JP2008078226A - Laminated type inductor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminated type inductor capable of improving high-frequency characteristics by reducing a stray capacitance. <P>SOLUTION: The laminated type inductor has a laminate 10 laminating non-magnetic layers A1 to A9, a coil L1 electrically connecting conductor patterns B1 to B9 mutually and leading-out conductors C1 and C2. The conductor patterns B2 and B3 are formed on the non-magnetic layer A4, those B4 and B5 on the non-magnetic layer A5, those B6 and B7 on the non-magnetic layer A6 and those B8 and B9 on the non-magnetic layer A7, respectively. The conductor patterns B2, B4, B3, B5, B6, B8, B7 and B9 are connected electrically in this order. A distance d2 between the conductor pattern B8 and the leading-out conductor C2 is set to be larger than that d1 between the conductor pattern B7 and the leading-out conductor C2. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a multilayer inductor.

Conventionally, a laminate in which a plurality of insulator layers are laminated and a coil provided in the laminate by electrically connecting a plurality of conductor patterns to each other, each conductor pattern being substantially C-shaped. A multilayer inductor is known (for example, see Patent Document 1).
JP 2005-166745 A

  However, in the conventional multilayer inductor described in Patent Document 1, since each conductor pattern constituting the coil is substantially C-shaped, stray capacitance is generated in a portion where the conductor pattern is bent. Therefore, there is a problem that desired characteristics cannot be obtained when the multilayer inductor is used in a high frequency region.

  An object of the present invention is to provide a multilayer inductor capable of reducing the stray capacitance and improving the high frequency characteristics.

  A multilayer inductor according to the present invention is configured by laminating a plurality of insulator layers, and includes a multilayer body having a pair of main surfaces facing each other so as to be parallel to each other, and a first multilayer body disposed on the outer surface of the multilayer body. The first and second external electrodes and a plurality of linear conductor patterns are electrically connected to each other. The coil is provided in the laminated body, and is electrically connected to one end of the coil. A first lead conductor electrically connected to one outer conductor, and a second lead conductor electrically connected to the other end of the coil and electrically connected to the second external electrode. A plurality of conductor patterns, a pair of first and second conductor patterns arranged so as to have a predetermined interval in one virtual plane among a plurality of virtual planes perpendicular to the opposing direction of the pair of main surfaces; One of several virtual planes A pair of third and fourth conductor patterns arranged in a virtual plane different from the plane so as to have a predetermined distance from each other and adjacent to the first and second conductor patterns in the opposing direction; The first and second conductor patterns intersect with the third and fourth conductor patterns as viewed from the opposing direction, and one end of the first conductor pattern and one end of the third conductor pattern are electrically connected. The other end of the third conductor pattern and one end of the second conductor pattern are electrically connected, the other end of the second conductor pattern and one end of the fourth conductor pattern are electrically connected, One conductor pattern of the plurality of conductor patterns is located on the same virtual plane as the first lead conductor of the plurality of virtual planes and is formed integrally with the first lead conductor. Multiple conductor patterns The other conductor pattern different from the one conductor pattern is located on a virtual plane different from the virtual plane on which the first lead conductor is located among the plurality of virtual planes, and in a direction opposite to the first lead conductor. Adjacent to each other, the distance between the first lead conductor and one conductor pattern is equal to or greater than the distance between the first lead conductor and another conductor pattern.

  In the multilayer inductor according to the present invention, a plurality of linear conductor patterns are electrically connected to each other to form a coil. Therefore, the bent portion does not exist in the conductor pattern. As a result, it is possible to reduce the stray capacitance generated in the portion where the conductor pattern is bent, as compared with the conventional multilayer inductor, and to improve the high frequency characteristics. In the multilayer inductor according to the present invention, the plurality of conductor patterns constituting the coil have first to fourth conductor patterns, and the first and second conductor patterns are arranged on one virtual plane. The third and fourth conductor patterns are arranged on another virtual plane. Then, one end of the first conductor pattern and one end of the third conductor pattern are electrically connected, the other end of the third conductor pattern and one end of the second conductor pattern are electrically connected, The other end of the second conductor pattern and one end of the fourth conductor pattern are electrically connected. Therefore, compared with the case where the 1st-4th conductor pattern is arrange | positioned on a respectively different virtual plane, the thickness of the laminated body in the opposing direction of a pair of main surface can be made small. As a result, it is possible to reduce the size of the multilayer inductor. Furthermore, in the multilayer inductor according to the present invention, the distance between the first lead conductor and one conductor pattern is equal to or greater than the distance between the first lead conductor and another conductor pattern. For this reason, the first lead conductor and one conductor pattern arranged on the same virtual plane are sufficiently separated from each other. As a result, the stray capacitance generated between the first lead conductor and the one conductor pattern can be reduced.

  The multilayer inductor according to the present invention is configured by laminating a plurality of insulator layers, and is disposed on a multilayer body having a pair of main surfaces facing each other so as to be parallel to each other, and on the outer surface of the multilayer body. The first and second external electrodes and a plurality of linear conductor patterns are electrically connected to each other, and are electrically connected to a coil provided inside the laminate and one end of the coil. A first lead conductor electrically connected to the first outer conductor, and a second lead conductor electrically connected to the other end of the coil and electrically connected to the second external electrode; And the plurality of conductor patterns are a pair of first and second conductor patterns arranged so as to have a predetermined interval in one virtual plane among a plurality of virtual planes perpendicular to the opposing direction of the pair of main surfaces. And out of multiple virtual planes And a pair of third and fourth conductor patterns that are arranged to have a predetermined distance from each other in another virtual plane different from the virtual plane and that are adjacent to the first and second conductor patterns in the opposite direction. The first and second conductor patterns intersect with the third and fourth conductor patterns as viewed from the opposing direction, and one end of the first conductor pattern and one end of the third conductor pattern are electrically connected. The other end of the third conductor pattern and one end of the second conductor pattern are electrically connected, and the other end of the second conductor pattern and one end of the fourth conductor pattern are electrically connected. The first lead conductor and the conductor pattern that is not formed integrally with the first lead conductor among the plurality of conductor patterns are arranged on mutually different virtual planes among the plurality of virtual planes. And

