JP2008091553A - Circuit board and its manufacturing method, and semiconductor device and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent excessive load on a solder and carry out soldering in good condition in a process of soldering an electronic component to a circuit board. <P>SOLUTION: Soldering lands for mounting a BGA package includes normal lands 1 and special lands 2 which are formed on a substrate main body 20. The substrate main body 20 has a concave portion 5. The normal lands 1 consist of conductive members 3 formed at predetermined portions on a mounting surface P of the substrate main body 20 except for the concave portion 5, while the special lands 2 consist of conductive members 3 formed on the bottom of the concave portion 5. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a circuit board having a solder mounting process compensation function applicable to a printed circuit board on which electronic parts such as BGA (Ball Grid Array) package LSI (Large Scale Integration) are mounted, a manufacturing method thereof, and a semiconductor device And a manufacturing method thereof.

  Specifically, the conductive part for soldering for mounting the electronic component is composed of a conductive part for solder dropping and a conductive part for solder leveling, so that the electronic part is soldered to the circuit board. In this process, when the board of the electronic component is bent, a part of the solder mounted on the electronic component is dropped into the conductive part for solder dropping so that the solder is not overloaded, and the proximity solder It is intended to avoid contact with the

  In recent years, when an electronic component such as a BGA package LSI is mounted on a printed circuit board, it is often soldered by reflow processing. FIG. 10A is a view of a part of the BGA package 6 and the substrate (printed circuit board) 50 according to the first conventional example as viewed from above. In the BGA package 6 shown in FIG. 10A, solder balls 7 are provided in advance on the bare chip 9 and the electrodes of the BGA package 6. The solder ball 7 is in contact with the normal land 1 of the substrate 50. FIG. 10B is a side view of the state in which the solder ball 7 shown in FIG. 10A is in contact.

  The solder ball 7 is heated and melted by hot air or the like in a reflow furnace in a state where the solder ball 7 is normally in contact with the land 1. FIG. 11A shows the BGA package 6 fixed to the substrate 50 by melting and press-bonding the solder balls 7. For example, all the solder balls 7 shown in FIG. 11A are melted and compressed to be uniformly deformed into a disk shape and fixed to the normal land 1. In this manner, the semiconductor device 51 is manufactured by mounting the BGA package 6 on the substrate 50.

  However, as shown in FIG. 11B, the BGA package 6 may be bent into a dome shape by heat heated in the reflow furnace. This is because the BGA package 6 is composed of a silicon chip, an organic interposer (resin + glass cloth), a sealing resin, and the like, and a certain degree of curvature is generated due to a difference in thermal expansion during reflow heating. The curved BGA package 6 causes a phenomenon that particularly the solder balls 7 in the peripheral portion are excessively crushed and adjacent solder balls (for example, the solder balls 7a and 7b) contact (bridge).

  FIG. 12A is a side view of part of a configuration example of the BGA package 6 ′ and the substrate 50 according to the second conventional example. A resin core ball 60 mounted in advance on the electrode of the BGA package 6 ′ shown in FIG. 12A is in contact with the normal land 1 of the substrate 50. FIG. 12C is a cross-sectional view illustrating a configuration example of the resin core ball 60. A resin core ball 60 shown in FIG. 12C includes a solder 61, a conductive layer 62, and a resin core 63. The resin core ball 60 has a spherical resin core 63 as a center, and the peripheral surface of the resin core 63 is covered with a conductive layer 62, and the conductive layer 62 is covered with a solder 61. The resin core 63 is made of a highly infusible material such as resin or refractory metal. As a result, the resin core ball 60 is not crushed by the BGA package 6 ′ during the reflow process and deformed into a disk shape.

  However, as shown in FIG. 12B, when the BGA package 6 'is bent into a dome shape due to the difference in thermal expansion due to the heat heated in the reflow furnace, the BGA package 6' curved in the dome shape is used for the normal land 1. A phenomenon occurs in which the resin core ball 60 in the contacted central portion is pulled in the anti-vertical direction and an unbonded area remains.

  In connection with such a conventional example, Patent Document 1 discloses a method for connecting bumps of a package to a circuit board. According to this method, the cream solder is formed on the bump connection pads on the circuit board to be connected by printing, and once dried, the cream solder is solidified, and the cream solder is further solidified on the solidified cream solder. Solder is printed and cream solder is laminated, and the package is bump-connected to the cream solder printed on the top by reflow. As a result, when the circuit board or the package itself is curved, the bumps that have been overloaded are embedded in the laminated cream solder, so that all the bumps can be securely connected.

