WO2015046202A1 - Sliced-sample production device and sliced-sample production method - Google Patents

Sliced-sample production device and sliced-sample production method Download PDF

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Publication number
WO2015046202A1
WO2015046202A1 PCT/JP2014/075190 JP2014075190W WO2015046202A1 WO 2015046202 A1 WO2015046202 A1 WO 2015046202A1 JP 2014075190 W JP2014075190 W JP 2014075190W WO 2015046202 A1 WO2015046202 A1 WO 2015046202A1
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WIPO (PCT)
Prior art keywords
sample
sample block
thin
temperature
unit
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PCT/JP2014/075190
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French (fr)
Japanese (ja)
Inventor
弘明 飯田
健吾 渡辺
中川 泰
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倉敷紡績株式会社
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Publication of WO2015046202A1 publication Critical patent/WO2015046202A1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00Sampling; Preparing specimens for investigation
    • G01N1/02Devices for withdrawing samples
    • G01N1/04Devices for withdrawing samples in the solid state, e.g. by cutting
    • G01N1/06Devices for withdrawing samples in the solid state, e.g. by cutting providing a thin slice, e.g. microtome
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00Sampling; Preparing specimens for investigation
    • G01N1/28Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/30Staining; Impregnating ; Fixation; Dehydration; Multistep processes for preparing samples of tissue, cell or nucleic acid material and the like for analysis
    • G01N1/31Apparatus therefor
    • G01N1/312Apparatus therefor for samples mounted on planar substrates

Definitions

  • the present invention relates to a thin-section sample preparation apparatus and a thin-section sample preparation method for preparing a thin-section sample used for physicochemical sample analysis or microscopic observation of biological samples.
  • a microtome is widely known as an apparatus for producing a thin-section sample used for physicochemical sample analysis or microscopic observation of a biological sample.
  • a microtome is a device that produces a thin slice sample by slicing a sample block (embedded) in an embedding agent such as paraffin into a specimen block (embedded) such as a biological sample of an animal.
  • Patent Documents 1 to 5 describe thin-section sample preparation apparatuses that perform a series of operations such as slicing a sample block, attaching to a slide glass, stretching, and drying.
  • the thickness of the thin slice sample is required to be very thin (depending on the sample, for example, 3 ⁇ m to 10 ⁇ m) and uniform. Furthermore, since many biological samples of animals are difficult to collect again, it is necessary to avoid as much as possible the waste of the sample without obtaining a desired thickness. On the other hand, this sample block has a problem that expansion and contraction are likely to occur due to a subtle change in temperature, and unevenness is likely to occur in the thickness of the thin slice during thin slice processing.
  • the thin-section sample preparation device is generally provided with a cooler that cools the inside of the device surrounded by a casing.
  • the temperature is appropriately set according to the sample used as the sample block, the type of embedding agent, and the like.
  • the temperature of the sample block may not reach the predetermined temperature even when the temperature varies within the enclosed apparatus and the temperature inside the apparatus is almost the predetermined temperature.
  • the temperature of the embedding agent for the sample block may not be sufficiently lowered until the preparation of the thin section.
  • the use of a thin-section sample preparation device usually starts a thin-section preparation operation such as a cutting process after about 30 minutes have passed since the cooler is operated.
  • the set time of 30 minutes does not take into account the temperature of the sample block, it may be too long and it may simply be a time loss, or it may be too short to reduce the temperature of the sample block, and the sample during the cutting process Thickness unevenness may occur in the thin slice obtained by the temperature change of the block.
  • the present invention controls the thin-section manufacturing operation of the apparatus based on the surface temperature of the sample block.
  • the thin-section sample preparation apparatus of the present invention is a thin-section sample preparation apparatus that prepares a thin-section sample by slicing a sample block in which a sample is embedded in an embedding agent with a cutter, and transports the sample block
  • a conveyance unit a cutting unit including the cutter; a temperature detection unit that detects a surface temperature of the sample block; and at least the conveyance unit and / or based on the surface temperature of the sample block detected by the temperature detection unit.
  • a control unit for controlling the operation of the cutting unit.
  • the control unit stops the conveying unit and / or the cutting unit until the surface temperature falls within the predetermined range.
  • any of the thin-section sample preparation devices further includes a humidifying unit that humidifies the surface of the sample block, and the humidifying unit humidifies between the cutting unit and the temperature detecting unit. .
  • any one of the thin-section sample preparation apparatuses further includes a surface determination unit that determines whether an area of the sample portion on the surface of the sample block is sufficient for thin-section sample preparation.
  • the temperature detection unit performs temperature detection when it is determined that the area of the sample portion on the surface of the sample block is sufficient for thin-section sample preparation.
  • the thin-section sample preparation method of the present invention is a thin-section sample preparation method for preparing a thin-section sample by slicing a surface layer portion of a sample block in which the sample is embedded in an embedding agent with a cutter. Detecting the surface temperature, determining whether or not the surface temperature is within a predetermined range, and if the surface temperature is within the predetermined range, the cutter and the sample block Performing the slicing operation by relatively moving, and stopping the sample block until the surface temperature falls within the predetermined range when the surface temperature is outside the predetermined range.
  • the thin-section sample preparation apparatus or method of the present invention since the thin-section sample preparation operation is controlled based on the surface temperature of the sample block, it is possible to reduce an extra waiting time before the start of thin-section sample preparation, And the nonuniformity of the thickness of the thin slice sample due to the change of the sample block temperature can be suppressed.
  • FIG. 1 It is a block diagram showing a schematic structure of a thin section sample preparation device concerning a 1st embodiment of the present invention.
  • A is sectional drawing which looked at the sample block before rough cutting from the front direction
  • (b) is a plan view of the sample block after rough cutting
  • (c) is a view of the sample block after rough cutting from the front direction.
  • It is sectional drawing.
  • It is a process flow figure of the thin section sample preparation method of a 1st embodiment of the present invention.
  • It is a process flow figure of a thin section sample preparation method of a 2nd embodiment of the present invention.
  • It is a process flow figure of a thin section sample preparation method of a 3rd embodiment of the present invention.
  • It is a block diagram which shows schematic structure of the thin slice sample preparation apparatus concerning the 3rd Embodiment of this invention.
  • a thin-section sample preparation apparatus 100 is an apparatus that prepares a thin-section sample 16 by automatically and continuously slicing the surface layer portion of the sample block 10 with a cutter 31.
  • the thin-section sample preparation device 100 includes a sample block transport unit 20, a sample block storage unit 21, a height detection unit 22, an imaging unit 23, a temperature detection unit 24, a cutting unit 30, a thin section pasting unit 40, an extension unit 50, and a slide.
  • the glass conveyance part 60 and the control part 70 which controls the whole apparatus are comprised.
  • the sample block 10 is obtained by embedding the sample 11 in an embedding agent 12 such as paraffin.
  • an embedding agent 12 such as paraffin.
  • the sample 11 that is the subject include biological samples such as human and animal tissues.
  • the sample block 10 generally has a surface size of 24 mm ⁇ 24 mm, 24 mm ⁇ 30 mm, 24 mm ⁇ 37 mm. Further, the height of the sample block 10 is generally about 5 mm.
  • a plurality of sample blocks 10 can be stored in the sample block storage unit 21.
  • One sample block 10 selected from the plurality of sample blocks 10 stored in the sample block storage unit 21 is moved to a position A (height detection unit 22), a position B (imaging unit 23), a position by the sample block transport unit 20. It is conveyed to position D (cutting part 30) via C (temperature detection part 24).
  • the sample block transport unit 20 is configured to be able to reciprocate the sample block 10 between positions A to D after taking out the sample block 10 and transporting it to the position A. Further, the sample block transport unit 20 is configured to be able to adjust the inclination and height position of the sample block 10. After the inclination (inclination) of the sample block 10 with respect to the horizontal plane is first adjusted, the conveyance unit 20 controlled by the control unit 70 adjusts the height of the sample block 10 appropriately according to the cutting amount.
  • a height detection unit 22 for detecting the tilt and height position of the sample block 10 is arranged above the position A.
  • the height detection part 22 what detects the surface of the sample block 10 with the at least 3 contact-type sensor which is described in patent document 4 and is not on the same straight line can be used, for example.
  • the control unit 70 controls the transport unit 20 to adjust the inclination and height position of the sample block 10.
  • the imaging unit 23 is arranged above the position B.
  • the imaging unit 23 for example, as described in Patent Document 2, a unit having a light source and a CCD camera can be used.
  • the control unit 70 determines whether or not the area of the portion of the sample 11 exposed on the surface of the sample block 10 is sufficient for the preparation of the thin slice sample.
  • exposing the sample 11 to the surface of the sample block 10 by cutting is referred to as “surface exposure”, and determining whether the area of the exposed sample 11 is sufficient for thin-section sample preparation is “surface determination”. That's it.
  • the surface determination for example, when the exposed area of the sample 11 on the cutting surface of the sample block 10 is larger than a preset area ratio, the surface can be determined to be sufficient.
  • the temperature detection unit 24 is disposed above the position C.
  • the temperature detection unit 24 has a non-contact temperature sensor and measures the surface temperature of the sample block 10.
  • the control unit 70 determines whether or not the measured temperature is within a predetermined range.
  • the reference temperature range can be set in advance according to the type of embedding agent such as paraffin.
  • the cutting part 30 is arranged above the position D.
  • the cutting unit 30 has a cutter 31 that can slice a surface layer portion of the sample block 10.
  • the cutter 31 is held such that the cutting edge extends in a direction perpendicular to the paper surface in FIG.
  • the cutter 31 is fixed, and the surface of the sample block 10 is sliced by moving the sample block 10 in the right direction in FIG.
  • the cutter 31 may be configured to be movable in a direction perpendicular to the paper surface. In that case, the surface of the sample block 10 is sliced by moving the sample block 10 in the right direction in FIG.
  • a carrier tape 33 for holding the thin slice sample 16 obtained by slicing the surface layer portion of the sample block 10 with the cutter 31 is supplied.
  • the carrier tape 33 is fed from the supply reel 32, guided by the guide rollers 34 and 35, and supplied above the position D.
  • the carrier tape 33 holding the thin slice sample 16 above the position D is guided by the guide rollers 36 and 37 and is taken up by the take-up reel 38.
  • the thin slice sample 16 held on the carrier tape 33 is stuck on the slide glass 17 by the thin slice sticking portion 40 disposed between the guide rollers 36 and 37.
  • the thin-section pasting portion 40 includes a pair of guide rollers 41 and 41 disposed on the upstream side of the traveling path of the carrier tape 33, and a pair of guide rollers 42 and 42 disposed on the downstream side of the traveling path of the carrier tape 33. It has.
