JP2010185789A - Device and method for making thin slice - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To cut a thin slice in desired thickness with high precision. <P>SOLUTION: In a thin slice making device, a control unit is operated so that a support and a cutter 3 are relatively moved forward by a moving means after an embedding block B is preparatorily humidified by a humidification means 6, the embedded block is preparatorily cut by the cutter and subsequently subjected to main humidification by the humidification means, the support and the cutter are relatively moved forward at the same speed as that in preparatory cutting by the moving means after they are relatively moved forward by slice thickness using an adjusting means and the embedding block is subjected to main cutting by the cutter to make the thin slice. The control unit makes the time from the completion of the preparatory humidification to the start of the preparatory cutting the same as the time from the completion of the main humidification to the start of the main humidification and performs both the preparatory humidification and the main humidification under the same humidification condition. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a thin-section preparation apparatus and a thin-section preparation method.

  Conventionally, prior to clinical trials in the development of new drugs, toxicity tests and pathological examinations using laboratory animals have been conducted. These tests and inspections are performed using a thin slice specimen in which a thin slice having a desired slice thickness (for example, 3 μm to 5 μm) is fixed on a substrate such as a slide glass. As a thin section, an experimental animal such as a mouse or a rabbit administered with a drug is necropsied and sliced for pathological examination. Moreover, it is produced for each of various parts (for example, brain, lungs, etc.).

As a device for producing such a thin slice, a microtome, which is a dedicated thin cutting device, is known. Here, a general method for producing a thin slice using a microtome will be described.
First, after replacing a biological sample such as a formalin-fixed organism or animal with paraffin, the periphery is further solidified with paraffin to make a block-shaped embedded block.
Next, this embedding block is set on a microtome, and rough cutting (chamfering) is performed. By this rough cutting, the surface of the embedding block becomes a smooth surface, and the embedded biological sample that is the object of experiment and observation is exposed on the surface.
After rough cutting is finished, the main cutting is performed. This is a process in which the embedded block is cut into an extremely thin thickness, that is, sliced, with the cutter of the microtome.
As described above, a thin slice having the slice thickness can be obtained.

  By the way, depending on the type of biological sample, if the surface of the embedding block is dry when preparing a thin section, the surface of the embedding block exposed after cutting may be wrinkled or deformed. Some require measures to prevent the surface of the buried block from drying out. In this case, for example, the embedding block needs to be appropriately humidified to prevent drying. As this type of thin section manufacturing apparatus, as shown in Patent Document 1 below, a cover that covers the periphery of the embedding block (sample block) and the cutter (knife) from above, and the humidity inside the cover is a target value. There is known a configuration including a humidity control device that performs control so as to be maintained at a predetermined temperature.

JP 2004-28965 A

  However, since the size of the embedded block may change due to swelling or temperature change due to humidification, the size may change due to contraction or expansion, so when the embedded block is humidified during the main cutting, Furthermore, it was difficult to cut the embedded block with a desired section thickness. In other words, when trying to cut the embedded block at the section thickness, if the embedded block contracts due to humidification, if the thin section is cut thinner than the section thickness and the embedded block expands, The thin section had been cut thicker than the section thickness.

  The present invention has been made in view of the above-described circumstances, and an object thereof is to provide a thin-slice manufacturing apparatus and a thin-slice manufacturing method capable of cutting a thin section with a desired section thickness with high accuracy. That is.

In order to solve the above problems, the present invention proposes the following means.
The thin-section preparation apparatus according to the present invention is a thin-section preparation apparatus that cuts an embedded block in which a biological sample is embedded to prepare a thin section having a desired section thickness, and supports the embedded block A body, a cutter for cutting the embedding block, a moving means for relatively moving the support and the cutter along one direction, and cutting the embedding block by the cutter, and the one direction Adjusting means for adjusting the position of the embedding block in the other direction relative to the cutter, and humidifying the embedding block. A humidifying unit; and a control unit that controls the moving unit, the adjusting unit, and the humidifying unit, and the control unit preliminarily humidifies the embedding block by the humidifying unit, and then the moving unit. The support and the cutter are moved forward relatively, the embedded block is preliminarily cut by the cutter, and then the embedded block is fully humidified by the humidifying means and the support is supported by the adjusting means. After the body and the cutter are relatively moved forward by the section thickness, the support and the cutter are relatively moved forward at the same speed as the preliminary cutting by the moving means, and the embedding is performed. The block is subjected to main cutting with the cutter to produce the thin slice, and the control unit starts from the preliminary humidification until the preliminary cutting is started and after the main humidification until the main humidification is started. The time is made the same, and the preliminary humidification and the main humidification are performed under the same humidification conditions.

