JP2008112874A - Cooling system, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve cooling performance much more. <P>SOLUTION: In a cooling system 10, a heat receiving part 6 receiving heat of a heat generating part 5, a radiation part 7 diffusing heat to an external part and a tank part 8 for storing a cooling medium 1 where liquid 1a and solid 2 whose thermal conductivity is higher than liquid 1a are mixed are connected by a passage 3, and the cooling medium 1 is circulated in the passage 3 so as to cool the heat generating part 5. In the tank part 8, the passages 3 for inflow and outflow are connected to vicinity of base parts of a pair of confronted side wall parts of the tank parts 8 in parallel. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a cooling device and an electronic device, and more particularly, to a cooling device and an electronic device that cool a heat generating portion by circulating a liquid.

  In electronic devices such as desktop computers, notebook computers, and mobile communication devices, a plurality of electronic components such as a CPU (Central Processing Unit), a coil element, and a capacitor are provided on a printed circuit board. In recent years, as electronic devices are required to have higher speed, higher functionality, and higher performance, LSI (Large Scale Integration) and other devices have become faster and more integrated, and the processing speed, functions, and performance of electronic components have improved. Yes. As described above, with the increase in speed, function, and performance of electronic devices, the amount of heat generated during operation of the electronic components constituting the electronic devices tends to increase. In order to maintain the stable operation of the electronic device, it is necessary to improve the heat dissipation property to quickly release the heat generated from the electronic component to the outside.

  Conventionally, in order to release the heat generated from the electronic components to the outside, for example, a fan is installed in the CPU, and the fan is rotated to cool the supplied air. On the other hand, as described above, the amount of heat generated by the electronic component is increasing, and a cooling device having higher heat dissipation than air is required. Therefore, a cooling device has been proposed that uses a liquid such as water or antifreeze having a specific heat higher than that of air as a cooling medium (see, for example, Patent Documents 1, 2, and 3).

In a cooling device using such a liquid as a cooling medium, a heat receiving plate (heat receiving portion) thermally bonded to an electronic component (heat generating portion), a heat radiating plate (heat radiating portion) that dissipates heat to the outside, and a pump The part is connected in a ring shape with a pipe, and the cooling medium is circulated in the pipe by the action of the pump part to cool the heat generating part. That is, due to the action of the pump unit, the cooling medium circulating in the pipe receives heat from the heat generating unit at the heat receiving unit. Further, heat is conducted to the heat radiating plate through the circulating cooling medium, and the conducted heat is dissipated from the heat radiating plate to the outside. Thus, the heat generating part can be cooled by circulating the cooling medium. In addition, by using such a cooling device, it is possible to reduce the size of the electronic device.
JP 2004-1111829 A JP 2001-237582 A JP 2004-95891 A

  However, it is expected that electronic devices will further increase in speed and performance due to technological progress and social demands. And with such progress, it is anticipated that the calorific value of the electronic component which comprises an electronic device will also increase further.

  The present invention has been made in view of these points, and an object thereof is to provide a cooling device and an electronic apparatus that improve the cooling performance.

  In the present invention, in order to solve the above problems, as shown in FIG. 1, a heat receiving portion 6 that receives heat from the heat generating portion 5, a heat radiating portion 7 that dissipates heat to the outside, and the thermal conductivity of the liquid 1a and the liquid 1a. A cooling device for connecting the tank 8 for storing the cooling medium 1 mixed with the solid 2 having a high content with the flow path 3 and circulating the cooling medium 1 in the flow path 3 to cool the heat generating section 5. 10. The cooling device according to claim 10, wherein the tank portion 8 has inflow and outflow passages 3 connected in parallel to each other in the vicinity of the bottom of a pair of opposing side wall portions of the tank portion 8. 10 is provided.

  According to such a configuration, the tank for storing the cooling medium in which the heat receiving part that receives the heat of the heat generating part, the heat radiating part that dissipates heat to the outside, and the liquid and the solid having higher thermal conductivity than the liquid are mixed. Is a cooling device in which a heat generating part is cooled by circulating a cooling medium in the flow path, and the tank part is located near the bottom of a pair of side wall parts facing each other. The inflow and outflow channels are connected in parallel to each other.

