JP2007329879A - Tuning-fork type bending crystal oscillator piece and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a structure and a manufacturing method in which a plurality of pieces are produced, at the same time, from a laminar crystalline substrate by photoetching technology, in order to reduce the dispersion in the characteristics of a tuning-fork type bending crystal oscillator piece. <P>SOLUTION: A tuning-fork type bending crystal oscillator piece 1 consists of a laminar crystalline substrate of a Z' plate, and the tuning-fork type bending crystal oscillator piece is constituted of a left oscillating arm 2 and a right oscillating arm 3 being integral with a basal portion 1a; with deep grooves 6, 7 showing a shape of, at least one line of inverted trapezoid or substantially a V-shape being provided on any ones of the front and the back surfaces of the left oscillating arm 2 and the right oscillating arm 3, while having a depth of 50% to 90% of a thickness of the tuning-fork type bending crystal oscillator piece 1; with the inside, having the deep groove 6 of the left oscillating arm 2 and an electrode film formed on its opposite face being connected with both side electrodes of the right oscillating arm 7 to form one terminal; and with both the side electrodes of the left oscillating arm 2 being connected to the inside, having the deep groove 7 of the right oscillating arm 3 and an electrode film formed on its opposite face to form another terminal, to bend and oscillate under the condition where an alternating voltage is applied between the two terminals. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention is a structure for improving the performance of a tuning fork-type bending quartz crystal vibrating piece manufactured using photo-etching technology and reducing the characteristic variation of a large number of tuning-fork type bending quartz crystal vibrating pieces formed in a thin plate crystal substrate, It relates to high-precision machining processes.

  Tuning fork-type bent quartz resonators are mounted as reference signal sources in mobile computers, mobile phones, small information devices, etc., and there are still strong demands for miniaturization, thinning, and price reduction of products. Such a conventional tuning fork-type bending quartz crystal vibrating piece and a manufacturing method thereof will be described with reference to the drawings.

  FIG. 3 is a plan view showing a conventional tuning-fork type bending crystal vibrating piece (hereinafter referred to as a vibrating piece according to the description), and FIG. 4 is a cross-sectional view of the vibrating piece shown in FIG. is there.

  In FIG. 3, the vibrating piece 100 has a thickness of 100 microns, and includes a base portion 100 a and a left vibrating arm portion 101 and a right vibrating arm portion 102 formed so as to protrude therefrom. Such a vibrating piece is made by a photolithography technique and a chemical etching technique. Further, a deep groove 103 is formed in the left vibrating arm portion 101 and a deep groove 104 is also formed in the right vibrating arm portion 102. This deep groove is generally formed on both the front and back sides, and the depth is slightly over 30 microns.

  In FIG. 4, the back main surface electrode 103 b is formed in the deep groove that the front main surface electrode 103 a has on the back side in the deep groove on the front side of the left vibration arm portion 101, and is electrically connected to the right vibration arm portion 102. The left side electrode 107a and the right side electrode 107b are electrically connected. For example, the wiring is performed by the wiring film 108 shown in FIG. 3 and is led out to the right terminal portion 109 to obtain one terminal.

  On the other hand, the left side electrode 106a and the right side electrode 106b included in the left vibrating arm 101 in FIG. 4 are electrically connected, and they are deep grooves on the front side of the right vibrating arm 102 in FIG. 4 by the wiring film 105 in FIG. The front main surface electrode 104a and the back main surface electrode 104b in the deep groove on the back side are electrically connected and led out to the left terminal portion 110 to become one terminal, and two terminals are obtained on the left and right.

  When an alternating voltage is applied between the two terminals in FIG. 4 and the state is instantaneously captured, the left side electrode 106a and the right side electrode 106b of the left vibrating arm 101 become +, and the front main surface electrode 103a and the back main surface electrode 103b becomes-, and an electric field is generated from + to-. On the other hand, the polarity of the right vibrating arm 102 is opposite. These electric fields cause expansion and contraction in the crystal, and bending vibration is obtained as shown by an arrow 111 shown in FIG.

  FIG. 5 shows a method for manufacturing the resonator element described with reference to FIGS. FIG. 5 shows steps A to F, and is a series of steps for patterning the tuning fork outline, the deep groove, and the electrode film. 5 will be described with reference to the cross section of the left vibrating arm 101 shown in FIGS.

