JP2008129007A - 試料処理装置 - Google Patents
試料処理装置 Download PDFInfo
- Publication number
- JP2008129007A JP2008129007A JP2007274904A JP2007274904A JP2008129007A JP 2008129007 A JP2008129007 A JP 2008129007A JP 2007274904 A JP2007274904 A JP 2007274904A JP 2007274904 A JP2007274904 A JP 2007274904A JP 2008129007 A JP2008129007 A JP 2008129007A
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- holder
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- tool holder
- processing
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- Granted
Links
- 238000012545 processing Methods 0.000 claims description 59
- 238000003801 milling Methods 0.000 claims description 14
- 238000005498 polishing Methods 0.000 claims description 11
- 238000000227 grinding Methods 0.000 claims description 10
- 230000001050 lubricating effect Effects 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 25
- 239000000523 sample Substances 0.000 description 150
- 238000005520 cutting process Methods 0.000 description 19
- 238000005259 measurement Methods 0.000 description 10
- 239000002826 coolant Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 238000007689 inspection Methods 0.000 description 5
- 239000000314 lubricant Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 240000004050 Pentaglottis sempervirens Species 0.000 description 1
- 235000004522 Pentaglottis sempervirens Nutrition 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000012620 biological material Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005211 surface analysis Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/003—Multipurpose machines; Equipment therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D45/00—Sawing machines or sawing devices with circular saw blades or with friction saw discs
- B23D45/003—Sawing machines or sawing devices with circular saw blades or with friction saw discs for particular purposes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/02—Devices for withdrawing samples
- G01N1/04—Devices for withdrawing samples in the solid state, e.g. by cutting
- G01N1/06—Devices for withdrawing samples in the solid state, e.g. by cutting providing a thin slice, e.g. microtome
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/02—Devices for withdrawing samples
- G01N1/04—Devices for withdrawing samples in the solid state, e.g. by cutting
- G01N1/06—Devices for withdrawing samples in the solid state, e.g. by cutting providing a thin slice, e.g. microtome
- G01N2001/061—Blade details
- G01N2001/063—Blade details with sawing action
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T407/00—Cutters, for shaping
- Y10T407/19—Rotary cutting tool
- Y10T407/1906—Rotary cutting tool including holder [i.e., head] having seat for inserted tool
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/202—With product handling means
- Y10T83/2066—By fluid current
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mining & Mineral Resources (AREA)
- Health & Medical Sciences (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
