JP2008140566A - Apparatus and method for treatment by irradiation of energy ray - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus and method for treatment by autonomous irradiation of an energy ray, capable of precisely controlling a position of a workpiece with respect to an energy ray irradiation device and highly accurately treating the workpiece with the energy ray. <P>SOLUTION: Because a degree of misregistration of the workpiece held by a holding apparatus is detected with respect to the holding apparatus by a positioning camera, a control apparatus corrects treatment data only in accordance with the degree of misregistration to operate a stage apparatus, and the holding apparatus is moved with respect to the energy ray irradiation device, the position of the workpiece held by the holding apparatus is precisely controlled with respect to the energy ray irradiation device, and the precise position and range of the workpiece are irradiated with the energy ray to allow highly accurate treatment. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an energy beam irradiation apparatus and method for performing various processes such as cleaning, film formation, modification, etching, and processing on a work surface by an energy beam irradiated from the energy beam irradiation apparatus.

  In Patent Document 1, a work is mounted on a table that can move in the X-axis and Y-axis directions, and the base of a wrist mechanism that can rotate around three axes perpendicular to each other is fixed to a lifting table that can move in the Z-axis direction. A plasma processing apparatus is described in which a plasma irradiation apparatus is attached to a flange provided at the tip. In this plasma processing apparatus, the plasma irradiation apparatus and the workpiece are moved relative to each other in the three orthogonal directions by the table and the lifting platform and are also rotated by the wrist mechanism under the control of the stage controller. Is opposed to the plasma irradiation apparatus, and is moved in a desired relative manner so that the necessary processing is performed on the processing site.

As a device that removes dirt on the mold (work) remaining at the time of molding, a first CCD camera that captures the entire image of the mold is installed on the fixed part, and a second CCD camera that captures the processing area of the mold is attached to the flange. ing. The entire image of the mold is picked up by the first CCD camera, and a dirty region is specified by image analysis of this image. Then, a detailed image of a dirty area is captured by the second CCD camera, and the plasma irradiation device is scanned and controlled in that area. By this operation, the contamination in the region is removed by fluorine radicals obtained from the gas plasma containing fluorine.
JP 2006-302652 (paragraphs [0042] to [0049], FIGS. 1 and 2)

  However, in the plasma processing apparatus described in Patent Document 1, a program for moving the work and the plasma irradiation apparatus relative to each other in order to perform a necessary process on the processing part of the work is separately created at a place away from the plasma processing apparatus. Need to be read by the stage controller. In this case, if there is an error in the work attachment position on the table, the program separately created at a location distant from the plasma processing apparatus cannot accurately scan and control the position of the plasma irradiation apparatus with respect to the work.

  The present invention has been made in order to solve the above-described problem, and enables the position of a workpiece to be accurately controlled with respect to the energy beam irradiation apparatus, and allows the workpiece to be processed with high accuracy by the energy beam. It is providing the processing apparatus and method by energy ray irradiation.

  In order to solve the above-mentioned problems, the structural features of the processing apparatus using energy beam irradiation according to claim 1 are the first axis, the second axis direction perpendicular to each other in the movement plane, and the first axis perpendicular to the movement plane. A table mounted on a base so as to be linearly driven in three axis directions, and a first rotating body supported on the table so as to be rotatable around a fourth axis parallel to the first axis or the second axis; A second rotating body supported by the first rotating body so as to be rotatable about a fifth axis perpendicular to the fourth axis; and a workpiece mounted on the second rotating body and in a plane perpendicular to the fifth axis. A stage device including a holding device that holds the workpiece, a positioning camera that photographs the workpiece held on the holding device so as to detect displacement of the workpiece relative to the holding device provided on the base, and the base For workpieces mounted on a table and held by the holding device An energy beam irradiating apparatus that performs processing by irradiating an energy beam, and control data for performing irradiation work by the energy beam irradiating apparatus is input to the work from the input device, and a work held in the holding device is And a control device for operating the stage device so as to face the positioning camera and the energy beam irradiation device.

  A structural feature of the processing apparatus using energy beam irradiation according to claim 2 is the work piece for obtaining position information of a defined point of the work surface provided on the base and held by the holding apparatus according to claim 1. At least one of a surface imaging camera that images the surface of the workpiece in order to acquire information on processing by the energy beam irradiation device on the surface of the workpiece held by the surface definition point detection device and the holding device is provided on the base. It is provided.

  According to a third aspect of the present invention, there is provided a processing apparatus using energy beam irradiation according to claim 2, wherein at least one of the workpiece surface defined point detection device and the surface photographing camera, the positioning camera, and the energy beam irradiation. The device is disposed on the base in the first axial direction.

  A structural feature of the processing apparatus using energy beam irradiation according to claim 4 is that, in any one of claims 1 to 3, the energy beam irradiation apparatus is a plasma irradiation apparatus.

  A structural feature of the processing apparatus using energy beam irradiation according to claim 5 is that, in claim 4, the holding device holds the workpiece in an electrically insulated state, and the workpiece and the electrode of the plasma irradiation device are arranged. In addition, it is possible to apply a bias voltage.

