon Polyurethane Industry Co., Ltd.): NIPPOLAN (registered trademark) 5033, 5111, 5115, 5120, 5138, 5193, 5196, 5199, 5230, 5238, 5980 and diisocyanate 10: 1 to 4 What was contained in the ratio selected from the range of this can be mentioned. In addition, the said resin is more preferable at the point that brand name: NIPPOLAN (trademark) 5196, 5199, 5230, 5238 is non-yellowing.

  Examples of the diisocyanate include trade names (manufactured by Nippon Polyurethane Industry Co., Ltd.): Coronate (registered trademark) HX, XL, HXLV, HK, and L. Product name: Coronate (registered trademark) HX is preferred because it is easy to mix. Therefore, as a urethane-based resin for the mark sheet layer, preferably, the product name: NIPPOLAN (registered trademark) 5199 contains Coronate (registered trademark) HX in a ratio selected from the range of 10: 1 to 4. Is.

  As the mark sheet layer, a transparent one can be used, or one already colored can be used. A desired color, pattern, figure, image or the like can be sublimated and transferred to these as cut marks. The mark sheet layer may have a laminated structure, and one layer of the laminated structure has a thickness of, for example, 10 to 15 μm. For example, diisocyanate is selected from the range of 10: 3 to 5 for the resin. The other layer may be made of the urethane resin of the mark sheet layer.

  In the invention of claim 1, for concealment comprising a curable urethane-based resin having a thickness of 30 to 50 μm and containing activated carbon, which is disposed between the adhesive sheet layer and the concealment white sheet layer. A black sheet layer may be further provided.

  Here, as the black background sheet layer for concealment, for example, a polyol such as polyether polyol, polyester polyol, polycarbonate polyol, or polycaprolactone polyol is mixed with a diisocyanate such as tolylene diisocyanate, diphenylmethane diisocyanate, or hexamethylene diisocyanate. For example, the black thing formed in the sheet form which added activated carbon 2-5% and has a thickness of 30-50 micrometers is mentioned. As the urethane resin of the black background sheet layer for concealment, a heat-resistant urethane resin having a thermosetting property of a melting temperature of 160 to 180 ° C., a curing temperature of 230 to 240 ° C., and a durometer of 60A to 80A is preferable.

  The means taken by the invention according to claim 3 is a curable urethane type having a thickness of 20 to 30 μm on one surface side of a mark sheet layer made of a curable urethane type resin having a thickness of 25 to 50 μm. A step of forming a concealment white background sheet layer made of resin, and a step of disposing a thermal transfer paper on which a desired color, pattern, figure, image, or the like is printed with a sublimation dye on the other surface side of the mark sheet layer A step of sublimating and transferring the sublimation dye by heating to a desired temperature while pressing the thermal transfer paper, the mark sheet layer and the concealing white sheet layer with a desired pressure, and the concealing white sheet layer A step of forming a cut mark sheet having an adhesive sheet layer by thermally bonding a urethane resin to the side, a step of cutting the cut mark sheet into a desired shape, A step of superimposing a cut mark on the adherend so that the adhesive sheet layer of the adhesive mark is on the adherend side, and thermally bonding the adhesive sheet layer to the adherend. And a cut mark adhesion method.

Here, the desired pressure is preferably 50 to 100 g / cm ² , and the desired temperature is preferably 140 to 160 ° C. This temperature is more preferably 145 to 150 ° C. These heating / pressurizing times are about 2 minutes. Here, when the desired temperature is lower than 140 ° C., there is a possibility that the sublimation transfer cannot be performed neatly on the mark sheet layer. On the other hand, if the temperature exceeds 160 ° C., the thermal transfer paper may melt and be welded or impregnated in the mark sheet layer, and the thermal transfer paper may not be peeled from the mark sheet layer. In this case, there is a possibility that the commercial value of the cut mark will be significantly impaired. Therefore, the desired temperature is preferably 140 to 160 ° C, and more preferably 145 to 150 ° C.