【解決手段】試料(15)を処理するための装置(1)であって、試料を観察するための観察装置(2)と、処理すべき該試料を受入れるための試料ホルダ(3)と、異なる処理ステップのための工具(5)を取付けるのに適した工具ホルダ(6)とを有する。
【選択図】図1
Description
2 観察装置
3 試料ホルダ
4 回転ノブ
5 工具
6 クランプ装置(工具ホルダ)
7 第一ポート
8 ポンプ
9 第二ポート
10 吸引装置
11 入力パネル
12 回転ノブ
13 設定つまみ
14 処理領域
15 試料
16 フライスカッタ
17 ハウジング
18 鋸(ソーないしダイシングブレード)
19 研磨ホイール
20 計量供給管
21 スピンドル
22 旋回アーム
23 レバー
24 カムプレート
25 リンクロッド(棒)
26 錘(ウェイト)
27 ガイド
28 スライダ
29 ボールベアリング
30 凹端部
31 駆動システム
32 シャフト
Claims (12)
- 試料(15)を観察するための観察装置(2)と、処理すべき該試料(15)を受入れるための試料ホルダ(3)と、工具ホルダ(6)とを有する、試料(15)を処理するための装置(1)であって、
該工具ホルダ(6)は、異なる処理ステップのための工具(5)を取付けるよう設計されており、取付けられた工具(5)が該工具ホルダ(6)の長軸(L’)周りに駆動回転できることを特徴とする、装置。 - 前記工具ホルダ(6)は、前記工具ホルダの長軸(L’)周りの前記工具ホルダ(6)の回転運動を駆動するスピンドル(21)に結合されていることを特徴とする、請求項1に記載の装置。
- 前記工具ホルダ(6)にクランプされた前記工具(5)の回転速度が毎分300から20000回転の範囲で調節可能であることを特徴とする、請求項1又は2に記載の装置。
- 前記工具ホルダ(6)に挿入可能な前記工具(5)が、フライスカッタ(16)、鋸(18)、及び研削もしくは研磨ホイール(19)の群から選択されることを特徴とする、請求項1に記載の装置。
- 前記工具ホルダ(6)は、クランプ装置として実現されることを特徴とする、請求項1から4のいずれか一に記載の装置。
- 長軸(L)を持つ前記試料ホルダ(3)は、旋回軸(S)周りに旋回可能であり、また前記試料ホルダ(3)は、前記試料(15)の処理のため、前記試料ホルダ(3)と前記工具ホルダ(6)の長軸(L,L’)が実質的に平行になるような位置(B)に旋回可能であることを特徴とする、請求項1から5のいずれか一に記載の装置。
- 前記観察装置(2)が前記試料(15)を計測するための計測装置を含むことを特徴とする、請求項1から6のいずれか一に記載の装置。
- 前記試料ホルダ(3)は、前記試料ホルダの長軸(L)周りに回転可能であることを特徴とする、請求項1から7のいずれか一に記載の装置。
- 前記工具ホルダ(6)は、前記工具ホルダの長軸(L’)方向に垂直な方向に旋回可能であることを特徴とする、請求項1から8のいずれか一に記載の装置。
- 前記装置(1)が、処理中に試料(15)を冷却及び/又は潤滑するためのポンプシステム(8)及び計量供給管(20)をさらに含むことを特徴とする、請求項1から9のいずれか一に記載の装置。
- 請求項1から10のいずれか一に記載の装置を含むミクロトーム又は超ミクロトーム。
- 請求項1から10のいずれか一に記載の装置を含む顕微鏡(光学式−、走査型電子式−又は原子間力式−顕微鏡を含む)。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006054617.2A DE102006054617B4 (de) | 2006-11-17 | 2006-11-17 | Vorrichtung zum Bearbeiten einer Probe |
DE102006054617.2 | 2006-11-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008129007A true JP2008129007A (ja) | 2008-06-05 |
JP5123636B2 JP5123636B2 (ja) | 2013-01-23 |
Family
ID=39199092
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007274904A Active JP5123636B2 (ja) | 2006-11-17 | 2007-10-23 | 試料処理装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20080115640A1 (ja) |
EP (1) | EP1923686A3 (ja) |
JP (1) | JP5123636B2 (ja) |
DE (1) | DE102006054617B4 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8869666B2 (en) | 2011-03-24 | 2014-10-28 | Sakura Finetek U.S.A., Inc. | Microtome with surface orientation sensor to sense orientation of surface of sample |
WO2012145751A2 (en) * | 2011-04-22 | 2012-10-26 | Fei Company | Automated sample preparation |
AT512227A1 (de) | 2011-11-29 | 2013-06-15 | Leica Mikrosysteme Gmbh | System zum kühlen einer probe in einer vorrichtung zum bearbeiten der probe |
US9032854B2 (en) | 2011-12-21 | 2015-05-19 | Sakura Finetek U.S.A., Inc. | Reciprocating microtome drive system |
US9718205B1 (en) * | 2012-08-20 | 2017-08-01 | Voorwood Company | Single setup shaper sander |
DE102014214944A1 (de) * | 2014-07-30 | 2016-02-04 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zur Erzeugung reproduzierbarer Schnitte und/oder Ausnehmung in zumindest einer oberflächenelastischen Probe |