  Patent Document 2 discloses an electrical component mounting module and a manufacturing method thereof. According to this electrical component mounting module, a recess having a wiring pattern is provided on the surface of an electrically insulating substrate on which the electrical component is mounted, and the mounting surface of the electrical component is electrically insulated from the recess through the solder. The electrical component is mounted on the electrically insulating substrate in a state where the substrate is applied to the surface of the substrate. As a result, it is possible to eliminate solder connection failure and short circuit caused by the solder entering under the mounting surface of the electrical component.

JP-A-6-224550 (page 3, FIG. 1) Japanese Patent Laying-Open No. 2005-51204 (page 8, FIG. 1)

  By the way, according to the method of connecting the bumps according to the first conventional example and Patent Document 1 to the circuit board, the cream solder is further printed on the solidified cream solder, the cream solder is laminated, and the package is reflowed. Bump connection by. However, when the package is bent in the process of soldering the package to the circuit board, the package may be connected to the circuit board while being displaced because the cream solder is laminated. In particular, in the case of a large package, the curvature becomes prominent and the weight increases due to the increase in the size of the package.

  Moreover, according to the electrical component mounting module according to Patent Document 2, the electrical component is mounted on the electrically insulating base material via the solder in the recess where the wiring pattern is formed. However, in the process of soldering the electronic component to the electrically insulating base material, if the substrate of the electronic component is curved, an excessive load is applied to the solder, and the solder applied to the recesses may overflow and bridge the adjacent solder. is there.

  Further, according to the resin core ball 60 according to the second conventional example, the resin core ball 60 has the spherical resin core 63 as the center, and the peripheral surface of the resin core 63 is covered with the conductive layer 62. The conductive layer 62 is formed so as to be covered with the solder 61. However, an excessive load is applied to the resin core ball 60 in the peripheral portion of the BGA package 6 ′, and the resin core ball 60 in the central portion is pulled away from the normal land 1 of the substrate 50, leaving an unbonded area. (Open / tempura is bad). That is, since the amount of solder at the joint portion is reduced, the self-alignment effect and the sinking behavior following the warping of the package and the circuit board are reduced, so that there is a possibility that the position shift and the above-described open / tempering defect may occur.

  Therefore, the present invention solves the problems related to the conventional example, and in the process of soldering the electronic component to the circuit board, the solder is not overloaded and the soldering is improved. It is an object of the present invention to provide a circuit board and a method for manufacturing the same, a semiconductor device and a method for manufacturing the same.

  In order to solve the above-described problem, the circuit board according to claim 1 according to the present invention includes a board main body, and a conductive portion for soldering for mounting electronic components formed on the board main body, The conductive part is composed of a conductive part for solder leveling and a conductive part for solder dropping.

  According to the circuit board according to the present invention, the conductive part for soldering for mounting the electronic component is composed of the conductive part for solder leveling and the conductive part for solder dropping. For example, the board body has a plurality of recesses, and the conductive part for solder leveling has a conductive member formed at a predetermined position on the electronic component mounting surface other than the recesses of the board body. The conductive part is formed by forming a conductive member at a predetermined position of the recess. As a result, in the process of soldering the electronic component to the circuit board, when the electronic component is bent, a part of the solder mounted on the electronic component is dropped into the concave portion of the conductive part for solder dropping, and is applied to the solder. You can avoid overloading.

  In order to solve the above-described problem, the method of manufacturing a circuit board according to claim 4 according to the present invention, on the other hand, forms a conductive member for soldering on the first board, and the first board Forming a plurality of openings at predetermined positions on the substrate; on the other hand, forming a conductive member for soldering on the second substrate; and each of the openings of the first substrate And a step of laminating and bonding the first substrate and the second substrate so as to align the conductive members of the second substrate.

  In order to solve the above-described problem, the semiconductor device according to claim 5 according to the present invention includes a substrate body, a conductive portion for solder dropping and a conductive portion for solder leveling provided on the substrate body. A solder chip for connecting the conductive part for solder dropping and the conductive part for solder leveling to a semiconductor chip in which a lead electrode is joined by solder, and for connecting the conductive part for solder dropping and the semiconductor chip. Is characterized in that, during the soldering process, a part of the solder falls into the conductive part for dropping the solder.

