JP2008159341A - Led lighting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To favorably maintain the luminous efficiency of LEDs, in an LED lighting device integrated with a case accommodating a light source having the LEDs and a case accommodating a power source which feeds electricity to the LEDs. <P>SOLUTION: The LED lighting device 10 provided with a first case 11 accommodating LED units 17, and a second case part 12 accommodating a power source 28 which feeds electricity to the LED units 17 with the first case 11 and the second case 12 integrated further has a gap 35 between the first case 11 and the second case 12 for restraining thermal conduction between the both cases 11, 12. The thermal conduction between the both cases 11, 12 is restrained by the gap 35. By this. heat generated at the power source 28 can be restrained from being transmitted to the LED units 17 to restrain a temperature rise in the vicinity of the LED units 17. As a result, the luminous efficiency of the LEDs can be favorably maintained. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an LED lighting device.

  2. Description of the Related Art A lighting device using LEDs is known in which a housing portion in which an LED is housed and a housing portion in which a power source is housed are integrated (see, for example, Patent Document 1). According to this, since it is not necessary to install both housing | casing parts separately and both housing | casing parts can be installed at once, it becomes possible to improve the workability | operativity of an LED lighting apparatus.

In general, when electronic components are placed at a high temperature, the life of the product may be reduced. For this reason, it is common practice to form the housing part for housing the LED and the housing part for housing the power source with a material having high thermal conductivity so that the heat generated in both housing parts is easily released to the outside. ing.
JP 2005-286267 A

  However, in the LED lighting device in which both housing parts are integrated, if both housing parts are formed of a material having high thermal conductivity, heat generated by the power source is easily transmitted to the LED side. Therefore, the temperature in the vicinity of the LED tends to rise. In particular, in an illuminating device including a large number of LEDs, the value of the current passed to turn them on and the amount of heat generated by the power supply also increase, and the temperature in the vicinity of the LEDs tends to increase accordingly. In general, the luminous efficiency of LEDs depends on temperature, and it is known that the luminous efficiency decreases as the temperature increases. For this reason, if the temperature in the vicinity of the LED rises by integrating both housing parts, the luminous efficiency of the LED may decrease.

  The present invention has been made in view of the above problems, and in an LED lighting device in which a housing unit that houses a light source having an LED and a housing unit that houses a power source for supplying power to the LED are integrated, It aims at providing the LED lighting apparatus which can maintain luminous efficiency favorably.

  Hereinafter, means effective for solving the above-described problems will be described. In the following, in order to facilitate understanding, a corresponding configuration example in the embodiment of the invention is appropriately shown in parentheses, but is not limited to the specific configuration example shown in parentheses.

  In order to solve the above-mentioned problem, in the invention according to claim 1, a first housing part (first housing part 11, 111, 211, etc.) that houses a light source (LED unit 17) having an LED, and the light source And a second housing portion (second housing portion 12, 112, 212, etc.) that accommodates a power source (power source 28) that supplies power to the power source, and the first housing portion and the second housing portion are integrated. In the LED lighting device (LED lighting device 10), a heat conduction inhibiting portion (gap 35) that inhibits heat conduction between the two housing portions between the first housing portion and the second housing portion. , 235, a heat insulating member 40, and a heat insulating sheet 48).

  The invention according to claim 2 is characterized in that the heat conduction suppressing portion has a larger thermal resistance than the first and second housing portions.

  According to a third aspect of the present invention, the first casing portion and the second casing portion are formed so that a gap (gap 35, 235) is formed between the first casing portion and the second casing portion. Are partly brought into contact with each other and integrated, and the heat conduction inhibiting portion is formed by the gap.

  According to a fourth aspect of the present invention, the first casing portion (first casing portion 111) and the second casing portion (second casing portion 112) are integrated with each other via a connecting portion (connecting portion 213). The heat conduction inhibiting portion is formed by molding and making the member thickness of the connecting portion smaller than the member thickness of the two casing portions.

  According to a fifth aspect of the present invention, a hole portion (through hole 44) is provided in at least one outer wall portion (the peripheral wall portions 15 and 26, the upper surface portions 13 and 24) of the first and second casing portions. It is characterized by communication between the inside and outside of the body.

  According to the sixth aspect of the present invention, the radiating fins (radiating fins 16, 27, 216, 227) are provided on at least one outer wall portion (the peripheral wall portions 15, 26, the upper surface portions 213, 224) of the first and second casing portions. ).

  The invention according to claim 7 is characterized in that the power source is brought into contact with an inner wall portion (upper surface portions 24, 224, peripheral wall portion 26) of the second casing portion.

  According to an eighth aspect of the present invention, a heat conduction part (silicone resin 31, rib 41, power supply surrounding member 42, rod 43) that connects the power supply and the second housing part is provided, and a part of the power supply is provided In addition to being in direct contact with the inner wall portion of the second housing portion, the other portion of the power source is connected to the inner wall portion of the second housing portion via the heat conducting portion.

  The invention according to claim 9 is characterized in that the heat conducting portion (rib 41, power supply surrounding member 42, rod 43) is made of metal.

