JP2008130815A - Capillary member, wire bonding apparatus, and wire bonding method - Google Patents

Capillary member, wire bonding apparatus, and wire bonding method Download PDF

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JP2008130815A
JP2008130815A JP2006314263A JP2006314263A JP2008130815A JP 2008130815 A JP2008130815 A JP 2008130815A JP 2006314263 A JP2006314263 A JP 2006314263A JP 2006314263 A JP2006314263 A JP 2006314263A JP 2008130815 A JP2008130815 A JP 2008130815A
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capillary
frame
bonding
wire
ball
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Yukifumi Masuda
享史 増田
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Toshiba Corp
Toshiba Electronic Device Solutions Corp
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Toshiba Corp
Toshiba Microelectronics Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a capillary member that increases a bonded area at the time of ball-bonding. <P>SOLUTION: The capillary member includes: a capillary 21 formed in a square-pole shape substantially axisymmetric in the axis that penetrates the upper surface and the bottom surface, the capillary 21 having an insertion hole 22 through which a bonding wire 31 passes to the bottom surface; a capillary frame 24 that has a through hole 25 for passing the capillary 21 therethrough in a nested way; and a frame driving mechanism 27 that can drive the bottom surface of the capillary frame 24 in the direction for taking in and out the bottom surface thereof on the boundary of the bottom surface of the capillary 21, wherein the frame driving mechanism 27 is fixed with the capillary frame 24. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、ワイヤボンディング装置、ワイヤボンディング装置のキャピラリ部材、及び、ワイヤボンディング方法に関する。   The present invention relates to a wire bonding apparatus, a capillary member of the wire bonding apparatus, and a wire bonding method.

半導体装置の製造において、ワイヤボンディング技術が使用されてきた。ワイヤボンディング法は、例えば、半導体チップに設けられた外部接続用の電極パッドにワイヤ先端に形成されたボールを押し付けて接合（ボールボンド）し、繰り出されたワイヤ線をリード上で押しつぶして接合（スティッチボンド）して、接続に関与しないワイヤ線を切断することによって、電極パッドとリード（外部接続端子）とをボンディングワイヤを介して接続する方法である。   Wire bonding technology has been used in the manufacture of semiconductor devices. In the wire bonding method, for example, a ball formed at the tip of a wire is pressed against an electrode pad for external connection provided on a semiconductor chip to bond (ball bond), and the drawn wire wire is crushed on a lead to be bonded ( This is a method of connecting the electrode pad and the lead (external connection terminal) via a bonding wire by cutting a wire line not involved in the connection by stitch bonding.

近年、集積回路を有する半導体装置は、高集積化および小型化等の要請に対応して、接続すべき電極パッドの密度が飛躍的に増大しつつある。これに伴って、ボンディングワイヤの間隔及び線径は微細化されつつあり、電極パッド及びリード等の接合部の面積は狭小化している。   In recent years, the density of electrode pads to be connected to a semiconductor device having an integrated circuit has been dramatically increased in response to demands for high integration and miniaturization. Along with this, the spacing and the wire diameter of the bonding wires are being miniaturized, and the area of the joint portion such as the electrode pad and the lead is narrowed.

ボンディングを実行する場合、接合部の面積が比較的大きく、ボンディングワイヤの線径も比較的大きいと、一定の接合強度が得られるが、ボンディングワイヤが微細化すると、接合部の面積が小さくなり接合強度が低下し、接合部での接続不良を起こし易くなるという課題があった。   When bonding is performed, if the bonding area is relatively large and the bonding wire diameter is relatively large, a certain bonding strength can be obtained. However, if the bonding wire is miniaturized, the bonding area is reduced and bonding is performed. There existed a subject that intensity | strength fell and it became easy to raise | generate the connection failure in a junction part.

そこで、例えば、ワイヤボンディング用キャピラリが、その先端に、被接続部におけるワイヤ接合部の接合面積を結線方向に増加可能な押し潰し手段、すなわち、スライド可能な押圧部材を備える技術が開示されている（例えば、特許文献１参照。）。   Therefore, for example, a technique is disclosed in which a wire bonding capillary is provided with crushing means, that is, a slidable pressing member, that can increase the bonding area of the wire bonding portion in the connected portion in the connecting direction at the tip thereof. (For example, refer to Patent Document 1).

しかしながら、この開示されたワイヤボンディング技術では、スティッチボンド（第２接続）時の第２接合部を結線方向に延ばした形状として、接合面積を増加することができるが、ボールボンド（第１接続）時の接合面積を増加させることは難しいという問題がある。
特開２００２−１６４３７７号公報（第３頁、図４、図５） However, in this disclosed wire bonding technique, the bonding area can be increased by extending the second bonding portion in the stitching direction (second connection) in the connection direction, but the ball bond (first connection) There is a problem that it is difficult to increase the bonding area.
JP 2002-164377 A (page 3, FIG. 4, FIG. 5)

本発明は、ボールボンド時の接合面積を増加させるキャピラリ部材、ワイヤボンディング装置、及びワイヤボンディング方法を提供することを目的とする。   It is an object of the present invention to provide a capillary member, a wire bonding apparatus, and a wire bonding method that increase the bonding area during ball bonding.

本発明の一態様のキャピラリ部材は、上面及び底面を通る軸に実質的に軸対称な４角柱をなし、ワイヤを挿通するワイヤ挿通孔が、前記底面に通じているキャピラリと、前記キャピラリを入れ子式に挿通する貫通孔を有するキャピラリ枠体とを備えていることを特徴とする。   A capillary member according to one aspect of the present invention is a quadrangular prism that is substantially axisymmetric with respect to an axis passing through an upper surface and a bottom surface, a wire insertion hole through which a wire passes is connected to the bottom surface, and the capillary is nested And a capillary frame having a through-hole inserted into the equation.

また、本発明の別態様のキャピラリ部材は、上面及び底面を通る軸に実質的に軸対称な４角柱をなし、ワイヤを挿通するワイヤ挿通孔が、前記底面に通じているキャピラリと、前記キャピラリを入れ子式に挿通する貫通孔を有するキャピラリ枠体と、前記キャピラリ枠体と固定され、前記キャピラリ枠体の底面を、前記キャピラリの底面を境に、出し入れ方向に駆動できる枠体駆動機構とを備えていることを特徴とする。   According to another aspect of the present invention, there is provided a capillary member having a quadrangular prism that is substantially axisymmetric with respect to an axis passing through the top surface and the bottom surface, and a capillary through which a wire insertion hole for inserting a wire communicates with the bottom surface; A capillary frame body having a through-hole that is inserted in a telescopic manner, and a frame body driving mechanism that is fixed to the capillary frame body and that can drive the bottom surface of the capillary frame body in the insertion / removal direction with the bottom surface of the capillary as a boundary. It is characterized by having.