  • the thin-section pasting portion 40 is bent downward with the carrier tape 33 sandwiched between the pair of guide rollers 41 and 41 and the pair of guide rollers 42 and 42, and the thin-section sample 16 held on the carrier tape 33. Is brought into contact with the slide glass 17 supplied with an adhesive liquid 18 such as water. As a result, the thin slice sample 16 is attached to the slide glass 17.
  • the slide glass on which the thin section sample 16 is attached is referred to as a slide glass with a thin section.
  • the slide glass 17 with a thin section is conveyed to the extension unit 50 by the slide glass conveyance unit 60.
  • the slide glass transport unit 60 transports the slide glass 17 with a thin section to the extension unit 50, and also takes out the slide glass 17 to which a thin section sample has not been pasted from a slide glass storage unit (not shown).
  • the extension section 50 includes a heating plate (not shown), extends the folds of the thin slice sample 16, and evaporates moisture on the slide glass 17, thereby fixing the thin slice sample 16 to the slide glass 17. .
  • each component such as the sample block transport unit 20 is controlled by the control unit 70.
  • the control unit 70 controls the operation of each component based on information input to an input unit (not shown).
  • the input unit is configured to be able to input, for example, the number of manufactured slide glasses with thin sections, the number of thin section samples attached per slide glass, and the like.
  • the apparatus 100 includes a casing and a cooler (not shown), and the inside of the apparatus surrounded by the casing is cooled by the cooler and air-conditioned so as to have a constant temperature.
  • This temperature setting is appropriately set according to the type of the sample 11 and the embedding agent 12 used as the sample block 10.
  • the set temperature is typically in the range of 10 ° C to 25 ° C. If the temperature of the sample block 10 is too high, there arises a problem that the quality of the thin slice sample is deteriorated due to the soft embedding agent. In addition, if the temperature difference between the temperature inside the apparatus and the sample block 10 is large, the sample block 10 contracts and expands due to a temperature change, which causes a problem that the variation in thickness between thin slices produced continuously increases. Furthermore, if the temperature of the sample block 10 is too low, a problem such as breaking of a thin section occurs.
  • FIG. 2 shows the structure of the sample block.
  • FIG. 3 shows a flow chart of thin section sample preparation in the present embodiment.
  • the thin-section sample 16 is manufactured under the control of the control unit 70.
  • FIG. 2A is a cross-sectional view of the sample block before rough cutting as viewed from the front, and the sample 11 is embedded in the embedding agent 12 so as not to be exposed to the outside (or slightly exposed).
  • the sample block 10 stored in the storage unit 21 is normally in this state.
  • the surface of the sample block 10 is roughened until the exposed area on the surface of the sample 11 is equal to or larger than a preset area (dotted line 14 in FIG. 2A). If the exposed area of the sample 11 exceeds a preset area by rough cutting (FIG.
  • a scraping or a main cutting for producing a thin slice sample 16 having a thickness of about 3 to 10 ⁇ m is performed.
  • Dotted line 15 in FIG. 2C Note that the sample block 10 is transported on a sample block table 13 not shown in FIG. It should also be noted that the scale of FIG. 2 is not accurate and is stretched in the height direction for ease of explanation.
  • the sample block transport unit 20 takes out the sample block 10 to be sliced next from the sample block storage unit 21 and transports it to the position A.
  • the inclination and height position of the sample block 10 are adjusted.
  • the sample block transport unit 20 transports the sample block 10 to the position B.
  • the imaging unit 23 images the sample block 10, and a surface determination is performed as to whether or not the area of the portion of the sample 11 exposed on the surface of the sample block 10 is sufficient for the preparation of the thin slice sample.
  • the method for determining the surface of Patent Document 1 detects the maximum projection area of the sample in the sample block, identifies the sample portion on the surface of the sample block and the portion of the embedding agent, and samples the sample on the surface of the sample block. It is determined whether or not the ratio of the area is sufficient with respect to whether or not the ratio of the area of the sample block to the area of the maximum projected region of the sample is greater than or equal to a predetermined ratio. In the first imaging, only the maximum projection area of the sample in the sample block is detected, and the surface determination can be omitted.
  • the sample block transport unit 20 transports the sample block 10 to the position D.
  • the surface layer portion of the sample block 10 is roughly cut by the cutting unit 30. Note that, also in the first rough cutting, it may be transferred to the position C, and surface temperature detection / temperature determination may be performed.
  • the sample block transport unit 20 transports the sample block 10 to the position B again.
  • the imaging unit 23 captures an image of the cut surface of the sample block 10 exposed by roughing, and the first surface determination is performed again or again.
  • the irradiation method, the detection method, and the like can be changed from the first imaging.
  • the sample block transport unit 20 transports the sample block 10 to the position D again, and the surface layer portion of the sample block 10 is roughly cut by the cutting unit 30 at the position D. In this case, it is not necessary to perform surface temperature detection and temperature determination, and rough cutting is performed more efficiently. However, even in rough cutting, the material may be transported to position C and surface temperature detection / temperature determination may be performed.
  • the sample block transport unit 20 transports the sample block 10 to the position C.
  • the temperature The detection unit 24 measures the surface temperature of the sample block 10 and determines whether or not the measured temperature is within a predetermined range.
  • the sample block is transported to the position D and proceeds to the next scraping or main cutting step.
  • the control unit 70 stops the sample block transport unit 20 and causes the sample block 10 to wait on the spot until the surface temperature falls within the predetermined range.
  • the humidity of the sample block is also important, and humidification is often performed before cutting.
  • the humidification is preferably performed at a timing at which the temperature measured by the surface temperature detection / temperature determination is within a predetermined range and transported to the position D for scraping or main cutting. That is, it is preferable that the humidification part 39 exists between the position C and the position D. This is because if the humidification is performed before the surface temperature is detected, an appropriate temperature measurement cannot be performed immediately after the humidification, resulting in a time loss.
  • the thin section 16 is cut out from the surface of the sample block 10 by the main cutting.
  • the main cutting is usually performed after performing a plurality of times of discarding with the same thickness and conditions as the main cutting. This is because the thickness of the thin section 16 is stabilized by performing the discarding.
  • the thickness accuracy of the thin slice to be produced is improved. In order to do this, it is preferable to perform several times of scraping with the thickness of the main cutting at the positions of the cutter 31 and the blade edge used for the main cutting.
  • the height position of the sample block 10 is adjusted by the sample block transport unit 20 so that the surface layer portion of the sample block 10 is sliced by the cutter 31 (about 3 ⁇ m to 10 ⁇ m). Thereafter, the surface layer portion of the sample block 10 is sliced by the cutter 31 to produce a thin slice sample 16. Thereafter, the sample block transport unit 20 temporarily retracts the sample block 10 from the position D to the position C, and adjusts the height position of the sample block 10 so that the surface layer portion of the sample block 10 is sliced by the cutter 31. The next main cutting is performed.
  • the operations of adjusting the height position of the sample block 20, slicing, and retracting are automatically and continuously repeated an arbitrary number of times based on information input to the input unit (not shown), and an arbitrary number of sheets
  • the thin slice sample 16 is prepared.
  • the thin slice sample 16 produced by the main cutting operation is attached to the carrier tape 33.
  • the surface of the carrier tape 33 is subjected to treatments such as humidification, cooling, and charging so that the thin-section sample 16 adheres to the carrier tape 33 more reliably.
  • the thin slice sample 16 affixed to the carrier tape 33 is conveyed to the thin slice affixing unit 40 and affixed to the slide glass 17 by the thin slice affixing unit 40. Thereafter, the slide glass with a thin section is conveyed to the extension unit 50 by the slide glass conveyance unit 60. Thereafter, the extending section 50 extends the wrinkles of the thin slice sample 16 and tightly fixes the thin slice sample 16 to the slide glass 17.
  • the transport unit 20 since the sample block 10 reciprocates between positions B to D, the transport unit 20 needs to be configured so that the sample block 10 can reciprocate between positions B to D. Further, since the position adjustment for increasing the height position of the sample block 10 by the cutting amount is performed at each cutting, it is not necessary to return the sample block to the position A normally. However, in preparation for when the inclination of the sample block 10 needs to be readjusted for some reason, the transport unit 20 is preferably configured so that the sample block 10 can reciprocate between positions A to D.
  • the position C of the temperature detection unit 24 is between the positions B and D, but is not limited to this.
  • the temperature detection unit 24 may be in the same place as the imaging unit 22 (position B), or may be in the same place as the cutting unit 30 (position D).
  • the physical position of the temperature detection unit 24 is not particularly limited as long as the transport unit 20 is within a range in which the sample block 10 can be reciprocated.
  • the transport unit 20 stops on the spot.
  • the operation when the surface temperature is outside the predetermined range is not limited to this, and the transport unit 20 transports the sample block 10 to a place other than the position C and returns to the position C after a while.
  • the temperature determination may be performed.
  • the conveyance unit 20 is stopped and the temperature detection position or the separate position until the temperature of the sample block 10 is lowered by the air conditioning in the apparatus 100. Wait at the position.
  • a method of waiting the sample block is a preferable method because the temperature change in the sample block 10 is reduced. This is particularly preferable when the number of continuous slices is large. However, this does not prevent forced cooling in order to speed up the cooling of the sample block 10.
  • the surface may be cooled by bringing a Peltier element into contact with the surface of the sample block 10.
  • a plurality of times of scraping and a plurality of times of main cutting are continuously performed.
  • the temperature of the sample block surface may be confirmed during the continuous cutting operation.
  • the thickness cut by the discard cutting and the main cutting is extremely thin, there is usually no problem even if the temperature of the sample block surface is not confirmed during the continuous cutting operation.
  • the temperature range that serves as a reference for temperature determination may be set differently before rough cutting and before scraping or main cutting.
  • FIG. 4 shows a flow chart of thin section sample preparation in this embodiment.
  • the thin-section sample 16 is manufactured under the control of the control unit 70.
  • the present embodiment is different from the first embodiment in that surface determination is performed after the surface temperature of the sample block 10 is determined.
  • the sample block 10 is adjusted in inclination and height position at position A, and surface temperature detection and temperature determination are performed at position C. If the surface temperature is outside the predetermined range, the sample block 10 stands by on the spot, and if it is within the predetermined range, moves to the position B to perform imaging and surface determination. If the surface of the sample block 10 is insufficient, it moves to the position D and rough cutting is performed by the cutting unit 30, and then returns to the position C again to determine the temperature. As described above, the surface temperature detection / temperature determination, imaging / surface determination, and roughing operations are repeated until the sample block 10 is sufficiently surface-exposed.
  • the sample block 10 moves to the position D and is discarded by the cutting unit 30 and the main cutting is performed. Since individual operations of the respective units such as the imaging unit 23, the temperature detection unit 24, and the cutting unit 30 are the same as those in the first embodiment, detailed description thereof is omitted.
