JP2011065754A - Light-emitting module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce fear of generation of luminance unevenness even if a plane light-emitting element and a driving circuit board are arranged in lamination in a light-emitting module. <P>SOLUTION: The light-emitting module 1 is provided with a surface light-emitting element 2 having a light-emitting layer 21, a driving circuit board 3 with an electronic component 31 mounted for making the light-emitting layer 21 emit light, and a case 4 for supporting the plane light-emitting element 2 and the driving circuit board 3. The case 4 includes a case body 41 with a bottom plate 43, and a lid 42. The driving circuit board 3 and the plane light-emitting element 2 are arranged at a position with the bottom plate 43 pinched and interposed with each other, and a sealing gas layer 47 is formed between the driving circuit board 3 and the bottom plate 43. With this structure, the sealing gas layer 47 restrains heat transmission from the electronic component 31 to the plane light-emitting element 2, variation of temperature distribution of the light-emitting layer 21 is not enlarged, and thus, fear of generation of luminance unevenness is reduced. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a light emitting module having a planar light emitting element.

  2. Description of the Related Art Conventionally, there is known a light emitting module that includes a planar light emitting element having a light emitting layer and a drive circuit board on which electronic components that emit light from the light emitting layer are mounted. (For example, refer to Patent Document 1). In such a light emitting module, since the planar light emitting element and the drive circuit board are arranged so as to overlap each other, the area is smaller than that in which the planar light emitting element and the drive circuit board are arranged side by side. The module can be miniaturized.

  However, in such a light emitting module, the heat generated from the electronic component is transmitted to the planar light emitting element, and the temperature variation in the light emitting layer increases, and there is a possibility that luminance unevenness occurs in the light emitting layer.

JP 2006-323144 A

  The present invention solves the above problem, and an object of the present invention is to provide a light-emitting module that is less likely to cause uneven brightness even when a planar light-emitting element and a drive circuit board are arranged to overlap each other.

  In order to achieve the above object, the invention of claim 1 includes a planar light emitting element having a light emitting layer, and a drive circuit board on which an electronic component that emits light from the light emitting layer is mounted. In the light emitting module in which the drive circuit board is disposed to overlap, a sealed gas layer that suppresses heat transfer from the electronic component to the light emitting layer is provided between the planar light emitting element and the drive circuit board. is there.

  According to a second aspect of the present invention, in the light emitting module according to the first aspect of the present invention, the light emitting module further includes a casing that supports the planar light emitting element and the drive circuit board, and the planar light emitting element is disposed outside the casing. The driving circuit board is provided in the housing so that the electronic component is positioned on the opposite side of the side where the planar light emitting element is located, and the electronic component is made of silicone resin. Covered, the casing surrounds the drive circuit board in contact with the silicone resin.

  According to the first aspect of the present invention, even if the planar light emitting element and the drive circuit board are arranged so as to overlap each other, the sealed gas layer between the planar light emitting element and the drive circuit board is changed from the electronic component to the planar light emitting element. Therefore, the temperature variation in the light emitting layer is not increased, and the possibility of uneven brightness is reduced.

  According to the second aspect of the present invention, the heat generated by the electronic component is transmitted to the housing through the silicone resin and dissipated from the housing, and the temperature of the electronic component is lowered, so that the heat is transmitted from the electronic component to the planar light emitting element. Less heat is generated and there is less risk of uneven brightness.

The disassembled block diagram which looked at the light emitting module which concerns on this embodiment from diagonally upward. The disassembled block diagram which looked at the light emitting module from diagonally downward. Sectional drawing of the light emitting module. Sectional drawing in the modification of the light emitting module.

  A light emitting module according to an embodiment of the present invention will be described with reference to FIGS. The light emitting module 1 includes a planar light emitting element 2 having a light emitting layer 21, a drive circuit board 3 that emits light from the light emitting layer 21, and a housing 4 that supports the planar light emitting element 2 and the drive circuit board 3. Yes. The planar light emitting element 2 includes a transparent glass substrate 22 on which a light emitting layer 21 is formed and an electrode 23 that supplies power to the light emitting layer 21. The light emitting layer 21 is, for example, an organic EL. The electrode 23 is connected to a power supply wiring pattern provided on the drive circuit board 3 by a conducting wire (not shown). The drive circuit board 3 mounts an electronic component 31.