  In the cut mark sheet of the present invention, the sublimation dye is difficult to enter the mark sheet layer, but the sublimation dye is retained in the mark sheet layer by the thermosetting compound contained in the mark sheet layer. Is done. Further, the concealment white sheet layer prevents the sublimation dye from dispersing in the mark sheet layer. Accordingly, color sublimation, color blur, and color blur hardly occur during sublimation transfer and over time after sublimation transfer.

  When the cut mark is formed on the adherend using the cut mark adhering method of the present invention, the color of the cloth of the adherend is concealed by the concealment white background sheet layer. Further, the concealment white sheet layer prevents the sublimation dye from being dispersed in the mark sheet layer. In this way, a clear color or the like is obtained and retained in the mark sheet layer of the cut mark.

  According to the cut mark sheet according to claim 1, it is possible to prevent color fading, color blurring, and color blurring of a color, a pattern, a figure, or an image due to a sublimation dye transferred to the mark sheet layer. Play.

  According to the sheet for cutting marks according to claim 2, in addition to the effect of the sheet for cutting marks according to claim 1, it is possible to further prevent the sublimation dye from being dispersed and to express the color of the cutting marks more clearly. And has the effect of being aesthetically pleasing.

  According to the cut mark adhesion method according to claim 3, a cut mark that is excellent in design and can ensure high quality of a product can be easily and reliably formed, and a color, a pattern, a figure, an image, or the like like a custom-made one There is an effect that can be applied.

  The best mode for carrying out the present invention will be described below with reference to the drawings. However, the present invention is not limited to the following examples as long as the gist of the present invention is not exceeded. FIG. 1 shows a cut mark sheet 10 according to an embodiment of the present invention. FIG. 2 is an explanatory diagram showing a state in which a cut mark is attached to a uniform which is an example of the adherend 1 using the cut mark bonding method according to the present invention.

(Example 1)
The cut mark sheet 10 is composed of an adhesive sheet layer 11 made of urethane resin, and a white background for concealment made of a curable urethane resin having a thickness of 20 to 30 μm provided on one surface side of the adhesive sheet layer 11. The sheet layer 12 and the mark sheet layer 13 made of a curable urethane-based resin having a thickness of 25 to 50 μm provided on the concealment white sheet layer 12 side are provided.

  The cut mark sheet 10 is used after being cut into a predetermined mark shape. For example, as shown in FIG. 2, the cut mark sheet 10 that has been cut is thermally bonded to an adherend 1 such as a uniform through an adhesive sheet layer 11.

  As the adhesive sheet layer 11, a urethane resin having a melting temperature of 90 to 150 ° C., more preferably 95 to 105 ° C., manufactured by Nippon Polyurethane Industry Co., Ltd. is heated by a heater plate at about 120 ° C. for about 20 minutes and then dried. The sheet was formed into a sheet having a thickness of 80 to 100 μm through a sheet forming process of removing the solvent.

  As the white sheet layer 12 for concealment, a thermosetting heat-resistant urethane-based resin (containing titanium white) having a melting temperature of 160 to 180 ° C, a curing temperature of 230 to 240 ° C, and a durometer of 60A to 80A manufactured by Nippon Polyurethane Industry Co., Ltd. The product was formed into a white sheet having a thickness of 20 to 30 μm through the same process as the sheet forming process of the adhesive sheet layer 11.

  Here, when the thickness of the concealment white sheet layer 12 is less than 20 μm, the white color of the concealment white sheet layer 12 is defeated by the color of the adherend 1 and the color, pattern, figure or image of the mark sheet layer 13. Etc. may become cloudy. That is, the concealment effect is weak and the commercial value may be impaired. Therefore, the thickness of the concealment white background sheet layer 12 is preferably 20 μm or more.

