JP2006086216A - Inductance element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inductance element which can be reduced in floating capacitance while at the same time being improved in Q value. <P>SOLUTION: A multilayer inductor L1 comprises a belt-like conductor 10, an outer package 20 which covers the belt-like conductor 10 and has an electric insulation property, and a pair of external electrodes 3 and 5 connected to both ends of the conductor 10, respectively. The outer package 20 has two first side faces 20a and 20b which intersect with the longitudinal direction at both ends of the conductor 10 and are not adjacent to each other, and second side faces which face the broad surface of the conductor 10. Each of the external electrodes 3 and 5 contains an electrode 3 or 5 which is formed along the widthwise direction of the conductor 10 on the first side face 20a or 20b while being substantially not formed on the second side face. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an inductance element.

  As this type of inductance element, one having a strip-shaped conductor, an exterior part that covers the conductor and has electrical insulation, and a plurality of external electrodes that are respectively connected to both ends of the conductor is known ( For example, see Patent Document 1).

The inductance element described in Patent Document 1 is a multilayer inductor. In this multilayer inductor, electrical insulation layers and strip-like conductor patterns are alternately laminated, and end portions of the respective conductor patterns are sequentially connected to form a coil superimposed in the lamination direction in the electrical insulation layer body (exterior portion). It is formed. The start and end of this coil are drawn out to both end faces of the chip that are parallel to the axial direction of the coil and not adjacent to each other, and are connected to terminal electrodes (external electrodes). The terminal electrode is not formed on the side surface of the chip that is parallel to the axial direction of the coil and adjacent to each chip end surface, but is formed on each chip end surface and the upper and lower surfaces of the chip that intersect the axial direction of the coil. .
JP 2001-155938 A

  However, the inductance element described in Patent Document 1 has the following problems.

  In the inductance element configured as described above, stray capacitance is likely to occur between the end of the strip-shaped conductor functioning as an inductor component and the external electrode. In particular, in the inductance element described in Patent Document 1, since a part of the external electrode is formed at a position facing the wide surface of the strip-shaped conductor, the part of the external electrode and the end of the conductor overlap. The area is large, and the stray capacitance generated between the end of the conductor and the external electrode also becomes large. As a result, in the inductance element described in Patent Document 1, Q (quality factor), which is an important characteristic of the inductance element, is significantly reduced.

  An object of the present invention is to provide an inductance element capable of reducing stray capacitance and improving Q.

  An inductance element according to the present invention includes a strip-shaped conductor, an exterior part that covers the conductor and has electrical insulation, and a plurality of external electrodes that are respectively connected to both ends of the conductor. Each of the external electrodes has a first side surface that intersects the longitudinal direction at the end of the conductor and that is not adjacent to each other, and a second side surface that faces the wide surface of the conductor. And having electrode portions formed over the width direction of the conductors, and substantially not formed on the second side surface.

  In the inductance element according to the present invention, each external electrode to which the end portion of the conductor is connected has an electrode portion formed over the width direction of the conductor on each first side surface, and substantially on the second side surface. Therefore, the area where the conductor and its external electrode overlap can be made sufficiently small. As a result, stray capacitance is reduced and Q can be improved.

  Moreover, it is preferable that the width | variety of a conductor is set to 2 times or more of the thickness of the conductor. In this case, Q can be improved and the DC resistance can be reduced by increasing the cross-sectional area of the conductor.

  The exterior portion further includes a third side surface that intersects the surface including the wide surface of the conductor and is adjacent to each first side surface, and each external electrode is formed on a part of the third side surface. In addition, it is preferable to further have electrode portions that are electrically continuous with the electrode portions formed on the first side surface. In this case, it becomes easy to ensure the soldering area, and the mounting strength of the inductance element can be ensured.

  The exterior portion further includes a fourth side surface that intersects the surface including the wide surface of the conductor, is adjacent to each first side surface, and is positioned to face the third side surface with the conductor interposed therebetween. Each external electrode is preferably formed on a part of the fourth side surface and further has an electrode portion electrically continuous with the electrode portion formed on the first side surface. In this case, it becomes easier to secure the soldering area, and the mounting strength of the inductance element can be sufficiently ensured.