  The thin-section preparation method according to the present invention includes a support that supports an embedded block in which a biological sample is embedded, a cutter that cuts the embedded block, and the support and the cutter in one direction. Moving forward relative to each other, moving the cutting block by the cutter, moving the support and the cutter relative to each other along the other direction intersecting the one direction, Using a thin-section preparation apparatus that includes an adjusting unit that adjusts the position of the embedded block in the other direction with respect to a cutter, and a humidifying unit that humidifies the embedded block, the embedded block is cut to a desired level. A thin-section preparation method for preparing a thin section having a section thickness, wherein the embedding block is pre-humidified by the humidifying means, and the support and the cutter are moved by the moving means. A preliminary cutting step in which the pre-humidified embedded block is preliminarily cut by the cutter, a pre-humidifying step in which the pre-cut embedding block is pre-humidified by the humidifying means; After the cutting step, the adjusting unit moves the support and the cutter relatively forward by the section thickness by the adjusting unit, and after the adjusting step, the supporting unit and the cutter are relatively moved by the moving unit. And a main cutting step of moving forwardly moving at the same speed as in the preliminary cutting step and main cutting the embedding block that has been humidified by the cutter to produce the thin slice, and after the preliminary humidification step. The time until the preliminary cutting step is started and the time after the main humidification step until the main humidification step is started are the same, and the preliminary humidification step and And performing each of the present humidification step under the same humidification conditions.

According to this invention, in the main cutting process, the support and the cutter are relatively moved forward by the moving means at the same speed as in the preliminary cutting process. Furthermore, the time from the start of the pre-humidification process to the start of the pre-cutting process is the same as the time from the start of the main humidification process to the start of the main humidification process. Performed under the same humidification conditions.
As described above, the humidifying conditions of the embedding block to be cut in the main cutting process, and the waiting time until the main cutting is performed after the main humidification, the humidifying conditions of the embedding block cut in the pre-cutting, and the pre-humidification It can be made to correspond with the cutting waiting time until it is pre-cut after being done. Thereby, it becomes possible to make the variation | change_quantity of the said other direction resulting from the humidification in the embedding block in this cutting process correspond with the said variation | change_quantity in a preliminary | backup cutting process. Accordingly, the thin section can be cut with high accuracy by the section thickness by performing the main cutting process after performing the adjustment process in which the support and the cutter are relatively moved forward by the section thickness by the adjusting means. .

  In the thin-slice manufacturing apparatus according to the present invention, the thin section manufacturing apparatus includes a discarding unit that sucks and discards cutting waste cut from the embedded block by the cutter, and the control unit cuts the cutting waste cut by preliminary cutting. May be aspirated and discarded by the discarding means.

  Moreover, in the thin-section preparation method according to the present invention, the thin-section manufacturing method includes a discarding step of sucking and discarding cutting waste cut from the embedded block by the cutter, and the discarding step is cut in the preliminary cutting step. The cutting waste may be sucked and discarded.

  In this case, since the scraping process discards the cutting scraps cut in the preliminary cutting step, the cutting scraps do not interfere with other operations in the process of manufacturing the thin slices, so that the thin slice manufacturing efficiency is improved. Can be made.

  According to the present invention, a thin slice can be cut with a desired slice thickness with high accuracy.

It is a typical side view of the thin section production apparatus concerning one embodiment of the present invention. FIG. 2 is a control block diagram of the thin section manufacturing apparatus shown in FIG. 1. It is one process figure explaining the thin slice production method using the thin slice production apparatus shown in FIG. It is one process figure explaining the thin slice production method using the thin slice production apparatus shown in FIG. It is one process figure explaining the thin slice production method using the thin slice production apparatus shown in FIG. It is one process figure explaining the thin slice production method using the thin slice production apparatus shown in FIG. It is one process figure explaining the thin slice production method using the thin slice production apparatus shown in FIG. It is one process figure explaining the thin slice production method using the thin slice production apparatus shown in FIG. It is one process figure explaining the thin slice production method using the thin slice production apparatus shown in FIG. It is one process figure explaining the thin slice production method using the thin slice production apparatus shown in FIG.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
As shown in FIG. 1, a thin-slice preparation device 1 is a device that prepares a thin slice S by slicing a substantially rectangular parallelepiped embedded block B in which a biological sample A is embedded to a desired slice thickness h1. The section thickness h1 of the thin section S is, for example, about 3 to 5 μm, and the thin section preparation apparatus 1 is mainly used in the process of inspecting and observing the biological sample A included in the thin section S.