また、本発明の別態様のワイヤボンディング装置は、ボンディングアームと、前記ボンディングアームに上面側が固定され、前記上面及び底面を通る軸に実質的に対称な４角柱をなし、ワイヤを挿通するワイヤ挿通孔が、前記底面に通じているキャピラリと、前記ボンディングアームに固定され、前記キャピラリの軸に沿って前進後退運動を発生可能な枠体駆動機構と、前記枠体駆動機構に接続され、前記キャピラリを入れ子式に挿通可能とする貫通孔を有し、前記キャピラリの底面に対して、出し入れ可能に設置されたキャピラリ枠体とを備えていることを特徴とする。   According to another aspect of the present invention, there is provided a wire bonding apparatus including a bonding arm and a quadrilateral column whose upper surface is fixed to the bonding arm and substantially symmetric with respect to an axis passing through the upper surface and the bottom surface. A capillary connected to the bottom surface, a frame fixed to the bonding arm, capable of generating a forward and backward movement along the capillary axis, and connected to the frame driving mechanism; And a capillary frame which is installed so as to be able to be inserted and removed from the bottom surface of the capillary.

また、本発明の別態様のワイヤボンディング方法は、キャピラリの先端部に、ボンディングワイヤの先端に形成されたボールを配設する工程と、前記ボールを前記キャピラリと共に、被接続物であるパッド上に降下させる工程と、キャピラリ枠体を前記キャピラリに沿って、前記キャピラリ枠体の底面を、前記ボールのつぶれ高さ相当分だけ前記キャピラリの先端部から降下させる工程と、前記キャピラリの軸に沿って圧力、並びに、熱及び超音波の内の少なくともいずれか１つを加えて、前記ボールを、潰しながら、前記パッドに接合させる工程と、前記キャピラリ枠体を上昇させる工程と、前記キャピラリを上昇させる工程とを備えていることを特徴とする。   The wire bonding method according to another aspect of the present invention includes a step of disposing a ball formed at a tip of a bonding wire at a tip of a capillary, and the ball together with the capillary on a pad as an object to be connected. Lowering the capillary frame along the capillary, lowering the bottom surface of the capillary frame from the tip of the capillary by an amount corresponding to the collapse height of the ball, and along the capillary axis Applying at least one of pressure, heat, and ultrasonic waves to squeeze the ball into the pad while being crushed, raising the capillary frame, and raising the capillary And a process.

本発明によれば、第１接続時の接合面積を増加させるキャピラリ部材、ワイヤボンディング装置、及びワイヤボンディング方法を提供すことが可能である。   According to the present invention, it is possible to provide a capillary member, a wire bonding apparatus, and a wire bonding method that increase the bonding area during the first connection.

以下、本発明の実施例について、図面を参照しながら説明する。各図では、同一の構成要素には同一の符号を付す。   Embodiments of the present invention will be described below with reference to the drawings. In each figure, the same components are denoted by the same reference numerals.

本発明の実施例１を、図１乃至図４を参照しながら説明する。図１はキャピラリ部材及びその周辺部の構造を比較的詳しく示すワイヤボンディング装置の模式的な正面図である。図２はキャピラリ部材を模式的に示す図で、図２（ａ）はキャピラリ部材の一部を切り欠いて示す正面図、図２（ｂ）はキャピラリ部材を下方から見た平面図である。図３はキャピラリ部材を使用してワイヤボンディングを行う方法を、工程順に、キャピラリ部材の一部を切り欠いて示す模式的な正面図である。図４は本実施例による接合部の形状を従来の接合部の形状と比較して示す模式図である。   A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a schematic front view of a wire bonding apparatus showing the structure of a capillary member and its peripheral part in a relatively detailed manner. 2A and 2B are diagrams schematically showing the capillary member. FIG. 2A is a front view of the capillary member with a part cut away, and FIG. 2B is a plan view of the capillary member as viewed from below. FIG. 3 is a schematic front view showing a method of performing wire bonding using a capillary member by cutting away a part of the capillary member in the order of steps. FIG. 4 is a schematic view showing the shape of the joint according to this embodiment in comparison with the shape of a conventional joint.

まず、図１に示すように、ボンディング装置１は、架台６、架台６の上の側部に、水平面内において移動自在なＸ−Ｙステージ７、Ｘ−Ｙステージ７の上に、ボンディングヘッド部８が配置されている。ボンディングヘッド部８は、遥動自在に軸支されたボンディングアーム１７を有している。ボンディングアーム１７のボンディングヘッド部８に対する端部には、キャピラリ部材２０が固定されている。また、ボンディング装置１は、キャピラリ部材２０の下方に、ボンディングステージ１１を有している。   First, as shown in FIG. 1, the bonding apparatus 1 includes a gantry 6, a side on the gantry 6, an XY stage 7 that is movable in a horizontal plane, an XY stage 7, and a bonding head unit. 8 is arranged. The bonding head portion 8 has a bonding arm 17 that is pivotally supported so as to be freely slidable. A capillary member 20 is fixed to an end portion of the bonding arm 17 with respect to the bonding head portion 8. The bonding apparatus 1 has a bonding stage 11 below the capillary member 20.

キャピラリ部材２０は、ボンディングワイヤ３１を挿通する挿通孔を有するキャピラリ２１と、キャピラリ２１の外側にあって、入れ子式に、キャピラリ２１の下端部に対して底面が出し入れ可能に設置されたキャピラリ枠体２４と、キャピラリ枠体２４の側面に固定された駆動アーム２８を、キャピラリ２１の下端部を境に、上下の出し入れ方向に駆動する枠体駆動機構２７とを備えた構成である。キャピラリ部材２０の上側のキャピラリ２１上端部及び枠体駆動機構２７は、ボンディングアーム１７の先端部に固定されている。   The capillary member 20 includes a capillary 21 having an insertion hole through which the bonding wire 31 is inserted, and a capillary frame outside the capillary 21 and installed in a nesting manner so that the bottom surface can be inserted into and removed from the lower end of the capillary 21. 24 and a frame drive mechanism 27 that drives the drive arm 28 fixed to the side surface of the capillary frame 24 in the up and down direction with the lower end of the capillary 21 as a boundary. The upper end portion of the capillary 21 on the upper side of the capillary member 20 and the frame body driving mechanism 27 are fixed to the distal end portion of the bonding arm 17.