  • the physical position of the temperature detection unit 24, the standby position of the sample block 10 when the surface temperature is outside a predetermined range, the presence or absence of forced cooling, and the confirmation of the sample block surface temperature during the continuous cutting operation are possible.
  • water may be sprayed for humidifying the surface of the sample block 10 with some operations. Normally, humidification is performed to optimize the humidity of the sample surface at the time of cutting.
  • water is sprayed to form a sample block. May humidify the surface. At this time, it is difficult to make an accurate determination even if the temperature is detected in a state where mist is floating above the sample block 10 or in a state where water droplets sprayed on the surface of the sample block remain.
  • the image pickup unit 23 performs the image pickup after a while after spraying the water. Therefore, even if the surface temperature is detected immediately after the surface determination, the temperature determination is not affected by water spray. However, in this embodiment, since the temperature detection operation is performed after the cutting operation, it is preferable that a certain period of time is taken between the cutting and the temperature detection until the influence of the spray is eliminated.
  • FIG. 5 shows a flowchart of thin section sample preparation in the present embodiment.
  • the thin-section sample 16 is manufactured under the control of the control unit 70.
  • the sample block 10 is adjusted in inclination and height position at position A, moved to position D, and rough cutting is performed in the cutting unit 30.
  • rough cutting since there is no image pickup unit that performs surface determination, rough cutting of a predetermined thickness, or repeated roughing until the surface is sufficiently performed while visually confirming by an operator. become.
  • the surface temperature detection and temperature determination of the sample block 10 are performed at the position C. If the surface temperature is outside the predetermined range, the sample block 10 stands by on the spot, and if it is within the predetermined range, the sample block 10 moves to the position D and is discarded by the cutting unit 30 to perform the main cutting.
  • the apparatus may convey to the position C once or several times before rough cutting, and may perform surface temperature detection and temperature determination. Since the individual operations of each part of the apparatus such as the temperature detection unit 24 and the cutting unit 30 are the same as those in the first embodiment, detailed description thereof will be omitted.
  • the physical position of the temperature detection unit 24, the standby position of the sample block 10 when the surface temperature is outside a predetermined range, the presence or absence of forced cooling, and the confirmation of the sample block surface temperature during the continuous cutting operation can be made.
  • thermometer in order to measure the temperature in the device housing, a thermometer is arranged separately from the temperature detection unit 24, the thermometer and the control unit are linked, and the housing itself is not within a set temperature range, It is also possible to prevent the entire device from starting.
  • a thermometer is arranged separately from the temperature detection unit 24, the thermometer and the control unit are linked, and the housing itself is not within a set temperature range, It is also possible to prevent the entire device from starting.
  • the method by sticking using an adhesive liquid such as water is most preferable, but as another example, the thin slice sample floated on the liquid in the liquid tank.
  • the section sample may be scooped up with a slide glass. Further, the thin slice sample may be transferred from the carrier tape onto the slide glass by the surface tension of the transfer liquid.
  • the surface temperature of the sample block is detected, and after confirming that the surface temperature is within a predetermined temperature range, the thin-section sample is prepared.
  • Sample block 11 Sample (subject) 12 Embedding agent 13
  • Sample block base 14 Rough cutting height 15 Discarded or main cutting height 16
  • Thin section sample 17 Slide glass 18
  • Adhesive liquid 20 Sample block transport unit 21
  • Sample block storage unit 22 Height detection unit 23
  • Imaging unit 24 Temperature Detection unit 30
  • Cutting unit 31 Cutter 32 Supply reel 33
  • Carrier tape 34 to 37, 41, 42 Guide roller 38 Take-up reel 39
  • Humidifying unit 40 Thin section pasting unit 50 Extending unit 60

Abstract

Provided are a sliced-sample production device and method capable of reducing sliced-sample thickness variation caused by the temperature of a sample block. A sliced-sample production device (100) for producing sliced samples (16) by using a cutter (31) to slice a sample block (10) in which a sample (11) is embedded in an embedding agent (12), said sliced-sample production device (100) being provided with a conveying unit (20) for conveying the sample block (10), a cutting unit (30) having the cutter (31) provided thereto, a temperature detection unit (24) for detecting the surface temperature of the sample block (10), and a control unit (70) for controlling the operation of at least the conveying unit (20), the cutting unit (30), or both on the basis of the surface temperature of the sample block (10) detected by the temperature detection unit (24).

Description

薄切片試料作製装置および薄切片試料作製方法Thin section sample preparation device and thin section sample preparation method
 本発明は、理化学試料分析や生体試料等の顕微鏡観察などに利用される薄切片試料を作製する薄切片試料作製装置および薄切片試料作製方法に関する。 The present invention relates to a thin-section sample preparation apparatus and a thin-section sample preparation method for preparing a thin-section sample used for physicochemical sample analysis or microscopic observation of biological samples.
 従来、理化学試料分析や生体試料等の顕微鏡観察等に利用される薄切片試料を作製するための装置としてミクロトームが広く知られている。ミクロトームは、動物の生体試料等の試料(被検体)をパラフィン等の包埋剤の中に埋め込んだ(包埋した)試料ブロックをカッターによって薄切りすることにより、薄切片試料を作製する装置である。例えば、特許文献1~5には、試料ブロックの薄切り、スライドガラスへの貼付、伸展、乾燥という一連の動作を行う薄切片試料作製装置が記載されている。 Conventionally, a microtome is widely known as an apparatus for producing a thin-section sample used for physicochemical sample analysis or microscopic observation of a biological sample. A microtome is a device that produces a thin slice sample by slicing a sample block (embedded) in an embedding agent such as paraffin into a specimen block (embedded) such as a biological sample of an animal. . For example, Patent Documents 1 to 5 describe thin-section sample preparation apparatuses that perform a series of operations such as slicing a sample block, attaching to a slide glass, stretching, and drying.
特開2012-229993号公報JP 2012-229993A 特開2012-229994号公報JP 2012-229994 A 特開2012-229995号公報JP 2012-229995 A 特開2012-229996号公報JP 2012-229996 A 特開2012-229997号公報JP 2012-229997 A
 薄切片試料の厚さは非常に薄く(試料によって異なるが例えば3μm~10μm)、かつ均一であることが求められる。さらに、動物の生体試料等は再度採取することが困難なものが多いため、所望の厚さを得ることができずに試料を無駄にすることは極力避けなければならない。一方で、この試料ブロックは、温度の微妙な変化によって膨張および収縮が発生しやすく、薄切り処理時に薄切片の厚さにムラが生じやすいという問題点を有する。 The thickness of the thin slice sample is required to be very thin (depending on the sample, for example, 3 μm to 10 μm) and uniform. Furthermore, since many biological samples of animals are difficult to collect again, it is necessary to avoid as much as possible the waste of the sample without obtaining a desired thickness. On the other hand, this sample block has a problem that expansion and contraction are likely to occur due to a subtle change in temperature, and unevenness is likely to occur in the thickness of the thin slice during thin slice processing.
 このため、環境を一定温度(例えば10℃~25℃)に維持するように、薄切片試料作製装置は、一般的には筐体に囲われた装置内部を冷却する冷却機を備えている。上記温度の設定は、試料ブロックとして使用する試料および包埋剤の種類等に応じて適宜設定される。しかし、冷却機による温度調節では囲われた装置内部で温度がばらつき、装置内温度がほぼ所定温度になっている場合でも、試料ブロックの温度は所定の温度に達していない場合がある。また、試料ブロックの包埋剤の温度が、薄切片作製時までに十分に下がりきっていない場合もある。 Therefore, in order to maintain the environment at a constant temperature (for example, 10 ° C. to 25 ° C.), the thin-section sample preparation device is generally provided with a cooler that cools the inside of the device surrounded by a casing. The temperature is appropriately set according to the sample used as the sample block, the type of embedding agent, and the like. However, when the temperature is adjusted by the cooler, the temperature of the sample block may not reach the predetermined temperature even when the temperature varies within the enclosed apparatus and the temperature inside the apparatus is almost the predetermined temperature. In addition, the temperature of the embedding agent for the sample block may not be sufficiently lowered until the preparation of the thin section.
 この対策として、薄切片試料作製装置の使用は、通常、冷却機を作動させてから30分程度時間をおいたうえで、切削工程等の薄切片作製動作が開始される。しかし、30分という設定時間は、試料ブロックの温度を考慮したものではなく、長すぎて単に時間のロスとなる場合もあれば、短すぎて試料ブロックの温度が下がりきらず、切削工程中の試料ブロックの温度変化により得られた薄切片に厚みムラが生じることもあり得る。 As a countermeasure against this, the use of a thin-section sample preparation device usually starts a thin-section preparation operation such as a cutting process after about 30 minutes have passed since the cooler is operated. However, the set time of 30 minutes does not take into account the temperature of the sample block, it may be too long and it may simply be a time loss, or it may be too short to reduce the temperature of the sample block, and the sample during the cutting process Thickness unevenness may occur in the thin slice obtained by the temperature change of the block.
 上記の課題に対して、本発明では、試料ブロックの表面温度に基づいて、装置の薄切片作製動作を制御する。 In response to the above-described problem, the present invention controls the thin-section manufacturing operation of the apparatus based on the surface temperature of the sample block.
 本発明の薄切片試料作製装置は、試料が包埋剤中に包埋された試料ブロックをカッターにより薄切りして薄切片試料を作製する薄切片試料作製装置であって、前記試料ブロックを搬送する搬送部と、前記カッターを備える切削部と、前記試料ブロックの表面温度を検出する温度検出部と、前記温度検出部により検出された前記試料ブロックの表面温度に基づいて少なくとも前記搬送部および/または前記切削部の動作を制御する制御部とを具備する。 The thin-section sample preparation apparatus of the present invention is a thin-section sample preparation apparatus that prepares a thin-section sample by slicing a sample block in which a sample is embedded in an embedding agent with a cutter, and transports the sample block A conveyance unit; a cutting unit including the cutter; a temperature detection unit that detects a surface temperature of the sample block; and at least the conveyance unit and / or based on the surface temperature of the sample block detected by the temperature detection unit. A control unit for controlling the operation of the cutting unit.
 また、好ましくは、前記制御部は、前記試料ブロックの表面温度が前記所定の範囲外である場合は、該表面温度が前記所定の範囲内となるまで前記搬送部および/または前記切削部を停止させる。 Preferably, when the surface temperature of the sample block is outside the predetermined range, the control unit stops the conveying unit and / or the cutting unit until the surface temperature falls within the predetermined range. Let
 また、好ましくは、上記いずれかの薄切片試料作製装置は、前記試料ブロック表面を加湿する加湿部をさらに具備し、前記加湿部は、前記切削部と前記温度検出部との間において加湿を行う。 Preferably, any of the thin-section sample preparation devices further includes a humidifying unit that humidifies the surface of the sample block, and the humidifying unit humidifies between the cutting unit and the temperature detecting unit. .
