JP2008076250A - Slice piece sample preparing method and slice piece sample preparing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a slice piece sample preparing method capable of automatically and continuously preparing a slice piece sample and reducing the load of a worker, while maintaining the accuracy required in the slice piece sample, and to provide a slice piece sample preparing apparatus. <P>SOLUTION: The slice piece sample is prepared by relatively moving a sample block feed part and a cutter and, when slicing operation for adjusting the height position of a sample block and set the cutting surface of the sample block so that slicing position is continuously performed, the cutter is moved so that the contact region of the edge of the cutter first brought into contact with the sample block, after the adjustment of the height position is successively altered, each time when the preset number of times of slicing operation is completed and the height position of the edge of the cutter after alteration is subsequently measured by a detection part. The slicing position is corrected, on the basis of the measuring data of the detection part and slicing operation is resumed. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a thin-section sample preparation method and apparatus for preparing a thin-section sample used for physicochemical sample analysis, microscopic observation of biological samples and the like.

  2. Description of the Related Art Conventionally, a microtome is widely known as an apparatus for producing a thin slice sample used for physicochemical sample analysis or microscopic observation of a biological sample. The microtome is an apparatus for producing a thin slice by slicing a surface layer portion of a sample block in which a specimen such as a biological sample is embedded in an embedding material such as paraffin, with a cutter.

  The thin slice produced by the microtome is collected in a tank filled with a liquid for extension such as water or hot water using a brush, paper, etc., and the heel is extended, and then an adhesive solution (for example, water) Is attached to the slide glass. Or the said thin slice is directly arrange | positioned on the slide glass which apply | coated the adhesive agent, and an extension, such as a wrinkle, is performed and affixed on a slide glass by heating a slide glass. The thin slice attached to the slide glass is closely fixed to the slide glass as the adhesive solution evaporates, and is used as a thin slice sample for tissue observation.

  Conventionally, the preparation work of a thin section sample using a microtome as described above has been manually performed by an operator, and requires a lot of labor and labor. Even a worker skilled in the use of a microtome usually takes several days to process dozens of sample blocks, but the same work is repeated, so both physically and mentally An excessive burden is placed on the worker.

In addition, the thickness required for the thin slice sample is very thin (for example, 3 μm to 10 μm although it varies depending on the sample), and high uniformity is also required. On the other hand, in the past, since the operator performed visual adjustment of the position (height) of the sample block and the cutter, the accuracy (thickness and uniformity) of the thin slice sample varies depending on the operator. Even with the same worker, the accuracy of the thin-section sample varies depending on the fatigue level of the worker. Further, when the surface layer portion of the sample block is sliced with a cutter, paraffin or the like adheres to the blade edge of the cutter, and the accuracy of the thin slice sample to be produced next time decreases. In particular, when the sample block is continuously sliced using the same region of the blade edge of the cutter, the sharpness of the region of the cutter gradually decreases, and the accuracy of the thin slice sample is greatly decreased.
Therefore, there is a need for an apparatus that reduces the burden on the operator and reduces the decrease in accuracy of the thin-section sample.

In Patent Document 1 (Japanese Patent Application Laid-Open No. 11-153521), when the surface layer portion of the sample block is continuously sliced with a cutter, the contact area of the blade edge of the cutter that first contacts the surface layer portion of the sample block is the same. An apparatus for moving the cutter so that the contact area is automatically changed so as not to concentrate on the area is disclosed. According to the apparatus of Patent Document 1, by automatically moving the cutter so that the contact area is appropriately changed, the burden due to the operator's cutter replacement work or attachment position change work can be reduced, The sharpness of the cutter can be kept constant in a good state, and a decrease in accuracy of the thin slice sample can be reduced.
Japanese Patent Laid-Open No. 11-153521

  However, in the apparatus disclosed in Patent Document 1, the height position of the blade edge of the cutter that contacts the sample block is caused by, for example, wear caused by friction between the cutter and the holder that holds the cutter, which is generated by repeatedly moving the cutter. Deviation may occur before and after the movement. Also, the height position of the blade edge of the cutter that contacts the sample block depends on the individual difference of the cutter and the amount of attachment when attaching the cutter to the holder (for example, tightening the screw when screwing the cutter to the holder) Also causes a gap.

  For this reason, in the apparatus of the above-mentioned Patent Document 1, when the above-mentioned deviation occurs in the process of automatically and continuously slicing a sliced piece sample, the cutter oscillates due to the slicing operation, The thickness of the sliced piece sample may be less than or thicker than that required for the sliced sample, or the sample block may be damaged when the blade is stuck in the sample block, resulting in a decrease in the accuracy of the sliced sample. In order to solve such a problem, for example, the operator constantly monitors the thin-section sample preparation operation of the apparatus, and when the accuracy of the thin-section sample is lowered or the height of the cutter blade abutting on the sample block When the position is displaced, it is necessary to perform an operation such as stopping the apparatus and adjusting the height position of the cutter or the sample block, which may place a burden on the operator.

  Therefore, the technical problem to be solved by the present invention is to enable automatic and continuous production of thin slice samples and to reduce the burden on the operator while maintaining the accuracy required for thin slice samples. An object of the present invention is to provide a method and apparatus for preparing a sliced piece sample that can be used.