  When the thickness of the white sheet layer 12 for concealment exceeds 30 μm, the manufacturing process of the white sheet sheet 12 for concealment 20 to 25 μm / one time is repeated twice, so-called “twice coating”. In addition to the high cost, the cut mark itself becomes hard and the stretchability thereof is remarkably impaired, and the comfort of the adherend 1 may be deteriorated. Therefore, the thickness of the concealment white background sheet layer 12 is preferably 30 μm or less.

  Furthermore, the content ratio of the diisocyanate in the white sheet layer 12 for concealment can be a ratio selected from the range of 10: 0.5 to 2 for the diisocyanate in the resin, for example. Here, when the content ratio of the diisocyanate in the white sheet layer 12 for concealment is less than 0.5, the dispersion of the sublimation dye in the mark sheet layer 13 may not be sufficiently prevented. If dispersion of the sublimation dye cannot be prevented, the commercial value of the cut mark may be impaired. Therefore, the content ratio of the diisocyanate in the concealment white background sheet layer 12 is preferably 0.5 or more.

  In addition, when the content ratio of the diisocyanate in the white sheet layer 12 for concealment exceeds 2, the color and lines of the sublimation dye are clearly expressed, but the cut mark becomes hard and may damage the commercial value of stretchability. is there. Therefore, the content ratio of the diisocyanate in the white sheet layer 12 for concealment is preferably 2 or less.

  Therefore, the content ratio of the diisocyanate in the white sheet layer 12 for concealment can be a ratio selected from the range of 10: 0.5 to 2 for the diisocyanate in the resin, for example. More preferably, the concealing white background sheet layer 12 contains diisocyanate in the resin at a ratio of 10: 1.

  The mark sheet layer 13 is made of a heat-resistant curable polyurethane resin having a melting temperature of 170 to 200 ° C. (here, trade name: NIPPOLAN (registered trademark) 5199, and diisocyanate is selected within the range of 10: 1 to 4). Were used in the form of a sheet having a thickness of 25 to 50 μm through the same process as the sheet forming process of the adhesive sheet layer 11.

  Here, when the thickness of the mark sheet layer 13 is less than 25 μm, only a thin color can be sublimated and transferred to the mark sheet layer 13, and there is a possibility that the color due to the sublimation dye may not appear cleanly. In other words, the sublimation dye tends to flow laterally, and there is a possibility that the color, the pattern, the figure, the image, or the like is blurred or thinned. Further, since the sublimation dye is held in the thin layer, the mark sheet layer 13 may be rubbed and the color, pattern, figure, image, or the like may become thin. Therefore, the thickness of the mark sheet layer 13 is preferably 25 μm or more.

  On the other hand, if the thickness of the mark sheet layer 13 exceeds 50 μm, the image becomes clean, but the cut mark sheet 10 may become hard and costly. In other words, there is a possibility that a soft cut mark cannot be made. Therefore, the thickness of the mark sheet layer 13 is preferably 50 μm or less.

  Furthermore, the content ratio of the diisocyanate in the mark sheet layer 13 can be set to a ratio in which the diisocyanate is selected from the range of 10: 1 to 4 for the resin for the same reason as the concealment white sheet layer 12. . More preferably, the mark sheet layer 13 contains diisocyanate in a ratio of 10: 3 in the resin.

  Next, a method for manufacturing the cut mark sheet 10 and a cut mark adhesion method will be described with reference to FIG. FIG. 3 is an explanatory view showing a cut mark adhering method according to the present invention. In production, first, as shown in FIG. 3 (a), on one surface side of the heat-resistant curable urethane-based resin sheet for the mark sheet layer 13, the heat-resistant curing for the concealed white background sheet layer 12 is performed. The urethane-type resin sheets of the mold are overlapped, and these are heated and pressurized to form the concealment white sheet layer 12 on the mark sheet layer 13.