 また、好ましくは、上記いずれかの薄切片試料作製装置は、前記試料ブロックの表面の前記試料の部分の面積が薄切片試料作製について十分であるか否か判定する面出し判定部をさらに具備し、前記温度検出部は、試料ブロックの表面の前記試料の部分の面積が薄切片試料作製について十分である判定をした場合に温度検出を行う。 Preferably, any one of the thin-section sample preparation apparatuses further includes a surface determination unit that determines whether an area of the sample portion on the surface of the sample block is sufficient for thin-section sample preparation. The temperature detection unit performs temperature detection when it is determined that the area of the sample portion on the surface of the sample block is sufficient for thin-section sample preparation.
 本発明の薄切片試料作製方法は、試料が包埋剤中に包埋された試料ブロックの表層部分をカッターにより薄切りして薄切片試料を作製する薄切片試料作製方法であって、前記試料ブロックの表面温度を検出するステップと、前記表面温度が所定の範囲内であるか否かを判定するステップと、前記表面温度が前記所定の範囲内である場合は、前記カッターと前記試料ブロックとを相対的に移動させることにより前記薄切り動作を行い、前記表面温度が前記所定の範囲外である場合は、該表面温度が前記所定の範囲内となるまで前記試料ブロックを停止させるステップとを有する。 The thin-section sample preparation method of the present invention is a thin-section sample preparation method for preparing a thin-section sample by slicing a surface layer portion of a sample block in which the sample is embedded in an embedding agent with a cutter. Detecting the surface temperature, determining whether or not the surface temperature is within a predetermined range, and if the surface temperature is within the predetermined range, the cutter and the sample block Performing the slicing operation by relatively moving, and stopping the sample block until the surface temperature falls within the predetermined range when the surface temperature is outside the predetermined range.
 また、好ましくは、上記薄切片試料作製方法は、前記表面温度が所定の範囲内であるか否かを判定するステップと、前記表面温度が前記所定の範囲内である場合は、前記カッターと前記試料ブロックとを相対的に移動させることにより前記薄切り動作を行うステップとの間に、前記試料ブロック表面を加湿するステップを有する。 Preferably, in the thin-section sample preparation method, the step of determining whether or not the surface temperature is within a predetermined range, and when the surface temperature is within the predetermined range, the cutter and the There is a step of humidifying the surface of the sample block between the step of performing the slicing operation by relatively moving the sample block.
 本発明の薄切片試料作製装置または方法によれば、試料ブロックの表面温度に基づいて薄切片試料作製動作を制御するので、薄切片試料作製開始前の余計な待機時間を短縮することができ、かつ試料ブロック温度が変化することによる薄切片試料の厚さのムラを抑えることができる。 According to the thin-section sample preparation apparatus or method of the present invention, since the thin-section sample preparation operation is controlled based on the surface temperature of the sample block, it is possible to reduce an extra waiting time before the start of thin-section sample preparation, And the nonuniformity of the thickness of the thin slice sample due to the change of the sample block temperature can be suppressed.
本発明の第1の実施形態にかかる薄切片試料作製装置の概略構成を示すブロック図である。It is a block diagram showing a schematic structure of a thin section sample preparation device concerning a 1st embodiment of the present invention. (a)は粗削り前の試料ブロックを正面方向から見た断面図であり、(b)は粗削り後の試料ブロックの平面図であり、(c)は粗削り後の試料ブロックを正面方向から見た断面図である。(A) is sectional drawing which looked at the sample block before rough cutting from the front direction, (b) is a plan view of the sample block after rough cutting, and (c) is a view of the sample block after rough cutting from the front direction. It is sectional drawing. 本発明の第1の実施形態の薄切片試料作製方法の工程フロー図である。It is a process flow figure of the thin section sample preparation method of a 1st embodiment of the present invention. 本発明の第2の実施形態の薄切片試料作製方法の工程フロー図である。It is a process flow figure of a thin section sample preparation method of a 2nd embodiment of the present invention. 本発明の第3の実施形態の薄切片試料作製方法の工程フロー図である。It is a process flow figure of a thin section sample preparation method of a 3rd embodiment of the present invention. 本発明の第3の実施形態にかかる薄切片試料作製装置の概略構成を示すブロック図である。It is a block diagram which shows schematic structure of the thin slice sample preparation apparatus concerning the 3rd Embodiment of this invention.
 本発明の第1の実施形態にかかる薄切片試料作製装置および方法について、まずその構成と動作の概略を図1に基づいて説明する。 First, an outline of the configuration and operation of the thin-section sample preparation apparatus and method according to the first embodiment of the present invention will be described with reference to FIG.
 図1において、薄切片試料作製装置100は、試料ブロック10の表層部分をカッター31により自動的にかつ連続的に薄切りして薄切片試料16を作製する装置である。薄切片試料作製装置100は、試料ブロック搬送部20、試料ブロック収納部21、高さ検出部22、撮像部23、温度検出部24、切削部30、薄切片貼付部40、伸展部50、スライドガラス搬送部60、および装置全体を制御する制御部70を具備する。 1, a thin-section sample preparation apparatus 100 is an apparatus that prepares a thin-section sample 16 by automatically and continuously slicing the surface layer portion of the sample block 10 with a cutter 31. The thin-section sample preparation device 100 includes a sample block transport unit 20, a sample block storage unit 21, a height detection unit 22, an imaging unit 23, a temperature detection unit 24, a cutting unit 30, a thin section pasting unit 40, an extension unit 50, and a slide. The glass conveyance part 60 and the control part 70 which controls the whole apparatus are comprised.
 試料ブロック10は、試料11をパラフィン等の包埋剤12の中に包埋したものである。被検体である試料11の例としては、例えば、人間や動物の組織などの生体試料が挙げられる。試料ブロック10は、表面のサイズが24mm×24mm、24mm×30mm、24mm×37mmであるものが一般的である。また、試料ブロック10の高さは5mm程度であることが一般的である。 The sample block 10 is obtained by embedding the sample 11 in an embedding agent 12 such as paraffin. Examples of the sample 11 that is the subject include biological samples such as human and animal tissues. The sample block 10 generally has a surface size of 24 mm × 24 mm, 24 mm × 30 mm, 24 mm × 37 mm. Further, the height of the sample block 10 is generally about 5 mm.
 図1において、試料ブロック収納部21には、複数の試料ブロック10を収納可能である。試料ブロック収納部21に収納された複数の試料ブロック10から選ばれた1つの試料ブロック10は、試料ブロック搬送部20により位置A(高さ検出部22)、位置B(撮像部23)、位置C(温度検出部24)を経て位置D(切削部30)へと搬送される。 1, a plurality of sample blocks 10 can be stored in the sample block storage unit 21. One sample block 10 selected from the plurality of sample blocks 10 stored in the sample block storage unit 21 is moved to a position A (height detection unit 22), a position B (imaging unit 23), a position by the sample block transport unit 20. It is conveyed to position D (cutting part 30) via C (temperature detection part 24).
 なお、試料ブロック搬送部20は、試料ブロック10を取り出して位置Aに搬送したのち、当該試料ブロック10を位置A~Dの間で往復搬送可能に構成されている。また、試料ブロック搬送部20は、試料ブロック10の傾きおよび高さ位置を調整可能に構成されている。最初に試料ブロック10の水平面に対する傾斜(傾き)が調整された後は、制御部70により制御される搬送部20が、切削量に応じて試料ブロック10の高さを適宜上げて調整する。 The sample block transport unit 20 is configured to be able to reciprocate the sample block 10 between positions A to D after taking out the sample block 10 and transporting it to the position A. Further, the sample block transport unit 20 is configured to be able to adjust the inclination and height position of the sample block 10. After the inclination (inclination) of the sample block 10 with respect to the horizontal plane is first adjusted, the conveyance unit 20 controlled by the control unit 70 adjusts the height of the sample block 10 appropriately according to the cutting amount.
 位置Aの上方には、試料ブロック10の傾きと高さ位置を検出する高さ検出部22が配置されている。高さ検出部22としては、例えば、特許文献4に記載された、同一直線上にない少なくとも3つの接触式センサーで試料ブロック10の表面を検知するものを用いることができる。そのセンサー情報に基づいて、制御部70が搬送部20を制御することにより、試料ブロック10の傾きと高さ位置が調整される。 Above the position A, a height detection unit 22 for detecting the tilt and height position of the sample block 10 is arranged. As the height detection part 22, what detects the surface of the sample block 10 with the at least 3 contact-type sensor which is described in patent document 4 and is not on the same straight line can be used, for example. Based on the sensor information, the control unit 70 controls the transport unit 20 to adjust the inclination and height position of the sample block 10.
 位置Bの上方には撮像部23が配置されている。撮像部23としては、例えば、特許文献2に記載されたように、光源とCCDカメラ等を有するものを用いることができる。撮像部23で得られた画像データを処理することによって、試料ブロック10の表面に露出した試料11の部分の面積が薄切片試料作製について十分であるか否かが制御部70で判定される。以下において、切削によって試料ブロック10表面に試料11を露出させることを「面出し」といい、露出した試料11の面積が薄切片試料作製に十分であるか否かの判定を「面出し判定」という。面出し判定の基準としては、例えば、試料ブロック10の切削面における試料11の露出面積が予め設定された面積比率よりも大きい場合に面出しが十分であるとすることができる。 The imaging unit 23 is arranged above the position B. As the imaging unit 23, for example, as described in Patent Document 2, a unit having a light source and a CCD camera can be used. By processing the image data obtained by the imaging unit 23, the control unit 70 determines whether or not the area of the portion of the sample 11 exposed on the surface of the sample block 10 is sufficient for the preparation of the thin slice sample. Hereinafter, exposing the sample 11 to the surface of the sample block 10 by cutting is referred to as “surface exposure”, and determining whether the area of the exposed sample 11 is sufficient for thin-section sample preparation is “surface determination”. That's it. As a reference for the surface determination, for example, when the exposed area of the sample 11 on the cutting surface of the sample block 10 is larger than a preset area ratio, the surface can be determined to be sufficient.
 位置Cの上方には温度検出部24が配置されている。温度検出部24は、非接触式温度センサーを有し、試料ブロック10の表面温度を測定する。測定された温度が所定範囲内にあるか否かが制御部70で判定される。基準となる温度範囲は、パラフィン等の包埋剤の種類に応じて予め設定しておくことができる。 The temperature detection unit 24 is disposed above the position C. The temperature detection unit 24 has a non-contact temperature sensor and measures the surface temperature of the sample block 10. The control unit 70 determines whether or not the measured temperature is within a predetermined range. The reference temperature range can be set in advance according to the type of embedding agent such as paraffin.
