JP2012229996A - Thin-sliced sample fabrication device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thin-sliced sample fabrication device capable of further correctly adjusting the position of a sample block.SOLUTION: A thin-sliced sample fabrication device includes: a sample block cutting-part comprising a cutter; a sample block transport part enabled to adjust an inclination angle of the sample block relative to an X-Y right-angle axis direction and a height position of the sample block in a Z direction, and for transporting the sample block in an X direction; a detection part for detecting the height position of the sample block; and a control part for adjusting the inclination angle and height position of the sample block on the basis of the detected information of the height detection part, with the height detection part comprising three contact-type sensors enabled to contact surface portions of the sample block at mutually different three measuring points to detect the height positions of the three measuring points.

Description

  The present invention relates to a thin-section sample preparation apparatus for preparing a thin-section sample used for physicochemical sample analysis or microscopic observation of biological samples.

  Conventionally, a microtome is known as this type of device. A microtome is an apparatus for producing a thin slice sample by slicing a specimen embedded with paraffin or the like with a cutter. A thin slice sample prepared by a microtome is attached to a slide glass and used as a thin slice sample for tissue observation.

  Conventionally, an operation for producing a sliced piece sample using a microtome has been manually performed by an operator, which requires a great deal of labor and labor. In addition, the thickness required for the thin slice sample is very thin (for example, 3 μm to 10 μm although it varies depending on the sample), and high uniformity is also required. For this reason, even an operator skilled in the use of a microtome usually takes several days to process dozens of sample blocks. Further, since the same work is repeated, an excessive burden is imposed on the worker physically and mentally.

  Therefore, in recent years, various apparatuses have been proposed for automating the preparation of the thin slice sample to reduce the burden on the operator. This type of device adjusts the height position of the cutter and the sample block so that the cutter can slice the surface layer portion of the sample block, and then transports the sample block toward the cutter to produce a thin slice sample. Generally, it is configured as follows. In the thin-section sample preparation apparatus having such a configuration, first, a predetermined amount of rough cutting is performed to perform chamfering, and main cutting is performed when the exposed area of the sample block becomes appropriate. Here, if the surface layer portion of the sample block is inclined with respect to the extending direction of the cutting edge of the cutter or the conveying direction of the sample block, rough cutting takes too much time. For this reason, it is important to adjust the position of the sample block so that the surface layer portion of the sample block is parallel to the extending direction of the cutting edge of the cutter and the conveying direction of the sample block.

  Patent Document 1 (Japanese Patent Laid-Open No. 2008-76251) discloses a method of providing a line sensor and surface-extruding (surface-matching) a sample block based on a change in the amount of light received by the line sensor. Note that adjusting the position of the sample block so that it is parallel may be referred to as “face-up”, but in the field of thin-section sample preparation devices, the term “face-up” refers to “specimen on the surface of the sample block. It may mean "effectively exposing". For this reason, in order to avoid misunderstanding, here, adjusting the position of the sample block so that the surface layer portion of the sample block is parallel to the extending direction of the cutting edge of the cutter and the conveying direction of the sample block is referred to as “surface matching. "

JP 2008-76251 A

  However, in the method of Patent Document 1, when a foreign object adheres to the surface of the sample block, the foreign object blocks the light of the line sensor, and the height position of the top of the foreign object is the height position of the surface of the sample block. There is a possibility of false detection. In this case, the surface of the sample block cannot be accurately performed, and as a result, there is a possibility that problems such as an increase in the manufacturing time of the thin slice sample may occur.

  Accordingly, an object of the present invention is to provide a thin-section sample preparation device that can solve the above-mentioned problem and can perform the surface alignment of the sample blocks more accurately.

In order to achieve the above object, the present invention is configured as follows.
According to the first aspect of the present invention, there is provided a thin-section sample preparation device for preparing a thin-section sample by slicing a surface layer portion of a sample block with a cutter,
A sample block cutting section comprising the cutter;
A sample block transport unit configured to adjust an inclination angle of the sample block with respect to an XY orthogonal two-axis direction and a height position in the Z-axis direction, and transports the sample block in the X-axis direction;
A height detector for detecting a height position of the sample block;
A control unit for adjusting the tilt angle and the height position of the sample block based on detection information of the height detection unit;
With
The height detection unit is configured to contact at least three measurement points that are not collinear with the surface layer portion of the sample block, and detect at least three contact points to detect the height positions of the at least three measurement points. Comprising
A thin-section sample preparation apparatus is provided.