  Further, in the present invention, in order to solve the above problem, cooling in which a heat receiving portion that receives heat from the heat generating portion, a heat radiating portion that dissipates heat to the outside, and a liquid and a solid having higher thermal conductivity than the liquid are mixed. A tank unit for storing a medium is connected by a flow path, and an electronic apparatus including a cooling device that circulates the cooling medium in the flow path and cools the heat generating part. An electronic apparatus is provided in which the inflow and outflow passages are connected in parallel to each other in the vicinity of the bottom of the pair of side wall portions facing each other in the tank portion.

  According to such a configuration, the tank for storing the cooling medium in which the heat receiving part that receives the heat of the heat generating part, the heat radiating part that dissipates heat to the outside, and the liquid and the solid having higher thermal conductivity than the liquid are mixed. Is an electronic device having a cooling device in which a heat generating part is cooled by circulating a cooling medium in the flow path, and the tank part is a pair of side wall parts opposed to the tank part. The inflow and outflow channels are connected in parallel to each other in the vicinity of the bottom of each.

  In the present invention, the flow path includes a heat receiving portion that receives heat from the heat generating portion, a heat radiating portion that dissipates heat to the outside, and a tank portion for storing a cooling medium in which a liquid and a solid having a higher thermal conductivity than the liquid are stored. And a cooling device that circulates a cooling medium in the flow path to cool the heat generating portion. The tank portion is provided for inflow and outflow in the vicinity of the bottom of a pair of side wall portions opposed to the tank portion. The flow paths were connected in parallel to each other. Thereby, the solid settled in the bottom part of the tank part can be stirred by the flow velocity from the flow path connected in parallel near the bottom part of the side wall part of the tank part.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the technical scope of the present invention is not limited to these embodiments, but extends to the matters described in the claims and equivalents thereof.

A cooling device having a cooling medium with improved thermal conductivity will be described, and then an outline of the present invention and a specific embodiment of the present invention will be described.
FIG. 8 is a schematic view of a cooling device having a cooling medium mixed with a high thermal conductive solid, and FIG. 9 is a schematic cross-sectional view of a tank portion.

  As shown in FIG. 8, the cooling device 200 includes a pump unit 104, a heat receiving unit 106 thermally bonded to the heat generating unit 105, a heat radiating unit 107, and a tank unit 108 in which the cooling medium 101 is placed. It is connected in a ring shape via a path 103. The driving of the pump unit 104 has a higher thermal conductivity than the liquid 101a. For example, solids 102 such as metal, ceramic powder particles or mixed particles thereof are mixed in the liquid 101a, and the thermal conductivity is improved. The cooling medium 101 is circulated in the flow path 103 in the direction indicated by the arrow, so that the heat generating portion 105 can be cooled more efficiently than when the cooling medium 101 is only the liquid 101a.

  On the other hand, as shown in FIG. 9, when the inlet 108a and the outlet 108b of the tank unit 108 of the cooling device 200 are not in a straight line, the pump unit 104 is stopped without operating the cooling device 200. Time), the solid 102, such as metal, ceramic powder particles, or mixed particles thereof, settles little by little on the bottom of the tank section 108. That is, as the standing time elapses, the amount of the solid 102 that receives the liquid flow 109 gradually decreases, the stirrability of the solid 102 in the liquid 101a also gradually decreases, and the cooling effect of the cooling medium 101 is unstable. May be.

Therefore, an outline of the present invention for further improving the cooling performance of such a cooling device 200 will be described, and then an embodiment of the present invention will be described.
FIG. 1 is a schematic diagram of the present invention.

  As shown in FIG. 1, the cooling device 10 includes a cooling medium 1 in which a pump unit 4, a heat receiving unit 6 that is thermally joined to a heat generating unit 5, a heat radiating unit 7, a liquid 1 a and a solid 2 are mixed. Is stored in a ring shape through the flow path 3.