 位置Dの上方には切削部30が配置されている。切削部30は、試料ブロック10の表層部分を薄切可能なカッター31を有する。カッター31は、刃先が図1において紙面に垂直な方向に延在するように保持されている。本実施形態ではカッター31が固定されており、試料ブロック10が図1右方向に移動することによって、試料ブロック10の表面が薄切りされる。また、カッター31は、紙面に垂直な方向に移動可能に構成されていてもよい。その場合、試料ブロック10が図1右方向に移動すると同時にカッター31が紙面の奥から手前に移動することによって、試料ブロック10の表面が薄切りされる。切削部30では、試料ブロック10表面に試料11が十分に露出するまでの粗削り、試料11が十分に露出した後に薄切片の厚さが安定するまでの捨て削り、および薄切片試料16を切り出す本削りが行われる。なお、捨て削りについては省略される場合もある。 The cutting part 30 is arranged above the position D. The cutting unit 30 has a cutter 31 that can slice a surface layer portion of the sample block 10. The cutter 31 is held such that the cutting edge extends in a direction perpendicular to the paper surface in FIG. In this embodiment, the cutter 31 is fixed, and the surface of the sample block 10 is sliced by moving the sample block 10 in the right direction in FIG. The cutter 31 may be configured to be movable in a direction perpendicular to the paper surface. In that case, the surface of the sample block 10 is sliced by moving the sample block 10 in the right direction in FIG. In the cutting unit 30, rough cutting until the sample 11 is sufficiently exposed on the surface of the sample block 10, scraping until the thickness of the thin section is stabilized after the sample 11 is sufficiently exposed, and a book for cutting out the thin section sample 16 Sharpening is performed. In some cases, discarding may be omitted.
 また、位置Dの上方には、試料ブロック10の表層部分がカッター31によって薄切りされることにより得られた薄切片試料16を保持するキャリアテープ33が供給される。キャリアテープ33は、供給リール32から繰り出され、ガイドローラ34,35に案内されて位置Dの上方に供給される。位置Dの上方で薄切片試料16を保持したキャリアテープ33は、ガイドローラ36,37に案内されて巻取リール38に巻き取られる。 Further, above the position D, a carrier tape 33 for holding the thin slice sample 16 obtained by slicing the surface layer portion of the sample block 10 with the cutter 31 is supplied. The carrier tape 33 is fed from the supply reel 32, guided by the guide rollers 34 and 35, and supplied above the position D. The carrier tape 33 holding the thin slice sample 16 above the position D is guided by the guide rollers 36 and 37 and is taken up by the take-up reel 38.
 キャリアテープ33に保持された薄切片試料16は、ガイドローラ36,37の間に配置された薄切片貼付部40によりスライドガラス17に貼り付けられる。薄切片貼付部40は、キャリアテープ33の走行経路の上流側に配置された一対のガイドローラ41,41と、キャリアテープ33の走行経路の下流側に配置された一対のガイドローラ42,42とを備えている。薄切片貼付部40は、一対のガイドローラ41,41の間と一対のガイドローラ42,42の間でキャリアテープ33を挟んで下方に撓ませ、当該キャリアテープ33に保持された薄切片試料16を、水などの接着液18が供給されたスライドガラス17に接触させる。これにより、薄切片試料16がスライドガラス17に貼り付けられる。以下、薄切片試料16が貼り付けられたスライドガラスを、薄切片付きスライドガラスという。 The thin slice sample 16 held on the carrier tape 33 is stuck on the slide glass 17 by the thin slice sticking portion 40 disposed between the guide rollers 36 and 37. The thin-section pasting portion 40 includes a pair of guide rollers 41 and 41 disposed on the upstream side of the traveling path of the carrier tape 33, and a pair of guide rollers 42 and 42 disposed on the downstream side of the traveling path of the carrier tape 33. It has. The thin-section pasting portion 40 is bent downward with the carrier tape 33 sandwiched between the pair of guide rollers 41 and 41 and the pair of guide rollers 42 and 42, and the thin-section sample 16 held on the carrier tape 33. Is brought into contact with the slide glass 17 supplied with an adhesive liquid 18 such as water. As a result, the thin slice sample 16 is attached to the slide glass 17. Hereinafter, the slide glass on which the thin section sample 16 is attached is referred to as a slide glass with a thin section.
 薄切片付きスライドガラス17は、スライドガラス搬送部60により伸展部50へ搬送される。スライドガラス搬送部60は、薄切片付きスライドガラス17を伸展部50へ搬送するとともに、スライドガラス収納部(図示せず)から薄切片試料を未貼付のスライドガラス17を取り出して薄切片貼付部40の下方へ搬送する。伸展部50は、加温板(図示せず)を備え、薄切片試料16の皺の伸展を行うとともに、スライドガラス17上の水分を蒸発させて薄切片試料16をスライドガラス17に密着固定する。 The slide glass 17 with a thin section is conveyed to the extension unit 50 by the slide glass conveyance unit 60. The slide glass transport unit 60 transports the slide glass 17 with a thin section to the extension unit 50, and also takes out the slide glass 17 to which a thin section sample has not been pasted from a slide glass storage unit (not shown). To the bottom. The extension section 50 includes a heating plate (not shown), extends the folds of the thin slice sample 16, and evaporates moisture on the slide glass 17, thereby fixing the thin slice sample 16 to the slide glass 17. .
 試料ブロック搬送部20などの各構成要素は、制御部70により動作を制御される。制御部70は、入力部(図示せず)に入力された情報に基づいて、各構成要素の動作を制御する。入力部は、例えば、薄切片付きスライドガラスの製作枚数や1枚のスライドガラス当たりの薄切片試料の貼り付け数などを入力可能に構成されている。 The operation of each component such as the sample block transport unit 20 is controlled by the control unit 70. The control unit 70 controls the operation of each component based on information input to an input unit (not shown). The input unit is configured to be able to input, for example, the number of manufactured slide glasses with thin sections, the number of thin section samples attached per slide glass, and the like.
 また、装置100は図示しない筐体と冷却器を備え、筐体に囲われた装置内部が冷却器により冷却され、一定温度となるように空調されている。この温度設定は、試料ブロック10として使用する試料11および包埋剤12の種類等に応じて適宜設定される。設定温度は、典型的には10℃~25℃の範囲にある。試料ブロック10の温度が高すぎると、包埋剤が軟らかいことで薄切片試料の品質が悪化するという問題を生じる。また、装置内部の温度と試料ブロック10の温度差が大きいと、試料ブロック10が温度変化によって収縮膨張し、連続して作製された薄切片間の厚さのばらつきが大きくなるという問題を生じる。さらに、試料ブロック10の温度が低すぎると、薄切片が割れるなどの問題を生じる。 The apparatus 100 includes a casing and a cooler (not shown), and the inside of the apparatus surrounded by the casing is cooled by the cooler and air-conditioned so as to have a constant temperature. This temperature setting is appropriately set according to the type of the sample 11 and the embedding agent 12 used as the sample block 10. The set temperature is typically in the range of 10 ° C to 25 ° C. If the temperature of the sample block 10 is too high, there arises a problem that the quality of the thin slice sample is deteriorated due to the soft embedding agent. In addition, if the temperature difference between the temperature inside the apparatus and the sample block 10 is large, the sample block 10 contracts and expands due to a temperature change, which causes a problem that the variation in thickness between thin slices produced continuously increases. Furthermore, if the temperature of the sample block 10 is too low, a problem such as breaking of a thin section occurs.
 次に、薄切片試料16の作製動作を、図1~3に基づいて説明する。図2は試料ブロックの構造を示している。図3は本実施形態における薄切片試料作製のフローチャートを示している。この薄切片試料16の作製動作は、制御部70の制御の下に行われる。 Next, the manufacturing operation of the thin slice sample 16 will be described with reference to FIGS. FIG. 2 shows the structure of the sample block. FIG. 3 shows a flow chart of thin section sample preparation in the present embodiment. The thin-section sample 16 is manufactured under the control of the control unit 70.
 図2において、試料ブロック10は、試料(被検体)11をパラフィン等の包埋剤12の中に包埋したものである。図2(a)は粗削り前の試料ブロックを正面方向から見た断面図であり、試料11は外部に露出しない(あるいは僅かに露出する)ように包埋剤12の中に埋め込まれている。収納部21に収納された試料ブロック10は、通常この状態である。試料ブロック10は、試料11の表面への露出面積が予め設定された面積以上になるまで表層部分を粗削りされる(図2(a)の点線14)。粗削りによって、試料11の露出面積が予め設定された面積以上になると(図2(b))、厚さが3~10μm程度の薄切片試料16を作製するための捨て削りまたは本削りが行われる(図2(c)の点線15)。なお、試料ブロック10は、図1には図示されていない試料ブロック台13に載せて搬送される。また、図2の縮尺は正確ではなく、説明の容易のために高さ方向に引き伸ばされていることに留意されたい。 In FIG. 2, a sample block 10 is obtained by embedding a sample (subject) 11 in an embedding agent 12 such as paraffin. FIG. 2A is a cross-sectional view of the sample block before rough cutting as viewed from the front, and the sample 11 is embedded in the embedding agent 12 so as not to be exposed to the outside (or slightly exposed). The sample block 10 stored in the storage unit 21 is normally in this state. The surface of the sample block 10 is roughened until the exposed area on the surface of the sample 11 is equal to or larger than a preset area (dotted line 14 in FIG. 2A). If the exposed area of the sample 11 exceeds a preset area by rough cutting (FIG. 2 (b)), a scraping or a main cutting for producing a thin slice sample 16 having a thickness of about 3 to 10 μm is performed. (Dotted line 15 in FIG. 2C). Note that the sample block 10 is transported on a sample block table 13 not shown in FIG. It should also be noted that the scale of FIG. 2 is not accurate and is stretched in the height direction for ease of explanation.
 図1および図3を参照して、まず、試料ブロック搬送部20が試料ブロック収納部21から次に薄切り処理される試料ブロック10を取り出し、位置Aに搬送する。位置Aにおいて、試料ブロック10の傾きおよび高さ位置が調整される。 1 and 3, first, the sample block transport unit 20 takes out the sample block 10 to be sliced next from the sample block storage unit 21 and transports it to the position A. At the position A, the inclination and height position of the sample block 10 are adjusted.