According to the first aspect of the present invention, the height position of the sample block can be adjusted, the sample block transport unit that transports the sample block, the cutter configured to be movable in the extending direction of the blade, and the cutter Using a thin-section sample preparation device having a detection unit for detecting the position in the thickness direction of the blade, a thin section sample is prepared by automatically and continuously slicing the surface layer portion of the sample block with the cutter. A section sample preparation method,
The surface section of the sample block is sliced by the cutter by moving the sample block transport unit and the cutter relative to each other to produce the thin slice sample, and the cut surface of the sample block after the slicing When continuously performing the thinning operation for adjusting the height position of the sample block so that the
Every time the above-mentioned thinning operation is completed a preset number of times,
After moving the cutter in the extending direction of the blade so that the contact area of the blade edge of the cutter that first contacts the sample block after the height position adjustment is sequentially changed, the changed post-change The height position of the cutting edge of the cutter in the thickness direction of the blade is measured by the detection unit,
Based on the measurement information of the detection unit, the slicable position is located at a position separated from the height position of the blade edge of the cutter after the change by the thickness of the thin slice sample in the blade thickness direction. Thus, there is provided a method for preparing a sliced piece sample, wherein the sliceable position is corrected and the sliced operation is restarted.

  According to the second aspect of the present invention, the thin slicing operation is performed by blowing compressed air onto the cutting edge of the cutter that is in contact with the sample block after the thin slice sample is prepared by the cutter. A thin-section sample preparation method according to the first aspect, comprising:

According to the third aspect of the present invention, the height position of the sample block can be adjusted, the sample block transport unit that transports the sample block, the cutter configured to be movable in the extending direction of the blade, and the cutter A detection unit for detecting the position in the thickness direction of the blade,
The sample block transport unit and the cutter move relatively to slice the surface layer portion of the sample block with the cutter to produce the thin slice sample, and the cut surface of the sample block after the slicing Is a thin-section sample preparation device that continuously performs a thin-cut operation for adjusting the height position of the sample block so that is positioned at a thin-cut possible position,
Furthermore, each time the thinning operation of a preset number of times is completed, the cutter is moved so that the contact area of the blade edge of the cutter that first contacts the sample block after the height position adjustment is changed. It has a blade edge contact position changing part that moves in the extending direction of the blade,
When the contact region of the blade edge of the cutter that first contacts the sample block after the height position adjustment is changed by the blade edge contact position changing unit, the detection unit changes the cutting edge of the cutter. , Measure the height position in the thickness direction of the blade,
Based on the measurement information of the detection unit, the thickness of the thin slice sample is changed from the height position of the cutting edge of the cutter after the change to the thickness direction of the blade. The height position of the sample block is corrected so that the position capable of slicing is adjusted so as to be far away and the cut surface of the sample block is positioned at the position capable of slicing after the correction. A thin-section sample preparation apparatus characterized by adjusting

  According to a fourth aspect of the present invention, there is further provided the thin-section sample preparation device according to the third aspect, further comprising an air supply unit that blows compressed air onto the cutting edge of the cutter.

According to the first or third aspect of the present invention, in one slicing operation, the height position of the sample block is adjusted so that the cut surface of the sample block after slicing is positioned at a slicable position. Like to do. Therefore, since the sample block is always adjusted to the same slicable position, it is possible to prevent a decrease in accuracy required for the thin slice sample due to the sample block being displaced from the slicable position.
Further, each time the thinning operation of a preset number of times is completed, the cutter is adjusted so that the position of the blade tip of the cutter that first contacts the sample block after the height position adjustment is sequentially changed. Move in the extending direction. Therefore, since the contact area of the cutter blade edge used for thin cutting of the sample block can be varied, the sharpness of the cutter can be maintained in a good state. Further, since the entire cutting edge of the cutter can be used, the number of replacements of the cutter can be reduced and the burden on the operator can be reduced.

Furthermore, according to the 1st or 3rd aspect of this invention, whenever the movement to the extension direction of the said blade of the said cutter is completed, the height position of the said blade edge | tip of the said cutter after the said change is said detection part. Then, based on the measurement information of the detection unit, the sliceable position is corrected in the thickness direction of the blade. Therefore, even if the height position of the cutting edge of the cutter that contacts the sample block is displaced before and after the movement of the cutter, the displacement is corrected.
Therefore, according to the first or third aspect of the present invention, when the thin cutting operation is performed, the sample block is always on the cutting edge of the cutter in contact with the sample block by the thickness of the thin slice sample. Since the blade is moved so as to maintain the distance in the thickness direction of the blade, it is possible to automatically and continuously produce a sliced piece sample, while maintaining the accuracy required for the sliced piece sample, while reducing the burden on the operator. Can be reduced.

  Moreover, according to the 2nd or 4th aspect of this invention, the said compressed air is sprayed on the said blade edge | tip of the said cutter. Therefore, even if paraffin or the like adheres to the cutting edge of the cutter, it becomes possible to blow off the paraffin or the like with the compressed air, while reducing the sharpness and maintaining the accuracy required for the thin-section sample. The burden on the user can be reduced.

  Hereinafter, a thin-section sample preparation apparatus according to an embodiment of the present invention will be described with reference to the drawings. First, the overall configuration and operation of the thin-section sample preparation apparatus 100 according to the embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is a front view showing a schematic configuration of a thin-section sample preparation device 100 according to an embodiment of the present invention. FIG. 2 is a plan view showing a schematic configuration in the sample pasting chamber 100B of the thin-section sample preparation device 100. FIG.

  In FIG. 1, a thin-section sample preparation apparatus 100 includes a sample preparation chamber 100A in which components related to preparation of a thin-section sample 24 by slicing a sample block 20 are disposed, and a thin-section sample 24 as a slide glass 22. And a sample affixing chamber 100B in which constituent parts related to being firmly transferred and adhered to are disposed.