  In the multilayer inductor according to the present invention, a plurality of linear conductor patterns are electrically connected to each other to form a coil. Therefore, the bent portion does not exist in the conductor pattern. As a result, it is possible to reduce the stray capacitance generated in the portion where the conductor pattern is bent, as compared with the conventional multilayer inductor, and to improve the high frequency characteristics. In the multilayer inductor according to the present invention, the plurality of conductor patterns constituting the coil have first to fourth conductor patterns, and the first and second conductor patterns are arranged on one virtual plane. The third and fourth conductor patterns are arranged on another virtual plane. Then, one end of the first conductor pattern and one end of the third conductor pattern are electrically connected, the other end of the third conductor pattern and one end of the second conductor pattern are electrically connected, The other end of the second conductor pattern and one end of the fourth conductor pattern are electrically connected. Therefore, compared with the case where the 1st-4th conductor pattern is arrange | positioned on a respectively different virtual plane, the thickness of the laminated body in the opposing direction of a pair of main surface can be made small. As a result, it is possible to reduce the size of the multilayer inductor. Furthermore, in the multilayer inductor according to the present invention, the first lead conductor and a predetermined conductor pattern that is not formed integrally with the first lead conductor among the plurality of conductor patterns are mutually connected among the plurality of virtual planes. Arranged in different virtual planes. Therefore, the first lead conductor and the predetermined conductor pattern are sufficiently separated. As a result, the stray capacitance generated between the first lead conductor and the predetermined conductor pattern can be reduced. Further, when the first lead conductor and the predetermined conductor pattern are arranged on the same virtual plane, the first lead conductor and the predetermined conductor pattern are arranged so as to be sufficiently separated from each other. Although there was a need, it is not necessary to take such considerations.

  The first lead conductor is formed so as to increase in width from one end of the coil toward the first external electrode, and the second lead conductor extends from the other end of the coil to the second external electrode. It is preferable that the width is increased as it goes. In this way, the contact area between the first external electrode and the first lead conductor is increased. Therefore, it is possible to improve the connection reliability between the first external electrode and the first lead conductor. Further, when this is done, there is no sudden change in the transmission path of the electrical signal at the connection portion between the first lead conductor and one end of the coil. That is, since the impedance and the size of the cross-sectional area of the conductor are inversely proportional, the impedance of the first lead conductor gradually increases as going from the first external electrode to one end of the coil. As a result, impedance matching is performed, and reflection of the electric signal can be reduced.

  Further, it is preferable that the first lead conductor is not formed integrally with any of the plurality of conductor patterns. When the first lead conductor and the conductor pattern are integrally formed, stray capacitance may occur due to bending at the connection portion between the first lead conductor and the conductor pattern. As a result, there is no bending at the connection portion between the first lead conductor and the conductor pattern, so that the stray capacitance can be further reduced.

  The first and second conductor patterns are arranged on one virtual plane so as to be parallel to each other when viewed from the facing direction, and the third and fourth conductor patterns are parallel to each other when viewed from the facing direction. As described above, the first and second conductor patterns and the third and fourth conductor patterns are preferably orthogonal to each other when viewed from the opposing direction. In this case, the first and second conductor patterns are not parallel to each other when viewed from the opposing direction, and the third and fourth conductor patterns are not parallel to each other when viewed from the opposing direction. Compared to the case where the pattern and the third and fourth conductor patterns are not orthogonal when viewed from the facing direction, it is possible to ensure a large coil diameter.

  According to the present invention, it is possible to provide a multilayer inductor capable of reducing stray capacitance and improving high frequency characteristics.

  Preferred embodiments of the present invention will be described with reference to the drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and a duplicate description is omitted.

(First embodiment)
The configuration of the multilayer inductor 1 according to the first embodiment will be described with reference to FIGS. FIG. 1 is a perspective view showing a multilayer inductor according to first to third embodiments. FIG. 2 is an exploded perspective view for explaining the configuration of the multilayer body included in the multilayer inductor according to the first embodiment. FIG. 3 is a front view showing one non-magnetic layer constituting the multilayer body included in the multilayer inductor according to the first embodiment. FIG. 4 is a top perspective view of the multilayer body included in the multilayer inductor according to the first embodiment.

  As shown in FIG. 1, the multilayer inductor 1 includes a substantially rectangular parallelepiped multilayer body 10, a pair of external electrodes 12 and 14 formed on both side surfaces in the longitudinal direction of the multilayer body 10, and the multilayer body 10. Inside, a linear (substantially I-shaped) conductor pattern B1 to B9 is provided with a coil L1 electrically connected to each other. The laminated body 10 has a pair of main surfaces S1 and S2 that face each other so as to be parallel to each other.

  As illustrated in FIG. 2, the stacked body 10 is configured by stacking nonmagnetic layers A1 to A9. That is, the upper surface of the nonmagnetic material layer A1 constitutes the main surface S1 of the multilayer body 10, and the lower surface of the nonmagnetic material layer A9 constitutes the main surface S2 of the multilayer body 10 (see FIG. 2). , S2 facing direction (hereinafter referred to as facing direction) corresponds to the stacking direction (hereinafter referred to as stacking direction) of the stacked body 10 (nonmagnetic layers A1 to A9) in the present embodiment. The nonmagnetic layers A1 to A9 function as an insulator having electrical insulation. The nonmagnetic layers A1 to A9 can be formed using, for example, a glass-based ceramic containing strontium, calcium, alumina, silicon oxide, and the like. The actual multilayer inductor 1 is integrated to such an extent that the boundaries between the nonmagnetic layers A1 to A9 cannot be visually recognized. Therefore, “the surface of the non-magnetic layer” used to describe the configuration of the multilayer inductor 1 in the following means a virtual plane.