ボンディングの対象となる半導体チップ１２は、リードフレーム１４にマウントされて、ボンディングステージ１１上に配設される。ボンディングステージ１１は、半導体チップ１２及びリードフレーム１４等を加熱する加熱装置（図示略）を有している。キャピラリ２１の下端部は、被接続物である半導体チップ１２のほぼ正方形をなす電極のパッド１３及びリードフレーム１４等の上方に固定位置を有し、上下方向及び水平面内で移動可能なボンディングアーム１７の動きに従って、キャピラリ２１を介してボール３３及びボンディングワイヤ３１を押圧し、被接続物間を移動することが可能である。   The semiconductor chip 12 to be bonded is mounted on the lead frame 14 and disposed on the bonding stage 11. The bonding stage 11 has a heating device (not shown) for heating the semiconductor chip 12, the lead frame 14, and the like. The lower end portion of the capillary 21 has a fixed position above the pad 13 and the lead frame 14 of the substantially square electrode of the semiconductor chip 12 that is an object to be connected, and the bonding arm 17 is movable in the vertical direction and in the horizontal plane. It is possible to move between the connected objects by pressing the ball 33 and the bonding wire 31 through the capillary 21 in accordance with the movement of.

なお、ボンディング装置１は、図示を省略するが、キャピラリ部材２０及びボンディングステージ１１の近傍に、ボンディングワイヤ３１のボール３３を形成するための電気トーチ、ボール３３の反対側でボンディングワイヤ３１をクランプするワイヤクランパ等が配置され、ボンディングアーム１７、キャピラリ２１、枠体駆動機構２７、電気トーチ、及びワイヤクランパ等は、ボンディング装置の制御装置に接続され、同期をとって駆動される。また、ボンディング装置１は、超音波を発生する機構（図示略）を有しており、制御装置に制御されて、キャピラリ部材２０を介して、超音波エネルギーをボール３３に伝えることが可能である。   Although not shown, the bonding apparatus 1 clamps the bonding wire 31 on the opposite side of the ball 33 and an electric torch for forming the ball 33 of the bonding wire 31 in the vicinity of the capillary member 20 and the bonding stage 11. A wire clamper or the like is disposed, and the bonding arm 17, the capillary 21, the frame drive mechanism 27, the electric torch, the wire clamper, and the like are connected to a control device of the bonding apparatus and driven in synchronization. Further, the bonding apparatus 1 has a mechanism (not shown) that generates ultrasonic waves, and can transmit ultrasonic energy to the balls 33 through the capillary member 20 under the control of the control device. .

図２に示すように、キャピラリ部材２０を構成するキャピラリ２１は、上面及び底面を通る軸に対称な４角柱をなし、ボンディングワイヤ３１を挿通する断面が円形の挿通孔２２が軸に沿って形成されている。上面及び底面の４角形は、正方形または面取りがなされたほぼ正方形をなしている。キャピラリ２１の底面部２３は、軸を中心に挿通孔２２の円形の開口があり、挿通孔２２周囲は、底面側に向かって開いたテーパが付けられ、テーパの周囲は軸にほぼ垂直な平面をなしている。キャピラリ２１は、例えば、セラミックで形成されているが、タングステンカーバイド等を使用することが可能である。また、キャピラリ２１は、底面部２３側が４角柱をなし、上部のボンディングアーム１７側は、他の形状、例えば、円柱であっても差し支えない。   As shown in FIG. 2, the capillary 21 constituting the capillary member 20 has a quadrangular prism symmetrical to an axis passing through the upper surface and the bottom surface, and an insertion hole 22 having a circular cross section through which the bonding wire 31 is inserted is formed along the axis. Has been. The quadrilaterals of the top surface and the bottom surface are square or chamfered almost square. The bottom surface portion 23 of the capillary 21 has a circular opening of an insertion hole 22 around the axis, and the periphery of the insertion hole 22 is tapered toward the bottom surface, and the periphery of the taper is a plane substantially perpendicular to the axis. I am doing. The capillary 21 is made of ceramic, for example, but tungsten carbide or the like can be used. Further, the capillary 21 may have a quadrangular prism on the bottom surface 23 side, and the upper bonding arm 17 side may have another shape, for example, a cylinder.

キャピラリ枠体２４は、キャピラリ２１の外側にあって、４角柱のキャピラリ２１の側面に対向する貫通孔２５をなす矩形の面が内側をなし、外側が４角柱をなしている。貫通孔２５は、キャピラリ２１をスムーズに通すことが可能な寸法に作製されている。キャピラリ枠体２４は、軸方向に、キャピラリ２１より短く、底面をキャピラリ２１の底面部２３より上方に配置可能であり、そのとき、上面をボンディングアーム１７の下側に配置可能である。キャピラリ枠体２４の底面は、ほぼ平面である。キャピラリ枠体２４は、例えば、セラミックで形成されているが、タングステンカーバイド、ステンレススチール等を使用することが可能である。   The capillary frame 24 is outside the capillary 21, and a rectangular surface forming a through-hole 25 facing the side surface of the quadrangular prism capillary 21 is on the inside, and the outside is a quadrangular column. The through hole 25 is formed to have a size that allows the capillary 21 to pass smoothly. The capillary frame 24 is shorter than the capillary 21 in the axial direction, and the bottom surface can be disposed above the bottom surface portion 23 of the capillary 21. At that time, the top surface can be disposed below the bonding arm 17. The bottom surface of the capillary frame 24 is substantially flat. The capillary frame 24 is made of, for example, ceramic, but tungsten carbide, stainless steel, or the like can be used.

駆動アーム２８は、一端をキャピラリ枠体２４の側面に固定され、他端を、図１に示すように、枠体駆動機構２７に接続されている。枠体駆動機構２７は、電気を供給されて、キャピラリ枠体２４を上下に動かすことができる機構を有している。図示を省略するが、例えば、圧電素子に駆動摩擦部材を取り付け、駆動摩擦部材に移動体を摩擦保持して、圧電素子の動きで、キャピラリ枠体２４が接続された移動体を駆動摩擦部材に沿って動かす機構でもよいし、また、小型の電磁アクチュエータを使用し、キャピラリ枠体２４を直進運動させる機構等でもよい。駆動アーム２８は、キャピラリ枠体２４と一体的に形成されてもよいし、別々に形成後、キャピラリ枠体２４に固定されてもよい。   One end of the drive arm 28 is fixed to the side surface of the capillary frame 24, and the other end is connected to the frame drive mechanism 27 as shown in FIG. 1. The frame drive mechanism 27 is supplied with electricity and has a mechanism that can move the capillary frame 24 up and down. Although illustration is omitted, for example, a driving friction member is attached to the piezoelectric element, the moving body is frictionally held on the driving friction member, and the moving body to which the capillary frame 24 is connected by the movement of the piezoelectric element is used as the driving friction member. It may be a mechanism that moves along, or may be a mechanism that uses a small electromagnetic actuator to move the capillary frame 24 in a straight line. The drive arm 28 may be formed integrally with the capillary frame 24, or may be fixed to the capillary frame 24 after being formed separately.

