JP2008107529A5 - - Google Patents

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JP2008107529A5
JP2008107529A5 JP2006289641A JP2006289641A JP2008107529A5 JP 2008107529 A5 JP2008107529 A5 JP 2008107529A5 JP 2006289641 A JP2006289641 A JP 2006289641A JP 2006289641 A JP2006289641 A JP 2006289641A JP 2008107529 A5 JP2008107529 A5 JP 2008107529A5
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carbon atoms
group
siloxane composition
alkyl group
hydrogen
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JP2006289641A
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JP4853228B2 (en
JP2008107529A (en
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（ａ）下記一般式（１）で表される化合物を加水分解、縮合させることによって得られる共重合体であるポリシロキサン、（ｂ）キノンジアジド化合物、（ｃ）溶剤を含有する感光性シロキサン組成物。
Figure 2008107529
 （Ｒ１ の少なくとも一つはオキセタニル基またはコハク酸無水物基が置換したアルキル基またはオキシアルキル基を表し、その他のＲ１は水素、炭素数１〜１０のアルキル基、炭素数２〜１０のアルケニル基、炭素数６〜１５のアリール基のいずれかで表され、複数のＲ１ はそれぞれ同じでも異なっていてもよい。Ｒ２は水素、炭素数１〜６のアルキル基、炭素数１〜６のアシル基、炭素数６〜１５のアリール基のいずれかを表し、複数のＲ２ はそれぞれ同じでも異なっていてもよい。ｘは１〜３の整数を表す。） (A) Photosensitive siloxane composition containing polysiloxane which is a copolymer obtained by hydrolyzing and condensing a compound represented by the following general formula (1), (b) a quinonediazide compound, and (c) a solvent. .
Figure 2008107529
 (At least one of R 1 represents an alkyl group or an oxyalkyl group oxetanyl group or succinic anhydride groups substituted, other R 1 represents hydrogen, an alkyl group having 1 to 10 carbon atoms, from 2 to 10 carbon atoms alkenyl group, represented by any of the aryl group having 6 to 15 carbon atoms, more R 1 s may be the same or different from each .R 2 is hydrogen, an alkyl group having 1 to 6 carbon atoms, 1 to carbon atoms 6 represents an acyl group of 6 or an aryl group of 6 to 15 carbon atoms, and a plurality of R 2 may be the same or different, and x represents an integer of 1 to 3). （ａ）のポリシロキサンが一般式（１）で表される化合物および下記一般式（２）で表される化合物を加水分解、縮合させることによって得られる共重合体である請求項１記載の感光性シロキサン組成物。
Figure 2008107529
 （Ｒ３ は水素、炭素数１〜１０のアルキル基、炭素数２〜１０のアルケニル基、炭素数６〜１５のアリール基のいずれかを表し、複数のＲ３はそれぞれ同じでも異なっていてもよい。Ｒ４ は水素、炭素数１〜６のアルキル基、炭素数１〜６のアシル基、炭素数６〜１５のアリール基のいずれかを表し、複数のＲ４はそれぞれ同じでも異なっていてもよい。ｙは０〜３の整数を表す。） The photosensitive resin according to claim 1, wherein the polysiloxane (a) is a copolymer obtained by hydrolysis and condensation of the compound represented by the general formula (1) and the compound represented by the following general formula (2). Siloxane composition.
Figure 2008107529
 (R 3 represents any one of hydrogen, an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, and an aryl group having 6 to 15 carbon atoms, and a plurality of R 3 may be the same or different. R 4 represents any one of hydrogen, an alkyl group having 1 to 6 carbon atoms, an acyl group having 1 to 6 carbon atoms, and an aryl group having 6 to 15 carbon atoms, and a plurality of R 4 may be the same or different. Y represents an integer of 0 to 3.) （ａ）ポリシロキサンが共重合体であり、該ポリシロキサンの少なくとも一部に化学的に結合したシリカ粒子を含んでいる請求項１または２記載の感光性シロキサン組成物。 The photosensitive siloxane composition according to claim 1 or 2, wherein (a) the polysiloxane is a copolymer and contains silica particles chemically bonded to at least a part of the polysiloxane. 請求項１〜３のいずれか記載の感光性シロキサン組成物から形成された硬化膜。 The cured film formed from the photosensitive siloxane composition in any one of Claims 1-3. 請求項４記載の硬化膜を具備する素子。 An element comprising the cured film according to claim 4. 請求項１〜３のいずれかに記載の感光性シロキサン組成物を基板上に塗布後、プリベークを行い、プリベーク後の膜にパターニング露光を行い、次いで０．４％水酸化テトラメチルアンモニウム水溶液または０．０４％水酸化カリウム水溶液で現像を行うパターン形成方法。A photosensitive siloxane composition according to any one of claims 1 to 3 is applied on a substrate, pre-baked, and the pre-baked film is subjected to patterning exposure, and then a 0.4% tetramethylammonium hydroxide aqueous solution or 0 A pattern forming method in which development is performed with a 04% aqueous potassium hydroxide solution.
JP2006289641A 2006-10-25 2006-10-25 Photosensitive siloxane composition, cured film formed therefrom, element having cured film, and pattern forming method Active JP4853228B2 (en)