  According to a second aspect of the present invention, there is provided the thin-section sample preparation device according to the first aspect, wherein the three measurement points are located inside the outer edge of the sample block.

  According to the third aspect of the present invention, the height detection unit can detect the height position of the fourth measurement point by contacting the fourth measurement point located approximately at the center of the sample block. The thin-section sample preparation apparatus according to the first or second aspect, further comprising a fourth contact sensor.

  According to the fourth aspect of the present invention, the control unit adjusts the tilt angle of the sample block, and then causes the height detection unit to detect the height position of the sample block again, and the height detection unit. Based on the detected information, the sample block transport unit is controlled to readjust the inclination angle of the sample block, and the height detecting unit detects the height position of the sample block, and the height of the sample block is determined. The thin-section sample preparation device according to any one of the first to third aspects, wherein the position is adjusted, is provided.

  According to the thin-section sample preparation device according to the present invention, since the height detection unit includes the three contact sensors, three measurement points that are not collinear with the surface layer portion of the sample block are provided. The height position of the three measurement points can be detected by contact. By detecting the height positions of the three measurement points, the tilt angle and height position of the sample block can be detected. Moreover, since it is a contact-type sensor, even if a foreign material has adhered to the surface of the sample block, the possibility that the height position of the sample block is erroneously detected by the foreign material can be suppressed. Therefore, the surface alignment of the sample block can be performed more accurately.

It is a block diagram which shows schematic structure of the thin section sample preparation apparatus concerning embodiment of this invention. It is a perspective view which shows schematic structure of a height detection part. It is a side view which shows typically the state which contacted the contact type sensor with respect to the surface layer part of a sample block. It is a side view which shows typically the state which contacted the contact-type sensor with respect to the surface layer part of the sample block adjusted so that it might become parallel to XY plane. FIG. 5 is a side view schematically showing a state in which a surface layer portion of a sample block finely adjusted to be parallel to the XY plane from the state shown in FIG. 4 is brought into contact with a contact sensor. It is a side view which shows typically the state which contacted the contact type sensor with which the height detection part shown in FIG. 2 with respect to the sample block which the surface curved inward. It is a perspective view which shows schematic structure of the modification of a height detection part. It is a side view which shows typically the state which contacted the contact type sensor with which the height detection part shown in FIG. 7 with respect to the sample block which the surface curved inside.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<Embodiment>
A schematic configuration of a thin-section sample preparation device according to an embodiment of the present invention will be described. FIG. 1 is a block diagram showing a schematic configuration of a thin-section sample preparation apparatus according to an embodiment of the present invention.

  In FIG. 1, a thin-section sample preparation apparatus 100 is an apparatus that prepares a plurality of thin-section samples 24 by automatically and continuously slicing a surface layer portion of a sample block 20 with a cutter 41. The sample block 20 is obtained by embedding the subject 20a in an embedding material such as paraffin. Examples of the subject 20a include biological samples such as human and animal tissues.

  The thin-section sample preparation apparatus 100 includes a sample block storage unit 30 that stores a plurality of sample blocks 20. One sample block 20 selected from the plurality of sample blocks 20 stored in the sample block storage unit 30 is transported by the sample block transport unit 1 to the sample block cutting unit 4 including the cutter 41.

  The sample block transport unit 1 is configured such that after the sample block 20 to be sliced next is taken out from the sample block storage unit 30 and transported onto the position A, the sample block 20 can be transported back and forth between the positions A to C. Has been. The positions A to C are linearly aligned in the ± X axis direction. That is, the sample block transport unit 1 is configured to be able to transport the sample block 20 in the X-axis direction. The sample block transport unit 1 is configured to be able to adjust the tilt angle of the sample block 20 with respect to the XY orthogonal biaxial direction (also referred to as the XY plane) and the height position in the Z axis direction.

  Above the position A, the height detector 2 that detects the height position of the sample block 20 is arranged. The configuration of the height detection unit 2 will be described in detail later. Above the position B, the image pickup unit 3 that picks up an image of the cut surface of the sample block 20 sliced and exposed by the cutter 41 is disposed. The imaging unit 3 is configured to have a portion that irradiates the surface of the sample block, such as a white light source or a monochromatic LED light source, and a photographing portion for obtaining image data such as a CCD camera. Above the position C, the sample block cutting section 4 is disposed that can hold the cutter 41 and slice the surface layer portion of the sample block 20. The cutter 41 is held such that the cutting edge extends in the ± Y axis direction.