  In order to solve the above-described problem, a method of manufacturing a semiconductor device according to claim 6 according to the present invention, on the other hand, forms a conductive member for soldering on a first substrate, and Forming a plurality of openings at predetermined positions on the substrate; on the other hand, forming a conductive member for soldering on the second substrate; and each of the openings of the first substrate Laminating and bonding the first substrate and the second substrate so as to align the conductive member of the second substrate, and the conductive member and other conductive members aligned in the opening And a step of mounting the semiconductor chip by soldering.

  According to the circuit board and the manufacturing method thereof according to the present invention, the conductive part for soldering for mounting the electronic component is composed of the conductive part for solder leveling and the conductive part for solder dropping. Is.

  With this configuration, when the electronic component is bent in the process of soldering the electronic component to the circuit board, a part of the solder mounted on the electronic component is dropped into the conductive part for solder dropping, and the solder is excessive. Can be avoided. Therefore, it becomes possible to avoid contact of close solder. As a result, a high-quality circuit board can be provided.

  According to the semiconductor device and the method for manufacturing the same according to the present invention, the solder connecting the conductive part for solder dropping and the semiconductor chip has a part of the solder in the conductive part for solder dropping during the soldering process. It has a depressed shape. With this configuration, it is possible to take a structure in which an excessive load applied to the solder is released to avoid contact with adjacent solder. As a result, a high-quality semiconductor device can be provided.

  Hereinafter, embodiments of a circuit board and a manufacturing method thereof, and a semiconductor device and a manufacturing method thereof according to the present invention will be described with reference to the drawings.

  FIG. 1 is a top view of partial crushing showing a configuration example of a substrate 100 as a first embodiment. A substrate 100 shown in FIG. 1 constitutes an example of a circuit board, and includes a normal land 1, a special land 2, and a substrate body 20.

  Usually, the land 1 constitutes an example of a conductive part for solder leveling, and is provided on the flat surface of the substrate 100 for soldering. The special land 2 constitutes an example of a conductive part for solder dropping, and soldering is performed in a hole (hole) provided at a predetermined position of the substrate 100. The normal land 1 and the special land 2 are formed in a lattice arrangement (grid array) shape on the substrate body (substrate body) 20. This lattice arrangement shape is divided into a central region R1 and a peripheral region R2. The central portion R1 is a range surrounded by a one-dot chain line in the figure, and is located at the center of the lattice shape. The peripheral portion R2 is a range surrounded by a one-dot chain line and a two-dot chain line, and is located around the lattice shape.

  In this example, 36 normal lands 1 are formed in the central region R1, and 64 special lands 2 are formed in the peripheral region R2. Usually, the land 1 and the special land 2 are circular, and are used for soldering when mounting an electronic component such as a BGA package LSI. The normal land 1 and the special land 2 are formed of a metal material such as copper having excellent conductivity. In addition, you may use silver etc. not only in this. Thus, the normal land 1 and the special land 2 are formed on the substrate body 20.

  FIG. 2 is a partially broken sectional view showing a configuration example of the substrate 100. The substrate 100 shown in FIG. 2 is a cut surface taken along the line XX shown in FIG. The substrate body 20 has a recess 5. In the normal land 1, the conductive member 3 is formed on the mounting surface P of the electronic component of the substrate body 20. The special land 2 has a conductive member 3 formed on the bottom surface of the recess 5. In this example, the depth of the recess 5 is about 30 μm to 60 μm. When the thickness of the conductive member 3 is about 10 μm, the distance L between the conductive member 3 formed on the bottom surface of the recess 5 and the mounting surface P is about 20 μm to 50 μm. Within this distance L, solder falls into the recess 5.

  Thus, in the process of soldering the BGA package LSI or the like to the substrate 100, when the package is bent into a dome shape by reflow heat, a part of the solder of the package joined to the special land 2 is within the range of the distance L. Can be dropped into the recess 5 to prevent excessive load on the solder. Accordingly, since the solder is not crushed, the contact (bridge) of the adjacent solder can be avoided.