  The invention according to claim 10 is characterized in that the heat conducting portion (silicone resin 31) is formed of a resin.

  The invention according to claim 11 is characterized in that a plurality of the heat conducting portions are provided, and a part of the plurality of heat conducting portions is formed of a metal and the other is formed of a resin.

  In the invention described in claim 12, the first casing portion (first casing portion 211) and the second casing portion (second casing portion 212) are arranged in a horizontal direction in the installed state of the LED lighting device. It is characterized by being arranged adjacent to each other.

  In the first aspect of the present invention, heat conduction between the first housing portion that houses the light source and the second housing portion that houses the power source is suppressed. For this reason, it can suppress that the heat which generate | occur | produced with the power supply is transmitted to a light source, and it becomes possible to suppress the temperature rise near a light source. As a result, it becomes possible to maintain the luminous efficiency of the LED satisfactorily.

  In the invention according to claim 2, since the thermal resistance of the heat conduction inhibiting portion is made larger than the thermal resistance of the first and second housing portions, it is possible to suitably suppress the heat conduction between the two housing portions. It becomes possible.

  In the invention according to claim 3, heat conduction between the first housing part and the second housing part is suppressed by forming a gap between the first housing part and the second housing part. Is possible. That is, air generally has a higher thermal resistance than metal. For this reason, it becomes possible to suppress heat conduction between both housing parts by providing a gap between both housing parts.

  In the invention according to claim 4, heat conduction between the first housing portion and the second housing portion is achieved by making the member thickness in the connecting portion smaller than the member thickness in the first and second housing portions. Can be suppressed. That is, in general, the thermal resistance is inversely proportional to the cross-sectional area of the member. For this reason, by forming the member thickness of the connection portion smaller than the member thickness of both housing portions, the thermal resistance of the connection portion is made larger than both housing portions, and heat conduction between both housing portions is suppressed. It becomes possible.

  According to the fifth aspect of the present invention, the inside and outside of the casing can be ventilated by forming a hole that communicates the inside and outside of the casing. Thereby, it is possible to suppress heat from being generated in the housing portion and to dissipate heat from the housing portion to the outside, thereby suppressing a temperature rise in the housing portion.

  In the invention according to claim 6, it is possible to effectively dissipate heat from the casing by providing the radiation fins, and it is possible to suppress the temperature rise of the casing.

  According to the seventh aspect of the present invention, the heat of the power source can be effectively transmitted to the second housing portion by bringing the power source into contact with the inner wall portion of the second housing portion. As a result, it is possible to suppress heat from being generated in the second housing part and to effectively dissipate heat through the second housing part, thereby suppressing an increase in temperature of the second housing part. It becomes.

  According to the eighth aspect of the present invention, the heat generated by the power source is conducted to the second housing portion through a direct contact portion between the power source and the inner wall portion of the second housing portion, and the power source and the second power source. It is conducted to the second housing part via a heat conducting part that connects the inner wall part of the housing part. Thereby, the heat generated by the power source can be efficiently transmitted to the second housing part. As a result, it is possible to suppress heat from being generated in the second housing part and to effectively dissipate heat through the second housing part, thereby suppressing an increase in temperature of the second housing part. It becomes.

  In the invention according to claim 9, the heat conducting portion is made of metal. In general, since metal has high thermal conductivity, it is possible to effectively conduct heat generated by the power source to the second casing.

  In the invention according to claim 10, since the heat conducting part is formed of resin, it is possible to improve the adhesion of the contact part between the power source and the heat conducting part. As a result, the thermal conductivity from the power source to the heat conducting unit can be increased, and the heat generated by the power source can be effectively conducted to the second housing unit.

  In invention of Claim 11, the heat conductive part formed with the metal and the heat conductive part formed with resin are provided. The heat generated by the power supply is formed by forming a part of the heat conduction part with a metal, which is a material with high heat conductivity, and forming the other part of the heat conduction part with a resin that can improve the adhesion at the contact part. Can be effectively conducted to the second housing portion.

  In the twelfth aspect of the invention, since the first housing portion and the second housing portion are disposed adjacent to each other in the horizontal direction in the installed state of the LED lighting device, the heat dissipation of the housing portion is maintained well. It becomes possible to do. That is, when the first and second housing parts are divided and arranged in the vertical direction in the installation state of the LED lighting device, the air heated by the heat generated in the housing part installed below rises and moves upward. Dissipates heat dissipation from the casing installed in the unit. In this regard, if both housing parts are arranged adjacent to each other in the horizontal direction in the installed state of the LED lighting device, the heat radiation of the other housing part is radiated by the rise of air heated by the heat generated in one housing part. Generation | occurrence | production of the situation which is inhibited can be suppressed and the heat dissipation of a housing | casing part can be maintained favorable.

[First Embodiment]
Hereinafter, a first embodiment of an LED lighting device according to the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of an LED lighting device according to the present embodiment, and FIG. 2 is a longitudinal sectional view of the LED lighting device.

