JP2008085631A - Manufacturing method of vibration reed, vibration reed, and vibrator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enhance the dimensions accuracy of an outer contour of a vibration reed during manufacturing the vibration reed in which a groove part is formed. <P>SOLUTION: This method for manufacturing the vibration reed in which a groove part is formed is a method for forming a metal film on a base and formed an external form and the groove part of the vibration reed by etching the base with the metal film as a mask and is provided with a metal film formation step for forming two metal films to one vibration reed while making the metal films face each other and forming the metal films on the base, wherein outer edge parts of the both metal films correspond to the external shape of the vibration reed and facing inner edge parts respectively correspond to edge parts of the groove part of the vibration reed, and an etching step for using the metal films to perform etching. The etching step includes a first etching step for etching the base by each edge part outside the two facing metal films to form the external form of a vibration reed, and a second step for etching the base by each edge part inside the two facing metal films to form the groove part of the vibration reed. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a vibrating piece, a vibrating piece, and a vibrator.

  As the resonator element, for example, a tuning fork type crystal resonator element is known. FIG. 11 is a diagram showing a configuration example of a tuning fork type crystal vibrating piece. FIG. 11A shows a plan view, and FIG. 11B shows a perspective view of a part of the resonator element.

  The tuning-fork type crystal vibrating piece 100 is configured by projecting a leg portion composed of two vibrating pieces 101 a and 101 b on a base 103. Grooves 102a and 102b are formed in the vibration pieces 101a and 101b, and the cross section is substantially H-shaped. By making the tuning fork type crystal vibrating piece substantially H-shaped, the vibrating piece can be reduced in size, vibration loss can be reduced, and the CI value (crystal impedance or equivalent series resistance) can be reduced.

  For example, Patent Document 1 is known as a forming method in which grooves are formed on both main surfaces of a resonator element and the cross-section of the resonator element is H-shaped. FIG. 12 shows an outline of the process shown in this document.

  In FIG. 12, a metal film 111 is formed on the front and back surfaces of the substrate 110A, a photoresist layer 112 is formed on the metal film 111, and the photoresist layer 112 is patterned to pattern the metal film 111 (FIG. 12). (A)). The pattern of the metal film 111 is designed according to the contour of the vibrator, and the pattern of the photoresist layer 112 is designed according to the groove pattern of the resonator element.

  First, the substrate 110A is etched with a photoresist layer 112 that matches the pattern of the metal film 111, thereby forming the outer contour of the resonator element 110 to form the resonator element 110 (FIG. 12B). 111 is patterned according to the groove pattern (FIG. 12C), and then the substrate 110A is etched according to the groove pattern to form the groove 102 in the vibrating piece 110 (FIG. 12D).

  According to the manufacturing method described above, the dimensional accuracy of the groove formed in the resonator element is excellent. However, when the outer contour of the resonator element and the groove are formed in two stages, the width of the resonator element is smaller than the design value. Patent Document 2 shows that there is a problem that the outer contour of the vibrating piece is different from the design pattern.

  In Patent Document 2, when the metal film is patterned in accordance with the groove pattern, the side etching 113 is likely to occur in the metal film 111, and this side etching 113 is performed in an etching process for forming the groove 114 </ b> C in the vibrating piece 110. Since the outer contour 114A of the resonator element 110 is further etched, the resonator element 110 can be easily thinned (FIG. 12D), the thickness of the resonator element 110 becomes smaller than the design value, and the resonance frequency of the resonator element 110 is reduced. The problem of deviation from the design value was pointed out, and as a result, the deviation of the resonance frequency of the resonator element from the design value may be different for each manufactured vibrator, causing a decrease in manufacturing yield. It points out.