As shown in FIG. 3B, the thermal transfer paper 2 on which a desired color, pattern, figure, image, or the like is printed with sublimation dye ink is disposed on the other surface side of the mark sheet layer 13. Further, as shown in FIG. 3C, the thermal transfer paper 2, the mark sheet layer 13, and the concealment white background sheet layer 12 are pressed at a temperature of 145 to 150 ° C. for 2 minutes while being pressed at a pressure of 50 to 100 g / cm ^2. The sublimation dye is sublimated and transferred by heating. Thereafter, they are cooled.

  Further, as shown in FIG. 4D, a urethane resin sheet for the adhesive sheet layer 11 is superimposed on the white background sheet layer 12 side for concealment, and these are thermally bonded. Then, these are cooled to complete the cut mark sheet 10.

  Thereafter, the cut mark sheet 10 is cut into a desired shape as shown in FIG. Further, as shown in FIG. 3 (f), a cut mark is superimposed on the adherend 1 so that the adhesive sheet layer 11 is on the adherend 1 side, and the adhesive sheet layer 11 is formed by heating and pressing. It is melted and thermocompression bonded to the adherend 1.

  Therefore, according to the cut mark sheet 10, the sublimation dye is fixed or held in the mark sheet layer 13 by the thermosetting compound such as the diisocyanate contained in the mark sheet layer 13. It becomes difficult to elute the dye later. Further, according to the cut mark sheet 10, it is possible to prevent the sublimation dye of the mark sheet layer 13 from being dispersed by the concealment white background sheet layer 12 and flowing out to the concealment white background sheet layer 12 side.

  As described above, the sublimation dye can be held by the mark sheet layer 13 and the dispersion of the sublimation dye can be further prevented by the concealment white background sheet layer 12, so that the color, pattern, and pattern by the sublimation dye applied to the cut mark sheet 10 can be reduced. A figure or an image is less likely to be blurred, and color fading, color blur, and color blur can be prevented. And according to the sheet | seat 10 for cut marks, this can be cut out and it can be set as a cut mark.

  That is, according to the cut mark sheet 10, only the adhesive sheet layer 11 can be melted by heating to form the cut mark on the adherend 1. At that time, since the melting temperature of the mark sheet layer 13 is higher than the melting temperature (around 100 ° C.) of the polyester adhesive used in the laser printer, even if the cut mark is pressed with an iron or the like, the mark sheet layer 13 and the color, pattern, figure, image or the like by the sublimation dye applied thereto are not sticky and do not collapse.

  Further, according to the cut mark formed on the adherend 1, the color of the fabric of the adherend 1 can be concealed by the concealment white sheet layer 12, and the color applied to the mark sheet layer 13, A design, a figure, an image, etc. can be complemented and it is excellent in aesthetics.

  Further, when the adherend 1 is washed, the cut marks formed on the adherend 1 have a color, a pattern, and the like according to the structural features of the cut mark sheet 10 so long as washing is repeated in daily life. No discoloration or blurring of graphics or images. Therefore, according to the cut mark sheet 10, it is possible to obtain a cut mark having excellent robustness and high quality.

According to the cut mark bonding method, such a cut mark can be formed on the adherend 1 easily and reliably with a simple configuration. Further, in the sublimation transfer step, the sublimation transfer can be performed by heating at a temperature of 145 to 150 ° C. for 2 minutes while pressing at a pressure of 50 to 100 g / cm ² , so that the mark sheet layer 13 is melted. In addition, the thermal transfer paper 2 can be easily and cleanly peeled off from the mark sheet layer 13, and a mark subjected to a beautiful sublimation transfer can be formed.

  In particular, according to the cut mark adhering method, for example, a color, a pattern, a figure, an image, or the like that the user likes can be applied to the mark sheet layer 13 in a customized manner. Here, although the sublimation dye is difficult to enter the mark sheet layer 13, the dye is fixed or held in the mark sheet layer 13 by the thermosetting compound of the mark sheet layer 13, so that the dye is eluted after the sublimation transfer. Hard to do.