 次いで、試料ブロック搬送部20が試料ブロック10を位置Bに搬送する。位置Bにおいて、撮像部23が試料ブロック10を撮像し、試料ブロック10の表面に露出した試料11の部分の面積が薄切片試料作製について十分であるか否かの面出し判定が行われる。なお、特許文献1の面出し判定の方法は、試料ブロックの試料の最大投影領域を検出し、試料ブロックの表面における試料の部分と包埋剤の部分とを識別し、試料ブロックの表面における試料の部分の面積の、試料ブロックの試料の最大投影領域の面積に対する割合が所定割合以上か否かにより、十分であるか否かを判定するものであり、それを用いることができる。なお、第1回目の撮像においては、試料ブロックの試料の最大投影領域を検出するのみとし、面出し判定を省略することも可能である。 Next, the sample block transport unit 20 transports the sample block 10 to the position B. At the position B, the imaging unit 23 images the sample block 10, and a surface determination is performed as to whether or not the area of the portion of the sample 11 exposed on the surface of the sample block 10 is sufficient for the preparation of the thin slice sample. The method for determining the surface of Patent Document 1 detects the maximum projection area of the sample in the sample block, identifies the sample portion on the surface of the sample block and the portion of the embedding agent, and samples the sample on the surface of the sample block. It is determined whether or not the ratio of the area is sufficient with respect to whether or not the ratio of the area of the sample block to the area of the maximum projected region of the sample is greater than or equal to a predetermined ratio. In the first imaging, only the maximum projection area of the sample in the sample block is detected, and the surface determination can be omitted.
 次いで、試料ブロック搬送部20が試料ブロック10を位置Dに搬送する。位置Dにおいて、試料ブロック10の表層部分が切削部30によって粗削りされる。なお、第1回目の粗削りにおいても、位置Cに搬送し、表面温度検出・温度判定を行っても良い。 Next, the sample block transport unit 20 transports the sample block 10 to the position D. At the position D, the surface layer portion of the sample block 10 is roughly cut by the cutting unit 30. Note that, also in the first rough cutting, it may be transferred to the position C, and surface temperature detection / temperature determination may be performed.
 次いで、試料ブロック搬送部20が試料ブロック10を再度位置Bに搬送する。位置Bにおいて、粗削りによって露出した試料ブロック10の切削面を撮像部23が撮像し、再び又は第1回目の面出し判定が行われる。なお、2回目以降の撮像については、最大投影領域を検出することを必要としないため、1回目の撮像とは照射方法、検出方法等を変更することができる。 Next, the sample block transport unit 20 transports the sample block 10 to the position B again. At the position B, the imaging unit 23 captures an image of the cut surface of the sample block 10 exposed by roughing, and the first surface determination is performed again or again. In addition, since it is not necessary to detect the maximum projection area for the second and subsequent imaging, the irradiation method, the detection method, and the like can be changed from the first imaging.
 面出し判定において、面出しが十分でない場合は、再度試料ブロック搬送部20が試料ブロック10を位置Dに搬送され、位置Dにおいて、試料ブロック10の表層部分が切削部30によって粗削りされる。この場合は、表面温度検出・温度判定を行う必要がなく、より効率的に粗削りを行う。ただし、粗削りにおいても、位置Cに搬送し、表面温度検出・温度判定を行ってもよい。 In the surface determination, if the surface is not sufficient, the sample block transport unit 20 transports the sample block 10 to the position D again, and the surface layer portion of the sample block 10 is roughly cut by the cutting unit 30 at the position D. In this case, it is not necessary to perform surface temperature detection and temperature determination, and rough cutting is performed more efficiently. However, even in rough cutting, the material may be transported to position C and surface temperature detection / temperature determination may be performed.
 面出し判定において、面出しが十分であるとされた場合、すなわち粗削りの動作が完了したとされた場合は、試料ブロック搬送部20が試料ブロック10を位置Cに搬送し、位置Cにおいて、温度検出部24が試料ブロック10の表面温度を測定し、測定された温度が所定範囲内にあるか否かが判定される。試料ブロック表面温度が所定範囲内である場合は、位置Dに搬送し、次の捨て削り又は本削り工程へと進む。試料ブロック表面温度が所定範囲外である場合は、制御部70は試料ブロック搬送部20を停止し、表面温度が所定範囲内になるまで試料ブロック10をその場で待機させる。なお、試料ブロックを切削する場合、試料ブロックの湿度も重要であり切削前に加湿を行うことが多い。加湿を行うのは、表面温度検出・温度判定により測定された温度が所定範囲内にあるとされ、捨て削り又は本削りのために位置Dに搬送されるタイミングで行うのが好ましい。すなわち、位置Cと位置Dとの間に加湿部39があるのが好ましい。表面温度検出前に加湿を行うと、加湿してすぐには適切な温度測定ができないため、時間的なロスが生じるためである。 In the surface determination, if the surface is determined to be sufficient, that is, if the roughing operation is completed, the sample block transport unit 20 transports the sample block 10 to the position C. At the position C, the temperature The detection unit 24 measures the surface temperature of the sample block 10 and determines whether or not the measured temperature is within a predetermined range. When the sample block surface temperature is within the predetermined range, the sample block is transported to the position D and proceeds to the next scraping or main cutting step. When the sample block surface temperature is outside the predetermined range, the control unit 70 stops the sample block transport unit 20 and causes the sample block 10 to wait on the spot until the surface temperature falls within the predetermined range. When cutting a sample block, the humidity of the sample block is also important, and humidification is often performed before cutting. The humidification is preferably performed at a timing at which the temperature measured by the surface temperature detection / temperature determination is within a predetermined range and transported to the position D for scraping or main cutting. That is, it is preferable that the humidification part 39 exists between the position C and the position D. This is because if the humidification is performed before the surface temperature is detected, an appropriate temperature measurement cannot be performed immediately after the humidification, resulting in a time loss.
 位置Dでは、本削りによって試料ブロック10表面から薄切片16が削り出される。このとき、通常は本削りと同じ厚さ・条件で複数回の捨て削りを行ってから、本削りが行われる。捨て削りを行うことによって、薄切片16の厚さが安定してくるからである。特に、粗削りと本削りとで異なるカッター31またはカッター31の刃先の異なる位置を使用する場合、あるいは粗削りの厚さと本削りの厚さが異なる場合は、作製される薄切片の厚さ精度を良くするために、本削りに使用されるカッター31および刃先の位置で、本削り厚さで数回の捨て削りを行うことが好ましい。 At position D, the thin section 16 is cut out from the surface of the sample block 10 by the main cutting. At this time, the main cutting is usually performed after performing a plurality of times of discarding with the same thickness and conditions as the main cutting. This is because the thickness of the thin section 16 is stabilized by performing the discarding. In particular, when using different cutters 31 or different positions of the cutting edges of the cutter 31 for rough cutting and main cutting, or when the thickness of rough cutting differs from the thickness of main cutting, the thickness accuracy of the thin slice to be produced is improved. In order to do this, it is preferable to perform several times of scraping with the thickness of the main cutting at the positions of the cutter 31 and the blade edge used for the main cutting.
 本削り動作においては、試料ブロック10の表層部分がカッター31に薄切り(3μm~10μm程度)されるように、試料ブロック搬送部20によって試料ブロック10の高さ位置が調整される。その後、試料ブロック10の表層部分がカッター31により薄切りされ、薄切片試料16が作製される。その後、試料ブロック搬送部20が、試料ブロック10を位置Dから位置C方向へ一旦退避させ、試料ブロック10の表層部分がカッター31に薄切りされるように試料ブロック10の高さ位置を調整し、次の本削りが行われる。この試料ブロック20の高さ位置の調整、薄切り、および退避の動作が、前記入力部(図示せず)に入力された情報に基づく任意の回数、自動的かつ連続的に繰り返され、任意の枚数の薄切片試料16が作製される。 In the main cutting operation, the height position of the sample block 10 is adjusted by the sample block transport unit 20 so that the surface layer portion of the sample block 10 is sliced by the cutter 31 (about 3 μm to 10 μm). Thereafter, the surface layer portion of the sample block 10 is sliced by the cutter 31 to produce a thin slice sample 16. Thereafter, the sample block transport unit 20 temporarily retracts the sample block 10 from the position D to the position C, and adjusts the height position of the sample block 10 so that the surface layer portion of the sample block 10 is sliced by the cutter 31. The next main cutting is performed. The operations of adjusting the height position of the sample block 20, slicing, and retracting are automatically and continuously repeated an arbitrary number of times based on information input to the input unit (not shown), and an arbitrary number of sheets The thin slice sample 16 is prepared.
 前記本削り動作により作製された薄切片試料16は、キャリアテープ33に貼り付けられる。なお、このとき、薄切片試料16がより確実にキャリアテープ33に貼り付くように、キャリアテープ33の表面に加湿、冷却および帯電などの処理をしておくことが好ましい。キャリアテープ33に貼り付けられた薄切片試料16は、薄切片貼付部40に搬送され、薄切片貼付部40によりスライドガラス17に貼り付けられる。その後、薄切片付きスライドガラスは、スライドガラス搬送部60により伸展部50へ搬送される。その後、伸展部50が、薄切片試料16の皺を伸展するとともに、薄切片試料16をスライドガラス17に密着固定させる。 The thin slice sample 16 produced by the main cutting operation is attached to the carrier tape 33. At this time, it is preferable that the surface of the carrier tape 33 is subjected to treatments such as humidification, cooling, and charging so that the thin-section sample 16 adheres to the carrier tape 33 more reliably. The thin slice sample 16 affixed to the carrier tape 33 is conveyed to the thin slice affixing unit 40 and affixed to the slide glass 17 by the thin slice affixing unit 40. Thereafter, the slide glass with a thin section is conveyed to the extension unit 50 by the slide glass conveyance unit 60. Thereafter, the extending section 50 extends the wrinkles of the thin slice sample 16 and tightly fixes the thin slice sample 16 to the slide glass 17.
 本実施形態では、試料ブロック10は位置B~Dの間を往復移動するので、搬送部20は試料ブロック10が位置B~D間で往復移動可能に構成されている必要がある。また、試料ブロック10の高さ位置を切削の都度切削分だけ高くする位置調整は搬送部20で行われるので、通常は試料ブロックを位置Aに戻す必要はない。しかし、何らかの原因によって試料ブロック10の傾きを再調整する必要があるときに備えて、搬送部20は、試料ブロック10が位置A~Dの間で往復移動可能に構成されていることが好ましい。 In this embodiment, since the sample block 10 reciprocates between positions B to D, the transport unit 20 needs to be configured so that the sample block 10 can reciprocate between positions B to D. Further, since the position adjustment for increasing the height position of the sample block 10 by the cutting amount is performed at each cutting, it is not necessary to return the sample block to the position A normally. However, in preparation for when the inclination of the sample block 10 needs to be readjusted for some reason, the transport unit 20 is preferably configured so that the sample block 10 can reciprocate between positions A to D.