  The structural feature of the processing apparatus using energy beam irradiation according to claim 6 is that in claim 4 or 5, the stage device, the plasma irradiation device, the positioning camera, a workpiece surface defined point detection device, and surface imaging. At least one of the cameras is housed in an airtight cover, and the inside of the cover is communicated to the exhaust treatment device by a pipe connected to the bottom of the hood that covers the plasma generating nozzle of the plasma irradiation device. It is that you are.

  The structural feature of the processing method using energy beam irradiation according to claim 7 is that the linear driving is possible in the first axis direction, the second axis direction, and the third axis direction perpendicular to the moving plane. A table mounted on a table, a first rotating body supported on the table so as to be rotatable about a fourth axis parallel to the first axis or the second axis, and the fourth rotating body on the first rotating body. A second rotating body that is supported so as to be rotatable around a fifth axis perpendicular to the axis; and a holding device that is attached to the second rotating body and holds the workpiece in a plane perpendicular to the fifth axis. A stage device, a positioning camera for photographing a workpiece held by the holding device to detect a positional deviation of the workpiece with respect to the holding device provided on the base, and held by the holding device provided on the base The energy beam irradiating device on the surface of the workpiece A surface photographing camera for photographing the surface of the workpiece in order to acquire information on the processing, and an energy beam irradiating device for irradiating the workpiece, which is mounted on the base and held by the holding device, to perform processing A determination step for determining whether re-irradiation is necessary based on information obtained by processing image information captured by the surface photographing camera, and if re-irradiation is determined to be necessary A parameter selection step for selecting an appropriate parameter comprising the position and area of the re-irradiated portion, the relative speed of the re-irradiated portion with respect to the energy beam, the irradiation intensity and the dose of the energy beam, and the energy beam based on the appropriate parameter. Re-irradiation step for performing irradiation, and until the determination step determines that re-irradiation is unnecessary, the determination step and the parameter selection step Is to repeat and the re-irradiation process.

  A structural feature of the processing method using energy beam irradiation according to claim 8 is that, in claim 7, the repetitive operations of the determination step, the parameter selection step, and the re-irradiation step are performed on the surface property of the workpiece. If it is determined in the determination step that the irradiation effect does not appear as a result of repetition for a set reference number, the repetition operation is stopped and an error stop is included.

  In the processing apparatus using energy beam irradiation according to the first aspect, the positional deviation amount of the work held by the holding apparatus by the positioning camera with respect to the holding apparatus is detected, and the control apparatus corrects the processing data by the positional deviation amount to adjust the stage apparatus. Since it is activated and the holding device is moved relative to the energy beam irradiation device, the position of the workpiece held by the holding device is accurately controlled with respect to the energy beam irradiation device, and the energy beam is irradiated to the exact position and range of the workpiece. Thus, highly accurate processing can be performed.

  In the processing apparatus by energy beam irradiation which concerns on Claim 2, the workpiece surface defined point detection apparatus for acquiring the positional information on the defined point of the processing surface of the workpiece | work hold | maintained at the holding | maintenance apparatus, and the workpiece | work surface hold | maintained at the holding | maintenance apparatus At least one of the surface photographing cameras for photographing the surface of the workpiece is provided on the base in order to acquire information on the processing by the energy beam irradiation apparatus.

  When a workpiece surface definition point detection device is provided, the reference position deviation amount of the reference workpiece held by the holding device located at the original position with respect to the holding device of the workpiece taken by the positioning camera is used for teaching. Detected from image information. The stage device is operated so that the definition point of the workpiece processing surface faces the workpiece surface definition point detection device, the holding device is positioned at the detection position, and the detection position information is sequentially acquired and stored in the storage device of the control device. . For the workpiece after teaching, the amount of displacement with respect to the holding device located at the original position is detected from the image information of the workpiece photographed by the positioning camera. The holding device is sequentially positioned by the stage device at a plurality of detection positions corrected by the difference between the current positional deviation amount and the reference positional deviation amount, and each definition point is detected by the workpiece surface definition point detection device at each detection position. . The positions of the first to fifth axes of the stage device when each definition point is detected are acquired as position information of a plurality of definition points. A processing surface is defined based on position information of a plurality of definition points, and processing data for processing the processing surface with energy rays is created. The control device operates the stage device based on this processing data and moves the holding device relative to the energy beam irradiation device, so that the position of the work held by the holding device is accurately controlled with respect to the energy beam irradiation device, It is possible to perform high-precision processing by irradiating an accurate position and region of the work with energy rays.