  Furthermore, it is possible to prevent the adhesive sheet layer 11 from spreading on the surface of the mark sheet layer 13 during thermal bonding, and to easily flow to the adherend 1 side. Therefore, the thickness of the adhesive sheet layer 11 can be formed thinner than the thickness of 80 to 100 μm. Therefore, the thickness of the adhesive sheet layer 11 is not limited to the thickness of the adhesive sheet layer 11 of the above-described embodiment. For example, when desired adhesive force is obtained, it may be formed to a thickness of 15 to 100 μm, for example.

  The cut mark sheet 10 can be sublimated. In this case, the white sheet layer 12 for concealment can prevent the sublimation dye of the mark sheet layer 13 from flowing out to the adhesive sheet layer 11 side, and the sublimation dye can be retained in the mark sheet layer 13, so that the color is light. Never become. Also, adhesion can be performed simultaneously with sublimation transfer.

(Comparative example)
The comparative example is an adhesive sheet layer 11 made of the same urethane-based resin as in Example 1, and a white sheet for concealment made of a urethane-based resin having a thickness of 20 to 30 μm provided on one surface side of the adhesive sheet layer 11. And a mark sheet layer made of a urethane-based resin having a thickness of 25 to 50 μm provided on the white background sheet layer side for concealment, wherein the resin and diisocyanate are mixed as the white background sheet layer for concealment The ratio is 10: 0.3, 10: 2, 10: 4, and the content ratio of the resin and diisocyanate is 10: 0.3, 10: 1, 10: 4 as the mark sheet layer. The cut mark adhesion method of the invention was applied.

  The adherend 1 on which cut marks of the examples and comparative examples are formed is washed 50 times with water at 40 ° C. based on JIS standards, and the color, pattern, figure or image of the cut mark is sharp and sharp. The hardness of the cut mark was confirmed. The case where there was no abnormality with respect to the sharpness was indicated as “◯”, the case where the sharpness was impaired as Δ, and the case where the sharpness was significantly impaired as “X”. The sharpness was evaluated as ◯, the sharpness was impaired as Δ, and the sharpness as markedly as poor. Regarding the hardness, ◯ indicates that there is no abnormality in the stretchability, Δ indicates that the degree of expansion / contraction is impaired, and X indicates that the expansion / contraction cannot be performed at all. As shown in Table 1, the examples were superior to the comparative examples. In addition, as the adherend 1, a material containing no sublimation dye was used.

(Example 2)
Another embodiment will be described with reference to FIGS. FIG. 4 is a cross-sectional view illustrating the cut mark sheet 20 according to the second embodiment. FIG. 5 is a cross-sectional view showing a state in which the cut mark cut out from the cut mark sheet 20 is thermally bonded to the adherend 1. The same parts as those of the cut mark sheet 10 of the first embodiment will be described with the same reference numerals.

  As shown in FIG. 4, the cut mark sheet 20 is disposed between the adhesive sheet layer 11 and the concealment white sheet layer 12 and has a thickness of 30 to 50 μm and contains activated carbon. The black background sheet layer 21 for concealment made of resin is further provided.

  As the black background sheet layer 21 for concealment, a heat-resistant urethane-based resin (containing activated carbon) having a thermosetting property having a melting temperature of 160 to 180 ° C., a curing temperature of 230 to 240 ° C., and a durometer of 60A to 80A manufactured by Nippon Polyurethane Industry Co., Ltd. The product was formed into a black sheet having a thickness of 30 to 50 μm through the same process as the sheet forming process of the mark sheet layer 13.

  Here, when the thickness of the concealment black background sheet layer 21 is less than 30 μm, the sublimation dye of the adherend 1 may be dispersed and protrude onto the concealment black background sheet layer 21. If the sublimation dye protrudes onto the black background sheet layer 21 for concealment, the color, pattern, figure or image of the mark sheet layer 13 may be blurred. This is to prevent the merchandise value from being impaired. Therefore, it is preferable that the black background sheet layer 21 for concealment has a thickness of 30 μm or more.