  The exterior portion further includes a third side surface adjacent to each first side surface and positioned so as to be opposed to each other with the conductor interposed therebetween, and the third side surface is defined as a mounting surface, It is preferable that the side surface of 3 cross | intersects the surface containing the wide surface of a conductor. In this case, with respect to the exterior surface adjacent to the mounting surface, the external electrode exists only on the first side surface, and the external electrode does not substantially exist on the second side surface. As a result, Q can be further improved.

  Moreover, it is preferable that a plurality of conductors are arranged in parallel in the thickness direction of the conductor. In this case, since the cross-sectional area of the conductor perpendicular to the longitudinal direction is larger than that of a single conductor, the DC resistance can be reduced.

  The exterior portion includes a plurality of insulators, and the conductor is configured by a conductor pattern formed on at least one insulator among the plurality of insulators, and the plurality of insulators are arranged in a thickness direction of the conductor pattern. It is preferable that they are laminated. In this case, a multilayer inductance element is realized.

  Moreover, it is preferable that the conductor is extended linearly along the longitudinal direction. Moreover, it is preferable that the conductor has a coil-shaped portion whose axial direction extends along a direction orthogonal to the wide surface of the conductor.

  According to the present invention, an inductance element capable of reducing stray capacitance and improving Q can be provided.

  An inductance element according to an embodiment of the present invention will be described with reference to the drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted. In this embodiment, the present invention is applied to a multilayer inductor.

(First embodiment)
First, the configuration of the multilayer inductor L1 according to the first embodiment will be described with reference to FIGS. FIG. 1 is a perspective view showing the multilayer inductor according to the first embodiment. FIG. 2A is a diagram for explaining a cross-sectional configuration in the longitudinal direction of the multilayer inductor according to the first embodiment, and FIG. 2B is orthogonal to the longitudinal direction of the multilayer inductor according to the first embodiment. It is a figure for demonstrating the cross-sectional structure in a direction. FIG. 3 is an exploded perspective view showing elements included in the multilayer inductor according to the first embodiment. FIG. 4 is a perspective view showing an exterior part included in the multilayer inductor according to the first embodiment.

  As illustrated in FIG. 1, the multilayer inductor L <b> 1 includes a rectangular parallelepiped element 1 and a pair of terminal electrodes (external electrodes) 3 and 5. As shown in FIG. 2, the element 1 includes a conductor 10 that extends linearly along the longitudinal direction and an exterior portion 20. As shown in FIG. 3, the exterior portion 20 includes a plurality of (seven layers in this embodiment) nonmagnetic green sheets (insulators) 21 to 27 that are stacked. The actual multilayer chip inductor L1 is integrated to such an extent that the boundaries between the non-magnetic green sheets 21 to 27 cannot be visually recognized.

  As shown in FIG. 4, the exterior portion 20 (element 1) includes two first side surfaces 20a and 20b, two second side surfaces 20c and 20d, a third side surface 20e, and a fourth side surface. 20f. The first side surfaces 20a and 20b are positioned so as to face each other when viewed in the X-axis direction. The second side surfaces 20c and 20d are positioned so as to face each other when viewed in the Y-axis direction. The third side surface 20e and the fourth side surface 20f are positioned so as to face each other when viewed in the Z-axis direction. Therefore, the first side surfaces 20a and 20b are not adjacent to each other, and the second side surfaces 20c and 20d are not adjacent to each other. The third side surface 20e and the fourth side surface 20f are not adjacent to each other. The first side surfaces 20a and 20b are adjacent to the third side surface 20e and the fourth side surface 20f, respectively.

  The first side surfaces 20 a and 20 b are orthogonal to the longitudinal direction of the conductor 10. The second side surfaces 20 c and 20 d, the third side surface 20 e, and the fourth side surface 20 f are parallel to the longitudinal direction of the conductor 10. The third side surface 20e is a surface (mounting surface) that faces the circuit board when the multilayer inductor L1 is mounted on the circuit board (not shown).

  Each of the terminal electrodes 3 and 5 includes first electrode portions 3a and 5a and second electrode portions 3b and 5b. The first electrode portions 3a and 5a and the second electrode portions 3b and 5b are They are electrically continuous with each other. The first electrode portions 3a and 5a are respectively formed on the first side surfaces 20a and 20b over the width direction of the conductor 10 (Z-axis direction in FIG. 4). Thus, in the present embodiment, the first electrode portions 3a and 5a are formed so as to cover the entire surfaces of the first side surfaces 20a and 20b.

