JP2007180321A - Hybrid electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a hybrid electronic component capable of removing common mode noise in broadband. <P>SOLUTION: The hybrid electronic component is provided with a rectilinear first conductor 12, a spiral second conductor 13 connected to the first conductor 12, a rectilinear fourth conductor 15 connected to a spiral third conductor 14, a fifth insulating layer 11e provided on the upper surface of the fourth conductor 15, a first to a fourth extracting electrodes 12a-15a, connected respectively to each one end of the first to the fourth conductors 12-15, and a rectilinear metal layer 16 provided on the fifth insulating layer 11e so as to be opposite to at least one part of the fourth conductor 15 via the fifth insulating layer 11e. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a composite electronic component used as a common mode noise filter or the like used in various electronic devices such as digital devices, AV devices, and information communication terminals.

  As shown in FIG. 10, this type of conventional composite electronic component is provided on the top surfaces of the first to sixth insulator layers 1a to 1f and the first to fourth insulator layers 1a to 1d, respectively. The spiral first to fourth conductors 2a to 2d and the flat metal layer 3 provided on the upper surface of the fifth insulator layer 1e were provided.

  A first coil 4 is formed by the first conductor 2a and the second conductor 2b, and a second coil 5 is formed by the third conductor 2c and the fourth conductor 2d. .

  The composite electronic component magnetically couples the first coil 4 and the second coil 5, and forms a capacitor portion between the fourth conductor 2 d and the metal layer 3. Had to be removed.

  As described above, by forming the capacitor portion between the fourth conductor 2d and the metal layer 3, it is possible to remove common mode noise in a higher frequency band as shown in FIG.

As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
JP 2004-194170 A

  In the above-described conventional composite electronic component, since the metal layer 3 has a flat plate shape, an eddy current is generated in the metal layer 3 due to the magnetic field generated in the fourth conductor 2d. Since the inductance value is small, the attenuation of common mode noise is small. As a result, there is a problem that common mode noise in a wide band cannot be removed.

  SUMMARY OF THE INVENTION An object of the present invention is to solve the above-described conventional problems and to provide a composite electronic component capable of removing common mode noise in a wide band.

  In order to achieve the above object, the present invention has the following configuration.

  The invention according to claim 1 of the present invention includes a linear first conductor provided on the upper surface of the first insulating layer, a second insulating layer provided on the upper surface of the first conductor, A spiral second conductor provided on the upper surface of the second insulating layer and connected to the first conductor; a third insulating layer provided on the upper surface of the second conductor; A spiral third conductor provided on the upper surface of the third insulating layer, a fourth insulating layer provided on the upper surface of the third conductor, and an upper surface of the fourth insulating layer; And the linear 4th conductor connected with the said 3rd conductor, the 5th insulating layer provided in the upper surface of the said 4th conductor, and the one end part of each of the said 1st-4th conductor First to fourth extraction electrodes respectively connected to the upper surface of the fifth insulating layer via at least a part of the fourth conductor and the fifth insulating layer. A linear metal layer is provided so as to oppose, and according to this configuration, the upper surface of the fifth insulating layer is opposed to at least a part of the fourth conductor via the fifth insulating layer. Since the linear metal layer is provided as described above, an eddy current is not generated in the metal layer due to the magnetic field generated in the third and fourth conductors, so that the third conductor and the fourth conductor Since the inductance value of the coil becomes large, the attenuation amount of the common mode noise can be increased, and as a result, an effect of being able to remove the common mode noise in a wide band can be obtained.

  According to the second aspect of the present invention, in particular, another metal layer that is linear so as to oppose at least a part of the first conductor via the first insulating layer is formed on the first insulating layer. According to this configuration, the coil having the first conductor and the second conductor has the same effect as the coil having the third conductor and the fourth conductor in claim 1. As a result, the effect of removing common mode noise in a wider band can be obtained.