  Moreover, when the thickness of the black background sheet layer 21 for concealment exceeds 50 μm, like the white sheet layer 12 for concealment, the cut mark becomes costly and hard, and there is a risk of impairing economy and stretchability. Further, the cut mark sheet 20 may not be cut by a cutting machine made of a plotter. Therefore, the thickness of the black background sheet layer 21 for concealment is preferably 50 μm or less.

  Next, in manufacturing the cut mark sheet 20 and bonding the cut mark to the adherend 1, in the manufacturing method and cut mark bonding method of Example 1, first, one of the sheets for the mark sheet layer 13 is used. A sheet for the white background sheet layer 12 for concealment is superimposed on the surface side, and these are heated and pressed to form the white sheet layer 12 for concealment on the mark sheet layer 13.

  Then, a sheet for the black background sheet layer 21 for concealment is superimposed on the white sheet layer 12 side for concealment, and a laminated structure comprising the mark sheet layer 13, the white sheet layer 12 for concealment, and the black sheet layer 21 for concealment is formed. Form. Subsequent to the sublimation transfer process is the same as that of the first embodiment. In this way, the cut mark sheet 20 is completed.

  Therefore, the cut mark sheet 20 includes the adhesive sheet layer 11, the concealment white background sheet layer 12, the mark sheet layer 13, and the concealment black background sheet layer 21. Compared with the sheet 20, the color of the fabric of the adherend 1 can be concealed, and the color, pattern, figure, image or the like applied to the mark sheet layer 13 can be enhanced, and the aesthetics are excellent.

  Further, as shown in FIG. 5, since the white background sheet layer 12 for concealment and the black background sheet layer 21 for concealment are laminated, the sublimation dye of the mark sheet layer 13 is dispersed by the white background sheet layer 12 for concealment. Thus, it is possible to prevent the sublimation dye of the adherend 1 from being dispersed and flowing into the mark sheet layer 13 side by the concealing black background sheet layer 21.

  Thus, according to the cut mark sheet 20, it is possible to more strongly prevent the sublimation dye from being dispersed in the mark sheet layer 13 and the adherend 1. Therefore, for example, even when a cut mark is formed on the adherend 1 to which sublimation transfer has been performed, it is possible to prevent the appearance of the cut mark from being impaired by the dispersion of the sublimation dye, and the mark sheet layer 13 can be prevented from being damaged. The applied color, pattern, figure or image can be enhanced and the commercial value of the cut mark is not impaired.

(Example 3)
Another embodiment will be described. The cut mark sheet of Example 3 has a laminated structure of mark sheet layers, an adhesive sheet layer, a concealing white background sheet layer, a first mark sheet layer, and a second mark. It has a four-layer structure composed of a sheet layer. The same parts as those of the cut mark sheet 10 of the first embodiment will be described with the same reference numerals.

  The sheet for cut marks is an adhesive sheet layer 11 made of a urethane resin, and a concealing material made of a curable urethane resin having a thickness of 20 to 30 μm provided on one surface side of the adhesive sheet layer 11. A white sheet layer 12, a first mark sheet layer made of a curable urethane-based resin having a thickness of 25 to 50 μm provided on the concealing white sheet layer 12 side, and the first mark sheet layer side And a second mark sheet layer made of a curable urethane-based resin having a thickness of 10 to 15 μm and a higher content ratio of the thermosetting compound than the first mark sheet layer. .

  The first mark sheet layer is made of a heat-resistant curable polyurethane resin having a melting temperature of 170 to 200 ° C. (here, trade name: NIPPOLAN (registered trademark) 5199, diisocyanate of 10: 0.5 to 2). The material contained at a ratio selected from the range was used after being formed into a sheet having a thickness of 25 to 50 μm through the same process as the sheet forming process of the adhesive sheet layer 11.

  The second mark sheet layer comprises a heat-resistant curable polyurethane resin having a melting temperature of 170 to 200 ° C. (in this case, trade name: NIPPOLAN (registered trademark) 5199 and diisocyanate within a range of 10: 3 to 5). Were used in the form of a sheet having a thickness of 10 to 15 μm through the same process as the sheet forming process of the adhesive sheet layer 11.