Examples of the liquid 1a include water and an antifreeze liquid in which water and propylene glycol are mixed.
The solid 2 is made of a highly heat conductive material such as metal. By mixing such a solid 2 and the liquid 1a, the thermal conductivity of the cooling medium 1 is improved, and the cooling performance of the cooling device 10 is improved. In addition to the alumina powder, the solid 2 high thermal conductivity material includes aluminum nitride, copper oxide, zinc oxide, beryllium oxide, magnesium oxide, zirconium oxide, and any of copper, aluminum, silver, gold, and magnesium. One of these metals or an alloy containing one or more elements of copper, aluminum, silver, gold, and magnesium can be given.

The pump unit 4 can circulate the cooling medium 1 in the flow path 3 by being driven.
The heat generating unit 5 is, for example, an electronic component that generates heat, such as a CPU.

The heat receiving unit 6 is thermally joined to the heat generating unit 5 and conducts heat received from the heat generating unit 5 to the cooling medium 1.
The heat radiating unit 7 dissipates heat carried by the cooling medium 1 to the outside.

The tank unit 8 will be described below with reference to FIG.
In the tank portion 8, an inflow port 8 a and an outflow port 8 b are formed in the vicinity of the bottom of the side wall surface of the tank portion 8, and the flow paths of the inflow port 8 a and the outflow port 8 b are provided in parallel. The tank unit 8 stores the cooling medium 1 in which the liquid 1 a and the solid 2 are mixed. By driving the pump unit 4, the flow rate 8 c is obtained from the inlet 8 a and along the bottom of the tank unit 8. Then, the cooling medium 1 is flowed, and the cooling medium 1 flows out into the flow path 3 from the outlet 8b.

  In such a tank unit 8, the solid 2 settles to the bottom of the tank unit 8 due to elapse of the standing time of the cooling device 10 or the like. However, the tank unit 8 is provided with the inlet 8 a and the outlet 8 b below the tank unit 8 in parallel with the flow velocity 8 c, so that the settled solid 2 receives the flow velocity 8 c driven by the pump unit 4. By receiving the flow velocity 8c, the solid 2 is stirred again with the liquid 1a in the tank unit 8, so that the solid 2 can be circulated in the flow path 3 together with the liquid 1a.

The cooling process of the cooling device 10 having such a configuration will be described below. The case where the cooling process is started after the cooling device 10 is left standing will be described as an example.
A cooling medium 1 having a liquid 1 a and a solid 2 is stored in the tank portion 8. However, since the cooling device 10 has been left stationary for a while, the solid 2 has settled at the bottom of the tank unit 8.

By driving the pump unit 4, the tank unit 8 obtains a flow velocity 8c from the inflow port 8a.
The solid 2 settled on the bottom of the tank unit 8 is stirred again in the tank unit 8 by obtaining the flow velocity 8c, and the cooling medium 1 in which the solid 2 is dispersed in the liquid 1a is It flows out to the flow path 3 from the outflow port 8b.

The cooling medium 1 flows in the flow path 3 inside the heat receiving part 6 that is thermally joined to the heat generating part 5. At this time, heat from the heat generating part 5 is conducted to the cooling medium 1 through the heat receiving part 6.
The cooling medium 1 to which the heat of the heat generating part 5 is conducted flows in the flow path 3 of the heat radiating part 7. At this time, the conducted heat is dissipated to the outside through the heat radiating portion 7.

Then, the cooling medium 1 from which heat is dissipated circulates through the flow path 3 and returns to the tank unit 8 again.
By repeating the circulation of the cooling medium 1 in this way, the heat generating part 5 can be cooled.

  As described above, by providing the inlet 8a and the outlet 8b of the tank portion 8 of the cooling device 10 in the vicinity of the bottom of the side wall portion of the tank portion 8, the highly thermally conductive material that has settled to the bottom of the tank portion 8 is provided. The solid 2 is agitated in response to the flow velocity 8c driven by the pump unit 4, and the cooling medium 1 in which the solid 2 is dispersed in the liquid can flow into the flow path 3. Therefore, the heat of the heat generating part 5 can be efficiently dissipated to the outside by the cooling medium 1 in which the improved thermal conductivity is maintained.