次に、キャピラリ部材２０を使用して、ボンディングを行う方法を説明する。図３（ａ）に示すように、加熱された半導体チップ１２のパッド１３の直上に、ほぼ球形のボール３３が形成されたボンディングワイヤ３１を有するキャピラリ部材２０が固定される。例えば、パッド１３は、１辺が約８０μｍである。ボンディングワイヤ３１は、直径が約２５μｍ、金または金を主成分とする合金である。   Next, a method for bonding using the capillary member 20 will be described. As shown in FIG. 3A, a capillary member 20 having a bonding wire 31 on which a substantially spherical ball 33 is formed is fixed immediately above the pad 13 of the heated semiconductor chip 12. For example, the pad 13 has a side of about 80 μm. The bonding wire 31 is about 25 μm in diameter and is gold or an alloy containing gold as a main component.

図３（ｂ）に示すように、キャピラリ部材２０を下げて、ボール３３がパッド１３にほぼ接する位置に置く。   As shown in FIG. 3B, the capillary member 20 is lowered and placed at a position where the ball 33 is substantially in contact with the pad 13.

図３（ｃ）に示すように、ボール３３がパッド１３に接合された直後の底面部２３とパッド１３との間隔に相当する距離だけ、底面部２３からキャピラリ枠体２４の底面を下げる。なお、キャピラリ２１に対するキャピラリ枠体２４の下降は、キャピラリ部材２０の下降より前に行っておくことが可能である。   As shown in FIG. 3C, the bottom surface of the capillary frame body 24 is lowered from the bottom surface portion 23 by a distance corresponding to the distance between the bottom surface portion 23 and the pad 13 immediately after the ball 33 is joined to the pad 13. Note that the lowering of the capillary frame 24 with respect to the capillary 21 can be performed before the lowering of the capillary member 20.

図３（ｄ）に示すように、底面部２３がボール３３を押圧するように、キャピラリ部材２０に圧力を加える。ここで、圧力と共に、超音波振動を印加してもよいし、圧力と共に、熱を加えても、超音波振動と熱を加えてもよい。押圧されたボール３３は、厚さ（または、高さ）を薄くしながら、パッド１３に平行な方向に広がり、底面部２３、キャピラリ枠体２４、及びパッド１３で形成される空間をほとんど埋める圧接体３３ａとなる。なお、キャピラリ枠体２４がパッド１３から一定の反作用を受けた場合、枠体駆動機構２７の駆動アーム２８を固定する力を緩めることは差し支えない。   As shown in FIG. 3D, pressure is applied to the capillary member 20 so that the bottom surface portion 23 presses the ball 33. Here, ultrasonic vibration may be applied together with pressure, heat may be applied together with pressure, or ultrasonic vibration and heat may be applied. The pressed ball 33 spreads in the direction parallel to the pad 13 while reducing the thickness (or height), and press-contacts almost filling the space formed by the bottom surface portion 23, the capillary frame body 24, and the pad 13. It becomes the body 33a. When the capillary frame 24 receives a certain reaction from the pad 13, the force for fixing the drive arm 28 of the frame drive mechanism 27 may be loosened.

図３（ｅ）に示すように、一定位置まで押圧された圧接体３３ａがパッド１３上に形成され、すなわち、一定時間経過後、まず、キャピラリ枠体２４の底面がキャピラリ２１の底面部２３より上部になるように移動され、次に、キャピラリ２１を上方向に移動する。その結果、パッド１３に接合された圧接体３３ａを有するボンディングワイヤ３１が形成されて、第１接続が完成する。以降、リードフレーム１４へのスティッチボンド（第２接続）は、周知のボンディング装置と同様に実行可能である。   As shown in FIG. 3 (e), the press contact body 33 a pressed to a certain position is formed on the pad 13, that is, after a certain time has elapsed, the bottom surface of the capillary frame 24 is first formed from the bottom surface portion 23 of the capillary 21. The capillary 21 is moved upward, and then the capillary 21 is moved upward. As a result, the bonding wire 31 having the press contact body 33a bonded to the pad 13 is formed, and the first connection is completed. Thereafter, stitch bonding (second connection) to the lead frame 14 can be performed in the same manner as a known bonding apparatus.

図４（ａ）に示すように、圧接体３３ａは、キャピラリ枠体２４の貫通孔２５に外形が規定された正方形、または、４隅が面取りされたような正方形をなす。ボール３３とパッド１３との接合形状もこの正方形に近い形状をなす。まず、第１の比較のために、同じ形状のパッド１３に対する接合を、パッド１３端からの距離が一定値を越えないように、キャピラリ枠体２４のない状態で形成した圧接体５３は、図４（ｂ）に示すように、底面部２３にほぼ内接する円形となる。同じボール３３を使用すると、圧接体５３の厚さは、４隅に広がらない分だけ圧接体３３ａより少し高くなる。次に、第２の比較例は、キャピラリの底面部を底面部２３にほぼ内接する円形として試みたが、第１の比較例と同様の大きさのほぼ円形の圧接体となる。そして、これらの接合部の形状も圧接体５３に近い円形となる。   As shown in FIG. 4A, the press contact body 33 a has a square shape whose outer shape is defined in the through hole 25 of the capillary frame body 24 or a square shape whose four corners are chamfered. The bonding shape of the ball 33 and the pad 13 is also a shape close to this square. First, for the first comparison, the press contact body 53 formed without the capillary frame 24 so that the distance from the end of the pad 13 does not exceed a fixed value is bonded to the pad 13 having the same shape. As shown in FIG. 4 (b), the shape is a circle that is substantially inscribed in the bottom surface portion 23. When the same ball 33 is used, the thickness of the press contact body 53 is slightly higher than that of the press contact body 33a by the amount not spread in the four corners. Next, in the second comparative example, an attempt was made to make the bottom surface portion of the capillary as a circular shape that is substantially inscribed in the bottom surface portion 23, but a substantially circular pressure contact body having the same size as the first comparative example is obtained. And the shape of these joint parts also becomes a circle close to the press contact body 53.