Therefore, Patent Document 2 includes a metal film 111 that forms the first opening 117 on the substrate 110A, and a photoresist film 115 that covers the metal film 111 and the first opening 117 (FIG. 13A). ), (B)), a second opening 118 is provided in the photoresist film 115, and the substrate 110A is etched corresponding to the second opening 118 (first etching step), thereby vibrating piece 110. Next, after removing the photoresist film 115 and etching the resonator element 110 (second etching step), the contour corresponding to the first opening 117 is formed (FIG. 13C). The step of forming the groove 102 (FIG. 13D) is disclosed.
JP 2002-76806 A JP 2004-289217 A

  According to the etching process shown in Patent Document 2 described above, the problem that the dimension of the outer contour of the resonator element deviates from the design value due to the side etching of the metal film is solved, but this problem is solved. Due to the formation accuracy of the photoresist film used to cover the metal film and the first opening, the dimension of the outer contour of the resonator element deviates from the design value, and the dimension of the outer contour of the resonator element deviates from the design value. There is a problem that the problem is not solved sufficiently.

  In Patent Document 2, the dimensional accuracy of the outer contour of the resonator element is greatly influenced by the accuracy of the photoresist film that covers the metal film and the first opening. Usually, since the position where the photoresist film is formed includes an error, it is difficult to match the edge position of the photoresist film with the edge position of the metal film. Therefore, the edge position of the photoresist film is usually formed with a margin more than the edge position of the metal film. FIG. 14A shows the formation state of the photoresist film. The edge position 117 of the photoresist film 115 is formed outside the edge position of the metal film 111. As a result, there is no portion where the photoresist film 115 covers the metal film 111.

  FIG. 14B shows a state where the substrate 110 </ b> A has been etched using the photoresist film 115. The substrate 110A is cut into the vibrating piece 110 by etching. The outer shape of the resonator element 110 is determined by the edge position 117 of the photoresist film 115. Since the edge position 117 of the photoresist film 115 protrudes by Δw outside the edge position of the metal film 111, the dimension of the vibrating piece 110 formed by etching forms an extra photoresist film than the design value. Increased by Δw. Therefore, there is a problem that the problem that the resonance frequency of the resonator element deviates from the design value has not been solved.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-described problems and increase the dimensional accuracy of the outer contour of the resonator element when manufacturing the resonator element in which the groove is formed.

  The present invention is a method of manufacturing a resonator element having a groove portion, in which a metal film is formed on a substrate, and the substrate is etched using the metal film as a mask to form an outer shape and a groove portion of the resonator element.

  The manufacturing method of the present invention is a step of forming two metal films opposite to one vibrating piece, and the outer edges of both metal films correspond to the outer shape of the vibrating piece and face each other. Each of the inner edges includes a metal film forming process for forming a metal film corresponding to the edge of the groove of the resonator element on the substrate, and an etching process for performing etching using the metal film.

  The etching process includes a first etching process in which the substrate is etched by the outer edges of the two opposing metal films to form the outer shape of the resonator element, and the inner edges of the two metal films facing each other. Two steps of a second etching step of forming the groove portion of the resonator element by etching the substrate by the portion are used.

  Both of the first etching step and the second etching step are caused by a dimensional error of the photoresist film because the substrate is etched by the edge portion of the metal film to form the outer shape of the vibrating piece and the groove portion of the vibrating piece. An error from the design value can be eliminated, and the dimensional accuracy of the outer shape of the resonator element can be increased.

  In the manufacturing method of the present invention, the patterning of the metal film is performed at an early stage, and is not performed at the time of forming the groove, so that the end of the formed metal film is not side-etched. Deviation from the design value of the outer shape can also be prevented.

  In the first etching step, etching is performed with a resist layer provided between two opposing metal films. This resist layer continuously covers the substrate between the two opposing metal films and the metal film between the inner edge and the outer edge of both metal films.

  This resist layer protects the groove of the vibrating piece from being etched when the outer shape of the vibrating piece is formed by the first etching step.

  In the second etching step, etching is performed in a state where the resist layer formed in the first etching step is removed. By removing the resist layer, the inner edge of the metal film covered with the resist layer is exposed. The inner edge of the metal film corresponds to the edge of the groove formed in the vibrating piece.