  3A to 3C are process diagrams showing a manufacturing example of the substrate 100, and FIG. 3C is the same as the cut surface of the substrate 100 shown in FIG. In the manufacturing method of the substrate 100, the conductive member 3 is formed on the substrate body 20a on the one hand, and the conductive member 3 is formed on the substrate body 20b on the other hand. For example, the pattern of the conductive member 3 is formed on the substrate body 20a shown in FIG. 3A and etching is performed to form the conductive member 3, and the pattern of the conductive member 3 is formed on the substrate body 20b and etched. Thus, the conductive member 3 is formed.

  After forming the conductive member 3, a plurality of openings 8 are formed at predetermined positions of the substrate body 20a. For example, 64 openings 8 are formed in the peripheral region R2 of the substrate body 20a shown in FIG. 3B. The shape of the opening 8 is slightly larger than the circular conductive member 3.

  After the opening 8 is formed, the substrate body 20a and the substrate body 20b are laminated and joined so that the conductive member 3 of the substrate body 20b is aligned with each of the openings 8 of the substrate body 20a. For example, an adhesive is applied to the surface of the substrate body 20b, and the surface of the substrate body 20b to which the adhesive has been applied and the back surface of the substrate body 20a are stacked and pressed to join. After the bonding, the recess 5 shown in FIG. 3C is formed by the opening 8 and the bonding surface of the substrate body 20 b, and the conductive member 3 is aligned with the bottom surface of the recess 5. Thereby, the special land 2 having the recess 5 and the conductive member 3 and the normal land 1 having the conductive member 3 are obtained.

  As described above, according to the substrate 100 and the manufacturing method thereof according to the first embodiment of the present invention, the soldering land for mounting the BGA package 6 is normally formed on the substrate body 20. A land 1 and a special land 2 are included. In this example, the normal land 1 is one in which the conductive member 3 is formed on the mounting surface P of the central portion R1 of the substrate body 20, and the special land 2 is provided in the peripheral portion R2 of the substrate body 20. The conductive member 3 is formed on the bottom surface of the recess 5.

  Therefore, in the process of soldering the BGA package 6 to the substrate 100, when the BGA package 6 is curved in a dome shape, a part of the solder ball 7 to be joined to the special land 2 is dropped into the concave portion 5 of the special land 2. Can do. Thereby, it is possible to prevent an excessive load from being applied to the solder ball 7. Therefore, it becomes possible to avoid the proximity solder from being crushed and bridged. As a result, a high-quality substrate 100 can be manufactured.

  Next, a process for manufacturing a semiconductor device by mounting a BGA package (semiconductor chip) on the substrate 100 will be described. 4A to 4C are process diagrams showing an example of printing the solder paste 10 on the substrate 100. FIG. In this example, an automatic mounting machine (not shown) constituted by arranging a large number of machines in charge of a series of processes such as component mounting and soldering in series is used. The solder paste is filled using a stencil printing method, a dispensing method, or the like. The solder paste is composed, for example, of metal powder and flux at a volume ratio of about 1: 1.

  As the conditions for printing the solder paste 10 on the substrate 100 by using the above-described automatic mounting machine, the solder paste filling method, etc., the screen 90 having a portion where the solder paste 10 is printed is opened by the automatic mounting machine. It is mounted so as to overlap the substrate 100 shown in FIG. 4A. Here, the printing openings of the screen 90 are portions corresponding to the normal land 1 and the special land 2.

  The solder paste 10 is poured on the substrate 100 on which the screen 90 is mounted and rubbed with the squeegee 11 shown in FIG. 4B. Thereby, the solder paste 10 is filled in the substrate 100. After filling, the automatic mounting machine removes the screen 90 from the substrate 100. Thereby, the solder paste 10 is printed on the normal land 1 and the special land 2 shown in FIG. 4C. In this case, the special land 2 is filled with the solder paste 10 in the recesses 5 and is also filled in the openings of the screen 90. Therefore, the height of the printing surface of the solder paste 10 on the special land 2 and the normal land 1 is increased. Is constant. In this way, the solder paste 10 is printed on the substrate 100.

  5A to 5C are process diagrams showing an example in which the BGA package 6 is mounted on the substrate 100. In this example, solder balls 7 are formed (arranged) in a BGA package 6 in a grid array in advance. Moreover, the substrate 100 on which the solder paste 10 is printed by the method shown in FIGS. Moreover, the automatic mounting machine mentioned above is used.