  In the invention according to claim 3 of the present invention, in particular, first and sixth sixth to sixth electrodes including fifth and sixth extraction electrodes respectively connected to both end portions of the metal layer. Of the first to fifth insulating layers, and arranged in parallel so that the first to sixth extraction electrodes are not connected to each other. Thus, it is possible to obtain an operational effect that it is possible to cope with parallel signal lines.

  According to a fourth aspect of the present invention, a linear first conductor provided on the upper surface of the first insulating layer, a second insulating layer provided on the upper surface of the first conductor, A spiral second conductor provided on the upper surface of the second insulating layer; a third insulating layer provided on the upper surface of the second conductor; and an upper surface of the third insulating layer. A spiral third conductor, a fourth insulating layer provided on the top surface of the third conductor, a linear fourth conductor provided on the top surface of the fourth insulating layer, A fifth insulating layer provided on an upper surface of the fourth conductor; and first to fourth extraction electrodes respectively connected to one end of each of the first to fourth conductors. A metal part connected to at least one of the fourth extraction electrodes and provided on one surface of the sixth insulating layer; at least a part of each of the metal parts; and And a metal layer provided so as to be opposed to each other through the six insulating layers, and the metal portion, the sixth insulating layer, and the metal layer are disposed below the first insulating layer or the fifth insulating layer. In this configuration, the distance between the metal layer and the fourth conductor is increased by providing the metal portion between the metal layer and the fourth conductor. Therefore, no eddy current is generated in the metal layer due to the magnetic field generated in the third and fourth conductors, and this increases the inductance value of the coil composed of the third conductor and the fourth conductor. Attenuation of mode noise can be increased. As a result, common mode noise in a wide band can be removed, and a capacitor part can be formed between the metal part and the metal layer. Remove common mode noise In which the effect that it is Rukoto obtained.

  According to a fifth aspect of the present invention, in particular, the metal portion, the sixth insulating layer, and the metal layer are disposed in the ceramic substrate, and between the ceramic substrate and the fourth insulating layer, or the ceramic. An adhesive layer is formed between the substrate and the first insulating layer. According to this configuration, the ceramic substrate and the fourth insulating layer, or between the ceramic substrate and the first insulating layer. In order to increase the capacity of the capacitor portion formed between the metal portion and the metal portion, the first to fourth insulating layer materials are used as the sixth insulating layer material. The effect is that even if ceramic substrates of different materials are used, they can be integrated.

  As described above, the composite electronic component of the present invention includes a linear first conductor provided on the upper surface of the first insulating layer, a second insulating layer provided on the upper surface of the first conductor, A spiral second conductor provided on the upper surface of the second insulating layer and connected to the first conductor; a third insulating layer provided on the upper surface of the second conductor; A spiral third conductor provided on the upper surface of the third insulating layer, a fourth insulating layer provided on the upper surface of the third conductor, and an upper surface of the fourth insulating layer; And the linear 4th conductor connected with the said 3rd conductor, the 5th insulating layer provided in the upper surface of the said 4th conductor, and the one end part of each of the said 1st-4th conductor First to fourth extraction electrodes connected to each other, and at least a part of the fourth conductor and the fifth insulating layer on the upper surface of the fifth insulating layer. Since the linear metal layers are provided so as to face each other, eddy currents are not generated in the linear metal layers by the magnetic fields generated by the third and fourth conductors. Since the inductance value of the coil composed of the first and fourth conductors is increased, the attenuation amount of the common mode noise can be increased, and as a result, the excellent effect that the common mode noise in a wide band can be removed. It is what you play.

(Embodiment 1)
Hereinafter, the invention described in the first to third aspects of the present invention will be described using the first embodiment.

  FIG. 1 is an exploded perspective view of a composite electronic component according to Embodiment 1 of the present invention, and FIG. 2 is a perspective view of the composite electronic component.

