JP2008098261A - Wiring board connector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connector for wiring board which is capable of narrowing the pitch of conductor wiring and forming a small-size connecting unit and is provided with repairing property. <P>SOLUTION: The first connecting unit of a first wiring board, to which a part of a plurality of conductor wirings is connected, and a second connecting unit of a second wiring board, to which a part of a plurality of conductor wirings is connected, are connected to this wiring board connector. In this case, a plurality of conductive fine protuberances 16 are provided on the surface of the first connecting unit and fine structures 17, engaged by hooking to the conductive fine protuberances 16, are provided on the surface of the second connecting unit. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a connection structure for a wiring board used as a component of an electronic device.

  In recent years, printed circuit boards are often used with downsizing and higher performance of electronic devices. In particular, flexible printed wiring boards are widely used for applications such as wiring to movable parts of electronic devices. Further, in such an electronic device, a wiring state that can be accommodated in a small device is realized by connecting a plurality of printed wiring boards.

  As a connection structure of a printed wiring board, for example, JP 2003-101167 A (Patent Document 1) discloses a connection structure using a connector. Specifically, a printed wiring board is disclosed in which a connector connection portion is formed at an end portion, and a connection terminal is formed on a conductor circuit layer whose surface is exposed in the connector connection portion. A plurality of printed wiring boards are connected by inserting the connection terminals into connector insertion openings formed in the connector.

As another printed wiring board connection structure, Japanese Patent Laid-Open No. 2000-58996 (Patent Document 2) discloses a structure in which a plurality of printed wiring boards are connected using an anisotropic conductive adhesive. Yes. Specifically, the bumps made of metal provided on the first printed wiring board and the connection pads provided on the second printed wiring are electrically connected via the anisotropic conductive adhesive. Thus, the first and second printed wiring boards are connected.
JP 2003-101167 A JP 2000-58996 A

  Along with the recent high density mounting, the pitch of the conductor wiring constituting the connecting portion formed on the wiring board is becoming finer and narrower. Therefore, when connecting the wiring boards, it is necessary to securely connect the conductor wirings (for example, the conductor wiring having a minimum pitch of 200 μm or less) formed at a fine pitch on the wiring boards.

  However, in the connection using the connector described in Patent Document 1, it is necessary to provide a connector having a thickness of about several millimeters in order to connect the wiring board, so that it is difficult to cope with downsizing of electronic devices.

  Further, in the connection by the bump described in Patent Document 2, the thickness of the connection portion of the first and second wiring boards is increased due to the thickness of the bump, and there is a problem that it is difficult to cope with downsizing of the electronic device. is there.

  Furthermore, since it uses an adhesive, once it is connected, it has poor detachability. Therefore, in the connection work, it is difficult to peel and reconnect (so-called repair) the connection part once connected for reasons such as misalignment without breaking or damaging it.

  Therefore, the present invention has been made in view of the above-mentioned problems, and can provide a connection body for a wiring board that can cope with finer pitches of conductor wiring, forms a small connection portion, and has detachability. Objective.

  A wiring board assembly according to the present invention includes a first wiring portion of a first wiring board having a part of a plurality of conductor wirings as a connection part and a second wiring having a part of the plurality of conductor wirings as a connection part. In the wiring board connection body connected to the second connection portion of the board, the surface of the first connection portion has a plurality of conductive fine protrusions, and the surface of the second connection portion has the conductive fineness. It has a fine structure that engages by being caught by a protrusion.

  Preferably, the fine structure of the second connection portion is composed of a plurality of conductive loop-shaped protrusions.

  As another wiring board connector, the fine structure of the second connecting portion has a network structure.

  According to the present invention, it is possible to realize a wiring board connector having a small connecting portion and having detachability.

(First embodiment)
Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the present embodiment, examples of the member to be joined include a printed wiring board having a first connection portion formed on a rigid substrate and a printed wiring board having a second connection portion formed on a flexible substrate. Will be described.

  FIG. 1 is a schematic cross-sectional schematic view of a connection portion for explaining a wiring board connector in an embodiment of the present invention.

  As shown in FIG. 1, in the present embodiment, the first wiring board 10 has a first connection portion 12 formed on a rigid substrate 11. The second wiring board 13 is obtained by forming a second connection portion 15 on a flexible substrate 14. The surface of the first connection portion 12 has a structure having a plurality of conductive fine protrusions 16. On the other hand, the surface of the second connecting portion 15 has a fine structure 17 (represented by a loop shape in FIG. 1) that catches and engages with the fine protrusion 16.

  As shown in FIG. 1, if a surface of one connecting portion has a structure having fine protrusions and a surface of another connecting portion is caught and engaged, a so-called magic tape (registered trademark) is obtained. ) -Like joints can be realized between connecting parts. That is, the structure is not limited to the hook-shaped protrusion and the loop-shaped structure illustrated in the present example, and a known structure recognized for a hook-and-loop fastener called Velcro (registered trademark) or the like is applicable. Therefore, a structure in which hooks and loops are mixed on both sides is also included.