上述したように、本実施例のキャピラリ部材２０は、キャピラリ２１と、キャピラリ２１の外側にあって、キャピラリ２１の下端部に対して底面が出し入れ可能に設置されたキャピラリ枠体２４と、キャピラリ枠体２４の側面に固定された駆動アーム２８を、キャピラリ２１の下端部を境に、上下の出し入れ方向に駆動する枠体駆動機構２７とを備えて、ボール３３を押圧するときに、底面部２３、キャピラリ枠体２４、及びパッド１３で外形の広がりを規定して、ボール３３とパッド１３とを接合する。   As described above, the capillary member 20 of the present embodiment includes the capillary 21, the capillary frame 24 that is located outside the capillary 21, and the bottom surface of the capillary 21 can be inserted into and removed from the lower end of the capillary 21. When the ball 33 is pressed when the ball 33 is pressed, the drive arm 28 fixed to the side surface of the body 24 is provided with a frame drive mechanism 27 for driving the drive arm 28 in the up and down direction with the lower end of the capillary 21 as a boundary. Then, the expansion of the outer shape is defined by the capillary frame 24 and the pad 13, and the ball 33 and the pad 13 are joined.

その結果、パッド１３に対して、平面的にはほぼ正方形の圧接体３３ａが形成され、接合部も、ほぼ同様な正方形となる。比較例では、圧接体５３はほぼ円形となり、接合部も同様なほぼ円形となる。つまり、本実施例の圧接体３３ａの接合面積は、比較例の圧接体５３の接合面積より約２５％増加する。接合面積の増加は、接合したボンディングワイヤの引っ張り試験の比較において、接合強度の増大を確認できる。   As a result, a substantially square pressure contact body 33a is formed on the pad 13 in a plan view, and the joint portion has a substantially similar square shape. In the comparative example, the press contact body 53 is substantially circular, and the joint portion is also substantially circular. That is, the bonding area of the pressure contact body 33a of the present embodiment is increased by about 25% from the bonding area of the pressure contact body 53 of the comparative example. The increase in the bonding area can be confirmed by the increase in the bonding strength in the comparison of the tensile test of the bonded bonding wires.

本実施例のキャピラリ部材２０を使用した半導体装置は、同じパッド面積において、接合強度をより大きくできるので、接合部における剥離等の接合不良を起こす頻度を抑制することが可能となる。また、同じ接合強度を目指す場合、パッド面積を縮小できるので、半導体装置の小型化が可能となる。また、圧接体３３ａは、キャピラリ枠体２４に規定されるので、はみ出す頻度が減少し、その結果、隣接のパッド及び圧接体に接触する不良等を減少させることが可能となる。   Since the semiconductor device using the capillary member 20 of the present embodiment can increase the bonding strength in the same pad area, it is possible to suppress the frequency of occurrence of bonding failure such as peeling at the bonding portion. Further, when aiming at the same bonding strength, the pad area can be reduced, so that the semiconductor device can be miniaturized. Further, since the pressure contact body 33a is defined by the capillary frame 24, the frequency of protrusion is reduced, and as a result, it is possible to reduce defects that come into contact with adjacent pads and pressure contact bodies.

上記実施例１の変形例を説明する。図５はキャピラリ部材を模式的に示す図で、図５（ａ）はキャピラリ部材の一部を切り欠いて示す正面図、図５（ｂ）はキャピラリ部材を下方から見た平面図である。上記実施例１とは、キャピラリの底面側の先端の形状が異なっている。上記実施例１と同じ構成要素については、説明を省略する。   A modification of the first embodiment will be described. 5A and 5B are diagrams schematically showing the capillary member. FIG. 5A is a front view showing a portion of the capillary member cut away, and FIG. 5B is a plan view of the capillary member as viewed from below. The shape of the tip on the bottom side of the capillary is different from that of the first embodiment. The description of the same components as those in the first embodiment is omitted.

図５に示すように、キャピラリ部材６０を構成するキャピラリ６１は、実施例１のキャピラリ２１の底面部２３の形状を除いて、ほとんど同様である。キャピラリ６１の底面部６３は、軸を中心に挿通孔２２の円形の開口があり、挿通孔２２周囲は、底面側に向かって開いた第１テーパ部６３ａがあり、第１テーパ部６３ａの周囲は底面側に向かって開いた第２テーパ部６３ｂがある。第２テーパ部６３ｂは、第１テーパ部６３ａに比較して、緩やかな傾斜（水平面に対して小さい角度）をなしている。キャピラリ６１を底面側から見ると、第２テーパ部６３ｂのそれぞれの合わせ目が直線になっている。   As shown in FIG. 5, the capillaries 61 constituting the capillary member 60 are almost the same except for the shape of the bottom surface portion 23 of the capillary 21 of the first embodiment. The bottom surface portion 63 of the capillary 61 has a circular opening of the insertion hole 22 around the axis, and the periphery of the insertion hole 22 includes a first taper portion 63a that opens toward the bottom surface side, and the periphery of the first taper portion 63a. Has a second tapered portion 63b that opens toward the bottom surface. The second taper portion 63b has a gentle slope (small angle with respect to the horizontal plane) as compared to the first taper portion 63a. When the capillary 61 is viewed from the bottom side, each joint of the second taper portion 63b is a straight line.

キャピラリ６１を使用したボンディング方法は、実施例１のキャピラリ２１を使用したボンディング方法と同様である。その結果、ボール３３が押圧された圧接体は、上部周辺部にキャピラリ６１の底面部６３の形状を反映している。その他は実施例１と同様に、パッドに接合された圧接体を有するボンディングワイヤ３１が形成されて、第１接続が完成する。   The bonding method using the capillary 61 is the same as the bonding method using the capillary 21 of the first embodiment. As a result, the pressure contact body on which the ball 33 is pressed reflects the shape of the bottom surface portion 63 of the capillary 61 in the upper peripheral portion. Other than the first embodiment, the bonding wire 31 having the press contact body bonded to the pad is formed, and the first connection is completed.

上述したように、底面側に向かって開いた第１テーパ部６３ａ及び第１テーパ部６３ａの周囲は底面側に向かって開いた第２テーパ部６３ｂを有する底面部６３を備えたキャピラリ６１を使用することにより、ボール３３は、第２テーパ部６３ｂに垂直な方向に押圧される。その結果、キャピラリ枠体２４に接触する境界の少し内側から中心部にかけて、パッドに接合される実質的な部分をより効率よく押すことができ、強い接合が可能となる。その他には、実施例１の効果と同様な効果を有している。   As described above, the capillary 61 including the first taper portion 63a that opens toward the bottom surface side and the bottom surface portion 63 that has the second taper portion 63b that opens toward the bottom surface side is used around the first taper portion 63a. As a result, the ball 33 is pressed in a direction perpendicular to the second tapered portion 63b. As a result, a substantial portion bonded to the pad can be pushed more efficiently from a little inside to the center of the boundary contacting the capillary frame 24, and strong bonding is possible. In addition, it has the same effect as that of the first embodiment.