  Further, above the position C, a carrier tape 21 for holding a thin slice sample 24 obtained by slicing the surface layer portion of the sample block 20 with a cutter 41 is supplied. The carrier tape 21 is fed out from the supply reel 5, guided by the guide rollers 81 and 82, and supplied above the position C. The carrier tape 21 holding the sliced piece sample 24 above the position C is guided by the guide rollers 83 and 84 and taken up on the take-up reel 6.

  The supply reel 5 is provided with a feeding motor 51. By driving the feeding motor 51, the carrier tape 21 is fed from the supply reel 5. The take-up reel 6 is provided with a take-up motor 61. A constant torque is always applied to the take-up reel 6 by always driving the take-up motor 61. Thereby, the carrier tape 21 fed out from the supply reel 5 by the driving of the feeding motor 51 is taken up on the take-up reel 6 simultaneously with the feeding out.

  The thin slice sample 24 held on the carrier tape 21 is stuck to the slide glass 22 by the thin slice sticking portion 7 disposed between the guide rollers 83 and 84. The thin section pasting part 7 is disposed on the upstream side (−X axis direction side) of the traveling path of the carrier tape 21 and on the downstream side (+ X axis direction side) of the traveling path of the carrier tape 21. And a pair of guide rollers 72 arranged. The thin slice pasting portion 7 is bent downward with the carrier tape 21 sandwiched between the pair of guide rollers 71 and 71 and the pair of guide rollers 72 and 72, and the thin slice sample 24 held on the carrier tape 21. Is brought into contact with the slide glass 22 supplied with an adhesive liquid 23 such as water. As a result, the thin slice sample 24 is attached to the slide glass 22. Hereinafter, the slide glass to which the thin section sample 24 is attached is referred to as a slide glass with a thin section.

  The slide glass 22 with a thin section is conveyed to the extension unit 9 by the slide glass conveyance unit 8. The slide glass transport unit 8 transports the slide glass 22 with a thin section to the extension unit 9, and takes out the slide glass 22 to which the thin section sample 24 has not been pasted from the slide glass storage unit (not shown), and a thin section pasting unit. 7 is conveyed below. The extension unit 9 includes a heating plate (not shown), extends the folds of the thin slice sample 24, and completely evaporates the moisture on the slide glass 22, thereby closely attaching the thin slice sample 24 to the slide glass 22. Fix it.

  The operation of each component such as the sample block transport unit 1 is controlled by the control unit 10. The control unit 10 controls the operation of each component based on information input to an input unit (not shown). The input unit is configured to be able to input, for example, the number of manufactured slide glasses with thin sections, the number of thin section samples attached per slide glass, and the like.

  Next, the manufacturing operation of the thin slice sample 24 will be described. The production operation of the thin slice sample 24 is performed under the control of the control unit 10. Normally, when the sample block 20 is stored in the sample block storage unit 30, the subject 20a is embedded in the embedding material so as not to be exposed to the outside (or slightly exposed). For this reason, in this embodiment, the surface layer portion of the sample block 20 is roughened until the exposed area of the subject 20a is equal to or larger than a preset area, and then a thin slice sample 24 of about 3 to 10 μm is prepared. I try to sharpen. First, the roughing operation will be described.

First, the sample block transport unit 1 takes out the sample block 20 to be sliced next from the sample block storage unit 30 and transports it to the position A.
Next, the height detector 2 detects the height position of the sample block 20.
Next, the sample block transport unit 1 adjusts the inclination angle of the sample block 20 with respect to the XY plane and the height position in the Z-axis direction based on the detection information of the height detection unit 2.

Next, the sample block transport unit 1 transports the sample block 20 to the position B.
Next, the imaging unit 3 images the sample block 20. Thereby, the maximum projection area (maximum projection area) of the subject 20a in the sample block 20 is recognized.
Next, the sample block transport unit 1 transports the sample block 20 to the position C. Thereby, the surface layer portion of the sample block 20 is roughly cut by the cutter 41.

Next, the sample block transport unit 1 transports the sample block 20 to the position B.
Next, the imaging unit 3 captures an image of the cut surface of the sample block 20 that is exposed by being sliced by the cutter 41.