  If a front-facing camera that captures the surface of the workpiece is provided, the reference camera position deviation amount relative to the reference holding device held by the holding device located at the original position is determined by the positioning camera in order to perform teaching. It is detected from the image information of the photographed work. The stage device is operated to position the holding device at the surface photographing position so that the position of the surface of the reference workpiece held by the holding device faces the surface photographing camera, and the first axis or the first axis of the stage device at that time is positioned. The position of the fifth axis is acquired as the surface photographing position information. After the teaching is completed, the amount of displacement of the workpiece relative to the holding device located at the original position is detected from the image information of the workpiece photographed by the positioning camera. The holding device is positioned at the corrected surface imaging position by the stage device based on the corrected surface imaging position information obtained by correcting the surface imaging position information by the difference between the current positional deviation amount and the reference positional deviation amount. Based on the image information of the workpiece surface imaged by the surface imaging camera at the corrected surface imaging position, data of a processing area that requires processing by the energy beam irradiation device is created. Based on the processing region data, processing data for processing the processing region with the energy beam irradiated from the energy beam irradiation device is created. The control device operates the stage device based on this processing data and moves the holding device relative to the energy beam irradiation device, so that the position of the work held by the holding device is accurately controlled with respect to the energy beam irradiation device, It is possible to perform high-precision processing by irradiating an accurate position and region of the work with energy rays.

  In the processing apparatus using energy beam irradiation according to claim 3, at least one of the workpiece surface treatment point detection device and the surface photographing camera, the positioning camera, and the energy beam irradiation device are arranged on the base in the first axis direction. Therefore, it is possible to move the workpiece at least one of the workpiece surface definition point detection device and the surface photographing camera, only by moving the holding device for holding the workpiece mainly in the first axis direction by the stage device, the positioning camera, and the energy beam irradiation device. Can be opposed to each other with good operability, and the apparatus can be miniaturized.

  In the processing apparatus using energy beam irradiation according to claim 4, since the energy beam irradiation apparatus is a plasma irradiation apparatus, the surface of the substance can be subjected to various processes such as cleaning, modification, film formation, etching, and processing. it can.

  In the processing apparatus using energy beam irradiation according to the fifth aspect, the holding device holds the workpiece in an electrically insulated state, and a bias voltage can be applied between the workpiece and the electrode of the plasma irradiation device. When a bias voltage is applied, the plasma can be drawn from the electrode to the workpiece, so that not only can the effects of ions be utilized, but plasma is generated directly above the workpiece, so that a large amount of neutral radicals are supplied. Can improve the processing capacity.

  According to the processing apparatus using energy beam irradiation according to claim 6, at least one of the stage device, the plasma irradiation device, the positioning camera, the workpiece surface defined point detection device, and the surface photographing camera has an airtight cover. It is stored inside. For example, in order to clean the surface of a workpiece using the plasma CVM (Chemical Vaporization Machining) method, it is harmful if fluorine radicals are chemically reacted with the surface atoms of the workpiece to convert foreign matter into volatile fluoride and evaporate. Hydrogen fluoride is generated. The stage device, the plasma irradiation device, etc. are housed in an airtight cover, and the inside of the cover communicates with the exhaust treatment device by a pipe connected to the bottom of the hood that covers the plasma generating nozzle of the plasma irradiation device. Therefore, the generated hydrogen fluoride is guided to the hood without staying inside the cover, sent to the exhaust treatment device and processed, and does not pollute the environment.

  In the processing method by energy beam irradiation which concerns on Claim 7, re-irradiation is required based on the information obtained by processing the image information of the imaging | photography location of the workpiece | work surface after the process image | photographed with the surface imaging camera If it is determined that re-irradiation is necessary, select an appropriate parameter consisting of the position and area of the re-irradiation part, the relative speed of the re-irradiation part with respect to the energy beam, the irradiation intensity of the energy beam, and the dose, Since the energy beam irradiation based on the appropriate parameter is repeated until it is determined that the re-irradiation is unnecessary, it is possible to provide a processing method using an autonomous energy beam irradiation capable of performing a highly accurate process on the workpiece with the energy beam. it can.

  In the processing method using energy beam irradiation according to claim 8, if the irradiation effect does not appear even if the energy beam re-irradiation operation is repeated a reference number of times, the repetition operation is stopped and an error is stopped. Do not repeat the work.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, an embodiment embodying a processing apparatus and method using an energy beam according to the invention will be described with reference to the drawings. As shown in FIG. 1, a plasma processing apparatus 10, which is an example of an energy beam processing apparatus, includes a stage device 11 mounted on a base 12 and a horizontal direction extending above the stage device 11 in the horizontal direction. A support base 13 having girders 14 is fixed on the base 12 with its three legs 15. A positioning camera 16, a workpiece surface definition point detection device 17, a surface photographing camera 18, and a plasma irradiation device 19 are fixed to the cross beam 14 in the X-axis direction. Further, a hood 21 that covers the plasma generating nozzle 20 of the plasma irradiation device 19 is fixed to the cross beam 14, and a pair of intake ports 22 that communicate with an exhaust processing device, which will be described later, are opened at the bottom of the hood 21 by a pipe. Yes.