  As shown in FIGS. 1 and 2, the composite electronic component according to Embodiment 1 of the present invention includes a linear first conductor 12 provided on the upper surface of the first insulating layer 11a, and the first conductor. A second insulating layer 11b provided on the upper surface of the second insulating layer 11; a spiral second conductor 13 provided on the upper surface of the second insulating layer 11b and connected to the first conductor 12; A third insulating layer 11c provided on the upper surface of the second conductor 13, a spiral third conductor 14 provided on the upper surface of the third insulating layer 11c, and an upper surface of the third conductor 14; A fourth insulating layer 11d provided on the upper surface of the fourth insulating layer 11d, a linear fourth conductor 15 provided on the upper surface of the fourth insulating layer 11d and connected to the third conductor 14, and the fourth insulating layer 11d. A fifth insulating layer 11e provided on the upper surface of the conductor 15, and each of the first to fourth conductors 12 to 15 In which and a first to fourth lead electrodes 12a~15a respectively connected to the ends.

  In the first embodiment of the present invention, the linear shape is further formed so as to face at least a part of the fourth conductor 15 via the fifth insulating layer 11e on the upper surface of the fifth insulating layer 11e. The metal layer 16 is provided, and another metal layer 17 is formed on the lower surface of the first insulating layer 11a.

The said structure WHEREIN: The said 1st-5th insulating layers 11a-11e are laminated | stacked on an up-down direction, and are the 1st insulating layer 11a, the 2nd insulating layer 11b, the 3rd insulating layer 11c, and the 4th from the bottom. The insulating layer 11d and the fifth insulating layer 11e are formed in this order. The first to fifth insulating layers 11a to 11e are made of an insulating material such as ferrite based on Fe ₂ O ₃ or the like.

  The first conductor 12 is formed by printing or transferring a conductive material such as silver linearly on the upper surface of the first insulating layer 11a. A first lead electrode 12a is connected to one end of the first conductor 12, and the first lead electrode 12a is exposed at one end face of the first insulating layer 11a.

  The second conductor 13 is formed by printing or transferring a conductive material such as silver spirally on the upper surface of the second insulating layer 11b. A second lead electrode 13a is connected to one end of the second conductor 13, and the second lead electrode 13a is exposed at one end face of the second insulating layer 11b. Further, the second conductor 13 is connected to the first conductor 12 via a via electrode (hereinafter not shown) formed on the second insulating layer 11b to constitute one coil.

  The third conductor 14 is formed by printing or transferring a conductive material such as silver spirally on the upper surface of the third insulating layer 11c. A third extraction electrode 14a is connected to one end of the third conductor 14, and the third extraction electrode 14a is exposed at one end surface of the third insulating layer 11c.

  The fourth conductor 15 is formed by printing or transferring a conductive material such as silver linearly on the upper surface of the fourth insulating layer 11d. The fourth lead electrode 15a is connected to one end of the fourth conductor 15, and the fourth lead electrode 15a is exposed at one end face of the fourth insulating layer 11d. Further, the fourth conductor 15 is connected to the third conductor 14 via a via electrode (hereinafter not shown) formed on the fourth insulating layer 11d to constitute one coil.

  The shapes of the first conductor 12 and the fourth conductor also include a straight line shape such as an L shape and a crank shape.

  The metal layer 16 is formed by printing or transferring a conductive material such as silver linearly on the upper surface of the fifth insulating layer 11e. And this metal layer 16 comprises the capacitor | condenser part by the 4th conductor 15 by facing a part of 4th conductor 15 via the 5th insulating layer 11e, The capacity | capacitance is 5 pF or less. Further, the metal layer 16 is also connected to two fifth extraction electrodes 16a exposed on both sides of the fifth insulating layer 11e.

  The other metal layer 17 is formed by printing or transferring a conductive material such as silver linearly on the lower surface of the first insulating layer 11a or the upper surface of the other insulating layer 11f. The other metal layer 17 also forms a capacitor portion with the first conductor 12 by facing a part of the first conductor 12 via the first insulating layer 11a. The capacity is 5 pF or less. Further, the other metal layer 17 is also connected to the two sixth extraction electrodes 17a exposed on both sides of the other insulating layer 11f.