 また、本実施形態では、温度検出部24の位置Cは位置BとDの間にあるが、これに限られるものではない。温度検出部24は、例えば、撮像部22(位置B)と同じ場所にあってもよく、切削部30(位置D)と同じ場所にあってもいい。さらに、搬送部20が試料ブロック10を往復移動可能な範囲内であれば、温度検出部24の物理的な位置は特に限定されない。なお、温度検出部24と切削部30とが同じ位置にある場合は、加湿部39も同じ位置に備えるのが好ましい。 In the present embodiment, the position C of the temperature detection unit 24 is between the positions B and D, but is not limited to this. For example, the temperature detection unit 24 may be in the same place as the imaging unit 22 (position B), or may be in the same place as the cutting unit 30 (position D). Furthermore, the physical position of the temperature detection unit 24 is not particularly limited as long as the transport unit 20 is within a range in which the sample block 10 can be reciprocated. In addition, when the temperature detection part 24 and the cutting part 30 exist in the same position, it is preferable to provide the humidification part 39 in the same position.
 また、本実施形態では、位置Cにおいて、試料ブロック10の表面温度が所定範囲外である場合は、搬送部20がその場で停止した。しかし、表面温度が所定範囲外であった場合の動作もこれに限られるものではなく、搬送部20が試料ブロック10を位置C以外の場所に搬送して、時間をおいてから位置Cに戻して温度判定を行うようにしてもよい。 In the present embodiment, when the surface temperature of the sample block 10 is outside the predetermined range at the position C, the transport unit 20 stops on the spot. However, the operation when the surface temperature is outside the predetermined range is not limited to this, and the transport unit 20 transports the sample block 10 to a place other than the position C and returns to the position C after a while. Thus, the temperature determination may be performed.
 また、試料ブロック10の表面温度が所定範囲外であった場合に、本実施形態では、搬送部20を停止して、装置100内の空調によって試料ブロック10の温度が下がるまで温度検出位置または別の位置で待機する。このような試料ブロックを待機させる方法は、試料ブロック10内での温度変化が少なくなるため好ましい方法である。連続する薄切り枚数が多い場合に特に好ましい。ただし、試料ブロック10の冷却を速めるために強制冷却を行うことを妨げるものではなく、例えば、試料ブロック10の表面にペルチェ素子を接触させて、表面を冷却してもよい。 Further, in the present embodiment, when the surface temperature of the sample block 10 is outside the predetermined range, in the present embodiment, the conveyance unit 20 is stopped and the temperature detection position or the separate position until the temperature of the sample block 10 is lowered by the air conditioning in the apparatus 100. Wait at the position. Such a method of waiting the sample block is a preferable method because the temperature change in the sample block 10 is reduced. This is particularly preferable when the number of continuous slices is large. However, this does not prevent forced cooling in order to speed up the cooling of the sample block 10. For example, the surface may be cooled by bringing a Peltier element into contact with the surface of the sample block 10.
 また、本実施形態では、面出し判定および温度判定を行った後、複数回の捨て削りと複数回の本削りを連続して行っている。しかし、連続する切削動作の途中で試料ブロック表面の温度を確認してもよい。なお、捨て削りおよび本削りで切削される厚さは極めて薄いため、連続する切削動作の途中で試料ブロック表面の温度を確認しなくても、通常問題ない。 Further, in this embodiment, after performing the surface determination and the temperature determination, a plurality of times of scraping and a plurality of times of main cutting are continuously performed. However, the temperature of the sample block surface may be confirmed during the continuous cutting operation. In addition, since the thickness cut by the discard cutting and the main cutting is extremely thin, there is usually no problem even if the temperature of the sample block surface is not confirmed during the continuous cutting operation.
 また、粗削り前と、捨て削りまたは本削り前で、温度判定の基準となる温度範囲を異なる設定にしてもよい。 Also, the temperature range that serves as a reference for temperature determination may be set differently before rough cutting and before scraping or main cutting.
 次に、本発明の第2の実施形態を図1および図4に基づいて説明する。 Next, a second embodiment of the present invention will be described based on FIG. 1 and FIG.
 本実施形態では、上記第1の実施形態と同じ装置を用いる(図1)。図4は本実施形態における薄切片試料作製のフローチャートを示している。この薄切片試料16の作製動作は、制御部70の制御の下に行われる。本実施形態では、試料ブロック10の表面温度判定を行った後に、面出し判定を行う点で第1の実施形態と異なる。 In this embodiment, the same apparatus as that in the first embodiment is used (FIG. 1). FIG. 4 shows a flow chart of thin section sample preparation in this embodiment. The thin-section sample 16 is manufactured under the control of the control unit 70. The present embodiment is different from the first embodiment in that surface determination is performed after the surface temperature of the sample block 10 is determined.
 図1および図4を参照して、試料ブロック10は、位置Aで傾きおよび高さ位置を調整され、位置Cで表面温度検出と温度判定が行われる。試料ブロック10は、表面温度が所定範囲外であればその場で待機し、所定範囲内であれば位置Bに移動して撮像、面出し判定が行われる。試料ブロック10は、面出しが不十分であれば位置Dに移動して切削部30にて粗削りが行われ、その後に再び位置Cに戻って温度判定が行われる。このように、表面温度検出・温度判定、撮像・面出し判定、粗削りの動作は、試料ブロック10の面出しが十分に行われるまで繰り返される。位置Bにおいて面出しが十分であると判断されると、試料ブロック10は位置Dに移動して切削部30にて捨て削り、本削りが行われる。撮像部23、温度検出部24、切削部30等の装置各部の個々の動作は第1の実施形態と同じであるので、詳細な説明は省略する。 Referring to FIGS. 1 and 4, the sample block 10 is adjusted in inclination and height position at position A, and surface temperature detection and temperature determination are performed at position C. If the surface temperature is outside the predetermined range, the sample block 10 stands by on the spot, and if it is within the predetermined range, moves to the position B to perform imaging and surface determination. If the surface of the sample block 10 is insufficient, it moves to the position D and rough cutting is performed by the cutting unit 30, and then returns to the position C again to determine the temperature. As described above, the surface temperature detection / temperature determination, imaging / surface determination, and roughing operations are repeated until the sample block 10 is sufficiently surface-exposed. When it is determined that the chamfering is sufficient at the position B, the sample block 10 moves to the position D and is discarded by the cutting unit 30 and the main cutting is performed. Since individual operations of the respective units such as the imaging unit 23, the temperature detection unit 24, and the cutting unit 30 are the same as those in the first embodiment, detailed description thereof is omitted.
 本実施形態においても、第1の実施形態と同様に、装置の構造や動作ステップの様々な変更が可能である。例えば、温度検出部24の物理的な位置、表面温度が所定の範囲外であったときの試料ブロック10の待機場所、強制冷却の有無、連続する切削動作の途中での試料ブロック表面温度の確認などについて、第1の実施形態と同様の変更が可能である。 Also in the present embodiment, various changes in the structure and operation steps of the apparatus are possible as in the first embodiment. For example, the physical position of the temperature detection unit 24, the standby position of the sample block 10 when the surface temperature is outside a predetermined range, the presence or absence of forced cooling, and the confirmation of the sample block surface temperature during the continuous cutting operation The same changes as in the first embodiment are possible.
 なお、本実施形態では、加湿のための水の噴霧の影響に注意する必要がある。薄切片試料作製装置100においては、いくつかの動作にともなって試料ブロック10表面の加湿のために水が噴霧されることがある。通常は切削時の試料表面の湿度を適正化するために加湿するのであるが、それとは別に撮像部23において、試料11と包埋剤12のコントラストを上げるために、水を噴霧して試料ブロック表面を加湿することがある。このとき、試料ブロック10上方に霧が舞っている状態や、試料ブロック表面に噴霧された水滴が残った状態で温度を検出しても、正確な判定を行うことが難しい。撮像部23では、同様に水の噴霧による画像への影響を避けるために、水を噴霧してからしばらく時間をおいてから撮像が行われる。そのため、面出し判定直後に表面温度検出を行っても、温度判定が水の噴霧の影響を受けることはない。しかし、本実施形態では、切削動作の次に温度検出動作が行われるので、切削から温度検出までの間に、噴霧の影響がなくなるまで、一定の時間をおくことが好ましい。 In this embodiment, it is necessary to pay attention to the influence of water spray for humidification. In the thin-section sample preparation device 100, water may be sprayed for humidifying the surface of the sample block 10 with some operations. Normally, humidification is performed to optimize the humidity of the sample surface at the time of cutting. Separately, in the imaging unit 23, in order to increase the contrast between the sample 11 and the embedding agent 12, water is sprayed to form a sample block. May humidify the surface. At this time, it is difficult to make an accurate determination even if the temperature is detected in a state where mist is floating above the sample block 10 or in a state where water droplets sprayed on the surface of the sample block remain. Similarly, in order to avoid the influence of the water spray on the image, the image pickup unit 23 performs the image pickup after a while after spraying the water. Therefore, even if the surface temperature is detected immediately after the surface determination, the temperature determination is not affected by water spray. However, in this embodiment, since the temperature detection operation is performed after the cutting operation, it is preferable that a certain period of time is taken between the cutting and the temperature detection until the influence of the spray is eliminated.
 本発明の第3の実施形態を図6および図5に基づいて説明する。 A third embodiment of the present invention will be described with reference to FIGS.
 本実施形態の薄切片試料作製装置は、図6に示すように、撮像部(図1の23)を有しない点で第1および第2の実施形態のそれと異なる。その他の構成は第1および第2の実施形態と同じである。図5は本実施形態における薄切片試料作製のフローチャートを示している。この薄切片試料16の作製動作は、制御部70の制御の下に行われる。 The thin-section sample preparation apparatus of this embodiment is different from that of the first and second embodiments in that it does not have an imaging unit (23 in FIG. 1), as shown in FIG. Other configurations are the same as those in the first and second embodiments. FIG. 5 shows a flowchart of thin section sample preparation in the present embodiment. The thin-section sample 16 is manufactured under the control of the control unit 70.