  As shown in FIGS. 1 and 2, the LED lighting device 10 includes a first housing part 11 and a second housing part 12. The 1st housing | casing part 11 is a bottomed cylindrical shape, and is formed with highly heat conductive metals, such as aluminum. The first housing part 11 is arranged so that the upper surface part 13 on one end side of the cylinder faces upward and the opening part 14 on the other end side faces downward.

  A large number of heat radiation fins 16 are formed on the outer side of the peripheral wall portion 15 of the first housing portion 11. An LED unit 17 is accommodated in the first housing part 11. The LED unit 17 is configured by mounting a plurality of white LED packages 18 which are surface-mounted components on a metal wiring board 19. The wiring substrate 19 is fixed to the upper surface portion 13 of the first housing portion 11 via the heat radiating resin sheet 20. Each LED package 18 is mounted on the wiring board 19 so as to include a lot of light distribution components in a direction perpendicular to the wiring board 19. In this embodiment, the LED lighting device 10 is installed in the direction shown in FIGS. 1 and 2, that is, the direction in which the LED package 18 irradiates downward.

  The second housing portion 12 is also formed of a metal having a high thermal conductivity such as aluminum. The second housing portion 12 is composed of a bottomed cylindrical container member 22 and a disk-shaped lid member 23. The vessel member 22 is arranged so that the upper surface portion 24 on one end side of the cylinder faces upward and the opening portion 25 on the other end side faces downward. The lid member 23 is fixed to the opening 25 of the vessel member 22 to form a hollow cylinder.

  A large number of radiating fins 27 are also formed on the outer side of the peripheral wall portion 26 of the second housing portion 12. A power supply 28 for supplying power to the LED unit 17 is accommodated in the second housing part 12. The power supply 28 is configured by housing a printed wiring board 30 on which electronic components such as a resistor, a capacitor, and a transistor are mounted in a box-type power supply case 29 formed of a metal having high thermal conductivity such as aluminum. The power supply case 29 is fixed with its upper surface portion 29 a in contact with the upper surface portion 24 of the container member 22. In addition, a silicone resin 31 is filled around the power supply case 29 in the container member 22 in the second housing portion 12. The lid member 23 is fixed to the opening 25 of the vessel member 22 after fixing the power supply 28 to the upper surface portion 13 of the vessel member 22 and filling the periphery with the silicone resin 31.

  A convex portion 32 is formed on the upper surface portion 13 of the first housing portion 11 so as to protrude outward (on the side opposite to the LED unit 17) of the first housing portion 11. The convex portion 32 is formed with a through hole penetrating in the inner and outer directions of the first housing portion 11. The first housing unit 11 and the second housing unit 12 are fastened with screws 34 in a state in which the convex portion 32 is in contact with the lid member 23 of the second housing unit 12. That is, as shown in FIGS. 1 and 2, the first and second housings are arranged adjacent to each other in the vertical direction in the installed state of the LED lighting device 10. Further, as shown in FIG. 2, both housing portions 11, 12 have a convex portion 32 in contact with the lid member 23 and have a gap 35 between the first housing portion 11 and the second housing portion 12. Are combined. In addition, the convex part 32 should just be a magnitude | size which can form the through-hole by which the screw 34 is penetrated, and is formed so that the contact area of the convex part 32 and the 2nd housing | casing part 12 may become small.

  According to the embodiment described above in detail, the following excellent effects can be obtained.

  The first housing portion 11 and the second housing portion 12 are only in contact with each other by the convex portion 32 and the screw 34 provided there, and the first housing portion 11 and the second housing portion 12 are in contact with each other. The contact area is made small. Further, a gap 35 is formed between the first housing part 11 and the second housing part 12. Here, the thermal resistivity of air is larger than the thermal resistivity of a highly thermally conductive metal such as aluminum. For this reason, the thermal resistance between the 1st housing | casing part 11 and the 2nd housing | casing part 12 is larger than the thermal resistance of the 1st and 2nd housing | casing parts 11 and 12. FIG. That is, a portion that suppresses mutual heat conduction is formed between the first housing portion 11 and the second housing portion 12. Thereby, it is suppressed that the heat which generate | occur | produced in each housing | casing part 11 and 12 mutually influences. As a result, it is possible to suppress the heat generated by the power source 28 from being conducted to the LED unit 17 via the first and second housing parts 11 and 12, and the temperature of the LED unit 17 rises to increase the luminous efficiency of the LED. Can be suppressed.

  Moreover, since the mutual thermal influence between the 1st housing | casing part 11 and the 2nd housing | casing part 12 can be suppressed, the LED lighting apparatus 10 is designed based only on the separate temperature conditions of the LED unit 17 and the power supply 28. FIG. And the design likelihood can be improved. As a result, for example, it is not necessary to enlarge the heat dissipating fins 16 of the first housing 11 in which the LED unit 17 is accommodated in consideration of the influence of heat from the power supply 28, so the size of the LED lighting device 10 is reduced. Can be realized.