  Further, a predetermined number of dummy insulating layers 18 are formed on the metal layer 16, and these dummy insulating layers 18, the first to fifth insulating layers 11a to 11e, and other insulating layers are formed. The number of 11f is not limited to the number shown in FIG.

  The above-described components form a main body portion 19 of a common mode noise filter as shown in FIG. 2, and are connected to first to fourth extraction electrodes 12 a to 15 a at both ends of the main body portion 19. First to fourth external electrodes 20a to 20d are formed, and fifth and sixth external electrodes connected to the fifth and sixth extraction electrodes 16a and 17a are formed on both sides of the main body portion 19, respectively. Electrodes 20e and 20f are formed. Further, a nickel plating layer and a tin plating layer are provided on the surfaces of the first to sixth external electrodes 20a to 20f.

  FIG. 3 shows an equivalent circuit of the composite electronic component according to Embodiment 1 of the present invention. The second conductor 13 and the third conductor 14 are magnetically coupled, and the fourth conductor 15 and the metal layer are further coupled. 16 constitutes a capacitor portion, and the first conductor 12 and the other metal layer 17 constitute a capacitor portion.

  Then, the number of parts can be reduced by packaging the circuit as described above into one package as shown in FIG.

  Next, the manufacturing method of the composite electronic component in Embodiment 1 of this invention is demonstrated.

  1 and 2, first, rectangular first to fifth insulating layers 11 a to 11 e, another insulating layer 11 f, and a dummy insulating layer 18 are made from a mixture of magnetic material powder and resin as raw materials. A predetermined number of each is prepared. At this time, holes are formed in the predetermined portions of the second and fourth insulating layers 11b and 11d by laser, punching, or the like, and the holes are filled with silver to form via electrodes.

  Next, the other metal layer 17 and the sixth extraction electrode 17a are formed on the upper surface of the other insulating layer 11f by printing or transferring, and then the first insulating layer 11f is formed on the upper surface of the other metal layer 17 with the first insulating layer 11f. The layer 11a is disposed.

  Next, the first conductor 12 and the first extraction electrode 12a are formed on the upper surface of the first insulating layer 11a by printing or transferring. At this time, a part of the first conductor 12 and the other metal layer 17 are opposed to each other.

  Next, on the upper surface of the first conductor 12, the second insulating layer 11b provided with a via electrode is disposed. At this time, the first conductor 12 and the via electrode are connected.

  Next, the second conductor 13 and the second extraction electrode 13a are formed on the upper surface of the second insulating layer 11b by printing or transferring. At this time, the second conductor 13 and the via electrode are connected.

  Next, the third insulating layer 11c is disposed on the upper surface of the second conductor 13, and then the third conductor 14 and the third extraction electrode 14a are printed or transferred on the upper surface of the third insulating layer 11c. By forming.

  Next, a fourth insulating layer 11 d provided with a via electrode is disposed on the upper surface of the third conductor 14. At this time, the third conductor 14 and the via electrode are connected.

  Next, the fourth conductor 15 and the fourth extraction electrode 15a are formed on the upper surface of the fourth insulating layer 11d by printing or transferring. At this time, the fourth conductor 15 and the via electrode are connected. Thereafter, the fifth insulating layer 11 e is disposed on the upper surface of the fourth conductor 15.

  Next, the metal layer 16 and the fifth extraction electrode 16a are formed on the upper surface of the fifth insulating layer 11e by printing or transferring. At this time, a part of the fourth conductor 15 and the metal layer 16 are opposed to each other.

  In addition, when forming the 1st-4th conductors 12-15, the metal layer 16, and the other metal layer 17 by transfer, the conductor of a predetermined pattern shape is formed by plating on a separately prepared base plate (not shown) Thereafter, this conductor is transferred to each insulating layer.