The biological sample A is, for example, a tissue such as an organ taken out from a human body, a laboratory animal, or the like, and is appropriately selected in the medical field, pharmaceutical field, food field, biological field, and the like. The embedding block B is obtained by embedding the biological sample A as described above with the embedding agent B1, that is, covering and solidifying the periphery. In more detail, such an embedding block B is produced as follows. First, the mass of the biological sample A is immersed in formalin to fix the protein constituting the biological sample A. And after making a structure | tissue solid, it cut | disconnects to a suitable magnitude | size. Finally, it is produced by embedding and solidifying a material in which the moisture in the cut biological sample A is replaced by the embedding agent B1 in the embedding agent B1. Here, the embedding agent B1 is a material that can be easily liquefied and cooled and solidified, and is dissolved by being immersed in ethanol, such as resin or paraffin.
Hereinafter, the configuration of the thin-slice manufacturing apparatus 1 will be described.

  As shown in FIGS. 1 and 2, the thin-section preparation apparatus 1 includes a support body 2 that supports the embedding block B, a cutter 3 that cuts the embedding block B, and the support body 2 and the cutter 3 as horizontal surfaces. An X stage (moving means) 4 that moves relatively back and forth along a parallel X direction (one direction), and a support 2 and a cutter 3 along a Z direction (the other direction) that is a vertical direction orthogonal to the horizontal plane. A Z stage (adjusting means) 5 that relatively moves and retreats, a humidifying means 6 that humidifies the embedding block B, and a control unit 7 that controls the X stage 4, the Z stage 5 and the humidifying means 6. Yes. Furthermore, in this embodiment, the waste means 8 which sucks and discards the cutting waste S1 (see FIG. 6) cut from the embedded block B by the cutter 3 and the presence or absence of cutting of the embedded block B by the cutter 3 are detected. Cutting detection means 9 for carrying out, and conveying means 10 for carrying the thin section S cut from the embedding block B by the cutter 3 to the next process. These discarding means 8 and conveying means 10 are also controlled by the controller 7. Controlled by

As shown in FIG. 1, the cutter 3 is detachably sandwiched and fixed between a fixing base 11 and a holder 12 fixed to each other by a fixing means (not shown) and is replaceable. In the illustrated example, the cutter 3 is fixed so that the cutting edge 3a is parallel to the horizontal plane.
The support 2 supports the embedding block B by positioning and fixing the cassette C on which the embedding block B is fixed in an exchangeable manner. The support 2 is supported by a guide rail 13 provided on the Z stage 5 so as to be slidable in the X direction. In the illustrated example, the support 2 supports the embedding block B so that the thickness direction of the embedding block B coincides with the Z direction and the surface B2 of the embedding block B coincides with the horizontal plane. Yes.

  The Z stage 5 supports the support body 2 so as to be movable along the Z direction, and the support body 2 and the cutter 3 are relatively moved forward by moving the support body 2 upward along the Z direction. Then, the support body 2 and the cutter 3 can be moved relatively backward by moving the support body 2 downward along the Z direction. Thereby, the position of the Z direction of the embedding block B with respect to the cutter 3 can be adjusted.

The X stage 4 supports the support 2 so as to be movable along the X direction via the Z stage 5 so that the support 2 approaches the cutter 3 from the cutting edge 3a side along the X direction. Both can be moved forward relatively by moving, and the support 2 can be moved backward relative to the cutter 3 so as to be separated toward the blade edge 3a along the X direction. .
The X stage 4 configured as described above moves the support 2 forward and backward relative to the cutter 3 so that the cutting edge 3a of the cutter 3 is moved relative to the embedded block B along the traveling surface 3b parallel to the horizontal plane. Can be moved. Therefore, the X stage 4 cuts the embedding block B by the cutter 3 by moving the support 2 forward from the standby position P separated in the X direction on the cutting edge 3a side of the cutter 3 with respect to the cutter 3. Can do.

  The cutting detection means 9 detects the position of the support 2 moved by the X stage 4 and outputs the support position data D1 and when the embedded block B is cut by the cutter 3. A cutting force detection unit 15 that detects the generated cutting force and outputs the cutting force data D2. Then, the cutting detection means 9 sends detection data D composed of the support body position data D1 and the cutting force data D2 to the control unit 7.