  A conductor pattern B1 and a lead conductor C1 are formed on the surface of the nonmagnetic layer A3. The conductor pattern B1 is disposed so as to be positioned at one end of the coil L1. A lead conductor C1 is integrally formed at one end of the conductor pattern B1. The lead conductor C1 is drawn out to the edge of the nonmagnetic layer A3 on the side where the external electrode 12 is formed, and its end is exposed at the end face of the nonmagnetic layer A3. The lead conductor C1 is directed from the terminal axis P along which the conductor pattern B1 (one end of the coil L1) extends toward the axial center of the coil L1 (toward the far edge of the nonmagnetic layer A3 when viewed from the terminal axis P). It is formed to extend. The lead conductor C1 increases in width from the conductor pattern B1 (one end of the coil L1) toward the end face (external electrode 12) of the nonmagnetic layer A3. For this reason, the conductor pattern B1 is electrically connected to the external electrode 12 through the lead conductor C1. The other end of the conductor pattern B1 is electrically connected to a through-hole electrode D1 formed through the nonmagnetic layer A3 in the thickness direction. For this reason, the conductor pattern B1 is electrically connected to the corresponding conductor pattern B2 through the through-hole electrode D1 in a stacked state.

  Conductor patterns B2 and B3 are formed on the surface of the nonmagnetic layer A4. The conductor pattern B2 and the conductor pattern B3 are arranged in the nonmagnetic layer A4 so as to be parallel to each other when viewed from the facing direction (stacking direction). The conductor patterns B2 and B3 are arranged so as to be orthogonal to the conductor patterns B1, B4, and B5 adjacent to each other in the facing direction (stacking direction) when viewed from the facing direction (stacking direction). One end of the conductor pattern B2 includes a region electrically connected to the through-hole electrode D1 in a stacked state. The other end of the conductor pattern B2 is electrically connected to a through-hole electrode D2 formed so as to penetrate the nonmagnetic layer A4 in the thickness direction. For this reason, the conductor pattern B2 is electrically connected to the corresponding conductor pattern B4 through the through-hole electrode D2 in a stacked state. One end of the conductor pattern B3 is electrically connected to a through-hole electrode D3 formed so as to penetrate the nonmagnetic layer A4 in the thickness direction. The other end of the conductor pattern B3 is electrically connected to a through-hole electrode D4 formed so as to penetrate the nonmagnetic layer A4 in the thickness direction. Therefore, the conductor pattern B3 is electrically connected to the corresponding conductor patterns B3 and B4 via the through-hole electrodes D3 and D4 in a stacked state.

  Conductor patterns B4 and B5 are formed on the surface of the nonmagnetic layer A5. The conductor pattern B4 and the conductor pattern B5 are arranged so as to be parallel to each other when viewed from the facing direction (stacking direction) in the nonmagnetic layer A5. The conductor patterns B4 and B5 are arranged so as to be orthogonal to the conductor patterns B2, B3, B6, and B7 that are adjacent to each other in the facing direction (stacking direction) when viewed from the facing direction (stacking direction). One end of the conductor pattern B4 includes a region electrically connected to the through-hole electrode D2 in a stacked state. The other end of the conductor pattern B4 includes a region electrically connected to the through-hole electrode D3 in a stacked state. One end of the conductor pattern B5 includes a region electrically connected to the through-hole electrode D4 in a stacked state. The other end of the conductor pattern B5 is electrically connected to a through-hole electrode D5 formed through the nonmagnetic material layer A5 in the thickness direction. For this reason, the conductor pattern B5 is electrically connected to the corresponding conductor pattern B6 via the through-hole electrode D5 in a stacked state.

  Conductor patterns B6 and B7 are formed on the surface of the nonmagnetic layer A6. The conductor pattern B6 and the conductor pattern B7 are arranged in the nonmagnetic layer A6 so as to be parallel to each other when viewed from the facing direction (stacking direction). The conductor patterns B6 and B7 are arranged so as to be orthogonal to the conductor patterns B4, B5, B8, and B9 adjacent to each other in the stacking direction of the multilayer body 10 when viewed from the facing direction (stacking direction). One end of the conductor pattern B6 includes a region electrically connected to the through-hole electrode D5 in a stacked state. The other end of the conductor pattern B6 is electrically connected to a through-hole electrode D6 formed through the nonmagnetic layer A6 in the thickness direction. For this reason, the conductor pattern B6 is electrically connected to the corresponding conductor pattern B8 through the through-hole electrode D6 in a stacked state. One end of the conductor pattern B7 is electrically connected to a through-hole electrode D7 formed through the nonmagnetic material layer A6 in the thickness direction. The other end of the conductor pattern B7 is electrically connected to a through-hole electrode D8 formed through the nonmagnetic layer A6 in the thickness direction. For this reason, the conductor pattern B7 is electrically connected to the corresponding conductor patterns B8 and B9 via the through-hole electrodes D7 and D8 in a stacked state.

  Conductor patterns B8 and B9 and a lead conductor C2 are formed on the surface of the nonmagnetic layer A7. The conductor pattern B8 and the conductor pattern B9 are arranged in the nonmagnetic layer A7 so as to be parallel to each other when viewed from the facing direction (stacking direction). The conductor patterns B8 and B9 are arranged so as to be orthogonal to the conductor patterns B6 and B7 adjacent to each other in the facing direction (stacking direction) when viewed from the facing direction (stacking direction). One end of the conductor pattern B8 includes a region electrically connected to the through-hole electrode D6 in a stacked state. The other end of the conductor pattern B8 includes a region electrically connected to the through-hole electrode D7 in a stacked state. The conductor pattern B9 is disposed so as to be positioned at the other end of the coil L1. One end of the conductor pattern B9 includes a region electrically connected to the through-hole electrode D8 in a stacked state. A lead conductor C2 is formed integrally with the other end of the conductor pattern B9. The lead conductor C2 is drawn to the edge of the nonmagnetic material layer A7 on the side where the external electrode 14 is formed, and its end is exposed at the end surface of the nonmagnetic material layer A7. The lead conductor C2 is directed from the terminal axis Q along the conductor pattern B9 (the other end of the coil L1) toward the axial center of the coil L1 (toward the far edge of the nonmagnetic layer A7 when viewed from the terminal axis Q). ) It is formed to extend. The lead conductor C2 increases in width from the conductor pattern B9 (the other end of the coil L1) toward the end surface (external electrode 14) of the nonmagnetic layer A7. For this reason, the conductor pattern B9 is electrically connected to the external electrode 14 via the lead conductor C2.