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JP2006289641A JP4853228B2 (en) 2006-10-25 2006-10-25 Photosensitive siloxane composition, cured film formed therefrom, element having cured film, and pattern forming method

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JP2006289641A JP4853228B2 (en) 2006-10-25 2006-10-25 Photosensitive siloxane composition, cured film formed therefrom, element having cured film, and pattern forming method

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JP2008107529A JP2008107529A (en) 2008-05-08
JP2008107529A5 true JP2008107529A5 (en) 2009-12-10
JP4853228B2 JP4853228B2 (en) 2012-01-11

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JP2001033926A (en) * 1999-07-15 2001-02-09 Fuji Photo Film Co Ltd Image forming device
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JP5771905B2 (en) * 2010-05-12 2015-09-02 Jsr株式会社 Radiation-sensitive resin composition for immersion exposure, cured pattern forming method and cured pattern
TWI432895B (en) * 2010-12-01 2014-04-01 Chi Mei Corp Photo-sensitive polysiloxane composition and protecting film formed therefrom
TWI428698B (en) * 2011-11-25 2014-03-01 Chi Mei Corp Photosensitive resin composition, black matrix, color filter and liquid crystal display element
TWI428699B (en) * 2011-12-01 2014-03-01 Chi Mei Corp Photo-curing polysiloxane composition and protecting film and element containing said protecting film
EP2799928B1 (en) 2011-12-26 2019-05-22 Toray Industries, Inc. Photosensitive resin composition and process for producing semiconductor element
TWI459051B (en) * 2012-03-01 2014-11-01 Chi Mei Corp Photosensitive resin composition, black matrix, color filter and liquid crystal display element
TWI477914B (en) * 2012-03-29 2015-03-21 Chi Mei Corp Photo-curing polysiloxane composition and protecting film and element containing said protecting film
TWI446111B (en) * 2012-04-20 2014-07-21 Chi Mei Corp Photosensitive resin composition,black matrix,color filter and liquid crystal display element
TWI443465B (en) * 2012-04-23 2014-07-01 Chi Mei Corp Photo-curing polysiloxane composition, protecting film and element containing said protecting film
TWI459137B (en) * 2012-05-10 2014-11-01 Chi Mei Corp Photosensitive resin composition for color filters and uses thereof
JP5505569B1 (en) * 2012-12-11 2014-05-28 東レ株式会社 Thermosetting coloring composition and cured film, touch panel provided with the cured film, and method for producing touch panel using the thermosetting coloring composition
JP6115115B2 (en) * 2012-12-18 2017-04-19 東レ株式会社 Positive photosensitive resin composition, method for producing cured pattern using the same, method for producing convex pattern substrate, and method for producing light-emitting element
TWI479269B (en) 2012-12-25 2015-04-01 Chi Mei Corp Photosensitive polysiloxane composition and uses thereof
CN105359037B (en) * 2013-07-02 2020-02-28 东丽株式会社 Positive photosensitive resin composition, cured film obtained by curing same, and optical device provided with same
TWI490653B (en) * 2013-09-10 2015-07-01 Chi Mei Corp Positive photosensitive resin composition and method for forming patterns by using the same
JPWO2015137281A1 (en) * 2014-03-14 2017-04-06 東レ株式会社 Photosensitive resin composition
KR20160136303A (en) * 2014-03-26 2016-11-29 도레이 카부시키가이샤 Method for manufacturing semiconductor device and semiconductor device
TWI629312B (en) * 2014-03-28 2018-07-11 奇美實業股份有限公司 Curing resin composition and uses thereof
JP2016121311A (en) * 2014-12-25 2016-07-07 Jsr株式会社 Cured film-forming composition, cured film, display element and method for forming cured film
TWI630458B (en) 2015-12-14 2018-07-21 奇美實業股份有限公司 Photosensitive resin composition, protection film, and liquid crystal display device
JP6332573B1 (en) * 2016-11-22 2018-05-30 東レ株式会社 FIELD EFFECT TRANSISTOR, MANUFACTURING METHOD THEREOF, RADIO COMMUNICATION DEVICE USING THE SAME, AND PRODUCT TAG
TW201940553A (en) * 2018-02-08 2019-10-16 日商日產化學股份有限公司 Photosensitive resin composition

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JPH03100553A (en) * 1989-09-14 1991-04-25 Nippon Telegr & Teleph Corp <Ntt> Resist material and photosensitive resin composition
JPH03288857A (en) * 1990-04-06 1991-12-19 Nippon Telegr & Teleph Corp <Ntt> Resist material and photosensitive resin composition
JP4784283B2 (en) * 2004-11-26 2011-10-05 東レ株式会社 Positive photosensitive siloxane composition, cured film formed therefrom, and device having cured film

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