CN107131460A - Lamps apparatus for vehicle - Google Patents
Lamps apparatus for vehicle Download PDFInfo
- Publication number
- CN107131460A CN107131460A CN201710089098.6A CN201710089098A CN107131460A CN 107131460 A CN107131460 A CN 107131460A CN 201710089098 A CN201710089098 A CN 201710089098A CN 107131460 A CN107131460 A CN 107131460A
- Authority
- CN
- China
- Prior art keywords
- distance light
- heat sink
- circuit substrate
- substrate
- boss
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
- B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
- B60Q1/0029—Spatial arrangement
- B60Q1/0041—Spatial arrangement of several lamps in relation to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/10—Arrangement of heat-generating components to reduce thermal damage, e.g. by distancing heat-generating components from other components to be protected
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
- B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
- B60Q1/02—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments
- B60Q1/04—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments the devices being headlights
- B60Q1/06—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments the devices being headlights adjustable, e.g. remotely-controlled from inside vehicle
- B60Q1/068—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments the devices being headlights adjustable, e.g. remotely-controlled from inside vehicle by mechanical means
- B60Q1/0683—Adjustable by rotation of a screw
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
- F21S41/148—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/19—Attachment of light sources or lamp holders
- F21S41/192—Details of lamp holders, terminals or connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/60—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution
- F21S41/65—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on light sources
- F21S41/663—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on light sources by switching light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/49—Attachment of the cooling means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
- F21S41/32—Optical layout thereof
- F21S41/321—Optical layout thereof the reflector being a surface of revolution or a planar surface, e.g. truncated
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
- F21S41/32—Optical layout thereof
- F21S41/36—Combinations of two or more separate reflectors
- F21S41/365—Combinations of two or more separate reflectors successively reflecting the light
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Securing Globes, Refractors, Reflectors Or The Like (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The present invention provides a kind of lamps apparatus for vehicle, and it can be so that the conducting-heat elements of coating-type are configured between thermal component and circuit substrate by simple structure and ensure insulating properties and thermal conductivity.Lamps apparatus for vehicle is characterised by having：Circuit substrate (14), it possesses surface and the back side, and is equipped with the surface light-emitting component (18a)；Thermal component (51), it is configured to opposed with the circuit substrate (14)；Distance piece (26), it is located between the circuit substrate (14) and the thermal component (51), and the interval between the circuit substrate (14) and the thermal component (51) is kept；And the conducting-heat elements (30) of coating-type, it is configured between the circuit substrate (14) and the thermal component (51) and with insulating properties.
Description
The cross reference of related application
This application claims the Japanese patent application for enjoying in entitled " lamps apparatus for vehicle " submitted on 2 26th, 2016
2016-035194 priority, the entire disclosure of which is herein incorporated by reference.
Technical field
The present invention relates to a kind of lamps apparatus for vehicle, light-emitting component is more particularly to equipped on circuit substrate and radiating is utilized
The lamps apparatus for vehicle that part is radiated from circuit substrate.
Background technology
In the past, propose to have that the light-emitting components such as LED (light emitting diode, Light Emitting Diode) are used for into light source
Lamps apparatus for vehicle.Light-emitting component shows the trend that heating and temperature rise with luminous, on this basis, its luminous efficiency
It is affected by temperature.Thus, in existing lamps apparatus for vehicle, in order to which the temperature control of light-emitting component is being adapted into what is lighted
Scope, future, the heat transfer of self-emission device was radiated to thermal component, is thus suppressed temperature and is risen.
Following lamps apparatus for vehicle is for example being disclosed in the prior art described in patent document 1, and the lamps apparatus for vehicle will
Light emitting diode is equipped on circuit substrate and makes it opposed with reflector (reflector), thus light is irradiated to vehicle front.
In addition, using in order that the light source supporting member that is made of the aluminium of the heat dissipation produced by light emitting diode makes to dissipate as radiator
Hot device is abutted with the back side of circuit substrate, thus from light emitting diode via circuit substrate from radiator to external cooling.
In such prior art, in order to effectively carry out the heat conduction between each part, typically make thermal conductivity good
Conducting-heat elements are between radiator and circuit substrate.In addition, wiring layer is also formed with the rear side of circuit substrate sometimes, because
This, also requires to ensure the insulating properties between the radiator and circuit substrate that metal is made.
As such conducting-heat elements for taking into account good thermal conductivity and insulating properties, advance comprising leading for sheet can be enumerated
Backing.However, the adhering processes due to needing thermally conductive sheet, therefore, assembling man-hour increase and operability variation, and due to heat conduction
The price of piece is higher, therefore manufacturing cost can increase.In addition, when using thermally conductive sheet, thermally conductive sheet is being held on into radiator
In the state of between circuit substrate, the state for compressing thermally conductive sheet with additional defined pressure is entered to radiator and circuit substrate
Row is kept.Now, due to being pressed from rear side by thermally conductive sheet the resin substrate as circuit substrate, therefore exist as follows
Problem：Warpage is produced in substrate and causes the position of light-emitting component to be deviateed from the focus of reflector, and is made desired in order to obtain
The adjustment of light irradiation scope becomes cumbersome.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2012-064493 publications
The content of the invention
Invent problem to be solved
If using heat-conductive lubricating grease, thermal conductivity bonding agent etc. to apply to prevent the warpage of the substrate as caused by thermally conductive sheet
The part for the type of applying is held between radiator and circuit substrate as conducting-heat elements, then conducting-heat elements and compared with unfertile land extension, dissipated
Hot device and circuit substrate are possible to directly contact and cause wiring layer and radiator conducting.If in addition, in order to ensure radiator with
Insulating properties between circuit substrate and the interval holding of the two is obtained larger, then thermal conductivity can be deteriorated.
Therefore, in order to ensure thermal conductivity and insulating properties, it is necessary to suitably keep the interval between radiator and circuit substrate.
However, in patent document 1, the construction for suitably keeping the interval between radiator and circuit substrate is not disclosed, it is difficult
With by the conducting-heat elements of the coating-types such as heat-conductive lubricating grease, thermal conductivity bonding agent between radiator and circuit substrate.
Further, since carrying out punch process to metal materials such as aluminium and being used as radiator, circuit substrate is also using flat
The resin substrate of tabular, accordingly, it is difficult to implement for ensuring several microns~several millimeters micro- between radiator and circuit substrate
Closely-spaced microfabrication.
Therefore, it is an object of the invention to provide a kind of lamps apparatus for vehicle, it can be with simple structure by coating-type
Conducting-heat elements are configured between thermal component and circuit substrate and are able to ensure that insulating properties and thermal conductivity.
Method for solving problem
In order to solve the above problems, lamps apparatus for vehicle of the invention is characterised by having：Circuit substrate, it possesses table
Face and the back side, and it is equipped with light-emitting component on the surface；Thermal component, it is configured to opposed with the circuit substrate；Interval
Part, it is located between the circuit substrate and the thermal component, and between the circuit substrate and the thermal component
Interval is kept；And the conducting-heat elements of coating-type, it is configured between the circuit substrate and the thermal component and had
There is insulating properties.
In such lamps apparatus for vehicle of the invention, distance piece is arranged between circuit substrate and thermal component and protected
Hold interval, and make the conducting-heat elements of the coating-type with insulating properties therebetween, thus, it is possible to true with simple structure
Protect insulating properties and thermal conductivity.
In addition, in the mode of the present invention, the conducting-heat elements of the coating-type are heat-conductive lubricating grease or heat conduction
Property adhesive.
In addition, in the mode of the present invention, the conducting-heat elements of the coating-type contain filler, the circuit substrate with
Maximum particle diameter of the interval more than the filler between the thermal component.
In addition, in the mode of the present invention, possessing the circuit substrate maintaining part kept to the circuit substrate
Part, the distance piece is integrally formed with the circuit substrate holding member.
In addition, in the mode of the present invention, the distance piece is to protrude to be formed from the circuit substrate holding member
Boss.