  In the laminate 10 in which the above-described nonmagnetic layers A1 to A9 are laminated, as shown in FIG. 4, the pair of conductor patterns formed on the same nonmagnetic layer is viewed from the facing direction (stacking direction). The conductor patterns adjacent to each other in the facing direction (stacking direction) are orthogonal to each other when viewed from the facing direction (stacking direction).

  Here, the conductor pattern B7 is formed on the surface of the nonmagnetic layer A6 different from the nonmagnetic layer A7 on which the lead conductor C2 is formed, and is adjacent to the lead conductor C2 in the facing direction (stacking direction). Matching. The distance d1 between the conductor pattern B7 and the lead conductor C2 can be set to about 30 μm, for example. As shown in FIGS. 2 and 3, the conductor pattern B8 is formed on the surface of the same nonmagnetic layer A7 as the lead conductor C2, and is not formed integrally with the lead conductor C2. ing. The distance d2 between the conductor pattern B8 and the lead conductor C2 is set to be not less than the distance d1 between the conductor pattern B7 and the lead conductor C2, and can be about 40 to 50 μm, for example.

  As described above, in the first embodiment, the linear conductor patterns B1 to B9 are electrically connected to each other to configure the coil L1. Therefore, the bent part does not exist in the conductor patterns B1 to B9. As a result, it is possible to reduce the stray capacitance generated in the portion where the conductor pattern is bent, as compared with the conventional multilayer inductor, and to improve the high frequency characteristics.

  In the first embodiment, the conductor patterns B2 and B3 are formed on the same nonmagnetic layer A4, the conductor patterns B4 and B5 are formed on the same nonmagnetic layer A5, and the conductor patterns B6 and B7 are formed. Are formed on the same nonmagnetic layer A6, and conductor patterns B8 and B9 are formed on the same nonmagnetic layer A7. The other end of the conductor pattern B2 is electrically connected to one end of the conductor pattern B4, the other end of the conductor pattern B4 is electrically connected to one end of the conductor pattern B3, and the other end of the conductor pattern B3 is the conductor pattern B5. The other end of the conductor pattern B5 is electrically connected to one end of the conductor pattern B6, the other end of the conductor pattern B6 is electrically connected to one end of the conductor pattern B8, and the conductor pattern B8. The other end of the conductor pattern B7 is electrically connected to one end of the conductor pattern B7, and the other end of the conductor pattern B7 is electrically connected to one end of the conductor pattern B9. Therefore, the thickness of the multilayer body 10 in the facing direction (lamination direction) can be reduced as compared with the case where the conductor patterns B2 to B9 are formed in different nonmagnetic layers. As a result, the multilayer inductor 1 can be reduced in size.

  In the first embodiment, the distance d2 between the conductor pattern B8 and the lead conductor C2 is set to be not less than the distance d1 between the conductor pattern B7 and the lead conductor C2. Therefore, the conductor pattern B8 and the lead conductor C2 formed on the surface of the same nonmagnetic material layer A7 are sufficiently separated. As a result, the stray capacitance generated between the conductor pattern B8 and the lead conductor C2 can be reduced.

  Further, in the first embodiment, the lead conductor C1 has a non-magnetic layer A3 from the terminal axis P along the conductor pattern B1 (one end of the coil L1) toward the axial center side of the coil L1 (when viewed from the terminal axis P). And the width increases from the conductor pattern B1 (one end of the coil L1) toward the end surface (external electrode 12) of the nonmagnetic layer A3. The lead conductor C2 extends from the terminal axis Q along the conductor pattern B9 (the other end of the coil L1) toward the axial center of the coil L1 (on the far edge of the nonmagnetic layer A7 when viewed from the terminal axis Q). The width of the conductive pattern B9 increases from the conductor pattern B9 (the other end of the coil L1) toward the end surface (external electrode 14) of the nonmagnetic layer A7. For this reason, it is possible to improve the connection reliability between the external electrode 12 and the lead conductor C1 and the connection reliability between the external electrode 14 and the lead conductor C2. In addition, there is a sudden change in the transmission path of the electrical signal at the connection portion between the lead conductor C1 and one end (conductor pattern B1) of the coil L1 and the connection portion between the lead conductor C2 and the other end (conductor pattern B9) of the coil L1. Disappear. That is, since the impedance and the size of the cross-sectional area of the conductor are inversely proportional, the impedance of the lead conductor C1 gradually increases from the external electrode 12 toward one end (conductor pattern B1) of the coil L1, and the external electrode 14 The impedance of the lead conductor C2 gradually increases toward the other end (conductor pattern B9) of the coil L1. As a result, impedance matching is performed, and reflection of the electric signal can be reduced.

  In the first embodiment, the conductor patterns B2 and B3 are formed on the nonmagnetic layer A4 so as to be parallel to each other, and the conductor patterns B4 and B5 are formed on the nonmagnetic layer A5 so as to be parallel to each other. The conductor patterns B6 and B7 are formed on the nonmagnetic layer A6 so as to be parallel to each other, and the conductor patterns B8 and B9 are formed on the nonmagnetic layer A7 so as to be parallel to each other. And conductor pattern B1-B9 is arrange | positioned so that it may orthogonally cross with the conductor pattern adjacent to an opposing direction (lamination direction) seeing from an opposing direction (lamination direction). Therefore, the conductor patterns B2 and B3, the conductor patterns B4 and B5, the conductor patterns B6 and B7, and the conductor patterns B8 and B9 are not parallel to each other, and the conductor patterns B1 to B9 are opposite to each other when viewed from the opposite direction (stacking direction). A large coil diameter can be secured as compared with the case where the conductor pattern is not orthogonal to the adjacent (lamination direction).