  As shown in FIG. 2, the stage device 11 is arranged in the X axis (first axis), Y axis (second axis) direction perpendicular to each other in the movement plane, and the Z axis (third axis) direction perpendicular to the movement plane. It has a table mounted on the base 12 so that it can be driven linearly. That is, the X-axis table 26 is mounted on a guide 27 fixed horizontally on the base 12 so as to be slidable in the first axis direction, and is a ball that is rotationally driven by an X-axis motor 28 fixed to the base 12. It is moved in the X-axis direction by a screw. The Y-axis table 30 is mounted on a guide 31 fixed horizontally on the X-axis table 26 so as to be slidable in the Y-axis direction, and is rotated by a Y-axis motor 32 fixed to the X-axis table 26. Is moved in the Y-axis direction. A column 34 is erected on the Y-axis table 30, and a Z-axis table 36 is slidably mounted in the Z-axis direction on a guide fixed in the vertical direction on the front surface of the column 34, and is fixed to the column 34. It is moved in the Z-axis direction by a ball screw that is rotationally driven by the Z-axis motor 37.

  A first rotating body 38 is supported on the Z-axis table 36 so as to be rotatable about a fourth axis parallel to the X-axis, and is rotated by a θ1-axis motor 39 fixed to the Z-axis table 36 via a speed reduction mechanism. . A second rotating body 40 is supported on the first rotating body 38 so as to be rotatable about a fifth axis perpendicular to the fourth axis, and a θ2-axis motor No. 41 fixed to the first rotating body 38 via a speed reduction mechanism. Driven by rotation. A holding device 43 that holds the workpiece W in a plane perpendicular to the five axes is attached to the tip of the second rotating body 40.

  As shown in FIG. 3, for example, a normal three-claw chuck 43 is fixed to the distal end surface of the second rotating body 40 as a holding device. 45 is a covered electric wire connected to an electrode for generating plasma of the plasma irradiation device 19 via an AC power supply, and is introduced from the outside into the rear end portion of the first rotation 38 to allow the second rotating body 40 to rotate. After the second rotating body 40 is loosely wrapped, the electrodes are wired along the rotation axis of the second rotating body 40 and are led out from the outer peripheral surface of the tip portion to the electrodes of the respective claws 44 of the three-jaw chuck 43. 46. Thereby, the bias voltage can be applied between the workpiece W and the electrode of the plasma irradiation device 19 by bringing the electrode 46 into contact with the workpiece W gripped in an electrically insulated state with the three-jaw chuck 43. it can.

  As shown in FIGS. 4 and 7, the image processing device 49 that forms a part of the control device 48 is configured such that the position of the workpiece W held by the three-claw chuck 43 positioned in the original position with respect to the three-claw chuck 43 is shifted. The amount is detected based on the image data of the workpiece W photographed by the positioning camera 16. An interference detection sensor 50 for preventing the workpiece W from interfering with the planar light source 47 is provided below the planar light source 47. The interference detection sensor 50 includes a light source and a light receiving element facing the light source, and detects that the work W has abnormally approached the planar light source 47 when the light emitted from the light source is blocked by the work W and does not reach the light receiving element. The stage apparatus 11 is abnormally stopped.

  As shown in FIG. 5, the workpiece surface defined point detection device 17 includes a detection unit 52 provided with a touch probe 51 at the tip and a base 53 fixed to the cross beam 14. When detecting the definition point of the W processing surface, the detection unit 52 is lowered to the detection position. The stage device 11 is operated to move the three-jaw chuck 43 at a low speed so that the defined point on the workpiece surface is brought into contact with the touch probe 51 of the detection unit 52 lowered to the detection position and moved slightly. The movement positions of the X-axis, Y-axis, and Z-axis tables 26, 30, and 36 corresponding to the position of the three-jaw chuck 43 when the touch probe 51 is moved by a small amount and a contact signal is sent are positions for the respective axes. Detected by a detection device, for example, a linear scale, the rotational positions of the first and second rotating bodies 38, 40 are detected by, for example, a rotary encoder, and these moving positions and rotational positions are defined as position information on the processing point of the workpiece W. The data is stored in the storage device of the motion controller 54 that forms part of the control device 48. The motion controller 54 defines a processing surface based on a plurality of definition point position information on the processing surface of the workpiece W, and creates processing data for processing the processing surface with plasma irradiated from the plasma irradiation device 19.

  In the detection unit 52, a detection unit 56 of the interference sensor 55 is provided so as to surround the touch probe 51 in order to prevent the workpiece W from interfering with the tip of the detection unit 52. When the detection unit 56 comes into contact with the workpiece W and vibrates, the vibration detection sensor connected to the detection unit 56 detects that the workpiece W has abnormally approached the tip of the detection unit 52 and abnormally stops the stage device 11. Since the diameter of the detection unit 56 is substantially the same as the diameter of the plasma generation nozzle 20 of the plasma irradiation device 19, the detection unit 56 is created based on the definition point detected by the touch probe 51 without contacting the detection unit 56. Even if the workpiece W is moved relative to the plasma generating nozzle 20 based on the processed data, the workpiece W does not interfere with the tip of the plasma generating nozzle 20.

