WO2021244703A3 - Wire bonding apparatus, and operating method therefor - Google Patents

Wire bonding apparatus, and operating method therefor Download PDF

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Publication number
WO2021244703A3
WO2021244703A3 PCT/DE2021/100457 DE2021100457W WO2021244703A3 WO 2021244703 A3 WO2021244703 A3 WO 2021244703A3 DE 2021100457 W DE2021100457 W DE 2021100457W WO 2021244703 A3 WO2021244703 A3 WO 2021244703A3
Authority
WO
WIPO (PCT)
Prior art keywords
bonding
tool
heating
bonding tool
heating device
Prior art date
Application number
PCT/DE2021/100457
Other languages
German (de)
French (fr)
Other versions
WO2021244703A2 (en
Inventor
Frank Walther
Original Assignee
Hesse Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hesse Gmbh filed Critical Hesse Gmbh
Publication of WO2021244703A2 publication Critical patent/WO2021244703A2/en
Publication of WO2021244703A3 publication Critical patent/WO2021244703A3/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
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    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the capillary or wedge
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    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7855—Mechanical means, e.g. for severing, pressing, stamping
    • H—ELECTRICITY
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    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78611—Feeding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/78824—Translational mechanism
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    • H01L2224/78841—Means for moving parts of the pressing portion, e.g. tip or head
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    • H01L2224/789—Means for monitoring the connection process
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    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
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    • H01L2224/85206—Direction of oscillation
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    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
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    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85986—Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector

Abstract

The invention relates to a bonding apparatus having a bonding head which is movable in a vertical direction, the bonding head comprising: a bonding tool (8) with a tool tip (9) designed to bear against an item being bonded (23); a transducer (3) on which the bonding tool (8) is replaceably held and which is designed to induce the bonding tool (8) to oscillate ultrasonically; a heating device (13) for at least locally heating the bonding tool; and a carrier (22) on which the heating device (13) and the transducer (3) with the bonding tool (8) are held; wherein the transducer (3) with the bonding tool (8) is held on the carrier (22) so as to be movable relative to the heating device (13) in such a way that, in a heating position, a tool contact area (11) of the bonding tool (8) is placed against a heating contact area (14) of the heating device (13) and, in a bonding position, the bonding tool (8) is located at a distance from the heating contact area (14) of the heating device (13). The invention further relates to an operating method for a bonding apparatus of said kind.
PCT/DE2021/100457 2020-06-02 2021-05-26 Bonding apparatus and operating method therefor WO2021244703A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102020114642.6A DE102020114642A1 (en) 2020-06-02 2020-06-02 Bonding device and operating method therefor
DE102020114642.6 2020-06-02

Publications (2)

Publication Number Publication Date
WO2021244703A2 WO2021244703A2 (en) 2021-12-09
WO2021244703A3 true WO2021244703A3 (en) 2022-03-31

Family

ID=76730249

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2021/100457 WO2021244703A2 (en) 2020-06-02 2021-05-26 Bonding apparatus and operating method therefor

Country Status (2)

Country Link
DE (1) DE102020114642A1 (en)
WO (1) WO2021244703A2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5511344A (en) * 1978-07-10 1980-01-26 Nec Kyushu Ltd Semiconductor inner connection method
EP0004787B1 (en) * 1978-04-07 1982-01-27 KULICKE and SOFFA INDUSTRIES INC. Heated semiconductor bonding tool
JPH04240739A (en) * 1991-01-25 1992-08-28 Matsushita Electric Ind Co Ltd Bonder
JP2008130815A (en) * 2006-11-21 2008-06-05 Toshiba Microelectronics Corp Capillary member, wire bonding apparatus, and wire bonding method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0004787B1 (en) * 1978-04-07 1982-01-27 KULICKE and SOFFA INDUSTRIES INC. Heated semiconductor bonding tool
JPS5511344A (en) * 1978-07-10 1980-01-26 Nec Kyushu Ltd Semiconductor inner connection method
JPH04240739A (en) * 1991-01-25 1992-08-28 Matsushita Electric Ind Co Ltd Bonder
JP2008130815A (en) * 2006-11-21 2008-06-05 Toshiba Microelectronics Corp Capillary member, wire bonding apparatus, and wire bonding method

Also Published As

Publication number Publication date
WO2021244703A2 (en) 2021-12-09
DE102020114642A1 (en) 2021-12-02

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