(Second Embodiment)
Next, the configuration of the multilayer inductor 2 according to the second embodiment will be described with reference to FIGS. 1 and 5. FIG. 5 is an exploded perspective view for explaining the configuration of the multilayer body included in the multilayer inductor according to the second embodiment. Below, it demonstrates centering around difference with the multilayer inductor 1 which concerns on 1st Embodiment, and the overlapping description is abbreviate | omitted.

  As shown in FIG. 1, the multilayer inductor 2 includes a substantially rectangular parallelepiped laminate 20, linear (substantially I-shaped) conductor patterns B <b> 1 to B <b> 9 and island-like conductor patterns B <b> 21 inside the laminate 20. Are provided with coils L2 that are electrically connected to each other.

  As shown in FIG. 5, the stacked body 20 is configured by stacking nonmagnetic layers A1 to A6, A21, A22, A8, and A9. The nonmagnetic layers A1 to A6, A21, A22, A8, and A9 function as an insulator having electrical insulation. In the actual multilayer inductor 2, the nonmagnetic layers A1 to A6, A21, A22, A8, and A9 are integrated so that the boundaries cannot be visually recognized.

  A conductor pattern B8 and a conductor pattern B21 are formed on the surface of the nonmagnetic layer A21. The conductor pattern B21 includes a region that is electrically connected to the through-hole electrode D8 in a stacked state. The center of the conductor pattern B21 is electrically connected to a through-hole electrode D21 formed through the nonmagnetic layer A21 in the thickness direction. For this reason, the conductor pattern B21 is electrically connected to one end of the corresponding conductor pattern B9 through the through-hole electrode D21 in a stacked state.

  A conductor pattern B9 and a lead conductor C2 are formed on the surface of the nonmagnetic layer A22.

  As described above, in the second embodiment, the linear conductor patterns B1 to B9 and the island-shaped conductor pattern B21 are electrically connected to each other to configure the coil L2. Therefore, the bent part does not exist in the conductor patterns B1 to B9 and B21. As a result, it is possible to reduce the stray capacitance generated in the portion where the conductor pattern is bent, as compared with the conventional multilayer inductor, and to improve the high frequency characteristics.

  In the second embodiment, the conductor patterns B2 and B3 are formed on the same nonmagnetic layer A4, and the conductor patterns B4 and B5 are formed on the same nonmagnetic layer A5. The other end of the conductor pattern B2 is electrically connected to one end of the conductor pattern B4, the other end of the conductor pattern B4 is electrically connected to one end of the conductor pattern B3, and the other end of the conductor pattern B3 is the conductor pattern B5. Is electrically connected to one end. Therefore, the thickness of the stacked body 20 in the facing direction (stacking direction) can be reduced as compared with the case where the conductor patterns B2 to B5 are formed in different nonmagnetic layers. As a result, the multilayer inductor 2 can be reduced in size.

  In the second embodiment, the conductor patterns B2 to B8 and B21 are not formed integrally with the lead conductors C1 and C2, and the conductor patterns B2 to B8 and B21 and the lead conductors C1 and C2 are different from each other. It is formed in the body layer. Therefore, the conductor patterns B2 to B8, B21 and the lead conductors C1, C2 are sufficiently separated. As a result, stray capacitance generated between the conductor patterns B2 to B8, B21 and the lead conductors C1, C2 can be reduced. Further, when the conductor pattern B8 and the lead conductor C2 are formed on the same nonmagnetic material layer A7 as in the first embodiment, the conductor pattern B8 and the lead conductor C2 are sufficiently separated from each other. In this way, it is necessary to form the layer on the nonmagnetic layer A7. However, in the second embodiment, it is not necessary to take such consideration into consideration.

  Further, in the second embodiment, the lead conductor C1 has a nonmagnetic layer A3 from the terminal axis P along the conductor pattern B1 (one end of the coil L2) toward the axial center side of the coil L2 (when viewed from the terminal axis P). The width of the conductive pattern B1 increases toward the end face (external electrode 12) of the nonmagnetic layer A3 from the conductor pattern B1 (one end of the coil L2). The lead conductor C2 extends from the terminal axis Q along the conductor pattern B9 (the other end of the coil L2) toward the axial center of the coil L2 (on the far edge of the nonmagnetic layer A22 as viewed from the terminal axis Q). And the width increases from the conductor pattern B9 (the other end of the coil L2) toward the end surface (the external electrode 14) of the nonmagnetic layer A22. For this reason, it is possible to improve the connection reliability between the external electrode 12 and the lead conductor C1 and the connection reliability between the external electrode 14 and the lead conductor C2. In addition, there is a sudden change in the transmission path of the electrical signal at the connection portion between the lead conductor C1 and one end (conductor pattern B1) of the coil L2 and the connection portion between the lead conductor C2 and the other end (conductor pattern B9) of the coil L2. Disappear. That is, since the impedance and the size of the cross-sectional area of the conductor are inversely proportional, the impedance of the lead conductor C1 gradually increases from the external electrode 12 toward one end (conductor pattern B1) of the coil L2, and the external electrode 14 The impedance of the lead conductor C2 gradually increases toward the other end (conductor pattern B9) of the coil L2. As a result, impedance matching is performed, and reflection of the electric signal can be reduced.

  In the second embodiment, the conductor patterns B2 and B3 are formed on the nonmagnetic layer A4 so as to be parallel to each other, and the conductor patterns B4 and B5 are formed on the nonmagnetic layer A5 so as to be parallel to each other. The conductor patterns B6 and B7 are formed on the nonmagnetic material layer A6 so as to be parallel to each other. And conductor pattern B1-B9 is arrange | positioned so that it may orthogonally cross with the conductor pattern adjacent to an opposing direction (lamination direction) seeing from an opposing direction (lamination direction). Therefore, the conductor patterns B2 and B3, the conductor patterns B4 and B5, and the conductor patterns B6 and B7 are not parallel to each other, and the conductor patterns B1 to B9 are adjacent to each other in the opposite direction (stacking direction) when viewed from the opposite direction (stacking direction). A large coil diameter can be ensured as compared with a case where the matching conductor pattern is not orthogonal.