  The first to fourth conductors 12 to 15, the metal layer 16, the other metal layer 17, and the first to sixth extraction electrodes 12 a to 17 a are not formed by printing or transferring, but other thin films. It may be formed by a method such as vapor deposition.

  Next, a predetermined number of dummy insulating layers 18 are disposed on the upper surface of the metal layer 16 to form the main body 19 of the common mode noise filter.

  Next, the main body 19 is fired at a predetermined temperature and time.

  Next, silver is printed on both side surfaces of the main body 19, and the first to fourth extraction electrodes 12 a exposed on both end surfaces of the main body 19 (one end of the first to fourth insulating layers 11 a to 11 d). First to fourth external electrodes 20a to 20d are formed so as to be connected to .about.15a. Also, silver is printed on both side portions of the main body portion 19, and the fifth and sixth extraction electrodes 16a exposed on both side surfaces of the main body portion 19 (both ends of the fifth insulating layer 11e and the other insulating layer 11f). , 17a, the fifth and sixth external electrodes 20e, 20f are formed.

  Finally, a nickel plating layer and a tin plating layer are formed on the surfaces of the first to sixth external electrodes 20a to 20f by plating.

  In the first embodiment of the present invention described above, the linear first conductor 12 provided on the upper surface of the first insulating layer 11 a and the second insulation provided on the upper surface of the first conductor 12. A layer 11b, a spiral second conductor 13 provided on the upper surface of the second insulating layer 11b and connected to the first conductor 12, and an upper surface of the second conductor 13. A third insulating layer 11c, a spiral third conductor 14 provided on the upper surface of the third insulating layer 11c, and a fourth insulating layer 11d provided on the upper surface of the third conductor 14; A fourth linear conductor 15 provided on the upper surface of the fourth insulating layer 11d and connected to the third conductor 14; and a fifth fourth conductor 15 provided on the upper surface of the fourth conductor 15. Insulating layer 11e and the first to fourth conductors 12 to 15 are connected to one end portions of the first to fourth conductors 12 to 15, respectively. To fourth extraction electrodes 12a to 15a, and linearly so as to face at least a part of the fourth conductor 15 via the fifth insulating layer 11e on the upper surface of the fifth insulating layer 11e. Therefore, the eddy current is not generated in the linear metal layer 16 due to the magnetic field generated in the third and fourth conductors 14 and 15. Since the inductance value of the coil composed of the fourth conductor 15 is increased, the attenuation amount of the common mode noise can be increased, and as a result, the effect of removing the common mode noise in a wide band can be obtained. Is.

  Further, since the capacitor portion can be formed between the metal layer 16 and the fourth conductor 15, common mode noise in the high frequency band can be removed.

  In addition, since another linear metal layer 17 is provided on the lower surface of the first insulating layer 11a, the above-described third conductor 14 is also applied to the coil composed of the first conductor 12 and the second conductor 13. Since the same effect as that of the coil made of the fourth conductor 15 is obtained, common mode noise can be removed in a wider band, and the product polarity is improved.

  FIG. 4A is a diagram showing common mode attenuation characteristics of the composite electronic component according to Embodiment 1 of the present invention and the conventional composite electronic component.

  As is apparent from FIG. 4A, the composite electronic component according to Embodiment 1 of the present invention has a larger attenuation amount in both the low frequency range and the high frequency range than before, and can remove common mode noise in a wide band. .

  For example, in FIG. 4A, the frequency at which the attenuation is d or less is conventionally in the range of l, but in the present invention, it extends to the range of L. That is, the frequency at which the attenuation amount becomes a predetermined value or less becomes a wide band.

  FIG. 4B is a diagram showing the differential mode attenuation characteristics of the composite electronic component according to Embodiment 1 of the present invention and the conventional composite electronic component.

  As is apparent from FIG. 4B, it can be seen that the composite electronic component according to Embodiment 1 of the present invention has a smaller attenuation in the high frequency range than in the past.

