JP2008108861A - 光源にフレキシブルｐｃｂが直結された発光ダイオードパッケージ - Google Patents

光源にフレキシブルｐｃｂが直結された発光ダイオードパッケージ Download PDF

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Publication number
JP2008108861A
JP2008108861A JP2006289444A JP2006289444A JP2008108861A JP 2008108861 A JP2008108861 A JP 2008108861A JP 2006289444 A JP2006289444 A JP 2006289444A JP 2006289444 A JP2006289444 A JP 2006289444A JP 2008108861 A JP2008108861 A JP 2008108861A
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
led
diode package
flexible pcb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006289444A
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English (en)
Japanese (ja)
Other versions
JP2008108861A5 (https=
Inventor
Akira Takekuma
顕 武熊
Chew Tong Fatt
チュー・トン・ファット
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
Original Assignee
Avago Technologies ECBU IP Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avago Technologies ECBU IP Singapore Pte Ltd filed Critical Avago Technologies ECBU IP Singapore Pte Ltd
Priority to JP2006289444A priority Critical patent/JP2008108861A/ja
Priority to US11/923,274 priority patent/US7963674B2/en
Publication of JP2008108861A publication Critical patent/JP2008108861A/ja
Publication of JP2008108861A5 publication Critical patent/JP2008108861A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Led Device Packages (AREA)
JP2006289444A 2006-10-25 2006-10-25 光源にフレキシブルｐｃｂが直結された発光ダイオードパッケージ Pending JP2008108861A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006289444A JP2008108861A (ja) 2006-10-25 2006-10-25 光源にフレキシブルｐｃｂが直結された発光ダイオードパッケージ
US11/923,274 US7963674B2 (en) 2006-10-25 2007-10-24 Light emitting diode package having flexible PCT directly connected to light source

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006289444A JP2008108861A (ja) 2006-10-25 2006-10-25 光源にフレキシブルｐｃｂが直結された発光ダイオードパッケージ

Publications (2)

Publication Number Publication Date
JP2008108861A true JP2008108861A (ja) 2008-05-08
JP2008108861A5 JP2008108861A5 (https=) 2010-12-24

Family

ID=39329867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006289444A Pending JP2008108861A (ja) 2006-10-25 2006-10-25 光源にフレキシブルｐｃｂが直結された発光ダイオードパッケージ

Country Status (2)

Country Link
US (1) US7963674B2 (https=)
JP (1) JP2008108861A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009133933A (ja) * 2007-11-29 2009-06-18 Kyocera Mita Corp 画像読取装置および画像形成装置
US9496244B2 (en) 2014-03-11 2016-11-15 Ushio Denki Kabushiki Kaisha Light emitting module and light irradiating apparatus
KR101797279B1 (ko) 2015-04-22 2017-12-12 엘지전자 주식회사 Led 발광 장치
JP2018531366A (ja) * 2015-06-25 2018-10-25 フレセニウス メディカル ケア ホールディングス インコーポレーテッド 直接光の示差測定システム
JP2020013949A (ja) * 2018-07-20 2020-01-23 日亜化学工業株式会社 発光装置