(Third embodiment)
Next, the configuration of the multilayer inductor 3 according to the third embodiment will be described with reference to FIGS. 1 and 6. FIG. 6 is an exploded perspective view for explaining the configuration of the multilayer body included in the multilayer inductor according to the third embodiment. Below, it demonstrates centering around difference with the multilayer inductor 1 which concerns on 1st Embodiment, and the overlapping description is abbreviate | omitted.

  As shown in FIG. 1, the multilayer inductor 3 includes a substantially rectangular parallelepiped multilayer body 30 and linear (substantially I-shaped) conductor patterns B <b> 1 to B <b> 8 and B <b> 31 in the multilayer body 30. And a coil L3 connected to the.

  As shown in FIG. 6, the laminated body 30 is configured by laminating nonmagnetic layers A1 to A6, A31, A32, A8, and A9. The nonmagnetic layers A1 to A6, A31, A32, A8, and A9 function as an insulator having electrical insulation. In the actual multilayer inductor 3, the nonmagnetic layers A1 to A6, A31, A32, A8, and A9 are integrated so that the boundaries cannot be visually recognized.

  Conductor patterns B8 and B31 are formed on the surface of the nonmagnetic layer A31. The conductor pattern B8 and the conductor pattern B31 are arranged in the nonmagnetic layer A31 so as to be parallel to each other when viewed from the stacking direction of the stacked body 30. The conductor patterns B8 and B31 are arranged so as to be orthogonal to the conductor patterns B6 and B7 adjacent to each other in the facing direction (stacking direction) when viewed from the facing direction (stacking direction). The conductor pattern B31 is disposed so as to be located at the other end of the coil L3. One end of the conductor pattern B31 includes a region electrically connected to the through-hole electrode D8 in a stacked state. The other end of the conductor pattern B31 is electrically connected to a through-hole electrode D31 formed through the nonmagnetic layer A31 in the thickness direction. For this reason, the conductor pattern B31 is electrically connected to the corresponding lead conductor C31 via the through-hole electrode D31 in a stacked state.

  A lead conductor C31 is formed on the surface of the nonmagnetic layer A32. One end of the lead conductor C31 includes a region electrically connected to the through-hole electrode D31 in a stacked state. The lead conductor C31 is drawn to the edge of the nonmagnetic layer A32 on the side where the external electrode 14 is formed, and its end is exposed at the end face of the nonmagnetic layer A32. The lead conductor C31 is directed from the terminal axis Q along the conductor pattern B9 (the other end of the coil L3) toward the axial center of the coil L3 (toward the far edge of the nonmagnetic layer A32 when viewed from the terminal axis Q). ) It is formed to extend. The lead conductor C31 increases in width from the conductor pattern B9 (the other end of the coil L3) toward the end surface (external electrode 14) of the nonmagnetic layer A32.

  As described above, in the third embodiment, the linear conductor patterns B1 to B8, B31 are electrically connected to each other to constitute the coil L3. Therefore, the bent part does not exist in the conductor patterns B1 to B8 and B31. As a result, it is possible to reduce the stray capacitance generated in the portion where the conductor pattern is bent, as compared with the conventional multilayer inductor, and to improve the high frequency characteristics.

  In the third embodiment, the conductor patterns B2 and B3 are formed on the same nonmagnetic layer A4, the conductor patterns B4 and B5 are formed on the same nonmagnetic layer A5, and the conductor patterns B6 and B7 are formed. Are formed on the same nonmagnetic layer A6, and the conductor patterns B8 and B31 are formed on the same nonmagnetic layer A31. The other end of the conductor pattern B2 is electrically connected to one end of the conductor pattern B4, the other end of the conductor pattern B4 is electrically connected to one end of the conductor pattern B3, and the other end of the conductor pattern B3 is the conductor pattern B5. The other end of the conductor pattern B5 is electrically connected to one end of the conductor pattern B6, the other end of the conductor pattern B6 is electrically connected to one end of the conductor pattern B8, and the conductor pattern B8. The other end of the coil L3 is electrically connected to one end of the conductor pattern B7, and the other end of the conductor pattern B7 is electrically connected to one end of the conductor pattern B31, thereby forming a part of the coil L3. Therefore, the thickness of the stacked body 30 in the facing direction (stacking direction) can be reduced as compared with the case where the conductor patterns B2 to B8 and B31 are formed in different nonmagnetic layers. As a result, the multilayer inductor 3 can be reduced in size.

  In the third embodiment, the conductor patterns B2 to B8 and B31 are not integrally formed with the lead conductors C1 and C31, and the conductor patterns B2 to B8 and B31 and the lead conductors C1 and C31 are different from each other. It is formed in the body layer. Therefore, the conductor patterns B2 to B8, B31 and the lead conductors C1, C31 are sufficiently separated. As a result, stray capacitance generated between the conductor patterns B2 to B8, B31 and the lead conductors C1, C31 can be reduced. Further, when the conductor pattern B8 and the lead conductor C2 are formed on the same nonmagnetic material layer A7 as in the first embodiment, the conductor pattern B8 and the lead conductor C2 are sufficiently separated from each other. In this manner, it is necessary to form the nonmagnetic material layer A7 on the nonmagnetic material layer A7. However, in the third embodiment, it is not necessary to take such consideration.