  The housing 4 has a housing body 41 formed of resin, metal, or the like, and a lid 42 attached to the opening surface. The lid 42 is attached to the housing main body 41 by screws (not shown), for example. The housing body 41 includes a bottom plate 43 and a side plate 44 erected around the bottom plate 43, and an internal space 45 a is formed surrounded by the bottom plate 43 and the side plate 44. The side plate 44 also extends to the surface side facing the outside of the bottom plate 43 (downward in FIGS. 1 and 2), and forms a recess 45b (see FIG. 2) together with the bottom plate 43. The bottom plate 43 has a frame 46 formed to protrude toward the internal space 45a near the center, and the drive circuit board 3 is attached to the frame 46 by, for example, screws (not shown). Here, the drive circuit board 3 is attached so that the electronic component 31 is located on the side opposite to the side where the planar light emitting element 2 is located.

  By attaching the drive circuit board 3 to the frame 46, a gas layer (hereinafter referred to as a sealed gas layer) 47 sealed by these and the bottom plate 43 is formed. The sealed gas layer 47 has a high heat insulating effect because the gas convection is suppressed when the gas layer is thin. The thickness of the sealed gas layer 47 is 12 mm or less, preferably 9 mm or less, and the heat insulating effect of the sealed gas layer 47 is high. The sealed gas layer 4 suppresses heat transfer from the electronic component 31 to the planar light emitting element 2. Further, the side plate 44 has a window 48, and the window 48 radiates heat of the electronic component 31 with the inside space 45 a being vented.

  The planar light emitting element 2 is attached to the bottom plate 43 by, for example, screws (not shown) with the plate-like silicone member 5 sandwiched in the recess 45b. The planar light emitting element 2 and the drive circuit board 3 are arranged at overlapping positions when viewed from the light emitting surface side. The plate-like silicone member may be attached to the planar light emitting element 2 by, for example, adhesion. The light emitting layer 21 is directed outward from the bottom plate 43. The temperature variation in the light emitting layer 21 is generated by heat from the electronic component 31 and the like, but the plate-like silicone member 5 suppresses the temperature variation in the light emitting layer 21 by heat conduction.

  Next, the operation of the light emitting module 1 will be described. When the drive circuit board 3 causes the light emitting layer 21 to emit light, the electronic component 31 generates heat, and the drive circuit board 3 is heated by the heat of the electronic component 31. The heat of the heated drive circuit board 3 tends to diffuse toward the bottom plate 43, but since the heat insulating effect of the sealed gas layer 47 between the drive circuit board 3 and the bottom plate 43 is high, the surface through the bottom plate 43 Heat transfer to the light emitting element 2 is suppressed. Thus, since the heat transmitted to the planar light emitting element 2 is suppressed, the temperature variation in the light emitting layer 21 does not increase, and the possibility of occurrence of luminance unevenness is reduced. In addition, since there is little possibility of uneven brightness, the area of the planar light emitting element 2 that emits light can be increased without considering the uneven brightness.

(Modification)
A modification of this embodiment will be described with reference to FIG. In this modification, the internal space 45 a is filled with the silicone resin 49, and the electronic component 31 is covered with the silicone resin 49. The housing 4 surrounds the drive circuit board 3 in contact with the silicone resin 49. With this configuration, heat generated by the electronic component 31 is transmitted to the lid 42 via the silicone resin 49 and is radiated from the lid 42. As a result, the temperature of the electronic component 31 is lowered, and the heat transmitted to the planar light emitting element 2 is reduced. Therefore, the temperature variation in the light emitting layer 21 is not increased, and the possibility of uneven brightness is reduced. Further, the silicone resin 49 may fill the space between the lid 42 only at the place where the electronic component 31 is disposed without filling the entire internal space 45a.

  In addition, this invention is not restricted to the structure of the said embodiment, A various deformation | transformation is possible in the range which does not change the meaning of invention. For example, the gas in the sealed gas layer 47 is not limited to the atmosphere, and may be an inert gas such as argon.

DESCRIPTION OF SYMBOLS 1 Light emitting module 2 Planar light emitting element 21 Light emitting layer 3 Drive circuit board 31 Electronic component 4 Case 47 Sealed gas layer 49 Silicone resin

Claims (2)

In a light emitting module comprising: a planar light emitting element having a light emitting layer; and a drive circuit board on which an electronic component that emits light from the light emitting layer is mounted, and the planar light emitting element and the drive circuit board are disposed to overlap each other.
A light emitting module comprising a sealed gas layer that suppresses heat transfer from the electronic component to the light emitting layer between the planar light emitting element and the drive circuit board. A housing that supports the planar light emitting element and the drive circuit board;
The planar light emitting element is provided on a surface facing the outside of the housing,
The drive circuit board is provided inside the housing so that the electronic component is located on the side opposite to the side where the planar light emitting element is located,
The electronic component is coated with a silicone resin,
The light emitting module according to claim 1, wherein the casing surrounds the drive circuit board in a state of being in contact with the silicone resin.

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