  With these as mounting conditions, the BGA package 6 is brought into contact with the substrate 100 by an automatic mounting machine. For example, the solder ball 7 of the BGA package 6 is in contact with the normal land 1 and the special land 2 on which the solder paste 10 of the substrate 100 shown in FIG. 5A is printed.

  After the BGA package 6 is brought into contact with the substrate 100, the substrate 100 and the BGA package 6 are fed into the reflow furnace of the automatic mounting machine. After the feeding, the solder paste 10 and the solder balls 7 are heated by hot air or the like in a reflow furnace, and the solder balls 7 are melted following the solder paste 10. For example, the temperature during the reflow process is set to about 200 ° C. to 220 ° C., and the reflow process time is set to about 8 minutes to 12 minutes.

  At this time, as shown in FIG. 5B, when the BGA package 6 is bent into a dome shape by reflow heat, a part of the solder ball 7 a abutting on the special land 2 through the solder paste 10 is It falls into the recess 5. FIG. 5C is an enlarged view of a portion surrounded by a one-dot chain line in FIG. 5B. The solder ball 7 a shown in FIG. 5C falls to about one third of the concave portion 5 of the special land 2.

  As a result, even when the BGA package 6 is curved, the solder ball 7a is not crushed because the solder ball 7a is not excessively loaded. Therefore, the bridge of the solder balls 7a and 7b can be avoided. In addition, since the solder paste 10 is melted and the flux is vaporized and the volume is reduced to about half, the overflowing solder paste does not bridge with the adjacent solder paste.

  In this way, the semiconductor device 40 shown in FIG. 5B is manufactured. This semiconductor device 40 includes a BGA package 6 joined to a normal land 1 and a special land 2 by soldering. The solder that connects the special land 2 and the BGA package 6 has a shape in which a part of the solder falls into the concave portion 5 of the special land 2 during the soldering process.

  According to the semiconductor device 40 and the method for manufacturing the same according to the present invention, since the substrate 100 is applied, it is possible to take a structure in which an excessive load applied to the solder ball is released and the bridge of the adjacent solder is avoided, and the device. You will be able to improve the quality.

  In order to prevent the solder from being crushed, in the package having the resin core ball 60 shown in FIG. 12C instead of the solder ball 7, a part of the solder ball 7 bonded to the special land 2 is formed in the recess 5. Can be dropped. As a result, when the BGA package 6 is curved in a dome shape, the resin core ball 60 in contact with the normal land 1 is not pulled in the anti-vertical direction, so that it does not move away from the normal land 1 and an unbonded area does not occur. .

  Further, when the BGA package 6 tends to be concavely curved, the special land 2 is formed in the central portion R1, and the normal land 1 is formed in the peripheral portion R2, so that the solder ball 7 positioned in the central portion R1 is formed in the special land. 2 starts to fall into the recess 5. As a result, it is possible to prevent an excessive load from being applied to the solder balls 7 and to avoid bridging of adjacent solder.

  FIG. 6 is a top view of partial crushing showing a configuration example of a substrate 200 as the second embodiment. A substrate 200 shown in FIG. 6 includes a normal land 1, a through hole 4, and a substrate body 21. The through hole 4 constitutes an example of a conductive part for solder dropping.

  The normal land 1 and the through hole 4 are formed in a lattice arrangement shape on the substrate body 21. This lattice arrangement shape is divided into a central region R1 and a peripheral region R2. The central portion R1 is a range surrounded by a one-dot chain line in the figure, and is located at the center of the lattice shape. The peripheral portion R2 is a range surrounded by a one-dot chain line and a two-dot chain line, and is located around the lattice shape.

  For example, 36 normal lands 1 are formed in the central region R1, and 64 through holes 4 are formed in the peripheral region R2. Usually, the land 1 and the through hole 4 are used for soldering when mounting an electronic component such as a BGA package LSI. The through hole 4 is formed by plating a metal material such as copper having excellent conductivity. In addition, you may use silver etc. not only in this. As described above, the normal land 1 and the through hole 4 are formed in the substrate main body 21.