 図6および図5を参照して、試料ブロック10は、位置Aで傾きおよび高さ位置を調整され、位置Dに移動して切削部30にて粗削りが行われる。本実施形態では、面出し判定を行う撮像部がないため、予め定められた厚さを粗削りしたり、作業員が目視で確認しながら、面出しが十分に行われるまで粗削りを繰り返したりすることになる。十分に面出しが行われた後に、位置Cで試料ブロック10の表面温度検出と温度判定が行われる。試料ブロック10は、表面温度が所定範囲外であればその場で待機し、所定範囲内であれば位置Dに移動して切削部30にて捨て削り、本削りが行われる。なお、粗削り前に1度又は複数回位置Cに搬送し、表面温度検出・温度判定を行ってもよい。温度検出部24、切削部30等の装置各部の個々の動作は第1の実施形態と同じであるので、詳細な説明は省略する。 Referring to FIGS. 6 and 5, the sample block 10 is adjusted in inclination and height position at position A, moved to position D, and rough cutting is performed in the cutting unit 30. In this embodiment, since there is no image pickup unit that performs surface determination, rough cutting of a predetermined thickness, or repeated roughing until the surface is sufficiently performed while visually confirming by an operator. become. After the surface is sufficiently formed, the surface temperature detection and temperature determination of the sample block 10 are performed at the position C. If the surface temperature is outside the predetermined range, the sample block 10 stands by on the spot, and if it is within the predetermined range, the sample block 10 moves to the position D and is discarded by the cutting unit 30 to perform the main cutting. In addition, it may convey to the position C once or several times before rough cutting, and may perform surface temperature detection and temperature determination. Since the individual operations of each part of the apparatus such as the temperature detection unit 24 and the cutting unit 30 are the same as those in the first embodiment, detailed description thereof will be omitted.
 本実施形態においても、第1および第2の実施形態と同様に、装置の構造や動作ステップの様々な変更が可能である。例えば、温度検出部24の物理的な位置、表面温度が所定の範囲外であったときの試料ブロック10の待機場所、強制冷却の有無、連続する切削動作の途中での試料ブロック表面温度の確認などについて、第1または第2の実施形態と同様の変更が可能である。 Also in the present embodiment, as in the first and second embodiments, various changes in the device structure and operation steps are possible. For example, the physical position of the temperature detection unit 24, the standby position of the sample block 10 when the surface temperature is outside a predetermined range, the presence or absence of forced cooling, and the confirmation of the sample block surface temperature during the continuous cutting operation The same changes as in the first or second embodiment can be made.
 本発明は、上記の実施形態に限定されるものではなく、その技術的思想の範囲内で種々の変形が可能である。例えば、装置筐体内の温度を測定するために、温度検出部24とは別に温度計を配置し、当該温度計と制御部とをリンクさせ、筐体内自体がある設定温度範囲内でなければ、装置全体をスタートできないようにすることも可能である。また、薄切片試料をスライドガラスの上面に載置する方法としては前記水などの接着液を用いた貼着による方法が最も好ましいが、その他の例としては、液槽内の液体に浮かべた薄切片試料を、スライドガラスで掬い上げるようにしてもよい。また、移載液の表面張力によって、薄切片試料がキャリアテープからスライドガラス上に移載されるようにしてもよい。 The present invention is not limited to the above-described embodiment, and various modifications can be made within the scope of the technical idea. For example, in order to measure the temperature in the device housing, a thermometer is arranged separately from the temperature detection unit 24, the thermometer and the control unit are linked, and the housing itself is not within a set temperature range, It is also possible to prevent the entire device from starting. In addition, as a method of placing the thin slice sample on the upper surface of the slide glass, the method by sticking using an adhesive liquid such as water is most preferable, but as another example, the thin slice sample floated on the liquid in the liquid tank. The section sample may be scooped up with a slide glass. Further, the thin slice sample may be transferred from the carrier tape onto the slide glass by the surface tension of the transfer liquid.
 本発明の薄切片試料作製装置および方法では、試料ブロックの表面温度を検出して、表面温度が所定の温度範囲内にあることを確認した後に、薄切片試料を作製する。これにより、試料ブロック温度が高すぎることによる薄切片試料の厚さのムラを抑えることができるので、理化学試料分析や生体試料等の顕微鏡観察などに利用される薄切片試料作製装置および方法として有用である。 In the thin-section sample preparation apparatus and method of the present invention, the surface temperature of the sample block is detected, and after confirming that the surface temperature is within a predetermined temperature range, the thin-section sample is prepared. This makes it possible to suppress uneven thickness of the thin slice sample due to the sample block temperature being too high, and is useful as a thin slice sample preparation device and method used for physicochemical sample analysis and microscopic observation of biological samples. It is.
10 試料ブロック
11 試料(被検体)
12 包埋剤
13 試料ブロック台
14 荒削り高さ
15 捨て削りまたは本削り高さ
16 薄切片試料
17 スライドガラス
18 接着液
20 試料ブロック搬送部
21 試料ブロック収納部
22 高さ検出部
23 撮像部
24 温度検出部
30 切削部
31 カッター
32 供給リール
33 キャリアテープ
34~37,41,42 ガイドローラ
38 巻取リール
39 加湿部
40 薄切片貼付部
50 伸展部
60 スライドガラス搬送部
70 制御部
100 薄切片試料作製装置
10 Sample block 11 Sample (subject)
12 Embedding agent 13 Sample block base 14 Rough cutting height 15 Discarded or main cutting height 16 Thin section sample 17 Slide glass 18 Adhesive liquid 20 Sample block transport unit 21 Sample block storage unit 22 Height detection unit 23 Imaging unit 24 Temperature Detection unit 30 Cutting unit 31 Cutter 32 Supply reel 33 Carrier tape 34 to 37, 41, 42 Guide roller 38 Take-up reel 39 Humidifying unit 40 Thin section pasting unit 50 Extending unit 60 Slide glass transport unit 70 Control unit 100 Thin section sample preparation apparatus

Claims (6)

  1.  試料が包埋剤中に包埋された試料ブロックをカッターにより薄切りして薄切片試料を作製する薄切片試料作製装置であって、
     前記試料ブロックを搬送する搬送部と、
     前記カッターを備える切削部と、
     前記試料ブロックの表面温度を検出する温度検出部と、
     前記温度検出部により検出された前記試料ブロックの表面温度に基づいて、少なくとも前記搬送部および/または前記切削部の動作を制御する制御部と、
    を具備する薄切片試料作製装置。
    A thin-section sample preparation device for preparing a thin-section sample by slicing a sample block in which a sample is embedded in an embedding agent with a cutter,
    A transport unit for transporting the sample block;
    A cutting section comprising the cutter;
    A temperature detector for detecting the surface temperature of the sample block;
    Based on the surface temperature of the sample block detected by the temperature detector, at least a controller that controls the operation of the transport unit and / or the cutting unit;
    A thin-section sample preparation apparatus comprising:
  2.  前記制御部は、前記試料ブロックの表面温度が前記所定の範囲外である場合は、該表面温度が前記所定の範囲内となるまで前記搬送部および/または前記切削部を停止させる、
    請求項1に記載の薄切片試料作製装置。
    When the surface temperature of the sample block is outside the predetermined range, the control unit stops the transport unit and / or the cutting unit until the surface temperature falls within the predetermined range.
    The thin-section sample preparation apparatus according to claim 1.
  3.  前記試料ブロック表面を加湿する加湿部をさらに具備し、
     前記加湿部は、前記切削部と前記温度検出部との間において加湿を行う、
    請求項1または2に記載の薄切片試料作製装置。
    Further comprising a humidifying part for humidifying the sample block surface;
    The humidification unit performs humidification between the cutting unit and the temperature detection unit.
    The thin-section sample preparation apparatus according to claim 1 or 2.
  4.  前記試料ブロックの表面の前記試料の部分の面積が薄切片試料作製について十分であるか否か判定する面出し判定部をさらに具備し、
     前記温度検出部は、試料ブロックの表面の前記試料の部分の面積が薄切片試料作製について十分である判定をした場合に温度検出を行う、
    請求項1~3のいずれか一項に記載の薄切片試料作製装置。
    A surface determination unit that determines whether the area of the sample portion on the surface of the sample block is sufficient for thin-section sample preparation;
    The temperature detection unit performs temperature detection when it is determined that the area of the sample portion on the surface of the sample block is sufficient for thin-section sample preparation,
    The thin-section sample preparation device according to any one of claims 1 to 3.
  5.  試料が包埋剤中に包埋された試料ブロックの表層部分をカッターにより薄切りして薄切片試料を作製する薄切片試料作製方法であって、
     前記試料ブロックの表面温度を検出するステップと、
     前記表面温度が所定の範囲内であるか否かを判定するステップと、
     前記表面温度が前記所定の範囲内である場合は、前記カッターと前記試料ブロックとを相対的に移動させることにより前記薄切り動作を行い、前記表面温度が前記所定の範囲外である場合は、該表面温度が前記所定の範囲内となるまで前記試料ブロックを停止させるステップと、
    を有する薄切片試料作製方法。
    A thin-section sample preparation method for preparing a thin-section sample by slicing a surface layer portion of a sample block in which a sample is embedded in an embedding agent with a cutter,
    Detecting the surface temperature of the sample block;
    Determining whether the surface temperature is within a predetermined range;
    When the surface temperature is within the predetermined range, the slicing operation is performed by relatively moving the cutter and the sample block, and when the surface temperature is outside the predetermined range, Stopping the sample block until the surface temperature is within the predetermined range;
    A method for preparing a sliced piece sample.
  6.  前記表面温度が所定の範囲内であるか否かを判定するステップと、
     前記表面温度が前記所定の範囲内である場合は、前記カッターと前記試料ブロックとを相対的に移動させることにより前記薄切り動作を行うステップとの間に、前記試料ブロック表面を加湿するステップを有する、
    薄切片試料作製方法。
    Determining whether the surface temperature is within a predetermined range;
    A step of humidifying the surface of the sample block between the step of performing the slicing operation by relatively moving the cutter and the sample block when the surface temperature is within the predetermined range; ,
    Thin section sample preparation method.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111929136A (en) * 2020-08-28 2020-11-13 广州金域医学检验中心有限公司 Staining method, device and system for frozen pathological section

Families Citing this family (1)

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Publication number Priority date Publication date Assignee Title
JP2017064542A (en) * 2017-01-23 2017-04-06 株式会社大都技研 Game machine

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1826547A2 (en) * 2006-01-25 2007-08-29 Seiko Instruments Inc. Automatic slicing apparatus
JP2007322386A (en) * 2006-06-05 2007-12-13 Mayekawa Mfg Co Ltd Microslicer
JP2008216109A (en) * 2007-03-06 2008-09-18 Toppan Printing Co Ltd Cutting method
JP2012229993A (en) * 2011-04-26 2012-11-22 Kurabo Ind Ltd Thin-sliced sample fabrication device and thin-sliced sample fabrication method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1826547A2 (en) * 2006-01-25 2007-08-29 Seiko Instruments Inc. Automatic slicing apparatus
JP2007322386A (en) * 2006-06-05 2007-12-13 Mayekawa Mfg Co Ltd Microslicer
JP2008216109A (en) * 2007-03-06 2008-09-18 Toppan Printing Co Ltd Cutting method
JP2012229993A (en) * 2011-04-26 2012-11-22 Kurabo Ind Ltd Thin-sliced sample fabrication device and thin-sliced sample fabrication method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111929136A (en) * 2020-08-28 2020-11-13 广州金域医学检验中心有限公司 Staining method, device and system for frozen pathological section

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