In addition, in the mode of the present invention, the boss is possess the first maintaining part and the second maintaining part many
Stepped shape, wherein, first maintaining part is contacted with the circuit substrate, and second maintaining part connects with the thermal component
Touch.
In addition, in the mode of the present invention, the circuit substrate holding member is that have to from the luminous member
The reflector for the reflecting surface that the light of part is reflected.
In addition, in the mode of the present invention, possess the thermal component maintaining part kept to the thermal component,
The distance piece be from the thermal component maintaining part protrude it is being formed and with the boss of the rear-face contact.
Invention effect
In the present invention, using the teaching of the invention it is possible to provide a kind of lamps apparatus for vehicle, the lamps apparatus for vehicle be able to will be applied with simple structure
The conducting-heat elements of type are configured between thermal component and circuit substrate and ensure insulating properties and thermal conductivity.
Brief description of the drawings
Fig. 1 is the summary front view of the lamps apparatus for vehicle 10 in first embodiment.
Fig. 2 is the A-A' sectional views of the lamps apparatus for vehicle 10 shown in Fig. 1.
Fig. 3 is the schematic isometric for representing the distance light top surface of reflector element 16 in first embodiment.
Fig. 4 be represent in first embodiment by heat sink holding boss 23a, 23b to distance light substrate 14 and remote
The figure of the light holding of heat sink 51, and be the partial enlargement section view for schematically showing the B regions surrounded in Fig. 1 by circle
Figure.
Fig. 5 be represent in second embodiment by heat sink holding boss 23a, 23b to distance light substrate 14 and remote
The schematic diagram of the light holding of heat sink 51.
Fig. 6 be represent in the 3rd embodiment by heat sink holding boss 23a, 23b to distance light substrate 14 and remote
The schematic diagram of the light holding of heat sink 51.
Fig. 7 is being used by heat sink holding boss 23a, 23b distance light substrate 14 and distance light in the 4th embodiment
The schematic diagram of the holding of heat sink 51.
Fig. 8 is being used by heat sink holding boss 23a, 23b distance light substrate 14 and distance light in the 5th embodiment
The schematic diagram of the holding of heat sink 51.
Embodiment
(first embodiment)
Hereinafter, embodiments of the present invention are described in detail referring to the drawings.To shown in each figure identical or wait
With structural element, part, processing mark identical symbol, and suitably by repeat explanation omit.In addition, in this specification
In, in the case where using the word in the expression such as " on ", " under ", "front", "rear", "left", "right", " interior ", " outer " direction, these
The direction under posture when word represents to be assemblied in lamps apparatus for vehicle into vehicle.
Fig. 1 is the summary front view of the lamps apparatus for vehicle 10 involved by embodiments of the present invention.In addition, Fig. 2 is Fig. 1 institutes
The A-A' sectional views of the lamps apparatus for vehicle 10 shown.Lamps apparatus for vehicle 10 shown in Fig. 1 is matched somebody with somebody respectively in the left and right sides of front part of vehicle
Be equipped with the headlamp of one, its construct it is substantially identical in left and right sides, therefore to be configured at the lamps apparatus for vehicle of vehicle left side
It is configured to represent and illustrate.
As shown in Figure 1 and Figure 2, lamps apparatus for vehicle 10 possesses：Lamp main body 11；And transparent outer cover 12, it is by lamp master
The preceding surface hole portion covering of body 11.Lamp main body 11 and the formation lamp house 13 of outer cover 12.Outer cover 12 is formed as imitating the nose of vehicle
The shape of (slant nose) shape, and tilted from vehicle interior side to outside towards rear view of vehicle.Therefore, by lamp main body 11 and outer cover
12 lamp houses 13 formed are formed as from vehicle interior side to outside towards the inclined space of rear view of vehicle.
Lamp unit 50 is accommodated in lamp house 13.The lamp unit 50 is configured to irradiation distance light light distribution patterns and dipped beam is matched somebody with somebody
Light pattern.Lamp unit 50 possesses distance light substrate 14, dipped beam substrate 15, distance light reflector element 16, dipped beam reflection
Device unit 17, distance light heat sink 51, dipped beam heat sink 52 and bracket 53.
Distance light is arranged with reflector element 16 and dipped beam with reflector element 17 on overall width direction.Distance light reflects
Device unit 16 is configured at vehicle interior side, and dipped beam reflector element 17 is configured at vehicle outside.
Distance light reflector element 16 is the reflector group of the irradiation for distance light, and is configured to include distance light diffusion with instead
Emitter 16a, the first distance light optically focused are anti-with reflector 16b and second distance light optically focused reflector 16c these three parabolic shapes
Emitter.These three reflectors are integrally formed.In these three reflectors, distance light diffusion is arranged at vehicle most with reflector 16a
Inner side, in distance light diffusion with the first distance light optically focused reflector 16b is provided with the outside of reflector 16a, in the first distance light optically focused
With being provided with the second distance light optically focused reflector 16c on the outside of reflector 16b.
Distance light diffusion is with reflector 16a, the first distance light optically focused with reflector 16b and the second distance light optically focused reflector
16c has reflecting surface 19a~19c formed by the basis of the paraboloid of revolution respectively.The Pivot axle of each paraboloid of revolution
Optical axis as each reflector.Each reflector arrangement is optical axis towards vehicle fore-and-aft direction (horizontal direction).
Dipped beam reflector element 17 is the reflector group of the irradiation for dipped beam, and is configured to include dipped beam diffusion with instead
Emitter 17a, the first dipped beam optically focused are anti-with reflector 17b and second dipped beam optically focused reflector 17c these three parabolic shapes
Emitter.These three reflectors are integrally formed.In these three reflectors, dipped beam diffusion is arranged at vehicle most with reflector 17a
Inner side, in dipped beam diffusion with the first dipped beam optically focused reflector 17b is provided with the outside of reflector 17a, in the first dipped beam optically focused
With being provided with the second dipped beam optically focused reflector 17c on the outside of reflector 17b.
Dipped beam diffusion is with reflector 17a, the first dipped beam optically focused with reflector 17b and the second dipped beam optically focused reflector
17c has reflecting surface 20a~20c formed by the basis of the paraboloid of revolution respectively.The Pivot axle of each paraboloid of revolution
Optical axis as each reflector.Each reflector arrangement is optical axis towards vehicle fore-and-aft direction (horizontal direction).
The inner surface that distance light passes through the base material to ester moulding with reflector element 16 and dipped beam reflector element 17
Implement aluminium-vapour deposition and formed.
Distance light substrate 14 is supported on the upper surface of distance light reflector element 16.Three LED (the first LED18a~the
Three LED18c) by light-emitting area downward in the way of be equipped on distance light substrate 14.The LED18c of first LED18a~the 3rd receives
Lighted from distance light with the electric current that substrate 14 is supplied.The LED18c of first LED18a~the 3rd is the LED for distant light irradiation.First
LED18a is configured at distance light diffusion reflector 16a reflecting surface 19a focal position.2nd LED18b is configured at the first distance light
Optically focused reflector 16b reflecting surface 19b focal position.3rd LED18c is configured at the second distance light optically focused reflector 16c
Focal position.Distance light be formed with the upper surface of reflector element 16 for by the light from each LED to each reflector
The hole of reflecting surface guiding.
Dipped beam substrate 15 is supported on the upper surface of dipped beam reflector element 17.Three LED (the 4th LED18d~the
Six LED18f) by light-emitting area downward in the way of be equipped on dipped beam substrate 15.The LED18f of 4th LED18d~the 6th receives
Lighted from dipped beam with the electric current that substrate 15 is supplied.The LED18f of 4th LED18d~the 6th is the LED irradiated for dipped beam.4th
LED18d is configured at dipped beam diffusion reflector 17a reflecting surface 20a focal position.5th LED18e is configured at the first dipped beam
Optically focused reflector 17b reflecting surface 20b focal position.6th LED18f is configured at the second dipped beam optically focused reflector 17c
Focal position.Dipped beam be formed with the upper surface of reflector element 17 for by the light from each LED to each reflector
The hole of reflecting surface guiding.