  As an example, the sample block 20 to be sliced in the thin-section sample preparation device 100 is used by embedding a specimen such as a biological sample in an embedding material such as paraffin. When such a sample block 20 is cut with the surface layer portion being dried, the cut surface is likely to be scratched or deformed, and on the other hand, it is prone to expansion and contraction due to subtle changes in temperature and humidity. At times, there is a problem that unevenness tends to occur in the thickness of the thin slice. Therefore, the internal temperature and humidity of the sample preparation chamber 100A are set so as to maintain a constant temperature (for example, 25 ° C.) and a constant high humidity (for example, 65% or more) by a cooler and a humidifier (not shown). Has been. The temperature and humidity may be set as appropriate depending on the type of the subject and the embedded body.

The sample preparation chamber 100A includes a sample storage unit 30, a sample block transport unit 1, a first charging unit 2, a cooling unit 3, a second charging unit 4, a cutter unit 5, and a supply reel 6. A carrier tape guide 8 is disposed.
A winding reel 7, a transfer unit 9, a slide glass transport unit 10, an adhesive liquid supply unit 11, an extension unit 12, and a slide glass storage unit 40 are arranged in the sample pasting chamber 100B. A control unit 13 to be described later is connected to each of the above units.

The sample block transport unit 1 transports one sample block 20 to be sliced next from the sample storage unit 30 that stores a large number of sample blocks 20 onto the position A, and then moves the sample block 20 to positions A to D. It is comprised so that reciprocating conveyance is possible. The positions A to D are linearly aligned in the horizontal direction (± X direction shown in FIG. 1), and the sample storage unit 30 stores the sample block 20 in the same temperature and humidity environment as the sample preparation chamber 100A. ing. Moreover, even if force is applied to the sample block 20 in the −X direction when the sample block 20 is sliced by a cutter 51 provided in the cutter unit 5 as will be described later, The sample block 20 can be firmly held at the sample block mounting position so that the accuracy of the thin section sample 24 is not deteriorated due to the position of the sample block 20 being displaced from the sample block mounting position (not shown). Has been.
In addition, the sample block transport unit 1 has a cutting surface, which is a surface layer portion of the sample block 20 after being sliced, positioned above the position D and can be sliced by a cutter 51 provided in the cutter unit 5 described later ( Hereinafter, the height position of the sample block 20 (the position in the ± Z direction orthogonal to the ± X direction) can be adjusted so as to be positioned at the sliceable position h).

The first charging unit 2 is disposed above the position A. The first charging unit 2 applies a positive charge to the surface layer portion of the sample block 20 transported to the position A, and charges the surface layer portion of the sample block 20 to the plus.
The cooling unit 3 is disposed above the position B. The cooling unit 3 supplies the sample block 20 conveyed to the position B and a part of the carrier tape 21 that is supplied above the sample block 20 and faces the sample block 20 as will be described later, to the temperature of the sample preparation chamber 100A. Cool to a temperature lower than the atmosphere. By this cooling, the surface layer portion of the sample block 20 can be easily sliced, and the thin slice sample 24 can be easily attached to the part of the carrier tape 21. The cooling temperature is preferably set so low that the part of the carrier tape 21 is condensed. Thereby, the said effect can be enlarged.

  The second charging unit 4 is disposed above the position C. The second charging unit 4 applies a negative charge to the part of the carrier tape 21 supplied from above the position B to above the position C in synchronism with the movement of the sample block 20 as will be described later. The part of the tape 21 is negatively charged.

The cutter unit 5 includes a cutter 51, and the cutter 51 is separated from the slicable position h to the sample block 20 side (−Z direction side) by the thickness of the thin slice sample 24 (for example, 3 μm to 10 μm). It is configured to be fixable on a plane and at a position on the −X direction side of the sliceable position h (hereinafter referred to as a sliced preparation position H). In the cutter unit 5, with the cutter 51 fixed at the slicing preparation position H, the sample block 20 after the height position adjustment is transported in the + X direction by the sample block transport unit 1 and moved to the slicing possible position h. Thus, the thin slice sample 24 can be produced by slicing the surface layer portion of the sample block 20 after the height position adjustment. Note that the side surface on the + X direction side of the sample block 20 is preferably formed so as to be perpendicular to the XY plane, that is, parallel to the YZ plane, for example, so that the cutter 51 can easily slice.
Hereinafter, the surface layer portion of the sample block 20 is sliced by the cutter 51 to produce the thin slice sample 24, and the height of the sample block 20 is set so that the cut surface of the sample block 20 after being sliced is positioned at the sliceable position h. A series of operations for adjusting the position by the sample block transport unit 1 is referred to as “thin cutting operation”. The detailed configuration of the cutter unit 5 will be described in detail later.

The supply reel 6 is disposed above the position A and the position B together with a feeding motor (not shown). The supply reel 6 is configured such that the carrier tape 21 functioning as a thin-cut auxiliary member can be fed by driving the feeding motor.
The take-up reel 7, together with the motor 71, is arranged further on the downstream side than the position E located on the downstream side (+ X direction side) of the travel (supply) path of the carrier tape 21 from the position D. A constant torque is always applied to the take-up reel 7 by always driving the motor 71, and the carrier tape 21 fed from the supply reel 6 by the feed motor can be wound at the same time as being fed. Has been. Driving of the feeding motor and motor 71 for feeding and winding the carrier tape 21 is controlled by the control unit 13.