Embodiments using the present invention will be described below.
First, a first embodiment will be described.
FIG. 2 is a schematic diagram of the cooling device according to the first embodiment.

  The cooling device 20 stores the pump 14, the heat receiving plate 16 thermally bonded to the electronic component 15, the heat radiating plate 17, and the cooling medium 11 in which the high thermal conductive solid alumina powder 12 is mixed in the water 11a. The reservoir tank 18 is annularly connected via the pipe 13. The room temperature at this time is 25 ° C., and the cooling device 20 is allowed to stand for 0 hour to 1 month.

The pipe 13 has a diameter of 5 mm and a length of 500 mm.
The pump 14 can circulate the cooling medium 11 in the pipe 13 by being driven. The drive voltage of the pump 14 is 5V and the flow rate is 150 ml / min.

Examples of the electronic component 15 include a CPU. Note that the heat generation amount of the electronic component 15 in the first embodiment is 50 W.
The heat receiving plate 16 is thermally bonded to the electronic component 15 and conducts heat received from the electronic component 15 to the cooling medium 11.

  The heat sink 17 dissipates the heat carried by the cooling medium 11 to the outside. Further, the heat radiating plate 17 is provided with heat radiating fins 19a for radiating heat, and a blower fan 19b for sending air toward the heat radiating fins 19a is provided in the vicinity of the heat radiating fins 19a. The blower fan 19b is driven at 5V, its diameter is 50 mm, and its air volume is 100 l / min.

  As shown in FIG. 2, the reservoir tank 18 is provided with an inlet 18 a and an outlet 18 b in a straight line near the bottom of the side wall of the reservoir tank 18. The reservoir tank 18 stores the cooling medium 11 in which the alumina powder 12 is mixed in the water 11a. By driving the pump 14, the flow rate 18c is obtained from the inlet 18a, and the cooling medium 11 is supplied from the outlet 18b. It flows out into the pipe 13.

  In such a reservoir tank 18, even if the alumina powder 12 settles on the bottom of the reservoir tank 18 due to elapse of the standing time of the cooling device 20, the inlet port 18 a and the outlet port 18 b are connected to the reservoir tank 18. By being provided in the vicinity of the bottom of the side wall surface in parallel with the flow velocity 18 c, the settled alumina powder 12 receives the flow velocity 18 c along the bottom of the reservoir tank 18 driven by the pump 14. Since the alumina powder 12 is stirred again with the water 11a in the reservoir tank 18 by receiving the flow velocity 18c, the alumina powder 12 can circulate in the pipe 13 together with the water 11a.

Note that silica powder is adhered to the surface of the alumina powder 12. Thereby, the dispersibility in the water 11a of the alumina powder 12 improves.
The cooling process of the cooling device 20 having such a configuration will be described below. The case where the cooling process is started after the cooling device 20 is left standing will be described as an example.

  A cooling medium 11 having water 11 a and alumina powder 12 is stored in the reservoir tank 18. However, since the cooling device 20 has been left standing for a while, the alumina powder 12 has settled at the bottom of the reservoir tank 18.

By driving the pump 14, the reservoir tank 18 obtains a flow velocity 18c from the inlet 18a.
The alumina powder 12 that has settled at the bottom of the reservoir tank 18 is stirred again in the reservoir tank 18 by obtaining a flow velocity 18c along the bottom of the reservoir tank 18, so that the alumina powder 12 is in the water 11a. The cooling medium 11 dispersed in the flow is discharged from the outlet 18 b of the reservoir tank 18 to the pipe 13.

The cooling medium 11 flows in the pipe 13 inside the heat receiving plate 16 thermally connected to the electronic component 15. At this time, heat from the electronic component 15 is conducted to the cooling medium 11 via the heat receiving plate 16.
The cooling medium 11 to which the heat of the electronic component 15 is conducted flows in the pipe 13 of the heat radiating plate 17. At this time, the conducted heat is dissipated to the outside through the heat radiating plate 17 and the heat radiating fins 19a. Furthermore, at this time, since air is sent from the blower fan 19b toward the heat radiating fins 19a, a larger heat radiating effect can be obtained.