DE102018204402A1 (de) * | 2018-03-22 | 2019-09-26 | Siemens Aktiengesellschaft | Verfahren und Vorrichtung zur Entnahme einer Probe sowie Verwendung einer solchen Vorrichtung |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004009293A (ja) * | 2003-08-11 | 2004-01-15 | Toshiba Mach Co Ltd | 工作機械の加工適否チェック方法 |
JP2004235250A (ja) * | 2003-01-28 | 2004-08-19 | Disco Abrasive Syst Ltd | 切削装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT276800B (de) * | 1968-08-30 | 1969-12-10 | Reichert Optische Werke Ag | Vorrichtung zum Bearbeiten von Objektblöcken für die Mikrotomie, insbesondere Ultra-mikrotomie |
US3702740A (en) * | 1970-04-13 | 1972-11-14 | Rockwell Mfg Co | Drill press with coolant means |
US4989316A (en) * | 1987-03-09 | 1991-02-05 | Gerber Scientific Products, Inc. | Method and apparatus for making prescription eyeglass lenses |
DE4030185A1 (de) * | 1990-09-24 | 1992-03-26 | Siemens Ag | Verfahren zum kalibrieren eines motorisch angetriebenen werkzeuges in bezug auf ein mit diesem zu bearbeitendes werkstueck sowie vorrichtung zur durchfuehrung des verfahrens |
DE29517783U1 (de) * | 1995-11-10 | 1996-01-11 | Hawema Werkzeugschleifmaschinen GmbH, 78647 Trossingen | Schutzkabine |
US6276990B1 (en) * | 1997-08-05 | 2001-08-21 | Darrell Greenland | Tile saw having improved rollers |
DE19819144C1 (de) * | 1998-04-29 | 2000-06-15 | Tga Tech Geraete Und Apparateb | Verfahren zur mikroskopischen Untersuchung der Gewebeintegration von Festkörpern, die dauerhaft oder vorübergehend in lebende Organismen implantiert werden und Vorrichtung zur Durchführung des Verfahrens |
US6106366A (en) * | 1998-10-29 | 2000-08-22 | Gerber Coburn Optical, Inc. | Lens grinder |
JP2004009201A (ja) * | 2002-06-06 | 2004-01-15 | Toshiba Corp | リムレスレンズ用穴開け加工装置およびこれを用いたレンズ研削加工装置 |
DE10257229A1 (de) * | 2002-12-07 | 2004-06-24 | P&L Gmbh & Co. Kg | Vorrichtung zur Steuerung einer Werkzeugmaschine sowie Werkzeugmaschinen mit einer solchen Vorrichtung |
DE10258555B4 (de) * | 2002-12-14 | 2005-04-28 | Leica Mikrosysteme Gmbh Wien | Verfahren und System zum Anstellen und Schneiden eines Präparaten in einer Schneideeinrichtung |
DE102004001475B4 (de) * | 2004-01-08 | 2006-02-02 | Leica Mikrosysteme Gmbh | Verfahren zum Trimmen von Proben |
WO2008014351A1 (en) * | 2006-07-25 | 2008-01-31 | Mori Seiki U.S.A., Inc. | Compound machining method and apparatus |
-
2006
- 2006-11-17 DE DE102006054617.2A patent/DE102006054617B4/de active Active
-
2007
- 2007-07-17 EP EP20070450125 patent/EP1923686A3/de not_active Withdrawn
- 2007-10-23 JP JP2007274904A patent/JP5123636B2/ja active Active
- 2007-11-15 US US11/940,430 patent/US20080115640A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004235250A (ja) * | 2003-01-28 | 2004-08-19 | Disco Abrasive Syst Ltd | 切削装置 |
JP2004009293A (ja) * | 2003-08-11 | 2004-01-15 | Toshiba Mach Co Ltd | 工作機械の加工適否チェック方法 |
Also Published As
Publication number | Publication date |
---|---|
DE102006054617A1 (de) | 2008-05-21 |
US20080115640A1 (en) | 2008-05-22 |
EP1923686A3 (de) | 2010-04-28 |
EP1923686A2 (de) | 2008-05-21 |
DE102006054617B4 (de) | 2017-06-01 |
JP5123636B2 (ja) | 2013-01-23 |
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