The carrier tape guide portion 8 includes a plurality of guide rollers 8. The plurality of guide rollers 8 are unwound from the supply reel 6 and are wound around the take-up reel 7 so that the carrier tape 21 is transported to the position B between the surface layer portion of the sample block 20 and the cooling unit 3 and the position C. Between the surface layer portion of the sample block 20 conveyed to the second charging unit 4, an area above the position D and close to the surface layer portion of the sample block 20 conveyed onto the position D, and above the position E. The carrier tape 21 is arranged so that it can be guided.
The supply reel 6 and the take-up reel 7 are not limited to the arrangement as described above, and the carrier tape 21 can be guided as described above by the carrier tape guide portion 8. As long as it is placed anywhere.

  The transfer unit 9 includes a pair of guide rollers 91 and 91 disposed above the position E and upstream of the travel path of the carrier tape 21 (−X direction side), and above the position E and the carrier tape 21. And a pair of guide rollers 92 disposed on the downstream side (+ X direction side) of the travel route. The transfer unit 9, for example, sandwiches a part of the carrier tape 21 to which the thin slice sample 24 is attached between the pair of guide rollers 91, 91 and the pair of guide rollers 92, 92, and in that state, the pair of guides By moving the rollers 92 and 92 or the pair of guide rollers 91 and 91 in the −Z direction, the carrier tape 21 is bent downward, and an adhesive liquid 23 is supplied to the upper surface and the slide glass is positioned at the position E as will be described later. The thin slice sample 24 is brought into contact with the upper surface of the glass 22 so that the thin slice sample 24 can be transferred to the upper surface of the slide glass 22. Hereinafter, the slide glass to which the thin section is transferred is referred to as a slide glass with a thin section.

  The slide glass transport unit 10 transports, from the slide glass storage unit 40 that stores a large number of slide glasses 22, one slide glass 22 to which the thin section sample 24 is to be applied next onto the position F, and the positions F, E, It conveys in order of the position G, and it mounts on the heating board (not shown) with which the extension part 12 is equipped at the position G (refer FIG. 2).

  The adhesive liquid supply unit 11 is disposed above the position F and supplies the adhesive liquid 23 to the upper surface of the slide glass 22 conveyed to the position F. Examples of the adhesive liquid 23 include water or water containing ethyl alcohol.

  The extension unit 12 includes a heating plate (not shown), and the slide glass 22 with a thin section placed on the heating plate by the slide glass transport unit 10 is heated by the first heating plate. (For example, about 40 ° C. to 60 ° C., several seconds to several tens of seconds), the heel of the thin section sample 24 is extended and the adhesive force of the thin section sample 24 to the slide glass 22 is increased, and then the second section Heating (for example, about 40 ° C., several hours) is performed to completely evaporate the moisture on the slide glass 22 with a thin section, so that the thin section sample 24 is closely fixed to the slide glass 22.

  The control unit 13 includes a sample block transport unit 1, a first charging unit 2, a cooling unit 3, a second charging unit 4, a cutter unit 5, a slide glass transport unit 10, an extension unit 12, It is connected to the motor 71 and controls each operation based on an operation program stored in advance in a storage unit (not shown).

The thin-section sample preparation device 100 according to the embodiment of the present invention is configured as described above.
In the embodiment of the present invention, the thin-section sample preparation apparatus 100 includes the above-described units. However, the thin-section sample preparation apparatus according to the present invention is not limited to this configuration, and performs the above-described thinning operation. It is only necessary that at least the sample block transport unit 1 and the cutter unit 5 are provided.

Next, the manufacturing operation of the thin-section sample 24 of the thin-section sample preparation apparatus 100 will be described. The thin-section sample 24 is produced under the control of the control unit 13.
In order to produce the thin slice sample 24 with high accuracy, the surface layer portion of the sample block 20 with unevenness is sliced in advance with a cutter 51, and the cut surface which is the surface layer portion after the slice cutting of the sample block 20 is thin. It is necessary to be parallel to a plane (XY plane) having the cuttable position h. For this reason, the following initial operations are performed.

First, the sample block transport unit 1 transports one sample block 20 to be sliced from the sample storage unit 30 onto the position A.
Next, the sample block 20 is transported by the sample block transport unit 1 so as to pass over position A, position B, and position C, and the surface layer portion of the sample block 20 is sliced during the transport. The height position (position in the ± Z direction) of the sample block 20 is adjusted so that the sample block 20 is positioned on the XY plane where the possible position h is located, so that the sample block 20 can be sliced on the position D (see FIG. 1).
By moving the sample block 20 to the slicing possible position h, the cutter 51 of the cutter unit 5 fixed at the slicing preparation position H slices the surface layer portion of the sample block 20 into the sample block 20. A cutting surface parallel to a plane (XY plane) having the sliceable position h is formed.
Next, the sample block transport unit 1 moves the sample block 20 with the cutting surface parallel to the XY plane from position D to position A, and the cutting surface of the sample block 20 is at the position where the slicing is possible h. The height position (position in the ± Z direction) of the sample block 20 is adjusted so as to be positioned on a certain XY plane.
Thereby, the initial operation is completed.

Next, the manufacturing operation of the thin-section sample 24 after the completion of the initial operation will be described.
First, the sample block 20 whose height position is adjusted by the sample block transport unit 1 so that the cutting surface is positioned on the XY plane where the slicing position h is present is positioned from the position A to the slicing position on the position D. It is conveyed toward h.