  In the present embodiment, the metal wiring board 19 on which the LED package 18 is mounted is fixed to the upper surface part 13 of the first housing part 11. For this reason, the heat generated in the LED unit 17 can be effectively conducted to the first housing part 11. In particular, in the present embodiment, the metal wiring board 19 is fixed to the upper surface portion 13 of the first housing part 11 via the heat-dissipating resin sheet 20, and thus the adhesion between the wiring board 19 and the first housing part 11. The thermal conductivity from the wiring board 19 to the first housing part 11 can be increased. Moreover, since the 1st housing | casing part 11 is formed with highly heat conductive metals, such as aluminum, the heat | fever conducted by the 1st housing | casing part 11 can be discharge | released outside effectively. As a result, it is possible to suppress a temperature increase in the vicinity of the LED unit 17, and thus it is possible to suppress a decrease in the light emission efficiency of the LED due to an increase in the temperature in the vicinity of the LED unit 17.

  In the present embodiment, the power supply case 29 is made of a metal having a high thermal conductivity such as aluminum, and is fixed in contact with the second housing portion 12 that is also made of a metal having a high thermal conductivity. For this reason, the heat generated by the power supply 28 can be effectively conducted to the second housing portion 12. In the present embodiment, a silicone resin 31 is filled around the power supply case 29 in the second housing portion 12. Silicone resin 31 has a lower thermal conductivity than metal, but has a higher thermal conductivity than air. Therefore, unlike the case where the heat of the power supply 28 is conducted to the second housing 12 through air, the heat conduction efficiency can be improved by conducting heat through the silicone resin 31. The heat generated by the power supply 28 can be more efficiently transmitted to the second housing portion 12. As a result, it is possible to prevent heat from being released from the second housing portion 12 to increase the temperature of the power supply 28, and to improve the reliability of the power supply 28 and thus the LED lighting device 10. .

  In the present embodiment, since both the first housing part 11 and the second housing part 12 have the radiation fins 16 and 27 outside the peripheral wall parts 15 and 26, the first and second housings are effectively provided. It is possible to dissipate heat to the outside of the parts 11 and 12, and it is possible to suppress the temperature rise of both the casing parts 11 and 12.

[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to the drawings. FIG. 3 is an exploded perspective view of the LED lighting device according to the present embodiment. In addition, about the structure similar to 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  In the first embodiment, both the casing portions 11 and 12 are fastened in a state where the first casing portion 11 and the second casing portion 12 are in contact with each other at the convex portion 32 formed on the first casing portion 11. A gap 35 was formed between the housing portions 11 and 12. On the other hand, in this embodiment, instead of forming the convex portion 32 on the first housing portion 11, a ring-shaped heat insulating member 40 is provided between the first housing portion 11 and the second housing portion 12. Arrange. Then, both the casing portions 11 and 12 are fastened together with the ring-shaped heat insulating member 40 interposed between the first casing portion 11 and the second casing portion 12, and both the casing portions 11 and 12. A gap 35 is formed between them.

  By disposing the heat insulating member 40 between the first housing portion 11 and the second housing portion 12, the mutual heat conduction between the housing portions 11 and 12 can be compared with the configuration of the first embodiment. Further suppression is possible. That is, in the present embodiment, mutual heat conduction is suppressed by the gap 35 formed between the two housing parts 11 and 12, and heat conduction between the two housing parts 11 and 12 is also suppressed by the heat insulating member 40. Is done. As a result, it is possible to further suppress the thermal influence between the two housing parts 11 and 12.

[Third Embodiment]
Next, a third embodiment of the present invention will be described with reference to the drawings. FIG. 4 is a longitudinal sectional view of the LED lighting device according to the present embodiment. In addition, about the structure similar to 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  In 1st Embodiment, both the housing | casing parts 11 and 12 were integrated by fastening the 1st housing | casing part 11 and the 2nd housing | casing part 12 which were formed separately with the screw 34. FIG. In this embodiment, the housing 110 includes first and second housing portions 111 and 112 and a connection portion 113 that connects the housing portions 111 and 112, and these are integrally formed. And the thickness of the member in the connection part 113 is formed smaller than the thickness of the member in the 1st and 2nd housing | casing part 111,112. Generally, the thermal resistance is inversely proportional to the cross-sectional area of the member. For this reason, in the connection part 113, thermal resistance is larger than the 1st and 2nd housing | casing part 111,112. Note that, in the present embodiment, unlike the first embodiment, the silicone resin 31 is not filled around the power supply 28 in the second housing portion 112.

  In this embodiment, the 1st housing | casing part 111 and the 2nd housing | casing part 112 are connected via the connection part 113 with larger thermal resistance compared with these. For this reason, it becomes possible to suppress the mutual heat influence between the 1st and 2nd housing | casing parts 111 and 112. FIG.