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090140271A1 (en) * 2007-11-30 2009-06-04 Wen-Jyh Sah Light emitting unit
TW201019006A (en) * 2008-11-06 2010-05-16 Chunghwa Picture Tubes Ltd LED light module
KR101305765B1 (ko) * 2009-07-14 2013-09-06 샤프 가부시키가이샤 면 발광 유닛 및 그 제조 방법
US20110101409A1 (en) * 2009-11-02 2011-05-05 Akron Brass Company LED Lamp Package with Integral Driver
US8241044B2 (en) * 2009-12-09 2012-08-14 Tyco Electronics Corporation LED socket assembly
KR20130143067A (ko) 2010-11-03 2013-12-30 쓰리엠 이노베이티브 프로퍼티즈 컴파니 가요성 led 디바이스 및 제조 방법
KR20130141559A (ko) 2010-11-03 2013-12-26 쓰리엠 이노베이티브 프로퍼티즈 컴파니 열 관리를 위한 가요성 ｌｅｄ 디바이스 및 제조 방법
EP2518848B1 (de) * 2011-04-27 2014-04-16 Hager Industrie AG Rahmen für elektrisches Installationsgerät.
GB2500380A (en) * 2012-03-18 2013-09-25 Effect Photonics B V Arrangement and method of making electrical connections
US8933473B1 (en) * 2012-06-01 2015-01-13 Valery Dubin Method, apparatus and system for providing light source structures on a flexible substrate
CN103363366A (zh) * 2013-07-15 2013-10-23 厦门乾照光电股份有限公司 一种led软灯条及其制造方法
US20150116999A1 (en) * 2013-10-30 2015-04-30 Avago Technologies General Ip (Singapore) Pte. Ltd Mono-axial lens for multiple light sources
CN108604629B (zh) 2016-02-05 2021-05-25 Lg 伊诺特有限公司 发光元件封装

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56174872U (https=) * 1980-05-26 1981-12-23
JPS61112662U (https=) * 1984-12-27 1986-07-16
JP2000277814A (ja) * 1999-03-29 2000-10-06 Sumitomo Electric Ind Ltd 光通信モジュール
JP2004103993A (ja) * 2002-09-12 2004-04-02 Ichikoh Ind Ltd Ｌｅｄ設置用フレキシブル基板及びそのｌｅｄ設置用フレキシブル基板を用いた車両用灯具
US20050045904A1 (en) * 2003-09-01 2005-03-03 Hsing Chen Light emitting diode with high heat dissipation

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7800121B2 (en) * 2002-08-30 2010-09-21 Lumination Llc Light emitting diode component
US7501659B2 (en) * 2005-04-12 2009-03-10 Japan Cash Machine Co., Ltd. LED device and optical detector therewith for bill validator

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56174872U (https=) * 1980-05-26 1981-12-23
JPS61112662U (https=) * 1984-12-27 1986-07-16
JP2000277814A (ja) * 1999-03-29 2000-10-06 Sumitomo Electric Ind Ltd 光通信モジュール
JP2004103993A (ja) * 2002-09-12 2004-04-02 Ichikoh Ind Ltd Ｌｅｄ設置用フレキシブル基板及びそのｌｅｄ設置用フレキシブル基板を用いた車両用灯具
US20050045904A1 (en) * 2003-09-01 2005-03-03 Hsing Chen Light emitting diode with high heat dissipation

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009133933A (ja) * 2007-11-29 2009-06-18 Kyocera Mita Corp 画像読取装置および画像形成装置
US9496244B2 (en) 2014-03-11 2016-11-15 Ushio Denki Kabushiki Kaisha Light emitting module and light irradiating apparatus
KR101797279B1 (ko) 2015-04-22 2017-12-12 엘지전자 주식회사 Led 발광 장치
JP2018531366A (ja) * 2015-06-25 2018-10-25 フレセニウス メディカル ケア ホールディングス インコーポレーテッド 直接光の示差測定システム
US11241176B2 (en) 2015-06-25 2022-02-08 Fresenius Medical Care Holdings, Inc. Direct light differential measurement system with increased noise immunity
US12114973B2 (en) 2015-06-25 2024-10-15 Fresenius Medical Care Holdings, Inc. Direct light differential measurement system
JP2020013949A (ja) * 2018-07-20 2020-01-23 日亜化学工業株式会社 発光装置
JP2021121019A (ja) * 2018-07-20 2021-08-19 日亜化学工業株式会社 発光装置
JP7058388B2 (ja) 2018-07-20 2022-04-22 日亜化学工業株式会社 発光装置

Also Published As

Publication number Publication date
US20080101066A1 (en) 2008-05-01
US7963674B2 (en) 2011-06-21

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