  In the third embodiment, the lead conductor C1 extends from the terminal axis P along the conductor pattern B1 (one end of the coil L3) toward the axial center side of the coil L3 (as viewed from the terminal axis P). The width of the conductive pattern B1 increases toward the end face (external electrode 12) of the nonmagnetic layer A3 from the conductor pattern B1 (one end of the coil L3). The lead conductor C31 extends from the terminal axis Q along the conductor pattern B31 (the other end of the coil L3) toward the axial center of the coil L3 (on the far edge of the nonmagnetic layer A32 when viewed from the terminal axis Q). And the width becomes wider from the conductor pattern B31 (the other end of the coil L3) toward the end surface (the external electrode 14) of the nonmagnetic layer A32. Therefore, it is possible to improve the connection reliability between the external electrode 12 and the lead conductor C1 and the connection reliability between the external electrode 14 and the lead conductor C31. In addition, there is a sudden change in the transmission path of the electrical signal at the connection portion between the lead conductor C1 and one end (conductor pattern B1) of the coil L3 and the connection portion between the lead conductor C31 and the other end (conductor pattern B31) of the coil L3. Disappear. That is, since the impedance and the size of the cross-sectional area of the conductor are inversely proportional, the impedance of the lead conductor C1 gradually increases from the external electrode 12 toward one end (conductor pattern B1) of the coil L3, and from the external electrode 14 The impedance of the lead conductor C31 gradually increases toward the other end (conductor pattern B31) of the coil L3. As a result, impedance matching is performed, and reflection of the electric signal can be reduced.

  In the third embodiment, the lead conductor C31 is not formed integrally with the conductor patterns B1 to B8, B31. Therefore, compared to the case where the lead conductor C31 is formed integrally with any one of the conductor patterns B1 to B8, B31, there is no bending at the connection portion between the lead conductor C31 and the conductor pattern, so that the stray capacitance is reduced. This can be further reduced.

  In the third embodiment, the conductor patterns B2 and B3 are formed on the nonmagnetic layer A4 so as to be parallel to each other, and the conductor patterns B4 and B5 are formed on the nonmagnetic layer A5 so as to be parallel to each other. The conductive patterns B6 and B7 are formed on the nonmagnetic layer A6 so as to be parallel to each other, and the conductor patterns B8 and B31 are formed on the nonmagnetic layer A31 so as to be parallel to each other. And conductor pattern B1-B8, B31 is arrange | positioned so that it may orthogonally cross with the conductor pattern adjacent to an opposing direction (lamination direction) seeing from an opposing direction (lamination direction). Therefore, the conductor patterns B2 and B3, the conductor patterns B4 and B5, the conductor patterns B6 and B7, and the conductor patterns B8 and B31 are not parallel to each other, and the conductor patterns B1 to B8 and B31 are viewed from the facing direction (stacking direction). A large coil diameter can be secured as compared with a case where the conductor pattern is not orthogonal to the adjacent conductor pattern in the facing direction (stacking direction).

  Although the preferred embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments. For example, in the first embodiment, if the distance d2 between the lead conductor C2 and the conductor pattern B8 is set to be greater than or equal to the distance d1 between the conductor pattern B7 and the lead conductor C2, the lead conductor C2 can have various shapes. can do. Specifically, as shown in FIG. 7A, compared to the lead conductor C2 in the multilayer inductor 1 according to the first embodiment, the termination axis Q along which the conductor pattern B9 (the other end of the coil L1) extends. By shortening the length of the lead conductor C41 that extends from the coil L1 toward the axis of the coil L1 (toward the far edge of the nonmagnetic layer A7 when viewed from the end axis Q), the lead conductor C41 and the conductor pattern The distance d3 to B8 may be set to be equal to or greater than the distance d1 between the conductor pattern B7 and the lead conductor C2. Further, as shown in FIG. 7B, the conductor pattern is curved so that the side facing the conductor pattern B8 of the lead conductor C42 is convex toward the end face (external electrode 14) of the nonmagnetic layer A7. By making the width of the conductor pattern C42 wider from B9 (the other end of the coil L1) toward the end face (external electrode 14) of the nonmagnetic layer A7, the distance d4 between the lead conductor C42 and the conductor pattern B8 is increased. You may set so that it may become more than the distance d1 of the conductor pattern B7 and the lead conductor C2.

  Further, in the first to third embodiments, the lead conductor C1 is not viewed from the terminal axis P along the conductor pattern B1 (one end of the coils L1 to L3) toward the axial center side of the coil L1 (as viewed from the terminal axis P). The lead conductors C2 and C31 extend from the terminal axis Q along which the conductor patterns B9 and B31 (the other ends of the coils L1 to L3) extend along the coil L1. Although it is formed to extend toward the axial center side of L3 (toward the far edge of the nonmagnetic layers A7, A22, A32 when viewed from the terminal axis Q), it is not limited thereto. That is, the lead conductor C1 is directed from the terminal axis P along which the conductor pattern B1 (one end of the coils L1 to L3) extends to the opposite side of the axis of the coil L1 (the closer to the nonmagnetic layer A3 as viewed from the terminal axis P). The lead conductors C2 and C31 may be formed so as to extend toward the edge of the coil L1 to L3 from the terminal axis Q along which the conductor patterns B9 and B31 (the other ends of the coils L1 to L3) extend. May be formed so as to extend toward the opposite side (toward the near edges of the nonmagnetic layers A7, A22, A32 when viewed from the end axis Q). The lead conductor C1 may be formed so as to extend toward both sides across the terminal axis P along which the conductor pattern B1 (one end of the coils L1 to L3) extends, and the lead conductors C2 and C31 are formed of the conductor pattern B9. , B31 (the other ends of the coils L1 to L3) may be formed so as to extend toward both sides across the terminal axis Q. Furthermore, the lead conductors C1, C2, C31 may be formed so as to be linear (substantially I-shaped), respectively.

  In the first to third embodiments, the conductor patterns B1 to B9 and the conductor patterns B1 to B8 and B31 are orthogonal to the conductor patterns adjacent to each other in the facing direction (stacking direction) when viewed from the facing direction (stacking direction). However, the conductor patterns B1 to B9 and the conductor patterns B1 to B8 and B31 may be arranged so that the conductor patterns adjacent to each other in the facing direction (stacking direction) intersect each other.