  The support body position detector 14 is configured by, for example, an optical sensor or a magnetic sensor. Further, the cutting force detection unit 15 is provided on the Z stage 5 so as to face the support 2 in the X direction and abuts against the support 2, and the force sensors 15 a and X sandwich the support 2. And a pressing portion 15b which is provided on the Z stage 5 so as to face the direction and presses the support 2 toward the force sensor 15a with a constant force. In the illustrated example, the force sensor 15a is disposed so as to face the cutting edge 3a of the cutter 3 in the X direction.

  The conveying means 10 includes a front roller 10a provided close to the holder 12 above the cutter 3, a rear roller 10b provided behind the cutter 3 where the next step is positioned, and a front roller 10a. A conveyance belt 10c wound around the rear roller 10b is provided. The front roller 10a and the rear roller 10b are each rotatably attached to a frame (not shown). Further, a gap through which the transport belt 10c can pass is provided between the front roller 10a and the holder 12 of the cutter 3.

Further, in the present embodiment, two intermediate rollers 10d and 10e rotatably mounted on the frame are disposed between the front roller 10a and the rear roller 10b, and one intermediate roller 10e includes The motor 10f is connected.
In the conveying means 10 configured as described above, the thin slice S cut from the embedding block B by the cutter 3 is lifted upward while being cut and received by the conveying belt 10c. The thin section S can be transported to the next process by operating the motor 10f and causing the transport belt 10c to travel infinitely.

The humidifying means 6 guides the mist so that the mist generating part 16 for generating mist heated to a constant temperature and the generated mist hit the surface B2 of the embedding block B supported by the support 2 at the standby position P. And a guide unit 17 for performing the above operation.
According to the humidifying means 6 configured in this way, the mist generated by the mist generating unit 16 is guided by the guide unit 17 so that the mist hits the surface B2 of the embedding block B located at the standby position P. Can be sprayed. Thereby, the embedding block B can be humidified with the fixed humidification temperature T. FIG.
Further, in the present embodiment, the humidifying means 6 can be controlled by the control unit 7 in the humidifying time.

  The discarding means 8 includes a suction port portion 18 disposed in the vicinity of the cutter 3 and a vacuum pump 19 connected to the suction port portion 18. In the present embodiment, the suction port portion 18 is opened toward the upper surface of the conveyance belt 10c in the vicinity of the cutter 3, and according to the discarding means 8, the vacuum pump 19 is operated to activate the suction port 18 on the conveyance belt 10c. The cutting waste S <b> 1 can be sucked from the suction port 18.

  As shown in FIG. 2, the control unit 7 includes a sampling circuit 20 that stores detection data D sent from the cutting detection means 9, a stage controller 21 that controls the X stage 4 and the Z stage 5, a sampling circuit 20, And a stage controller 21, and a computer 22 for controlling the conveying means 10, the humidifying means 6 and the discarding means 8.

The computer 22 is electrically connected to the sampling circuit 20 and the stage controller 21 respectively.
The computer 22 is connected to an input unit 23 capable of inputting various data externally. In the present embodiment, in the computer 22, the position coordinate in the X direction of the cutting edge 3 a of the cutter 3, the size along the X direction of the embedding block B, and the desired section thickness h 1 of the thin section S are input to the input unit 23. Is previously input and stored using. Further, the stage controller 21 stores in advance the moving speed v of the X stage 4 in the moving process (preliminary cutting process) and the main cutting process, which will be described later, using the input unit 23.

Then, the computer 22 will be described later based on the position coordinates in the X direction of the cutting edge 3a of the cutter 3, the size along the X direction of the embedding block B, and the detection data D stored in the sampling circuit 20. Thus, it is set as the structure which can determine whether the embedding block B was cut.
In the present embodiment, a display 24 is connected to the computer 22, and the progress status of each process shown below, the detection result by the cutting detection means 9, and the like can be displayed.

Next, a thin slice preparation method for preparing the thin slice S having the slice thickness h1 from the previously-embedded embedded block B using the thin slice preparation apparatus 1 described above will be described.
First, as shown in FIG. 3, the support 2 is moved to the standby position P, and a preparation process for setting the cassette C on which the embedding block B is fixed to the support 2 is performed. At this time, in this embodiment, the cassette C is set so that the Z-direction positions of the traveling surface 3b of the cutting edge 3a of the cutter 3 and the surface B2 of the embedding block B coincide.