本発明の実施例２を、図６を参照しながら説明する。図６はキャピラリ部材を模式的に示す図で、図６（ａ）はキャピラリ部材の一部を切り欠いて示す正面図、図６（ｂ）は、図６（ａ）に示すキャピラリ部材の先端部を拡大して示す断面図、図６（ｃ）はキャピラリ部材の先端部を下方から見た平面図である。上記実施例１とは、キャピラリ枠体の底面側の先端の形状が異なっている。上記実施例１と同じ構成要素については、説明を省略する。   A second embodiment of the present invention will be described with reference to FIG. 6 is a diagram schematically showing the capillary member, FIG. 6 (a) is a front view showing a part of the capillary member, and FIG. 6 (b) is a front end of the capillary member shown in FIG. 6 (a). FIG. 6C is a plan view of the tip portion of the capillary member as viewed from below. The shape of the tip on the bottom side of the capillary frame is different from that of the first embodiment. The description of the same components as those in the first embodiment is omitted.

図６に示すように、キャピラリ部材７０を構成するキャピラリ枠体７４は、実施例１のキャピラリ枠体２４の先端部の形状を除いて、ほとんど同様である。キャピラリ枠体７４の先端部は、キャピラリ枠体２４と同様な貫通孔２５を先端部の近傍まで有しているが、先端部の近傍において、先端部に向かって、次第に、開口が大きくなるテーパ部７５を備えている。テーパ部７５は、キャピラリ２１の底面部２３からキャピラリ枠体７４の底面を下げてボンディングを実施することになるが、底面部２３から下方に突出した部分に形成される（図３（ｃ）参照）。テーパ部７５の面は、貫通孔２５を形成する面に対して、例えば、約２０度以下の傾きを有している。   As shown in FIG. 6, the capillary frame 74 constituting the capillary member 70 is almost the same except for the shape of the tip of the capillary frame 24 of the first embodiment. The distal end portion of the capillary frame 74 has a through-hole 25 similar to that of the capillary frame 24 to the vicinity of the distal end portion, but in the vicinity of the distal end portion, a taper whose opening gradually increases toward the distal end portion. Part 75 is provided. The taper part 75 is formed by lowering the bottom surface of the capillary frame 74 from the bottom surface part 23 of the capillary 21 to perform bonding, and is formed in a portion protruding downward from the bottom surface part 23 (see FIG. 3C). ). The surface of the taper part 75 has an inclination of, for example, about 20 degrees or less with respect to the surface forming the through hole 25.

キャピラリ枠体７４を使用したボンディング方法は、実施例１のキャピラリ枠体２４を使用したボンディング方法と同様である。その結果、ボール３３が押圧された圧接体は、キャピラリ枠体７４に接する周辺部に、キャピラリ枠体７４のテーパ部７５の形状を反映している。その他は実施例１と同様に、パッドに接合された圧接体を有するボンディングワイヤ３１が形成されて、第１接続が完成する。   The bonding method using the capillary frame 74 is the same as the bonding method using the capillary frame 24 of the first embodiment. As a result, the pressure contact body on which the ball 33 is pressed reflects the shape of the tapered portion 75 of the capillary frame 74 in the peripheral portion in contact with the capillary frame 74. Other than the first embodiment, the bonding wire 31 having the press contact body bonded to the pad is formed, and the first connection is completed.

上述したように、先端部に向かって、次第に、開口が大きくなるテーパ部７５を備えたキャピラリ枠体７４を使用することにより、ボール３３は、底面部２３に垂直な方向に押圧され、キャピラリ枠体７４に接触した圧接体は、上側（ボンディングワイヤ３１の側）に向かって、テーパ部７５を反映して、次第に小さい形状となる。圧接体は、キャピラリ２１、キャピラリ枠体７４、及びパッド１３で形成される空間に一杯に広がっても、キャピラリ枠体７４に対しては、むしろ、押し上げる力が働くので、キャピラリ枠体７４を、上方に引き離すことが容易となる。   As described above, by using the capillary frame body 74 having the taper portion 75 whose opening gradually increases toward the tip portion, the ball 33 is pressed in a direction perpendicular to the bottom surface portion 23, and the capillary frame. The pressure contact body in contact with the body 74 gradually becomes a small shape reflecting the tapered portion 75 toward the upper side (the bonding wire 31 side). Even if the pressure contact body spreads fully in the space formed by the capillary 21, the capillary frame body 74, and the pad 13, rather than pushing up force on the capillary frame body 74, the capillary frame body 74 is It becomes easy to pull upward.

その結果、実施例１のボンディング方法で採られた、まず、キャピラリ枠体２４の底面がキャピラリ２１の底面部２３より上部になるように移動させ、次に、キャピラリ２１を上方向に移動するという手順は必ずしも必要なく、例えば、キャピラリ枠体７４と底面部２３を同時に上方向に移動させることが可能となる。また、キャピラリ枠体７４のテーパ部７５と圧接体との接触抵抗は小さくなるので、キャピラリ枠体７４の上方向に移動時に、圧接体を上方に持ち上げようとする力は小さくなり、周辺部の接合を弱めるということは抑制され、より信頼性の高い半導体装置を作製することが可能となる。その他には、実施例１の効果と同様な効果を有している。   As a result, first, the capillary frame 24 is moved so that the bottom surface of the capillary frame 24 is located above the bottom surface 23 of the capillary 21, and then the capillary 21 is moved upward. The procedure is not necessarily required. For example, the capillary frame 74 and the bottom surface 23 can be simultaneously moved upward. Further, since the contact resistance between the taper portion 75 of the capillary frame 74 and the press contact body becomes small, the force to lift the press contact body upward when moving upward in the capillary frame 74 becomes small, and the peripheral portion Weakness of bonding is suppressed, and a more reliable semiconductor device can be manufactured. In addition, it has the same effect as that of the first embodiment.

なお、本実施例のキャピラリ枠体７４と、実施例１の変形例で示した底面側に向かって開いた第１テーパ部６３ａ及び第１テーパ部６３ａの周囲は底面側に向かって開いた第２テーパ部６３ｂを有する底面部６３を備えたキャピラリ６１とを組み合わせて、新たなキャピラリ部材を構成することは可能である。   Note that the capillary frame 74 of the present embodiment, the first taper portion 63a opened toward the bottom surface shown in the modification of the first embodiment, and the periphery of the first taper portion 63a opened toward the bottom surface side. It is possible to construct a new capillary member by combining with the capillary 61 having the bottom surface portion 63 having the two taper portions 63b.