The cooling medium 11 whose temperature has decreased due to heat dissipation circulates in the pipe 13 by driving the pump 14. Thus, the electronic component 15 is cooled by the circulation of the cooling medium 11.
Next, a second embodiment will be described below.

The cooling device of the second embodiment is configured by another reservoir tank in place of the reservoir tank 18 in the cooling device 20 of the first embodiment.
FIG. 3 is a schematic cross-sectional view of another reservoir tank according to the second embodiment.

  In the reservoir tank 28, the cooling medium 21 in which the alumina powder 22 is mixed in the water 21a is stored as before, and the inlet 28a and the outlet 28b are near the bottom of the side wall surface of the reservoir tank 28. Is provided. Then, by driving the pump 14, the flow velocity 28 c is obtained from the inlet 28 a, and the cooling medium 21 flows out from the outlet 28 b into the pipe 13. However, unlike the first embodiment, the reservoir tank 28 is connected to the pipe on the inlet 28a side with an inclination.

  Similar to the reservoir tank 18 of the first embodiment, the reservoir tank 28 may be deposited on the bottom of the reservoir tank 28 due to elapse of the standing time of the cooling device 20 or the like. The settled alumina powder 22 receives a flow velocity 28 c along the bottom of the reservoir tank 28 driven by the pump 14. Since the alumina powder 22 receives the flow rate 28c and is stirred again with the water 21a in the reservoir tank 28, the alumina powder 22 can circulate in the pipe 13 together with the water 21a.

Note that silica powder is adhered to the surface of the alumina powder 22 as in the first embodiment. Thereby, the dispersibility in the water 21a of the alumina powder 22 improves.
The cooling device having such a reservoir tank 28 can cool the electronic component 15 and the like that generate heat by performing the same cooling process as in the first embodiment.

Next, a third embodiment will be described below.
The cooling device of the third embodiment is configured by another reservoir tank in place of the reservoir tank 18 in the cooling device 20 of the first embodiment.

FIG. 4 is a schematic cross-sectional view of another reservoir tank according to the third embodiment.
The reservoir tank 38 has a circular shape, and the inflow port 38a and the outflow port 38b are arranged in the vicinity of the bottom portion.

  Similar to the reservoir tank 18 of the first embodiment, the reservoir tank 38 may be settled on the bottom of the reservoir tank 38 due to elapse of the standing time of the cooling device 20 or the like. The settled alumina powder 32 receives a flow velocity 38c by driving the pump 14. Since the alumina powder 32 receives the flow rate 38c and is stirred again with the water 31a in the reservoir tank 38, the alumina powder 32 can circulate in the pipe 13 together with the water 31a.

As in the first embodiment, silica powder is attached to the surface of the alumina powder 32. Thereby, the dispersibility in the water 31a of the alumina powder 32 improves.
The cooling device 20 having such a reservoir tank 38 can cool the electronic component 15 and the like that generate heat by performing the same cooling process as in the first embodiment.

Next, a fourth embodiment will be described below.
The cooling device of the fourth embodiment is configured by another reservoir tank in place of the reservoir tank 18 in the cooling device 20 of the first embodiment.

FIG. 5 is a schematic cross-sectional view of another reservoir tank according to the fourth embodiment.
The shape of the reservoir tank 48 is a triangular prism, and one side of the triangular prism is arranged facing downward, and the inflow port 48a and the outflow port 48b are connected near the bottom.

  This reservoir tank 48 is similar to the reservoir tank 18 of the first embodiment, even if the alumina powder 42 settles on the bottom of the reservoir tank 48 due to elapse of the standing time of the cooling device 20 or the like. The settled alumina powder 42 receives a flow velocity 48 c along the bottom of the triangular prism driven by the pump 14. Since the alumina powder 42 receives the flow rate 48c and is stirred again with the water 41a in the reservoir tank 48, the alumina powder 42 can circulate in the pipe 13 together with the water 41a.