Distance light is with substrate 14 and dipped beam substrate 15 equivalent to the circuit substrate in the present invention, and these substrates are on surface
The back side is formed with the flat part formed by glass epoxy resin etc. of wiring layer pattern.
In the back side (face opposed with part mounting surface) side of distance light substrate 14, across the coating-type with insulating properties
Conducting-heat elements 30 and distance light is supported with heat sink 51.The radiating part that the distance light is e.g. formed with heat sink 51 by aluminium sheet
Part, and with causing from the function of being equipped on the heat produced that the LED18c of the first LED18a of distance light substrate 14~the 3rd is produced.
In rear side of the dipped beam with substrate 15, dipped beam is used and dissipated across the conducting-heat elements 30 of the coating-type with insulating properties
Hot plate 52 is supported.The dipped beam is also the thermal component that is for example formed by aluminium sheet with heat sink 52, and with causing from carrying
In function of the dipped beam with the LED18f of the 4th LED18d of substrate 15~the 6th heat produceds produced.
Distance light with heat sink 51 and dipped beam heat sink 52 equivalent to the thermal component in the present invention, in present embodiment
In, use the part for carrying out punch process by the metallic plate to aluminium etc. and shaping.Herein, although shown as thermal component
The example shaped by the punch process of metallic plate, but it is also possible to use other materials and processing method.By rushing for metallic plate
Pressure processes shape distance light heat sink 51 and dipped beam heat sink 52, thus, it is possible to realize the distance light use as thermal component
Heat sink 51 and the dipped beam lightweight of heat sink 52 and the reduction of cost.
In addition, as hereinafter illustrate as, respectively by heat sink holding with boss 23a~23c, 23d~23f with relative
The mode in small gap 31 is kept to distance light heat sink 51 and dipped beam in distance light substrate 14 and dipped beam substrate 15
Kept with heat sink 52, it is in gap 31, with the LED18c of the first LED18a~the 3rd, the 4th LED18d~6th
LED18f inboard corresponding region is configured with conducting-heat elements 30.
Conducting-heat elements 30 are made up of the material of the coating-type with insulating properties, and in distance light with substrate 14, dipped beam substrate
15th, distance light heat sink 51, the surface of any part of dipped beam heat sink 52 or the back side are formed by coating.Herein, apply
Deposited type refers to by spraying, dripping, scraper etc. supplies the material with mobility to object and can be in substrate with dissipating
The material rolled between hot plate, is additionally included in the elevated situation of viscosity after coating, the situation of solidification.In addition, with flowing
Property material of the material comprising liquid, gel, paste etc., include the mixture, micro- containing other of the material of these forms
Short grained material.As conducting-heat elements 30, such as can enumerate heat-conductive lubricating grease, heat conductive adhesive.
In the present embodiment, dipped beam heat sink 52 possesses in a part of overlapping mode with distance light heat sink 51
Extended local overlapping portion 52a.The local overlapping portion 52a can be supported with overlapping distance light with a part for heat sink 51
Connect.Increase the area of dissipation of dipped beam heat sink 52 by possessing such part overlapping portion 52a, therefore, it is possible to improve the 4th
The LED18f of LED18d~the 6th thermal diffusivity.
Bracket 53 is for example formed by resin material, and is possessed：Frame 53a；First extension 53b and the second extension
53c, they stretch out towards the rear from frame 53a top；And the 3rd extension 53d, its from frame 53a bottom backwards
Side is stretched out.Frame 53a is by internally accommodating distance light reflector element 16 and dipped beam reflector element 17 with car
The state arranged on cross direction is supported to them.Frame 53a is only by distance light with heat sink 51 and dipped beam heat sink
52 forward portion covering, other parts (except the part covered by the first~the 3rd extension) are exposed.This is to improve
Distance light heat sink 51 and the thermal diffusivity of dipped beam heat sink 52.
First is provided with the first extension 53b of bracket 53 to vert part 55, and second is provided with the second extension 53c
Vert part 56, and being provided with the 3rd in the 3rd extension 53d verts part 57.First vert part 55, second vert part 56
And the 3rd the part 57 that verts have bracket 53 be supported on lamp main body 11 and makes bracket to adjust optical axis (aim at adjust)
53 functions of verting.
As shown in Fig. 2 first part 55 that verts possesses：Screw 55a is aimed at, it is installed on the back part 11a of lamp main body 11；
Screw part 55b, it is arranged at the first extension 53b of bracket 53；And adjustment portion 55c, it is arranged at the outside of lamp main body 11.
In addition, the 3rd part 57 that verts possesses：Ball-and-socket joint 57a, it is installed on the back part 11a of lamp main body 11；And ball-and-socket 57b,
Its orbicule (ball) to ball-and-socket joint 57a is kept.Ball-and-socket 57b insertions are supported on the 3rd extension in bracket 53
The hole portion that 53d is set.Second part 56 that verts also verts in the same manner as part 57 with the 3rd and possessed：Ball-and-socket joint, it is installed on lamp
The back part 11a of main body 11；And ball-and-socket, its orbicule to ball-and-socket joint keeps.Ball-and-socket insertion is supported in support
The hole portion that second extension 53c of frame 53 is set.
If by first vert part 55 adjustment portion 55c and make first vert part 55 aiming screw 55a rotate,
Bracket 53 using the 3rd vert part 57 ball-and-socket joint 57a orbicule as fulcrum relative to lamp main body 11 in the vertical direction
Vert, and bracket 53 using second vert part 56 ball-and-socket joint orbicule as fulcrum relative to lamp main body 11 in left and right
Verted on direction.By so making bracket 53 be verted up and down relative to lamp main body 11, lamp unit 50 can be carried out
Optical axis is adjusted.
Fig. 3 is the schematic isometric for representing the distance light top surface of reflector element 16 in present embodiment.Dipped beam is with instead
Emitter unit 17 is also same structure, so that the explanation repeated is omitted.As shown in figure 3, top plate 21 is with by reflecting surface 19a
~19c top covering mode be arranged at distance light reflector element 16, top plate 21 be formed with opening portion 22a~22c, dissipate
Hot plate holding boss 23a~23c, hot riveting boss 24a~24d.
Opening portion 22a~22c is formed at region corresponding with the LED18c of the first LED18a~the 3rd, as it was previously stated, opening
Portion 22a~22c is the hole for the light from each LED to be guided to the reflecting surface of each reflector.Although in the present embodiment
The example for being provided with three LED and three opening portion 22a~22c is shown, but respective number is not defined.Though in addition,
So show the example that a LED is each configured with opening portion 22a~22c, but it is also possible to configure multiple in each opening portion
LED。
Heat sink holding is the boss of the prominent top for being formed at top plate 21 with boss 23a~23c, and is used for distance light
The part kept with substrate 14 and distance light with heat sink 51.Therefore, heat sink holding with boss 23a~23c as
The distance piece function in gap 31 is spaced and formed as defined in being kept between distance light substrate 14 and distance light heat sink 51.
As shown in figure 3, heat sink holding is at least arranged at position at three on top plate 21, and is respectively configured as with boss 23a~23c
Do not arrange point-blank, accordingly, it is determined that by the heat sink holding at three positions with boss 23a~23c to distance light base
The face that plate 14 and distance light are kept with heat sink 51.
In the present embodiment, distance light reflector element 16 and the integral landform of heat sink holding boss 23a~23c
Into so that both functions as the circuit substrate holding member kept to circuit substrate, are also served as to thermal component
The thermal component maintaining part that is kept and function.Hereinafter to detailed structure of the heat sink holding with boss 23a~23c
Make and distance light is described with substrate 14 and distance light with the holding of heat sink 51.
Hot riveting is the boss of the prominent top for being formed at top plate 21 with boss 24a~24d, and is inserted in distance light base
The hole that plate 14 or distance light are set with the corresponding position of heat sink 51.Hot riveting boss 24a~24d is formed as prominent from the hole
The height of the degree gone out, heated and pressurizeed to prominent fore-end and be plastically deformed it, thus so that hole to be covered
Mode carries out hot riveting and fixes distance light substrate 14 or distance light heat sink 51.