Next, as shown in FIG. 4, a pre-humidification process is performed in which the embedding block B is pre-humidified by the humidifying means 6. In the present embodiment, the computer 22 causes the mist generating unit 16 to generate a mist having a constant temperature for a constant humidifying time t1 (for example, 10 seconds), and blows the generated mist from the guide unit 17 onto the surface B2 of the embedding block B. Put on. Thereby, the surface B2 of the embedding block B is pre-humidified at the humidification temperature T for the humidification time t1. That is, the humidification temperature T and the humidification time t1 constitute a humidification condition H for preliminary humidification.
In the following, the embedding block B pre-humidified under the humidification condition H contracts by a change amount h2 (however, h2 <h1) in the Z direction as compared with the embedding block B before pre-humidification. Will be described. That is, the surface B2 of the pre-humidified embedding block B is positioned below the traveling surface 3b of the cutter 3.

  Next, as shown in FIG. 5, in the present embodiment, a preliminary adjustment step of adjusting the position of the embedding block B in the Z direction with respect to the cutter 3 by the Z stage 5 is performed. In the present embodiment, the stage controller 21 moves the support 2 forward with respect to the cutter 3 by the section thickness h 1 by the Z stage 5, and adjusts the position of the embedding block B with respect to the cutter 3. In the illustrated example, since h2 <h1, the surface B2 of the embedding block B is positioned above the running surface 3b of the cutter 3.

Next, in the present embodiment, as shown in FIG. 6, a moving process is performed in which the support 2 and the cutter 3 are relatively moved forward by the X stage 4. In the present embodiment, the stage controller 21 moves the embedded block B forward relative to the cutter 3 at the moving speed v by the X stage 4. The moving speed v may vary depending on the relative positional relationship between the embedding block B and the cutter 3 in the X direction. For example, a range in the X direction in which the embedding block B can be cut by the cutter 3. Then, it may be slower than the range in the X direction in which the embedding block B and the cutter 3 simply approach each other.
The computer 22 measures and stores the time t2 from the preliminary humidification process to the start of the movement process.

  Moreover, the detection process which detects the cutting state of the embedding block B by the cutter 3 is performed, performing the movement process. In this embodiment, the stage controller 21 supports the position of the support 2 in the X direction while the stage controller 21 moves the support 2 forward from the standby position P toward the cutter 3 by the X stage 4. The force sensor 15a of the cutting force detector 15 sends the cutting force data D2 of the cutting force generated by cutting the embedded block B by the cutter 3 to the sampling circuit 20 as body position data D1. Send it out.

  The cutting detection process will be described in detail. When the surface B2 of the pre-humidized embedding block B is positioned above the traveling surface 3b of the cutter 3 as in the illustrated example, the embedding block B in the moving process. Is cut by the cutter 3. At this time, the period during which the embedding block B is cut, that is, from the time when the position coordinate in the X direction of the embedding block B fixed to the support 2 reaches the position coordinate in the X direction of the cutting edge 3a of the cutter 3. In the detection period until the embedding block B is moved along the X direction, the cutting force by the cutter 3 is transmitted to the force sensor 15a, and the cutting force data D2 becomes larger than before and after this detection period. .

  On the other hand, when the surface B2 of the pre-humidified embedding block B is located below the running surface 3b of the cutter 3, the cutting edge 3a of the cutter 3 does not contact the embedding block B during the detection period. Since the cutter 3 swings the embedded block B, the cutting force data D2 of the cutting force detected by the force sensor 15a while the embedded block B is moved forward with respect to the cutter 3 including the detection period is It becomes almost constant. At this time, the cutting force data D2 indicates the cutting force detected by the force sensor 15a when the support body 2 is pressed by the pressing portion 15b.

As described above, in the cutting detection step, the cutting state of the embedding block B by the cutter 3 is detected and sent to the sampling circuit 20 as detection data D composed of the support body position data D1 and the cutting force data D2. be able to. The sampling circuit 20 stores the transmitted detection data D.
This completes the cutting detection process.

Next, a determination process for determining whether or not the embedded block B is cut based on the detection data D obtained in the cutting detection process is performed.
At this time, first, the computer 22 is based on the position coordinates in the X direction of the cutting edge 3a of the cutter 3, the size along the X direction of the embedding block B, and the detection data D stored in the sampling circuit 20. Then, it is determined whether or not the cutting force data D2 in the detection period is larger than before and after the detection period, and the presence or absence of cutting is determined.