[Fourth Embodiment]
Next, a fourth embodiment of the present invention will be described with reference to the drawings. FIG. 5 is a longitudinal sectional view of the LED lighting device according to the present embodiment, and FIG. 6 is a longitudinal sectional view of the LED lighting device according to a modification of the present embodiment. In addition, about the structure similar to 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  In the first embodiment, only the upper surface portion 29 a of the power supply case 29 is brought into contact with the upper surface portion 24 of the container member 22 to fix the power supply case 29 to the second housing portion 12. In the present embodiment, as shown in FIG. 5, the upper surface portion 29 a and the side surface portion 29 b of the power supply case 29 are brought into contact with the upper surface portion 24 and the peripheral wall portion 26 of the container member 22, respectively. 12 was fixed. In the present embodiment, a part of the side surface portion 29b of the power supply case 29 is formed into a curved surface having the same curvature as the curvature of the peripheral wall portion 26 of the device member 22, and the side surface portion 29b of the power supply case 29 and the device member 22 are formed. The peripheral wall portion 26 is in surface contact.

  In the present embodiment, since a plurality of surfaces of the power supply case 29 are in contact with the second housing part 12, heat generated in the power supply 28 is directly conducted from the power supply case 29 to the second housing part 12. The ratio increases compared to that of the first embodiment. Therefore, it is possible to increase the efficiency of heat conduction from the power supply 28 to the second housing portion 12, and it is possible to more efficiently release the heat generated by the power supply 28 to the outside of the second housing portion 12. . As a result, it is possible to suppress the temperature rise of the power supply 28.

  As shown in FIG. 6, a metal plate-like rib 41 for connecting the side surface portion 29 b of the power supply case 29 and the peripheral wall portion 26 of the second housing portion 12 is provided, and the power supply case is provided via the rib 41. The heat conduction from 29 to the second housing portion 12 may be adopted. Also with this configuration, similarly to the LED lighting device 10 of FIG. 5, it is possible to increase the efficiency of heat conduction from the power supply 28 to the second housing 12, and the heat generated by the power supply 28 can be more effectively reduced to It is possible to discharge the outside of the housing unit 12.

[Fifth Embodiment]
Next, a fifth embodiment of the present invention will be described with reference to the drawings. FIG. 7 is a longitudinal sectional view of the LED lighting device according to the present embodiment. In addition, about the structure similar to 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  In the first embodiment, the entire inside of the second housing portion 12 around the power supply case 29 is filled with the silicone resin 31. In this respect, in the present embodiment, as shown in FIG. 7, the power supply case 29 fixed in the second housing portion 12 is covered with a metal power supply surrounding member 42, and the power supply surrounding member 42 has an inside. Only the silicone resin 31 is filled.

  In the present embodiment, the heat generated by the power supply 28 is directly conducted from the contact portion between the power supply case 29 and the second housing portion 12 to the second housing portion 12 and the silicone resin covering the power supply 28. Conducted to 31. Then, the heat conducted to the silicone resin 31 is conducted to the second housing part 12 via the power supply surrounding member 42. Here, in this embodiment, since the amount of the silicone resin 31 is reduced as compared with the first embodiment, it is quicker than heat conduction to the peripheral wall portion 26 and the like through the silicone resin 31 in the first embodiment. Heat conduction is made to the power supply surrounding member 42 through the silicone resin 31. Further, the heat conduction between the power supply surrounding member 42 and the second housing 12 is promptly performed because the heat conduction between the metals is performed. For this reason, the present embodiment has higher heat conduction efficiency between the power supply 28 and the second housing portion 12 than the first embodiment. As a result, it is possible to increase the efficiency of releasing the heat generated by the power supply 28 and suppress the temperature rise of the power supply 28.

[Sixth Embodiment]
Next, a sixth embodiment of the present invention will be described with reference to the drawings. FIG. 8 is a longitudinal sectional view of the LED lighting device according to the present embodiment. In addition, about the structure similar to 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  As shown in FIG. 8, in the present embodiment, a plurality of metal rods 43 are provided between the lid member 23 and the upper surface part 24 in the second housing part 12. As a result, the heat conducted from the power source 28 to the silicone resin 31 is conducted to the second housing portion 12 via the metal rod 43, so that the heat generated by the power source 28 is efficiently transferred to the second housing portion 12. It becomes possible to conduct to. As a result, it is possible to increase the efficiency of releasing the heat generated by the power supply 28 and suppress the temperature rise of the power supply 28.

[Seventh Embodiment]
Next, a seventh embodiment of the present invention will be described with reference to the drawings. FIG. 9 is a longitudinal sectional view of the lighting apparatus according to the present embodiment. In addition, about the structure similar to 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  As shown in FIG. 9, in the present embodiment, unlike the first embodiment, the silicone resin 31 is not filled around the power supply 28 in the second housing portion 12. In the present embodiment, the peripheral wall portion 15 and the upper surface portion 13 of the first housing portion 11, and the peripheral wall portion 26 and the upper surface portion 24 of the container member 22 in the second housing portion 12 are provided with the first or second portion. A plurality of through-holes 44 communicating between the inside and outside of the housing parts 11 and 12 are formed, and ventilation between the inside and outside of the first and second housing parts 11 and 12 is possible. Although not shown in FIG. 9, the first housing portion 11 and the second housing portion 12 are fastened with screws 34 as in the first embodiment.