  Next, when the sample block 20 after the height position adjustment passes over the position A, a positive charge is applied to the cut surface of the sample block 20 after the height position adjustment by the first charging unit 2. Supplied and the cut surface of the sample block 20 is positively charged.

  Next, when the sample block 20 after the height position adjustment passes over the position B, the cut surface of the sample block 20 after the height position adjustment is positioned above the position B and the height. A portion of the carrier tape 21 facing the sample block 20 after the position adjustment is cooled by the cooling unit 3.

Next, when the sample block 20 after the height position adjustment moves from position B to position C, the part of the carrier tape 21 is synchronized with the movement of the sample block 20 after the height position adjustment. The feeding motor (not shown) is driven so as to move while maintaining the opposed state to the sample block 20 after the height position adjustment.
Next, when the sample block 20 after the height position adjustment passes over the position C, the carrier tape 21 moved above the position C in synchronization with the movement of the sample block 20 after the height position adjustment. Negative charges are supplied to the part by the second charging unit 4. As a result, the part of the carrier tape 21 is negatively charged.

  Next, when the sample block 20 after the height position adjustment is transported from the position C to the sliceable position h on the position D by the sample block transport unit 1, the sample block after the height position adjustment is performed. After the surface layer portion of 20 abuts the cutter 51 of the cutter unit 5 fixed at the thin cutting preparation position H, the thin slice sample 24 is produced by being sliced by the conveyance force of the sample block conveyance unit 1. .

  When the cutting surface of the sample block 20 after the height position adjustment is sliced by the cutter 51 of the cutter unit 5, the sample block 20 after the height position adjustment is a sliceable position h on the position D. The portion of the carrier tape 21 that moves in synchronism with the movement of the sample block 20 after the height position adjustment exits the sample preparation chamber 100A and stops at the position where the slice can be performed h. The movement is continued to above the position E located in the sticking chamber 100B.

  At this time, as described above, the thin slice sample 24 produced by the cutter unit 5 is positively charged as the thin slice sample 24 which is the cut surface of the sample block 20 after the height position adjustment is performed. The portion of the carrier tape 21 facing the sample 24 is attached to the portion of the carrier tape 21 due to static electricity because the portion is negatively charged and due to the cooling effect of the cooling section 3 above the position E. Move up.

  On the other hand, during the movement of the sample block 20 from the position A to the position D and the movement of the thin-section sample 24 to the position F after the height position adjustment, the thin-section sample 24 is next moved by the slide glass transport unit 10. One glass slide 22 to be pasted is transported from the slide glass storage unit 40, transported to position F, supplied with the adhesive liquid 23 on the upper surface by the adhesive liquid supply unit 11, and then transported to position E. Thereby, in the position E, the thin slice sample 24 and the slide glass 22 will be in an opposing state.

  Next, the portion of the carrier tape 21 to which the thin slice sample 24 is adhered is bent downward by the transfer unit 9, and the thin slice sample 24 is pressed against the adhesive liquid 23 on the upper surface of the slide glass 22, thereby thin slice sample 24. Is transferred from the part of the carrier tape 21 to the upper surface of the slide glass 22.

The slide glass 22 with the thin section to which the thin section sample 24 has been transferred is transported from the position E to the position G of the extension section 12 by the slide glass transport section 10.
The slide glass 22 with a thin section conveyed to the position G is first heated (for example, about 40 ° C. to 60 ° C. for several seconds to several tens of seconds) by the extension section 12, so that the eyelids of the thin slice sample 24 are extended. And the sticking force of the thin slice sample 24 to the slide glass 22 is strengthened. Thereafter, the second heating (for example, about 40 ° C. for several hours) is further performed, the water is completely evaporated, and the thin-section sample 24 is firmly fixed to the slide glass 22.
Thereby, the manufacturing operation of the first thin slice sample 24 is completed.

In the above, when the thin slice sample 24 is moved to above the position E, the sample block 20 stopped at the sliceable position h on the position D is used for the preparation of the next thin slice sample 24. The sample block is transported from the position D to the position A by the sample block transport unit 1, and the cut surface of the sample block 20 after the first piece of the thin slice sample 24 is formed on the XY plane where the sliceable position h is located. The height position (position in the ± Z direction) of the sample block 20 is adjusted so as to be positioned at the position.
Thereafter, the sample block 20 is transported from the position A to the position D by the sample block transport unit 1 in the same manner as described above, and the above thinning operation is automatically and continuously repeated an arbitrary number of times. A thin section sample 24 is prepared.

Next, the configuration and operation of the cutter unit 5 will be described in detail.
FIG. 3 is a plan view showing a schematic configuration of the cutter unit 5. FIG. 4 is a side view illustrating a schematic configuration of the cutter unit 5.

3 and 4, the cutter unit 5 includes a cutter 51, a blade edge contact position changing unit 52, and a detection unit 53.
The cutter 51 has a length in the width direction (also referred to as the extending direction of the blade) sufficiently larger than the length in the width direction of the sample block 20 (± Y direction orthogonal to the ± X direction and ± Z direction). The cutter 51 is arranged so that any one of the contact areas I to VI (see FIG. 3) of the blade edge 51 a extending in the width direction (± Y direction) can first contact the sample block 20. Each of the contact regions I to VI of the cutting edge 51a of the cutter 51 has a length in the width direction that is equal to or greater than the length in the width direction of the sample block 20, and is conveyed to a slicable position h (see FIG. 1). The sample block 20 is arranged so as to be sliced without being brought into contact with another contact region. In FIG. 3, the cutting edge 51a of the cutter 51 is arranged so as to be orthogonal to the conveyance direction (± X direction) of the sample block 20 (extend in the ± Y direction), but at a certain angle. It may be inclined with.