  By forming a plurality of opposing metal film pairs on the substrate, a plurality of vibrating pieces can be manufactured from one substrate. At this time, in the case of a shape in which a plurality of vibrating pieces are connected like the tuning fork type vibrating piece, one end in the length direction of the plurality of vibrating pieces can be connected by the base. This base portion can be formed simultaneously with the first etching step for forming the outer shape of the resonator element by, for example, forming a resist layer so as to cut out the substrate when the resonator element is formed by etching from the substrate. Further, it can be formed by connecting the resonator element base portion with the pattern of the resist layer. As the substrate, a piezoelectric single crystal such as a quartz substrate can be used.

  Moreover, the other aspect of the present invention can be a vibrating piece having a groove, and can be manufactured by forming the outer shape of the vibrating piece and the groove using the manufacturing method of the present invention.

  Still another embodiment of the present invention can be a vibrator in which a vibrating piece having a groove portion is housed in a package, and the outer shape of the vibrating piece and the groove portion are formed using the manufacturing method of the present invention. It can be manufactured by storing the formed resonator element in a package.

  According to the present invention, in both the first etching process for forming the contour of the resonator element and the second etching process for forming the groove of the resonator element, the patterning is first performed without using the photoresist film as a mask. Since the etched metal film is used as a mask, it is not affected by the dimensional error of the photoresist film, and the pattern of the groove forming metal film is not subjected to side etching. The dimensional accuracy can be improved.

  According to the method for manufacturing a resonator element of the present invention, when manufacturing the resonator element in which the groove is formed, the dimensional accuracy of the outer contour of the resonator element can be increased.

  Hereinafter, the method for manufacturing a resonator element, the resonator element, and the vibrator of the present invention will be described in detail with reference to the drawings.

  First, a substantially H-shaped tuning fork type crystal vibrating piece will be described with reference to FIGS.

  FIG. 1 is a schematic perspective view for explaining an outer shape of a tuning-fork type crystal vibrating piece having a substantially H-shaped cross section according to an embodiment of the present invention. 1A shows a state before electrode formation, and FIG. 1B shows a state after electrode formation. The configuration shown in FIGS. 1 and 2 is a commonly known configuration as shown, for example, in Patent Document 1 described above. For the following explanation, refer to Patent Document 1 in the configuration of a tuning-fork type crystal vibrating piece. As shown.

  As shown in FIG. 1, a tuning fork type crystal vibrating piece 1 having a substantially H-shaped cross section is cut out from a single crystal of quartz and processed into a tuning fork type. The substantially H-shaped tuning-fork type crystal vibrating piece 1 is cut out from a single crystal of crystal so that, for example, the X-axis direction is an electric axis, the Y-axis direction is a mechanical axis, and the Z-axis direction is an optical axis. Thus, a highly accurate vibration piece is obtained by arrange | positioning an electric shaft to a X-axis direction.

  Further, when cutting from a single crystal of quartz, in the orthogonal coordinate system composed of the X-axis, Y-axis and Z-axis described above, the XY plane composed of the X-axis and Y-axis is rotated about 1 degree counterclockwise around the X-axis. A so-called crystal Z plate tilted 5 degrees from the angle can be obtained.

  The tuning fork type crystal vibrating piece 1 includes a base portion 3 and, for example, two vibrating pieces 1 a and 1 b formed so as to protrude from the base portion 3 in the Y-axis direction.

  Grooves 2a and 2b are formed on the front and back sides of the two vibrating pieces 1a and 1b. The groove on the back side is not shown.

  Electrodes 4a, 5a and 4b, 5b are formed on the portions 1a, 1b of the substantially H-type tuning fork type crystal vibrating piece 1 at the hatched portions in FIG. Here, the electrodes 4a and 4b are provided in the groove portions 2a and 2b of the vibrating pieces 1a and 1b, and the electrodes 5a and 5b are provided on the side surfaces of the leg portions of the vibrating pieces 1a and 1b. The electrodes 4a, 5a, 4b, and 5b generate an electric field when an electric current is applied from the outside, and vibrate the legs of the quartz crystal that is a piezoelectric body.

  Providing a groove on the resonator element and making the cross-sectional shape substantially H-shaped reduces the size of the resonator element, reduces vibration loss, and reduces the CI value (crystal impedance or equivalent series resistance). Can do.