  Thus, since the connection part itself has a joining function, a connector and an adhesive agent are unnecessary and it becomes a connection body of a small structure. Furthermore, since the joining function exists only in the connection part, the connection parts are reliably joined together. For this reason, even in a fine pitch, it is possible to prevent a connection in a deviated state in which there is no connection portion facing each other. Further, when the fine protrusion is made of an elastic body, the catch can be released by applying a certain large force. After the release, the projection returns to its original state, and can be connected again. That is, it is possible to attach and detach without destroying the connection portion.

  When detachability is not so necessary and strong bonding is required, when the action of the present invention is mainly used to prevent deviation, it is used in combination with an adhesive or a reinforcing jig for mechanical bonding to bond the connection parts. You may help. Furthermore, it is also possible to use the joint of the present invention as a detachable temporary fix and connect it permanently with an adhesive or the like.

  FIG. 2 is a schematic top view of a first printed wiring board used in the present invention, in which a first connection portion is provided on a rigid board. As shown in FIG. 2, the first wiring board 10 is provided with a plurality of (in this embodiment, four) conductor wirings 22 on one side of a rigid base material 21 formed of a glass base material or the like. It has been. A part of the conductor wiring 22 constitutes the first connection portion 12. On the surface of the first connection portion 12, a fine protrusion 16 having a shape that is caught by the second connection portion surface structure is disposed.

  FIG. 3 is a diagram schematically showing the shape of the fine protrusions. FIG. 3A shows a case where the tip is hooked. FIG. 3B shows a case where the tip is bumped. However, the present invention is not limited to the above as long as the shape has a catching portion.

  FIG. 4 is a schematic top view of a second wiring board used in the present invention, in which a second connection portion is provided on a flexible substrate. As shown in FIG. 4, the second wiring board 13 includes a plurality of (in this embodiment, four) conductor wirings 22 on one side of a flexible substrate 41 formed of a flexible resin film. Is provided. A part of the conductor wiring 22 constitutes the second connection portion 15. On the surface of the second connection portion 15, a fine structure 17, for example, a plurality of loop-shaped protrusions, is provided that catches and engages with the fine protrusion 16.

  As a resin film which comprises the flexible base material 41, what consists of a resin material excellent in the softness | flexibility is used. As such a resin film, for example, any resin film that is versatile for flexible wiring boards, such as a polyester film, can be used. In addition, it is particularly preferable that the resin film has high heat resistance in addition to flexibility, and examples of the resin film include polyamide resin films, polyimide resin films such as polyimide and polyamideimide, and polyethylene. Naphthalate is preferably used.

  As the size of the first connection portion 12 and the second connection portion 15, typically, those having a width W of 50 μm to 300 μm, a length L of 500 μm to 1000 μm, and a height of 10 μm to 100 μm are used. Depending on the material, part of the conductor wiring itself may be used as the connection part. For example, a noble metal material is attached as a foil, or deposited as a layer by plating or vapor deposition, and the structure of the connection part It may be an element.

  A manufacturing example of the connection portion surface structure will be described below. FIG. 5 is a diagram schematically showing the manufacturing flow of the surface structure. (a) A metal layer 51 of about 10 μm to 50 μm is deposited on the surface of the connection part (12, 15) by a plating method or the like. (B) An etching process is performed on this so that a plurality of needle-like bodies 52 made of deposited metal material are standing. (C) Heat is applied from above the needle-like body using a heat source 53 such as a soldering iron. The needle-like body 52 curls due to the effect of heat. (D) If the heating time is short, the needle-like body curls loosely and becomes a hook-like fine protrusion 54. Further, when only the tip portion is strongly curled, a bump-shaped fine protrusion 55 is formed. This state is adopted as the surface structure of the first connection portion. (E) When the heating time is increased, stronger curling occurs and the loop-shaped fine protrusion 56 is formed. This state is used as the surface structure of the second connection portion.

  FIG. 6 is a diagram schematically showing an engagement state of the connection portion in the first embodiment. The hook-shaped fine protrusion 54 or bump-shaped fine protrusion 55 positioned on the surface of the first connection portion 12 and the loop-shaped fine structure 56 positioned on the surface of the second connection portion 15 are caught and joined.

  As described above, hook-shaped or bump-shaped protrusions are provided on the surface of the first connecting portion, and loop-shaped protrusions are provided on the surface of the second connecting portion. If these connecting portions are opposed to each other and a force is applied so that the connecting portions are pressure-bonded, the connecting portions can be joined with Velcro (registered trademark) -like effect. Since the fine protrusions on the surface of each connection portion have conductivity, low resistance electrical bonding between the connection portions can be realized.

(Second Embodiment)
Next, a second embodiment of the present invention will be described. Similarly to the first embodiment, the second embodiment also has a printed wiring board having a first connection portion formed on a rigid board and a second board formed on a flexible board as members to be joined. A printed wiring board having a connecting portion will be described as an example.