  The blade edge contact position changing unit 52 changes the cutter 51 to the sample block so that the position where the blade edge 51a of the cutter 51 first contacts the sample block 20 can be sequentially changed, that is, the contact areas I to VI can be changed. It is configured to be movable in a direction (± Y direction, blade extending direction) orthogonal to 20 conveyance directions (± X direction).

The detection unit 53 includes a light projecting unit 53a that projects light and a light receiving unit 53b that receives light projected from the light projecting unit 53a. The light projecting unit 53a and the light receiving unit 53b They are arranged so as to face each other across the ± Y direction (for example, in the vicinity of the sliced preparation position H). The detection unit 53 can measure the height (± Z direction) position of the blade edge 51a of the cutter 51 based on the difference between the light amount projected from the light projecting unit 53a and the light amount received by the light receiving unit 53b. It is configured.
The detection unit 53 includes a light projecting unit 53c that projects light, and a light receiving unit 53d that receives light projected from the light projecting unit 53c. The light projecting unit 53c and the light receiving unit 53d include a sample On the upstream side of the transport direction (± X direction) of the block 20 (for example, in the vicinity of the position A), the sample block 20 is disposed so as to face each other across the transport path in the ± Y direction. Based on the difference between the amount of light projected from the light projecting unit 53c and the amount of light received by the light receiving unit 53c, the detecting unit 53 is the height of the cutting surface of the sample block 20 that is transported to the sliceable position h. (± Z direction) The position can be measured.

Operations of the blade edge contact position changing unit 52 and the detection unit 53 are controlled by the control unit 13.
As described above, the cutter unit 5 is configured.

  Next, the operation of the cutter unit 5 when producing a plurality of thin slice samples 24 will be described. The description overlapping with the description of the thinning operation will be omitted. FIG. 5 is a flowchart showing the operation of the cutter unit 5. The operations of the cutting edge contact position changing unit 52 and the detecting unit 53 of the cutter unit 5 are performed under the control of the control unit 13.

  Here, the initial operation and the like described above are performed to form a cut surface parallel to the XY plane on the surface layer portion of the sample block 20, and the sample block 20 is detected by the sample block transport unit 1. The description starts assuming that the light emitting unit 53c is disposed between the light projecting unit 53c and the light receiving unit 53d.

  First, the detection unit 53 projects light from the light projecting unit 53c and projects light from the light projecting unit 53c in a state where the sample block 20 is disposed between the light projecting unit 53c and the light receiving unit 53d. The light is received by the light receiving portion 53d, and the height (± Z direction) position of the cut surface of the sample block 20 is measured (step S1).

  Following the operation of step S1 or simultaneously with the operation of step S1, the cutting edge 51a of the cutter 51 in which the detection unit 53 is disposed at the thin cutting preparation position H between the light projecting unit 53a and the light receiving unit 53b. Then, light is projected from the light projecting unit 53a, and the light projected from the light projecting unit 53a is received by the light receiving unit 53b, and the height (± Z direction) position of the blade edge 51a of the cutter 51 is measured ( Step S2).

  Next, based on the measurement information of the cutting surface of the sample block 20 and the height position of the cutter 51 measured by the detection unit 53, the height position of the cutting surface of the sample block 20 is the height of the cutting edge 51a of the cutter 51. The sample block is positioned so as to lie on a plane (that is, a plane having a slicable position h) separated from the vertical position (that is, the slicing preparation position H) by the thickness of the thin slice sample 24 in the + Z direction side. The sample block 20 is moved in the ± Z direction by the transport unit 1, and the height position of the sample block 20 is adjusted (step S3).

Next, in a state where the cutting edge 51a of the cutter 51 is fixed at the slicing preparation position H, the sample block 20 after the height position adjustment is conveyed from the position A to the slicing possible position h on the position D, The surface layer portion of the sample block 20 is sliced in one of the contact areas (for example, the contact area I) of the cutting edge 51a of the cutter 51. That is, the thinning operation is started (step S4).
Next, each time the thinning operation is completed once, the control unit 13 determines whether or not the thinning operation has been completed an arbitrary number of times (for example, 100 times) by the contact area of the blade edge 51a of the cutter 51. (Step S5). The arbitrary number of times refers to the number of thin slice samples 24 required by the operator and the thin slice samples 24 before the worker starts the thinning operation automatically and continuously by the thin slice sample preparation apparatus 100. It is set according to the type of.

  In step S5, when the control unit 13 determines that the arbitrary number of thinning operations have been completed, the control unit 13 determines that the arbitrary number of thinning operations have not been completed while stopping the thinning operation. Sometimes, the control unit 13 then determines whether or not the thinning operation has been completed a preset number of times (for example, 20 times) (step S6). The preset number of times is set appropriately by the operator according to the material or the like before the operator starts the thinning operation automatically and continuously by the thin-section sample preparation device 100. Yes, it is preferable to set the number of times within a range in which the sharpness of the cutting edge 51a of the cutter 51 is not deteriorated by the automatic and continuous thin cutting operation.