  As shown in FIG. 1, a surface photographing camera 18 is fixed to a cross beam 14 of a support base 13 adjacent to a workpiece surface definition point detection device 17. A ring light source 57 in which light emitting elements are arranged in a ring shape is disposed below the surface photographing camera 18, and the workpiece W held by the three-jaw chuck 43 and facing the surface photographing camera 18 is irradiated by the stage device 11. To do. For example, when detecting dirt adhering to the surface of the workpiece from the photographed image, the ring light source 57 may use a light that causes the generated light to emerge from the dirt adhering to the surface of the workpiece W. The reflected light from the workpiece W passes through the center hole of the ring light source 57 and enters the surface photographing camera 18, and a portion of the workpiece W to be photographed is photographed. It is not always necessary to provide both the workpiece surface definition point detection device 17 and the surface photographing camera 18, and at least one of them may be attached to the cross beam 14.

  A plasma irradiation device 19 is attached to the cross beam 14 adjacent to the surface photographing camera 18, and a plasma generation nozzle 20 protrudes downward from the lower end of the plasma irradiation device 19. As the plasma irradiation device 19, for example, the one described in Japanese Patent Application Laid-Open No. 2006-302652 is used. In this plasma irradiation device 19, as shown in FIG. 6, a pair of electrodes 59 are fixed to be opposed to the outside of an insulating separation member 58 in which a plasma material gas passage 60 is formed. The tip portions of the pair of electrodes 59 are formed on opposing surfaces that approach each other, and the tip portions of the separation member 58 project so as to close both side surfaces of the opposing surfaces of the pair of electrodes 59. Thereby, the front end portion of the plasma material gas flow channel 60 is formed by the facing surfaces of the pair of electrodes 59 and the protruding portion of the separation member 58. Two concave portions 61 having a width and a depth of 0.5 mm are formed on the opposing surfaces of the pair of electrodes 59. When a plasma material gas is allowed to flow through the gas flow path 60 in a state where a voltage is applied with the pair of electrodes 59 connected to the plasma generation unit power source 62, in the recess 61 on the side of the pair of electrodes 59 to which a negative potential is applied. Electrons emitted by the hollow cathode discharge collide with the gas, and plasma is generated with high density. The plasma generated by this discharge rides on the gas flow and is irradiated from the opening. The tip portions of the pair of electrodes 59 constitute the plasma generating nozzle 20. As described above, when the electrode 59 of the plasma irradiation device 19 and the workpiece W held by the three-claw chuck 43 are connected to the AC power source 64 by the covered electric wire 45 and a voltage is applied, the plasma can be extracted to the workpiece W. .

  In order to hydrophilize the workpiece W by plasma irradiation, it is desirable to use a gas comprising at least one of nitrogen, oxygen, helium, neon, argon, and air as the plasma material gas. In order to perform processing such as cleaning, etching, and processing of the surface of the workpiece W by plasma irradiation, it is preferable to use a fluorocarbon (CxFy) or hydrofluorinated carbon (CxHyFz) gas as a plasma material gas.

  As shown in FIG. 7, the base 12, the stage device 11, the support base 13, the positioning camera 16, the workpiece surface definition point detection device 17, the surface photographing camera 18, the plasma irradiation device 19, and the hood 21 are airtight covers. The device main body 66 is configured by being housed in the device 65. A pair of intake ports 22 that open to the bottom of the hood 21 that covers the plasma generating nozzle 20 of the plasma irradiation device 19 are connected to a pipe 67, and the pipe 67 is an exhaust that is installed outside the cover 65 and behind the apparatus main body 66. A processing device 68 is connected.

  A plasma generation unit power source 62 for applying an AC voltage between the pair of electrodes 59 of the plasma irradiation apparatus 19 is installed behind the apparatus main body 66. Reference numeral 70 denotes a control box installed beside the apparatus main body 66, which houses a motion controller 54, a programmable controller 71, and an image processing device 49 constituting the control device 48, and an operation screen 72 of the control device 48 is provided on the front surface. Yes. Further, a gas cylinder 73 for storing various plasma material gases is installed in the vicinity of the back surface of the apparatus main body 66, and the gas cylinder 73 is connected to the gas flow path 60 of the plasma irradiation apparatus 19 by a pipe.

  Next, the case where the mold 74 for molding a ceramic product is cleaned as the workpiece W by the plasma processing apparatus 10 configured as described above will be described. First, in order to perform teaching shown in FIG. 8, the reference die 74 is held by the three-jaw chuck 43 with the claws 44. The stage device 11 is operated by the individual operation by the motion controller 54, and the three-jaw chuck 43 is positioned at the original position so that the front surface of the die 74 faces the positioning camera 16, and the X axis and Y axis corresponding to the original position The movement positions of the Z-axis tables 26, 30, 36 and the rotation positions of the first and second rotating bodies 38, 40 are stored as original position information in the storage device of the motion controller 54 (S1). The mold 74 is photographed by the positioning camera 16 (S2), and the image information is taken into the image processing device 49. When a characteristic portion of the mold 74 displayed on the operation screen 72 by the image processing device 49, for example, two holes are designated on the image (see FIG. 9), the image processing device 49 defines the two holes by the difference in brightness. Based on the positions of these two holes, the reference position deviation amount of the mold 74 with respect to the camera optical axis of the positioning camera 16, that is, the deviation amount in the X-axis and Y-axis directions and the inclination amount with respect to the X-axis is calculated (S3). ) To the motion controller 54.