  The second electrode portions 3b and 5b are formed on a part of the third side surface 20e. Specifically, the second electrode portions 3b and 5b are respectively formed at both ends of the third side surface 20e along the ridge between the third side surface 20e and the first side surfaces 20a and 20b. That is, the second electrode portions 3b and 5b are electrically insulated from each other with a predetermined interval.

  The terminal electrodes 3 and 5 are not substantially formed on the second side surfaces 20c and 20d. In the element 1, each vertex and each edge are curved and formed. Therefore, when the first electrode portions 3a and 5a are formed on the entire surface of the first side surfaces 20a and 20b, the first electrode portions 3a and 5a go around the second side surfaces 20c and 20d by about 100 μm at the maximum. Will be formed. Therefore, the term “substantially” includes electrode portions that are formed on the second side surfaces 20c and 20d when the terminal electrodes 3 and 5 (first electrode portions 3a and 5a, etc.) are formed.

  As shown in FIG. 2B, the conductor 10 is a strip-shaped conductor having a wide surface S and a width W larger than the thickness T. Each wide surface S is parallel to the second side surfaces 20c and 20d, and the first side surfaces 20a and 20b are positioned in the orthogonal direction with respect to each wide surface S. That is, a configuration in which the wide surface S is parallel to the third and fourth side surfaces 20e and 20f when viewed from a direction perpendicular to the third side surface 20e or the fourth side surface 20f (Z-axis direction in FIG. 4). Compared to the above, the area where the conductor 10 and the second electrode portions 3b and 5b overlap is small. The width W is preferably at least twice as large as the thickness T.

  As shown in FIG. 3, the conductor 10 is formed of a strip-shaped conductor pattern 10 a formed on the nonmagnetic green sheet 24. Each end of the conductor pattern 10a extends in a straight line toward both edges of the nonmagnetic green sheet 24 and has a substantially I shape. The end portion of the conductor pattern 10 a is drawn to the edge of the nonmagnetic green sheet 24 and is exposed on the end surface of the nonmagnetic green sheet 24. That is, as shown in FIG. 2, the end portion of the conductor pattern 10a extends toward the first side surfaces 20a and 20b, and the first electrode portions 3a and 1b formed on the first side surfaces 20a and 20b. By connecting to 5a, it is electrically connected to the corresponding terminal electrodes 3 and 5.

  The conductor pattern 10a does not need to have the same width, and may be formed slightly wider near the edge of the nonmagnetic green sheet 24, that is, near the first electrode portions 3a and 5a. With such a configuration, connection reliability between the end portion of the conductor 10 and the first electrode portions 3a and 5a is improved.

  The nonmagnetic green sheets 21 to 27 are glass-based ceramic green sheets having electrical insulation. The nonmagnetic green sheets 21 to 27 are, for example, a ceramic composition made of strontium, calcium, alumina, and silicon oxide, and the composition is preferably 70 wt% glass and 30 wt% alumina powder.

  Next, a method for manufacturing the multilayer inductor L1 having the above-described configuration will be described.

  First, nonmagnetic green sheets 21 to 27 are prepared. Next, the conductor pattern 10 a is formed on the nonmagnetic green sheet 24. The conductor pattern 10a is formed by screen-printing a paste mainly composed of silver or nickel on the nonmagnetic green sheet 24. On the other hand, no conductor pattern is formed on the nonmagnetic green sheets 21 to 23 and 25 to 27.

  Next, the nonmagnetic green sheets 21 to 27 are laminated as shown in FIG. 3 and then fired at a predetermined temperature (for example, about 900 ° C.). Thus, the completed element 1 is formed so that the length in the longitudinal direction is 0.6 mm, the width is 0.3 mm, and the height is 0.3 mm, for example. Further, the fired conductor pattern 10a is designed so that, for example, the width W is 40 μm and the thickness T is 12 μm.

  Next, terminal electrodes 3 and 5 are formed on the fired element 1. The terminal electrodes 3 and 5 are formed by applying a paste mainly composed of silver or copper to the element 1 and baking it at a predetermined temperature (for example, about 700 ° C.). Thereafter, the terminal electrodes 3 and 5 that have been baked are further electroplated to form the multilayer inductor L1. For this electroplating, for example, Ni, Sn or the like can be used. The terminal electrodes 3 and 5 may be formed by using both a paste printing mainly composed of silver or copper and a dipping method.