  In the present embodiment, by forming the through-hole 44, convection can be generated in the first and second casing portions 11 and 12. That is, the air warmed by the heat generated in the LED unit 17 of the first housing part 11 flows out of the first housing part 11 from the through hole 44 formed in the upper surface part 13 and the first housing part. The air outside 11 flows into the first housing part 11 through the through hole 44 formed in the peripheral wall part 15 and the opening part 14 of the first housing part 11. Further, the air heated by the heat generated by the power supply 28 of the second housing portion 12 flows out of the second housing portion 12 from the through hole 44 formed in the upper surface portion 24, and the second housing portion 12. Outside air flows into the second housing portion 12 through a through hole 44 formed in the peripheral wall portion 26. Thereby, since it is suppressed that a heat | fever goes inside the 1st and 2nd housing | casing parts 11 and 12, it becomes possible to suppress the temperature rise of both the housing | casing parts 11 and 12. FIG.

  The through-hole 44 may be provided at any position of the two housing parts 11 and 12, but air warmed by the heat from the first housing part 11 flows into the second housing part 12. In order to suppress this, it is preferable to provide the second housing in a portion other than the lid portion 23.

[Eighth Embodiment]
Next, an eighth embodiment of the present invention will be described with reference to the drawings. FIG. 10 is an exploded perspective view of the LED lighting device according to the present embodiment, and FIG. 11 is a longitudinal sectional view of the LED lighting device according to the present embodiment. In addition, about the structure similar to 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  In 1st Embodiment, the 1st housing | casing part 11 and the 2nd housing | casing part 12 were arrange | positioned adjacent to the up-down direction in the installation state of the LED lighting apparatus 10. FIG. On the other hand, in this embodiment, the 1st housing | casing 211 and the 2nd housing | casing 212 are arrange | positioned adjacent to the horizontal direction in the installation state of the LED lighting apparatus 10. FIG.

  More specifically, as shown in FIGS. 10 and 11, the first housing 211 has a shape obtained by cutting a bottomed cylinder along a plane including its axis. A plurality of heat radiation fins 216 extending upward are formed on the upper surface portion 213. In addition, a disk part 45 parallel to the upper surface part 213 is integrally formed on the peripheral wall part 215. The disc portion 45 has a semicircular portion connected to the peripheral wall portion 215, and the remaining semicircular portion protrudes from the first housing 211 toward the second housing 212. The protruding semicircular portion has a radius slightly smaller than that of the semicircular portion fixed to the peripheral wall portion 215. And the LED unit 17 is being fixed to the lower surface of the disk part 45 through the heat-radiating resin sheet 20.

  The second housing 212 has a shape in which a bottomed cylinder having the same diameter and the same length as the first housing 211 is cut by a plane including its axis, and a plurality of the second housing 212 extends upward on the outer side of the upper surface portion 224. Radiating fins 227 are formed. A power supply case 29 is fixed to the lower surface of the upper surface portion 224 via the heat radiation resin sheet 20. Note that the upper surface portion 224 of the second housing 212 is formed to have a member thickness larger than that of the upper surface portion 213 of the first housing 211.

  The first casing 211 and the second casing 212 are integrated by fastening with screws (not shown) so that both form a substantially bottomed cylinder and a gap 235 is formed therebetween. Yes. Since the radius of the protruding semicircle portion of the disk portion 45 is slightly smaller than the semicircle portion fixed to the peripheral wall portion 215, the first and second casings 211 and 212 are integrated. In the state, the disk part 45 and the second housing 212 are in a non-contact state. Further, since the upper surface portion 224 of the second housing 212 has a member thickness larger than that of the upper surface portion 213 of the first housing 211, the power supply case 29 fixed to the upper surface portion 224 of the second housing 212. Is in a non-contact state with the first housing 211. Further, in the present embodiment, unlike the first embodiment, the power supply case 29 is not filled with the silicone resin 31, and both the casings 211 and 212 are not in contact except for a fastening portion by screws. Therefore, as shown in FIGS. 10 and 11, a gap 235 is formed between both housings 211 and 212. At the same time, the inside and outside of the housings 211 and 212 can be ventilated through the gap 235 formed between the housings 211 and 212.

  In the present embodiment, since the gap 235 is provided between the first casing 211 and the second casing 212, it is possible to suppress heat conduction between the casings 211 and 212. In addition, since the inside and outside of the housings 211 and 212 can be ventilated, heat generated by the LED unit 17 and the power source 28 is suppressed from entering the housings 211 and 212. As a result, the temperature rise of the first and second casings 211 and 212 can be suppressed.