  Further, since the metal layer 16 and the other metal layer 17 are linear, there is a stray capacitance between the fourth conductor 15 and the metal layer 16 or between the first conductor 12 and the other metal layer 17. As a result, the high-frequency component of the differential mode signal is not excessively removed, so that the differential mode signal waveform does not become dull.

  In the composite electronic component according to the first embodiment of the present invention, the first to fourth extraction electrodes 12a to 15a are drawn to both ends of the main body 19 of the common mode noise filter, and the fifth and sixth Although the extraction electrodes 16a and 17a are drawn out on both side portions of the main body 19, as shown in FIGS. 5 and 6, all of the first to sixth extraction electrodes 12a to 17a are common mode noise filters. The first to sixth external electrodes 20a to 20f are connected to the first to sixth extraction electrodes 12a to 17a so as to be connected to the first and sixth extraction electrodes 12a to 17a. You may form in the both ends of the part 19. FIG. By adopting such a configuration, it is possible to cope with signal lines configured in parallel. At this time, the first to sixth extraction electrodes 12a to 17a (first to sixth external electrodes 20a to 20f) are not connected to each other.

(Embodiment 2)
Hereinafter, the invention described in the fourth and fifth aspects of the present invention will be described using the second embodiment.

  FIG. 7 is an exploded perspective view of the composite electronic component according to Embodiment 2 of the present invention, and FIG. 8 is a perspective view of the composite electronic component. In the second embodiment of the present invention, components having the same configurations as those of the first embodiment of the present invention are denoted by the same reference numerals, and the description thereof is omitted.

  7 and 8, the second embodiment of the present invention is different from the first embodiment of the present invention described above in that the sixth insulating layer 11g is interposed between the fourth conductor 15 and the metal layer 16. This is that metal portions 21a to 21d provided on one surface (the lower surface in FIG. 7) are formed.

  At this time, at least a part of each of the metal portions 21a to 21d is opposed to the metal layer 16 via the sixth insulating layer 11g. The metal parts 21a to 21d are connected to the first to fourth lead electrodes 12a to 15a via the first to fourth external electrodes 20a to 20d, respectively.

  In the second embodiment of the present invention, the distance between the metal layer 16 and the fourth conductor 15 is increased by providing the metal portions 21 a to 21 d between the metal layer 16 and the fourth conductor 15. Therefore, an eddy current does not occur in the metal layer 16 due to the magnetic field generated in the third and fourth conductors 14 and 15, and thus, the inductance value of the coil composed of the third conductor 14 and the fourth conductor 15. Therefore, the amount of attenuation of common mode noise can be increased. As a result, common mode noise in a wide band can be removed. Furthermore, since a capacitor | condenser part can be formed between the metal parts 21a-21d and the metal layer 16, common mode noise can be removed in a higher frequency band.

  Further, the metal parts 21a to 21d, the sixth insulating layer 11g, and the metal layer 16 are disposed in the ceramic substrate 22 as shown in FIGS. 8 and 9, and the ceramic substrate 22 and the fourth insulation are arranged. The layer 11d may be bonded through the adhesive layer 23. At this time, a fifth insulating layer 11e may be formed between the fourth insulating layer 11d and the adhesive layer 23.

  With such a configuration, the fifth insulating layer 11e and the sixth insulating layer 11g are made of the first material in order to increase the capacitance of the capacitor unit formed between the metal units 21a to 21d and the metal layer 16. Even if the ceramic substrate 22 made of a material different from the materials of the first to fourth insulating layers 11a to 11d is used, they can be integrated.

  Further, as shown in FIGS. 8 and 9, in order to strengthen the magnetic coupling between the second conductor 13 and the third conductor 14, an adhesive layer 23 is provided on the lower surface of the first insulating layer 11 a. The magnetic body 24 may be bonded.

  In the composite electronic component according to the second embodiment of the present invention, the metal parts 21a to 21d, the sixth insulating layer 11g, and the metal layer 16 are formed only above the fifth insulating layer 11e. However, they may be formed both above the fifth insulating layer 11e and below the first insulating layer 11a, or only below the first insulating layer 11a.