  When the computer 3 determines that the cutter 3 has swung the embedded block B during the detection period of the moving process and the cutting has not been performed, the computer 22 returns to the preliminary humidification process, and the process from the preliminary humidification process to the determination process is performed. repeat. In addition, when repeating a determination process from a preliminary humidification process, the computer 22 updates and memorize | stores time t2 after a preliminary humidification process until it starts a movement process, whenever both processes are implemented.

  On the other hand, when the computer 22 determines that cutting has been performed in the detection period of the moving process, the process proceeds to the next process. In the present embodiment, the moving process in which it is determined in the determination process that cutting has been performed in the detection period is a preliminary cutting process in which the pre-humidified embedded block B is preliminarily cut by the cutter 3.

  By performing the preliminary cutting process (moving process) in this way, the embedding block B preliminarily humidified under the humidification condition H has a time t2 until the preliminary cutting process (moving process) starts after the preliminary humidifying process. In the preliminary cutting step (moving step), the moving speed v of the cutter 3 is changed by a predetermined change amount in the Z direction under the cutting waiting time t3 from preliminary humidification to preliminary cutting determined by Pre-cut with.

Next, as shown in FIG. 6, a discarding step of sucking and discarding the cutting waste S <b> 1 cut in the preliminary cutting step is performed. At this time, the computer 22 sucks and discards the thin section S received on the conveyor belt 10c from the suction port portion 18 by the vacuum pump 19.
As shown in FIG. 7, the computer 22 operates the X stage 4 by the stage controller 21 to move the support 2 backward to the standby position P.

  Here, when the preliminary cutting process is completed, the traveling surface 3b of the cutter 3 and the surface B2 of the embedding block B coincide with the Z direction. As the embedded block B dries, the shrinkage in the Z direction of the embedded block B, which is the effect of humidification, is gradually restored, and the surface B2 of the embedded block B is It is located on the upper side by the amount of change h2.

Next, as shown in FIG. 8, a main humidification process is performed in which the pre-cut embedded block B is fully humidified by the humidifying means 6. Under the present circumstances, it carries out on the same humidification conditions H as a preliminary humidification process. In the present embodiment, the computer 22 causes the mist generating unit 16 to generate the mist having the constant temperature for the humidifying time t1, and sprays the generated mist from the guide unit 17 onto the surface B2 of the embedding block B to thereby generate the humidifying temperature. Humidify with T. Thereby, since the embedding block B which has been fully humidified in the present humidifying process is humidified under the humidifying condition H, the amount of change h2 contracts in the Z direction compared to the embedding block B before the main humidification. To do. Therefore, the running surface 3b of the cutter 3 and the surface B2 of the embedding block B coincide with the Z direction.
Moreover, the computer 22 memorize | stores the time of complete | finishing this humidification process.

  Next, as shown in FIG. 9, a main adjustment process (adjustment process) is performed in which the support 2 and the cutter 3 are relatively moved forward by the section thickness h <b> 1 by the Z stage 5. In the present embodiment, the stage controller 21 moves the support 2 forward with respect to the cutter 3 by the Z stage 5 by the section thickness h1. As a result, the surface B2 of the embedding block B is positioned above the traveling surface 3b by the section thickness h1.

Next, as shown in FIG. 10, the support body 2 and the cutter 3 are relatively moved forward by the X stage 4, and the embedding block B that has been humidified is finally cut by the cutter 3 to produce a thin slice S. This cutting process is performed. At this time, the main cutting process is performed so that the time t4 from the start of the main humidification process to the start of the main humidification process is the same as the time t2 from the start of the prehumidification process to the start of the preliminary cutting process. Further, the support 2 and the cutter 3 are relatively moved forward at the same speed v as in the preliminary cutting process.
In the present embodiment, the main cutting process is performed based on the time t2 from when the computer 22 stores the preliminary humidification process stored in the preliminary cutting process to the start of the preliminary cutting process, and the time when the main humidifying process is completed. Start. At this time, the stage controller 21 moves the embedded block B forward relative to the cutter 3 at the moving speed v.

  Next, in the present embodiment, a transport process is performed in which the thin slice S that has been cut and transferred to the transport means 10 is transported toward the next process. In the present embodiment, the computer 22 operates the motor 10f and transports the thin slice S toward the next process by the transport belt 10c.