  Here, when the thickness of the second mark sheet layer is less than 10 μm, it can be finely sublimated and transferred to the second mark sheet layer on the surface layer, and the sublimation dye is also applied to the deep first mark sheet layer. Although it is in a held state, the second mark sheet layer may be rubbed and the color, pattern, figure, image, or the like may become thin. Therefore, the thickness of the second mark sheet layer is preferably 10 μm or more.

  Also, if the thickness of the second mark sheet layer exceeds 15 μm, the image and the like will be clean, but the total thickness of the sheet combined with the other layers will be thick, and the cut mark sheet will be hard and costly. There is a risk. Therefore, the thickness of the second mark sheet layer is preferably 15 μm or less.

  Furthermore, the content ratio of the thermosetting compound in the second mark sheet layer includes, for example, one in which the content ratio of the resin and diisocyanate is selected from the range of 10: 3 to 10: 5. More preferably, the content ratio is 10: 4.

  Next, in manufacturing the cut mark sheet and bonding the cut mark to the adherend 1, in the manufacturing method and cut mark bonding method of Example 1, first, the first mark sheet layer sheet A sheet for the white background sheet layer 12 for concealment is superposed on one surface side, and these are heated and pressed to form the white sheet layer 12 for concealment on the first mark sheet layer.

  After that, the second mark sheet layer sheet is overlaid on the other surface side of the first mark sheet layer sheet, and the concealment white background sheet layer 12, the first mark sheet layer, A laminated structure including two mark sheet layers is formed.

Thereafter, the thermal transfer paper 2 on which a desired color, pattern, figure, image or the like is printed with sublimation dye ink is disposed on the surface layer side of the second mark sheet layer. Further, while pressing the thermal transfer paper 2, the second mark sheet layer, the first mark sheet layer, and the concealment white background sheet layer 12 at a pressure of 50 to 100 g / cm ² , the temperature is 145 to 150 ° C. for 2 minutes. The sublimation dye is sublimated and transferred by heating. Thereafter, they are cooled.

  Further, a urethane resin sheet for the adhesive sheet layer 11 is superposed on the concealing white sheet layer 12 side, and these are thermally bonded. And after that, these are cooled and the sheet | seat for cut marks of Example 3 is completed. The sublimation transfer step, the step of cutting out the cut mark sheet and forming the cut mark, and the step of bonding to the adherend 1 are the same as in the first embodiment.

  According to this cut mark sheet and cut mark adhesion method, the sublimation dye can be more strongly held by the thermosetting compound of the second mark sheet layer. Therefore, the content ratio of the thermosetting compound in the first mark sheet layer can be reduced. For example, the content ratio of the resin and diisocyanate in the first mark sheet layer can be in the range of 10: 0.5 to 2.

  When the content ratio of the diisocyanate in the first mark sheet layer is low, the stretchability of the first mark sheet layer is improved. On the other hand, the second mark sheet layer itself is a hard layer, but the thickness of the second mark sheet layer is thinner than that of the first mark sheet layer. There is no problem with the firmness of the cut mark due to the stretchability of the first mark sheet layer, the concealment white background sheet layer, and the adhesive sheet layer provided between the object to be bonded 1. There is no feeling that the comfort of the adherend 1 is poor.

  Therefore, according to the cut mark sheet and the cut mark adhesion method, a cut mark excellent in terms of the sharpness, sharpness, and hardness of a color, a pattern, a figure, an image, or the like by a sublimation dye can be obtained.

  As mentioned above, although the best mode about the sheet | seat for cutting marks of this invention was demonstrated based on the Example, this invention is not limited to the structure described in the said Example, In the range which does not deviate from the meaning The configuration can be changed as appropriate.