  In the first to third embodiments, the lead conductor C1 and the conductor pattern B1 are integrally formed. However, the lead conductor C1 and the conductor pattern B1 are not integrally formed, and different nonmagnetic layers are formed. It may be formed on top. In the first embodiment, the lead conductor C2 and the conductor pattern B9 are integrally formed. However, the lead conductor C2 and the conductor pattern B9 are not formed integrally, but are formed on different nonmagnetic layers. May be.

  In the first to third embodiments, the stacked bodies 10, 20, and 30 are configured by stacking nonmagnetic layers, but the stacked body may be configured by stacking magnetic layers. . The magnetic layer can be formed using, for example, a ferrite such as Ni—Cu—Zn ferrite, Ni—Cu—Zn—Mg ferrite, Cu—Zn ferrite, or Ni—Cu ferrite.

It is a perspective view which shows the multilayer inductor which concerns on 1st-4th embodiment. It is a disassembled perspective view for demonstrating the structure of the laminated body with which the multilayer inductor which concerns on 1st Embodiment is provided. It is a front view which shows one nonmagnetic material layer which comprises the laminated body with which the multilayer inductor which concerns on 1st Embodiment is provided. It is an upper surface perspective view of the multilayer body with which the multilayer inductor which concerns on 1st Embodiment is provided. It is a disassembled perspective view for demonstrating the structure of the laminated body with which the multilayer inductor which concerns on 2nd Embodiment is provided. It is a disassembled perspective view for demonstrating the structure of the laminated body with which the multilayer inductor which concerns on 3rd Embodiment is provided. It is a front view which shows one nonmagnetic material layer which comprises the laminated body with which the multilayer inductor which concerns on 4th Embodiment is provided.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1-3 ... Multilayer inductor 10, 20, 30 ... Laminated body, 12, 14 ... External electrode, A1-A9, A21, A22, A31, A32 ... Nonmagnetic layer, B1-B9, B21, B31 ... Conductor Pattern, C1, C2, C31, C41, C42 ... Lead conductor, D1-D8, D21, D31 ... Through-hole electrode, d1-d4 ... Distance, L1-L3 ... Coil, P, Q ... Termination axis.

Claims (5)

A laminate having a pair of main surfaces that are configured by laminating a plurality of insulator layers and facing each other so as to be parallel to each other;
First and second external electrodes respectively disposed on the outer surface of the laminate;
A plurality of linear conductor patterns are configured to be electrically connected to each other, and a coil provided inside the laminate,
A first lead conductor electrically connected to one end of the coil and electrically connected to the first outer conductor;
A second lead conductor electrically connected to the other end of the coil and electrically connected to the second external electrode;
The plurality of conductor patterns include a pair of first and second conductor patterns arranged so as to have a predetermined interval in one virtual plane among a plurality of virtual planes perpendicular to the opposing direction of the pair of main surfaces. A pair of the plurality of virtual planes arranged at predetermined intervals in another virtual plane different from the one virtual plane and adjacent to the first and second conductor patterns in the facing direction. A third and a fourth conductor pattern;
The first and second conductor patterns and the third and fourth conductor patterns intersect with each other when viewed from the facing direction,
One end of the first conductor pattern and one end of the third conductor pattern are electrically connected, and the other end of the third conductor pattern and one end of the second conductor pattern are electrically connected. , The other end of the second conductor pattern and one end of the fourth conductor pattern are electrically connected,
One conductor pattern of the plurality of conductor patterns is located on the same virtual plane as the virtual plane on which the first lead conductor is located among the plurality of virtual planes, and is integrated with the first lead conductor. Is not formed,
The other conductor pattern different from the one conductor pattern among the plurality of conductor patterns is located on a virtual plane different from a virtual plane on which the first lead conductor is located among the plurality of virtual planes, and the first Adjacent to one lead conductor in the facing direction,
A multilayer inductor, wherein a distance between the first lead conductor and the one conductor pattern is equal to or greater than a distance between the first lead conductor and the other conductor pattern. A laminate having a pair of main surfaces that are configured by laminating a plurality of insulator layers and facing each other so as to be parallel to each other;
First and second external electrodes respectively disposed on the outer surface of the laminate;
A plurality of linear conductor patterns are configured to be electrically connected to each other, and a coil provided inside the laminate,
A first lead conductor electrically connected to one end of the coil and electrically connected to the first outer conductor;
A second lead conductor electrically connected to the other end of the coil and electrically connected to the second external electrode;
The plurality of conductor patterns include a pair of first and second conductor patterns arranged so as to have a predetermined interval in one virtual plane among a plurality of virtual planes perpendicular to the opposing direction of the pair of main surfaces. A pair of the plurality of virtual planes arranged at predetermined intervals in another virtual plane different from the one virtual plane and adjacent to the first and second conductor patterns in the facing direction. A third and a fourth conductor pattern;
The first and second conductor patterns and the third and fourth conductor patterns intersect with each other when viewed from the facing direction,
One end of the first conductor pattern and one end of the third conductor pattern are electrically connected, and the other end of the third conductor pattern and one end of the second conductor pattern are electrically connected. , The other end of the second conductor pattern and one end of the fourth conductor pattern are electrically connected,
The first lead conductor and the conductor pattern that is not formed integrally with the first lead conductor among the plurality of conductor patterns are arranged on different virtual planes among the plurality of virtual planes. Multilayer inductor characterized by The first lead conductor is formed so as to increase in width from one end of the coil toward the first external electrode,
3. The multilayer inductor according to claim 1, wherein the second lead conductor is formed to have a width that increases from the other end of the coil toward the second external electrode. 4. .   4. The multilayer inductor according to claim 3, wherein the first lead conductor is not formed integrally with any one of the plurality of conductor patterns. 5. The first and second conductor patterns are arranged on the one virtual plane so as to be parallel to each other when viewed from the facing direction,
The third and fourth conductor patterns are arranged on the other virtual plane so as to be parallel to each other when viewed from the facing direction,
The first and second conductor patterns and the third and fourth conductor patterns are orthogonal to each other when viewed from the facing direction. Laminated inductor.

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