According to the thin section manufacturing apparatus 1 and the thin section manufacturing method described above, in the main cutting process, the support 2 and the cutter 3 are relatively moved forward by the X stage 4 at the same speed v as in the preliminary cutting process. . Furthermore, the time t2 from the start of the prehumidification step to the start of the precutting step is the same as the time t4 from the start of the main humidification step to the start of the main humidification step, and the prehumidification step and the main humidification step. Each is performed under the same humidification condition H.
As described above, the humidification condition H of the embedding block B to be cut in the main cutting process, and the cutting waiting time from the main humidification to the main cutting are determined as the humidification condition H of the embedding block B cut in the preliminary cutting. , And the waiting time t3 from the preliminary humidification to the preliminary cutting can be made to coincide with each other. Thereby, it becomes possible to make the change amount of the Z direction resulting from the humidification in the embedding block B in the main cutting process coincide with the change amount in the preliminary cutting process. Therefore, after performing the main adjustment process in which the support 2 and the cutter 3 are relatively moved forward by the section thickness h1 by the Z stage 5, the thin section S is increased by the section thickness h1 by performing the main cutting process. It can be produced with high accuracy.

In addition, since the scrapping process discards the cutting waste S1 cut in the preliminary cutting process, the cutting scrap S1 does not interfere with other operations in the process of manufacturing the thin slice S. Efficiency can be improved.
Moreover, in this embodiment, since it transfers to the disposal process which is the next process after determining with having been cut in the determination process, there is no possibility of repeating the preliminary cutting a plurality of times, and after the preliminary cutting, the process proceeds smoothly to the next process. can do.

The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.
For example, in the above embodiment, in the preparation step, the cassette C is set on the support 2 so that the traveling surface 3b of the cutter 3 and the surface B2 of the embedding block B are aligned in the Z direction. The surface B2 of the embedding block B may be positioned on the lower side or the upper side with respect to the traveling surface 3b of the cutter 3.

  Moreover, in the said embodiment, although the case where the embedding block B which shrink | contracts by humidification was employ | adopted was shown as an example, the embedding block which expand | extends by humidification may be employ | adopted. Even in this case, the same effects can be achieved. Furthermore, in this case, the preliminary adjustment step does not have to be performed, whereby the thickness of the cutting waste S1 sliced in the preliminary adjustment step can be reduced, and the thin slice S that can be produced from the embedding block B can be reduced. Yield can be improved.

  In the above embodiment, the support 2 is moved forward by the section thickness h1 with respect to the cutter 3 in the preliminary adjustment step. However, the present invention is not limited to this. For example, for the embedding block B to be subjected to the main cutting, when the humidification condition H is humidified, an approximate predicted change amount indicating how much the shrinkage or expansion is changed is stored in the control unit 7 in advance. Alternatively, the advance / retreat amount of the support 2 with respect to the cutter 3 in the preliminary adjustment step may be set according to the predicted change amount.

  In the above embodiment, the cutting detection means 9 is provided. However, the cutting detection means 9 may be omitted. For example, the predicted change amount is stored in the control unit 7 in advance, and the preliminary cutting is performed by the moving step performed after the accumulated value of the advance / retreat amount of the support 2 with respect to the cutter 3 in the preliminary adjustment step exceeds the predicted change amount. It may be determined that it has been done. Moreover, even if it is a case provided with the cutting detection means 9, a cutting detection means is not restricted to what is shown to the said embodiment.

Moreover, in the said embodiment, although the discarding means 8 and the conveyance means 10 were provided, these may be omitted, and even if it is a case where these are provided, the discarding means and the conveyance means are in the said embodiment. It is not limited to what is shown.
In the above embodiment, the X direction is a direction parallel to the horizontal plane, and the Z direction is a vertical direction orthogonal to each horizontal plane. However, the present invention is not limited to this, and the X direction and the Z direction intersect each other. Just do it.

Moreover, in the said embodiment, although the X stage 4 which is a moving means shall move the support body 2 forward / backward with respect to the cutter 3 to move both relatively forward / backward, it is not restricted to this. . For example, the moving means may move both the cutter 3 and the support 2, and may move the cutter 3 relative to the support 2.
Moreover, in the said embodiment, although the Z stage 5 which is an adjustment means shall move the support body 2 forward / backward with respect to the cutter 3, both are moved forward / backward relatively, However, It is not restricted to this. . For example, the adjusting means may move both the cutter 3 and the support 2, and may move the cutter 3 with respect to the support 2.