Fig. 4 is to represent the guarantor by heat sink holding boss 23a, 23b to distance light substrate 14 and distance light heat sink 51
The figure held, and be the enlarged partial sectional view for schematically showing the B regions surrounded in Fig. 1 by circle.Heat sink is kept with convex
Platform 23a, 23b are formed as being formed with the multistage shape of the different multiple steps of diameter, and platform is contacted by circuit substrate from below
Rank portion 25, heat sink contact stage portion 26, hot riveting stage portion 27 are constituted.
In distance light substrate 14, diameter is provided with position corresponding with boss 23a, 23b with heat sink holding with dissipating
The roughly the same hole of diameter of hot plate contact stage portion 26, the heat sink contact contraposition of stage portion 26 is inserted in the hole.Thus, circuit
The upper surface of substrate contact stage portion 25 is contacted with distance light with the lower surface of substrate 14, so as to contact stage portion 25 by circuit substrate
Distance light is kept with substrate 14.In addition, in distance light with heat sink 51 also corresponding with heat sink holding boss 23a, 23b
Position at be provided with the diameter hole roughly the same with the diameter of hot riveting stage portion 27, the contraposition of hot riveting stage portion 27 is inserted in
The hole.Thus, the upper surface of heat sink contact stage portion 26 is contacted with distance light with the lower surface of heat sink 51, so that by heat sink
Contact stage portion 26 is kept to distance light with heat sink 51.
Herein, the horizontal position of distance light substrate 14 is determined by the hole of distance light substrate 14 and heat sink contact stage portion 26
Put, the lateral attitude of distance light heat sink 51 is determined by the hole of distance light heat sink 51 and hot riveting stage portion 27.Although showing
Heat sink is contacted stage portion 26 and is arranged at distance light and is set to the hole of substrate 14 roughly the same diameter and by hot riveting platform
Rank portion 27 and the example that distance light is set to roughly the same diameter with the hole of heat sink 51 is arranged at, but as long as each of multistage shape
Rank is inserted into, and can also be set to the diameter with a certain degree of gap.
A part for the front end of hot riveting stage portion 27 is protruded from distance light with the hole of heat sink 51, to prominent fore-end
Heated and pressurizeed and be plastically deformed it, form the front end variant part 28 for covering hole, stage portion 26 is contacted by heat sink
Upper surface and front end variant part 28 distance light heat sink 51 is fixed in the height direction.In distance light substrate 14, with heat
Hot riveting is inserted in the hole with boss 24a, 24b and to front end by riveting with hole is provided with the corresponding position of boss 24a, 24b
Portion carries out hot riveting, so that by the upper surface and hot riveting of circuit substrate contact stage portion 25 with boss 24a, 24b in height side
Distance light substrate 14 is fixed upwards.In addition, in the distance light position corresponding with hot riveting boss 24a, 24b of heat sink 51
Place is also formed with preventing interference hole 51a, 51b, thus prevents distance light heat sink 51 from occurring with hot riveting boss 24a, 24b dry
Disturb.
When assembling lamp unit 50, by heat sink holding boss 23a, 23b and hot riveting boss 24a, 24b couple
Position is inserted in each hole set in distance light substrate 14, and by front end of the hot riveting with boss 24a, 24b in the way of hot riveting
It is fixed.Then, conducting-heat elements 30 are applied in the rear side of distance light substrate 14, the contraposition of hot riveting stage portion 27 is inserted in into distance light uses
The hole of heat sink 51, and fixed the front end of hot riveting stage portion 27 in the way of hot riveting.
As shown in figure 4, prominent on top plate 21 be formed with heat sink holding boss 23a, 23b, distance light is with the He of substrate 14
Distance light is kept with heat sink 51 by heat sink holding boss 23a, 23b, ensures there is gap 31 between.It is being arranged at top
The top in the opening portion 22a regions of plate 21, the first LED18a is equipped on distance light substrate 14 in the way of downward, and with not
The reflecting surface 19a of diagram is opposed.The rear side coating conducting-heat elements in region in gap 31, being equipped with the first LED18a
30, the conducting-heat elements 30 are held on distance light substrate 14 and distance light between heat sink 51 and in the way of being contacted with the two pair
The conducting-heat elements 30 are rolled.
As described above, in the present embodiment, heat sink holding boss 23a, 23b are multistage shape, its circuit substrate
Contact stage portion 25 contacted with heat sink the difference in height of stage portion 26 equivalent to distance light substrate 14 thickness and gap 31 away from
From sum.Therefore, heat sink contact stage portion 26 is kept as positioned at distance light between substrate 14 and distance light heat sink 51
The distance piece function at the interval in gap 31.As the interval in gap 31, it is preferably big to can distance light substrate 14 the back of the body
The degree of insulating properties is ensured between face and distance light heat sink 51 and small to the good degree of thermal conductivity is caused, it is specifically, excellent
Select 0.05mm~1.5mm scope.
In addition, as the conducting-heat elements 30 of coating-type, using the material containing the filler as thermally conductive materials particulate
In the case of, maximum particle diameter of the interval more than filler of preferred gap 31.Thereby, it is possible to avoid because containing more than between gap 31
Every filler and make the problem of short transverse of distance light heat sink 51 is unstable.
In the present embodiment, heat sink holding is shaped in distance light reflector list with boss 23a~23c by resin
The top plate 21 of member 16, can carry out the processing of the high-precision shape of several units of micrometers, additionally it is possible to make manufacturing process and construction letter
Change and realize cost degradation.In addition, distance light substrate 14, the shape simplification of distance light heat sink 51 can be made, punching can be passed through
Pressure processing is molded to heat sink, and cost degradation is realized therefore, it is possible to simplify manufacturing process and construction.Further, pass through
Heat sink holding is set to hot riveting stage portion 27 with boss 23a~23c front end, thus, it is possible to be used as distance light using hot riveting
With the fastening linking method of heat sink 51, and the simplification of the reduction, miniaturization, manufacturing process of number of components can be realized.
Therefore, in the lamps apparatus for vehicle 10 of present embodiment, distance light substrate 14 can be ensured with simple structure
The gap 31 of the back side and distance light between heat sink 51, and can by configure the conducting-heat elements 30 of coating-type and ensure insulation
Property and thermal conductivity.Thereby, it is possible to prevent circuit substrate produced during using preshaped thermally conductive sheet, thermal component from sticking up
Song, and can prevent light-emitting component from deviateing from the focal position of reflector and causing light distribution characteristic to be deteriorated.
(second embodiment)
Next, reference picture 5 is illustrated to second embodiment of the present invention.It will be directed to and be repeated with first embodiment
Part explanation omit.Fig. 5 be represent in second embodiment by heat sink holding with boss 23a, 23b to distance light base
Plate 14 and the schematic diagram of the distance light holding of heat sink 51, and be the office for schematically showing the B regions surrounded in Fig. 1 by circle
Portion's amplification view.In the present embodiment, in order to ensure gap 31 of the distance light between substrate 14 and distance light heat sink 51
And using the packing ring of split part as distance piece, this point is different from first embodiment.
Heat sink holding boss 23a, 23b are formed as being formed with the multistage shape of the different multiple steps of diameter, from it
Lower section is risen to be made up of circuit substrate contact stage portion 25, hot riveting stage portion 27.Dissipated in addition, being used in distance light with substrate 14 and distance light
The packing ring 29 as distance piece is configured between hot plate 51, thus distance light with the back side of substrate 14 and distance light heat sink 51 it
Between ensure there is gap 31.The rear side coating conducting-heat elements 30 in region in gap 31, being equipped with the first LED18a, by this
Conducting-heat elements 30 be held on distance light substrate 14 and distance light between heat sink 51 and in the way of being contacted with the two to the heat conduction
Part 30 is rolled.
In distance light substrate 14 and distance light heat sink 51, with the heat sink holding corresponding position of boss 23a, 23b
The place of putting is provided with the diameter hole roughly the same with the diameter of hot riveting stage portion 27, and the contraposition of hot riveting stage portion 27 is inserted in the hole
With packing ring 29.Thus, the upper surface of circuit substrate contact stage portion 25 is contacted with distance light with the lower surface of substrate 14, so that by electricity
Base board contact stage portion 25 is kept to distance light with substrate 14.