  FIG. 2 shows a cross-sectional shape of the resonator element. 2A shows a cross-sectional view of two vibrating pieces, and FIG. 2B shows a perspective view of a part of one vibrating piece.

  Since the groove part 2 is provided in the leg part of the vibration piece 1 along the length direction of the leg part, the cross-sectional shape becomes substantially H shape as shown in FIG. Since this cross-sectional shape is substantially H-shaped, it is called a substantially H-shaped tuning-fork type crystal vibrating piece. The vibrating bars 1a and 1b have groove portions 2a and 2b at two locations on the front and back surfaces, and electrodes 4a and 4b are provided on the inner surfaces of the groove portions, respectively. Electrodes 5a and 5b are also provided on both side surfaces of the resonator element.

  Such electrodes 4a, 4b, 5a, 5b are connected to a power source (not shown), and voltages having different polarities are alternately applied to the side electrode 5 and the groove portion electrode 4 respectively. It is like that. For example, when a positive voltage is applied to the groove side electrode 4 and a negative voltage is applied to the side electrode 5, an electric field is generated. When the electric field is generated, the leg portion of the vibrating piece vibrates, but the substantially H-shaped tuning fork type quartz vibrating piece 1 has the groove portion 2 and the electrode 4 is provided in the groove portion 2. Since the electric field to be distributed is widely distributed inside the leg, the vibration loss of the leg can be reduced and the CI value can be suppressed. According to this configuration, the vibration piece is small but highly accurate as compared with a tuning-fork type crystal vibration piece having no groove.

  Next, the manufacturing process of the resonator element according to the invention will be described with reference to the flowchart of FIG. 3 and the process diagrams of FIGS. 6 shows a first etching process for forming the outer shape of the resonator element in the resonator element manufacturing process of the present invention, and FIG. 7 shows forming the groove portion of the resonator element in the resonator element manufacturing process of the present invention. A second etching step is shown. In addition, the process shown here can utilize the normally known process disclosed by above-mentioned patent document 2, for example, the process except the process of forming the external shape and groove part of a vibration piece.

  First, a quartz substrate 10A is prepared. For example, a wafer-like substrate can be used as the quartz substrate 10A. The material of the quartz substrate 10A is not limited, but piezoelectric single crystals such as quartz, lithium niobate single crystal, lithium tantalate single crystal, lithium niobate-lithium tantalate solid solution single crystal, lithium borate single crystal, langasite single crystal, etc. Can be used. The substrate may be either a Z plate or an X plate (Y plate), or may be an offset substrate of a Z plate or an X plate (Y plate).

  The surface of the quartz substrate 10A is etched to remove the work-affected layer on the surface, and then the quartz substrate 10A is washed to reduce particles. As the cleaning liquid at this time, for example, an alkaline detergent, ultrapure water, isopropyl alcohol (EL grade) or the like can be used.

  Next, the metal film 11 is formed on both surfaces 1a and 1b of the quartz substrate 10A. The metal film 11 is made of a material that can function as a mask for etching the quartz crystal substrate. The material used for the metal film 11 is not particularly limited. For example, a multilayer film in which a Cr sputter layer 12 is used as a base and an Au sputter layer 13 is laminated thereon can be used. In addition, a multilayer film in which the base is a Ti layer and an Au layer is laminated thereon, a tungsten layer, or the like can be used (S1) (FIG. 4A).

  Next, a photoresist film 15 is formed and coated on each metal film 11 (Cr sputter layer 12, Au sputter layer 13). Next, the photoresist film 15 is patterned to obtain a patterned photoresist film 15. The patterning of the photoresist film 15 determines the position of the edge when the outer shape of the vibrating piece and the groove of the vibrating piece are formed by etching. The patterning of the photoresist film 15 can be performed by a normal exposure method. For example, a contact aligner can be used during exposure (S2) (FIG. 4B).