  In this embodiment, both housings 211 and 212 are disposed adjacent to each other in the horizontal direction in the installed state of the LED lighting device 10. Generally, heat generated in the LED lighting device 10 is conducted to the housing. Then, by radiating heat from the housing, an increase in the temperature of the housing, and hence the temperature of the LED unit 17 and the power supply 28 inside the housing is suppressed. However, as in the first embodiment, when the first housing portion 11 and the second housing portion 12 are disposed adjacent to each other in the vertical direction in the installed state of the LED lighting device 10, the first housing disposed on the lower side is arranged. Air that has received heat from the casing 11 rises toward the second casing 12 that is disposed on the upper side for convection. For this reason, there exists a possibility that the heat dissipation of the 2nd housing | casing part 12 may deteriorate. In order to ensure a predetermined heat dissipation property in the second housing portion 12, it is necessary to increase the size of the second housing portion 12 itself or the radiation fins 27 formed in the second housing portion 12.

  In this respect, when the two casings 211 and 212 are disposed adjacent to each other in the horizontal direction in the installed state of the LED lighting device 10 as in this embodiment, the other casing receives heat from one casing due to convection. It becomes possible to suppress. As a result, it is not necessary to change the size of the radiating fins 216 and 227 of the other casing in consideration of the influence of heat from one casing, and the increase in the size of the LED lighting device 10 can be suppressed. .

  Moreover, in this embodiment, since the radiation fins 216 and 227 are formed outside the upper surface portions 213 and 224 in the first and second casings 211 and 212, the radial size of the LED lighting device 10 can be reduced. effective.

[Ninth Embodiment]
Next, a ninth embodiment of the present invention will be described with reference to the drawings. FIG. 12 is a longitudinal sectional view of the LED illumination device according to the present embodiment, and FIG. 13 is a longitudinal sectional view of the LED illumination device according to a modification of the present embodiment. In addition, about the structure similar to 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  In the first embodiment, the power supply 28 includes the printed wiring board 30 on which electronic components are mounted and the power supply case 29 in which the printed wiring board 30 is stored. On the other hand, in this embodiment, the power supply 28 is configured only by the printed wiring board 30 on which electronic components are mounted, and the printed wiring board 30 is not accommodated in the power supply case 29. In addition, a storage portion 47 is formed on the upper surface portion 24 of the second housing portion 12 by two pairs of opposing wall portions 46 protruding from the upper surface portion 24. The printed wiring board 30 is directly fixed to the storage portion 47 via an insulating sheet (not shown) without being stored in the power supply case 29.

  In the present embodiment, heat generated by the power supply 28 can be directly conducted to the second housing portion 12 without going through the power supply case 29. For this reason, it becomes possible to improve the heat conduction efficiency from the power supply 28 to the 2nd housing | casing part 12. FIG. Further, by eliminating the power supply case 29, the number of parts can be reduced and the second housing 12 can be further downsized.

  As shown in FIG. 13, a silicone resin 31 may be filled around the printed wiring board 30 in the housing portion 47. Thereby, not only heat conduction between the printed wiring board 30 and the upper surface portion 24 of the second housing portion 12 but also heat conduction to the second housing portion 12 through the silicone resin 31 and the wall portion 46. Therefore, it is possible to further improve the efficiency of heat conduction from the power supply 28 to the second housing portion 12.

[Tenth embodiment]
Next, a tenth embodiment embodying the present invention will be described with reference to the drawings. FIG. 14 is a longitudinal sectional view of the LED lighting device according to the present embodiment, and FIG. 15 is a longitudinal sectional view of the LED lighting device according to a modification of the present embodiment. In addition, about the structure similar to 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  In the first embodiment, the power supply case 29 is housed in the second housing portion 12, and the second housing portion 12 and the first housing portion 11 are connected and integrated. This embodiment is different from the first embodiment in that the power supply case 29 itself is used as the second housing 312 without housing the power supply case 29 in the second housing 312.

  More specifically, the first housing 311 is formed in a bottomed cylindrical shape, and the LED unit 17 is fixed and accommodated on the upper surface portion 313 thereof. A plurality of heat dissipating fins 316 extending outward are provided on the outer peripheral portion of the upper surface portion 313. In addition, a power supply case 29 is fixed to a central portion of the upper surface of the upper surface portion 313 via a heat insulating sheet 48. As described above, the power supply case 29 also serves as a member corresponding to the second housing portion 12 in the first embodiment.

  Since the power supply case 29 also serves as the second housing 312, heat can be directly radiated from the power supply case 29 to the outside, and heat dissipation of the power supply 28 can be improved. Furthermore, the number of parts can be reduced and the LED illumination device 10 can be downsized.

  As shown in FIG. 15, a flange portion 316 extending from the opening 314 of the first housing 311 to the outer diameter side is provided, and the power supply case 29 is fixed on the flange portion 316 via a heat insulating sheet 48. Also good. This also enables heat to be directly radiated from the power supply case 29 to the outside as in the embodiment of FIG. 14, and the LED lighting device 10 can be downsized. In particular, in the embodiment of FIG. 15, since the power supply case 29 is fixed on the flange 316, the height of the LED lighting device 10 can be made lower than that shown in FIG.

[Other Embodiments]
In addition, this invention is not limited to the content of description of the said embodiment, For example, you may implement as follows.