  The stage device 11 is operated in individual operation by the motion controller 54, and the three-nail chuck is arranged so that the surface of the entire front surface of the mold 74 as a reference held by the three-nail chuck 43 to be photographed faces the surface photographing camera 18. 43 is positioned at the surface photographing position (S4), the movement positions of the X-axis, Y-axis, and Z-axis tables 26, 30, and 36 corresponding to the surface photographing position, and the rotation of the first and second rotating bodies 38 and 40. The position is stored in the storage device of the motion controller 54 as surface photographing position information (S5).

  When the workpiece W is solid and it is desired to photograph the surfaces of a plurality of surfaces, the stage device 11 is operated so that each surface to be photographed sequentially faces the surface photographing camera 18 and the three-jaw chuck 43 is placed on the surface photographing position. The motion controller 54 stores the movement positions of the X-axis, Y-axis, and Z-axis tables 26, 30, and 36 and the rotation positions of the first and second rotating bodies 38 and 40 corresponding to the respective surface photographing positions. It is good to memorize | store as several surface imaging position information.

  After completion of teaching, as shown in FIGS. 10A and 10B, when the mold 74 to be processed is started by being gripped by the three-jaw chuck 43 (S11), the motion controller 54 counts the number N of cleaning repetitions described later. Initialization such as resetting the counter is performed (S12), and the stage device 11 is operated to position the three-jaw chuck 43 at the original position (S13). In response to a command from the programmable controller 71, the positioning camera 16 photographs the front surface of the mold 74 (S14) and sends the image information to the image processing device 49. The image processing device 49 detects the two holes 77 based on the difference in brightness of the image, and based on the position of the two holes 77, the amount of displacement of the mold 74 with respect to the camera optical axis of the positioning camera 16, that is, the X axis and Y axis. The direction shift amount and the tilt amount with respect to the X axis are calculated (S15) and sent to the motion controller 54.

  The motion controller 54 operates the stage device 11 to position the three-claw chuck 43 at the corrected surface photographing position corrected by the difference between the current positional deviation amount and the reference positional deviation amount (S16). In response to a command from the programmable controller 71, the surface photographing camera 18 photographs the front surface of the mold 74 (S17) and sends the image information to the image processing device 49. The image processing device 49 detects dirt by dirt detection image processing. For example, the determination criterion for contamination may be determined as contamination if the area of the portion where the difference in brightness is equal to or greater than a set value on the image is equal to or greater than the set value. The image processing device 49 creates dirt area data such as the position and area of the dirt area with respect to the optical axis of the surface photographing camera 18 (S18), and sends it to the motion controller 54. The motion controller 54 determines whether or not cleaning is necessary based on the dirt region position data (S19), and then sends the result to the motion controller 54. If not, the motion controller 54 moves the three-jaw chuck 43 to the loading / unloading position (S20), and if necessary, creates cleaning data by the plasma irradiation device 19 (S21).

  The motion controller 54 operates the stage device 11 based on the cleaning data, and scans the plasma irradiated from the plasma irradiation device 19 in the contamination area to remove the contamination (S22). The plasma material gas used at this time is a hydrofluoric carbon (CxHyFz) gas suitable for cleaning. Thereby, hydrogen fluoride is generated during cleaning, but the generated hydrogen fluoride is sucked from the hood 21 into the exhaust treatment device 68 and processed, and does not pollute the environment.

  The motion controller 54 operates the stage device 11 to return the three-claw chuck 43 holding the cleaned mold to the corrected surface photographing position (S23). The surface photographing camera 18 photographs the front surface of the cleaned mold 74 (S24), and sends the image information to the image processing device 49. The image processing device 49 detects dirt by the dirt detection image processing, creates dirt area data such as the position and area of the dirt area with respect to the optical axis of the surface photographing camera 18 (S25), and sends it to the motion controller 54.

  The motion controller 54 determines whether or not re-irradiation is necessary based on the input dirty area data (S26). When the motion controller 54 determines that re-irradiation is unnecessary, the stage device 11 is operated to move the three-jaw chuck 43 to the loading / unloading position, and the die 74 is removed from the chuck (S27).

  If the motion controller 54 determines that re-irradiation is necessary, the motion controller 54 adds 1 to the counter indicating the number of cleaning repetitions N (S28). The apparatus automatically selects appropriate parameters including the position and area of the re-irradiated portion, the relative speed of the re-irradiated portion with respect to the plasma, the irradiation intensity of the plasma, and the irradiation amount (S29).

  The motion controller 54 creates recleaning data based on the dirty area data and the appropriate parameters (S30), operates the stage device 11 to scan the dirty area with plasma, and recleans it (S31). The control device 48 repeats steps S23 to S31 until it is determined that re-irradiation is unnecessary, and when it is determined that the irradiation effect does not appear as a result of repeating the set reference number L (S32), it is repeated. The operation is stopped and an error is stopped (S33). The reference number L is appropriately set according to the surface properties of the workpiece, that is, surface cleaning, modification, film formation, etching, and the like.