  FIG. 7 is a schematic cross-sectional schematic diagram for explaining a wiring board connector according to a second embodiment of the present invention. A first connection portion 12 is formed on the rigid substrate 11, and the surface of the first connection portion 12 has a plurality of hook-like fine protrusions 54 or bump-like fine protrusions having conductivity as in the first embodiment. The structure has 55. On the other hand, a second connection portion 15 is formed on the flexible substrate 14, and a network structure layer 71 is provided on the surface of the second connection portion 15.

  Here, the network structure layer will be described. FIG. 8 is a schematic top view (a) and a schematic side view (b) of the network structure layer. The network structure is configured by stacking fine fibrous materials 81 randomly with gaps. Since the fibrous materials are stacked with gaps, a three-dimensional porous structure is obtained.

  FIG. 9 is a schematic cross-sectional view illustrating a connecting portion according to the second embodiment of the present invention. A hook-like fine protrusion 54 or a bump-like fine protrusion 55 located on the surface of the first connection portion 12 is formed into a mesh-like structure from any hole on the surface of the network-like structure layer 71 arranged on the surface of the second connection portion 14. It is inserted into the layer 71 and engaged by being caught on any fibrous material 81 of the network structure layer 71.

  As the base material for the network structure layer, a porous resin material having a thickness of about 10 μm to 50 μm is used. Since it is a resin material, it has elasticity. Electroless plating is applied to the porous resin substrate, and a conductive metal component is adhered to the surface of the fibrous material. Since the fibrous material is coated with the conductive metal component, the network structure layer has a good conductivity as a whole. The network structure layer is bonded to the surface of the second connection portion by using solder, a conductive adhesive, a thermal atomic diffusion method (diffusion bonding), or the like.

  As described above, hook-shaped or bump-shaped protrusions are provided on the surface of the first connection portion, and a network structure is provided on the surface of the second connection portion. If these connecting portions are opposed to each other and a force is applied so that the connecting portions are pressure-bonded, the connecting portions can be joined with Velcro (registered trademark) -like effect. Since the fine protrusions on the surface of the first connection portion and the second surface mesh structure layer of the second connection portion have conductivity, low resistance electrical connection between the connection portions can be realized.

  Since the network structure layer of the second connection portion is elastic, the network structure layer is deformed so as to absorb the variation in height of the connection portion, and the electrical connection of each connection portion is ensured. To be done.

  In the above embodiment, an example in which a rigid printed wiring board is used as the first wiring board and a flexible printed wiring board is used as the second wiring board has been described. However, the first wiring board of the present invention is a rigid print wiring board. Not only a wiring board but a flexible printed wiring board may be sufficient. Conversely, the second wiring board may be a rigid wiring board. Some flexible wiring boards are called flexible flat cables, and the present invention can be used to connect various combinations of these various wiring boards.

  The embodiment disclosed above should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above embodiments and examples but by the scope of claims, and is intended to include all modifications and variations within the meaning and scope equivalent to the scope of claims. .

It is a schematic cross-sectional schematic diagram of the connection part for demonstrating the wiring board connection body in embodiment of this invention. It is an upper surface schematic diagram of the 1st wiring board by which the 1st connection part was provided on the rigid board | substrate used for this invention. It is the figure which represented the shape of the fine protrusion typically. It is an upper surface schematic diagram of the 2nd wiring board by which the 2nd connection part was provided on the flexible substrate used for this invention. It is the figure which represented the manufacturing flow of the surface structure typically. It is the figure which represented typically the engagement state of the connection part in 1st Embodiment. It is a schematic cross-sectional schematic diagram explaining the wiring board connector concerning the 2nd Embodiment of this invention. FIG. 8 is a schematic top view (a) and a schematic side view (b) of the network structure layer. It is a schematic cross-sectional schematic diagram explaining the connection part concerning the 2nd Embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 1st wiring board, 11 rigid board | substrate, 12 1st connection part, 13 2nd wiring board, 14 flexible substrate, 15 2nd connection part, 16 electroconductive fine protrusion, 17 caught by fine protrusion 16 Microstructure, 21 Rigid base material, 22 Conductor wiring, 41 Flexible base material, 51 Metal layer, 52 Needle-like body, 53 Heat source, 54 Hook-like fine protrusion, 55 Bump-like fine protrusion, 56 Loop-like fine protrusion, 71 network structure layer, 81 fibrous material

Claims (3)

The first connection part of the first wiring board having a part of the plurality of conductor wirings as a connection part is connected to the second connection part of the second wiring board having a part of the plurality of conductor wirings as a connection part. In the printed wiring board connector,
The surface of the first connection part is provided with a plurality of conductive fine protrusions, and the surface of the second connection part is provided with a fine structure that is engaged by being caught by the conductive fine protrusions. Wiring board connector.   The wiring board connector according to claim 1, wherein the fine structure of the second connection portion is composed of a plurality of conductive loop-shaped protrusions.   The wiring board connector according to claim 1, wherein the fine structure of the second connection portion has a network structure.

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