Herein, distance light base is determined by the hole and hot riveting stage portion 27 of distance light substrate 14 and distance light heat sink 51
The lateral attitude of plate 14 and distance light heat sink 51.Though it is shown that distance light substrate 14 and distance light radiating will be arranged at
The hole of plate 51 and hot riveting stage portion 27 are set to the example of roughly the same diameter, but as long as each step of multistage shape can be inserted
Enter, the diameter with a certain degree of gap can also be set to.
A part for the front end of hot riveting stage portion 27 is protruded from distance light with the hole of heat sink 51, to prominent fore-end
Heated and pressurizeed and be plastically deformed it, form the front end variant part 28 for covering hole.Thus, platform is contacted by circuit substrate
The upper surface in rank portion 25 and front end variant part 28 are in the height direction by distance light with substrate 14, packing ring 29 and distance light heat sink
51 fix.
As described above, in the present embodiment, packing ring 29 as be located at distance light with substrate 14 and distance light heat sink 51 it
Between and keep the distance piece function at the interval in gap 31.As determine gap 31 interval packing ring 29 thickness, preferably
It is big to the degree that insulating properties can be ensured between the back side of distance light substrate 14 and distance light heat sink 51 and small to can be so that leading
Hot good degree, specifically, preferred 0.05mm~1.5mm scope.In the present embodiment, by hot riveting stage portion
27 contrapositions are inserted in the hole of distance light substrate 14, insert and the hot riveting stage portion 27 contraposition is inserted in distance light packing ring 29 and use
The hole of heat sink 51, is only whereby just able to ensure that the gap 31 of the conducting-heat elements 30 for configuring coating-type, so as to make system
Make process and construction simplifies.
In addition, in the present embodiment, heat sink holding is also shaped in distance light by resin with boss 23a~23c and used
The top plate 21 of reflector element 16, so that manufacturing process and construction can also be made to simplify and realize cost degradation.In addition, can make
The shape simplification of distance light substrate 14, distance light heat sink 51, and heat sink can be molded by punch process, because
This, can make manufacturing process and construction simplify and realize cost degradation.Further, by by heat sink holding with boss 23a~
23c front end is set to hot riveting stage portion 27, thus, it is possible to using fastening link side of the hot riveting as distance light heat sink 51
Method, and the simplification of the reduction, miniaturization, manufacturing process of number of components can be realized.
Therefore, in the lamps apparatus for vehicle 10 of present embodiment, also distance light substrate can be ensured with simple structure
14 gap 31 of the back side and distance light between heat sink 51, and the conducting-heat elements 30 of coating-type can be configured and insulating properties is ensured
And thermal conductivity.Thereby, it is possible to prevent from using the warpage of circuit substrate produced during preshaped thermally conductive sheet, thermal component,
And can prevent light-emitting component from deviateing from the focal position of reflector and causing light distribution characteristic to be deteriorated.
(the 3rd embodiment)
Next, reference picture 6 is illustrated to third embodiment of the present invention.It will be directed to and be repeated with first embodiment
Part explanation omit.Fig. 6 be represent in the 3rd embodiment by heat sink holding with boss 23a, 23b to distance light base
Plate 14 and the schematic diagram of the distance light holding of heat sink 51, and be the office for schematically showing the B regions surrounded in Fig. 1 by circle
Portion's amplification view.In the present embodiment, it is formed at circuit substrate contact stage portion 25 and heat sink contact stage portion 26
Different zones this point is different from first embodiment.
Heat sink holding boss 23a, 23b are formed as different multiple convex of height of the prominent top for being formed at top plate 21
Platform shape, from its highly relatively low step contacting stage portion 25, heat sink by circuit substrate contacts stage portion 26, hot riveting platform
Rank portion 27 is constituted.Heat sink contacts stage portion 26 and hot riveting the stage portion 27 multistage shape that to be formed as diameter different.In addition,
It is provided with hot riveting boss 24a, 24b in circuit substrate contact stage portion 25 and is formed as the different multistage shape of diameter.This
Place, although show the example that the multistage shape that hot riveting boss 24a, 24b are provided with stage portion 25 is contacted in circuit substrate
Son, but it is also possible to circuit substrate is contacted into stage portion 25 and hot riveting is arranged at the different zones of top plate 21 with boss 24a, 24b.
In distance light substrate 14, diameter is provided with position corresponding with boss 23a, 23b with heat sink holding with dissipating
The roughly the same hole of diameter of hot plate contact stage portion 26, the heat sink contact contraposition of stage portion 26 is inserted in the hole.In addition, remote
Light is also provided with diameter and hot riveting stage portion with heat sink 51 at position corresponding with boss 23a, 23b with heat sink holding
The roughly the same hole of 27 diameter, the contraposition of hot riveting stage portion 27 is inserted in the hole.Thus, heat sink contact stage portion 26 is upper
Surface is contacted with distance light with the lower surface of heat sink 51, so as to be carried out by heat sink contact stage portion 26 to distance light with heat sink 51
Keep.
A part for the front end of hot riveting stage portion 27 is protruded from distance light with the hole of heat sink 51, to prominent fore-end
Heated and pressurizeed and be plastically deformed it, form the front end variant part 28 for covering hole, stage portion 26 is contacted by heat sink
Upper surface and front end variant part 28 distance light heat sink 51 is fixed in the height direction.
In addition, contacting the circuit substrate contact stage portion 25 that stage portion 26 is dividually provided projectingly on top plate 21 with heat sink
Upper surface contacted with distance light with the lower surface of substrate 14 and distance light kept with substrate 14.In distance light substrate 14,
Hole is provided with position corresponding with boss 24a, 24b with hot riveting, hot riveting is inserted in the hole with boss 24a, 24b and right
The hot riveting carries out hot riveting with boss 24a, 24b leading section, thus by circuit substrate contact stage portion 25 upper surface and
Hot riveting boss 24a, 24b in the height direction fix distance light substrate 14.In addition, in distance light heat sink 51 and heat
Thus riveting prevents distance light heat sink 51 with being also formed with preventing from disturbing hole 51a, 51b at the corresponding position of boss 24a, 24b
Disturbed with hot riveting boss 24a, 24b.
As described above, in the present embodiment, heat sink holding boss 23a, 23b are multiple highly different boss shapes
Shape, circuit substrate contact stage portion 25 contacts thickness of the difference in height equivalent to distance light substrate 14 of stage portion 26 with heat sink
With gap 31 apart from sum.Therefore, heat sink contact stage portion 26, which is used as, is located at distance light with substrate 14 and distance light heat sink
The distance piece function at the interval in gap 31 is kept between 51.Region in gap 31, being equipped with the first LED18a
Rear side coating conducting-heat elements 30, the conducting-heat elements 30 are held between distance light substrate 14 and distance light heat sink 51 simultaneously
The conducting-heat elements 30 are rolled in the way of being contacted with the two.
In the present embodiment, heat sink holding is also shaped in distance light reflector with boss 23a~23c by resin
The top plate 21 of unit 16, can carry out the processing of the high-precision shape of several units of micrometers, additionally it is possible to make manufacturing process and construction
Simplify and realize cost degradation.In addition, distance light substrate 14, the shape simplification of distance light heat sink 51 can be made, it can pass through
Punch process is molded to heat sink, and cost degradation is realized therefore, it is possible to simplify manufacturing process and construction.Further, lead to
Cross heat sink holding and to be set to hot riveting stage portion 27 with boss 23a~23c front end, thus, it is possible to using hot riveting as remote
The fastening linking method of light heat sink 51, and the simplification of the reduction, miniaturization, manufacturing process of number of components can be realized.
Therefore, in the lamps apparatus for vehicle 10 of present embodiment, distance light substrate 14 can be ensured with simple structure
The gap 31 of the back side and distance light between heat sink 51, and can by configure the conducting-heat elements 30 of coating-type and ensure insulation
Property and thermal conductivity.Thereby, it is possible to prevent circuit substrate produced during using preshaped thermally conductive sheet, thermal component from sticking up
Song, and can prevent light-emitting component from deviateing from the focal position of reflector and causing light distribution characteristic to be deteriorated.