  Next, the metal film 11 is etched using the patterned photoresist film 15, and the pattern of the photoresist film 15 is transferred to the metal film 11 to form the patterned metal film 11. In this metal film 11, the interval indicated by reference numeral 20 in FIG. 4C corresponds to the width of the groove, and the interval indicated by reference numeral 21 in FIG. 4C corresponds to the interval between adjacent vibrating pieces ( S3) (FIG. 4C).

  Next, a patterned metal film 11 and a resist layer 16 that covers a groove formed between the metal films 11 are provided by patterning. Here, the resist layer 16 only needs to cover at least the groove. Therefore, the outer edge of the metal film 11 is not covered with the resist layer 16, and the metal film is exposed (S4) (FIG. 4D).

  Next, the crystal substrate 10 </ b> A is etched with the metal film 11 to form the outer shape of the resonator element 10. By this etching, the leg portion of the resonator element 10 is separated from the crystal substrate 10A. At this time, the groove remains without being etched by the resist layer 16 (S5) (FIG. 5A).

  Next, the resist layer 16 is stripped and removed (S6) (FIG. 5B), and the groove is etched at the position of the inner edge of the metal film 11 (S7) (FIG. 5C). After forming the groove 2 by etching, the metal film 11 is peeled off and removed (S8) (FIG. 5D).

  FIG. 6 shows a first etching step for forming the outer shape of the resonator element. 6 (a) corresponds to FIG. 4 (c), FIG. 6 (b) corresponds to FIG. 4 (d), and FIG. 6 (c) corresponds to FIG. 5 (a).

  6A, a metal film 11 made of a multilayer film in which a Cr sputter layer 12 is used as a base and an Au sputter layer 13 is laminated on the Cr sputter layer 12 is formed by patterning on a quartz substrate 10A. The metal film 11 formed by this patterning has two portions arranged to face each other, the positions of the outer edges of both portions define the outer shape of the vibrating piece 10, and the positions of the inner edges are the vibrating piece 10. An inner edge portion of the groove portion is defined. The interval 20 between the positions of the inner edge corresponds to the groove width of the groove.

  In FIG. 6B, a resist layer 16 is provided continuously between the distance 20 between the two metal film 11 portions arranged opposite to each other and from the inner edge of the metal films 11 to the metal film 11. The resist layer 16 has a width 16A corresponding to the interval 20 between the metal films 11 and a width 16B from the inner edge of the metal film 11 to the metal film 11. In addition to the width 16A, by providing a portion of the width 16B that overlaps with the metal film 11, an interval 20 between the positions of the inner edge portions of the metal film 11 corresponding to at least the groove portions, regardless of the formation error of the resist layer 6. Can be covered with a resist layer.

  Further, the width 16B of the resist layer 16 does not extend to the outer edge of the metal film 11, and the metal film 11 is exposed in the vicinity of the outer edge of the metal film 11. 6C, when the quartz substrate 10A is etched by the metal film 11, the outer edge of the metal film 11 defines the position of the edge portion for etching the quartz substrate 10A. . As a result, the dimensions of the outer shape of the resonator element can be determined without being affected by the formation error of the resist layer of the resonator element.

  FIG. 7 shows a second etching process for forming the groove of the resonator element. 7 (a) corresponds to FIG. 5 (b), FIG. 7 (b) corresponds to FIG. 5 (c), and FIG. 7 (c) corresponds to FIG. 5 (d).

  In FIG. 7A, after the outer shape is formed on the resonator element, the resist layer 16 is removed. Since the removal of the resist layer 16 does not affect the metal film 11, it is not affected by side etching as in the prior art, and the position of the edge of the metal film 11 changes from the position formed by patterning. Never do.

  In the second etching step according to FIG. 7B, the substrate 10A is etched at the position of the inner edge of the metal film 11 disposed oppositely, and a groove with a width of 20 is formed between the edges.

  Therefore, the etching surface 30 that forms the outer shape of the resonator element 10 is determined by the outer edge 11 </ b> A of the metal film 11, and the etching surface 31 that forms the groove 2 of the resonator element 10 is determined by the inner edge 11 </ b> B of the metal film 11. .

  The specific method of etching is not limited, and dry etching or wet etching can be used.

  The metal mask etching method itself and the substrate etching method itself are known, for example, as disclosed in Patent Document 2.

  The etchant for etching the metal mask is preferably an aqueous solution of iodine and potassium iodide, and the etchant for chromium is preferably an aqueous solution of ceric ammonium nitrate and perchloric acid. In the case of simultaneously etching gold and chromium, an aqueous solution of ceric ammonium nitrate, perchloric acid and hydrochloric acid is preferable.

  Examples of the etchant for etching the substrate include a hydrogen fluoride solution, an ammonium hydrogen fluoride solution, a buffered hydrofluoric acid solution (a mixed solution of ammonium hydrogen fluoride and ammonium fluoride), a sodium hydroxide solution, and the like.

  In the present invention, the material of the photoresist film covering the metal mask must be durable to the substrate etchant. Such materials include, for example, novolak resin-based positive resist, main chain cutting (collapse) -type positive resist, cyclized polyisoprene-azide compound-based resist, phenol resin-azide compound-based resist, dissolution There are a suppression electron beam positive resist, a cross-linked electron beam negative resist, and the like.

  Next, the process of forming an electrode will be described with reference to the cross-sectional views of FIGS.

  First, an electrode film is formed on the entire surface of the crystal 10A of a substantially H-shaped vibrating piece by sputtering or the like. Here, the electrode film can be formed, for example, by laminating the Au sputter layer 18 on the base of the Cr sputter layer 17 (S9) (FIG. 8A).

  Next, a resist layer 19 is formed on the formed electrode films 17 and 18 (S10) (FIG. 8B), and an electrode pattern is patterned on the photosensitive resin by exposure (S11) (FIG. 8). (C)), the portion of the resist layer corresponding to the portion where the electrode is not formed is removed (S12) (FIG. 8 (d)), and then etching is performed, and the portion of the electrode where the photoresist layer is not provided The film 18 is removed. The electrode can be formed by peeling off the remaining resist layer 19 (S13).

  Thereafter, a rough adjustment film 22 used for frequency adjustment is deposited and laminated on a part of the vibrating bars 1a and 1b. As the rough adjustment film 22, for example, a Cr vapor deposition film 22a is vapor deposited, and then an Ag vapor deposition film 22b is vapor deposited (S14) (FIGS. 9A and 9B).

  Thereby, an electrode can be formed in the groove parts 2a and 2b and the side part which were formed in the leg part of each vibration piece 1a and 1b of the substantially H type tuning fork type crystal vibrating piece 1.

  FIG. 10 is a schematic cross-sectional view showing the configuration of the vibrator. The vibrator 40 includes, for example, a box-shaped package 41 having a space inside. The package 41 includes a storage container 42 and a sealing lid 43. The storage container 42 can be formed of ceramics such as alumina, for example, and the inside of the storage container 42 is sealed by closing the upper edge of the storage container 42 with a sealing lid 43.

  A package-side electrode (not shown) is provided in the storage container 42 of the package 41 thus formed. An end portion of a substantially H-shaped tuning-fork type crystal vibrating piece 1 on which an electrode (not shown) is formed is fixed on the package side electrode via a conductive adhesive or the like.

  The substantially H-shaped tuning-fork type crystal vibrating piece 1 vibrates when a constant driving voltage is applied from the package-side electrode.

  Further, the tuning fork type crystal vibrating piece 1 manufactured in this way can be applied to a digital mobile phone, a tuning fork crystal oscillator, a gyro and the like in addition to the vibrator 40 housed in the ceramic package described above.

  Further, the resonator element 1 of the present invention is not limited to the above-described example, and may be used for other electronic devices, portable information terminals, televisions, video devices, so-called radio cassettes, personal computer built-in devices such as personal computers, and watches. Furthermore, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the claims.

  Moreover, the structure of the said embodiment can abbreviate | omit a part, or can be changed into the other arbitrary combinations which are not mentioned above.