以上、本発明の実施例を説明したが、本発明は上記実施例に限定されるものではなく、本発明の要旨を逸脱しない範囲内で種々変形して実施することができる。   As mentioned above, although the Example of this invention was described, this invention is not limited to the said Example, It can implement in various deformation | transformation within the range which does not deviate from the summary of this invention.

例えば、実施例では、ほぼ正方形のパッドに接合するために、キャピラリの底面はほぼ正方形である例を示したが、パッドが長方形である場合、キャピラリの底面をパッドの長方形に内接する長方形としてもよい。   For example, in the embodiment, an example in which the bottom surface of the capillary is approximately square in order to bond to a substantially square pad is shown. However, when the pad is rectangular, the bottom surface of the capillary may be a rectangle inscribed in the rectangle of the pad. Good.

また、実施例では、キャピラリは、上面及び底面が４角形をなす４角柱である例を示したが、４角形の４つの角が他の４つの辺より短い辺に置き換えられた８角形をなす８角柱とすることは可能である。また、４角形の４つの角が他の４つの辺より短い曲率を有する辺に置き換えられた柱状とすることは可能である。   In the embodiment, the capillary has an example in which the top surface and the bottom surface are quadrangular prisms having a quadrangular shape. However, the capillary has an octagonal shape in which four corners of the quadrangular shape are replaced with sides shorter than the other four sides. It is possible to use an octagonal column. Further, it is possible to form a columnar shape in which four corners of the quadrangle are replaced with sides having curvatures shorter than those of the other four sides.

本発明は、以下の付記に記載されるような構成が考えられる。
（付記１） 上面及び底面を通る軸に実質的に軸対称な４角柱をなし、ワイヤを挿通するワイヤ挿通孔が、前記底面に通じているキャピラリと、前記キャピラリを入れ子式に挿通する貫通孔を有するキャピラリ枠体とを備えているキャピラリ部材。 The present invention can be configured as described in the following supplementary notes.
(Supplementary Note 1) A quadrangular column that is substantially axisymmetric with respect to an axis passing through the top surface and the bottom surface, and a wire insertion hole through which the wire is inserted communicates with the bottom surface, and a through hole through which the capillary is inserted in a nested manner A capillary member provided with a capillary frame having

（付記２） 前記キャピラリの底面は、前記軸に垂直な面とほぼ平行、及び、前記軸に垂直な面に対して凹部をなす傾斜の内の少なくともいずれか一方を備えている付記１に記載のボンディング部材。 (Supplementary note 2) The supplementary note 1, wherein a bottom surface of the capillary is provided with at least one of an inclination substantially parallel to a surface perpendicular to the axis and a concave portion with respect to a surface perpendicular to the axis. Bonding member.

（付記３） キャピラリの先端部に、ボンディングワイヤの先端に形成されたボールを配設する工程と、前記ボールを前記キャピラリと共に、被接続物であるパッド上に降下させる工程と、キャピラリ枠体を前記キャピラリに沿って、前記キャピラリ枠体の底面を、前記ボールのつぶれ高さ相当分だけ前記キャピラリの先端部から降下させる工程と、前記キャピラリの軸に沿って圧力、並びに、熱及び超音波の内の少なくともいずれか１つを加えて、前記ボールを、潰しながら、前記パッドに接合させる工程と、前記キャピラリ枠体を上昇させる工程と、前記キャピラリを上昇させる工程とを備えているワイヤボンディング方法。 (Additional remark 3) The process of arrange | positioning the ball formed in the front-end | tip of a bonding wire to the front-end | tip part of a capillary, the process of dropping the said ball on the pad which is a to-be-connected object with the said capillary, A step of lowering the bottom surface of the capillary frame along the capillary from the tip of the capillary by an amount corresponding to the collapse height of the ball, pressure along the axis of the capillary, and heat and ultrasonic waves A wire bonding method comprising: adding at least any one of the above and joining the pad while crushing the ball; raising the capillary frame; and raising the capillary .

（付記４） 前記キャピラリ枠体は、前記キャピラリの先端部から降下させた後、上昇させる力を受けた場合、上昇させる力がほぼなくなるまで変位させることが可能である付記３に記載のワイヤボンディング方法。 (Supplementary note 4) The wire bonding according to supplementary note 3, wherein when the capillary frame is lowered from the tip of the capillary and receives a force to be raised, the capillary frame can be displaced until the force to be lifted is almost eliminated. Method.

（付記５） 前記キャピラリ枠体を上昇させる工程と、前記キャピラリを上昇させる工程とを同時に実行する付記３に記載のワイヤボンディング方法。 (Supplementary note 5) The wire bonding method according to supplementary note 3, wherein the step of raising the capillary frame and the step of raising the capillary are performed simultaneously.

本発明の実施例１に係るキャピラリ部材及びその周辺部の構造を比較的詳しく示すワイヤボンディング装置の模式的な正面図。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic front view of a wire bonding apparatus that shows a structure of a capillary member and its peripheral portion according to a first embodiment of the present invention in more detail. 本発明の実施例１に係るキャピラリ部材を模式的に示す図で、図２（ａ）はキャピラリ部材の一部を切り欠いて示す正面図、図２（ｂ）はキャピラリ部材を下方から見た平面図。FIG. 2A is a schematic view of a capillary member according to Embodiment 1 of the present invention, FIG. 2A is a front view showing a part of the capillary member, and FIG. 2B is a view of the capillary member from below. Plan view. 本発明の実施例１に係るキャピラリ部材を使用してワイヤボンディングを行う方法を、工程順に、キャピラリ部材の一部を切り欠いて示す模式的な正面図。The typical front view which shows the method of performing wire bonding using the capillary member which concerns on Example 1 of this invention by notching a part of capillary member in order of a process. 本発明の実施例１に係るキャピラリ部材を使用して形成した接合部の形状を従来の接合部の形状と比較して示す模式図。The schematic diagram which shows the shape of the junction part formed using the capillary member which concerns on Example 1 of this invention compared with the shape of the conventional junction part. 本発明の実施例１の変形例に係るキャピラリ部材を模式的に示す図で、図５（ａ）はキャピラリ部材の一部を切り欠いて示す正面図、図５（ｂ）はキャピラリ部材を下方から見た平面図。FIGS. 5A and 5B are diagrams schematically showing a capillary member according to a modification of the first embodiment of the present invention, FIG. 5A is a front view showing a part of the capillary member, and FIG. FIG. 本発明の実施例２に係るキャピラリ部材を模式的に示す図で、図６（ａ）はキャピラリ部材の一部を切り欠いて示す正面図、図６（ｂ）は、図６（ａ）に示すキャピラリ部材の先端部を拡大して示す断面図、図６（ｃ）はキャピラリ部材の先端部を下方から見た平面図。6A and 6B are diagrams schematically illustrating a capillary member according to a second embodiment of the present invention, in which FIG. 6A is a front view showing a part of the capillary member cut away, and FIG. Sectional drawing which expands and shows the front-end | tip part of the capillary member to show, FIG.6 (c) is the top view which looked at the front-end | tip part of the capillary member from the downward direction.

符号の説明Explanation of symbols

１ ボンディング装置
６ 架台
７ Ｘ−Ｙステージ
８ ボンディングヘッド部
１１ ボンディングステージ
１２ 半導体チップ
１３ パッド
１４ リードフレーム
１７ ボンディングアーム
２０、６０、７０ キャピラリ部材
２１、６１ キャピラリ
２２ 挿通孔
２３、６３ 底面部
２３ａ、７５ テーパ部
２３ｂ 平面部
２４、７４ キャピラリ枠体
２５ 貫通孔
２７ 枠体駆動機構
２８ 駆動アーム
３１ ボンディングワイヤ
３３ ボール
３３ａ、５３ 圧接体
６３ａ 第１テーパ部
６３ｂ 第２テーパ部 DESCRIPTION OF SYMBOLS 1 Bonding apparatus 6 Base 7 XY stage 8 Bonding head part 11 Bonding stage 12 Semiconductor chip 13 Pad 14 Lead frame 17 Bonding arm 20, 60, 70 Capillary member 21, 61 Capillary 22 Insertion hole 23, 63 Bottom part 23a, 75 Tapered portion 23b Planar portion 24, 74 Capillary frame 25 Through hole 27 Frame drive mechanism 28 Drive arm 31 Bonding wire 33 Ball 33a, 53 Press contact body 63a First taper 63b Second taper

Claims (5)

上面及び底面を通る軸に実質的に軸対称な４角柱をなし、ワイヤを挿通するワイヤ挿通孔が、前記底面に通じているキャピラリと、
前記キャピラリを入れ子式に挿通する貫通孔を有するキャピラリ枠体と、
を備えていることを特徴とするキャピラリ部材。 A capillary having a quadrangular prism that is substantially axisymmetric with respect to an axis passing through the top surface and the bottom surface, and a wire insertion hole through which the wire is inserted communicates with the bottom surface;
A capillary frame having a through-hole through which the capillary is nested,
A capillary member comprising: 上面及び底面を通る軸に実質的に軸対称な４角柱をなし、ワイヤを挿通するワイヤ挿通孔が、前記底面に通じているキャピラリと、
前記キャピラリを入れ子式に挿通する貫通孔を有するキャピラリ枠体と、
前記キャピラリ枠体と固定され、前記キャピラリ枠体の底面を、前記キャピラリの底面を境に、出し入れ方向に駆動できる枠体駆動機構と、
を備えていることを特徴とするキャピラリ部材。 A capillary having a quadrangular prism that is substantially axisymmetric with respect to an axis passing through the top surface and the bottom surface, and a wire insertion hole through which the wire is inserted communicates with the bottom surface;
A capillary frame having a through-hole through which the capillary is nested,
A frame body drive mechanism fixed to the capillary frame body and capable of driving the bottom surface of the capillary frame body in the insertion / removal direction with the bottom surface of the capillary as a boundary;
A capillary member comprising: 前記キャピラリ枠体の底面近傍の開口は、内法が一定の形状、及び、内法が底面側に向かって大きくなる形状の内の少なくともいずれか一方を備えていることを特徴とする請求項１または２に記載のボンディング部材。   2. The opening in the vicinity of the bottom surface of the capillary frame has at least one of a shape having a constant inner method and a shape in which the inner method increases toward the bottom surface side. Or the bonding member of 2. ボンディングアームと、
前記ボンディングアームに上面側が固定され、前記上面及び底面を通る軸に実質的に対称な４角柱をなし、ワイヤを挿通するワイヤ挿通孔が、前記底面に通じているキャピラリと、
前記ボンディングアームに固定され、前記キャピラリの軸に沿って前進後退運動を発生可能な枠体駆動機構と、
前記枠体駆動機構に接続され、前記キャピラリを入れ子式に挿通可能とする貫通孔を有し、前記キャピラリの底面に対して、出し入れ可能に設置されたキャピラリ枠体と、
を備えていることを特徴とするワイヤボンディング装置。 A bonding arm,
A capillary having an upper surface fixed to the bonding arm, forming a quadrangular column substantially symmetric with respect to an axis passing through the upper surface and the bottom surface, and a wire insertion hole through which a wire passes to the bottom surface;
A frame drive mechanism fixed to the bonding arm and capable of generating forward and backward movement along the capillary axis;
A capillary frame that is connected to the frame body drive mechanism and has a through hole that allows the capillary to be inserted in a telescopic manner, and is installed so as to be able to be inserted and removed from the bottom surface of the capillary;
A wire bonding apparatus comprising: キャピラリの先端部に、ボンディングワイヤの先端に形成されたボールを配設する工程と、
前記ボールを前記キャピラリと共に、被接続物であるパッド上に降下させる工程と、
キャピラリ枠体を前記キャピラリに沿って、前記キャピラリ枠体の底面を、前記ボールのつぶれ高さ相当分だけ前記キャピラリの先端部から降下させる工程と、
前記キャピラリの軸に沿って圧力、並びに、熱及び超音波の内の少なくともいずれか１つを加えて、前記ボールを、潰しながら、前記パッドに接合させる工程と、
前記キャピラリ枠体を上昇させる工程と、
前記キャピラリを上昇させる工程と、
を備えていることを特徴とするワイヤボンディング方法。 A step of disposing a ball formed at the tip of the bonding wire at the tip of the capillary;
Dropping the ball together with the capillary onto a pad, which is an object to be connected;
Dropping the capillary frame along the capillary and lowering the bottom surface of the capillary frame from the tip of the capillary by an amount corresponding to the collapsed height of the ball;
Applying at least one of pressure and heat and ultrasound along the axis of the capillary to bond the ball to the pad while crushing;
Raising the capillary frame;
Raising the capillary;
A wire bonding method comprising:
JP2006314263A 2006-11-21 2006-11-21 Capillary member, wire bonding apparatus, and wire bonding method Withdrawn JP2008130815A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021244703A3 (en) * 2020-06-02 2022-03-31 Hesse Gmbh Wire bonding apparatus, and operating method therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021244703A3 (en) * 2020-06-02 2022-03-31 Hesse Gmbh Wire bonding apparatus, and operating method therefor

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