  In the above embodiment, the printed wiring board 19 is fixed to the first housing part 11 via the heat radiating resin sheet 20, but may be directly fixed without using the heat radiating resin sheet 20. Further, although the power supply case 29 is directly fixed to the second housing part 12, it may be fixed via the heat radiation resin sheet 20.

  In the above embodiment, the radiation fins 16 and 27 and the like are provided on the peripheral wall portions 15 and 26 or the upper surface portions 213 and 224, but the formation positions of the radiation fins 16, 27 and the like are not limited thereto. Further, the heat radiation fins 16, 27, etc. may be provided only in either one of the housing parts 11, 12, etc. Furthermore, the radiation fins 16, 27 and the like are not essential to the present invention, and the radiation fins 16, 27 and the like can be omitted.

It is a perspective view of the LED lighting apparatus concerning 1st Embodiment of this invention. It is a longitudinal cross-sectional view of the LED lighting apparatus concerning 1st Embodiment of this invention. It is a disassembled perspective view of the LED lighting apparatus concerning 2nd Embodiment of this invention. It is a longitudinal cross-sectional view of the LED lighting apparatus concerning 3rd Embodiment of this invention. It is a longitudinal cross-sectional view of the LED lighting apparatus concerning 4th Embodiment of this invention. It is a longitudinal cross-sectional view of the LED lighting apparatus concerning the modification of 4th Embodiment of this invention. It is a longitudinal cross-sectional view of the LED lighting apparatus concerning 5th Embodiment of this invention. It is a longitudinal cross-sectional view of the LED lighting apparatus concerning 6th Embodiment of this invention. It is a longitudinal cross-sectional view of the LED lighting apparatus concerning 7th Embodiment of this invention. It is a disassembled perspective view of the LED lighting apparatus concerning 8th Embodiment of this invention. It is a longitudinal cross-sectional view of the LED lighting apparatus concerning 8th Embodiment of this invention. It is a longitudinal cross-sectional view of the LED lighting apparatus concerning 9th Embodiment of this invention. It is a longitudinal cross-sectional view of the LED lighting apparatus concerning the modification of 9th Embodiment of this invention. It is a longitudinal cross-sectional view of the LED lighting apparatus concerning 10th Embodiment of this invention. It is a longitudinal cross-sectional view of the LED lighting apparatus concerning the modification of 10th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 LED illuminating device 11 1st housing | casing part 12 2nd housing | casing part 13 Upper surface part 14 Opening part 15 Perimeter wall part 16 Radiation fin 17 LED unit 18 LED package 19 Wiring board 20 Thermal radiation resin sheet 22 Instrument member 23 Cover member 24 Upper surface part 25 Opening 26 Peripheral Wall 27 Radiating Fin 28 Power Supply 29 Power Supply Case 30 Printed Circuit Board 31 Silicone Resin 32 Convex 34 Screw

Claims (12)

A first housing portion that houses a light source having an LED; and a second housing portion that houses a power source for supplying power to the light source, wherein the first housing portion and the second housing portion are integrated. In the LED lighting device
An LED lighting device, wherein a heat conduction inhibiting portion for inhibiting heat conduction between the two housing portions is provided between the first housing portion and the second housing portion.   The LED lighting device according to claim 1, wherein the heat conduction suppressing unit has a thermal resistance larger than that of the first and second housing units.   The first housing portion and the second housing portion are partially brought into contact with each other so as to form a gap between the first housing portion and the second housing portion, and The LED lighting device according to claim 1, wherein the heat conduction suppressing portion is formed.   The heat conduction inhibiting portion is formed by integrally forming the first housing portion and the second housing portion via a connection portion, and reducing a member thickness of the connection portion to be smaller than a member thickness of the both housing portions. The LED lighting device according to claim 1, wherein the LED lighting device is formed.   The hole part was provided in the outer wall part of at least one of the said 1st and 2nd housing | casing part, and the inside and outside of the said housing | casing part were connected, The any one of Claim 1 to 4 characterized by the above-mentioned. LED lighting apparatus of description.   6. The LED lighting device according to claim 1, wherein a radiation fin is provided on at least one outer wall portion of the first and second housing portions.   The LED lighting device according to any one of claims 1 to 6, wherein the power source is brought into contact with an inner wall portion of the second housing portion. Providing a heat conducting part for connecting the power source and the second housing part;
A part of the power source is brought into direct contact with the inner wall portion of the second casing portion, and the other portion of the power source is connected to the inner wall portion of the second casing portion via the heat conducting portion. The LED lighting device according to claim 7.   The LED lighting device according to claim 8, wherein the heat conducting portion is formed of a metal.   The LED lighting device according to claim 8, wherein the heat conducting portion is formed of a resin.   The LED lighting device according to claim 8, wherein a plurality of the heat conducting portions are provided, a part of the plurality of heat conducting portions is formed of a metal, and the other is formed of a resin.   The said 1st housing | casing part and the 2nd housing | casing part are arrange | positioned adjacent to the horizontal direction in the installation state of the said LED lighting apparatus, It is any one of Claims 1-11 characterized by the above-mentioned. LED lighting apparatus of description.

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