  The composite electronic component according to the present invention has an effect that common mode noise can be removed in a wide band, and is used as noise countermeasures for various electronic devices such as digital devices, AV devices, and information communication terminals. This is useful in composite electronic parts used for filters and the like.

1 is an exploded perspective view of a composite electronic component according to Embodiment 1 of the present invention. Perspective view of the composite electronic component Equivalent circuit diagram of the composite electronic component (A) The figure which showed the common mode attenuation characteristic of the composite electronic component and the conventional composite electronic component, (b) The figure which showed the differential mode attenuation characteristic of the composite electronic component and the conventional composite electronic component An exploded perspective view showing another example of the composite electronic component Perspective view showing another example of the composite electronic component The disassembled perspective view of the composite electronic component in Embodiment 2 of this invention An exploded perspective view showing another example of the composite electronic component Perspective view showing another example of the composite electronic component An exploded perspective view of a conventional composite electronic component The figure which showed the common mode attenuation characteristic with the presence or absence of the capacitor part in the composite electronic component

Explanation of symbols

11a to 11g Insulating layer 12 1st conductor 12a 1st extraction electrode 13 2nd conductor 13a 2nd extraction electrode 14 3rd conductor 14a 3rd extraction electrode 15 4th conductor 15a 4th extraction electrode 16 Metal layer 17 Other metal layers 21a to 21d Metal part 22 Ceramic substrate 23 Adhesive layer

Claims (5)

A linear first conductor provided on the upper surface of the first insulating layer, a second insulating layer provided on the upper surface of the first conductor, and an upper surface of the second insulating layer; A spiral second conductor connected to the first conductor, a third insulating layer provided on the top surface of the second conductor, and a spiral provided on the top surface of the third insulating layer Third conductor, a fourth insulating layer provided on the upper surface of the third conductor, and a linear shape provided on the upper surface of the fourth insulating layer and connected to the third conductor A fourth conductor, a fifth insulating layer provided on the upper surface of the fourth conductor, and first to fourth leads connected to one end of each of the first to fourth conductors. A linear metal layer on the upper surface of the fifth insulating layer so as to face at least a part of the fourth conductor via the fifth insulating layer. Only composite electronic components. The composite electronic component according to claim 1, wherein another linear metal layer is provided on the lower surface of the first insulating layer so as to face at least a part of the first conductor via the first insulating layer. The fifth and sixth extraction electrodes are connected to both ends of the metal layer, respectively, and the first to sixth extraction electrodes including the fifth and sixth extraction electrodes are connected to both ends of the first to fifth insulating layers. The composite electronic component according to claim 1, wherein the composite electronic component is arranged in parallel so that the first to sixth extraction electrodes are not connected to each other. A linear first conductor provided on the upper surface of the first insulating layer, a second insulating layer provided on the upper surface of the first conductor, and an upper surface of the second insulating layer A spiral second conductor; a third insulating layer provided on an upper surface of the second conductor; a spiral third conductor provided on an upper surface of the third insulating layer; A fourth insulating layer provided on the upper surface of the third conductor; a linear fourth conductor provided on the upper surface of the fourth insulating layer; and a fifth insulating layer provided on the upper surface of the fourth conductor. An insulating layer and first to fourth extraction electrodes connected to one end of each of the first to fourth conductors, and connected to at least one of the first to fourth extraction electrodes. And a metal portion provided on one surface of the sixth insulating layer, and at least a part of each of the metal portions so as to face each other through the sixth insulating layer And a metal layer, a sixth insulating layer, and a metal layer formed on at least one of the lower side of the first insulating layer or the upper side of the fifth insulating layer. parts. The metal portion, the sixth insulating layer, and the metal layer are disposed in the ceramic substrate, and an adhesive layer is provided between the ceramic substrate and the fourth insulating layer or between the ceramic substrate and the first insulating layer. The composite electronic component according to claim 4 formed.

Images