(the 4th embodiment)
Next, 7 pairs of reference picture the 4th embodiment of the invention is illustrated.It will be directed to and be repeated with first embodiment
Part explanation omit.Fig. 7 be represent in the 4th embodiment by heat sink holding with boss 23a, 23b to distance light base
Plate 14 and the schematic diagram of the distance light holding of heat sink 51, and be the office for schematically showing the B regions surrounded in Fig. 1 by circle
Portion's amplification view.
As shown in fig. 7, in the present embodiment, possessing the thermal component maintaining part with the split of distance light reflector element 16
32.Thermal component maintaining part 32 is formed with heat sink holding boss 23a~23c, the thermal component maintaining part 32 be used for from
The part that distance light is kept to distance light with the top of heat sink 51 with substrate 14 and distance light with heat sink 51.Although being drawn in figure
The entire surface of distance light heat sink 51 is covered for thermal component maintaining part 32, but in order to ensure being radiated from distance light heat sink 51
Efficiency, preferably in other regions (not shown) thermal component maintaining part 32 set opening portion and make distance light heat sink 51
The part of upper surface expose.
Heat sink holding is formed as the height being protrudedly formed downward from thermal component maintaining part 32 with boss 23a~23c
The different multiple projection shapes of degree, from its highly relatively low step contacting stage portion 26, circuit substrate by heat sink contacts platform
Rank portion 25, hot riveting stage portion 27 are constituted.It is different that circuit substrate contact stage portion 25 is formed as diameter with hot riveting stage portion 27
Multistage shape.Therefore, heat sink holding with boss 23a~23c as in distance light with substrate 14 and distance light heat sink
The distance piece function in gap 31 is spaced and formed as defined in being kept between 51.
In distance light heat sink 51, it is respectively arranged with position corresponding with boss 23a, 23b with heat sink holding straight
Footpath contacts the roughly the same hole of diameter of stage portion 26 and circuit substrate contact stage portion 25 with heat sink, and heat sink is contacted
Stage portion 26 and circuit substrate contact stage portion 25 align be inserted in the hole respectively.In addition, distance light with substrate 14 also with
Heat sink holding is roughly the same with the diameter of hot riveting stage portion 27 with diameter is provided with the corresponding position of boss 23a, 23b
Hole, the hole is inserted in by the contraposition of hot riveting stage portion 27.Thus, the lower surface and distance light base of circuit substrate contact stage portion 25
Upper surface (back side) contact of plate 14, so as to be kept by circuit substrate contact stage portion 25 to distance light with substrate 14.
A part for the front end of hot riveting stage portion 27 is protruded from distance light with the hole of substrate 14, and prominent fore-end is entered
Row heats and pressurizes and be plastically deformed it, the front end variant part 28 for covering hole is formed, so as to contact stage portion by heat sink
Distance of 26 lower surface and front end variant part 28 by distance light with substrate 14 relative to thermal component maintaining part 32 is fixed.Heat sink
The part for contacting the front end of stage portion 26 is also protruded from distance light with the hole of heat sink 51, and prominent fore-end is heated
And pressurization and be plastically deformed it, the front end variant part 28 that covers hole is formed, so that by thermal component maintaining part 32 and distance light
It is fixed in a contact fashion with heat sink 51.In addition, utilizing the foregoing hot riveting boss for being provided projectingly on top plate 21
24a~24d carries out hot riveting at hole (not shown), thus in the height direction fixes distance light substrate 14.
Herein, the lateral attitude of distance light substrate 14 is determined by the hole of distance light substrate 14 and hot riveting stage portion 27, by
Distance light contacts stage portion 25 with the hole of heat sink 51 and circuit substrate and heat sink contact stage portion 26 determines that distance light radiates
The lateral attitude of plate 51.
As described above, in the present embodiment, circuit substrate contact stage portion 25 and hot riveting stage portion 27 are formed as straight
The different multistage shape in footpath, the circuit substrate contacts thickness and gap of the height of stage portion 25 equivalent to distance light with heat sink 51
31 apart from sum.Therefore, circuit substrate contact stage portion 25 as be located at distance light with substrate 14 and distance light heat sink 51 it
Between and keep the distance piece function at the interval in gap 31.The back of the body in region in gap 31, being equipped with the first LED18a
Surface side apply conducting-heat elements 30, by the conducting-heat elements 30 be held between distance light substrate 14 and distance light heat sink 51 and with
The mode of the two contact is rolled to the conducting-heat elements 30.
In the present embodiment, heat sink holding is also integrally molded so as thermal component holding with boss 23a~23c by resin
Portion 32, can carry out the processing of the high-precision shape of several units of micrometers, additionally it is possible to manufacturing process and construction is simplified and is realized
Cost degradation.In addition, distance light substrate 14, the shape simplification of distance light heat sink 51 can be made, punch process pair can be passed through
Heat sink is molded, and cost degradation is realized therefore, it is possible to simplify manufacturing process and construction.Further, by by heat sink
Holding is set to hot riveting stage portion 27 with boss 23a~23c front end, thus, it is possible to be used as distance light substrate 14 using hot riveting
Fastening linking method, and the simplification of the reduction, miniaturization, manufacturing process of number of components can be realized.
Therefore, in the lamps apparatus for vehicle 10 of present embodiment, distance light substrate 14 can be ensured with simple structure
The gap 31 of the back side and distance light between heat sink 51, and can by configure the conducting-heat elements 30 of coating-type and ensure insulation
Property and thermal conductivity.Thereby, it is possible to prevent circuit substrate produced during using preshaped thermally conductive sheet, thermal component from sticking up
Song, and can prevent light-emitting component from deviateing from the focal position of reflector and causing light distribution characteristic to be deteriorated.
(the 5th embodiment)
Next, 8 pairs of reference picture the 5th embodiment of the invention is illustrated.It will be directed to and be repeated with first embodiment
Part explanation omit.Fig. 8 be represent in the 5th embodiment by heat sink holding with boss 23a, 23b to distance light base
Plate 14 and the schematic diagram of the distance light holding of heat sink 51, and be the office for schematically showing the B regions surrounded in Fig. 1 by circle
Portion's amplification view.In the present embodiment, distance light heat sink 51 is configured between distance light substrate 14 and top plate 21 this
It is a little different from first embodiment.
Heat sink holding boss 23a, 23b are formed as being formed with the multistage shape of the different multiple steps of diameter, from it
Lower section is risen to be contacted stage portion 25, hot riveting stage portion 27 and is constituted by heat sink contact stage portion 26, circuit substrate.
In distance light heat sink 51, be provided with position corresponding with boss 23a, 23b with heat sink holding diameter with
The roughly the same hole of diameter of circuit substrate contact stage portion 25, the hole is inserted in by the circuit substrate contact contraposition of stage portion 25.
Thus, the upper surface of heat sink contact stage portion 26 is contacted with distance light with the lower surface of heat sink 51, so as to be contacted by heat sink
Stage portion 26 is kept to distance light with heat sink 51.In addition, in distance light heat sink 51, in the opening portion 22a with top plate 21
Corresponding region is provided with opening portion, and the top in opening portion 22a regions, the first LED18a is equipped in the way of downward
Distance light is with substrate 14 and opposed with reflecting surface 19a (not shown).
The rear end side (right side in Fig. 2) of distance light heat sink 51 can be formed as more towards rear prolonging than distance light substrate 14
Construction (omitting diagram) that is long and improving radiating efficiency.At this point it is possible to make the extension of distance light heat sink 51 by punch process
Region in vertical direction bending and used as radiating fin.
Diameter and heat are also provided with position corresponding with boss 23a, 23b with heat sink holding with substrate 14 in distance light
The roughly the same hole of the diameter of stage portion 27 is riveted, the contraposition of hot riveting stage portion 27 is inserted in the hole.Thus, circuit substrate connects
The upper surface for touching stage portion 25 is contacted with distance light with the lower surface of substrate 14, so as to contact stage portion 25 to distance light by circuit substrate
Kept with substrate 14.