  In step A, a corrosion resistant film, for example, a two-layer film of Cr 151 and Au 152 is formed on the front and back of a thin quartz substrate 150 having a thickness of 100 microns by sputtering, and a photosensitive resist is applied on the front and back, and then the tuning fork outline is formed. Necessary exposure and development are performed to obtain an outer pattern 153 using a photosensitive resist.

  The Au 152 and Cr 151 exposed in step B are sequentially chemically etched. Accordingly, the crystal surface 154 is exposed on the surface other than the tuning fork outline. Next, since the photosensitive resist used for the external pattern 153 is not exposed to light, the deep groove-shaped pattern is exposed and developed again without being removed, and the Au 152 exposed in the deep groove portion is chemically etched. As a result, Cr 151 is exposed on the surface, resulting in a process B. Generally, a positive type (photolytic type) is used for the photosensitive resist. The chemical etching is performed in an environment that is not exposed to light.

  In the process C, the crystal face 154 exposed by the mixed liquid of hydrofluoric acid and ammonium fluoride is etched in the state shown in the process B to obtain the outer shape of the tuning fork. At this time, the etching time is one step before the ideal shape. Thereafter, Cr 151 is etched using Au 152 and photosensitive resist 153a as a mask to expose crystal surface 151a.

  In the process D, the deep crystal 155 is obtained by immersing the exposed quartz surface 151a again in a mixed solution of hydrofluoric acid and ammonium fluoride in the state shown in the figure of the process C, and the deep fork 155 is completely etched. It becomes an ideal shape, and the depth of the deep groove is about 30 to 40 microns. Next, the photosensitive resist 153a, Au152 and Cr151 are sequentially removed. What remains is only quartz, and a tuning fork outline and a deep groove 155 are formed.

  In step E, an electrode film 156 is formed on the entire quartz surface obtained in step D. The electrode film 156 is generally a two-layer film of Cr and Au, aluminum, or the like, and sputtering or vacuum deposition is used. Here, a description will be given with a two-layer film of Cr and Au. The thickness of the two layers is about 1000 angstroms, and it is also formed inside the deep groove 155. Next, in order to obtain an electrode shape as shown in FIGS. 3 and 4, a photosensitive resist 157 is applied to the entire surface, and exposure and development, which are processes necessary for patterning, are performed. At this time, since there is a risk that the mask and the thin quartz substrate come into contact with each other and break the exposure apparatus, it is common to use a non-contact double-sided projection exposure apparatus. An electrodeposition resist is used for three-dimensional coating of the photosensitive resist.

  In Step F, the electrode film is etched using the remaining photosensitive resist (not shown) as a mask, and then the photosensitive resist is removed to obtain the side electrodes 159a and 159b, the front main surface electrode 158a and the back main surface electrode 158b. To be completed.

  Thereafter, a metal film for frequency adjustment is formed on the tip portion 106. Au and Ag are used for the metal film, and trimming is performed using a laser method. Or it removes using an ion etching method and it adjusts to a desired frequency. These are performed in a wafer state, after being mounted on a container, or after the container is sealed.

US-3969641 JP 52-61985 JP-A-56-65517 International Publication Number WO00 / 44092 Patent No. 3729249 JP2004-159072

Problems to be solved by the invention

The conventional tuning fork-type bent quartz crystal vibrating piece 100 described with reference to FIGS. 3, 4, and 5 has the following problems.
(A) Since the vibration piece 100 has deep grooves formed on the front and back sides of the left vibration arm portion 101 and the right vibration arm portion 102, respectively, in the manufacturing method shown in FIG. Position variations due to alignment accuracy and deep groove depth variations due to double-sided etching occur on the front and back, which is a frequency variation, and when multiple wafers are installed in the wafer, the frequency differs greatly between the center and the periphery of the wafer, and the frequency between wafers Variations will become larger. By the way, it was 3 times compared to the case without deep grooves. Accordingly, there is a problem that the frequency adjustment amount becomes extremely large. As a reference patent document, FIG. 4 of JP-A-52-61985, or the structure of International Publication No. WO00 / 44092.

(B) If the left vibrating arm 101 and the right vibrating arm 102 are different in shape, the left and right vibration frequencies are different, so that the balance is not achieved, and the vibration leakage is transmitted to the base, resulting in a crystal impedance ( In the following, the CI value was high, but it was difficult to stabilize.

The following points can be considered as the causes of the above (a) and (b). If deep grooves are manufactured on the front and back as shown in FIGS. 3 and 4 by the method shown in FIG. 5, the accuracy of matching the back and front of the double-sided projection exposure apparatus is generally several microns, and the resolution is as low as 5 microns. Since the exposure is performed twice separately, the worst case overlap results in an accuracy variation of several microns × 2. This causes not only vertical and horizontal but also rotational deviation. Furthermore, since there are electrode exposures, the exposure is performed three times, the accuracy variation is increased, and the number of processes is increased. Further, the double-sided projection exposure apparatus is expensive and the yield is low in this process. The reason why this exposure apparatus is used is that the electrode pattern is formed after external processing of the crystal by etching, but the thin crystal substrate has already been removed, and when the mask and the thin crystal substrate are brought into close contact with each other, the resonator element falls off. Therefore, it is difficult to manufacture unless an expensive non-contact method is adopted.
This point is the same as in Japanese Patent Laid-Open No. 56-65517.

  Further, as a problem of the manufacturing method, the process C-C in FIG. 5 shows the problem of the process C. However, if Cr151 is etched, there is an adverse effect of battery corrosion, and it is etched in a few tens of seconds and difficult to control. The side etching is large and the pattern 160 is thin. The problem varies greatly between wafers. When the crystal is etched in the process D, as shown in the process DD, a step 155b is formed on the left side and a step 155c is formed on the right side. That is, it can be said that the variation is large because the Cr 151 is etched twice in the process B and the process C. Incidentally, the finished product is as shown in the process FF and may not be a cross-sectional view like the process F. Reference patent documents include Japanese Patent No. 3729249 and Japanese Patent Application Laid-Open No. 2004-159072.

  The present invention has been made in order to solve these problems, and the main problems thereof are a low CI value, a small frequency variation within a wafer and between wafers, and a small number of steps, even if it is ultra-compact. It is to achieve a high yield with inexpensive equipment.

Means for solving the problem

In order to achieve the above object, a tuning-fork type bending crystal vibrating piece of the present invention has the following characteristics.
A tuning fork-type bending quartz crystal vibrating piece that is simultaneously prepared from a quartz substrate by photoetching technology, wherein the tuning-fork type bending quartz crystal vibrating piece has an X axis in the width direction, a Y axis in the longitudinal direction, and a Z axis in the thickness direction. The Y-axis is composed of a Z′-plate thin quartz substrate with a cut angle θ rotated about −10 ° to + 10 ° around the X-axis. The arm part is integrated with the base part, and at least one deep trapezoidal or substantially V-shaped deep groove is formed on one of the front and back surfaces of the left vibration arm part and the right vibration arm part. The thickness is 50% to 90% of the thickness of the tuning-fork type bending crystal vibrating piece, and the electrode film formed on the inside of the left vibrating arm portion having the deep groove and the opposite surface is on both sides of the right vibrating arm portion. Connected to the surface electrode to form one terminal, and the left side arm of the left vibrating arm is the right vibrating arm Deep groove inside and as its electrode film formed on the opposite surface and connected has been one terminal having, characterized in that bending vibration by applying an alternating voltage between the two terminals.

  A tuning fork-type bending quartz crystal vibrating piece that is simultaneously produced by a photoetching technique from a thin quartz substrate, wherein the tuning-fork type bending quartz crystal vibrating piece has an X axis in the width direction, a Y axis in the longitudinal direction, and a Z axis in the thickness direction. The Y-axis is composed of a Z′-plate thin quartz substrate with a cut angle θ rotated about −10 ° to + 10 ° around the X-axis. The vibrating arm portion is integrally formed with the base portion, and has at least one inverted trapezoidal or substantially V-shaped deep groove on one of the front and back surfaces of the left vibrating arm portion and the right vibrating arm portion. The depth is 50% to 90% with respect to the thickness of the tuning fork-type bent quartz crystal vibrating piece, and the electrode film formed in the inside having the deep groove of the left vibrating arm portion is formed on both side electrodes of the right vibrating arm portion. Connected to form one terminal, the left side arm of the left vibrating arm has a deep groove in the right vibrating arm. And formed inside the electrode film and connected to with one terminal which is characterized in that bending vibration by applying an alternating voltage between the two terminals.

  The method for manufacturing a tuning-fork-type bending quartz crystal resonator element according to the present invention includes a step of forming a corrosion-resistant film on the front and back of a thin quartz substrate, and the corrosion-resistant film is formed on one side of the front and back by a photo-etching technique. A step of processing so that a corrosion-resistant film remains on the other surface as a tuning fork outer shape so that it remains as a shape, and a portion of the deep groove in the left and right vibrating arms does not leave a corrosion-resistant film; The process of removing the photosensitive resist used in the technology, the process of creating a pattern necessary for electrode film formation by coating the photosensitive resist on the new corrosion resistant film on the front and back, and the exposed quartz surface without the corrosion resistant film A process of simultaneously etching a process for obtaining a tuning fork outline by etching from both sides, and a process for half-etching the crystal surface of the exposed deep groove portion on either of the front and back sides; A step of removing the corrosion-resistant film on the front and back, a step of forming an electrode film by vacuum deposition, a step of peeling off the photosensitive resist and the electrode film formed thereon, and a step of etching the corrosion-resistant film It is characterized by having.

  A metal film that adjusts the resonance frequency of the tuning fork type bending vibration piece is formed on the tip of both arms opposite to the surface having the deep groove of the tuning fork type bending vibration piece, and the desired frequency is obtained by removing this metal film. To fit.

  Moreover, it is preferable that the resonance frequency of the tuning fork type quartz crystal vibrating piece is in a range of 32 KHZ to 200 KHZ.

The invention's effect

    According to the present invention, even if it is ultra-compact, the CI value is low, the frequency variation within and between wafers is small, the number of processes is small, and high yield can be achieved with inexpensive equipment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, taking a 32.768 KHZ resonator element as an example. FIG. 1 is a plan view showing a resonator element according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of both arms TT ′ of the resonator element according to the present invention.

  FIG. 1A is a front surface having a deep groove, and FIG. 1B is a rear surface thereof. The thickness of the vibrating piece 1 is 100 microns, and is composed of a left vibrating arm portion 2 and a right vibrating arm portion 3 which are formed integrally with the length 560 microns of the base portion 1a. The length was 1711 microns, the total length was 2271 microns, the arm width was 123 microns, and the width was 82 microns. Further, according to the present invention, the deep groove is formed on either one of the front and back sides, that is, only on one side, and the deep groove 6 is carved in the left vibrating arm portion 2 and the deep groove 7 is carved in the right vibrating arm portion 3, and the deep groove width is 93 microns and the length is 850. Micron. As shown in FIG. 2, the deep groove is chemically etched from one side, the shape is inverted trapezoidal, and has an angle in the depth direction, the depth Q1 to the bottom is 80 microns, and the thickness Q2 is 100 microns. Q1 is 80% with respect to Q2.

  1A, FIG. 1B, and FIG. 2, the left side electrode 8 and the right side electrode 10 of the left vibrating arm portion 2 have an electrode film 7a in the deep groove 7 on the surface of the right vibrating arm portion 3 and the back side thereof. The back wiring electrode 15 is also used with the planar electrode 17b included in the electrode, and is electrically connected to be connected to the terminal portion 4 to obtain one terminal. On the other hand, the electrode film 6a in the deep groove 6 on the surface of the left vibrating arm portion 2 and the planar electrode 17a on the back side thereof are electrically connected using the front wiring electrode 14 and connected to the right terminal portion 5 to be connected to one terminal. A total of two terminals were obtained. In addition, the front and back electrode films on both arms are electrically connected through a part of the side surface by a band part 16 also provided on the part. The width of the bank portion 18 is preferably in a narrow range of 2 microns to 20 microns.

  When an alternating voltage is applied between the two terminals of the resonator element obtained according to the present invention, an electric field is generated as shown in FIG. In the present invention, an electric field is generated vertically from the surface of the side electrode 8 of the left vibrating arm 2 and is drawn into the electrode surface at a slight angle by the deep groove inner electrode 6a. On the other hand, an electric field perpendicular to the surface is generated from the tapered surface of the deep groove inner electrode 7a of the right vibrating arm 3, but the direction of the electric field generated from the left vibrating arm 2 is the same as the taper angle. Absent. The direction of the electric field is also different for the relationship between the planar electrode and the side electrode on the back surface.

  Meanwhile, another embodiment of the present invention will be described with reference to FIGS. 6A is the same as FIG. 1A, but the back surface has a structure in which no electrode is provided on both arms as shown in FIG. 6B, and only the wiring electrode 15 is provided. However, a metal film 19 for adjusting the frequency is formed on the tip of the tuning fork on the plane, and materials of Au, Ag, and Pd are used. FIG. 7 is a cross-sectional view taken along the line QQ ′ of FIG. 6A, and the electrical connection has the contents shown in the figure. (Detailed explanation is omitted)

  As still another embodiment, FIG. 9 is a cross-sectional view of both arms of a tuning fork, and there are two substantially V-shaped deep grooves 90 on the surface, and the depth is 50 to 90% of the thickness. In FIG. 10, no electrode film is formed on the back surface 91 thereof. These are also almost the same as the performance in the above-mentioned invention. In this embodiment, two lines are taken as an example, but a larger number may be used.

  FIG. 8 illustrates a manufacturing method according to the present invention using the cross-sections of both arms of the resonator element of FIG. In step J, a corrosion-resistant film 301 is formed on the front and back surfaces of a thin quartz substrate 300 of Z ′ plate by sputtering. The corrosion resistant film material is any one of Cr, aluminum oxide, and Cr + Au, but this description will be made with Cr.

  Next, in Step K, a photosensitive resist (positive type) is formed on both surfaces of the corrosion-resistant film, and after drying, exposure, development, drying (hereinafter patterning) and tuning fork are performed so that tuning fork-shaped Cr remains on both the front and back surfaces. Etching Cr other than the shape. At this time, the portion corresponding to the deep groove is simultaneously etched to expose the crystal surface 303a. As a result, a left portion Cr303 and a right portion Cr304 that determine the outer shape of the tuning fork shape remain on the front surface, and a tuning fork shape Cr302 remains on the rear surface. That is, in this process, a tuning fork shape and a deep groove pattern are created simultaneously.

  In the next step L, a photosensitive resist (positive type) having a negative relationship with the electrode film shape described in FIG. 1 is patterned on the front and back Cr. As a result, the left resist 305 and the right resist 306 remain on the front surface, and the lower left resist 307 and the lower right resist 308 remain on the back surface as well. The photosensitive resist used at this time is formed to a relatively large thickness of 2 to 3 microns.

  In the next step M, a mixed solution of hydrofluoric acid and ammonium fluoride is prepared and etched as a crystal etching solution. At this time, the tuning fork-shaped side surface portion 309 penetrates by double-sided etching, but the deep groove portion 310 does not penetrate or is not penetrated because of single-sided etching.

  In the next step N, Cr 302 exposed on the back surface is etched to obtain a crystal surface 311. Next, an electrode film is formed on the entire surface in step O. Ti + Pd, Ti + AuNi + Pd, Ni + Au, or the like is used as the electrode film material, but other materials may be used as long as they do not dissolve in the later etching solution of Cr and satisfy electrical characteristics.

  In the next process P, the photosensitive resist formed on the front and back and the electrode film formed thereon are peeled off. This can be easily removed by immersing it in a solution for dissolving the photosensitive resist. However, Cr304 which has in the lower part remains.

  Next, in Step Q, the remaining Cr 304 is etched. At this time, the left side electrode 306 and the right side electrode 307, and the electrode film 305 and the back side electrode film 308 in the deep groove remain as they are not dissolved in the Cr etching solution. Incidentally, the series of electrode pattern forming processes described in the present invention uses a lift-off method. In addition, a mixed liquid of ceric ammonium nitrate and perchloric acid was used as the Cr etching liquid described above.

  In the other embodiment of the present invention, when the electrode film is not formed on the back surface as shown in FIG. 6B, the photosensitive resist on the back surface is not separated into light like 307 and 308 in the process L of this manufacturing process. If the tuning fork shape is maintained, the electrode film does not adhere to the back surface.

  Although the embodiment of the present invention has been described in 32.768 KHZ, it can be applied up to around 200 KHZ. The manufacturing method according to the present invention is used for a tuning-fork type bending crystal vibrating piece having grooves on the upper and lower surfaces of the vibrating arm, but it goes without saying that the manufacturing method can also be applied to a vibrating piece penetrating the deep groove portion of the vibrating arm. Further, although it has two arms called a tuning fork, it can also be applied to a three-pronged bending crystal vibrating piece having three, and a gyro sensor is also included in the range.

  As described above, according to the present invention, in the resonator element, when the depth of the deep groove of the tuning fork exceeds 50% of the thickness, the CI value suddenly decreases, and the box-type ultra-small size 3.2 × 1. The result of mounting in a 5 × 0.7 container and vacuum-sealing was very good at 43 KΩ. Compared with products with conventional double-sided grooves, it is equivalent or better. When the deep groove is 50%, it was 70KΩ, so when it exceeds 50% at the center of the thickness, the CI value suddenly further decreases, and at 80%, the 43KΩ reduces the current consumption of small portable devices such as mobile phones and radio clocks. Greatly contribute to

  Incidentally, the CI value tends to increase as the size is reduced, but 50 KΩ or less is ideal in consideration of the oscillation margin of the oscillation circuit. The effect of the present invention is great because the mobility is poor at 70 KΩ, and non-oscillation may occur.

  On the other hand, in the case where there is no electrode film on the back surface shown in FIG. 6B, the frequency is detected while oscillating while the resonator element is connected to the wafer by the frequency adjustment method, or the pre-measurement data is obtained. The metal film 19 is removed by laser or ion etching until the desired frequency is used. At that time, the metal film, for example, Au may be scattered, which causes a problem such as short circuit or increased sheet resistance. However, the formation of the metal film 19 on the surface without the electrode film greatly reduces the problem.

  Further, according to the manufacturing method of the present invention, the etching of the Cr film used for the tuning fork outline and the deep groove pattern is simultaneous, and the tuning fork outline and the deep groove pattern are depicted on one mask substrate in the photomask used for exposure. The CI value is stable and low because there is no alignment error between the tuning fork outline and the deep groove and the balance between the left vibrating arm and the right vibrating arm is good. Furthermore, in the present invention, there is no need to form an electrode film after extracting the tuning fork outline and coat the entire surface with a photosensitive resist, and a series of photolithography processes can be performed on both surfaces of the thin quartz substrate before the crystal is extracted. Inexpensive contact method and proximity method can be adopted. By the way, the number of exposures can be shortened to 2 times, which was 3 times. In addition, since the deep groove portion is also etched at the time of the first Cr etching, it takes about 60 seconds, that is, the battery corrosion phenomenon is small, so the etching rate is slow and there is no Cr etching residue in the deep groove, the deep groove has no irregularities and is extremely defective Less is.

  According to the present manufacturing method, the frequency variation of 32.768 KHZ obtained from a large number of wafers according to the conventional method was over 500 KHZ in the conventional wafer, but it was drastically reduced to 150 KHZ or less, and the effect was great. As a result, the amount of frequency adjusting Au formed at the tip is also も or less of the conventional one.

  The present invention achieves performance improvement, low investment, and high yield by combining a single-sided deep groove structure of a tuning fork type quartz crystal unit and a new manufacturing method. If this tuning fork type quartz crystal resonator piece is used, it is used. The container to be used is a box type, thin lid type, or a resin-molded crystal unit that can be easily created. It can be applied to a gyro sensor or combined with a semiconductor to make a crystal oscillator. This performance greatly contributes to the miniaturization, high performance, and low cost of the applied product, and the effect of the invention is great.

  It is a top view which shows the tuning fork type bending quartz crystal vibrating piece of this invention.   It is sectional drawing which shows the tuning fork type bending quartz crystal vibrating piece of this invention.   It is a top view which shows the conventional tuning fork type bending quartz crystal vibrating piece.   It is sectional drawing which shows the conventional tuning fork type bending vibration piece.   It is sectional drawing which shows the manufacturing method of the conventional tuning fork type bending quartz crystal vibrating piece.   It is a top view which shows the other tuning fork type bending quartz crystal vibrating piece by this invention.   It is sectional drawing which shows the other tuning fork type bending crystal vibrating piece by this invention.   It is sectional drawing which shows the manufacturing method of the tuning fork type bending quartz crystal vibrating piece by this invention.   It is sectional drawing which shows the other tuning fork type bending crystal vibrating piece by this invention.   It is sectional drawing which shows the other tuning fork type bending crystal vibrating piece by this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,100 Tuning fork type crystal vibrating piece 1a Base 2, 101 Left vibration arm 3, 103 Right vibration arm 4, 110 Left terminal 5, 109 Right terminal 6, 7, 103, 104, 155, 310 Deep groove 6a, 7a Deep groove inner electrode 8, 106a, 107a, 306 Left side electrode 10, 106b, 107b, 307 Right side electrode 14 Front wiring electrode 15 Back wiring electrode 106 Tip 16 Band portion 17a Planar electrode 18 Bank 19 Metal coating 103a, 104a 158a Front main surface electrodes 103b, 104b, 158b Back main surface electrodes 105, 108 Wiring film 111 Arrow 150, 300 Thin crystal substrate 151, 302, 303, 304 Cr
151a, 154, 303a, 311 quartz surface 152 Au
153 Outline pattern 153a, 157 Photosensitive resist 156, 305, 308 Electrode film 155b, 155c Step 301 Corrosion resistant film 305 Left resist 306 Right resist 307 Left lower resist 308 Right lower resist 309 Side surface

Claims (5)

  A tuning fork-type bending quartz crystal vibrating piece that is simultaneously produced by a photoetching technique from a thin quartz substrate, wherein the tuning-fork type bending quartz crystal vibrating piece has an X axis in the width direction, a Y axis in the longitudinal direction, and a Z axis in the thickness direction. The Y-axis is composed of a Z′-plate thin quartz substrate with a cut angle θ rotated about −10 ° to + 10 ° around the X-axis. The vibrating arm portion is integrally formed with the base portion, and has at least one inverted trapezoidal or substantially V-shaped deep groove on one of the front and back surfaces of the left vibrating arm portion and the right vibrating arm portion. The depth is 50% to 90% of the thickness of the tuning fork-type bent quartz crystal vibrating piece, and the electrode film formed on the inside of the left vibrating arm portion having the deep groove and on the opposite surface thereof is the right vibrating arm portion. Connected to both side electrodes to form one terminal, both side electrodes of the left vibrating arm vibrate to the right A tuning-fork type quartz crystal vibrating piece characterized in that it is bent and vibrated by applying an alternating voltage between the two terminals connected to an electrode film formed on the opposite side and the inside having a deep groove in the part .   A tuning fork-type bending quartz crystal vibrating piece that is simultaneously produced by a photoetching technique from a thin quartz substrate, wherein the tuning-fork type bending quartz crystal vibrating piece has an X axis in the width direction, a Y axis in the longitudinal direction, and a Z axis in the thickness direction. The Y-axis is composed of a Z′-plate thin quartz substrate with a cut angle θ rotated about −10 ° to + 10 ° around the X-axis. The vibrating arm portion is integrally formed with the base portion, and has at least one inverted trapezoidal or substantially V-shaped deep groove on one of the front and back surfaces of the left vibrating arm portion and the right vibrating arm portion. The depth is 50% to 90% with respect to the thickness of the tuning fork-type bent quartz crystal vibrating piece, and the electrode film formed in the inside having the deep groove of the left vibrating arm portion is formed on both side electrodes of the right vibrating arm portion. Connected to form one terminal, the left side arm of the left vibrating arm has a deep groove in the right vibrating arm. Inside is formed electrode film and connected to the one terminal, the tuning fork type flexural quartz crystal resonator element, characterized in that bending vibration by applying an alternating voltage between the two terminals to be.   A process for forming a corrosion-resistant film on the front and back surfaces of a thin quartz substrate and the corrosion-resistant film remain on one surface of the front and back surfaces as a tuning fork outline shape by photo-etching technology, and a corrosion-resistant film is formed on the other surface as a tuning fork outline shape. And a process of processing the deep groove portions of the left and right vibrating arms so as not to leave a corrosion-resistant film, a process of removing the photosensitive resist used in the photo-etching technique of the above process, and newly on the front and back A process for creating a pattern necessary for electrode film formation by coating a photosensitive resist on a corrosion-resistant film, a process for obtaining a tuning fork outline by etching the exposed quartz surface that does not have a corrosion-resistant film from both sides, and either of the front and back sides The process of half-etching the crystal surface of the exposed deep groove portion on one side, the process of removing the corrosion-resistant film on the front and back, and the vacuum evaporation of the electrode film Forming by law, the photosensitive resist and the step of removing the formed electrode film thereon, the manufacturing method of the tuning fork type flexural quartz crystal resonator element, characterized in that a step of etching the corrosion resistant film.   A metal film for adjusting the resonance frequency of the tuning fork type bending vibration piece is formed on the tip of both arms on the opposite side of the surface having the deep groove of the tuning fork type bending vibration piece. The tuning-fork-type bent quartz crystal vibrating piece according to claim 1 or 2 matched with a frequency.   The tuning fork type bending crystal vibrating piece according to claim 1 or 2, wherein a resonance frequency of the tuning fork type bending vibration piece is in a range of 32 KHz to 200 KHz.

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