  For example, the cut mark sheet includes an adhesive sheet layer made of urethane resin having a melting temperature of 130 to 150 ° C., and a curable urethane having a thickness of 20 to 30 μm provided on one surface side of the adhesive sheet layer. A white sheet layer for concealment made of an epoxy resin, a mark sheet layer made of a curable urethane resin having a thickness of 25 to 50 μm provided on the white sheet layer side for concealment, and the other of the adhesive sheet layers And an adhesive layer for an adherend made of a urethane resin having a melting temperature lower than that of the adhesive sheet layer (for example, a melting temperature of 90 to 110 ° C.) and having a thickness of 15 to 25 μm. May be.

  In this case, the cut mark cut out from the cut mark sheet is superimposed on the adherend so that the adherend adhesive layer is on the adherend side, and the adherend adhesive layer becomes the adherend. The mark can be provided on the adherend simply by pressurizing and heating until it disappears after impregnation. In addition, the adhesive layer for the adherend can enter the fabric of the adherend and supplement the adhesive force of the adhesive layer. That is, a cutting mark having a stronger adhesive force can be formed on the adherend.

  Moreover, the sheet | seat layer for adhesion | attachment of the sheet | seat for cutting marks of Examples 1-3 can be made into such a laminated structure. That is, it further includes a concealing black background sheet layer made of a curable urethane-based resin having a thickness of 30 to 50 μm and containing activated carbon, which is disposed between the adhesive sheet layer and the concealing white background sheet layer. May be. Further, the mark sheet layer may have a laminated structure including a first mark sheet layer and a second mark sheet layer.

  The cut mark sheet of the present invention can be used in the industrial field of mark formation in which a cut mark having a urethane resin bonding sheet layer formed on the back surface is heated and bonded to an adherend.

It is sectional drawing which shows one Example of the sheet | seat for cutting marks of this invention. It is explanatory drawing which shows the state by which the sheet | seat for marks concerning this invention was attached to the uniform. It is explanatory drawing which shows the cut mark adhesion | attachment method which concerns on this invention. 6 is a cross-sectional view showing a cut mark sheet of Example 2. FIG. It is sectional drawing which shows the state which thermally bonded the cut mark cut out from the sheet | seat for cut marks of the said Example to the to-be-adhered thing.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Adhered object 2 Thermal transfer paper 10, 20 Cut mark sheet 11 Adhesive sheet layer 12 Concealment white background sheet layer 13 Mark sheet layer 21 Concealment black background sheet layer

Claims (3)

An adhesive sheet layer made of urethane resin;
A concealing white background sheet layer made of a curable urethane-based resin having a thickness of 20 to 30 μm provided on one side of the adhesive sheet layer;
A mark sheet layer made of a curable urethane-based resin having a thickness of 25 to 50 μm provided on the concealment white background sheet layer side;
A sheet for cutting marks, characterized by comprising:   A black background sheet layer for concealment made of a curable urethane-based resin having a thickness of 30 to 50 μm and containing activated carbon disposed between the adhesive sheet layer and the concealment white sheet layer; The cut mark sheet according to claim 1. A step of forming a concealing white background sheet layer made of a curable urethane-based resin having a thickness of 20 to 30 μm on one surface side of a mark sheet layer made of a curable urethane-based resin having a thickness of 25 to 50 μm When,
A step of disposing a thermal transfer paper on which a desired color, pattern, figure, image, or the like is printed with a sublimation dye on the other surface side of the mark sheet layer;
Heating the desired temperature while pressing the thermal transfer paper, the mark sheet layer and the concealing white background sheet layer at a desired pressure, and sublimating and transferring the sublimation dye;
Forming a cut mark sheet having an adhesive sheet layer by thermally bonding a urethane-based resin on the concealing white sheet layer side;
A step of making the cut mark sheet cut into a desired shape;
A step of superimposing the cut mark on the adherend so that the adhesive sheet layer of the cut mark is on the adherend side, and thermally bonding the adhesive sheet layer to the adherend;
A cutting mark adhesion method comprising:

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