  In step S6, when the control unit 13 determines that the preset number of times of the thinning operation has not been completed, the process returns to step S4 and repeats the thinning operation, while the control unit 13 sets the preset number of times. When it is determined that the thin cutting operation has been completed, the blade edge contact position changing unit 52 is different from the contact area (for example, the position where the blade edge 51a of the cutter 51 first contacts the sample block 20). The cutter 51 is moved in the ± Y direction (the extending direction of the blade) so as to be changed to the contact region II) (step S7). At this time, the height position of the blade edge 51a of the cutter 51 may be shifted before and after movement due to individual differences of the cutter 51, as described above. That is, in this case, the thin cutting preparation position H is shifted in the ± Z direction.

  For this reason, the detection unit 53 projects light from the light projecting unit 53a in a state where the cutter 51 is disposed between the light projecting unit 53a and the light receiving unit 53a, and the light projected from the light projecting unit 53a. Is received by the light receiving portion 53b, and the height (± Z direction) position of the blade edge 51a of the cutter 51 after the above movement (after change) is measured (step S8).

Next, based on the measurement information of the height position of the cutting edge 51 a of the cutter 51 after movement measured by the detection unit 53, the height position of the cutting surface of the sample block 20 is the cutting edge of the cutter 51 after movement. The sample block 20 is moved in the ± Z direction by the sample block transport unit 1 so that the sample block 20 is positioned on a plane separated from the height position 51a by the thickness of the thin slice sample 24 toward the + Z direction side, and the above The height position of the sample block 20 is adjusted (step S9). In other words, according to the deviation of the thin cutting preparation position H in the ± Z direction, the thin cutting possible position h in the ± Z direction is corrected. Thereby, the distance in the ± Z direction between the sample block 20 and the blade edge 51a of the cutter 51 after the movement is kept at a distance corresponding to the thickness of the thin slice sample 24.
Next, the process returns to step S4 and the thinning operation is resumed.

  As described above, when the cutter unit 5 operates, a plurality of thin slice samples 24 can be manufactured.

In the above description, the cutter 51 is fixed at the slicing preparation position H, and the sample block 20 is moved to the slicing possible position h so that the surface layer portion of the sample block 20 is sliced. It is not limited to this configuration. For example, the thin-section sample preparation device 100 may be configured to perform the above-described thinning operation by fixing the sample block 20 at the sliceable position h and moving the cutter 51 in the ± X direction on the XY plane. That is, the thin-section sample preparation device 100 may be configured to perform the above-described thin cutting operation by relatively moving the sample block 20 and the cutter 51. As an example of moving the cutter 51, a cutter horizontal moving unit (not shown) for moving the cutter 51 in the ± X direction is provided separately, and the sample block 20 is moved to the sliceable position h by the sample block transport unit 1. It is conceivable that the thin block sample 24 is produced by thinly slicing the sample block 20 by moving the cutter 51 in the −X direction by the cutter horizontal movement unit while being transported and stopped (fixed).
The operation of adjusting the height positions of the sample block 20 and the cutter 51 is not limited to the above-described operation, and the sample block 20 is transported from the position D to the position A by the sample block transport unit 1 and again from the position A to the position D. It may be carried out before being conveyed to.

  In the above description, the height position at the time of slicing is adjusted by moving the sample block 20 in the ± Z direction (height direction), but the present invention is not limited to this configuration. For example, the height position at the time of thin cutting may be adjusted by moving the cutter 51 in the ± Z direction (the blade thickness direction).

As described above, according to the thin-section sample preparation device 100 according to the embodiment of the present invention, the height of the sample block 20 is set so that the cut surface of the sample block 20 is positioned at the sliceable position h in one thin-cut operation. The position is adjusted. Therefore, since the sample block 20 is always adjusted to the same slicable position h, it is possible to prevent a decrease in accuracy required for the thin slice sample 24 due to the sample block 20 being displaced from the slicable position h. .
Further, every time the thinning operation of a preset number of times is completed, the contact areas I to VI of the blade edge 51a of the cutter 51 that first contacts the sample block 20 after the height position adjustment are sequentially changed. The cutter 51 moves in the blade extending direction (± Y direction). Therefore, since the contact areas I to VI of the blade edge 51a of the cutter 51 used for thin cutting of the sample block 20 can be made different, the sharpness of the cutter 51 can be kept in a good state. Further, since the entire blade edge 51a of the cutter 51 can be used, the number of replacements of the cutter 51 can be reduced, and the burden on the operator can be reduced.

Furthermore, according to the thin-section sample preparation device 100 according to the embodiment of the present invention, every time the movement of the cutter 51 in the extending direction of the blade is completed, the height position of the blade edge 51a of the cutter 51 after the change is changed. Measurement is performed by the detection unit 53, and the sliceable position h is corrected in the ± Z directions based on the measurement information of the detection unit 53. Therefore, even if the position of the blade edge 51a of the cutter 51 that contacts the sample block 20 is displaced before and after the movement of the cutter 51, the displacement is corrected.
Therefore, according to the thin-section sample preparation device 100 according to the embodiment of the present invention, when the thin-section operation is performed, the sample block 20 includes the cutting edge 51a of the cutter 51 that contacts the sample block 20 and the thin-section sample 24. Since it is moved so as to maintain the distance in the ± Z direction corresponding to the thickness, the thin section sample 24 can be automatically and continuously produced, and the operator can maintain the accuracy required for the thin section sample 24 while maintaining the accuracy required for the thin section sample 24. Can be reduced.