It is a schematic perspective view for demonstrating the external shape of the tuning fork type | mold crystal vibrating piece whose cross-sectional shape is substantially H type based on embodiment of this invention. It is a figure which shows the cross-sectional shape of a vibration piece. 6 is a flowchart for explaining a manufacturing process of the resonator element according to the invention. It is process drawing for demonstrating the manufacturing process of the vibration piece of this invention. It is process drawing for demonstrating the manufacturing process of the vibration piece of this invention. It is process drawing for demonstrating the manufacturing process of the vibration piece of this invention. It is process drawing for demonstrating the manufacturing process of the vibration piece of this invention. It is process drawing for demonstrating the manufacturing process of the vibration piece of this invention. It is process drawing for demonstrating the manufacturing process of the vibration piece of this invention. It is a schematic sectional drawing which shows the structure of the vibrator | oscillator of this invention. It is a figure which shows one structural example of a tuning fork type crystal vibrating piece. It is a figure for demonstrating the formation method which makes the cross section of a vibration piece H type. It is a figure for demonstrating the formation method which makes the cross section of a vibration piece H type. It is a figure for demonstrating a position shift in the etching by the position shift of the resist of a vibration piece.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,1a, 1b Vibrating piece 1A Tuning fork type vibrating piece 2,2a, 2b Groove part 3 Base part 4,4a, 4b Electrode 5,5a, 5b Electrode 10 Vibrating piece 10A Quartz substrate 11 Metal film 11A Metal film outer edge part 11B Metal film Inner edge 12 Cr sputtered film 13 Au sputtered film 15 Resist film 16 Resist layer 16 A Groove width 16 B Metal film width 17 Cr sputtered film 18 Au sputtered film 19 Resist film 20 Metal film spacing 21 Oscillating piece spacing 22 Rough tuning film 22 a Cr vapor deposition film 22b Ag vapor deposition film 30, 31 Etching surface 40 Vibrator 41 Package 42 Storage container 43 Sealing lid 100 Tuning fork type vibrating piece 101A Tuning fork type vibrating piece 101a, 101b Vibrating piece 102a, 102b Groove 103 Base 111 Metal film 112 Resist film 110 Vibrating piece 110A Substrate 114A, 11 B, 114C etched surface 115 resist layer 117 second opening first opening section 118

Claims (8)

A method of manufacturing a resonator element having a groove,
It is a method of forming a metal film on a substrate and etching the substrate using the metal film as a mask to form the outer shape and groove of the resonator element.
It is a step of forming two metal films facing one vibrating piece, the outer edges of both metal films corresponding to the outer shape of the vibrating piece, and the opposite inner edges are respectively vibrating pieces Forming a metal film corresponding to the edge of the groove on the substrate,
A first etching step of etching the substrate by the outer edges of the two opposing metal films to form the outer shape of the resonator element;
And a second etching step of forming a groove portion of the resonator element by etching the substrate with each of the opposite inner edges of the two metal films.   2. The method for manufacturing a resonator element according to claim 1, wherein in the first etching step, etching is performed in a state where a resist layer is provided between two opposing metal films.   3. The resist layer continuously covers a substrate between two opposing metal films and a metal film intermediate between an inner edge and an outer edge of both metal films. The manufacturing method of the vibration piece as described in any one of.   3. The method for manufacturing a resonator element according to claim 2, wherein, in the second etching step, the etching is performed in a state where the resist layer of the first etching step is removed.   5. The resonator element according to claim 1, wherein a plurality of resonator elements are manufactured from one substrate by forming a plurality of the pairs of metal films facing each other on the substrate. 6. Manufacturing method.   The method for manufacturing a resonator element according to any one of claims 1 to 5, wherein the substrate is made of a piezoelectric single crystal. A resonator element having a groove,
The external shape and groove part of a vibration piece were manufactured by the manufacturing method as described in any one of Claims 1-6, The vibration piece characterized by the above-mentioned. A vibrator in which a resonator element having a groove is housed in a package,
7. The vibrator according to claim 1, wherein the outer shape and the groove of the resonator element included in the vibrator are manufactured by the manufacturing method according to any one of claims 1 to 6.

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