  Next, a case where etching is performed on the processing surface of the workpiece W by the plasma processing apparatus 10 will be described. First, in order to perform teaching, a work piece serving as a reference is gripped by the three-jaw chuck 43 with the claws 44. The stage apparatus 11 is operated by the individual operation by the motion controller 54, and the three-jaw chuck 43 is positioned at the original position so that the workpiece W faces the positioning camera 16, and the X axis, Y axis, Z corresponding to this original position The movement positions of the axis tables 26, 30 and 36 and the rotation positions of the first and second rotating bodies 38 and 40 are stored in the storage device of the motion controller 54 as original position information. The workpiece W is photographed by the positioning camera 16 and the image information is taken into the image processing device 49. When a feature portion of the workpiece W displayed on the operation screen by the image processing device 49, for example, a corner portion that intersects at a right angle is specified on the image, the image processing device 49 detects the corner portion by the difference in brightness, and the corner portion is detected. Based on the position, the reference position deviation amount of the workpiece W with respect to the camera optical axis of the positioning camera 16, that is, the deviation amount in the X-axis and Y-axis directions and the inclination amount with respect to the X-axis is calculated and sent to the motion controller 54.

  The detection unit 52 of the workpiece surface defined point detection device 17 is lowered to the detection position. The stage device 11 is operated to sequentially position the three-jaw chuck 43 at a plurality of detection positions facing the tip of the touch probe 51 of the detection unit 52 where a plurality of definition points on the processing surface of the workpiece W are lowered to the detection position. To do. The movement positions of the X-axis, Y-axis, and Z-axis tables 26, 30, and 36 and the rotation positions of the first and second rotating bodies 38 and 40 corresponding to the respective detection positions where the three-jaw chuck 43 is sequentially positioned are detected. The position information is stored in the storage device of the motion controller 54.

  After the teaching is completed, when the workpiece W to be etched is held by the three-jaw chuck 43 and started, the motion controller 54 operates the stage device 11 to position the three-jaw chuck 43 at the original position. The positioning camera 16 photographs the workpiece W and sends the image information to the image processing device 49. The image processing device 49 detects the corner of the image, calculates the amount of positional deviation of the workpiece W with respect to the camera optical axis of the positioning camera 16 based on the position of the corner, and sends it to the motion controller 54.

  The motion controller 54 adds a displacement amount to the teaching irradiation position, and creates processing data for etching the processing surface by scanning of the plasma irradiated from the plasma irradiation device 19. The motion controller 54 operates the stage device 11 based on the processing data, scans the plasma irradiated from the plasma irradiation device 19 on the processing surface, and performs etching. A plasma material gas used at this time is suitable for cleaning.

  Next, a case where the contact lens is hydrophilized as the workpiece W by the plasma processing apparatus 10 will be described. In this case, since the workpiece surface definition point detection device 17 and the surface photographing camera 18 are not used, teaching is not necessary. When the jigs 76 (see FIG. 11) each having a plurality of contact lenses 75 attached to an adhesive sheet are gripped by the three-jaw chuck 43 positioned in the original position without being displaced, the plasma irradiation apparatus 19 The reference processing data for moving the three-claw chuck 43 holding the jig 76 by the stage device 11 is performed so that the plasma irradiated from the above scans each contact lens 75 attached to the jig 76 and sequentially performs the hydrophilic treatment. It is created in advance and stored in the motion controller 54.

  When the jig 76 having a plurality of contact lenses 75 attached to each sticky sheet is started by being gripped by the three-jaw chuck 43, the motion controller 54 operates the stage device 11 to start the three-jaw chuck 43. Position to position. The positioning camera 16 images the jig 76 and sends the image information to the image processing device 49. The image processing device 49 calculates the positional deviation amount of the jig 76 with respect to the camera optical axis of the positioning camera 16 based on the positions of the two reference marks 78 detected in the image, and sends them to the motion controller 54. The motion controller 54 operates the stage device 11 with the correction processing data obtained by correcting the reference processing data by the positional deviation amount, and sequentially performs the hydrophilic treatment on the plurality of contact lenses 75 by the plasma irradiated from the plasma irradiation device 19.

  In the above embodiment, the plasma irradiation apparatus is used as the energy beam irradiation apparatus. However, the present invention is not limited to this, and for example, a laser beam irradiation apparatus, an electron beam irradiation apparatus, or the like may be used.

The perspective view of the apparatus main body which removed the cover. The perspective view of a stage apparatus. The perspective view of a 1st, 2nd rotary body and a three-claw chuck | zipper part. The block diagram which shows a control relationship. The figure which shows a workpiece surface defined point detection apparatus. The figure which shows an example of a plasma irradiation apparatus. The perspective view which shows an apparatus main body. The flowchart of teaching of cleaning processing. The figure which shows the image of a type | mold. The first half of the flowchart after teaching the cleaning process. The second half of the flowchart after teaching the cleaning process. The figure which shows the jig of a contact lens.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Plasma processing apparatus, 11 ... Stage apparatus, 12 ... Base, 13 ... Support stand, 14 ... Cross beam, 16 ... Positioning camera, 17 ... Work surface definition point detection apparatus, 18 ... Surface imaging camera, 19 ... Plasma irradiation 20 ... Plasma generating nozzle, 21 ... Hood, 22 ... Intake port, 26 ... X-axis table, 30 ... Y-axis table, 36 ... Z-axis table, 38 ... First rotating body, 40 ... Second rotating body, 43 ... three-claw chuck (holding device), 45 ... covered electric wire, 46 ... electrode, 48 ... control device, 49 ... image processing device, 51 ... touch probe, 54 ... motion controller, 59 ... electrode,
60 ... gas flow path, 61 ... recess, 62 ... plasma generating unit power supply, 64 ... AC power supply, 65 ... cover, 66 ... device main body, 68 ... exhaust treatment device, 70 ... control box, 71 ... programmable controller, 72 ... operation Screen 73, gas cylinder, 74 ... mold, 75 ... contact lens, 76 ... jig, work W.