Note that silica powder is adhered to the surface of the alumina powder 42 as in the first embodiment. Thereby, the dispersibility in the water 41a of the alumina powder 42 improves.
The cooling device 20 having such a reservoir tank 48 can cool the electronic component 15 and the like that generate heat by performing the same cooling process as in the first embodiment.

Here, the change in the thermal resistance of the cooling medium with respect to the change over time of the standing time of the cooling device 20 in the first, second, third, and fourth embodiments will be described.
FIG. 6 is a graph showing changes in the thermal resistance of the cooling medium with respect to changes in the standing time of the cooling device.

  According to FIG. 6, the thermal resistance of the cooling media 11, 21, 31, 41 of the first, second, third, and fourth embodiments is kept constant as the standing time elapses. The same effect was obtained in each case. In addition, the big difference was not shown also about the thermal resistance of the cooling medium 11,21,31,41 of 1st, 2nd and 3rd, 4th embodiment.

Next, a fifth embodiment will be described below.
In the fifth embodiment, a portable as an example of an electronic apparatus provided with a cooling device having the reservoir tank 18, 28, 38, 48 of any of the first, second, third, and fourth embodiments. A computer will be described as an example.

FIG. 7 is a schematic diagram of a portable computer equipped with a cooling device.
The portable computer 70 includes a cooling device 60. The cooling device 60 includes a pump 64, a heat receiving plate 66 thermally bonded to the heating element 65, a heat radiating plate 67, and alumina powder mixed in water. A reservoir tank 68 in which a cooling medium is stored is connected in an annular shape via a pipe 63. Further, the heat radiating plate 67 is provided with heat radiating fins 69a for radiating heat, and a blower fan 69b for sending air toward the heat radiating fins 69a is provided in the vicinity of the heat radiating fins 69a.

  As described above, the portable computer 70 provided with such a cooling device 60 can improve the cooling efficiency with respect to the heating element 65 such as a CPU. Therefore, stable operation of the heating element 65 such as a CPU can be maintained, and as a result, the performance of the portable computer 70 itself can be improved.

  In the fifth embodiment, a portable computer has been described as an example of an electronic device. However, the same effect can be obtained by providing the electronic device in a desktop computer or a mobile communication device. Can do.

  As described above, in the present invention, by connecting the flow paths of the inlet and the outlet in parallel with each other near the bottom surface of the side wall portion of the tank portion of the cooling device, the solid of the high thermal conductivity material settled on the bottom of the tank portion is obtained. The cooling medium in which the solid is dispersed in the liquid can be flowed through the flow path by being stirred by receiving the flow rate by driving the pump. Therefore, the heat of the heat generating portion can be efficiently dissipated to the outside by the cooling medium in which the improved thermal conductivity is maintained.

  (Additional remark 1) The heat receiving part which receives the heat of a heat generating part, the thermal radiation part which dissipates heat outside, and the tank part for storing the cooling medium with which the liquid and the solid whose heat conductivity is higher than the said liquid were mixed A cooling device connected in a flow path and circulating the cooling medium in the flow path to cool the heat generating part, wherein the tank part is near the bottom of a pair of side wall parts facing the tank part The inflow and outflow channels are connected in parallel to each other.

(Supplementary note 2) The cooling device according to supplementary note 1, wherein the flow paths for inflow and outflow are connected to the tank portion in a straight line.
(Additional remark 3) The cooling device of Additional remark 1 or 2 characterized by further having a ventilation fan which sends a heat | fever into the said heat radiating plate and the said heat radiating fin while a heat radiating fin is installed in a heat radiating plate.

(Additional remark 4) The said liquid is water or an antifreeze liquid, The cooling device of Additional remark 1 thru | or 3 characterized by the above-mentioned.
(Additional remark 5) The cooling device of Additional remark 4 characterized by the said antifreeze being a liquid mixture of water and propylene glycol.

  (Supplementary note 6) The cooling device according to supplementary notes 1 to 5, wherein alumina, aluminum nitride, copper oxide, zinc oxide, beryllium oxide, magnesium oxide or zirconium oxide is used for the solid.