  FIG. 7 is a partially broken sectional view showing a configuration example of the substrate 200. The substrate 200 shown in FIG. 7 is a cut surface taken along the arrow YY shown in FIG. The substrate body 21 has a through hole 12, and the through hole 4 is formed by forming the conductive member 3 on the inner peripheral surface of the through hole 12. Thereby, in the process of soldering the BGA package LSI or the like to the substrate 200, when the package is bent in a dome shape by reflow heat, a part of the solder to be soldered to the through hole 4 The through hole 12 falls to a predetermined position.

  As described above, according to the substrate 200 of the second embodiment of the present invention, the soldering lands for mounting the BGA package 6 are formed on the substrate main body 21 with the normal lands 1 and the through lands. It consists of a hole 4.

  Therefore, in the soldering process, a part of the solder ball 7 is dropped into the through hole 4 so that an excessive load is not applied to the solder ball 7. As a result, it is possible to prevent the adjacent solder from being crushed and bridged.

  Next, a process for manufacturing a semiconductor device by mounting a BGA package on the substrate 200 will be described. 8A to 8C are process diagrams showing an example of printing the solder paste 10 on the substrate 200. FIG. In this example, as in the first embodiment, an automatic mounting machine (not shown) configured by arranging a large number of machines responsible for a series of processes such as component mounting and soldering in series is used. The solder paste is filled using a stencil printing method, a dispensing method, or the like. The solder paste is composed, for example, of metal powder and flux at a volume ratio of about 1: 1. The substrate 200 shown in FIG. 8A is the same as the cut surface of the substrate 200 shown in FIG.

  Assuming that the above-described use of the automatic mounting machine and the solder paste filling method are the conditions for printing the solder paste 10 on the substrate 200, the automatic mounting machine is used to display a screen 90 'having a portion where the solder paste 10 is printed. It is mounted on the substrate 200 shown in 8A. Here, the printing opening of the screen 90 ′ is a portion corresponding to the land 1 and the through hole 4.

  After mounting the screen 90 ', the solder paste 10 is filled in the substrate 200 with the squeegee 11 shown in FIG. 8B. After filling, the automatic mounting machine removes the screen 90 ′ from the substrate 200. Thereby, the solder paste 10 is printed on the normal land 1 and the through hole 4 shown in FIG. 8C. In this case, the through hole 4 is filled with the solder paste 10 up to about half of the through hole 12 and is also filled in the opening of the screen 90 '. At this time, the filling amount of the through hole 4 is determined by adjusting the viscosity of the solder paste 10 and the printing pressure, attack angle, speed, etc. of the squeegee 11. For example, when it is desired to fill the through hole 4 with a large amount of solder paste 10, the printing pressure of the squeegee 11 is set high, the attack angle is set small, and the speed is set low. As a result, a large amount of solder paste 10 is filled in the through holes 4 and the heights of the printed surfaces of the special land 2 and the solder paste 10 of the normal land 1 are constant. In this way, the solder paste 10 is printed on the substrate 200.

  9A to 9C are process diagrams showing an example in which the BGA package 6 is mounted on the substrate 200. In this example, solder balls 7 are formed (arranged) in a BGA package 6 in a grid array in advance. Moreover, the substrate 200 on which the solder paste 10 is printed by the method shown in FIGS. Moreover, the automatic mounting machine mentioned above is used.

  With these as mounting conditions, the BGA package 6 is brought into contact with the substrate 200 by an automatic mounting machine. For example, the solder ball 7 of the BGA package 6 is in contact with the normal land 1 and the through hole 4 on which the solder paste 10 of the substrate 200 shown in FIG. 9A is printed.

  After the BGA package 6 is brought into contact with the substrate 200, the substrate 200 and the BGA package 6 are fed into a reflow furnace of an automatic mounting machine. After the feeding, the solder paste 10 and the solder balls 7 of the substrate 200 are heated by hot air or the like in a reflow furnace, and the solder balls 7 are melted following the solder paste 10.

  At this time, as shown in FIG. 9B, when the BGA package 6 is bent into a dome shape due to reflow heat, a part of the solder ball 7 a that is in contact with the through hole 4 through the solder paste 10 penetrates the through hole 4. It falls into the hole 12. FIG. 9C is an enlarged view of a portion surrounded by a one-dot chain line in FIG. 9B. The solder ball 7 a shown in FIG. 9C falls to about one-sixth of the through hole 12 of the through hole 4. Thereby, even when the BGA package 6 is bent by reflow heat, the solder ball 7a is not crushed because the solder ball 7a is not excessively loaded. Therefore, the bridge of the solder balls 7a and 7b can be avoided. In this way, the semiconductor device 41 shown in FIG. 9B is manufactured.