  When the exposed area of the subject 20a on the cutting surface of the sample block 20 is less than a preset area (for example, 80% of the maximum projection region), the sample block transport unit 1 uses the cutter 41 as the surface layer portion. The height position of the sample block 20 is adjusted so that it is roughly cut. Thereafter, the sample block transport unit 1 transports the sample block 20 to the position C. Thereby, the surface layer portion of the sample block 20 is roughed again by the cutter 41. Thereafter, the sample block transport unit 1 transports the sample block 20 to the position B, and the imaging unit 3 captures the cutting surface of the sample block 20 again. The rough cutting of the sample block 20 and the imaging operation of the cutting surface are repeated until the exposed area of the subject 20a on the cutting surface of the sample block 20 is equal to or larger than a preset area.

  When the exposed area of the subject 20a on the cutting surface of the sample block 20 is equal to or larger than a preset area, the rough cutting operation is finished and the main cutting operation is started. In addition, when using the position of the cutting edge 41a of different cutter 41 or different cutter 41 for rough cutting and main cutting, or when the thickness of rough cutting differs from the thickness of main cutting, the thickness accuracy of the section to be manufactured is improved. Therefore, at the position of the cutter 41 used for the main cutting or the cutting edge 41a of the cutter 41, a so-called discarding operation is performed in which the thin cutting sample 24 is thinly cut several times with the main cutting thickness before the thin section sample 24 is manufactured (before the main cutting). Is preferably performed.

  In the main cutting operation, the sample block transport unit 1 adjusts the height position of the sample block 20 so that the surface layer portion of the sample block 20 is sliced by the cutter 41 (about 3 μm to 10 μm). Thereafter, the sample block transport unit 1 transports the sample block 20 to the position C. Thereby, the surface layer part of the sample block 20 is sliced by the cutter 41, and the thin slice sample 24 is produced. Thereafter, the sample block transport unit 1 retracts the sample block 20 from the position C to the position B or the like, and adjusts the height position of the sample block 20 so that the surface layer portion of the sample block 20 is sliced by the cutter 41. The operations of adjusting the height position of the sample block 20, slicing, and retracting are automatically and continuously repeated an arbitrary number of times based on information input to the input unit (not shown), and an arbitrary number of sheets A thin slice sample 24 is prepared.

  The thin slice sample 24 produced by the main cutting operation is attached to the carrier tape 21. At this time, it is preferable that the surface of the carrier tape 21 is subjected to treatments such as humidification, cooling, and charging so that the thin slice sample 24 is securely attached to the carrier tape 21. The thin slice sample 24 affixed to the carrier tape 21 is conveyed to the thin slice affixing unit 7 by driving of the feeding motor 51 and the take-up motor 61 and affixed to the slide glass 22 by the thin segment affixing unit 7. Thereafter, the slide glass 22 with a thin section is conveyed to the extension unit 9 by the slide glass conveyance unit 8. Thereafter, the extension section 9 extends the folds of the thin slice sample 24 and closely fixes the thin slice sample 24 to the slide glass 22.

  Next, the configuration of the height detection unit 2 will be described in more detail. FIG. 2 is a perspective view illustrating a schematic configuration of the height detection unit 2.

  As shown in FIG. 2, the height detector 2 includes three contact sensors 2A, 2B, and 2C. Each of the contact sensors 2A, 2B, 2C can contact the three measurement points 20b to 20d that are not on the same straight line with respect to the surface layer portion of the sample block 20, and detect the height positions of the three measurement points. Is provided. Each contact type sensor 2A, 2B, 2C is configured to detect, for example, the contact pressure with the surface layer portion of the sample block 20, and when the contact pressure of each sensor is the same, the inclination angle of the sample block 20 with respect to the XY plane is It is provided to be 0 degrees (that is, parallel to the extending direction of the cutting edge of the cutter 41 and the conveying direction of the sample block 20).

  Next, the height detection operation of the sample block 20 by the height detection unit 2 will be described in more detail. The height detection operation of the sample block 20 by the height detection unit 2 is performed under the control of the control unit 10.

  First, the sample block transport unit 1 transports the sample block 20 to be sliced next from the sample block storage unit 30 to the position A.

  Next, the sample block transport unit 1 moves the sample block 20 in the + Z-axis direction, and brings the surface layer portion of the sample block 20 into contact with the three contact sensors 2A, 2B, 2C of the height detection unit 2. As a result, the contact sensors 2A, 2B, 2C detect the height position of the sample block 20.