  (Appendix 7) The solid is an alloy containing one or more elements of copper, aluminum, silver, gold, magnesium, or one of the elements in copper, aluminum, silver, gold, magnesium. The cooling device according to any one of appendices 1 to 5, characterized in that

(Additional remark 8) Silica powder adheres to the surface of the said solid, The cooling device of Additional remark 6 thru | or 7 characterized by the above-mentioned.
(Supplementary note 9) The cooling device according to any one of supplementary notes 1 to 8, wherein the inflow flow path is connected at an angle.

(Additional remark 10) The said tank part is a triangular prism, Comprising: The cooling device of Additional remark 1 thru | or 9 arrange | positioned by making one side of the said triangular prism into a bottom part.
(Additional remark 11) The said tank part is a cylinder, Comprising: One side part of the said cylinder is made into a bottom part, and it is parallel to the circle which the said cylinder opposes, Comprising: The said flow path for inflow and outflow is parallel to the said bottom part 10. The cooling device according to any one of appendices 1 to 9, wherein the cooling device is connected to

  (Additional remark 12) The heat-receiving part which receives the heat of a heat-emitting part, the thermal radiation part which dissipates heat outside, and the tank part for storing the cooling medium with which the liquid and the solid whose heat conductivity is higher than the said liquid were mixed An electronic device including a cooling device that is connected in a flow path and circulates the cooling medium in the flow path to cool the heat generating portion, wherein the tank portion is a pair of opposed tank portions. An electronic apparatus characterized in that the inflow and outflow passages are connected in parallel to each other in the vicinity of the bottom of the side wall.

It is a schematic diagram of the present invention. It is a schematic diagram of the cooling device in 1st Embodiment. It is a cross-sectional schematic diagram of another reservoir tank of 2nd Embodiment. It is a cross-sectional schematic diagram of another reservoir tank of 3rd Embodiment. It is a cross-sectional schematic diagram of another reservoir tank of 4th Embodiment. It is a graph which shows the change of the thermal resistance of a cooling medium with respect to the change of the stationary time of a cooling device. It is a schematic diagram of the portable computer provided with the cooling device. It is a schematic diagram of a cooling device having a cooling medium mixed with a high thermal conductive solid. It is a cross-sectional schematic diagram of a tank part.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Cooling medium 1a Liquid 2 Solid 3 Flow path 4 Pump part 5 Heat generating part 6 Heat receiving part 7 Heat radiating part 8 Tank part 8a Inlet 8b Outlet 8c Flow rate 10 Cooling device

Claims (6)

  A heat receiving part that receives heat from the heat generating part, a heat radiating part that dissipates heat to the outside, and a tank part for storing a cooling medium in which a liquid and a solid having a higher thermal conductivity than the liquid are stored in a flow path A cooling device that is connected and circulates the cooling medium in the flow path to cool the heat generating portion, wherein the tank portion is in the vicinity of the bottom of a pair of side walls facing the tank portion. And a cooling device in which the flow paths for outflow are connected in parallel to each other.   The cooling device according to claim 1, wherein the flow paths for inflow and outflow are connected to the tank portion in a straight line.   3. The cooling device according to claim 1, wherein the flow paths for inflow are connected at an angle.   The cooling device according to claim 1, wherein the tank portion is a triangular prism, and is arranged with one side of the triangular prism as a bottom.   The tank part is a cylinder, and one side surface part of the cylinder is a bottom part, which is parallel to an opposite circle of the cylinder, and the flow paths for inflow and outflow are connected in parallel to the bottom part. The cooling device according to any one of claims 1 to 3, wherein   A heat receiving part that receives heat from the heat generating part, a heat radiating part that dissipates heat to the outside, and a tank part for storing a cooling medium in which a liquid and a solid having a higher thermal conductivity than the liquid are stored in a flow path An electronic apparatus comprising a cooling device that is connected and circulates the cooling medium in the flow path to cool the heat generating part, wherein the tank part is a bottom part of a pair of side wall parts facing the tank part. An electronic apparatus characterized in that the inflow and outflow channels are connected in parallel to each other in parallel.

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