Claims (8)

A table mounted on a base so as to be linearly driven in a first axis, a second axis direction perpendicular to each other in a movement plane, and a third axis direction perpendicular to the movement plane; and A first rotating body supported rotatably about a fourth axis parallel to the two axes, and a second rotating body supported rotatably about a fifth axis perpendicular to the fourth axis by the first rotating body. A stage device including a rotating body;
A holding device that is mounted on the second rotating body of the stage device and holds a workpiece in a plane perpendicular to the fifth axis;
A positioning camera provided on the base for photographing the workpiece held by the holding device in order to detect a displacement of the workpiece with respect to the holding device;
An energy beam irradiating device for irradiating an energy beam to a workpiece mounted on the base and held by the holding device; and
Control data for performing an irradiation operation on the workpiece by the energy irradiation device is input from the input device, and the stage device is moved so that the workpiece held on the holding device faces the positioning camera and the energy beam irradiation device. A control device to be operated;
The processing apparatus by energy ray irradiation characterized by the above-mentioned. In Claim 1, The workpiece surface defined point detection apparatus for acquiring the positional information on the defined point of the workpiece surface provided in the base and held by the holding device, and the workpiece surface held by the holding device to the workpiece surface A processing apparatus using energy beam irradiation, characterized in that at least one of a surface photographing camera for photographing a surface of the workpiece is provided on the base in order to acquire information related to processing by the energy beam irradiation apparatus. In Claim 2, At least one of the said workpiece surface defined point detection apparatus and the said surface imaging | photography camera, the said positioning camera, and the said energy beam irradiation apparatus are arrange | positioned by the said 1st axial direction at the said base. The processing apparatus by energy ray irradiation characterized by the above-mentioned. The processing apparatus using energy beam irradiation according to any one of claims 1 to 3, wherein the energy beam irradiation apparatus is a plasma irradiation apparatus. 5. The energy beam irradiation according to claim 4, wherein the holding device holds the workpiece in an electrically insulated state, and allows a bias voltage to be applied between the workpiece and an electrode of the plasma irradiation device. Processing equipment. In Claim 4 or 5, the stage device, the plasma irradiation device, the positioning camera, at least one of the workpiece surface definition point detection device and the surface photographing camera is housed in an airtight cover, The processing apparatus using energy beam irradiation, wherein the inside of the cover is connected to an exhaust processing apparatus by a pipe connected to a bottom portion of a hood that covers a plasma generating nozzle of the plasma irradiation apparatus. A table mounted on a base so as to be linearly driven in a first axis, a second axis direction perpendicular to each other in a movement plane, and a third axis direction perpendicular to the movement plane; and A first rotating body supported rotatably about a fourth axis parallel to the two axes, and a second rotating body supported rotatably about a fifth axis perpendicular to the fourth axis by the first rotating body. A stage device including a rotating body;
A holding device that is mounted on the second rotating body of the stage device and holds a workpiece in a plane perpendicular to the fifth axis;
A positioning camera that is provided on the base and photographs the workpiece held by the holding device in order to detect displacement of the workpiece with respect to the holding device;
A surface photographing camera that photographs the surface of the workpiece in order to acquire information related to processing by the energy beam irradiation device on the workpiece surface that is provided on the base and is held by the holding device;
An energy beam irradiating device that performs processing by irradiating an energy beam to a workpiece mounted on the base and held by the holding device;
A determination step for determining whether or not re-irradiation is necessary based on information obtained by processing image information captured by the front-side camera;
Parameter selection step of selecting an appropriate parameter consisting of the position and area of the re-irradiation part, the relative speed of the re-irradiation part with respect to the energy beam, the irradiation intensity of the energy beam, and the irradiation amount when it is determined that re-irradiation is necessary When,
Re-irradiation step of performing energy beam irradiation based on the appropriate parameter,
The processing method using energy beam irradiation, wherein the determination step, the parameter selection step, and the re-irradiation step are repeated until it is determined that re-irradiation is unnecessary in the determination step. In Claim 7, as a result of repeating the determination operation, the parameter selection step, and the re-irradiation step a predetermined number of times set according to the surface property of the workpiece, the irradiation effect does not appear If the determination step determines, the method includes the step of stopping the repetitive operation and stopping the error, and the processing method using energy beam irradiation.

Images