  Next, after the sample block transport unit 1 retracts the sample block 20 from the three contact sensors 2A, 2B, and 2C in the −Z axis direction, the inclination angle of the sample block 20 with respect to the XY plane is adjusted. For example, as shown in FIG. 3, when the sample block 20 is inclined with respect to the XY plane, the sample block transport unit 1 causes the sample block 20 so that the surface layer portion of the sample block 20 is parallel to the XY plane. Adjust the tilt angle. By this adjustment, the rough cutting time of the thin slice sample 24 can be shortened and the rough cutting amount can be reduced by bringing the surface layer portion of the sample block 20 closer to the XY plane. Although it is preferable to make the surface layer portion of the sample block 20 completely parallel to the XY plane by this adjustment, since the adjustment requires an accuracy of several μm level, it is practically difficult. For this reason, it is preferable to perform the following operation.

  That is, the sample block transport unit 1 moves the sample block 20 in the + Z-axis direction, and brings the surface layer portion of the sample block 20 into contact with the three contact sensors 2A, 2B, and 2C as shown in FIG. As a result, the contact sensors 2A, 2B, 2C redetect the height position of the sample block 20.

  Next, after the sample block transport unit 1 retracts the sample block 20 from the three contact sensors 2A, 2B, and 2C in the −Z axis direction, the tilt angle of the sample block 20 with respect to the XY plane is finely adjusted. By performing the second height detection with this contact sensor and finely adjusting the tilt angle, the accuracy of making the surface layer portion of the sample block 20 parallel to the XY plane is improved. Note that the redetection and fine adjustment operations of the height position of the sample block 20 may be repeated until a desired accuracy is obtained.

  Next, the sample block transport unit 1 moves the sample block 20 in the + Z-axis direction, and again brings the surface layer portion of the sample block 20 into contact with the three contact sensors 2A, 2B, and 2C as shown in FIG. Thereby, the contact-type sensors 2A, 2B, and 2C detect the height position of the sample block 20 again.

Next, the sample block transport unit 1 retracts the sample block 20 from the three contact sensors 2A, 2B, 2C in the −Z axis direction.
Next, the sample is adjusted so that the height position of the measurement point located at the highest position among the three measurement points detected by the three contact sensors 2A, 2B, and 2C and the cutting edge of the cutter 41 coincide with each other. The block transport unit 1 adjusts the height position of the sample block 20.

  Next, the sample block transport unit 1 transports the sample block 20 to the position C. Thereby, the surface layer portion of the sample block 20 is sliced by the cutter 41, and rough cutting can be performed in a shorter time, and the thin slice sample 24 is produced.

  As described above, according to the present embodiment, since the height detection unit 2 includes the three contact sensors 2A, 2B, and 2C, the three measurement points 20b that are not collinear with the surface layer portion of the sample block 20 are provided. , 20c and 20d, the height positions of the three measurement points can be detected. In particular, by detecting the height positions of the three measurement points 20b, 20c, and 20d twice, the fineness of the inclination angle of the sample block 20 with respect to the XY plane can improve the accuracy of the surface matching. .

  In addition, according to the present embodiment, since the contact type sensors 2A, 2B, and 2C are in contact with the surface layer portion of the sample block 20, even if foreign matter adheres to the surface of the sample block 20, the sample is caused by the foreign matter. The possibility of erroneous detection of the height position of the block 20 can be suppressed. In the thin-section sample preparation device, it is conceivable that paraffin waste as an embedding material adheres to the surface of the sample block 20 as a foreign substance. Further, in order to clean the surface of the sample block, a fiber material such as a non-woven fabric may be used, but the fiber waste may adhere to the surface of the sample block 20. In such a case, if it is a non-contact type sensor, the thickness including the foreign matter will be detected. On the other hand, in the case of a contact-type sensor, it is possible to exclude the thickness due to the foreign matter because the foreign matter can be pushed into the sample block 20 to some extent at the time of contact with paraffin waste. Therefore, the surface alignment of the sample block 20 using paraffin as the embedding material can be performed more accurately.

  Note that the three measurement points 20b, 20c, and 20d at which the contact sensors 2A, 2B, and 2C detect the height position are preferably located on the inner side of the outer edge portion 20e of the sample block 20. The sample block 20 is produced, for example, by placing a subject 20a in a plastic mold and then pouring paraffin into it. In this case, when removing the mold from the manufactured sample block 20, the surface of the sample block 20 may be warped (recessed) inward as shown in FIG. In this case, even if only the outer edge portion 20e of the sample block 20 is sliced, it cannot be used as the thin-section sample 24. Therefore, the time taken to slice the outer edge portion 20e is wasted. In the method of Patent Document 1, since only the height position of the outer edge portion 20e of the sample block 20 can be detected, the preparation time of the thin slice sample 24 becomes long. On the other hand, by positioning the three measurement points 20b, 20c, and 20d on the inner side of the outer edge portion 20e of the sample block 20, it is possible to shorten the time required for the operation of slicing the outer edge portion 20e.