  In addition, this invention is not limited to the said embodiment, It can implement with another various aspect. For example, as shown in FIG. 6, the cutter unit 5 is further provided with an air supply unit 56 that blows compressed air (indicated by an arrow) onto the cutting edge 51 a of the cutter 51, so that the cutting edge 51 a of the cutter 51 contacts the sample block 20. When not in contact, the deposit 120 such as paraffin attached to the cutting edge 51a of the cutter 51 by the thin cutting operation may be blown off by the compressed air. By comprising in this way, the fall of the sharpness in one contact area | region of the blade edge | tip 51a of the cutter 51 can be reduced, and the frequency | count of replacement | exchange of the cutter 51 can be reduced further conventionally. Therefore, the burden on the operator can be reduced while maintaining the accuracy required for the thin-section sample 24.

  In addition, as shown in FIG. 6, the two nozzles 56a and 56b are provided in the air supply part 56, and it is comprised so that the said compressed air may be sprayed from 2 directions of + Z direction side and -Z direction side of the blade edge 51a of the cutter 51. Then, the deposit 120 can be removed more easily.

  The thin-section sample preparation method and apparatus of the present invention can automatically and continuously prepare a thin-section sample, and can reduce the burden on the operator while maintaining the accuracy required for the thin-section sample. It has an effect and is useful for a thin-section sample preparation method and apparatus for preparing a thin-section sample to be used for physicochemical sample analysis or microscopic observation of biological samples.

It is a front view which shows schematic structure of the thin slice sample preparation apparatus concerning embodiment of this invention. It is a top view which shows the general | schematic structure in the sample sticking chamber of the thin section sample preparation apparatus concerning embodiment of this invention. It is a front view which shows schematic structure of the cutter part with which the sliced piece sample preparation apparatus concerning embodiment of this invention is provided. It is a side view which shows the outline | summary structure of the cutter part with which the thin section sample preparation apparatus concerning embodiment of this invention is provided. It is a flowchart which shows the process of producing a some thin section sample in the thin section sample preparation apparatus concerning embodiment of this invention. It is a side view which shows the other structural example of the cutter part with which the sliced piece sample preparation apparatus concerning embodiment of this invention is provided.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Sample block conveyance part 2 1st charging part 3 Cooling part 4 2nd charging part 5 Cutter part 6 Supply reel 7 Take-up reel 8 Carrier tape guide part 9 Transfer part 10 Slide glass conveyance part 11 Adhesive liquid supply part 12 Extension Part 13 Control part 20 Sample block 21 Carrier tape 22 Slide glass 23 Adhesive liquid 24 Thin section sample 51 Cutter 51a Blade edge 52 Blade edge contact position changing part 53 Detection part 53a, 53c Light projection part 53b, 53d Light reception part 56 Air supply part 56a , 56b Nozzle 100 Thin section sample preparation device

Claims (4)

A sample block conveyance unit that can adjust the height position of the sample block and conveys the sample block, a cutter configured to be movable in the extending direction of the blade, and a detection unit that detects the thickness direction position of the blade of the cutter Using a thin-section sample preparation device having a thin-section sample preparation method, wherein a surface layer portion of the sample block is automatically and continuously sliced by the cutter to produce a plurality of thin-section samples.
The surface section of the sample block is sliced by the cutter by moving the sample block transport unit and the cutter relative to each other to produce the thin slice sample, and the cut surface of the sample block after the slicing When continuously performing the thinning operation for adjusting the height position of the sample block so that the
Every time the above-mentioned thinning operation is completed a preset number of times,
After moving the cutter in the extending direction of the blade so that the contact area of the blade edge of the cutter that first contacts the sample block after the height position adjustment is sequentially changed, the changed post-change The height position of the cutting edge of the cutter in the thickness direction of the blade is measured by the detection unit,
Based on the measurement information of the detection unit, the slicable position is located at a position separated from the height position of the blade edge of the cutter after the change by the thickness of the thin slice sample in the blade thickness direction. As described above, the thin slice sample preparation method, wherein the thin slicing position is corrected and the thin slicing operation is restarted.   The one-time slicing operation includes an operation of blowing compressed air to the cutting edge of the cutter that is in contact with the sample block after the thin slice sample is prepared by the cutter. The thin-section sample preparation method as described. A sample block conveyance unit that can adjust the height position of the sample block and conveys the sample block, a cutter configured to be movable in the extending direction of the blade, and a detection unit that detects the thickness direction position of the blade of the cutter And
The sample block transport unit and the cutter move relatively to slice the surface layer portion of the sample block with the cutter to produce the thin slice sample, and the cut surface of the sample block after the slicing Is a thin-section sample preparation device that continuously performs a thin-cut operation for adjusting the height position of the sample block so that is positioned at a thin-cut possible position,
Furthermore, each time the thinning operation of a preset number of times is completed, the cutter is moved so that the contact area of the blade edge of the cutter that first contacts the sample block after the height position adjustment is changed. It has a blade edge contact position changing part that moves in the extending direction of the blade,
When the contact region of the blade edge of the cutter that first contacts the sample block after the height position adjustment is changed by the blade edge contact position changing unit, the detection unit changes the cutting edge of the cutter. , Measure the height position in the thickness direction of the blade,
Based on the measurement information of the detection unit, the sample block transport unit has a thickness of the thin slice sample in the thickness direction of the blade from the height position of the blade edge of the cutter after the change. The height position of the sample block is corrected so that the position capable of slicing is adjusted so as to be far away and the cut surface of the sample block is positioned at the position capable of slicing after the correction. A thin-section sample preparation device characterized by adjusting the above.   Furthermore, the thin slice sample preparation apparatus of Claim 3 provided with the air supply part which sprays compressed air on the said blade edge | tip of the said cutter.

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