In the above embodiment, the preliminary adjustment process is performed after the preliminary humidification process. However, if both processes are performed before the preliminary cutting process, the process order is not limited to this, for example, the preliminary adjustment process. Thereafter, a preliminary humidification step may be performed, or the preliminary humidification step and the preliminary adjustment step may be performed in parallel.
Moreover, in the said embodiment, although this adjustment process shall be performed after this humidification process, if both processes are performed before this cutting process, a process sequence will not be restricted to this, For example, this adjustment process After this, the present humidification step may be performed, or the present humidification step and the present adjustment step may be performed in parallel.

  In the above embodiment, the section thickness h1 of the thin section S is preliminarily input and stored using the input unit 23. However, the present invention is not limited to this, and the input unit 23 is not limited to this. You may input using.

  In addition, it is possible to appropriately replace the constituent elements in the embodiment with known constituent elements without departing from the spirit of the present invention, and the above-described modified examples may be appropriately combined.

DESCRIPTION OF SYMBOLS 1 Thin section production apparatus 2 Support body 3 Cutter 3a Cutting edge 3b Running surface 4 X stage (moving means)
5 Z stage (adjustment means)
6 Humidification means 7 Control section 8 Disposal means B Embedding block C Cassette S Thin section S1 Cutting waste h1 Section thickness

Claims (4)

A thin-slice preparation device that cuts an embedded block in which a biological sample is embedded to produce a thin section having a desired section thickness,
A support for supporting the embedding block;
A cutter for cutting the embedded block;
Moving means for relatively moving the support and the cutter along one direction, and cutting the embedding block by the cutter;
Adjusting means for relatively moving the support and the cutter along the other direction intersecting the one direction, and adjusting the position of the embedding block with respect to the cutter in the other direction;
Humidifying means for humidifying the embedded block;
A controller for controlling the moving means, the adjusting means, and the humidifying means,
The controller is
After pre-humidifying the embedding block by the humidifying means,
The support and the cutter are relatively moved forward by the moving means, the embedded block is preliminarily cut by the cutter,
Then, the main block is humidified by the humidifying means and the support and the cutter are relatively moved forward by the section thickness by the adjusting means.
The support and the cutter are relatively moved forward at the same speed as the preliminary cutting by the moving means, and the embedded block is cut by the cutter to produce the thin slice,
The controller is
The time until the preliminary cutting is started after the preliminary humidification is made the same as the time until the primary humidification is started after the main humidification,
A thin-slice preparation apparatus, wherein the preliminary humidification and the main humidification are performed under the same humidification conditions. The thin-slice manufacturing device according to claim 1,
Disposing means for sucking and discarding cutting waste cut from the embedded block by the cutter,
The control section sucks and discards the cutting waste cut by preliminary cutting by the discarding means. A support that supports an embedding block in which a biological sample is embedded;
A cutter for cutting the embedded block;
Moving means for relatively moving the support and the cutter along one direction, and cutting the embedding block by the cutter;
Adjusting means for relatively moving the support and the cutter along the other direction intersecting the one direction, and adjusting the position of the embedding block with respect to the cutter in the other direction;
Humidifying means for humidifying the embedded block;
A thin-slice preparation method using a thin-slice preparation device comprising: cutting the embedded block to prepare a thin section having a desired section thickness,
A pre-humidifying step of pre-humidifying the embedding block with the humidifying means;
A preliminary cutting step in which the support and the cutter are relatively moved forward by the moving means, and the embedded block preliminarily humidified is preliminarily cut by the cutter;
A main humidification step of subjecting the pre-cut embedded block to main humidification by the humidifying means;
After the preliminary cutting step, an adjusting step of moving the support and the cutter relatively forward by the section thickness by the adjusting means;
After the adjustment step, the support and the cutter are relatively moved forward by the moving means at the same speed as in the preliminary cutting step, and the humidified embedded block is main cut by the cutter. A main cutting step for producing the thin slice;
With
The time from the start of the preliminary humidification step to the start of the preliminary cutting step is the same as the time from the start of the main humidification step to the start of the main humidification step.
A thin-slice manufacturing method, wherein each of the preliminary humidification step and the main humidification step is performed under the same humidification conditions. The thin-section preparation method according to claim 3,
Comprising a disposal step of sucking and discarding cutting waste cut from the embedded block by the cutter;
In the discarding step, the cutting piece cut in the preliminary cutting step is sucked and discarded.

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