  As described above, according to the semiconductor device 41 and the manufacturing method thereof according to the second embodiment of the present invention, since the substrate 200 is applied, the excessive load applied to the solder ball is released to avoid the proximity solder bridge. As a result, the quality of the apparatus can be improved.

  Since the substrate 200 of the second embodiment does not need to be a multilayer substrate unlike the substrate 100 of the first embodiment, the number of manufacturing steps can be reduced and the manufacturing can be simplified.

  The present invention is suitable for application to a printed circuit board on which an electronic component such as a BGA package LSI is mounted.

It is a top view of partial crushing which shows the example of composition of substrate 100 as the 1st example. 2 is a partially crushed cross-sectional view illustrating a configuration example of a substrate 100. FIG. FIGS. 4A to 4C are process diagrams showing a manufacturing example of the substrate 100. A to C are process diagrams showing an example of printing the solder paste 10 on the substrate 100. FIGS. 4A to 4C are process diagrams showing an example in which the BGA package 6 is mounted on the substrate 100. It is a top view of partial crushing which shows the example of composition of substrate 200 as the 2nd example. It is sectional drawing of partial crushing which shows the structural example of the substrate 200. FIG. A to C are process diagrams showing an example of printing the solder paste 10 on the substrate 200. A to C are process diagrams showing an example of mounting the BGA package 6 on the substrate 200. FIGS. 7A and 7B are explanatory diagrams illustrating configuration examples of the substrate 50 and the BGA package 6 according to the first conventional example. FIGS. A and B are explanatory views showing configuration examples of the substrate 50 and the BGA package 6 after the reflow process. FIGS. 8A to 8C are explanatory views showing configuration examples of a substrate 50 and a BGA package 6 'according to a second conventional example.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Normal land (conductive part for solder flat placement), 2 ... Special land (conductive part for solder dropping), 3 ... Conductive member, 4 ... Through hole, 5 ... Recessed part, 6 ... electronic component (BGA package), 12 ... through hole, 20,21 ... substrate body (substrate body), 40,41 ... semiconductor device, 100,200 ... sub straight

Claims (6)

A substrate body;
A conductive portion for soldering for mounting electronic components formed on the substrate body;
The conductive part is
Conductive parts for solder leveling;
A circuit board comprising a conductive part for solder drop-in. The substrate body has a plurality of recesses or through holes,
The conductive part for solder leveling is:
A conductive member is formed at a predetermined position on the electronic component mounting surface other than the recess or the through hole of the substrate body
The conductive part for solder drop is
The circuit board according to claim 1, wherein a conductive member is formed at a predetermined position of the recess or the through hole. In the case where the conductive part for soldering is formed in a lattice shape,
The conductive part for solder drop is
Peripheral portion of the conductive part for solder leveling that forms the lattice shape,
Alternatively, the circuit board according to claim 1, wherein the circuit board is provided at a central portion surrounded by a conductive portion for solder leveling that forms the lattice shape. On the other hand, forming a conductive member for soldering on the first substrate, and forming a plurality of openings at predetermined positions on the first substrate;
On the other hand, forming a conductive member for soldering on the second substrate;
Stacking and bonding the first substrate and the second substrate so that the conductive member of the second substrate is aligned with each of the openings of the first substrate. A method of manufacturing a circuit board characterized by the above. A substrate body;
Provided in the substrate body, a conductive portion for solder dropping and a conductive portion for solder leveling,
A semiconductor chip in which an extraction electrode is joined by solder to the conductive part for solder dropping and the conductive part for solder flat application,
Solder for connecting the conductive part for dropping solder and the semiconductor chip,
A semiconductor device characterized in that, during a soldering process, a part of the solder falls into the conductive part for solder dropping. On the other hand, forming a conductive member for soldering on the first substrate, and forming a plurality of openings at predetermined positions on the first substrate;
On the other hand, forming a conductive member for soldering on the second substrate;
Stacking and bonding the first substrate and the second substrate so that the conductive member of the second substrate is aligned with each of the openings of the first substrate;
And a step of mounting the semiconductor chip on the conductive member aligned with the opening and the other conductive member by soldering.

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