Herein, the lateral attitude of distance light substrate 14 is determined by the hole of distance light substrate 14 and hot riveting stage portion 27, by
Distance light determines the lateral attitude of distance light heat sink 51 with the hole of heat sink 51 and heat sink contact stage portion 26.Though it is shown that
Hot riveting stage portion 27 is set to roughly the same diameter with the hole of substrate 14 with being arranged at distance light and heat sink is contacted into step
Portion 26 is with being arranged at the example that distance light is set to roughly the same diameter with the hole of heat sink 51, but as long as each step of multistage shape
It is inserted into, the diameter with a certain degree of gap can be set to.
A part for the front end of hot riveting stage portion 27 is protruded from distance light with the hole of substrate 14, and prominent fore-end is entered
Row heats and pressurizes and be plastically deformed it, the front end variant part 28 for covering hole is formed, so as to contact step by circuit substrate
The upper surface in portion 25 and front end variant part 28 in the height direction fix distance light substrate 14.Using foregoing hot riveting with convex
Platform 24a~24d carries out hot riveting to distance light with heat sink 51, so as to contact upper surface and the hot riveting of stage portion 26 by heat sink
Distance light heat sink 51 is fixed in the height direction with boss 24a~24d.
It is formed on top plate 21, is kept by heat sink with convex as shown in figure 8, heat sink holding boss 23a, 23b are protruded
Platform 23a, 23b are kept with heat sink 51 with substrate 14 and distance light to distance light and ensure there is gap 31 between.
The rear side coating conducting-heat elements 30 in region in gap 31, being equipped with the first LED18a, thus clamp the conducting-heat elements 30
Rolled in distance light with substrate 14 with distance light between heat sink 51 and to the conducting-heat elements 30 in the way of being contacted with the two.
As described above, in the present embodiment, heat sink holding boss 23a, 23b are multistage shape, the heat sink connects
Touch thickness of the difference in height equivalent to distance light heat sink 51 and gap 31 that stage portion 26 contacts stage portion 25 with circuit substrate
Apart from sum.Therefore, circuit substrate contact stage portion 25 is as being located at distance light between substrate 14 and distance light heat sink 51
Keep the distance piece function at the interval in gap 31.
In the present embodiment, heat sink holding is also shaped in distance light reflector with boss 23a~23c by resin
The top plate 21 of unit 16, can carry out the processing of the high-precision shape of several units of micrometers, additionally it is possible to make manufacturing process and construction
Simplify and realize cost degradation.In addition, distance light substrate 14, the shape simplification of distance light heat sink 51 can be made, it can pass through
Punch process is molded to heat sink, and cost degradation is realized therefore, it is possible to simplify manufacturing process and construction.Further, lead to
Cross heat sink holding and to be set to hot riveting stage portion 27 with boss 23a~23c front end, thus, it is possible to using hot riveting as remote
The fastening linking method of light substrate 14, and the simplification of the reduction, miniaturization, manufacturing process of number of components can be realized.
Therefore, in the lamps apparatus for vehicle 10 of present embodiment, distance light substrate 14 can be ensured with simple structure
The gap 31 of surface and distance light between heat sink 51, and can by configure the conducting-heat elements 30 of coating-type and ensure insulation
Property and thermal conductivity.Thereby, it is possible to prevent circuit substrate produced during using preshaped thermally conductive sheet, thermal component from sticking up
Song, and can prevent light-emitting component from deviateing from the focal position of reflector and causing light distribution characteristic to be deteriorated.
(the 6th embodiment)
Although exemplified as lamps apparatus for vehicle 10 many lamp-type in the embodiment of first embodiment~the five
Light fixture, also can be with simple structure even if using the structure of other optical systems such as projection type, PES types, parabolic shape
And ensure the gap between the surface of circuit substrate and thermal component, and can be ensured by configuring the conducting-heat elements of coating-type
Insulating properties and thermal conductivity.In addition, circuit substrate produced when can prevent from using preshaped thermally conductive sheet, thermal component
Warpage, and can prevent light-emitting component from deviateing from the focal position of reflector and causing light distribution characteristic to be deteriorated.
The present invention is not limited to above-mentioned each embodiment, can be carried out in the scope shown in claims various
Change, by that will distinguish that disclosed technological means is appropriately combined in various embodiments and the embodiment that obtains, is also wrapped
In the technical scope for being contained in the present invention.
Symbol description
10 lamps apparatus for vehicle
11 lamp main bodys
11a back parts
12 outer covers
13 lamp houses
14 distance light substrates
15 dipped beam substrates
16 distance light reflector elements
16a distance light diffusion reflectors
16b, 16c distance light optically focused reflector
17 dipped beam reflector elements
17a dipped beam diffusion reflectors
17b, 17c dipped beam optically focused reflector
18a~18f LED
19a~19c, 20a~20c reflectings surface
21 top plates
22a~22c opening portions
23a~23f heat sink holding boss
24a~24d hot riveting boss
25 circuit substrates contact stage portion
26 heat sinks contact stage portion
27 hot riveting stage portions
28 front end variant parts
29 packing rings
30 conducting-heat elements
31 gaps
32 thermal component maintaining parts
50 lamp units
51 distance light heat sinks
51a, 51b prevent from disturbing hole
52 dipped beam heat sinks
Claims (8)
1. a kind of lamps apparatus for vehicle, it is characterised in that
The lamps apparatus for vehicle has：
Circuit substrate, it possesses surface and the back side, and is equipped with light-emitting component on the surface；
Thermal component, it is configured to opposed with the circuit substrate；
Distance piece, it is located between the circuit substrate and the thermal component, and to the circuit substrate and the radiating part
Interval between part is kept；And
The conducting-heat elements of coating-type, it is configured between the circuit substrate and the thermal component and with insulating properties.
2. lamps apparatus for vehicle according to claim 1, it is characterised in that
The conducting-heat elements of the coating-type are heat-conductive lubricating grease or heat conductive adhesive.
3. lamps apparatus for vehicle according to claim 1 or 2, it is characterised in that
The conducting-heat elements of the coating-type contain filler, and the interval between the circuit substrate and the thermal component is more than described
The maximum particle diameter of filler.
4. lamps apparatus for vehicle according to any one of claim 1 to 3, it is characterised in that
Possesses the circuit substrate holding member kept to the circuit substrate, the distance piece is kept with the circuit substrate
Part is integrally formed.
5. lamps apparatus for vehicle according to claim 4, it is characterised in that
The distance piece is to protrude the boss to be formed from the circuit substrate holding member.
6. lamps apparatus for vehicle according to claim 5, it is characterised in that
The boss is the multistage shape for possessing the first maintaining part and the second maintaining part, wherein, first maintaining part and institute
Circuit substrate contact is stated, second maintaining part is contacted with the thermal component.
7. the lamps apparatus for vehicle according to any one of claim 4 to 6, it is characterised in that
The circuit substrate holding member is the reflector with the reflecting surface reflected the light from the light-emitting component.