  In general, the sample block 20 has a surface size of 24 mm × 24 mm, 24 mm × 30 mm, and 24 mm × 37 mm. For this reason, it is preferable that the space | interval of the measurement points 20b, 20c, and 20d is less than 24 mm.

  The sample block 20 also has a surface size of 15 mm × 15 mm. In this case, the interval between the measurement points 20b, 20c, and 20d is preferably less than 15 mm. it is conceivable that. However, as the distance between the measurement points 20b, 20c, and 20d becomes narrower, it becomes more difficult to detect the inclination angle of the surface layer portion of the sample block 20 with respect to the XY plane. In FIG. 6, the bottom of the concave portion on the surface of the sample block 20 is shown to be flat, but the bottom may be arcuate. For this reason, as shown in FIG. 7, the height detection unit 2 is in contact with the fourth measurement point 20f located approximately at the center of the sample block and can detect the height position of the measurement point 20f. A contact sensor 2D may be provided. This makes it possible to detect the height position in the vicinity of the lowest point of the concave portion on the surface of the sample block 20, thereby further shortening the production time of the thin slice sample 24.

  The fourth measurement point 20f is preferably positioned at the center of the sample block 20. As a result, the height position near the lowest point of the concave portion on the surface of the sample block 20 can be detected, and the production time of the thin-section sample 24 can be further shortened.

  In addition, by positioning the fourth measurement point 20f approximately at the center of the sample block 20, the following effects can be obtained. For example, when the sample block 20 is very small, the three contact sensors 2A, 2B, 2C cannot contact the sample block 20, and the apparatus may enter an error state and stop. On the other hand, at least the contact sensor 2D comes into contact with the sample block 20 by providing the fourth contact sensor 2D that can come into contact with the fourth measurement point 20f located approximately at the center of the sample block 20. Can do. Thereby, the height position of the sample block 20 can be adjusted. In addition, the continuous operation state can be maintained without entering an error state. In particular, it is effective to provide the fourth contact sensor 2D during continuous automatic operation such as overnight operation.

  Since the thin-section sample preparation device according to the present invention can perform the surface alignment of the sample block more accurately, the thin-section sample preparation device is useful as a thin-section sample preparation device used for physicochemical sample analysis or microscopic observation of biological samples. is there.

DESCRIPTION OF SYMBOLS 1 Sample block conveyance part 2 Height detection part 2A-2D Contact type sensor 3 Imaging part 4 Sample block cutting part 5 Supply reel 6 Take-up reel 7 Thin section sticking part 8 Slide glass conveyance part 9 Extending part 10 Control part 20 Sample block DESCRIPTION OF SYMBOLS 21 Carrier tape 22 Glass slide 23 Adhesive liquid 24 Thin section sample 30 Sample block storage part 41 Cutter 51 Feeding motor 61 Take-up motor 71,72,81-84 Guide roller 100 Thin section sample preparation apparatus

Claims (4)

A thin-section sample preparation device for preparing a thin-section sample by slicing a surface layer portion of a sample block with a cutter,
A sample block cutting section comprising the cutter;
A sample block transport unit configured to adjust an inclination angle of the sample block with respect to an XY orthogonal two-axis direction and a height position in the Z-axis direction, and transports the sample block in the X-axis direction;
A height detector for detecting a height position of the sample block;
A control unit for adjusting the tilt angle and the height position of the sample block based on detection information of the height detection unit;
With
The height detection unit is configured to contact at least three measurement points that are not collinear with the surface layer portion of the sample block, and detect at least three contact points to detect the height positions of the at least three measurement points. With
Thin section sample preparation device.   The thin-section sample preparation device according to claim 1, wherein the three measurement points are located inside an outer edge portion of the sample block.   The said height detection part is further provided with the 4th contact-type sensor which can contact the 4th measurement point located in the center of the said sample block, and can detect the height position of the said 4th measurement point. The thin-section sample preparation apparatus according to 1 or 2.   The control unit adjusts the inclination angle of the sample block, and then causes the height detection unit to detect the height position of the sample block again, and transports the sample block based on detection information of the height detection unit. A control unit to readjust the inclination angle of the sample block, and further to cause the height detection unit to detect the height position of the sample block, thereby adjusting the height position of the sample block. The thin-section sample preparation device according to any one of the above.

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