  As described above, according to the first embodiment, the exterior portion 20 includes the two first side surfaces 20 a and 20 b that intersect the longitudinal direction at the end portion of the conductor 10 and are not adjacent to each other, and the wide width of the conductor 10. It has 2nd side surfaces 20c and 20d facing the surface S. The terminal electrodes 3 and 5 to which both ends of the conductor 10 are respectively connected have first electrode portions 3a and 5a formed over the width direction of the conductor 10 on the first side surfaces 20a and 20b. The second side surfaces 20c and 20d are not substantially formed. As a result, stray capacitance is reduced and Q can be improved.

  In this embodiment, since the width W of the conductor 10 is set to be twice or more the thickness T, the Q can be improved and the DC resistance can be reduced by increasing the cross-sectional area of the conductor 10. it can.

  Moreover, in this embodiment, the exterior part 20 has the 3rd side surface 20e which cross | intersects the surface containing the wide surface S of the conductor 10, and adjoins each 1st side surface 20a, 20b, and each terminal electrode 3 and 5 are formed on a part of the third side surface 20e, and the second electrode portion 3b is electrically continuous with the first electrode portions 3a and 5a formed on the first side surfaces 20a and 20b. , 5b. Thereby, it becomes easy to ensure a soldering area, and the mounting strength of the inductance element can be ensured.

  Further, in the present embodiment, the exterior portion 20 has a third side surface 20e that is adjacent to each of the first side surfaces 20a and 20b and is positioned so as to be opposed to each other with the conductor 10 in between. The side surface 20 e is defined as the mounting surface, and the third side surface 20 e intersects the surface including the wide surface S of the conductor 10. In this case, for the exterior surface 20 adjacent to the mounting surface, the terminal electrodes 3 and 5 are present only on the first side surfaces 20a and 20b, and the terminal electrodes 3 and 5 are not substantially present on the second side surfaces 20c and 20d. It will be. As a result, Q can be further improved.

  In the present embodiment, the exterior portion 20 includes a plurality of nonmagnetic green sheets 21 to 27, and the conductor 10 is a conductor formed on at least one nonmagnetic green sheet among the nonmagnetic green sheets 21 to 27. The nonmagnetic green sheets 21 to 27 are configured by the pattern 10a and are laminated in the thickness direction of the conductor pattern 10a. In this case, the multilayer inductor L1 is realized.

(Second Embodiment)
First, the configuration of the multilayer inductor L2 according to the second embodiment will be described with reference to FIG. FIG. 5A is a perspective view showing the multilayer inductor according to the second embodiment, and FIG. 5B is a diagram for explaining a cross-sectional configuration of the multilayer inductor according to the second embodiment. The multilayer inductor L2 according to the second embodiment is different from the multilayer inductor L1 according to the first embodiment in the configuration of the terminal electrodes 3 and 5.

  The multilayer inductor L2 includes an element 1 and a pair of terminal electrodes 3 and 5, as shown in FIG. The element 1 has a conductor 10 and an exterior part 20 as shown in FIG.

  Each terminal electrode 3, 5 includes a first electrode portion 3 a, 5 a, a second electrode portion 3 b, 5 b, and a third electrode portion 3 c, 5 c, and the first electrode portion 3 a, 5 a The second electrode portions 3b and 5b and the third electrode portions 3c and 5c are electrically continuous with each other. The third electrode portions 3c and 5c are formed on a part of the fourth side surface 20f. Specifically, the third electrode portions 3c and 5c are respectively formed at both ends of the third side surface 20e along the ridge between the fourth side surface 20f and the first side surfaces 20a and 20b. That is, the third electrode portions 3c and 5c are electrically insulated from each other with a predetermined interval. Also in the multilayer inductor L2, the terminal electrodes 3 and 5 are not substantially formed on the second side surfaces 20c and 20d.

  As described above, in the second embodiment, the exterior portion 20 intersects the surface including the wide surface S of the conductor 10 and is adjacent to each of the first side surfaces 20a and 20b, and the third portion sandwiching the conductor 10 therebetween. The fourth side surface 20f is positioned so as to face the side surface 20e. Each of the terminal electrodes 3 and 5 is formed on a part of the fourth side surface 20f, and is electrically connected to the first electrode portions 3a and 5a formed on the first side surfaces 20a and 20b. Each of the electrode portions 3c and 5c is further provided. In this case, it becomes easier to secure the soldering area, and the mounting strength of the multilayer inductor L2 can be sufficiently secured.

  Here, the measurement result of the high frequency characteristic of Q in the multilayer inductors L1 and L2 according to the first and second embodiments will be described. The multilayer inductors 100 to 102 shown in FIGS. 6 to 9 are used as the proportionalities 1 to 3 for showing the usefulness of the multilayer inductors L1 and L2 according to the first and second embodiments. The multilayer inductors 100 to 102 have the same configuration as the multilayer inductors L1 and L2 described above, except for the following points.

  The multilayer inductor 100 includes terminal electrodes 103 and 105 and a conductor 10. As shown in FIG. 7A, the terminal electrodes 103 and 105 are also formed on part of the second side surfaces 20c and 20d. Specifically, part of the terminal electrodes 103 and 105 are substantially formed at both ends of the second side surfaces 20c and 20d so as to wrap around the second side surfaces 20c and 20d, respectively. That is, part of the terminal electrodes 103 and 105 formed on the second side surfaces 20c and 20d are electrically insulated from each other with a predetermined distance from each other. As shown in FIG. 7B, each wide surface S of the conductor 10 faces the third side surface 20e and the fourth side surface 20f.

  The multilayer inductor 101 includes terminal electrodes 3 and 5 and a conductor 10. As shown in FIG. 8A, the terminal electrodes 3 and 5 are formed on the first side surfaces 20a and 20b, the third side surface 20e, and a part of the fourth side surface 20f, and are formed on the multilayer inductor L2. It has the same configuration as the terminal electrodes 3 and 5. As shown in FIG. 8B, each wide surface S of the conductor 10 faces the third side surface 20e and the fourth side surface 20f.

  The multilayer inductor 102 includes terminal electrodes 103 and 105 and a conductor 10. As shown in FIG. 9A, the terminal electrodes 103 and 105 are also formed on part of the second side surfaces 20c and 20d, and have the same configuration as the terminal electrodes 103 and 105 of the multilayer inductor 100. . Each wide surface S of the conductor 10 faces the second side surfaces 20c and 20d as shown in FIG. 9B.

  The measurement results are shown in FIG. A characteristic A1 indicates a frequency characteristic of Q of the multilayer inductor L1 according to the first embodiment, and a characteristic A2 indicates a frequency characteristic of Q of the multilayer inductor L2 according to the second embodiment. The characteristic B1 indicates the frequency characteristic of the Q of the multilayer inductor 100 according to the proportionality 1, the characteristic B2 indicates the frequency characteristic of the Q of the multilayer inductor 101 according to the proportionality 2, and the characteristic B3 indicates the multilayer characteristic according to the proportionality 3. The frequency characteristic of Q of the type inductor 102 is shown. As shown in FIG. 6, the multilayer inductors L <b> 1 and L <b> 2 according to the first and second embodiments have a larger Q than the multilayer inductors 100 to 102 according to the proportionalities 1 to 3. The tendency that the Q of the multilayer inductors L1 and L2 according to the first and second embodiments is larger than the Q of the multilayer inductors 100 to 102 according to the proportions 1 to 3 is particularly remarkable in a high frequency band of 800 MHz or more. It has become.

(Third embodiment)
First, the configuration of the multilayer inductor L3 according to the third embodiment will be described with reference to FIGS. 4, 10, and 11. FIG. FIG. 10A is a perspective view showing a multilayer inductor according to the third embodiment, and FIG. 10B is a diagram for explaining a cross-sectional configuration of the multilayer inductor according to the third embodiment. FIG. 11 is an exploded perspective view showing elements included in the multilayer inductor according to the third embodiment. The multilayer inductor L3 according to the third embodiment is different from the multilayer inductor L1 according to the first embodiment in the configuration of the conductor 10.

  As shown in FIG. 10A, the multilayer inductor L3 includes an element 1 and a pair of terminal electrodes 3 and 5. The element 1 has conductors 10 and 10 and an exterior part 20 as shown in FIG. As shown in FIG. 11, the exterior portion 20 includes a plurality of (in this embodiment, eight layers) non-magnetic green sheets 21 to 28 that are stacked. The actual multilayer chip inductor L3 is integrated to such an extent that the boundaries between the non-magnetic green sheets 21 to 28 cannot be visually recognized.

  As shown in FIG. 10B, the conductors 10 and 10 have a predetermined distance from each other, are electrically insulated, and are arranged in parallel in the thickness T direction. The wide surfaces S of the conductors 10 and 10 are parallel to the second side surfaces 20c and 20d, and the first side surfaces 20a and 20b are positioned in the orthogonal direction with respect to the wide surfaces S. That is, when viewed from the Z-axis direction in FIG. 4, each conductor 10, 10 and the second electrode portion 3 b, compared to the configuration in which the wide surface S is parallel to the third and fourth side surfaces 20 e, 20 f. The area where 5b overlaps is small.

  Moreover, the conductors 10 and 10 are formed of strip-shaped conductor patterns 10a and 10a formed on the non-magnetic green sheets 24 and 25, as shown in FIG. On the other hand, no conductor pattern is formed on the nonmagnetic green sheets 21 to 23 and 26 to 28. The conductor patterns 10a and 10a have the same configuration as the conductor pattern 10a according to the first embodiment. Also, with respect to the method of manufacturing the multilayer inductor L3, the multilayer inductor L1 according to the first embodiment is manufactured except that the nonmagnetic green sheets 21 to 28 are stacked to form the element 1 (exterior portion 20). It is the same as the method.

  As described above, in the third embodiment, a plurality of conductors 10 and 10 are arranged side by side in the thickness direction of the conductors 10 and 10. In this case, since the cross-sectional area of the conductor perpendicular to the longitudinal direction is larger than that of a single conductor, the DC resistance can be reduced. Further, the inductance value can be adjusted by the number of conductors.

(Fourth embodiment)
First, the configuration of the multilayer inductor L4 according to the fourth embodiment will be described with reference to FIGS. 4, 12, and 13. FIG. FIG. 12A is a perspective view showing the multilayer inductor according to the fourth embodiment, and FIG. 12B is a diagram for explaining a cross-sectional configuration of the multilayer inductor according to the fourth embodiment. FIG. 13 is an exploded perspective view showing elements included in the multilayer inductor according to the fourth embodiment. The multilayer inductor L4 according to the fourth embodiment is different from the multilayer inductor L1 according to the first embodiment in that the conductor 11 includes a coiled conductor 12.

  The multilayer inductor L4 includes an element 1 and a pair of terminal electrodes 3 and 5, as shown in FIG. The element 1 has the conductor 11 and the exterior part 20 as FIG.12 (b) shows. As shown in FIG. 13, the exterior portion 20 includes a plurality of (in this embodiment, eight layers) nonmagnetic green sheets 21 to 28 that are stacked. The actual multilayer chip inductor L4 is integrated to such an extent that the boundaries between the non-magnetic green sheets 21 to 28 cannot be visually recognized.

  The conductor 11 includes a coiled conductor 12 and lead conductors 13 and 14. The conductor 11 has a wide surface S, and the wide surface S is parallel to the second side surfaces 20c and 20d. The coiled conductor 12 is formed so that its axial direction is orthogonal to the second side surfaces 20c and 20d and is superimposed in the axial direction. One end of each of the lead conductors 13 and 14 is drawn from both end portions of the coiled conductor 12, and the other end is connected to the first electrode portions 3a and 5a formed on the first side surfaces 20a and 20b. . That is, when viewed from the Z direction in FIG. 4, each of the lead conductors 13, 14 and the second electrode portion 3 b, compared to the configuration in which the wide surface S is parallel to the third and fourth side surfaces 20 e, 20 f. The area where 5b overlaps is small.

  The coiled conductor 12 is composed of strip-shaped conductor patterns 12a to 12d formed on the non-magnetic green sheets 23 to 26. The lead conductors 13 and 14 are constituted by strip-shaped conductor patterns 13a and 14a formed on the nonmagnetic green sheets 23 to 26, respectively. In the present embodiment, the conductor pattern 12a and the conductor pattern 13a are integrally formed, and the conductor pattern 12d and the conductor pattern 14a are integrally formed. On the other hand, no conductor pattern is formed on the nonmagnetic green sheets 21, 22, 27, and 28.

  The conductor pattern 12 a corresponds to approximately ½ turn of the coiled conductor 12, and is formed in an approximately L shape on the nonmagnetic green sheet 23. The conductor pattern 12 b corresponds to approximately 3/4 turns of the coiled conductor 12, and is formed in a substantially U shape on the nonmagnetic green sheet 24. The conductor pattern 12 c corresponds to approximately 3/4 turns of the coiled conductor 12, and is formed in a substantially C shape on the nonmagnetic green sheet 25. The conductor pattern 12 d corresponds to approximately ¼ turn of the coiled conductor 12, and is formed in a substantially I shape on the nonmagnetic green sheet 26. The end portions of the conductor patterns 12 a to 12 d are electrically connected by through electrodes 15 a to 15 c formed on the nonmagnetic green sheets 23 to 25 to form the coiled conductor 12.

  As described above, in the fourth embodiment, the conductor 11 has the coiled conductor 12 that extends along the direction in which the axial direction is orthogonal to the wide surface of the conductor 11. Even in this case, stray capacitance can be reduced and Q can be improved.

  The present invention is not limited to the embodiment described above. For example, the terminal electrodes 3 and 5 are not limited to the configurations shown in the first and second embodiments described above. For example, each terminal electrode 3, 5 may have only the first electrode portions 3a, 5a. Further, the shape of the exterior portion 20 is not limited to a rectangular parallelepiped shape.

  Although each electrode part 3a-3c, 5a-5c is formed over the width direction of the conductor 10 on each corresponding side surface 20a, 20b, 20e, 20f, it is not restricted to this. That is, as shown in FIG. 14A and FIG. 15A, it is formed so as to have a predetermined distance from both ends of each side surface 20a, 20b, 20e, 20f along the width direction of the conductor 10. Also good.

  As shown in FIG. 2 or 10, one conductor 10 or two conductors 10 are provided in the thickness direction of the conductor 10, but the present invention is not limited to this. That is, as shown in FIG. 16, a pair of conductors 10, 10 provided side by side in the thickness direction of the conductor 10 are further provided in pairs in the width direction of the conductor 10, and the laminated inductor has four conductors 10. May be provided.

  The conductor 10 extends linearly along the longitudinal direction of the element 1 as shown in FIG. 2, FIG. 5, or FIG. 10, but is not limited thereto. That is, the conductor 10 may have various shapes other than a linear shape such as a zigzag shape, a meandering shape, or a crank shape in a plane including a wide surface.

  The connection position between the lead conductors 13 and 14 (conductor patterns 13a and 14a) and the terminal electrodes 3 and 5 is not limited to the position near the fourth side face 20f as shown in FIG. That is, the connection position between the lead conductors 13 and 14 (conductor patterns 13a and 14a) and the terminal electrodes 3 and 5 is an intermediate position between the fourth side face 20f and the third side face 20e in the first electrode portion. May be. Alternatively, the position may be closer to the third side surface 20e. Further, either one of the lead conductors 13 and 14 may be close to the fourth side face 20f, and the other of the lead conductors 13 and 14 may be close to the third side face 20e.

  The lead conductors 13 and 14 (conductor patterns 13a and 14a) may be connected to the second electrode portions 3b and 5b. In this case, the lead conductors 13 and 14 (conductor patterns 13a and 14a) are drawn out from both corners of the coiled conductor 12 near the third side surface 20e or from both corners near the fourth side surface 20f to the third side surface 20e. It will grow toward you.

  In the present embodiment, the element 1 is configured by laminating nonmagnetic green sheets (green sheet laminating method). However, the present invention is not limited to this, and the element 1 is configured by other methods such as a printing laminating method. You may make it do.

1 is a perspective view showing a multilayer inductor according to a first embodiment. It is a figure for demonstrating the cross-sectional structure of the multilayer inductor which concerns on 1st Embodiment. It is a disassembled perspective view which shows the element contained in the multilayer inductor which concerns on 1st Embodiment. It is a perspective view which shows the exterior part contained in the multilayer inductor which concerns on 1st Embodiment. (A) is a perspective view which shows the multilayer inductor which concerns on 2nd Embodiment, (b) is a figure for demonstrating the cross-sectional structure of the multilayer inductor which concerns on 2nd Embodiment. It is a figure which shows the frequency characteristic of Q. (A) is a perspective view showing a multilayer inductor according to the proportionality 1, and (b) is a diagram for explaining a sectional configuration of the multilayer inductor according to the proportionality 1. (A) is a perspective view showing a multilayer inductor according to the proportional 2, and (b) is a diagram for explaining a cross-sectional configuration of the multilayer inductor according to the proportional 2. (A) is a perspective view showing a multilayer inductor according to the proportionality 3, and (b) is a diagram for explaining a cross-sectional configuration of the multilayer inductor according to the proportionality 3. (A) is a perspective view which shows the multilayer inductor which concerns on 3rd Embodiment, (b) is a figure for demonstrating the cross-sectional structure of the multilayer inductor which concerns on 3rd Embodiment. It is a disassembled perspective view which shows the element contained in the multilayer inductor which concerns on 3rd Embodiment. (A) is a perspective view which shows the multilayer inductor which concerns on 4th Embodiment, (b) is a figure for demonstrating the cross-sectional structure of the multilayer inductor which concerns on 4th Embodiment. It is a disassembled perspective view which shows the element contained in the multilayer inductor which concerns on 4th Embodiment. (A) is a perspective view of the modification of the multilayer inductor which concerns on 1st Embodiment, (b) is a figure for demonstrating the cross-sectional structure of the modification of the multilayer inductor which concerns on 1st Embodiment. (A) is a perspective view of the modification of the multilayer inductor which concerns on 2nd Embodiment, (b) is a figure for demonstrating the cross-sectional structure of the modification of the multilayer inductor which concerns on 2nd Embodiment. It is a figure for demonstrating the cross-sectional structure of the modification of the multilayer inductor which concerns on 3rd Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Element, 3, 5 ... Terminal electrode, 3a, 5a ... 1st electrode part, 3b, 5b ... 2nd electrode part, 3c, 5c ... 3rd electrode part 10, 11 ... Conductor, 10a, 12a -12d, 13a, 14a ... conductor pattern, 12 ... coiled conductor, 13, 14 ... lead conductor, 15a-15c ... penetrating electrode, 20 ... exterior part, 20a, 20b ... first side, 20c, 20d ... second Side surface, 20e ... third side surface, 20f ... fourth side surface, 21-28 ... non-magnetic green sheet, 103, 105 ... terminal electrode, L1-L4, 100-102 ... multilayer inductor, S ... wide surface

Claims (9)

A strip-shaped conductor;
An exterior part covering the conductor and having electrical insulation;
A plurality of external electrodes respectively connected to both ends of the conductor,
The exterior portion includes two first side surfaces that intersect in the longitudinal direction at the end portion of the conductor and are not adjacent to each other, and a second side surface that faces the wide surface of the conductor,
Each of the external electrodes has an electrode portion formed over the width of the conductor on each of the first side surfaces, and is not substantially formed on the second side surface. .   The inductance element according to claim 1, wherein the width of the conductor is set to be twice or more the thickness of the conductor. The exterior portion further includes a third side surface that intersects the surface including the wide surface of the conductor and is adjacent to the first side surface,
Each of the external electrodes is formed on a part of the third side surface and further has an electrode portion electrically continuous with the electrode portion formed on the first side surface. Item 2. The inductance element according to Item 1. The exterior portion includes a fourth side surface that intersects the surface including the wide surface of the conductor and is adjacent to the first side surface and is positioned to face the third side surface with the conductor interposed therebetween. In addition,
Each of the external electrodes is formed on a part of the fourth side surface and further has an electrode portion electrically continuous with the electrode portion formed on the first side surface. Item 4. The inductance element according to Item 3. The exterior portion further includes a third side surface that is adjacent to each first side surface and is positioned to face each other with the conductor interposed therebetween.
2. The inductance element according to claim 1, wherein the third side surface is defined as a mounting surface, and the third side surface intersects a surface including the wide surface of the conductor.   The inductance element according to claim 1, wherein a plurality of the conductors are arranged side by side in the thickness direction of the conductors. The exterior part includes a plurality of insulators,
The conductor is constituted by a conductor pattern formed on at least one insulator among the plurality of insulators,
The inductance element according to claim 1, wherein the plurality of insulators are stacked in a thickness direction of the conductor pattern.   The inductance element according to claim 1, wherein the conductor extends linearly along a longitudinal direction thereof.   The inductance element according to claim 1, wherein the conductor has a coil-shaped portion whose axial direction extends along a direction orthogonal to the wide surface of the conductor.

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