8. lamps apparatus for vehicle according to any one of claim 1 to 3, it is characterised in that
Possesses the thermal component maintaining part kept to the thermal component, the distance piece is kept from the thermal component
Portion protrude it is being formed and with the boss of the rear-face contact.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016035194A JP6691792B2 (en) | 2016-02-26 | 2016-02-26 | Vehicle lighting |
| JP2016-035194 | 2016-02-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107131460A true CN107131460A (en) | 2017-09-05 |
| CN107131460B CN107131460B (en) | 2020-04-21 |
Family
ID=59679476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710089098.6A Active CN107131460B (en) | 2016-02-26 | 2017-02-20 | Vehicle lamp |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US10150404B2 (en) |
| JP (1) | JP6691792B2 (en) |
| CN (1) | CN107131460B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109556074A (en) * | 2017-09-19 | 2019-04-02 | 株式会社小糸制作所 | Lamp unit and lamps apparatus for vehicle |
| CN110296370A (en) * | 2018-03-22 | 2019-10-01 | 斯坦雷电气株式会社 | Lamps apparatus for vehicle |
| CN112577018A (en) * | 2019-09-27 | 2021-03-30 | 株式会社小糸制作所 | Light source unit and vehicle lamp |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102017113673A1 (en) * | 2017-06-21 | 2018-12-27 | HELLA GmbH & Co. KGaA | Lighting device for vehicles and fastening methods |
| JP6981832B2 (en) * | 2017-09-28 | 2021-12-17 | 株式会社小糸製作所 | Vehicle lighting |
| JP7364309B2 (en) * | 2019-01-29 | 2023-10-18 | スタンレー電気株式会社 | Vehicle lighting unit and vehicle lighting |
| DE102019116865A1 (en) * | 2019-06-24 | 2020-12-24 | HELLA GmbH & Co. KGaA | Light unit for a motor vehicle, with a reflector, a circuit board and a heat sink |
| CN111486407A (en) * | 2019-11-30 | 2020-08-04 | 华域视觉科技(上海)有限公司 | Car lamp module, car lamp and vehicle |
| JP2022057394A (en) * | 2020-09-30 | 2022-04-11 | 市光工業株式会社 | Vehicular lighting fixture |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008159341A (en) * | 2006-12-22 | 2008-07-10 | Matsushita Electric Works Ltd | Led lighting device |
| CN201448660U (en) * | 2009-08-08 | 2010-05-05 | 木林森电子有限公司 | LED lamp tube |
| CN101836040A (en) * | 2007-10-24 | 2010-09-15 | 欧陆汽车有限责任公司 | Method for positioning and mounting an LED assembly and positioning body for the same |
| CN201706449U (en) * | 2010-05-25 | 2011-01-12 | 东莞市邦臣光电有限公司 | Led daylight lamp radiator |
| US20130044501A1 (en) * | 2009-02-02 | 2013-02-21 | Charles A. Rudisill | Modular lighting system and method employing loosely constrained magnetic structures |
| JP2013084675A (en) * | 2011-10-06 | 2013-05-09 | Shindengen Electric Mfg Co Ltd | Electric connection structure of semiconductor element |
| CN104145332A (en) * | 2012-03-22 | 2014-11-12 | 皇家飞利浦有限公司 | Thermal interface material |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004087569A (en) * | 2002-08-23 | 2004-03-18 | Pioneer Electronic Corp | Positioning structure |
| TW201020460A (en) * | 2008-11-26 | 2010-06-01 | Ling Chyuan Fa Ing Yonq Ltd | Heat-dissipation structure of LED |
| JP5593578B2 (en) * | 2010-03-23 | 2014-09-24 | スタンレー電気株式会社 | Vehicle lighting |
| JP2011243502A (en) * | 2010-05-20 | 2011-12-01 | Ichikoh Ind Ltd | Vehicle lighting device |
| JP5557665B2 (en) | 2010-09-17 | 2014-07-23 | 株式会社小糸製作所 | Vehicle lighting |
| WO2012155816A1 (en) * | 2011-05-18 | 2012-11-22 | 广州南科集成电子有限公司 | Dustproof and waterproof multipurpose led-light power source assembly and dustproof and waterproof led light |
| WO2012164506A1 (en) * | 2011-05-31 | 2012-12-06 | Sabic Innovative Plastics Ip B.V. | Led plastic heat sink and method for making and using the same |
| WO2014015561A1 (en) * | 2012-07-24 | 2014-01-30 | 上海亚明照明有限公司 | Integrated led module |
| US20140063794A1 (en) * | 2012-09-05 | 2014-03-06 | Foshan Innovative Lighting Co., Ltd. | Curved printed circuit boards, light modules, and methods for curving a printed circuit board |
| JP2014175359A (en) * | 2013-03-06 | 2014-09-22 | Koito Mfg Co Ltd | Mounting substrate, light emitting device and lamp fitting for vehicle |
| JP6211349B2 (en) * | 2013-08-27 | 2017-10-11 | 株式会社小糸製作所 | Vehicle lighting |
-
2016
- 2016-02-26 JP JP2016035194A patent/JP6691792B2/en active Active
-
2017
- 2017-02-10 US US15/429,383 patent/US10150404B2/en not_active Expired - Fee Related
- 2017-02-20 CN CN201710089098.6A patent/CN107131460B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008159341A (en) * | 2006-12-22 | 2008-07-10 | Matsushita Electric Works Ltd | Led lighting device |
| CN101836040A (en) * | 2007-10-24 | 2010-09-15 | 欧陆汽车有限责任公司 | Method for positioning and mounting an LED assembly and positioning body for the same |
| US20130044501A1 (en) * | 2009-02-02 | 2013-02-21 | Charles A. Rudisill | Modular lighting system and method employing loosely constrained magnetic structures |
| CN201448660U (en) * | 2009-08-08 | 2010-05-05 | 木林森电子有限公司 | LED lamp tube |
| CN201706449U (en) * | 2010-05-25 | 2011-01-12 | 东莞市邦臣光电有限公司 | Led daylight lamp radiator |
| JP2013084675A (en) * | 2011-10-06 | 2013-05-09 | Shindengen Electric Mfg Co Ltd | Electric connection structure of semiconductor element |
| CN104145332A (en) * | 2012-03-22 | 2014-11-12 | 皇家飞利浦有限公司 | Thermal interface material |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109556074A (en) * | 2017-09-19 | 2019-04-02 | 株式会社小糸制作所 | Lamp unit and lamps apparatus for vehicle |
| CN110296370A (en) * | 2018-03-22 | 2019-10-01 | 斯坦雷电气株式会社 | Lamps apparatus for vehicle |
| CN112577018A (en) * | 2019-09-27 | 2021-03-30 | 株式会社小糸制作所 | Light source unit and vehicle lamp |
| CN112577018B (en) * | 2019-09-27 | 2024-03-01 | 株式会社小糸制作所 | Light source unit and vehicle lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6691792B2 (en) | 2020-05-13 |
| CN107131460B (en) | 2020-04-21 |
| JP2017152285A (en) | 2017-08-31 |
| US10150404B2 (en) | 2018-12-11 |
| US20170248287A1 (en) | 2017-08-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107131460A (en) | Lamps apparatus for vehicle | |
| US10054278B2 (en) | Vehicle headlamp | |
| US7832913B2 (en) | Equipped flexible electronic support, supporting at least one light emitting diode, and the associated manufacturing method | |
| JP5863226B2 (en) | Rear-mounted light-emitting diode module for automotive rear combination lamps | |
| US10914462B2 (en) | Systems and methods for lighting fixtures | |
| US20100290241A1 (en) | Vehicular lamp | |
| US11199297B2 (en) | LED lamp | |
| KR20150015901A (en) | Automobile led head lamp module using flexible substrate and heat sink structure thereof | |
| US10634309B2 (en) | Motor vehicle lighting module with cooling member | |
| JP5166917B2 (en) | Vehicle headlamp | |
| JP4783428B2 (en) | LED light source | |
| JP2013232305A (en) | Lamp fitting for vehicle | |
| CN111156472B (en) | Vehicle lamp | |
| US10429027B2 (en) | Lamp unit, and lighting device and vehicle lamp using same | |
| CN101266028A (en) | Vehicular headlamps | |
| CN112088583A (en) | Electronic module and light emitting device for automobile | |
| WO2022100163A1 (en) | Led double-light module with self-adaption function | |
| CN213577282U (en) | LED double-light module with self-adaptive function | |
| CN111692564B (en) | Lamp unit and vehicle lamp | |
| CN211232746U (en) | Vehicle lamp | |
| JP6105318B2 (en) | Heat dissipation structure for vehicular lamp | |
| CN215764928U (en) | Radiator and lighting device comprising same | |
| CN108626693A (en) | Lighting module and its production method with radiator on a printed circuit | |
| CN207298773U (en) | A kind of nearly distance light modules of LED | |
| CN219735077U (en) | Light-emitting module and light-emitting mechanism |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |